JP2019026889A - Production method of plating component - Google Patents

Abstract

To easily produce a plating component having a plurality of to-be-plated parts on which metal films different from each other are formed.SOLUTION: A production method of a plating component 10 comprises: a molding step in which a substrate 12 of non-conducting resin mold is molded, which includes a plurality of to-be-plated parts 14a and 14b having gap therebetween, and connection parts 16 for connecting the plurality of to-be-plated parts 14a and 14b; an electroless plating step in which conductive films are formed on the plurality of to-be-plated parts 14a and 14b; and an electrolytic plating step in which mutually different electrolytic plating treatments are exceptionally performed on to-be-plated parts 14a and 14b on which metal films different from each other are formed among the plurality of to-be-plated parts 14a and 14b.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a method for manufacturing a plated component having a plurality of parts to be plated on which different metal films are formed.

  For example, a vehicle decorative article having a metallic appearance such as a radiator grille, a back panel, and a fog cover attached to an automobile is manufactured by forming a plating film composed of a plurality of layers of metal film on a synthetic resin base material. . As a method for producing such a plated component, a conductive film is formed on a base material by applying an electroless plating process to impart conductivity, and then a plurality of layers of metal films are formed by performing an electrolytic plating process. A plating method to be formed is known.

  By the way, conventionally, when it is going to manufacture the plating component which has the some to-be-plated part in which the plating film from which a layer structure mutually differs was formed, a some to-be-plated member is shape | molded exceptionally and it mutually differs with respect to each to-be-plated member By performing the electrolytic plating treatment, plating films having different layer structures are formed. Then, a plurality of members to be plated are specially attached to an automobile or the like, or an assembly product in which each member to be plated is assembled in advance is attached to the automobile.

  However, in this case, not only the number of parts increases, but also a process for performing different electroplating processes for each member to be plated is required. Moreover, the process of attaching a some to-be-plated member exceptionally with respect to a motor vehicle etc. is needed. Therefore, there exists a problem that the manufacturing process of plating components becomes complicated.

  On the other hand, in the multicolor plating method described in Patent Document 1, the surface of the base material is divided into two or more non-coating parts by applying a non-chemical plating insulating coating to the base material. Subsequently, the non-painted portion is made into a conductor by chemical plating. Thereafter, different electroplating is applied to each non-painted portion. Thereby, a plurality of different metal coatings are formed on a plurality of non-painted portions (a portion to be plated) of one base material.

JP 59-126790 A

  By the way, in the case of the multicolor plating method described in Patent Document 1, a process for applying a non-chemical plating insulating coating to a base material is required in order to classify a plurality of parts to be plated. Therefore, there exists a problem that a manufacturing process becomes complicated by the said process being added.

  The objective of this invention is providing the manufacturing method of the plating component which can manufacture easily the plating component which has the some to-be-plated part in which the metal film which is mutually different was formed.

  A method of manufacturing a plated component for achieving the above object includes a non-conductive resin molded body having a plurality of parts to be plated provided with a space and a connecting part for connecting the parts to be plated. A forming step for forming a base material, an electroless plating step for imparting conductivity by forming a conductive coating on the plurality of portions to be plated, and metal coatings different from each other among the plurality of portions to be plated And an electroplating step in which different electroplating processes are applied to the portion to be plated.

  According to this method, since a plurality of portions to be plated are provided with a space therebetween, they are electrically insulated from each other, so that the step of applying an insulating coating prior to the electroless plating step can be omitted. Therefore, it is possible to easily manufacture a plated part having a plurality of parts to be plated on which different metal films are formed.

  In the method for manufacturing a plated component, the electrolytic plating step is configured such that the first plated portion of the plurality of plated portions is energized while the energization of all other plated portions is interrupted, A first electrolytic plating process for forming a first metal film on the first plated portion, and a second plated portion different from the first plated portion among the plurality of plated portions. It is preferable to include a second electrolytic plating process in which a second metal film is formed on the second plated portion in a state where energization is interrupted while all the other plated portions are cut off.

According to this method, the first metal film can be formed on the first plated portion, while the second metal film can be formed on the second plated portion.
In the method for manufacturing a plated component, the electrolytic plating step includes forming a first metal film on all of the plurality of parts to be plated in a state where all the parts to be plated are energized. A second metal film different from the first metal film on the part to be plated in an electroplating process and in a state where a part of the part to be plated is energized. It is preferable to include the 2nd electroplating process which forms.

  According to this method, first, the first metal film is formed on all of the plurality of portions to be plated. Then, a 2nd metal film is formed with respect to the to-be-plated part of each to-be-plated part. Thereby, the plated component which has the to-be-plated part in which the 1st metal film was formed, and the to-be-plated part in which the 2nd metal film was formed on the 1st metal film can be manufactured.

  ADVANTAGE OF THE INVENTION According to this invention, the plating component which has several to-be-plated parts in which a mutually different metal coating film was formed can be manufactured easily.

The figure explaining a pre-processing process and an electroplating process about 1st Embodiment of the manufacturing method of plating components. The front view of the plating component of the embodiment. (A) is a front view which shows the relationship between the 1st hanger and base material used in the satin nickel plating process of the embodiment, (b) is the second used in the bright nickel plating process of the embodiment. The front view which shows the relationship between a hanger and a base material. (A) is sectional drawing of a 1st to-be-plated part, a conductive film, and a 1st plating film, (b) is a cross section of a 2nd to-be-plated part, a conductive film, and a 2nd plating film. Figure. The figure explaining a pre-processing process and an electroplating process about 2nd Embodiment of the manufacturing method of a plating component. (A) is a front view which shows the relationship between the 1st hanger and base material used in the trivalent chromium plating process of the embodiment, (b) is used in the dark trivalent chromium plating process of the embodiment. The front view which shows the relationship between a 2nd hanger and a base material. (A) is sectional drawing of a 1st to-be-plated part, a conductive film, and a 1st plating film, (b) is a cross section of a 2nd to-be-plated part, a conductive film, and a 2nd plating film. Figure.

<First Embodiment>
Hereinafter, with reference to FIGS. 1-4, the manufacturing method of the plating component in 1st Embodiment is demonstrated.

  As shown in FIG. 2, the plated component 10 of the present embodiment constitutes a radiator grill of an automobile and has a base 12 that is a non-conductive resin molded body. In addition, in this embodiment, in order to demonstrate easily, the base material 12 which makes front view substantially rectangular shape is demonstrated. In the following description, the longitudinal direction of the substrate 12 is simply referred to as the longitudinal direction L, and the short direction of the substrate 12 is simply referred to as the short direction S.

  As shown in FIG. 2, the base material 12 has a pair of adjacent portions in the longitudinal direction L and a plurality of plated parts 14 a and 14 b that have the same wave shape and are spaced apart in the longitudinal direction L. It has the some connection part 16 which connects the to-be-plated parts 14a and 14b. Each connection part 16 has connected parts other than the plating surface in the to-be-plated parts 14a and 14b, ie, the surface in which the conductive film 20 mentioned later and plating film 30a, 30b are formed.

  Each of the plated portions 14a and 14b is made of a black ABS resin. Each connecting portion 16 is made of transparent polycarbonate. The plated portions 14a and 14b and the connecting portions 16 are integrally formed by two-color molding.

  As shown in FIG. 2, the plurality of to-be-plated portions 14 a and 14 b include a plurality of first to-be-plated portions 14 a provided alternately in the longitudinal direction L and the first to-be-plated portions 14 a adjacent to each other in the longitudinal direction L. A plurality of second plated parts 14b provided one by one between the plated parts 14a.

A first contact 18a is provided at both ends of each first plated portion 14a in the short direction S so as to protrude outward.
At both ends in the short direction S of each second plated portion 14b, second contacts 18b are provided so as to protrude outward.

  As shown in FIG. 4A, a conductive film 20 made of nickel is formed on the first plated portion 14a. On the conductive film 20, a first plating film 30a made of a plurality of layers of metal films is laminated. The first plating film 30a includes, in order from the conductive film 20 side, a copper film 32, a semi-bright nickel film 34, a satin nickel film 36a, a microporous nickel film (hereinafter, MP nickel film 38), and a trivalent chromium film 40. (A so-called white trivalent chromium film) is laminated.

  As shown in FIG. 4B, a conductive film 20 made of nickel is formed on the second plated portion 14b. On the conductive coating 20, a second plating coating 30b made of a plurality of metal coatings and having a layer configuration different from that of the first plating coating 30a is laminated. The second plating film 30b is formed by laminating a copper film 32, a semi-bright nickel film 34, a bright nickel film 36b, an MP nickel film 38, and a trivalent chromium film 40 in this order from the conductive film 20 side. .

  That is, the first plated film 30a is provided with the satin nickel film 36a, whereas the second plated film 30b is provided with the bright nickel film 36b instead of the satin nickel film 36a.

Next, a procedure for manufacturing the plated component 10 of the present embodiment will be described.
When the plated component 10 is manufactured, first, the base material 12 described above is integrally formed by two-color molding (molding process).

Next, as shown in FIG. 1, prior to performing the electrolytic plating process on the base material 12, a known pretreatment process (S 101 to 105) is performed.
In the pretreatment step, first, in the degreasing step (S101), the base material 12 is degreased to remove oils and fats adhering to the surface of the base material 12.

  Subsequently, in the etching step (S102), the surfaces of the portions to be plated 14a and 14b formed of the ABS resin in the base 12 are roughened (made rough) by etching with chromic acid and a sulfuric acid solution.

  Subsequently, in the catalyst process (S103), a catalyst such as a PdSn complex for precipitating electroless nickel that becomes the conductive coating 20 is adsorbed on the surfaces of the portions to be plated 14a and 14b.

Subsequently, the adsorbed catalyst is activated in the accelerator step (S104).
Subsequently, in the electroless nickel plating step (S105), each non-conductive portion to be plated is subjected to electroless nickel plating in an electroless nickel plating solution in which a reducing agent such as sodium hypophosphite is present. A nickel film as the conductive film 20 is formed on the surfaces of 14a and 14b. In the present embodiment, this electroless nickel plating step corresponds to the electroless plating step according to the present invention.

Next, an electrolytic plating process (S106 to S111) is performed.
In the electrolytic plating step, first, in the copper plating step (S106), the terminals of the hangers (see FIG. 6A) are connected to all the contacts 18a, 18b of the substrate 12, and a known copper plating solution ( In a state where the base material 12 is immersed in a not-shown state, the hanger is energized through all the contacts 18a and 18b. Thereby, the copper film 32 is formed on the electroconductive film 20 of each to-be-plated part 14a, 14b.

  Subsequently, in the semi-bright nickel plating step (S107), the terminals of the hangers (see FIG. 6A) are connected to all the contacts 18a and 18b of the substrate 12, and a known semi-bright nickel plating solution (illustrated) is shown. In the state where the base material 12 is immersed in the abbreviation), the hanger is energized through all the contacts 18a and 18b. As a result, a semi-bright nickel coating 34 is formed on the copper coating 32 of each of the portions to be plated 14a, 14b.

  Subsequently, in the satin nickel plating step (S108), as shown in FIG. 3A, the terminal of the first hanger 51 is connected to each first contact 18a of the substrate 12, and the well-known satin nickel. In the state in which the base material 12 is immersed in a plating solution (not shown), the first hanger 51 is energized through each first contact 18a. Since the 1st hanger 51 is not connected to the 2nd contact 18b at this time, electricity supply is interrupted | blocked with respect to the 2nd to-be-plated part 14b. As a result, a satin nickel coating 36a is formed only on the semi-bright nickel coating 34 of each first portion 14a to be plated. In the present embodiment, this satin nickel plating step corresponds to the first electrolytic plating process according to the present invention. The satin nickel coating 36a corresponds to the first metal coating according to the present invention.

  Subsequently, in the bright nickel plating step (S109), as shown in FIG. 3B, the second hanger 52 is connected to each second contact 18b of the substrate 12, and a well-known bright nickel plating solution. In a state where the base material 12 is immersed in (not shown), the second hanger 52 is energized through each second contact 18b. At this time, since the second hanger 52 is not connected to the first contact 18a, energization is interrupted with respect to the first plated portion 14a. Thus, the bright nickel coating 36b is formed only on the semi-bright nickel coating 34 of each second plated portion 14b. In the present embodiment, this bright nickel plating step corresponds to the second electrolytic plating treatment according to the present invention. The bright nickel coating 36b corresponds to the second metal coating according to the present invention.

  Subsequently, in the MP nickel plating step (S110), hangers (see FIG. 6 (a)) are connected to all the contacts 18a and 18b of the substrate 12, and based on a well-known MP nickel plating solution (not shown). In the state where the material 12 is immersed, the hanger is energized through all the contacts 18a and 18b. Thus, the MP nickel coating 38 is formed on the satin nickel coating 36a of the first plated portion 14a, and the MP nickel coating 38 is formed on the bright nickel coating 36b of the second plated portion 14b.

  Subsequently, in the trivalent chrome plating step (S111), hangers (see FIG. 6A) are connected to all the contacts 18a and 18b of the substrate 12, and a known trivalent chrome plating solution (both shown). In the state where the base material 12 is immersed in the abbreviation), the hanger is energized through all the contacts 18a and 18b. Thereby, the trivalent chromium coating 40 is formed on the MP nickel coating 38 of each of the plated portions 14a and 14b.

Then, the plating component 10 is formed by performing a well-known chromate process.
In addition, between these processes, the washing | cleaning process of multiple times is provided suitably so that the chemical | medical agent used at each process may not mix in the next process.

According to the method for manufacturing a plated component according to this embodiment described above, the following effects can be obtained.
(1) The manufacturing method of the plated component 10 is a non-conductive having a plurality of parts to be plated 14a and 14b provided with a space and a connecting part 16 connecting the plurality of parts 14a and 14b to be plated. A molding process for molding the substrate 12 which is a resin molded body is provided. In addition, an electroless plating step of forming the conductive film 20 on the plurality of portions to be plated 14a and 14b is provided. Further, different electroplating processes are applied to the portions 14a and 14b to be formed with different metal coatings (satin nickel coating 36a and bright nickel coating 36b) among the plurality of portions 14a and 14b. The electroplating process to be applied to is provided.

  According to such a method, since the plurality of portions to be plated 14a and 14b are provided with a space therebetween, they are electrically insulated from each other, so that the step of applying an insulating coating prior to the electroless plating step can be omitted. Therefore, it is possible to easily manufacture the plated component 10 having the plurality of plated portions 14a and 14b on which different metal films (satin nickel film 36a and bright nickel film 36b) are formed.

  (2) In the electrolytic plating step, the first plated portion 14a is energized, while the second plated portion 14b is deenergized with the satin nickel coating 36a applied to the first plated portion 14a. A first electrolytic plating process to be formed is provided. Further, the second electrolysis forms a bright nickel coating 36b on the second plated portion 14b while energizing the second plated portion 14b while cutting off the current to the first plated portion 14a. A plating process was provided.

  According to such a method, the satin nickel coating 36a can be formed only on the first plated portion 14a, while the bright nickel coating 36b can be formed only on the second plated portion 14b. Thus, the first plated portion 14a that develops a satin-like appearance when the satin nickel coating 36a is formed, and the second plated portion 14b that develops a glossy appearance when the bright nickel coating 36b is formed. It is possible to manufacture the plated part 10 having the following.

Second Embodiment
Hereinafter, a second embodiment will be described with reference to FIGS.
The base material 12 of the plated component 110 of this embodiment is the same as that of the first embodiment. In the present embodiment, the same components as those in the first embodiment are denoted by the same reference numerals, and redundant description is omitted.

  As shown in FIG. 7A, a conductive film 20 made of nickel is formed on the first plated portion 14a. On the conductive film 20, a first plating film 60a made of a plurality of layers of metal films is laminated. The first plating film 60a includes a copper film 32, a semi-bright nickel film 34, a bright nickel film 36b, an MP nickel film 38, a trivalent chromium film 40, and a dark trivalent chromium film 42 in order from the conductive film 20 side. It is formed by stacking.

  As shown in FIG. 7B, a conductive film 20 made of nickel is formed on the second plated portion 14b. On the conductive coating 20, a second plating coating 60b made of a plurality of metal coatings and having a layer configuration different from that of the first plating coating 60a is laminated. The second plating film 60b is formed by laminating a copper film 32, a semi-bright nickel film 34, a bright nickel film 36b, an MP nickel film 38, and a trivalent chromium film 40 in this order from the conductive film 20 side. .

  That is, in the first plating film 60a, both the trivalent chromium film 40 and the dark trivalent chromium film 42 are provided, whereas in the second plating film 60b, only the trivalent chromium film 40 is provided. It has been.

Next, a procedure for manufacturing the plated component 110 of the present embodiment will be described.
As shown in FIG. 5, the same pretreatment process (S101 to S105) as that in the first embodiment is performed before the electrolytic plating process is performed on the substrate 12.

Next, an electrolytic plating process (S106, S107, S109a, S110, S111) is performed.
First, the copper plating step (S106) and the semi-bright nickel plating step (S107) are performed by the same method as in the first embodiment.

  Subsequently, in the bright nickel plating step (S109a), hangers (see FIG. 6 (a)) are connected to all the contacts 18a and 18b of the substrate 12, and based on a well-known bright nickel plating solution (not shown). In the state where the material 12 is immersed, the hanger is energized through all the contacts 18a and 18b. Thereby, the bright nickel coating 36b is formed on the semi-bright nickel coating 34 of each of the plated portions 14a and 14b.

Subsequently, the MP nickel plating step (S110) is performed by the same method as in the first embodiment.
Subsequently, a trivalent chromium plating step (S111) is performed by the same method as in the first embodiment. That is, as shown in FIG. 6A, the third hanger 53 is connected to all the contacts 18a, 18b of the substrate 12, and the substrate 12 is attached to a known trivalent chromium plating solution (not shown). In the immersed state, the third hanger 53 is energized through all the contacts 18a, 18b. Thereby, the trivalent chromium coating 40 is formed on the MP nickel coating 38 of each of the plated portions 14a and 14b. In the present embodiment, this trivalent chromium plating step corresponds to the first electrolytic plating treatment according to the present invention. The trivalent chromium film 40 corresponds to the first metal film according to the present invention.

  Subsequently, in the dark trivalent chromium plating step (S112), as shown in FIG. 6B, the first hanger 51 is connected to each first contact 18a of the substrate 12, and the known dark 3 In the state in which the base 12 is immersed in a valent chromium plating solution (not shown), the first hanger 51 is energized through each first contact 18a. The dark trivalent chromium plating solution is obtained by adding a compound such as thiocyanate to the trivalent chromium plating solution. Since the 1st hanger 51 is not connected to the 2nd contact 18b at this time, electricity supply is interrupted | blocked with respect to the 2nd to-be-plated part 14b. As a result, the dark trivalent chromium coating 42 is formed only on the trivalent chromium coating 40 of each first plated portion 14a. In the present embodiment, this dark trivalent chromium plating step corresponds to the second electrolytic plating process according to the present invention. Further, the dark trivalent chromium film 42 corresponds to the second metal film.

Then, the plating component 110 is formed by performing a well-known chromate process.
In addition, between these processes, the washing | cleaning process of multiple times is provided suitably so that the chemical | medical agent used at each process may not mix in the next process.

According to the method for manufacturing a plated component according to this embodiment described above, the following effects can be obtained.
(3) The electrolytic plating step is a first electrolytic plating in which the trivalent chromium coating 40 is formed on all of the plurality of to-be-plated parts 14a and 14b in a state where all of the to-be-plated parts 14a and 14b are energized. A process was prepared. In addition, a second electrolytic plating process for forming a dark trivalent chromium coating 42 on the first plated portion 14a in a state where current is supplied to the first plated portion 14a is provided.

  According to such a method, first, the trivalent chromium coating 40 is formed on all of the plurality of portions to be plated 14a, 14b. Subsequently, a dark trivalent chromium coating 42 is formed only on the first portion 14a to be plated. As a result, the formation of the trivalent chromium coating 40 forms the second plated portion 14b that exhibits a white glossy appearance, and the formation of the dark trivalent chromium coating 42 on the trivalent chromium coating 40 results in black gloss. The plated component 10 having the first portion 14a to be plated that exhibits an appearance can be manufactured.

<Modification>
In addition, the said embodiment can also be changed as follows, for example.
For example, in the second embodiment, after the trivalent chromium plating step (S111) is performed, all the second contacts 18b may be removed. In this case, the third hanger 53 can be continuously used in the subsequent dark trivalent chromium plating step (S112). For this reason, the trouble of replacing the hanger can be omitted.

  -The plating component which concerns on this invention is not limited to the radiator grille of a motor vehicle, A plating component can also be actualized as other exterior goods, such as a back panel and a fog cover. Further, the present invention can also be applied to interior parts and vehicle decorations.

  DESCRIPTION OF SYMBOLS 10 ... Plating part, 12 ... Base material, 14a, 14b ... Plated part, 16 ... Connection part, 18a, 18b ... Contact, 20 ... Conductive film, 30a, 30b ... Plating film, 32 ... Copper film, 34 ... Half Bright nickel coating, 36a ... satin nickel coating, 36b ... bright nickel coating, 38 ... MP nickel coating, 40 ... trivalent chromium coating, 42 ... dark trivalent chromium coating, 51 ... first hanger, 52 ... second hanger 53 ... 3rd hanger, 60a, 60b ... plating film.

Claims (3)

A molding step of molding a substrate that is a non-conductive resin molded body having a plurality of plated parts provided with a space therebetween and a connecting part that connects the plurality of plated parts,
An electroless plating step of imparting conductivity by forming a conductive film on the plurality of portions to be plated;
An electroplating step for performing a different electroplating process on a portion to be plated on which a different metal film is to be formed among the plurality of portions to be plated.
Manufacturing method of plated parts. The electrolytic plating step is
A first metal film is formed on the first plated portion in a state where the first plated portion among the plurality of plated portions is energized while the energization is interrupted for all other plated portions. First electrolytic plating treatment to
While energizing a second plated part different from the first plated part among the plurality of plated parts, the second coated part is cut off from energizing all other plated parts. A second electrolytic plating process for forming a second metal film on the plating part,
The manufacturing method of the plating component of Claim 1. The electrolytic plating step is
A first electroplating process for forming a first metal film on all of the plurality of portions to be plated in a state where all of the portions to be plated are energized;
A second metal film different from the first metal film is formed on the first plated part in a state where the first plated part among the plurality of plated parts is energized. An electroplating process of
The manufacturing method of the plating component of Claim 1.