JP2019013077A - Electronic component mounting body and power source device - Google Patents

Abstract

To provide an electronic component mounting body in which a circuit substrate can be downsized.SOLUTION: An electronic component mounting body 1 includes a circuit substrate 2, electronic components 3a, 3b which are mounted on a component mounting surface F2 of the circuit substrate 2, a bus bar 4, and a heat radiator 5. The bus bar 4 is fixed to the circuit substrate 2. The heat radiator 5 is fixed to the bus bar 4 in a state of having the electronic component 3a fixed thereto and being separated from the component mounting surface F2 of the circuit substrate 2. The electronic component 3b is mounted on the circuit substrate 2 such that at least a part of the electronic component 3b is positioned within a region, of the component mounting surface F2, overlapping, in the thickness direction of the circuit substrate 2, a "substrate side portion" disposed on the circuit substrate 2 side relative to the fixed position of the electronic component 3a on the heat radiator 5.SELECTED DRAWING: Figure 5

Description

  The present invention relates to an electronic component mounting body in which an electronic component, a bus bar, and a radiator are mounted on at least one surface of a circuit board, and a power supply device configured to include such an electronic component mounting body.

  For example, the following patent document discloses a power supply device including an electronic component mounting body in which electronic components such as a transformer, a choke coil, a diode, a capacitor, and a switch element are mounted on one surface of a printed board. .

  In this power supply device, a heat sink for dissipating heat from heat generating components such as a switch element and a rectifying diode is attached to the printed circuit board together with each electronic component. In this case, the heat sink of the power supply device includes a plate-like mounting base and a fin portion (fin) provided at the upper end of the mounting base, and the mounting base is placed on the printed circuit board so that the heat-generating component contacts the side surface. It is fixed to the printed circuit board in a standing state. In this power supply device, a plurality of bus bars are mounted on the printed circuit board in addition to the electronic components and the heat sink.

JP 2008-271645 A (page 10-17, FIG. 1-11)

  However, the power supply device disclosed in the above patent document has the following problems to be improved. Specifically, in the power supply device described above, various electronic components, a heat sink, a bus bar, and the like are fixed and mounted on a printed board. Further, as described above, in this power supply device, the mounting base of each heat sink is fixed to the printed board in a state where it is erected on the printed board.

  In this case, in the configuration in which the plate-like mounting base in the heat sink is fixed on the printed board in an upright state, the contact area of the mounting base with respect to the surface of the printed board is set to avoid wobbling of the heat sink with respect to the printed board. It needs to be wide enough. Therefore, in the power supply device described above, the heat sink is provided with a mounting base portion having a sufficient thickness in order to sufficiently increase the contact area of the mounting base portion with respect to the printed circuit board.

  On the other hand, when the lower end portion of the mounting base portion of the heat sink is widened, it is necessary to secure a wide area on the component mounting surface of the printed circuit board where the heat sink can be brought into contact. Therefore, in the configuration of the power supply unit described above, a wide area for fixing the heat sink (heatsink) is secured on the component mounting surface separately from the area for mounting multiple electronic components and bus bars necessary for the circuit configuration. There is a need to do that. For this reason, it is difficult to reduce the size of the printed circuit board (circuit board), and it is preferable to improve this point.

  The present invention has been made in view of such problems to be improved, and provides an electronic component mounting body capable of reducing the size of a circuit board, and a power supply device configured by including such an electronic component mounting body. The main purpose.

  In order to achieve the above object, an electronic component mounting body according to the present invention is an electronic component mounting body in which an electronic component, a bus bar, and a radiator are mounted on at least one surface of a circuit board, and the bus bar includes the circuit The heat sink is fixed to the bus bar in a state in which the first electronic component as the electronic component is fixed and spaced from the at least one surface of the circuit board. In the region of the at least one surface that overlaps in the thickness direction of the circuit board with respect to the board side part on the circuit board side of the radiator from the fixing position of the first electronic component. The second electronic component is mounted so that at least a part of the second electronic component as the electronic component different from the electronic component is located.

  According to this electronic component mounting body, the second electronic component and the radiator are mounted at the same position on at least one surface of the circuit board while the heat of the first electronic component can be suitably radiated by the radiator. Thus, the precious component mountable area of the circuit board can be shared by the second electronic component and the radiator. Thereby, according to this electronic component mounting body, a circuit board can be reduced in size sufficiently.

  Further, in the electronic component mounting body according to the present invention, the bus bar is integrally formed with a main body portion and a plurality of substrate fixing portions fixed to the circuit board, and the main body portions intersect with each other in plan view. At least a first portion and a second portion that are arranged along the direction and are integrally formed, and the substrate fixing portion is provided in the first portion and the second portion, respectively. .

  According to this electronic component mounting body, unlike the electronic component mounting body having a configuration in which, for example, a flat bus bar is fixed to a circuit board in an I-shape, a planar view L made up of a first part and a second part The board-fixed portion of the letter-shaped portion is fixed to the circuit board, thereby causing the bus bar to wobble with respect to the circuit board. As a result, the radiator fixed to the bus bar and the first electronic component fixed to the radiator The wobble can be suitably avoided. This avoids a situation where a large stress is applied to the connection terminal of the first electronic component and the board fixing portion of the bus bar when the electronic component mounting body in the completed state is used, and the first electronic component and the bus bar to the circuit board are avoided. The fixed state can be suitably maintained over a long period of time, and the state in which the first electronic component is suitably in contact with the radiator can be suitably maintained over a long period of time.

  Furthermore, in the electronic component mounting body according to the present invention, the main body is parallel to the extending direction of one of the first part and the second part in plan view, and the first part A third portion that is disposed along the direction intersecting the extending direction of the other portion of the portion and the second portion and is integrally formed with the first portion and the second portion. The radiator is fixed to at least two of the one part and the third part.

  According to this electronic component mounting body, for example, unlike an electronic component mounting body configured to fix a radiator to a bus bar at only one location, the radiator can be securely fixed to the bus bar. Since it is possible to preferably avoid the positional deviation of the first electronic component, it is possible to maintain the state in which the radiator is preferably in contact with the first electronic component for a long period of time, and the first electronic component is wobbled. Can be more preferably avoided.

  The electronic component mounting body according to the present invention includes a pair of first members each including at least an electronic component fixing portion to which the first electronic component is fixed and a bus bar fixing portion to be fixed to the bus bar. At the same time, the first members are fixed to the bus bars in a state where they are in contact with each other.

  According to this electronic component mounting body, even if the heatsink has to be somewhat complicated in order to dispose the heatsink in a limited space on the circuit board, the plurality of first components By configuring the radiator by combining the members, it is possible to avoid an increase in the manufacturing cost of the radiator, and as a result, it is possible to sufficiently reduce the manufacturing cost of the electronic component mounting body. In addition, when it is necessary to fix the first electronic components on both the front and back sides of the radiator, an easy manufacturing method is adopted in which the electronic components are first fixed to both first members and then the first members are integrated. Therefore, also in this respect, the manufacturing cost of the electronic component mounting body can be reduced.

  In the electronic component mounting body according to the present invention, the radiator includes a second member fixed to the upper end portions of the first members so as to face the at least one surface.

  According to this electronic component mounting body, as compared with the case where the heat radiator is configured by only both the first members, the contact area with the atmosphere increases, and as a result, the heat of the first electronic component is radiated more suitably. In addition, since it can be firmly configured, the state in which both the first members are integrated can be suitably maintained.

  In addition, a power supply device according to the present invention includes the electronic component mounting body described above.

  According to this power supply device, by mounting the second electronic component and the radiator at the same position on at least one surface of the circuit board while enabling the heat of the first electronic component to be suitably radiated by the radiator, A valuable component mounting area of the circuit board can be shared by the second electronic component and the radiator. Thereby, according to this power supply device, a circuit board can be reduced in size sufficiently.

  According to the electronic component mounting body and the power supply device according to the present invention, the heat sink is fixed to the bus bar and the second electronic component is mounted between the heat sink and the circuit board, thereby reducing the size of the circuit board. be able to.

1 is an external perspective view of an electronic component mounting body 1 in a power supply device 100. FIG. It is an external appearance perspective view of the electronic component mounting body 1 in the state which removed the heat radiator component 23 of the heat radiator 5. FIG. 1 is an exploded perspective view of an electronic component mounting body 1. FIG. FIG. 3 is a plan view of the power supply device 100 in a state in which a radiator component member 23 of the electronic component mounting body 1 is removed. It is the sectional view on the AA line in FIG.

  Hereinafter, embodiments of an electronic component mounting body and a power supply device will be described with reference to the accompanying drawings.

  The power supply device 100 shown in FIG. 1 is an example of a “power supply device”, and is configured by housing the electronic component mounting body 1 in a casing (not shown).

  The electronic component mounting body 1 (electronic component mounting board) is an example of an “electronic component mounting body”, and as shown in FIGS. 1 to 3, a plurality of electronic components 3a and 3b, a bus bar 4 and a radiator 5 (heat sinks). Etc.) are mounted on the component mounting surface F2 of the circuit board 2. In this case, in the electronic component mounting body 1 of this example, the component mounting surface F2 corresponds to “at least one surface”. In FIGS. 1 to 3 and FIGS. 4 and 5 to be referred to later, the electronic components 3a and 3b, the bus bar 4, and the radiator 5 are provided in order to facilitate understanding of the configuration of the electronic component mounting body 1 and the power supply device 100. In addition, illustration of electronic components and the like mounted on the component mounting surface F2 of the circuit board 2 is omitted.

  The circuit board 2 is an example of a “circuit board”, and in the electronic component mounting body 1 of this example, the circuit board 2 is configured by a single-side mounting type printed board that can mount various electronic components only on the component mounting surface F2. The electronic component 3a (heat generating component) is an example of a “first electronic component”, and is mounted on the component mounting surface F2 of the circuit board 2 and fixed to the radiator 5 by the heat transfer sheet 5a, and is generated during operation. Heat is indirectly contacted with the radiator 5 via the heat transfer sheet 5a so that the heat can be radiated from the radiator 5. The electronic component 3 b is an example of a “second electronic component”, and is mounted on the component mounting surface F <b> 2 of the circuit board 2 in a non-contact state with respect to the radiator 5.

  The bus bar 4 is an example of a “bus bar”, and is mounted on the component mounting surface F2 of the circuit board 2 together with the electronic components 3a and 3b. 3 and 4, as an example, the bus bar 4 is formed in a U shape in plan view by bending a metal material having conductivity. Specifically, as shown in FIG. 3, the bus bar 4 includes main body portions 11 a to 11 c and a plurality of fixing leg portions 12.

  In this case, in the bus bar 4 of this example, the main body portions 11 a to 11 c are combined to form a “main body portion”. Specifically, in the bus bar 4 of this example, the main body portion 11a corresponds to a “first portion”, and a notch H4a that allows a fixing screw 6 for fixing the radiator 5 to be inserted as will be described later. Is formed. Further, in the bus bar 4 of this example, the main body part 11c disposed along the direction intersecting (orthogonal in this example) with respect to the main body part 11a in plan view corresponds to the “second part”. Further, in the bus bar 4 of the present example, the main body part 11b that is parallel to the main body part 11a in a plan view and intersects (in the present example, orthogonal) with the extending direction of the main body part 11c corresponds to the “third portion”. As will be described later, an insertion hole H4b is formed through which a fixing screw 6 for fixing the radiator 5 can be inserted.

  Further, in the bus bar 4 of this example, each fixing leg 12 corresponds to a “substrate fixing part”. In this case, in the bus bar 4 of this example, as an example, two fixing leg portions 12 are integrally provided on the main body portions 11a and 11b, respectively, and one fixing leg portion 12 is integrally formed on the main body portion 11c. Is provided. In the electronic component mounting body 1 of this example, a configuration is adopted in which each fixing leg 12 of the bus bar 4 is fixed to the circuit board 2 while being electrically connected to the circuit board 2 by soldering. . For this reason, in the bus bar 4 of this example, the round hole H4c for preventing rapid heat transfer from the fixing leg 12 to the main body parts 11a to 11c at the time of soldering has a fixing leg part in the main body parts 11a to 11c. It is formed according to 12 positions.

  The radiator 5 corresponds to a “radiator”, and as shown in FIGS. 1 and 3, as an example, a pair of radiator constituent members 20 and 20 having an L shape in plan view and a flat radiator constituent member 23. These three members are provided.

  The radiator constituting member 20 is an example of a “first member”, and as shown in FIGS. 3 and 4, the electronic component 3a is fixed (indirectly to the electronic component 3a via the heat transfer sheet 5a). A component fixing portion 21 (to be brought into contact) and a fixed portion 22 fixed to the bus bar 4 are integrally formed of a metal material such as aluminum. In the radiator constituting member 20 of this example, the component fixing portion 21 corresponds to an “electronic component fixing portion”, and the fixed portion 22 corresponds to a “bus bar fixed portion”. In this case, as shown in FIG. 3, both the radiator component members 20 are provided with screw holes H <b> 20 a into which fixing screws 6 for fixing to the bus bars 4 can be screwed. Then, a screw hole H20b that is formed on the side end surface and into which the fixing screw 24 for fixing the radiator constituting member 23 can be screwed is formed on the upper end portion (upper end surface in this example) of the fixed portion 22. Is formed.

  The radiator constituting member 23 is an example of a “second member”, and as shown in FIGS. 1 and 3, an insertion hole H 23 a through which a fixing screw 24 can be inserted into a metal plate such as aluminum, and an electronic A plurality of slits H23b that allow passage of air whose temperature has increased due to heat radiation from the component 3a and the radiator component member 20 are opened and formed as a flat plate as a whole.

  As shown in FIGS. 1 and 5, this heat radiator 5 has one surface of both component fixing portions 21 in both heat radiator components 20 in surface contact with each other (“both first members are in contact with each other”. Bus bar 4 in a state in which both radiator component members 20 are integrated so that each electronic component 3a is fixed to the other surface of both component fixing portions 21 by heat transfer sheet 5a. It is fixed to. Specifically, the radiator 5 radiates both the fixing screw 6 through which the notch H4a formed in the main body portion 11a of the bus bar 4 and the insertion hole H4b formed in the main body portion 11b of the bus bar 4 are inserted. The two radiator component members 20 are fixed to the bus bar 4 by being screwed and tightened into the screw holes H20a of the fixed portion 22 of the component component member 20 ("[one of the first part and the second part] An example of the configuration of “one portion] and [third portion] are fixed to at least two places”).

  In this case, in the radiator 5 of this example, the position surrounded by the broken line L1 in FIGS. 3 and 5 corresponds to the “fixed position of the first electronic component in the radiator”, and the mesh line in the broken line L2 in both figures. The part filled with is equivalent to the “substrate side part”.

  In the radiator 5, the fixing component 24 inserted through the insertion hole H 23 a of the radiator component member 23 is screwed into the screw hole H 20 b of the fixed portion 22 to tighten the radiator component member 23. The heat dissipating member 20 is fixed to the heat dissipating member 20 so as to be in surface contact with the upper end portion of the constituent member 20 and to face the component mounting surface F2 of the circuit board 2.

  In this case, in the electronic component mounting body 1 of this example, as shown in FIG. 5, both the radiator component members 20 of the radiator 5 are separated from the component mounting surface F <b> 2 of the circuit board 2 and between the component mounting surface F <b> 2. The radiator 5 is fixed to the bus bar 4 so that a gap S is generated in the gap (an example of a configuration in which “the radiator is fixed to the bus bar in a state of being separated from at least one surface of the circuit board”).

  Further, in the electronic component mounting body 1 of this example, the “board side portion” of the circuit board 2 relative to the fixing position of the electronic component 3a in the radiator 5 (in this example, the component fixing portion 21 and the two radiator component members 20 and In the region of the component mounting surface F2 that overlaps the lower end portion of the fixed portion 22 in the thickness direction of the circuit board 2 (the region facing the lower end portion of the radiator 5: the region illustrated by being filled with a mesh line in FIG. 4) The electronic component 3b is mounted such that at least a part of the electronic component 3b (in this example, the entire electronic component 3b) is positioned.

  In order to facilitate understanding of the configuration of the electronic component mounting body 1, an example in which only one electronic component 3 b is mounted in the above region will be described. The number of the “second electronic components” so mounted may be plural. In addition, a state where the entire “second electronic component (electronic component 3b in this example)” is mounted so as to be located in the above-described region will be described. However, “only part of the second electronic component” is described above. It can also be mounted to be located in the region (not shown).

  In manufacturing the power supply apparatus 100, first, the electronic component mounting body 1 is manufactured. In this case, in the manufacturing method of the electronic component mounting body 1 of this example, as an example, the surface mounting components such as the respective electronic components 3b are fixed while being electrically connected to the circuit board 2 by the reflow soldering process. A method is adopted in which the component 3a, the bus bar 4 and the like are fixed while being electrically connected to the circuit board 2 by flow soldering. Therefore, first, after the electronic component 3b or the like is placed at a specified position on the component mounting surface F2 of the circuit board 2, the reflow soldering process is executed. Thereby, connection and fixation of the electronic component 3b etc. with respect to the circuit board 2 are completed.

  Next, the electronic component 3a, the bus bar 4 and the like are fixed to the circuit board 2 by flow soldering. In this case, the manufacturing method of this example employs a procedure in which the electronic component 3a, the bus bar 4 and the radiator 5 are integrated prior to the placement on the component mounting surface F2 of the circuit board 2. Specifically, first, the heat transfer sheet 5a is affixed to a part of the component fixing portion 21 of both radiator component members 20 that is in contact with the electronic component 3a. Next, the main body portion of the electronic component 3a is fixed to the radiator component member 20 so as to indirectly contact the component fixing portion 21 via the heat transfer sheet 5a. Since this heat transfer sheet 5a has sufficient adhesiveness to fix the electronic component 3a to the component fixing portion 21, in the electronic component mounting body 1 of this example, the component fixing portion of the radiator component member 20 is used. The electronic component 3 a is fixed to the component fixing portion 21 simply by pressing the electronic component 3 a against the heat transfer sheet 5 a attached to the component 21.

  Subsequently, the radiator constituting member 23 is fixed to the upper end portion thereof in a state where the back surfaces of the contact surfaces of the component fixing portions 21 of both the radiator constituting members 20 and 20 with the electronic component 3a are in surface contact with each other. Specifically, the fixing screw 24 through which one of the insertion holes H23a and H23a of the radiator component member 23 is inserted is screwed into the screw hole H20b of the one radiator component member 20 and tightened, and the insertion holes H23a and H23a are inserted. The other fixing screw 24 is inserted into the screw hole H20b of the other radiator constituting member 20 and tightened. Thereby, the heat radiator component 23 is fixed to the heat radiator members 20, 20, and the heat radiator 5 is formed.

  Next, both the radiator constituent members 20, 20 are inserted inside the bus bar 4 and fixed to the bus bar 4 with screws. Specifically, after the fixing screw 6 inserted through the insertion hole H4b formed in the main body portion 11b of the bus bar 4 is screwed into the screw hole H20a in the fixed portion 22 of the one radiator component member 20 and tightened. Then, the fixing screw 6 through which the notch H4a formed in the main body part 11a is inserted is screwed into the screw hole H20a in the fixed part 22 of the other radiator constituting member 20 and tightened. Thereby, fixation to the bus bar 4 of the heat radiator 5 is completed, and it will be in the state which the electronic component 3a, the bus bar 4, and the heat radiator 5 integrated.

  Subsequently, the electronic component 3a, the bus bar 4 and the radiator 5 in an integrated state are placed at a specified position on the component mounting surface F2 together with other electronic components to be connected to the circuit board 2 by flow soldering. At this time, each of the fixing leg portions 12 of the bus bar 4 is inserted into an insertion hole provided in the circuit board 2 so that the bus bar 4 is positioned on the circuit board 2, whereby heat is dissipated above the electronic component 3 b. The “substrate side part” of the vessel 5 is located.

  Next, a flow soldering process is performed on the circuit board 2 on which the mounting of the integrated electronic component 3a, bus bar 4, radiator 5 and the like has been completed. At this time, each connection terminal of the electronic component 3a is connected to a conductor pattern (not shown) of the circuit board 2 so that the electronic component 3a is fixed to the circuit board 2, and the fixing legs 12 of the bus bar 4 are connected to the circuit board. The bus bar 4 is connected to a conductor pattern 2 (not shown) and fixed to the circuit board 2.

  In this case, in the manufacturing method of this example, as described above, a method of fixing the bus bar 4 in a state integrated with the radiator 5 in advance to the circuit board 2 by flow soldering is employed. In addition, the bus bar 4 is made of a conductive metal material and has a sufficient cross-sectional area, so that the thermal conductivity is very high. Furthermore, a radiator 5 made of a material having high thermal conductivity is fixed to the main body portions 11a and 11b of the bus bar 4. Therefore, when the fixing leg 12 in the bus bar 4 is in contact with the solder in the flow solder tank during the flow soldering process, the heat transferred from the solder to the fixing leg 12 is the main body parts 11a to 11c and the radiator structure. Heat is rapidly transferred to the member 20, and due to this, the heat of the solder in contact with the fixing leg 12 is excessively taken away, and the connection between the fixing leg 12 and the circuit board 2 may be incomplete. There is.

  Therefore, in the bus bar 4 in the electronic component mounting body 1 of this example, as described above, the flow soldering process is performed by forming the round hole H4c in the arrangement position of the fixing leg portion 12 in the main body portions 11a to 11c. At this time, a configuration is adopted in which the heat of the solder in contact with the fixing leg portion 12 is rapidly transferred to the main body portions 11a to 11c and the solder heat is taken away excessively. Thereby, it is possible to fix the bus bar 4 to the circuit board 2 while securely connecting the solder bar to the fixing leg portion 12 of the bus bar 4 and the circuit board 2 and securely connecting the bus bar 4 to the circuit board 2.

  Thereafter, a connection cable or the like (not shown) is disposed, whereby the electronic component mounting body 1 is completed. Moreover, the power supply apparatus 100 is completed by accommodating the completed electronic component mounting body 1 in a casing.

  In the electronic component mounting body 1 in the power supply device 100, as shown in FIG. 5, the radiator component members 20, 20 in the radiator 5 attached to the circuit board 2 via the bus bar 4 are not in relation to the circuit board 2. In this state, a gap S is formed below the radiator constituent members 20 and 20. Moreover, in the electronic component mounting body 1 in the power supply apparatus 100 of this example, as shown in FIGS. 4 and 5, the component mounting surface F2 of the circuit board 2 and the “board side portion” of the radiator 5 (in this example, the radiator The electronic component 3b is mounted in a gap S formed between the constituent members 20 and 20 (lower end portions). Thereby, in the electronic component mounting body 1 in the power supply apparatus 100 of this example, the space for mounting the electronic component 3b is ensured separately from the space for disposing the radiator constituent members 20 and 20 in the radiator 5. Instead, the electronic component 3b and the radiator 5 are mounted on the component mounting surface F2.

  As described above, in the electronic component mounting body 1, the bus bar 4 is fixed to the circuit board 2, and the radiator 5 is fixed to the electronic component 3a and separated from the component mounting surface F2 of the circuit board 2. The electronic component is fixed within the region of the component mounting surface F2 that is fixed to the bus bar 4 and overlaps in the thickness direction of the circuit board 2 with respect to the “board side portion” on the side of the circuit board 2 from the fixing position of the electronic component 3a in the radiator 5. The electronic component 3b is mounted so that at least a part (the whole in this example) of 3b is located. In addition, the power supply device 100 includes the electronic component mounting body 1 described above.

  Therefore, according to the electronic component mounting body 1 and the power supply device 100, the heat of the electronic component 3 a can be suitably radiated by the radiator 5, while the electronic component 3 b and the heat radiating at the same position on the component mounting surface F 2 on the circuit board 2. By mounting the device 5, the precious component mountable area of the circuit board 2 can be shared by the radiator 5 and the electronic component 3 b. Thereby, according to this electronic component mounting body 1 and the power supply device 100, the circuit board 2 can be reduced in size sufficiently.

  In addition, the electronic component mounting body 1 and the power supply device 100 include a main body portion 11a, a main body portion 11c, and a main body portion 11b that are integrally formed by being arranged along a direction intersecting each other in a plan view. And a plurality of fixing legs 12 fixed to the circuit board 2 are integrally formed, and the fixing legs 12 are respectively disposed on the main body portions 11a to 11c to constitute the bus bar 4.

  Therefore, according to the electronic component mounting body 1 and the power supply device 100, for example, unlike the “electronic component mounting body” having a configuration in which a flat “bus bar” is fixed to a “circuit board” in an I shape, By fixing the fixing leg portions 12 and 12 of the L-shaped portion including the portion 11a and the main body portion 11c to the circuit board 2, the bus bar 4 is wobbled with respect to the circuit board 2, and as a result, is fixed to the bus bar 4. The wobbling of the heat radiator 5 and the electronic component 3a fixed to the heat radiator 5 can be preferably avoided. This avoids a situation in which a large stress is applied to the connection terminal of the electronic component 3a and the fixing leg portion 12 of the bus bar 4 when the electronic component mounting body 1 in the completed state and the power supply device 100 including the electronic component mounting body 1 are used. Thus, the electronic component 3a and the bus bar 4 can be suitably fixed to the circuit board 2 for a long period of time, and the state in which the radiator 5 is suitably in contact with the electronic component 3a for a long period of time. Can be suitably maintained.

  Further, in the electronic component mounting body 1 and the power supply device 100, the main body 11a is disposed along a direction parallel to the extending direction of the main body 11a and intersecting the extending direction of the main body 11c in a plan view. , 11c and a main body 11b formed integrally with the bus bar 4 to constitute a "main body", and the radiator 5 is fixed at two locations, the main body 11a and the main body 11b.

  Therefore, according to the electronic component mounting body 1 and the power supply device 100, unlike the “electronic component mounting body” in which, for example, the “heat radiator” is fixed to the “bus bar” only at one place, the heat sink 5 Can be reliably fixed, and it is possible to preferably avoid displacement of the radiator 5 with respect to the bus bar 4, so that the state in which the radiator 5 is suitably in contact with the electronic component 3a can be maintained for a long period of time. In addition, the wobbling of the electronic component 3a can be more preferably avoided.

  In addition, the electronic component mounting body 1 and the power supply device 100 include a pair of radiator component members 20 each including a component fixing portion 21 that is brought into contact with the electronic component 3 a and a fixed portion 22 that is fixed to the bus bar 4. The radiator 5 is configured, and the radiator members 20 are fixed to the bus bars 4 in a state where the radiator members 20 are in contact with each other.

  Therefore, according to the electronic component mounting body 1 and the power supply device 100, in order to dispose the heat sink 5 in a limited space on the circuit board 2, the heat sink 5 must have a somewhat complicated shape. However, as a result of avoiding a rise in the manufacturing cost of the radiator 5 by configuring the radiator 5 by combining a plurality of radiator component members 20, the electronic component mounting body 1 and the electronic component mounting body 1 are provided. In addition, the manufacturing cost of the power supply device 100 can be sufficiently reduced. In addition, when it is necessary to fix the electronic components 3a on both the front and back surfaces of the radiator 5, it is easy to integrate the radiator components 20 after fixing the electronic components 3a to the radiator components 20 and 20 in advance. In this respect, the manufacturing cost of the electronic component mounting body 1 and the power supply device 100 can be reduced.

  Further, according to the electronic component mounting body 1 and the power supply device 100 including the electronic component mounting body 1, the radiator component member fixed to the upper end portions of the two radiator component members 20 so as to face the component mounting surface F2. 23, the heat sink 5 is configured, and as a result, the contact area with the atmosphere is increased as compared with the case where the “heat radiator” is configured only by the heat radiator components 20 and 20, and as a result, the heat of the electronic component 3a is increased. Can be radiated more suitably, and since it can be firmly constructed, it is possible to favorably maintain a state in which the heat radiating member 20 and 20 are integrated.

  The configurations of the “electronic component mounting body” and the “power supply device” are not limited to the configuration examples of the electronic component mounting body 1 and the power supply device 100 described above. For example, the configuration in which the bus bar 4 is fixed to the circuit board 2 by soldering the fixing legs 12 has been described as an example, but instead of or in addition to such a configuration, “circuit It is also possible to adopt a configuration in which a “bus bar” is fixed to the “board” with screws (not shown). In this case, the fixing of the “bus bar” to the “circuit board” is not limited to the configuration in which the “bus bar” is directly fixed to the “circuit board” as illustrated above. It is also possible to adopt a configuration in which the “bus bar” is indirectly fixed to the “circuit board” via a “mounting tool” formed separately from the “mounting tool” (not shown).

  Further, the configuration in which the radiator 5 is fixed to the bus bar 4 by screwing has been described as an example. However, instead of such a configuration, or in addition to such a configuration, by soldering fixing or adhesive fixing, It is also possible to adopt a configuration in which the “heat radiator” is fixed to the “bus bar” (not shown). In this case, the fixing of the “heat radiator” to the “bus bar” is not limited to the configuration in which the “heat radiator” is directly fixed to the “bus bar” as illustrated above. It is also possible to adopt a configuration in which the “heat radiator” is indirectly fixed to the “bus bar” via a “mounting tool” formed separately from the device (not shown).

  Furthermore, although the example provided with the bus-bar 4 provided with three parts of the main-body parts 11a-11c and formed in the planar view U-shape was demonstrated, the shape of a "bus-bar" is not limited to this, The main-body part in the bus-bar 4 11a and 11b and two parts of the main body part 11c are provided and formed in an L shape in plan view, or in addition to the configuration of the bus bar 4, a part parallel to the main body part 11c is provided in plan view. It can also be formed in a square shape (both not shown). In either case, the “heat radiator” with respect to the “bus bar” is fixed in the same manner as the electronic component mounting body 1 in the power supply device 100 by fixing the “heat radiator” in at least two parts. It is possible to preferably avoid the positional deviation.

  Moreover, although the example which provided the three members of the heat radiator structural member 20, 20, 23 and comprised the heat radiator 5 was demonstrated, when sufficient heat radiation area is ensured even if the heat radiator structural member 23 is not provided. Can adopt a configuration in which the “second member” such as the radiator component 23 is not provided (not shown). Further, the “first member” is not limited to the L-shape in plan view like the radiator component 20 in the radiator 5 described above, but is U-shaped in plan view, T-shape in plan view, and E in plan view. Various shapes such as a letter shape can be adopted. In addition, without providing the “pair of first members”, for example, a member having the same shape as the shape in which the radiator constituent members 20 and 20 are integrated can be fixed to the “bus bar” as a “radiator”. (Not shown).

  Further, the configuration in which the electronic component 3a is fixed to the radiator 5 by the heat transfer sheet 5a disposed between the electronic component 3a and the radiator 5 has been described as an example, but instead of fixing by the heat transfer sheet 5a. Alternatively, in addition to fixing by the heat transfer sheet 5a, a configuration in which the electronic component 3a is fixed to the radiator 5 by a fixing bracket such as a clip or a fixing screw may be employed. Moreover, the structure which will be in the state which the electronic component 3a and the heat radiator 5 will contact indirectly via the heat transfer sheet 5a by arrange | positioning the heat transfer sheet 5a between the electronic component 3a and the heat radiator 5 is an example. However, instead of the heat transfer sheet 5a, a heat transfer agent such as silicon grease is applied to the heat radiator 5 or the electronic component 3a so that the electronic component 3a and the heat sink 5 are indirectly connected via the heat transfer agent. The electronic component 3a is configured by arranging a fixture formed of a material having a sufficiently high thermal conductivity instead of the heat transfer sheet 5a between the radiator 5 and the electronic component 3a. The heat transfer sheet 5a, the heat transfer agent, and the fixture are not disposed between the electronic component 3a and the heat radiator 5, and the configuration in which the heat sink 5 and the heat radiator 5 are in indirect contact with each other through the fixture. Adopt a configuration in which the electronic component 3a and the radiator 5 are in direct contact with each other. It is also (not shown).

  Further, the manufacturing method in which the electronic component 3a, the bus bar 4 and the radiator 5 are integrated in advance when the electronic component mounting body 1 is manufactured has been described as an example. However, the electronic component 3a is separated from the bus bar 4 as an example. A manufacturing method of mounting on the circuit board 2 and fixing to the circuit board 2 by flow soldering or the like, or a manufacturing method of fixing the radiator 5 to the bus bar 4 after fixing the bus bar 4 to the circuit board 2 alone, etc. You can also Further, in the state in which the radiator component members 20 and 20 are fixed to the bus bar 4, the bus bar 4 is fixed to the circuit board 2 by flow soldering, and then the radiator component member 23 is fixed to the radiator component members 20 and 20. The method can also be adopted.

  Further, the configuration in which the electronic components 3a and 3b, the bus bar 4, the radiator 5 and the like are mounted on one side of the circuit board 2 has been described as an example, but the “electronic component” and “bus bar” are provided on both the front and back sides of the “circuit board”. ”And“ heat radiator ”are mounted on the“ circuit board ”by adopting a configuration in which at least one surface thereof is fixed to the“ bus bar ”in the same manner as the electronic component mounting body 1 described above. Miniaturization can be achieved (not shown). In addition, the configuration of the electronic component mounting body 1 constituting the power supply device 100 has been described as an example. However, the “electronic component mounting body” is not limited to the mounting body for the “power supply device”, and “electronic component (heat generation) The same configuration as that of the electronic component mounting body 1 described above is adopted in the “electronic component mounting body” that constitutes various devices that need to be mounted on the “circuit board”. be able to.

DESCRIPTION OF SYMBOLS 100 Power supply device 1 Electronic component mounting body 2 Circuit board 3a, 3b Electronic component 4 Busbar 5 Radiator 6,24 Fixing screw 11a-11c Body part 12 Fixing leg part 20,23 Radiator component 21 Component fixing part 22 Covered Fixed part F2 Component mounting surface H4a Notch H4b, H23a Insertion hole H4c Round hole H20a, H20b Screw hole H23b Slit S Gap

Claims (6)

An electronic component mounting body in which an electronic component, a bus bar and a radiator are mounted on at least one surface of a circuit board,
The bus bar is fixed to the circuit board,
The radiator is fixed to the bus bar in a state where the first electronic component as the electronic component is fixed and separated from the at least one surface of the circuit board,
In the circuit board, in the region of the at least one surface that overlaps in the thickness direction of the circuit board with respect to the board side portion on the circuit board side than the fixing position of the first electronic component in the radiator. An electronic component mounting body on which the second electronic component is mounted such that at least a part of the second electronic component as the electronic component different from the first electronic component is located. The bus bar is integrally formed with a main body portion and a plurality of substrate fixing portions fixed to the circuit board.
The main body includes at least a first part and a second part that are arranged along a direction intersecting each other in plan view and are integrally formed, and the first part and the second part include the first part and the second part. The electronic component mounting body according to claim 1, wherein the substrate fixing parts are respectively disposed. The main body is parallel to the extending direction of one of the first part and the second part in plan view, and is the other part of the first part and the second part. A third portion disposed along the direction intersecting the extending direction and integrally formed with the first portion and the second portion;
The electronic component mounting body according to claim 2, wherein the radiator is fixed to at least two of the one of the parts and the third part.   The radiator includes a pair of first members each including at least an electronic component fixing portion to which the first electronic component is fixed and a bus bar fixing portion to be fixed to the bus bar. The electronic component mounting body according to any one of claims 1 to 3, wherein members are fixed to the bus bars in a state where the members are in contact with each other.   The electronic component mounting body according to claim 4, wherein the radiator includes a second member fixed to upper ends of the first members so as to face the at least one surface.   The power supply device comprised including the electronic component mounting body in any one of Claim 1 to 5.

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