JP2010161417A - Power circuit wiring device - Google Patents

Power circuit wiring device Download PDF

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Publication number
JP2010161417A
JP2010161417A JP2010089083A JP2010089083A JP2010161417A JP 2010161417 A JP2010161417 A JP 2010161417A JP 2010089083 A JP2010089083 A JP 2010089083A JP 2010089083 A JP2010089083 A JP 2010089083A JP 2010161417 A JP2010161417 A JP 2010161417A
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circuit board
printed circuit
power module
power
heat
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JP4866469B2 (en
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Masaki Takada
雅樹 高田
Takashi Kumagai
隆 熊谷
Kenichi Hayashi
建一 林
Junji Morimoto
純司 森本
Motoyuki Nasu
基志 那須
Shigeo Takada
茂生 高田
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a power circuit wiring device capable of accurately reducing a local temperature rise at an electric connection portion between a circuit board made of a printed circuit board 1 and a power supply portion composed of a power module 2. <P>SOLUTION: The power circuit wiring device includes the power supply portion composed of a power module 2 having screw terminal portions with screws 4, a first heat dissipation member 3 configured to cool the power module 2, the circuit board composed of the printed circuit board 1 configured to electrically connecting a circuit component (not illustrated) to the power module 2, and a second heat dissipation member 6 assembled together when the screw terminal portions and printed circuit board 1 are fastened together with the screws 4. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

この発明は、パワー回路配線装置、特に、パワーモジュールで構成されるパワー給電部にねじ止めされたプリント基板からなる回路基板におけるパワー回路配線装置に関するものである。   The present invention relates to a power circuit wiring device, and more particularly to a power circuit wiring device in a circuit board composed of a printed circuit board screwed to a power feeding unit composed of a power module.

従来、大電流が流れる配線パターンの放熱対策としては、プリント基板の配線パターンに熱的に結合された放熱部材を実装することで配線パターン部の温度上昇を軽減していた（例えば、特許文献１および特許文献２参照）。   Conventionally, as a heat dissipation measure for a wiring pattern through which a large current flows, a temperature rise in the wiring pattern portion has been reduced by mounting a heat dissipation member thermally coupled to the wiring pattern of the printed circuit board (for example, Patent Document 1). And Patent Document 2).

実開平３−１０４７９３号公報Japanese Utility Model Publication No. 3-104793 実開平４−８４８９号公報Japanese Utility Model Publication 4-8489

パワーモジュールで構成されるパワー給電部にねじ止めされたプリント基板からなる回路基板においては、従来の配線パターンの放熱対策では、放熱部材が実装された近傍の配線パターンの温度上昇は軽減するが、ネジ締結されたパワーモジュール端子部の配線パターン温度の上昇まで軽減することはできないという課題があった。   In a circuit board consisting of a printed circuit board screwed to a power feeding unit composed of a power module, the conventional wiring pattern heat dissipation measures reduce the temperature rise of the wiring pattern in the vicinity where the heat dissipation member is mounted, There was a problem that it was not possible to reduce the rise in the wiring pattern temperature of the power module terminal portion that was screwed.

パワーモジュールで構成されるパワー給電部にねじ止めされたプリント基板からなる回路基板において、パワーモジュールネジ端子部は、パワーモジュールの発熱と基板上の部品の発熱さらには配線パターンの発熱によって熱が伝導し局部的に温度が上昇する。パワーモジュールで構成されるパワー給電部にねじ止めされたプリント基板からなる回路基板においては、パワーモジュールネジ端子部の配線パターンの温度上昇が最も大きく、温度上の制約となっているという問題点があった。
従来、配線パターンに大電流を流す場合、配線パターンに熱的に結合した放熱部材により配線パターンの温度上昇を軽減する手法があったが、前述の通りパワーモジュールネジ端子部の配線パターンの温度上昇は局部的であり、配線パターンにのみ放熱部材があるだけでは放熱効果が無いという問題があった。 In a circuit board consisting of a printed circuit board that is screwed to a power feeding unit that is composed of a power module, the power module screw terminal part conducts heat by the heat generation of the power module, the heat generation of parts on the board, and the heat generation of the wiring pattern. However, the temperature rises locally. In a circuit board consisting of a printed circuit board that is screwed to a power feeding section composed of a power module, the temperature rise of the wiring pattern of the power module screw terminal is the largest, which is a limitation on temperature. there were.
Conventionally, when a large current is passed through a wiring pattern, there has been a technique to reduce the temperature rise of the wiring pattern by using a heat dissipation member that is thermally coupled to the wiring pattern. However, as described above, the temperature rise of the wiring pattern of the power module screw terminal There is a problem that there is no heat dissipation effect if there is a heat dissipation member only in the wiring pattern.

この発明は、回路基板における電気的接続部での局部的な温度上昇を的確に軽減できるパワー回路配線装置を得ようとするものである。   An object of the present invention is to obtain a power circuit wiring device capable of accurately reducing a local temperature rise at an electrical connection portion in a circuit board.

この発明に係るパワー回路配線装置では、ネジ端子部を備えたパワー給電部と、前記パワー給電部を冷却する第１の放熱部材と、回路部品とパワー給電部とを電気的に接続する回路基板と、前記ネジ端子部と前記回路基板とをネジで締結する際に同時に組み付けられる第２の放熱部材とを備えたものである。   In the power circuit wiring device according to the present invention, the circuit board for electrically connecting the power feeding portion having the screw terminal portion, the first heat radiating member for cooling the power feeding portion, and the circuit component and the power feeding portion. And a second heat dissipating member that is assembled at the same time when the screw terminal portion and the circuit board are fastened with screws.

この発明によれば、回路基板における電気的接続部での局部的な温度上昇を的確に軽減できるパワー回路配線装置を得ることができる。   According to the present invention, it is possible to obtain a power circuit wiring device capable of accurately reducing a local temperature rise at an electrical connection portion in a circuit board.

この発明による実施の形態１におけるパワー回路配線装置の構成を示す斜視図である。It is a perspective view which shows the structure of the power circuit wiring apparatus in Embodiment 1 by this invention. この発明による実施の形態１におけるパワー回路配線装置の要部構成を示す図１のII−II線における断面図である。It is sectional drawing in the II-II line | wire of FIG. 1 which shows the principal part structure of the power circuit wiring apparatus in Embodiment 1 by this invention. この発明による実施の形態１におけるパワー回路配線装置の熱的な等価回路を示す接続図である。It is a connection diagram which shows the thermal equivalent circuit of the power circuit wiring apparatus in Embodiment 1 by this invention. この発明による実施の形態２におけるパワー回路配線装置の要部構成を示す断面図である。It is sectional drawing which shows the principal part structure of the power circuit wiring apparatus in Embodiment 2 by this invention. この発明による実施の形態３におけるパワー回路配線装置の要部構成を示す断面図である。It is sectional drawing which shows the principal part structure of the power circuit wiring apparatus in Embodiment 3 by this invention. この発明による実施の形態４におけるパワー回路配線装置の要部構成を示す断面図である。It is sectional drawing which shows the principal part structure of the power circuit wiring apparatus in Embodiment 4 by this invention. この発明による実施の形態５におけるパワー回路配線装置の要部構成を示す断面図である。It is sectional drawing which shows the principal part structure of the power circuit wiring apparatus in Embodiment 5 by this invention.

実施の形態１．
この発明による実施の形態１を図１から図３までについて説明する。図１は実施の形態１におけるパワー回路配線装置の構成を示す斜視図である。図２は実施の形態１におけるパワー回路配線装置の要部構成を示す図１のII−II線における断面図である。図３は実施の形態１におけるパワー回路配線装置の熱的な等価回路を示す接続図である。図中、同一符号は同一または相当部分を示す。 Embodiment 1 FIG.
A first embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a perspective view showing a configuration of a power circuit wiring device according to the first embodiment. 2 is a cross-sectional view taken along the line II-II in FIG. 1, showing the main configuration of the power circuit wiring device according to the first embodiment. FIG. 3 is a connection diagram showing a thermal equivalent circuit of the power circuit wiring device according to the first embodiment. In the drawings, the same reference numerals indicate the same or corresponding parts.

図１において、回路部品（図示せず）を搭載する回路基板を構成するプリント基板１には、発熱部品であるパワー給電部としてのパワーモジュール２が取り付けられている。パワーモジュール２の図示下面にはパワーモジュール２自体を冷却する放熱部材３が設けられ、パワーモジュール２はパワーモジュール２のネジ端子部を構成するネジ４によってプリント基板１に締結される。
この実施の形態１に示す発熱部品のパワーモジュール２はネジ４を持つネジ端子部を５個設けた５端子のパワーモジュールで構成されている。プリント基板１には所定の配線パターン５が形成されており、パワーモジュール２のネジ端子部はネジ４によるプリント基板１への締結によって、それぞれプリント基板１の所定の配線パターン５に電気的に接続される。パワーモジュール２とプリント基板１の配線パターン５との接続部には断面コ字状の放熱部材６が設けられる。
放熱部材６は冷却対象となるパワーモジュール２のネジ端子部それぞれに対応する配線パターン５にプリント基板１とパワーモジュール２をネジ４で締結する際に同時に組み付けられている。
放熱部材６の素材には、はんだ付け性が良好で熱伝導性も良い金属製、例えば銅や真鍮を用い、構造も非常にシンプルで安価である。 In FIG. 1, a power module 2 as a power feeding unit, which is a heat generating component, is attached to a printed circuit board 1 that constitutes a circuit board on which circuit components (not shown) are mounted. A heat radiating member 3 for cooling the power module 2 itself is provided on the lower surface of the power module 2 in the figure, and the power module 2 is fastened to the printed circuit board 1 by screws 4 constituting screw terminal portions of the power module 2.
The power module 2 of the heat generating component shown in the first embodiment is a five-terminal power module provided with five screw terminal portions having screws 4. A predetermined wiring pattern 5 is formed on the printed circuit board 1, and the screw terminal portion of the power module 2 is electrically connected to the predetermined wiring pattern 5 on the printed circuit board 1 by fastening the screw 4 to the printed circuit board 1. Is done. A heat radiating member 6 having a U-shaped cross section is provided at a connection portion between the power module 2 and the wiring pattern 5 of the printed circuit board 1.
The heat radiating member 6 is assembled at the same time when the printed circuit board 1 and the power module 2 are fastened with the screws 4 to the wiring patterns 5 corresponding to the screw terminal portions of the power module 2 to be cooled.
The heat radiating member 6 is made of a metal having good solderability and good thermal conductivity, such as copper or brass, and the structure is very simple and inexpensive.

この実施の形態１では、パワーモジュール２のネジ４を有するネジ端子部それぞれに対応して５個の放熱部材６を組み付けているが、基板の実状に併せて適正に数を減じても良い。   In the first embodiment, the five heat radiating members 6 are assembled corresponding to the screw terminal portions having the screws 4 of the power module 2, but the number may be appropriately reduced in accordance with the actual state of the substrate.

図２では、図１に示したパワー回路配線装置のII−II線における断面図を示す。図２において、パワーモジュール２のネジ端子部を構成し導電経路を形成するネジ４はパワーモジュール２のプリント基板１への締結状態でネジ頭部を断面コ字状の放熱部材６の中央凹部上面に圧接して放熱部材６をプリント基板１の配線パターン５に圧接している。
これによりプリント基板１とパワーモジュール２との電気的接続が確保されるとともに、プリント基板１とパワーモジュール２との電気的接続部分に放熱部材６が介挿されることによってプリント基板１とパワーモジュール２との電気的接続部における冷却がプリント基板１とパワーモジュール２との電気的接続部分に熱的に直接結合された放熱部材６により直接的かつ効果的に行われ、局部的な温度上昇が的確に抑制される。 2 shows a cross-sectional view taken along line II-II of the power circuit wiring device shown in FIG. In FIG. 2, the screw 4 constituting the screw terminal portion of the power module 2 and forming the conductive path is the upper surface of the central recess of the heat radiating member 6 having a U-shaped cross section at the screw head when the power module 2 is fastened to the printed circuit board 1. The heat radiating member 6 is pressed against the wiring pattern 5 of the printed circuit board 1 in pressure contact.
As a result, the electrical connection between the printed circuit board 1 and the power module 2 is ensured, and the heat dissipation member 6 is inserted into the electrical connection portion between the printed circuit board 1 and the power module 2, whereby the printed circuit board 1 and the power module 2. Cooling at the electrical connection part is directly and effectively performed by the heat dissipating member 6 that is thermally coupled directly to the electrical connection part between the printed circuit board 1 and the power module 2, and a local temperature rise is accurately performed. To be suppressed.

そして、ネジ４によって締結される放熱部材６には、それぞれ回り止め用の突部６ａが少なくとも１個以上設けられ、プリント基板１に設けられた穴部１ａに係合するように構成されている。ネジ４による締結時に放熱部材６の突部６ａが嵌合している穴部１ａの周縁に係合し放熱部材６の回り止めが行われる。
プリント基板１に設けられる回り止め用の穴部１ａは、プリント基板１へのパワーモジュール２投影外形の外側に設けられ、すなわち、プリント基板１のパワーモジュール２との対向面以外に設けられ、放熱部材６に設けられた回り止め用突部６ａが、ネジ４による締結時にパワーモジュール２に干渉することを防止できる。 Each of the heat dissipating members 6 fastened by the screws 4 is provided with at least one protrusion 6a for preventing rotation, and is configured to engage with a hole 1a provided on the printed circuit board 1. . When the screw 4 is fastened, the heat dissipating member 6 is engaged with the periphery of the hole 1a in which the protrusion 6a of the heat dissipating member 6 is fitted to prevent the heat dissipating member 6 from rotating.
The anti-rotation hole 1a provided in the printed circuit board 1 is provided outside the outer shape of the power module 2 projected onto the printed circuit board 1, that is, provided on a surface other than the surface of the printed circuit board 1 facing the power module 2 to dissipate heat. It is possible to prevent the rotation preventing projection 6 a provided on the member 6 from interfering with the power module 2 when the screw 4 is fastened.

図３では、図１および図２に示したパワー回路配線装置の熱的な等価回路を示す。パワーモジュール２による発熱を定電流源Ｐで示し、θａはパワーモジュール２と放熱部材３間の熱抵抗、θｂは放熱部材３と空気間の熱抵抗、θｃはパワーモジュール２とプリント基板１間の熱抵抗、θｄはプリント基板１と放熱部材６間の熱抵抗、θｅは放熱部材６と空気間の熱抵抗、θｆはプリント基板１の熱抵抗、θｇはプリント基板１と空気間の熱抵抗、θｈは放熱部材６と空気間の熱抵抗、θｉは放熱部材６と空気間の熱抵抗を示す。   FIG. 3 shows a thermal equivalent circuit of the power circuit wiring device shown in FIGS. 1 and 2. Heat generation by the power module 2 is indicated by a constant current source P, θa is a thermal resistance between the power module 2 and the heat radiating member 3, θb is a heat resistance between the heat radiating member 3 and the air, and θc is between the power module 2 and the printed circuit board 1. Thermal resistance, θd is the thermal resistance between the printed circuit board 1 and the heat dissipation member 6, θe is the thermal resistance between the heat dissipation member 6 and the air, θf is the thermal resistance of the printed circuit board 1, θg is the thermal resistance between the printed circuit board 1 and the air, θh represents the thermal resistance between the heat radiating member 6 and air, and θi represents the thermal resistance between the heat radiating member 6 and air.

この発明では、図１および図２で示したパワー回路配線装置において、発熱部品であるパワーモジュール２がネジ４により締結されたプリント基板１のねじ止め部の配線パターン５の温度を軽減することにより、配線パターン５のヒートサイクルが緩和され当該回路・製品の信頼性が向上する。   In the present invention, in the power circuit wiring device shown in FIGS. 1 and 2, the temperature of the wiring pattern 5 of the screwing portion of the printed circuit board 1 in which the power module 2 as the heat generating component is fastened by the screw 4 is reduced. The heat cycle of the wiring pattern 5 is alleviated and the reliability of the circuit / product is improved.

図３の熱的等価回路において、配線パターン５の温度は、熱抵抗θｃと熱抵抗θｄ間のａ点を示す。プリント基板パターン温度Ｔｂは、熱抵抗θｂを下げパワーモジュール２のベース温度Ｔｍを下げることで低減可能である。しかし、熱抵抗θｂを下げるには、放熱部材３の放熱性能を大幅に向上させる必要があり、放熱部材３が高コスト、大型化するという問題がある。
そこで、この発明による実施の形態では、パワーモジュール２のケース温度を一般的な設計温度に設定することでパワーモジュール２自体の冷却を行う放熱部材３には汎用の低コストな部材を使用し、パワーモジュール２のネジ端子部に放熱部材６を組み付けることで、パワーモジュール２のネジ端子部で形成される電気的接続部分における配線パターン５の温度を軽減した。
プリント基板パターン温度Ｔｂは、次式で求められる。 In the thermal equivalent circuit of FIG. 3, the temperature of the wiring pattern 5 indicates a point a between the thermal resistance θc and the thermal resistance θd. The printed circuit board pattern temperature Tb can be reduced by lowering the thermal resistance θb and lowering the base temperature Tm of the power module 2. However, in order to reduce the thermal resistance θb, it is necessary to greatly improve the heat dissipation performance of the heat radiating member 3, and there is a problem that the heat radiating member 3 is expensive and large.
Therefore, in the embodiment according to the present invention, a general-purpose low-cost member is used for the heat radiating member 3 that cools the power module 2 itself by setting the case temperature of the power module 2 to a general design temperature. By assembling the heat dissipating member 6 to the screw terminal portion of the power module 2, the temperature of the wiring pattern 5 at the electrical connection portion formed by the screw terminal portion of the power module 2 was reduced.
The printed circuit board pattern temperature Tb is obtained by the following equation.

Figure 2010161417
Figure 2010161417

前記式において、熱抵抗θｃおよびθｄは、ネジ４と空気間の熱抵抗θｅとパワーモジュール２のベースと端子間の熱抵抗θｉに比べ十分小さく、パワーモジュール２のネジ端子部の配線パターン温度は熱抵抗θｅとθｉが支配的である。なお、熱抵抗θｉは、モジュール構造で決定されるため変更が不可能である。   In the above equation, the thermal resistances θc and θd are sufficiently smaller than the thermal resistance θe between the screw 4 and air and the thermal resistance θi between the base and terminals of the power module 2, and the wiring pattern temperature of the screw terminal portion of the power module 2 is Thermal resistances θe and θi are dominant. The thermal resistance θi cannot be changed because it is determined by the module structure.

そこで、この発明では、熱抵抗θｅを低減すべく並列に熱抵抗θｈの放熱部材６をパワーモジュール２の端子部に組み付けることで配線パターン温度を大幅に軽減した。なお、プリント基板１の熱抵抗θｆを軽減することでもプリント基板パターン温度Ｔｂを軽減することは可能であるが、熱伝導特性の良い高価な金属基板が必要となり高コスト化するという問題がある。   Therefore, in the present invention, the wiring pattern temperature is greatly reduced by assembling the heat radiating member 6 having the thermal resistance θh in parallel to the terminal portion of the power module 2 in order to reduce the thermal resistance θe. Although it is possible to reduce the printed circuit board pattern temperature Tb by reducing the thermal resistance θf of the printed circuit board 1, there is a problem that an expensive metal substrate having good heat conduction characteristics is required and the cost is increased.

この実施の形態１では、前述の通り、図１および図２に示すように、断面コ字状の放熱部材６がプリント基板１の上面に設けられている。放熱部材６の形状はプリント基板１の取付け部分に接する通電に寄与する平面部分と、プリント基板１から直立する放熱に寄与する平面部分とを兼ね備え、放熱に寄与する面積の和が、放熱部材６と接するプリント基板１の表面積以上である。   In the first embodiment, as described above, the heat radiating member 6 having a U-shaped cross section is provided on the upper surface of the printed circuit board 1 as shown in FIGS. 1 and 2. The shape of the heat dissipating member 6 includes a flat portion contributing to energization contacting the mounting portion of the printed circuit board 1 and a flat portion contributing to heat dissipating upright from the printed circuit board 1, and the sum of the areas contributing to heat dissipating is the heat dissipating member 6. Or more than the surface area of the printed circuit board 1 in contact with.

なお、この実施の形態１においては、放熱部材６はパワーモジュール２のネジ端子部を構成するネジ４による締結によってプリント基板１の配線パターン５に接合されているが、放熱部材６をプリント基板１にはんだ付けし、放熱部材６をプリント基板１の配線パターン５にはんだ付けにより結合することができる。
これによって、放熱部材６はプリント基板１の配線パターン５に電気的ならびに熱的および機械的に確実に結合され、プリント基板１の配線パターン５とパワーモジュール２と電気的接続部分の直接的かつ効果的な冷却を一層有効に行うことが可能になる。 In the first embodiment, the heat radiating member 6 is joined to the wiring pattern 5 of the printed board 1 by fastening with the screws 4 constituting the screw terminal portion of the power module 2. The heat dissipation member 6 can be bonded to the wiring pattern 5 of the printed circuit board 1 by soldering.
Thereby, the heat radiating member 6 is securely and electrically and thermally and mechanically coupled to the wiring pattern 5 of the printed circuit board 1, and the direct and effect of the wiring pattern 5, the power module 2, and the electrical connection portion of the printed circuit board 1. Cooling can be performed more effectively.

（１Ａ）この発明による実施の形態１によれば、パワーモジュール２からなるパワー給電部と回路部品とを電気的に接続するプリント基板１からなる回路基板を備え、前記パワーモジュール２からなるパワー給電部と前記プリント基板１からなる回路基板の配線パターン５との接続部分に断面コ字状の放熱部材６を熱的に結合したので、プリント基板１からなる回路基板における電気的接続部分での局部的な温度上昇を的確に軽減できるパワー回路配線装置を得ることができる。
すなわち、ダイオード，トランジスタ，ＭＯＳＦＥＴ，ＩＧＢＴ等をパッケージに収めたパワーモジュール２と、前記パワーモジュール２に配線される回路部品と、前記パワーモジュール２と回路部品とを電気的に接続したプリント基板１からなるパワー配線回路において、前記パワーモジュール２と前記プリント基板１の接続部分に放熱部材６を熱的に結合したので、放熱部材６を接続部分に結合したことにより接続部分での放熱性能を向上し、パワーモジュール２からの熱伝導による接続部分のプリント基板１の局部的な温度上昇を軽減する。
そして、パワーモジュール２のネジ端子部とプリント基板１における配線パターン５のネジ端子部に放熱部材６を実装することにより、パワーモジュール２のネジ端子部と配線パターン５部分に生じる局部的な温度上昇を軽減するとともに、さらには、ネジ締結時にプリント基板１へのストレスとなる締め付け圧力を緩和し、プリント基板１の凹みを緩和する。 (1A) According to the first embodiment of the present invention, a power supply comprising the printed circuit board 1 for electrically connecting a power supply unit comprising the power module 2 and a circuit component is provided. Since the heat-dissipating member 6 having a U-shaped cross section is thermally coupled to the connection portion between the printed circuit board 1 and the circuit board wiring pattern 5 formed of the printed circuit board 1, local portions at the electrical connection portions of the printed circuit board 1 circuit board are provided. It is possible to obtain a power circuit wiring device capable of accurately reducing a typical temperature rise.
That is, from a power module 2 in which a diode, transistor, MOSFET, IGBT or the like is housed in a package, a circuit component wired to the power module 2, and a printed circuit board 1 in which the power module 2 and the circuit component are electrically connected. In the power wiring circuit, the heat radiating member 6 is thermally coupled to the connection portion between the power module 2 and the printed circuit board 1. Therefore, the heat radiation performance at the connection portion is improved by coupling the heat radiating member 6 to the connection portion. The local temperature rise of the printed circuit board 1 at the connection portion due to heat conduction from the power module 2 is reduced.
Then, by mounting the heat dissipation member 6 on the screw terminal portion of the power module 2 and the screw terminal portion of the wiring pattern 5 on the printed circuit board 1, a local temperature rise that occurs in the screw terminal portion of the power module 2 and the wiring pattern 5 portion. In addition, the tightening pressure that becomes a stress on the printed circuit board 1 when the screw is tightened is relieved, and the dent of the printed circuit board 1 is relieved.

（１Ｂ）この発明による実施の形態１によれば、前記（１Ａ）項における構成において、前記放熱部材６を前記回路基板にはんだ付けしたので、プリント基板１からなる回路基板における電気的接続部分での局部的な温度上昇を的確に軽減できるとともに放熱部材６をプリント基板１の配線パターン５に電気的ならびに熱的および機械的に確実に結合できるパワー回路配線装置を得ることができる。 (1B) According to the first embodiment of the present invention, in the configuration in the item (1A), the heat radiating member 6 is soldered to the circuit board. Thus, it is possible to obtain a power circuit wiring device that can accurately reduce the local temperature rise and that can reliably connect the heat radiating member 6 to the wiring pattern 5 of the printed circuit board 1 electrically, thermally, and mechanically.

（１Ｃ）この発明による実施の形態１によれば、前記（１Ａ）項における構成において、前記放熱部材６に少なくとも１個以上の突部６ａを設け、前記突部６ａを前記回路基板１に設けられた穴部１ａに嵌合状態で係合するようにしたので、プリント基板１からなる回路基板における電気的接続部での局部的な温度上昇を的確に軽減できるとともに、放熱部材を接続部分に締結する際に、放熱部材が回転することを防止できるパワー回路配線装置を得ることができる。 (1C) According to the first embodiment of the present invention, in the configuration in the item (1A), at least one protrusion 6a is provided on the heat radiating member 6, and the protrusion 6a is provided on the circuit board 1. Since the hole 1a is engaged in the fitted state, the local temperature rise at the electrical connection portion in the circuit board made of the printed circuit board 1 can be accurately reduced, and the heat radiating member can be connected to the connection portion. When fastening, the power circuit wiring device which can prevent that a heat radiating member rotates can be obtained.

（１Ｄ）この発明による実施の形態１によれば、前記（１Ｃ）項における構成において、前記プリント基板１からなる回路基板に設けられる穴部１ａを、前記プリント基板１からなる回路基板の前記パワーモジュール２からなるパワー給電部との対向面以外に設けたので、プリント基板１からなる回路基板における電気的接続部での局部的な温度上昇を的確に軽減できるとともに、放熱部材に設けられた回転防止用突部が、締結時にパワーモジュールに干渉することを防止できるパワー回路配線装置を得ることができる。 (1D) According to the first embodiment of the present invention, in the configuration in the item (1C), the hole 1a provided in the circuit board made of the printed circuit board 1 is replaced with the power of the circuit board made of the printed circuit board 1. Since it is provided on a surface other than the surface opposite to the power feeding unit made up of the module 2, the local temperature rise at the electrical connection part in the circuit board made of the printed circuit board 1 can be accurately reduced, and the rotation provided on the heat dissipation member It is possible to obtain a power circuit wiring device capable of preventing the prevention protrusion from interfering with the power module at the time of fastening.

（１Ｅ）この発明による実施の形態１によれば、前記（１Ａ）項から前記（１Ｄ）項までにおけるいずれかの構成において、前記放熱部材６は、前記プリント基板１からなる回路基板取付け部分に接する通電に寄与する平面部分と、前記プリント基板１からなる回路基板から直立する放熱に寄与する平面部分とを兼ね備え、放熱に寄与する平面の面積の和が、前記放熱部材６と接するプリント基板１からなる回路基板の表面積以上であるようにしたので、十分な放熱面積を持つ放熱部材６を接続部分に結合したことにより接続部分での放熱性能を向上し、パワーモジュール２からの熱伝導による接続部分のプリント基板１からなる回路基板の局部的な温度上昇を軽減できるパワー回路配線装置を得ることができる。 (1E) According to the first embodiment of the present invention, in any one of the configurations from the items (1A) to (1D), the heat radiating member 6 is attached to a circuit board mounting portion made of the printed circuit board 1. The printed circuit board 1 that combines a planar portion that contributes to energization and a planar portion that contributes to heat dissipation that stands upright from the circuit board made of the printed circuit board 1, and the sum of the areas of the plane that contributes to heat radiation is in contact with the heat dissipation member 6. Since the heat dissipation member 6 having a sufficient heat radiation area is coupled to the connection portion, the heat radiation performance at the connection portion is improved and the connection by heat conduction from the power module 2 is performed. It is possible to obtain a power circuit wiring device that can reduce the local temperature rise of the circuit board formed of the partial printed circuit board 1.

（１Ｆ）この発明による実施の形態１によれば、前記（１Ａ）項から前記（１Ｅ）項までにおけるいずれかの構成において、前記放熱部材６を前記プリント基板１からなる回路基板に締結するネジ４を有するネジ端子部からなる締結手段を備え、前記ネジ４を有するネジ端子部からなる締結手段による締結によって前記パワー給電部と前記回路基板とを電気的および熱的に接続したので、プリント基板１からなる回路基板における電気的接続部での局部的な温度上昇を的確に軽減できるとともに、パワー給電部と回路基板とを締結により電気的および熱的に確実に接続できるパワー回路配線装置を得ることができる。 (1F) According to the first embodiment of the present invention, in any of the configurations from (1A) to (1E), the screw for fastening the heat radiating member 6 to the circuit board made of the printed circuit board 1 Since the power feeding unit and the circuit board are electrically and thermally connected by fastening by the fastening means comprising the screw terminal part having the screw 4, the printed circuit board is provided. A power circuit wiring device capable of accurately mitigating a local temperature rise at an electrical connection portion in a circuit board made of 1 and capable of being connected electrically and thermally reliably by fastening the power feeding portion and the circuit board is obtained. be able to.

実施の形態２．
この発明による実施の形態２を図４について説明する。図４は実施の形態２におけるパワー回路配線装置の要部構成を示す断面図である。
この実施の形態２において、ここで説明する特有の構成以外の構成については、先に説明した実施の形態１における構成と同一の構成内容を具備し、同様の作用を奏するものである。図中、同一符号は同一または相当部分を示す。 Embodiment 2. FIG.
A second embodiment of the present invention will be described with reference to FIG. FIG. 4 is a cross-sectional view showing a main configuration of the power circuit wiring device according to the second embodiment.
In the second embodiment, the configuration other than the specific configuration described here has the same configuration contents as the configuration in the first embodiment described above, and exhibits the same operation. In the drawings, the same reference numerals indicate the same or corresponding parts.

図４において、プリント基板１の配線パターン５とパワーモジュール２のネジ４を有するネジ端子部とで形成されるプリント基板１の配線パターン５とパワーモジュール２の電気的接続部分に熱的に結合されたＬ字状の放熱部材６が実装されている。
Ｌ字状の放熱部材６はプリント基板１の上面に設けられ、放熱部材６の形状はプリント基板１の取付け部分に接する通電に寄与する平面部分と、プリント基板１から直立する放熱に寄与する平面部分とを兼ね備え、放熱に寄与する平面の面積の和が、放熱部材６と接するプリント基板１の表面積以上である。 In FIG. 4, the wiring pattern 5 of the printed circuit board 1 and the screw terminal portion having the screw 4 of the power module 2 are thermally coupled to the wiring pattern 5 of the printed circuit board 1 and the electrical connection portion of the power module 2. An L-shaped heat radiating member 6 is mounted.
The L-shaped heat radiating member 6 is provided on the upper surface of the printed circuit board 1, and the shape of the heat radiating member 6 is a flat surface portion that contributes to energization contacting the mounting portion of the printed circuit board 1 and a flat surface that contributes to heat radiation that stands upright from the printed circuit board 1. The sum of the areas of the planes that combine the portions and contribute to heat dissipation is equal to or greater than the surface area of the printed circuit board 1 in contact with the heat dissipation member 6.

この発明による実施の形態２によれば、パワーモジュール２からなるパワー給電部と回路部品とを電気的に接続するプリント基板１からなる回路基板を備え、前記パワーモジュール２からなるパワー給電部と前記回路基板１の配線５との接続部分に断面Ｌ字状の放熱部材６を熱的に結合したので、前記プリント基板１からなる回路基板の配線５との接続部分に設けられた断面Ｌ字状の放熱部材６により、プリント基板１からなる回路基板における電気的接続部での局部的な温度上昇を的確に軽減できるパワー回路配線装置を得ることができる。   According to the second embodiment of the present invention, the power supply unit including the power module 2 includes the circuit board including the printed circuit board 1 that electrically connects the power supply unit including the power module 2 and the circuit component. Since the heat dissipating member 6 having an L-shaped cross section is thermally coupled to the connection portion with the wiring 5 of the circuit board 1, the L-shaped cross section provided at the connection portion with the wiring 5 of the circuit board made of the printed circuit board 1. With the heat radiating member 6, a power circuit wiring device can be obtained in which the local temperature rise at the electrical connection portion in the circuit board made of the printed circuit board 1 can be accurately reduced.

実施の形態３．
この発明による実施の形態３を図５について説明する。図５は実施の形態３におけるパワー回路配線装置の要部構成を示す断面図である。
この実施の形態３において、ここで説明する特有の構成以外の構成については、先に説明した実施の形態１における構成と同一の構成内容を具備し、同様の作用を奏するものである。図中、同一符号は同一または相当部分を示す。 Embodiment 3 FIG.
A third embodiment of the present invention will be described with reference to FIG. FIG. 5 is a cross-sectional view showing a main configuration of the power circuit wiring device according to the third embodiment.
In the third embodiment, the configuration other than the specific configuration described here has the same configuration contents as the configuration in the first embodiment described above, and has the same function. In the drawings, the same reference numerals indicate the same or corresponding parts.

図５において、プリント基板１の配線パターン５とパワーモジュール２のネジ４を有するネジ端子部とで形成されるプリント基板１の配線パターン５とパワーモジュール２の電気的接続部分に熱的に結合されたブロック状の金属体からなる放熱部材６が実装されている。
ブロック状の金属体からなる放熱部材６はプリント基板１の上面に設けられ、放熱部材６の形状はプリント基板１の取付け部分に接する通電に寄与する平面部分と、プリント基板１から直立する放熱に寄与する平面部分とを兼ね備え、放熱に寄与する平面の面積の和が、放熱部材６と接するプリント基板１の表面積以上である。 In FIG. 5, the wiring pattern 5 of the printed circuit board 1 and the screw terminal portion having the screw 4 of the power module 2 are thermally coupled to the electrical connection portion of the wiring pattern 5 of the printed circuit board 1 and the power module 2. A heat radiating member 6 made of a block-shaped metal body is mounted.
A heat radiating member 6 made of a block-shaped metal body is provided on the upper surface of the printed circuit board 1, and the shape of the heat radiating member 6 is a flat surface portion that contributes to energization in contact with the mounting portion of the printed circuit board 1 and heat radiation that stands upright from the printed circuit board 1. The surface area of the printed circuit board 1 that is in contact with the heat radiating member 6 is equal to or larger than the surface area of the printed circuit board 1 in contact with the heat radiating member 6.

この発明による実施の形態３によれば、パワーモジュール２からなるパワー給電部と回路部品とを電気的に接続するプリント基板１からなる回路基板を備え、前記パワーモジュール２からなるパワー給電部と前記回路基板１の配線５との接続部分にブロック状の金属体からなる放熱部材６を熱的に結合したので、前記プリント基板１からなる回路基板の配線５との接続部分に設けられたブロック状の金属体からなる放熱部材６により、プリント基板１からなる回路基板における電気的接続部での局部的な温度上昇を的確に軽減できるパワー回路配線装置を得ることができる。   According to the third embodiment of the present invention, the power supply unit including the power module 2 includes the circuit board including the printed circuit board 1 that electrically connects the power supply unit including the power module 2 and the circuit component. Since the heat radiating member 6 made of a block-like metal body is thermally coupled to the connection portion of the circuit board 1 with the wiring 5, the block shape provided in the connection portion of the circuit board made of the printed circuit board 1 By using the heat dissipation member 6 made of the metal body, it is possible to obtain a power circuit wiring device that can accurately reduce the local temperature rise at the electrical connection portion of the circuit board made of the printed circuit board 1.

実施の形態４．
この発明による実施の形態４を図６について説明する。図６は実施の形態４におけるパワー回路配線装置の要部構成を示す断面図である。
この実施の形態４において、ここで説明する特有の構成以外の構成については、先に説明した実施の形態１における構成と同一の構成内容を具備し、同様の作用を奏するものである。図中、同一符号は同一または相当部分を示す。 Embodiment 4 FIG.
A fourth embodiment of the present invention will be described with reference to FIG. FIG. 6 is a cross-sectional view showing the main configuration of the power circuit wiring device according to the fourth embodiment.
In the fourth embodiment, the configuration other than the specific configuration described here has the same configuration contents as the configuration in the first embodiment described above, and exhibits the same operation. In the drawings, the same reference numerals indicate the same or corresponding parts.

図６において、プリント基板１の配線パターン５とパワーモジュール２のネジ４を有するネジ端子部とで形成されるプリント基板１の配線パターン５とパワーモジュール２の電気的接続部分に熱的に結合された拡大ネジ頭部４ａを有するネジ４からなる締結手段を構成する放熱部材６が実装されている。
拡大ネジ頭部４ａを有するネジ４からなる締結手段を構成する放熱部材６はプリント基板１の上面に設けられ、放熱部材６の形状はプリント基板１の取付け部分に接する通電に寄与する平面部分と、プリント基板１から直立する放熱に寄与する平面部分とを兼ね備え、放熱に寄与する平面の面積の和が、放熱部材６と接するプリント基板１の表面積以上である。 In FIG. 6, the wiring pattern 5 of the printed circuit board 1 and the screw terminal portion having the screw 4 of the power module 2 are thermally coupled to the wiring pattern 5 of the printed circuit board 1 and the electrical connection portion of the power module 2. A heat dissipating member 6 constituting a fastening means composed of a screw 4 having an enlarged screw head 4a is mounted.
The heat dissipating member 6 constituting the fastening means comprising the screw 4 having the enlarged screw head 4a is provided on the upper surface of the printed circuit board 1, and the shape of the heat dissipating member 6 is a plane part contributing to energization in contact with the mounting part of the printed circuit board 1. In addition, the sum of the areas of the planes contributing to the heat dissipation is greater than or equal to the surface area of the printed circuit board 1 in contact with the heat dissipation member 6.

この発明による実施の形態４によれば、パワーモジュール２からなるパワー給電部と回路部品とを電気的に接続するプリント基板１からなる回路基板を備え、前記パワーモジュール２からなるパワー給電部と前記回路基板１の配線５との接続部分に拡大ネジ頭部４ａを有するネジ４からなる締結手段を構成する放熱部材６を熱的に結合したので、前記プリント基板１からなる回路基板の配線５との接続部分に設けられた拡大ネジ頭部を有する締結手段を構成する放熱部材６により、プリント基板１からなる回路基板における電気的接続部での局部的な温度上昇を的確に軽減できるパワー回路配線装置を得ることができる。   According to the fourth embodiment of the present invention, the power supply unit including the power module 2 includes the circuit board including the printed circuit board 1 that electrically connects the power supply unit including the power module 2 and the circuit component. Since the heat dissipating member 6 constituting the fastening means including the screw 4 having the enlarged screw head 4a is thermally coupled to the connection portion with the wiring 5 of the circuit board 1, the wiring 5 of the circuit board including the printed circuit board 1 and Power circuit wiring that can accurately reduce the local temperature rise at the electrical connection portion of the circuit board made of the printed circuit board 1 by the heat dissipating member 6 constituting the fastening means having the enlarged screw head provided at the connection portion of A device can be obtained.

実施の形態５．
この発明による実施の形態５を図７について説明する。図７は実施の形態５におけるパワー回路配線装置の要部構成を示す断面図である。
この実施の形態５において、ここで説明する特有の構成以外の構成については、先に説明した実施の形態１における構成と同一の構成内容を具備し、同様の作用を奏するものである。図中、同一符号は同一または相当部分を示す。 Embodiment 5 FIG.
A fifth embodiment of the present invention will be described with reference to FIG. FIG. 7 is a cross-sectional view showing a main configuration of the power circuit wiring device according to the fifth embodiment.
In the fifth embodiment, the configuration other than the specific configuration described here has the same configuration contents as the configuration in the first embodiment described above, and exhibits the same operation. In the drawings, the same reference numerals indicate the same or corresponding parts.

図７において、プリント基板１の配線パターン５とパワーモジュール２のネジ４を有するネジ端子部とで形成されるプリント基板１の配線パターン５とパワーモジュール２の電気的接続部分に熱的に結合された茶筒状の放熱部材６が実装されている。
茶筒状の放熱部材６はプリント基板１の上面に設けられ、放熱部材６の形状はプリント基板１の取付け部分に接する通電に寄与する平面部分と、プリント基板１から直立する放熱に寄与する平面部分とを兼ね備え、放熱に寄与する平面の面積の和が、放熱部材６と接するプリント基板１の表面積以上である。 In FIG. 7, the wiring pattern 5 of the printed circuit board 1 and the screw terminal portion having the screw 4 of the power module 2 are thermally coupled to the electrical connection portion of the wiring pattern 5 of the printed circuit board 1 and the power module 2. A tea tube-shaped heat radiating member 6 is mounted.
The tea tube-shaped heat radiating member 6 is provided on the upper surface of the printed circuit board 1, and the shape of the heat radiating member 6 is a flat surface portion that contributes to energization contacting the mounting portion of the printed circuit board 1 and a flat surface portion that contributes to heat radiation upright from the printed circuit board 1. And the sum of the plane areas contributing to heat dissipation is equal to or greater than the surface area of the printed circuit board 1 in contact with the heat dissipation member 6.

この発明による実施の形態５によれば、パワーモジュール２からなるパワー給電部と回路部品とを電気的に接続するプリント基板１からなる回路基板を備え、前記パワーモジュール２からなるパワー給電部と前記回路基板１の配線５との接続部分にブロック状金属体からなる放熱部材６を熱的に結合したので、前記プリント基板１からなる回路基板の配線５との接続部分に設けられた茶筒状の放熱部材６により、プリント基板１からなる回路基板における電気的接続部での局部的な温度上昇を的確に軽減できるパワー回路配線装置を得ることができる。   According to the fifth embodiment of the present invention, the power supply unit including the power module 2 includes the circuit board including the printed circuit board 1 that electrically connects the power supply unit including the power module 2 and the circuit component. Since the heat dissipating member 6 made of a block-like metal body is thermally coupled to the connection portion of the circuit board 1 with the wiring 5, the tea tube-like shape provided at the connection portion with the wiring 5 of the circuit board made of the printed circuit board 1. With the heat radiating member 6, a power circuit wiring device that can accurately reduce a local temperature rise at the electrical connection portion of the circuit board made of the printed circuit board 1 can be obtained.

１ プリント基板、２ パワーモジュール、３ 放熱部材、４ ネジ、５ 配線パターン、６ 放熱部材、Ｐ パワーモジュールによる発熱源、θａ パワーモジュール２と放熱部材３間の熱抵抗、θｂ放熱部材３と空気間の熱抵抗、θｃ パワーモジュール２とプリント基板１間の熱抵抗、θｄ プリント基板１と放熱部材６間の熱抵抗、θｅ 放熱部材６と空気間の熱抵抗、θｆ プリント基板１の熱抵抗、θｇ プリント基板１と空気間の熱抵抗、θｈ 放熱部材６と空気間の熱抵抗、θｉ パワーモジュールのベースと端子間の熱抵抗、Ｔａ 基板周囲温度、Ｔｂ プリント基板パターン温度、Ｔｃ パワーモジュールの端子温度、Ｔｍ パワーモジュールのベース温度。   DESCRIPTION OF SYMBOLS 1 Printed circuit board, 2 Power module, 3 Heat radiating member, 4 Screw, 5 Wiring pattern, 6 Heat radiating member, Heat source by P power module, θa Thermal resistance between power module 2 and radiating member 3, θb Heat radiating member 3 and air , Thermal resistance between the power module 2 and the printed circuit board 1, θd thermal resistance between the printed circuit board 1 and the heat radiating member 6, θe thermal resistance between the heat radiating member 6 and the air, θf thermal resistance of the printed circuit board 1, θg Thermal resistance between printed circuit board 1 and air, θh Thermal resistance between heat radiation member 6 and air, θi Thermal resistance between base and terminal of power module, Ta substrate ambient temperature, Tb Printed circuit board pattern temperature, Tc Power module terminal temperature , Tm Base temperature of the power module.

Claims (5)

ネジ端子部を備えたパワー給電部と、前記パワー給電部を冷却する第１の放熱部材と、回路部品と前記パワー給電部とを電気的に接続する回路基板と、前記ネジ端子部と前記回路基板とをネジで締結する際に同時に組み付けられる第２の放熱部材とを備えたことを特徴としたパワー回路配線装置。   A power feeder provided with a screw terminal; a first heat radiating member that cools the power feeder; a circuit board that electrically connects a circuit component and the power feeder; the screw terminal; and the circuit A power circuit wiring device comprising: a second heat dissipating member that is assembled at the same time when the substrate is fastened with screws. 前記第２の放熱部材の断面形状は、コの字状であることを特徴とした請求項１に記載のパワー回路配線装置。   The power circuit wiring device according to claim 1, wherein a cross-sectional shape of the second heat radiating member is a U-shape. 前記第２の放熱部材の断面形状は、Ｌ字状であることを特徴とした請求項１に記載のパワー回路配線装置。   The power circuit wiring device according to claim 1, wherein a cross-sectional shape of the second heat radiating member is L-shaped. 前記第２の放熱部材の断面形状は、筒状であることを特徴とした請求項１に記載のパワー回路配線装置。   The power circuit wiring device according to claim 1, wherein a cross-sectional shape of the second heat radiating member is a cylindrical shape. 前記回路基板に設けられた穴部と、前記第２の放熱部材の一部に設けられた突部とが係合するように構成されたことを特徴とした請求項１から４のいずれか１項に記載のパワー回路配線装置。   5. The structure according to claim 1, wherein a hole provided in the circuit board and a protrusion provided in a part of the second heat radiation member are engaged with each other. The power circuit wiring device according to the item.
JP2010089083A 2010-04-08 2010-04-08 Power circuit wiring device Active JP4866469B2 (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014139986A (en) * 2013-01-21 2014-07-31 Hitachi Automotive Systems Ltd Electronic controller
JPWO2021235445A1 (en) * 2020-05-21 2021-11-25

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014139986A (en) * 2013-01-21 2014-07-31 Hitachi Automotive Systems Ltd Electronic controller
JPWO2021235445A1 (en) * 2020-05-21 2021-11-25
WO2021235445A1 (en) * 2020-05-21 2021-11-25 株式会社オートネットワーク技術研究所 Circuit construction
JP7359300B2 (en) 2020-05-21 2023-10-11 株式会社オートネットワーク技術研究所 circuit construct

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