JP2019012202A - Optical connection module, manufacturing method thereof and optical transceiver - Google Patents

Abstract

To provide an optical connection module capable of un-tightening the mounting position accuracy of an optical waveguide device.SOLUTION: An optical connection module 10 comprises: an optical waveguide device 1 having a first circuit region 15 including a first optical waveguide 11; a second circuit region 25 including a second optical waveguide 21; an optical waveguide base plate 2 having an opening 26 for mounting the optical waveguide device; and a third optical waveguide 3 which is formed on the optical waveguide device and the optical waveguide base plate, which are mounted in the opening so that the first circuit region and the second circuit region come at the identical side, to optically connect the first optical waveguide and the second optical waveguide.SELECTED DRAWING: Figure 1

Description

  The present invention relates to an optical connection module, a manufacturing method thereof, and an optical transceiver.

  Conventionally, when an optical waveguide device is mounted on an optical waveguide substrate, the optical waveguide of the optical waveguide device and the optical waveguide of the optical waveguide device are optically aligned with the circuit region (circuit surface) including the terminals facing downward. In general, an optical waveguide device is mounted in the opening of the optical waveguide substrate so as to be connected.

JP-A 61-156231 JP-A-4-359204 JP 2003-227951 A

When the optical waveguide device is mounted downward in the opening of the optical waveguide substrate and the optical waveguides of the optical waveguide substrate and the optical waveguide device are optically connected to each other, high mounting position accuracy of the optical waveguide device is required.
An object of the present invention is to alleviate the mounting position accuracy of an optical waveguide device.

  In one aspect, an optical connection module includes an optical waveguide device including a first circuit region including a first optical waveguide, a second circuit region including a second optical waveguide, and an opening for mounting the optical waveguide device. And an optical waveguide device mounted on the opening so that the first circuit region and the second circuit region are on the same side, and the first optical waveguide and the second optical waveguide. A third optical waveguide for optically connecting the waveguide.

  In one aspect, the optical connection module includes: a first optical waveguide device including a first circuit region including a first optical waveguide; a second optical waveguide device including a second circuit region including a second optical waveguide; An optical waveguide substrate having a first opening for mounting an optical waveguide device and a second opening for mounting a second optical waveguide device, and the first circuit region and the second circuit region are on the same side The first optical waveguide device and the second optical waveguide device mounted on each of the first opening and the second opening are provided on the optical waveguide substrate, and the first optical waveguide and the second optical waveguide are optically connected. And a third optical waveguide that is connected to each other.

  In one aspect, an optical transceiver includes an optical waveguide device including a first circuit region including a first optical waveguide and a terminal for electrical connection, and a second optical waveguide and a terminal for electrical connection. An optical waveguide substrate including a second circuit region including the opening, and an opening for mounting the optical waveguide device, and an optical waveguide mounted in the opening so that the first circuit region and the second circuit region are on the same side A third optical waveguide provided on the device and the optical waveguide substrate and optically connecting the first optical waveguide and the second optical waveguide; and mounted on the optical waveguide device and the optical waveguide substrate; And an electronic circuit component connected to the substrate via bumps.

  In one aspect, an optical transceiver includes a first optical waveguide device that includes a first optical waveguide and a first circuit region that includes a terminal for electrical connection, and a second circuit region that includes a second optical waveguide. An optical device comprising: a second optical waveguide device; a first opening for mounting the first optical waveguide device; a second opening for mounting the second optical waveguide device; and a terminal for electrical connection. A first optical waveguide device, a second optical waveguide device, and an optical waveguide mounted in each of the first opening and the second opening so that the waveguide substrate and the first circuit region and the second circuit region are on the same side A third optical waveguide provided on the substrate and optically connecting the first optical waveguide and the second optical waveguide, and mounted on the first optical waveguide device and the optical waveguide substrate, the first optical waveguide device and the optical waveguide Connected to the board via bumps And a first electronic circuit component that is.

  In one aspect, a method for manufacturing an optical connection module includes: an optical waveguide device including a first circuit region including a first optical waveguide; an optical waveguide substrate including a second circuit region including a second optical waveguide and an opening. The optical waveguide device and the optical waveguide are mounted in the opening so that the first circuit region and the second circuit region are on the same side, and the first optical waveguide and the second optical waveguide are optically connected. A third optical waveguide is provided on the substrate.

  In one aspect, a method for manufacturing an optical connection module includes a first optical waveguide device including a first circuit region including a first optical waveguide, and a second optical waveguide device including a second circuit region including a second optical waveguide. Are mounted on the first opening and the second opening of the optical waveguide substrate having the first opening and the second opening, respectively, so that the first circuit region and the second circuit region are on the same side. The third optical waveguide is provided on the first optical waveguide device, the second optical waveguide device, and the optical waveguide substrate so that the first optical waveguide and the second optical waveguide are optically connected.

  As one aspect, the mounting position accuracy of the optical waveguide device can be relaxed.

(A), (B) is a schematic cross section which shows the structural example of the optical connection module concerning this embodiment, (B) is the enlarged view which expanded the part shown with the code | symbol X in (A). . It is typical sectional drawing which shows the structural example of the optical connection module concerning this embodiment. It is typical sectional drawing which shows the structural example of the optical connection module concerning this embodiment. It is a typical top view which shows the structural example of the optical connection module concerning this embodiment. It is a typical top view which shows the structural example of the optical connection module concerning this embodiment. It is typical sectional drawing which shows the structural example of the optical connection module concerning this embodiment. (A)-(E) are the schematic diagrams for demonstrating the manufacturing method of the optical connection module concerning this embodiment, (A) is a top view, (B)-(E) is sectional drawing. It is. (A)-(H) are the schematic diagrams for demonstrating the manufacturing method of the optical connection module concerning this embodiment, (A)-(G) are sectional drawings, (H) is a top view. It is. It is a typical perspective view which shows the state which connected the optical fiber to the optical connection module concerning this embodiment. It is a typical perspective view which shows the structure of the modification of the optical connection module concerning this embodiment. (A), (B) is a schematic diagram which shows the structural example of an optical transmitter / receiver provided with the optical connection module concerning this embodiment, (A) is a perspective view, (B) is sectional drawing. .

Hereinafter, an optical connection module, a manufacturing method thereof, and an optical transceiver according to an embodiment of the present invention will be described with reference to FIGS.
The optical connection module according to this embodiment is a module having an optical connection structure, and is used for an optical communication network, an optical interconnection, and the like, for example.
As shown in FIGS. 1A and 1B, the optical connection module of the present embodiment includes a first optical region 11 including a first optical waveguide 11 and a terminal 14 for electrical connection. An optical waveguide substrate 2 including a waveguide device 1, a second circuit region 25 including a second optical waveguide 21 and a terminal 24 for electrical connection, and an opening 26 for mounting the optical waveguide device 1. Prepare. The surfaces of the circuit regions 15 and 25 are also referred to as circuit surfaces. Here, the opening 26 is a through hole for embedding the optical waveguide device 1. The circuit regions 15 and 25 include an optical circuit configured by an optical waveguide and an electronic circuit configured by electrical wiring and terminals. The optical waveguide device 1 is also referred to as an optical device. Here, the optical waveguide device 1 is an active device, and the optical waveguide substrate 2 is a passive substrate.

  Furthermore, the first circuit region 15 and the second circuit region 25 are provided on the optical waveguide device 1 and the optical waveguide substrate 2 mounted in the opening 26 so that the first circuit region 15 and the second circuit region 25 are on the same side. A third optical waveguide 3 for optically connecting the optical waveguide 21 is provided. In the present embodiment, the optical waveguide device 1 is provided in the opening 26 so that the first optical waveguide 11 and the second optical waveguide 21 are at the same level. The optical waveguide device 1 and the optical waveguide substrate 2 are integrated with a resin 4 filled in the opening 26.

Thus, in the present embodiment, the first circuit surface that is the surface of the first circuit region 15 and the second circuit surface that is the surface of the second circuit region 25 are in the same direction, that is, on the surface side. With the first circuit surface and the second circuit surface exposed, the optical waveguide device 1 is inserted into the opening 26 so that the first optical waveguide 11 and the second optical waveguide 21 are at substantially the same level. Yes.
The surplus portion (gap) of the opening 26 into which the optical waveguide device 1 is inserted is filled with resin 4 and solidified, so that the optical waveguide device 1 and the optical waveguide substrate 2 are integrated.

Further, the third optical waveguide 3 is provided on the integrated structure (integrated structure) in this manner, and the first optical waveguide 11 and the second optical waveguide 21 are mutually connected via the third optical waveguide 3. Optically connected.
Thus, the mounting position accuracy of the optical waveguide device can be relaxed by optically connecting the first optical waveguide 11 and the second optical waveguide 21 via the third optical waveguide 3 without abutting the first optical waveguide 11 and the second optical waveguide 21. it can.

Here, the optical waveguide device 1 is, for example, a silicon photonics device formed on a silicon substrate, and the first optical waveguide 11 is a silicon fine wire waveguide formed on the silicon substrate.
The optical waveguide device 1 is a quartz-based device such as a quartz optical circuit device, and the first optical waveguide 11 is an optical waveguide made of a quartz-based (glass-based) material, for example. There may be. The optical waveguide device 1 may be a compound semiconductor device, for example, and the first optical waveguide 11 may be an optical waveguide made of a compound semiconductor, for example.

The optical waveguide substrate 2 is, for example, a substrate having an optical waveguide formed on a resin substrate, and the second optical waveguide 21 is a polymer waveguide formed on the resin substrate.
The third optical waveguide 3 is, for example, a polymer waveguide. In addition, the polymer waveguide as the third optical waveguide 3 and the polymer waveguide as the second optical waveguide 21 may be made of the same material or different materials.

Further, the resin 4 filling the gap of the opening 26 in which the optical waveguide device 1 is inserted is, for example, a transparent resin.
In the present embodiment, the first optical waveguide 11 includes a first core layer 12 and a first cladding layer 13 that covers the first core layer 12. The second optical waveguide 21 includes a second core layer 22 and a second cladding layer 23 that covers the second core layer 22. The third optical waveguide 3 includes a third core layer 31 and a third cladding layer 32 that covers the third core layer 31. The first core layer 12 and the third core layer 31 partially overlap, and the second core layer 22 and the third core layer 31 partially overlap.

In the present embodiment, the first cladding layer 13 is interposed between the first core layer 12 and the third core layer 31 in the portion where the first core layer 12 and the third core layer 31 overlap. doing. In addition, the second cladding layer 23 is interposed between the second core layer 22 and the third core layer 31 in the portion where the second core layer 22 and the third core layer 31 overlap.
In this case, the first cladding layer 13 and the second cladding layer 23 are made of a material (for example, transparent resin) having a lower refractive index than the first core layer 12, the second core layer 22, and the third core layer 31. The thickness reaches the core layer of the optical waveguide to which the electromagnetic field components of the light propagating through the first optical waveguide 11, the second optical waveguide 21, and the third optical waveguide 3 are optically connected to each other. For example, the thickness may be within about 1 micron.

  However, the present invention is not limited to this. For example, as shown in FIGS. 2 and 3, the first core layer 12 and the third core layer 31 overlap each other (that is, the first optical waveguide 11 and the first optical waveguide 11 In the connection portion of the three optical waveguides 3), the first core layer 12 and the third core layer 31 are in contact with each other, and the second core layer 22 and the third core layer 31 overlap each other (that is, the first core layer 31). The second core layer 22 and the third core layer 31 may be in contact with each other at the connection portion between the second optical waveguide 21 and the third optical waveguide 3.

  For example, as shown in FIG. 2, the first cladding layer 13 and the second cladding layer 23 are partially removed at the connection portion between the optical waveguides so as to be in direct contact with the first core layer 12 and the second core layer 22. The third core layer 31 may be provided on the substrate, and the third cladding layer 32 may be provided so as to cover them. By thus connecting the core layers directly, the optical connection efficiency between the optical waveguides is improved, and highly efficient optical connection is possible with a short connection distance. Here, the third cladding layer 32 may be made of a material having a refractive index lower than that of the first core layer 12, the second core layer 22, and the third core layer 31.

  Further, for example, as shown in FIG. 3, the first cladding layer 13 that covers the upper side of the first core layer 12 and the second cladding layer 23 that covers the upper side of the second core layer 22 are not provided. Using the exposed core layer 22, the third core layer 31 is provided so as to be in direct contact with the first core layer 12 and the second core layer 22, and the third cladding layer 32 is provided so as to cover them. May be. In this case, the third clad layer 32 functions as a clad layer common to the first core layer 12, the second core layer 22, and the third core layer 31.

By thus connecting the core layers directly, the optical connection efficiency between the optical waveguides is improved, and highly efficient optical connection is possible with a short connection distance. Here, the third cladding layer 32 may be made of a material having a refractive index lower than that of the first core layer 12, the second core layer 22, and the third core layer 31.
Further, for example, as shown in FIG. 4, in a portion where the first core layer 12 and the third core layer 31 overlap, at least one of the first core layer 12 and the third core layer 31 has a cross-sectional area. It is good also as what has the 1st taper part 5 from which changes. That is, at the connection portion between the first optical waveguide 11 and the third optical waveguide 3, either or both of the first optical waveguide 11 and the third optical waveguide 3 have a taper structure 5 whose cross-sectional area gradually changes. It may be. FIG. 4 illustrates a case where the end portion of the first core layer 12 has a tapered structure 5.

  Similarly, in the portion where the second core layer 22 and the third core layer 31 overlap, at least one of the second core layer 22 and the third core layer 31 has a second taper portion 6 whose cross-sectional area changes. It is good also as a thing provided. That is, at the connection portion between the second optical waveguide 21 and the third optical waveguide 3, one or both of the second optical waveguide 21 and the third optical waveguide 3 has a tapered structure 6 whose cross-sectional area gradually changes. It may be. FIG. 4 illustrates the case where the end portion of the third core 31 has a tapered structure 6.

  Further, for example, as shown in FIG. 5, at an optical connection portion between the first core layer 12 and the third core layer 31, at least one of the first core layer 12 and the third core layer 31 is provided in parallel. It may be composed of a plurality of core layers. That is, either or both of the first optical waveguide 11 and the third optical waveguide 3 may have a plurality of linear structures at the connection portion between the first optical waveguide 11 and the third optical waveguide 3. . FIG. 5 illustrates the case where the first core layer 12 is composed of a plurality of core layers (a plurality of linear structures) at the connection location with the third core layer 31.

  In this case, since the first optical waveguide 11 is provided in the optical waveguide device 1, a plurality of linear structures are created in the optical waveguide device 1 in advance. In addition, when the first optical waveguide 11 includes a plurality of first core layers 12, each first core layer 12 is connected to the third optical waveguide 3 (third core layer 31) at each connection point. A plurality of linear structures will be provided.

Also in this case, the cross-sectional area of one or both of the first optical waveguide 11 and the third optical waveguide 3 is gradually increased at the connection portion between the first optical waveguide 11 and the third optical waveguide 3. The taper structure 5 may be changed.
Similarly, at the optical connection portion between the second core layer 22 and the third core layer 31, at least one of the second core layer 22 and the third core layer 31 is composed of a plurality of core layers provided in parallel. It is also good. That is, either or both of the second optical waveguide 21 and the third optical waveguide 3 may have a plurality of linear structures at the connection portion between the second optical waveguide 21 and the third optical waveguide 3. . FIG. 5 illustrates the case where the third core layer 31 is composed of a plurality of core layers (a plurality of linear structures) at the connection location with the second core layer 22.

In this case, when the third optical waveguide 3 includes a plurality of third core layers 31, each third core layer 31 is connected to the second optical waveguide 21 (second core layer 22). A plurality of linear structures are provided.
Also in this case, the cross-sectional area of the optical waveguide of either or both of the second optical waveguide 21 and the third optical waveguide 3 is gradually increased at the connection portion of the second optical waveguide 21 and the third optical waveguide 3. The taper structure 6 may be changed.

For example, as shown in FIG. 6, the optical waveguide device 1 and the optical waveguide substrate 2 may include bumps (bump structures) 7 and 8 for connecting to electronic circuit components on the terminals 14 and 24, respectively. good.
By making electronic circuit components and optical waveguide devices directly connectable by bumps, the load on electronic circuit components is reduced and the speed is higher than when electronic circuit components and optical waveguide devices are electrically connected via an optical waveguide substrate. It can be expected to improve performance and power saving.

Next, the manufacturing method of the optical connection module of this embodiment is demonstrated, referring FIG. 7, FIG.
First, as shown in FIGS. 7A and 7B, the optical waveguide device 1 including the first circuit region 15 including the first optical waveguide 11 and the terminal 14, the second optical waveguide 21 and the terminal 24 are provided. An optical waveguide substrate 2 including a second circuit region 25 including the opening 26 (here, a through hole) for mounting the optical waveguide device 1 is prepared.

Next, as shown in FIG. 7C, the optical waveguide device 1 and the optical waveguide substrate 2 are mounted on the support substrate 9.
Here, the optical waveguide substrate 2 is supported with the surface (second circuit surface) 25X of the second circuit region 25 of the optical waveguide substrate 2 facing downward, that is, with the second circuit surface 25X in contact with the support substrate 9. Mounted on the substrate 9.

In addition, the optical waveguide device 1 is inserted into the opening 26 of the optical waveguide substrate 2 with the surface (first circuit surface) 15X of the first circuit region 15 of the optical waveguide device 1 facing downward, and the first circuit surface 15X supports The optical waveguide device 1 is mounted on the support substrate 9 so as to be in contact with the substrate 9.
In this way, the optical waveguide device 1 is mounted in the opening 26 of the optical waveguide substrate 2 so that the first circuit region 15 and the second circuit region 25 are on the same side.

Next, as shown in FIG. 7D, a resin (for example, a transparent resin) 4 is filled in the gaps of the openings 26 of the optical waveguide substrate 2 on which the optical waveguide device 1 is mounted, and then solidified, and then FIG. As shown in E), the support substrate 9 is removed.
In this way, the optical waveguide device 1 and the optical waveguide substrate 2 are integrated by the resin 4 filled in the opening 26 of the optical waveguide substrate 2.

Next, as shown in FIGS. 8A to 8C and FIG. 8H, the first optical waveguide 11 and the second optical waveguide are formed on the integrated optical waveguide device 1 and the optical waveguide substrate 2. The third optical waveguide 3 is provided so that the waveguide 21 is optically connected.
8A to 8C, the first optical waveguide 11 and the second optical waveguide 21 are not shown, and the third cladding layer 32 is not shown in FIG. 8H. The details of these connection states are as shown in FIGS.

For example, when mounting the silicon photonics device 1 including the silicon fine wire waveguide (first optical waveguide) 11 in the opening 26 of the optical waveguide substrate 2 including the polymer waveguide (second optical waveguide) 21 on the resin substrate, A polymer waveguide may be provided as the third optical waveguide 3.
Further, for example, the core layer (first core layer) 12 constituting the first optical waveguide 11 and the core layer (second core layer) 22 constituting the second optical waveguide 21 are partially overlapped. After patterning the core layer (third core layer) 31 as shown in FIG. 8 (A), FIG. 8 (B), and FIG. 8 (H), as shown in FIG. The third optical waveguide 3 having a laminated structure in which the third core layer 31 and the third cladding layer 32 are laminated on the integrated optical waveguide device 1 and the optical waveguide substrate 2 is provided by covering with the clad layer 32. Just do it.

Here, the patterning of the core layer (third core layer) 31 may be performed as follows.
For example, as shown in FIG. 8A, a waveguide layer 31X is formed on the entire surface of the integrated optical waveguide device 1 and optical waveguide substrate 2, and a photoresist (not shown) is formed on the waveguide layer 31X. 8B, a waveguide pattern is formed on the photoresist by a direct exposure type exposure machine (for example, a laser direct drawing exposure machine) or photolithography, and the waveguide layer 31X is etched using the resist as a mask. The patterned core layer 31 may be formed as shown in FIG.

However, the present invention is not limited to this. For example, a photosensitive waveguide layer is formed on the entire surface of the integrated optical waveguide device 1 and optical waveguide substrate 2, and direct drawing exposure is directly performed on the waveguide layer. A waveguide pattern may be formed by a machine (for example, a laser direct drawing exposure machine) or photolithography, and the patterned core layer 31 may be formed.
Here, the formation accuracy of the third optical waveguide 3 (third core layer 31) is, for example, the first optical waveguide 11 (first core layer 12) and the second optical waveguide 21 (second core) with a direct-drawing type exposure machine. Patterning may be performed so as to match the layer 22), taper structures 5 and 6 (see, for example, FIG. 4) are provided at the connection portions between the optical waveguides, or a plurality of linear structures are provided at the connection portions of the optical waveguides. The positional accuracy may be relaxed by using a structure provided in parallel (see, for example, FIG. 5).

For example, when the third optical waveguide 3 (third core layer 31) is formed by a direct drawing type exposure machine, the mounting accuracy on the first support substrate 9 may be about 10 microns, and the third optical waveguide 3 ( The pattern of the third core layer 31) may be drawn according to each of the first optical waveguide 11 (first core layer 12) and the second optical waveguide 21 (second core layer 22).
Moreover, the tolerance of optical connection can be improved by providing the taper structures 5 and 6 (for example, refer FIG. 4) in the connection part of optical waveguides. Further, when the positional accuracy is relaxed by the taper structures 5 and 6 (for example, see FIG. 4), the initial mounting accuracy on the support substrate 9 is in accordance with the electric field distribution that can be expanded by the taper structures 5 and 6 (for example, see FIG. 4). It can be mitigated.

Moreover, the alignment tolerance between the optical waveguides can be relaxed to several tens of microns by using a waveguide structure (for example, see FIG. 5) in which a plurality of linear structures are provided in parallel.
For example, as shown in FIG. 6, bumps 7 and 8 for connecting to electronic circuit components may be formed on the terminals 14 and 24 provided on the optical waveguide device 1 and the optical waveguide substrate 2.
In this case, after forming the third cladding layer 32 constituting the third optical waveguide 3, the third cladding layer 32 is patterned to form at least bumps, as shown in FIGS. 8D and 8E, for example. The third cladding layer 32 formed at the predetermined location is removed, and bumps 7 and 8 may be provided on the terminals 14 and 24 as shown in FIGS. 8F and 8G, for example.

At this time, for example, as shown in FIG. 8D, the third clad layer 32 formed in unnecessary portions (including bump formation planned portions) other than the portion covering the third core layer 31 is removed. Alternatively, for example, as shown in FIG. 8E, only the third cladding layer 32 formed at the bump formation scheduled location may be removed.
The third core layer 31 and the third clad layer 32 may be provided on the first clad layer 13 covering the first core layer 12 and the second clad layer 23 covering the second core layer 22 (FIG. 1 ( B)). In addition, the first cladding layer 13 and the second cladding layer 23 are partially removed at the connection portion between the optical waveguides, and the third core layer is in direct contact with the first core layer 12 and the second core layer 22. 31 may be provided, and a third cladding layer 32 may be provided so as to cover them (see FIG. 2). Further, the first cladding layer 13 covering the upper side of the first core layer 12 and the second cladding layer 22 covering the upper side of the second core layer 22 are not provided, and the first core layer 12 and the second core layer 22 are exposed. The third core layer 31 may be provided so as to be in direct contact with the first core layer 12 and the second core layer 22, and the third cladding layer 32 may be provided so as to cover them (see FIG. 3).

In this manner, the optical connection module 10 of the present embodiment (see, for example, FIG. 1A and FIG. 8H) can be manufactured.
Note that the optical connection module 10 according to the present embodiment is not limited to the above-described materials and structures, and may be modified as appropriate, and in that case, the same effect can be obtained.
For example, as shown in FIG. 9, when the optical fiber 50 is connected to the optical connection module 10 configured as described above via the fiber connector 51, the first optical waveguide 11 and the second optical waveguide are used. The mode sizes (spot sizes) of the waveguide 21 and the third optical waveguide 3 are preferably larger in the order of the first optical waveguide 11, the third optical waveguide 3, and the second optical waveguide 21 (for example, FIGS. 1 to 5). reference). Here, in order to make the mode sizes different, the refractive indexes may be different or the core sizes may be different.

  Thus, the relationship between the spot sizes of the first optical waveguide 11, the second optical waveguide 21, and the third optical waveguide 3 is such that the first optical waveguide 11 <the third optical waveguide 3 <the second optical waveguide 21. Can gradually increase the spot size. For example, the spot size can be easily expanded from a silicon wire waveguide to a spot size of a single mode fiber (standard single mode fiber).

  Here, the case where a single mode fiber as an optical fiber is connected and used is described as an example. However, the present invention is not limited to this. For example, a polymer waveguide compatible with a single mode fiber is used. It may be connected to a sheet and used by connecting to a single mode fiber (optical fiber) through this polymer waveguide sheet. In this case, it is sufficient if the spot size can be expanded to the spot size of the polymer waveguide sheet.

  Further, in the optical connection module 10 of the above-described embodiment, the opening 26 of the optical waveguide substrate 2 is a through hole. However, the present invention is not limited to this, and a hole (groove) that does not penetrate may be used. This has an advantage that a region for providing wiring on the back side of the optical waveguide substrate 2 is widened. In this case, it is preferable that a filling hole is provided at the bottom of the groove in order to fill the groove as the opening 26 with the resin 4 without a gap.

In the above-described embodiment, the first optical waveguide 11, the second optical waveguide 21, and the third optical waveguide 3 are each described as an example in which one optical waveguide is provided. It is not limited, and at least one optical waveguide may be provided.
In the above-described embodiment, the case where one optical waveguide device 1 is mounted on the optical waveguide substrate 2 is described as an example. However, the present invention is not limited to this, and at least one optical waveguide device is mounted. Just do it.

In the above-described embodiment, the first optical waveguide 11 of the optical waveguide device 1 and the second optical waveguide 21 of the optical waveguide substrate 2 are optically connected by the third optical waveguide 3. It is not limited.
For example, as shown in FIG. 10, the third optical waveguide 3 (third core layer 31) is optically connected between the optical waveguides of the plurality of optical waveguide devices 1 and 1X mounted on the optical waveguide substrate 2. May be. That is, the first optical waveguide 11 (first core layer 12) of the first optical waveguide device 1 mounted on the optical waveguide substrate 2, the second optical waveguide 11X (second core layer 12X) of the second optical waveguide device 1X, and May be optically connected by the third optical waveguide 3 (third core layer 31). The details of the configuration and manufacturing method of the optical waveguide device and the optical waveguide substrate are the same as those in the above-described embodiment.

Here, the plurality of optical waveguide devices 1 and 1X mounted on the optical waveguide substrate 2 may be silicon photonics devices as in the above-described embodiment, and other quartz-based devices, compound semiconductor devices, and the like. It may be.
As described above, in the above-described embodiment, the second optical waveguide is a polymer waveguide on a resin substrate. However, a silicon fine wire waveguide provided in the optical waveguide device, a waveguide made of a quartz-based material, and a compound A waveguide made of a semiconductor may be used.

  In this case, the optical connection module includes the first optical waveguide device 1 including the first circuit region including the first optical waveguide 11 and a terminal for electrical connection, the second optical waveguide 11X, and electrical connection. A second optical waveguide device 1X having a second circuit region including a plurality of terminals, a first opening for mounting the first optical waveguide device, and a second opening for mounting the second optical waveguide device First optical waveguide device and second optical waveguide device mounted on each of the first opening and the second opening so that the optical waveguide substrate 2 provided and the first circuit region and the second circuit region are on the same side The third optical waveguide 3 is provided on the optical waveguide substrate and optically connects the first optical waveguide and the second optical waveguide.

  The first optical waveguide device 1 and the second optical waveguide device 1X are provided in the first opening and the second opening, respectively, so that the first optical waveguide 11 and the second optical waveguide 11X are at the same level. The first optical waveguide device 1 and the optical waveguide substrate 2, and the second optical waveguide device 1X and the optical waveguide substrate 2 are integrated with the resin filled in the first opening and the second opening, respectively. It should be.

The first optical waveguide device 1, the second optical waveguide device 1X, and the optical waveguide substrate 2 may each include a bump for connecting to an electronic circuit component.
By making electronic circuit components and optical waveguide devices directly connectable by bumps, the load on electronic circuit components is reduced and the speed is higher than when electronic circuit components and optical waveguide devices are electrically connected via an optical waveguide substrate. It can be expected to improve performance and power saving.

  The method of manufacturing the optical connection module configured as described above includes the first optical waveguide device 1 including the first optical waveguide 11 and the first circuit region including the terminals for electrical connection, and the second optical waveguide 11X. And a second optical waveguide device 1X having a second circuit region including a terminal for electrical connection, and a first opening of the optical waveguide substrate 2 having a first opening and a second opening, respectively. The first optical region is mounted in the two openings so that the first circuit region and the second circuit region are on the same side, and the first optical waveguide 11 and the second optical waveguide 11X are optically connected. A step of providing the third optical waveguide 3 on the waveguide device 1, the second optical waveguide device 1X, and the optical waveguide substrate 2 may be included.

In addition, after the first optical waveguide device 1 and the second optical waveguide device 1X are mounted in the first opening and the second opening of the optical waveguide substrate 2, respectively, before the third optical waveguide 3 is provided, the first A step of integrating the first optical waveguide device 1 and the second optical waveguide device 1X and the optical waveguide substrate 2 with a resin filled in each of the opening and the second opening may be included.
In this modification, the other details are the same as those in the above-described embodiment.

By the way, an optical transceiver (optical transceiver) can be configured as including the optical connection module 10 as in the above-described embodiment.
In this case, for example, as shown in FIGS. 11A and 11B, the optical transceiver 41 includes the optical connection module 10 configured as in the above-described embodiment, the optical waveguide device 1, and the optical waveguide substrate. 2, and an electronic circuit component 40 connected to the optical waveguide device 1 and the optical waveguide substrate 2 via bumps (bump structures) 7 and 8.

In this way, by directly connecting the electronic circuit component and the optical waveguide device by the bump, the load on the electronic circuit component becomes smaller than when the electronic circuit component and the optical waveguide device are electrically connected via the optical waveguide substrate. , High speed and power saving can be improved.
The electronic circuit component 40 is a component (chip) including an electronic circuit such as a drive circuit. Further, for example, as shown in FIG. 11A, the optical transceiver 41 is used by being connected to the optical fiber 50 via the fiber connector 51.

  When the optical connection module 10 is configured as in the above-described modification, that is, a first optical waveguide device including a first circuit region including a first optical waveguide and a terminal for electrical connection; A second optical waveguide device having a second circuit region including a second optical waveguide and a terminal for electrical connection; a first opening for mounting the first optical waveguide device; and a second optical waveguide device. An optical waveguide substrate having a second opening for mounting and a terminal for electrical connection, and the first opening and the second opening so that the first circuit region and the second circuit region are on the same side. A first optical waveguide device and a second optical waveguide device mounted on each of the sections, and a third optical waveguide provided on the optical waveguide substrate and optically connecting the first optical waveguide and the second optical waveguide. If so, the optical transceiver An optical connection module configured as described above, a first optical circuit component mounted on the first optical waveguide device and the optical waveguide substrate, and connected to the first optical waveguide device and the optical waveguide substrate via bumps, 2 optical waveguide devices and a second electronic circuit component mounted on the optical waveguide substrate and connected to the second optical waveguide device and the optical waveguide substrate via bumps. In the modification of the present embodiment, the second optical waveguide device may be a passive optical circuit without electrical input. In this case, the second optical waveguide device may not have an electrical connection terminal, and The second electronic circuit component may not be provided.

Therefore, the optical connection module, the manufacturing method thereof, and the optical transceiver according to the present embodiment and the modification can directly bond the electronic circuit component to the optical waveguide device, thereby improving the high speed and power saving. Have.
By the way, the reason why the configuration as in the above-described embodiment and modification is employed is as follows.

In recent years, silicon photonics devices have been actively studied as key devices for realizing optical transceivers for optical interconnects.
High-efficiency input / output of light is the key to realizing products using silicon photonics devices.
In general, silicon photonics devices use a silicon waveguide with a spot size of about 1 micron or less.

In order to input / output light to / from silicon photonics devices, highly efficient optical coupling with other optical waveguide devices or optical fibers is required.
For high-efficiency optical coupling, it is generally necessary to roughly match the spot sizes of the optical waveguides to be coupled, and to align the optical waveguides with an accuracy of about 1/10 of the spot size. is there.

For example, a standard single mode optical fiber has a spot size of about 10 microns, and has an optical input / output structure that has a function of expanding the spot size of the optical waveguide to about 10 microns to match the optical fiber. A spot size converter is used to perform alignment with an accuracy of about 1 micron.
In addition, for joining a silicon photonics device to another optical waveguide device, the spot size is enlarged by using a spot size converter that matches the spot size of each optical waveguide, and about 1/10 of the spot size. Align each other with accuracy of.

Further, when optical connection is made between a single mode optical waveguide device and an optical waveguide substrate, it is necessary to precisely align the output ends of the optical waveguide in order to suppress coupling loss.
For example, when the waveguide mode size of each of the optical waveguide device and the optical waveguide substrate is about 3 μm, a positional accuracy of about 0.5 μm is required for practical use.

For this reason, the alignment in the height direction is controlled by the depth of the device mounting groove provided in the optical waveguide substrate, and the alignment in the horizontal direction is controlled by the mounting accuracy of the mounting apparatus.
However, a mounting device for high-accuracy alignment is required, which increases the cost.
In addition, since the optical waveguide device is mounted with the circuit surface facing downward, the drive circuit cannot be directly joined to the optical waveguide device, and is connected via the substrate, so it is electrically connected with high efficiency. As a result, the load on the drive circuit becomes large, resulting in problems in high speed and power saving.

As described above, the connection structure between the optical waveguide device and the optical waveguide substrate requires high-precision alignment, is expensive, and has problems in high speed and power saving.
Therefore, the configuration as in the above-described embodiment and modification is employed.
As a result, the drive circuit of the optical waveguide device can be directly mounted on the optical waveguide device, which is superior in terms of high speed and power saving, and is optically connected to each other via the third waveguide. In addition, the dependency of the optical loss on the mounting position accuracy is reduced, and the effect of reducing the mounting accuracy can be obtained.

In addition, this invention is not limited to the structure described in embodiment mentioned above, A various deformation | transformation is possible in the range which does not deviate from the meaning of this invention.
Hereinafter, additional notes will be disclosed regarding the above-described embodiment.
(Appendix 1)
An optical waveguide device comprising a first circuit region including a first optical waveguide;
An optical waveguide substrate comprising: a second circuit region including a second optical waveguide; and an opening for mounting the optical waveguide device;
The first optical waveguide and the second optical waveguide are provided on the optical waveguide device and the optical waveguide substrate mounted on the opening so that the first circuit region and the second circuit region are on the same side. An optical connection module comprising: a third optical waveguide that optically connects the waveguide.

(Appendix 2)
A first optical waveguide device comprising a first circuit region including a first optical waveguide;
A second optical waveguide device comprising a second circuit region including the second optical waveguide;
An optical waveguide substrate comprising: a first opening for mounting the first optical waveguide device; and a second opening for mounting the second optical waveguide device;
The first optical waveguide device and the second optical waveguide device mounted in the first opening and the second opening, respectively, so that the first circuit region and the second circuit region are on the same side; An optical connection module comprising: a third optical waveguide provided on the optical waveguide substrate and optically connecting the first optical waveguide and the second optical waveguide.

(Appendix 3)
The optical waveguide device is provided in the opening so that the first optical waveguide and the second optical waveguide are at the same level,
The optical connection module according to appendix 1, wherein the optical waveguide device and the optical waveguide substrate are integrated with a resin filled in the opening.

(Appendix 4)
The first optical waveguide device and the second optical waveguide device are provided in the first opening and the second opening, respectively, so that the first optical waveguide and the second optical waveguide are at the same level. And
The first optical waveguide device and the optical waveguide substrate, and the second optical waveguide device and the optical waveguide substrate are integrated with the resin filled in the first opening and the second opening, respectively. The optical connection module according to Appendix 2, characterized by:

(Appendix 5)
The first optical waveguide, the second optical waveguide, and the third optical waveguide have a mode size that increases in the order of the first optical waveguide, the third optical waveguide, and the second optical waveguide. The optical connection module according to Appendix 1 or 3.
(Appendix 6)
The optical connection module according to any one of appendices 1, 3, and 5, wherein the optical waveguide device and the optical waveguide substrate each include a bump for connecting to an electronic circuit component.

(Appendix 7)
The optical connection module according to appendix 2 or 4, wherein each of the first optical waveguide device and the optical waveguide substrate includes a bump for connecting to an electronic circuit component.
(Appendix 8)
The first optical waveguide includes a first core layer and a first cladding layer covering the first core layer,
The second optical waveguide includes a second core layer and a second cladding layer covering the second core layer,
The third optical waveguide includes a third core layer and a third cladding layer covering the third core layer,
The first core layer and the third core layer partially overlap,
The optical connection module according to any one of appendices 1 to 7, wherein the second core layer and the third core layer partially overlap each other.

(Appendix 9)
In the portion where the first core layer and the third core layer overlap, the first cladding layer is interposed between the first core layer and the third core layer,
The second clad layer is interposed between the second core layer and the third core layer in a portion where the second core layer and the third core layer overlap with each other. The optical connection module according to appendix 8.

(Appendix 10)
In the portion where the first core layer and the third core layer overlap, the first core layer and the third core layer are in contact with each other,
The optical connection according to appendix 8, wherein the second core layer and the third core layer are in contact with each other in a portion where the second core layer and the third core layer overlap. module.

(Appendix 11)
In a portion where the first core layer and the third core layer overlap each other, at least one of the first core layer and the third core layer includes a first taper portion whose cross-sectional area changes. The optical connection module according to any one of appendices 8 to 10, which is characterized by the following.
(Appendix 12)
In a portion where the second core layer and the third core layer are overlapped, at least one of the second core layer and the third core layer includes a second taper portion whose cross-sectional area changes. The optical connection module according to any one of appendices 8 to 11, which is characterized by the following.

(Appendix 13)
In the optical connection portion between the first core layer and the third core layer, at least one of the first core layer and the third core layer is composed of a plurality of core layers provided in parallel. The optical connection module according to any one of appendices 8 to 12.
(Appendix 14)
In the optical connection portion between the second core layer and the third core layer, at least one of the second core layer and the third core layer is composed of a plurality of core layers provided in parallel. The optical connection module according to any one of appendices 8 to 13.

(Appendix 15)
An optical waveguide device comprising a first circuit region including a first optical waveguide and a terminal for electrical connection;
An optical waveguide substrate comprising: a second circuit region including a second optical waveguide and a terminal for electrical connection; and an opening for mounting the optical waveguide device;
The first optical waveguide and the second optical waveguide are provided on the optical waveguide device and the optical waveguide substrate mounted on the opening so that the first circuit region and the second circuit region are on the same side. A third optical waveguide for optically connecting the waveguide;
An optical transceiver, comprising: the optical waveguide device and an electronic circuit component mounted on the optical waveguide substrate and connected to the optical waveguide device and the optical waveguide substrate via bumps.

(Appendix 16)
A first optical waveguide device comprising a first circuit region including a first optical waveguide and a terminal for electrical connection;
A second optical waveguide device comprising a second circuit region including the second optical waveguide;
An optical waveguide substrate comprising: a first opening for mounting the first optical waveguide device; a second opening for mounting the second optical waveguide device; and a terminal for electrical connection;
The first optical waveguide device and the second optical waveguide device mounted in the first opening and the second opening, respectively, so that the first circuit region and the second circuit region are on the same side; A third optical waveguide provided on the optical waveguide substrate and optically connecting the first optical waveguide and the second optical waveguide;
An optical transceiver comprising: a first electronic circuit component mounted on the first optical waveguide device and the optical waveguide substrate, and connected to the first optical waveguide device and the optical waveguide substrate via a bump. vessel.

(Appendix 17)
An optical waveguide device including a first circuit region including a first optical waveguide is connected to the opening of an optical waveguide substrate including a second circuit region including a second optical waveguide and an opening. Mount so that the two circuit areas are on the same side,
A method of manufacturing an optical connection module, comprising: providing a third optical waveguide on the optical waveguide device and the optical waveguide substrate so that the first optical waveguide and the second optical waveguide are optically connected to each other. .

(Appendix 18)
After mounting the optical waveguide device in the opening of the optical waveguide substrate and before providing the third optical waveguide, the optical waveguide device and the optical waveguide substrate are integrated with a resin filled in the opening. 18. The method for manufacturing an optical connection module according to appendix 17, wherein:
(Appendix 19)
A first optical waveguide device including a first circuit region including a first optical waveguide, and a second optical waveguide device including a second circuit region including a second optical waveguide, respectively, are first and second openings. Mounted in the first opening and the second opening of the optical waveguide substrate including the first circuit region and the second circuit region on the same side,
Providing a third optical waveguide on the first optical waveguide device, the second optical waveguide device, and the optical waveguide substrate so that the first optical waveguide and the second optical waveguide are optically connected. A method for manufacturing an optical connection module.

(Appendix 20)
After mounting the first optical waveguide device and the second optical waveguide device in the first opening and the second opening of the optical waveguide substrate, respectively, before providing the third optical waveguide, The light according to appendix 19, wherein the first optical waveguide device, the second optical waveguide device, and the optical waveguide substrate are integrated by a resin filled in each of the first opening and the second opening. A method for manufacturing a connection module.

1 Optical waveguide device (first optical waveguide device)
1X 2nd optical waveguide device 2 Optical waveguide board 3 3rd optical waveguide 4 Resin 5 1st taper part (taper structure)
6 Second taper part (taper structure)
7, 8 Bump (Bump structure)
DESCRIPTION OF SYMBOLS 9 Support substrate 10 Optical connection module 11 1st optical waveguide 11X 2nd optical waveguide 12 1st core layer 12X 2nd core layer 13 1st clad layer 14 Terminal 15 1st circuit area 15X 1st circuit surface 21 2nd optical waveguide 22 Second core layer 23 Second clad layer 24 Terminal 25 Second circuit region 25X Second circuit surface 26 Opening 31 Third core layer 31X Waveguide layer 32 Third clad layer 40 Electronic circuit component 41 Optical transceiver 50 Optical fiber 51 Fiber connector

Claims (18)

An optical waveguide device comprising a first circuit region including a first optical waveguide;
An optical waveguide substrate comprising: a second circuit region including a second optical waveguide; and an opening for mounting the optical waveguide device;
The first optical waveguide and the second optical waveguide are provided on the optical waveguide device and the optical waveguide substrate mounted on the opening so that the first circuit region and the second circuit region are on the same side. An optical connection module comprising: a third optical waveguide that optically connects the waveguide. A first optical waveguide device comprising a first circuit region including a first optical waveguide;
A second optical waveguide device comprising a second circuit region including the second optical waveguide;
An optical waveguide substrate comprising: a first opening for mounting the first optical waveguide device; and a second opening for mounting the second optical waveguide device;
The first optical waveguide device and the second optical waveguide device mounted in the first opening and the second opening, respectively, so that the first circuit region and the second circuit region are on the same side; An optical connection module comprising: a third optical waveguide provided on the optical waveguide substrate and optically connecting the first optical waveguide and the second optical waveguide. The optical waveguide device is provided in the opening so that the first optical waveguide and the second optical waveguide are at the same level,
The optical connection module according to claim 1, wherein the optical waveguide device and the optical waveguide substrate are integrated with a resin filled in the opening. The first optical waveguide device and the second optical waveguide device are provided in the first opening and the second opening, respectively, so that the first optical waveguide and the second optical waveguide are at the same level. And
The first optical waveguide device and the optical waveguide substrate, and the second optical waveguide device and the optical waveguide substrate are integrated with the resin filled in the first opening and the second opening, respectively. The optical connection module according to claim 2, wherein:   The first optical waveguide, the second optical waveguide, and the third optical waveguide have a mode size that increases in the order of the first optical waveguide, the third optical waveguide, and the second optical waveguide. The optical connection module according to claim 1 or 3.   The optical connection module according to claim 1, wherein each of the optical waveguide device and the optical waveguide substrate includes a bump for connecting to an electronic circuit component.   5. The optical connection module according to claim 2, wherein each of the first optical waveguide device and the optical waveguide substrate includes a bump for connecting to an electronic circuit component. The first optical waveguide includes a first core layer and a first cladding layer covering the first core layer,
The second optical waveguide includes a second core layer and a second cladding layer covering the second core layer,
The third optical waveguide includes a third core layer and a third cladding layer covering the third core layer,
The first core layer and the third core layer partially overlap,
The optical connection module according to claim 1, wherein the second core layer and the third core layer partially overlap each other.   In a portion where the first core layer and the third core layer overlap each other, at least one of the first core layer and the third core layer includes a first taper portion whose cross-sectional area changes. The optical connection module according to claim 8, wherein the optical connection module is characterized.   In a portion where the second core layer and the third core layer are overlapped, at least one of the second core layer and the third core layer includes a second taper portion whose cross-sectional area changes. The optical connection module according to claim 8 or 9, characterized in that   In the optical connection portion between the first core layer and the third core layer, at least one of the first core layer and the third core layer is composed of a plurality of core layers provided in parallel. The optical connection module according to any one of claims 8 to 10.   In the optical connection portion between the second core layer and the third core layer, at least one of the second core layer and the third core layer is composed of a plurality of core layers provided in parallel. The optical connection module according to any one of claims 8 to 11. An optical waveguide device comprising a first circuit region including a first optical waveguide and a terminal for electrical connection;
An optical waveguide substrate comprising: a second circuit region including a second optical waveguide and a terminal for electrical connection; and an opening for mounting the optical waveguide device;
The first optical waveguide and the second optical waveguide are provided on the optical waveguide device and the optical waveguide substrate mounted on the opening so that the first circuit region and the second circuit region are on the same side. A third optical waveguide for optically connecting the waveguide;
An optical transceiver, comprising: the optical waveguide device and an electronic circuit component mounted on the optical waveguide substrate and connected to the optical waveguide device and the optical waveguide substrate via bumps. A first optical waveguide device comprising a first circuit region including a first optical waveguide and a terminal for electrical connection;
A second optical waveguide device comprising a second circuit region including the second optical waveguide;
An optical waveguide substrate comprising: a first opening for mounting the first optical waveguide device; a second opening for mounting the second optical waveguide device; and a terminal for electrical connection;
The first optical waveguide device and the second optical waveguide device mounted in the first opening and the second opening, respectively, so that the first circuit region and the second circuit region are on the same side; A third optical waveguide provided on the optical waveguide substrate and optically connecting the first optical waveguide and the second optical waveguide;
An optical transceiver comprising: a first electronic circuit component mounted on the first optical waveguide device and the optical waveguide substrate, and connected to the first optical waveguide device and the optical waveguide substrate via a bump. vessel. An optical waveguide device including a first circuit region including a first optical waveguide is connected to the opening of an optical waveguide substrate including a second circuit region including a second optical waveguide and an opening. Mount so that the two circuit areas are on the same side,
A method of manufacturing an optical connection module, comprising: providing a third optical waveguide on the optical waveguide device and the optical waveguide substrate so that the first optical waveguide and the second optical waveguide are optically connected to each other. .   After mounting the optical waveguide device in the opening of the optical waveguide substrate and before providing the third optical waveguide, the optical waveguide device and the optical waveguide substrate are integrated with a resin filled in the opening. The method for manufacturing an optical connection module according to claim 15, wherein: A first optical waveguide device including a first circuit region including a first optical waveguide, and a second optical waveguide device including a second circuit region including a second optical waveguide, respectively, are first and second openings. Mounted in the first opening and the second opening of the optical waveguide substrate including the first circuit region and the second circuit region on the same side,
Providing a third optical waveguide on the first optical waveguide device, the second optical waveguide device, and the optical waveguide substrate so that the first optical waveguide and the second optical waveguide are optically connected. A method for manufacturing an optical connection module.   After mounting the first optical waveguide device and the second optical waveguide device in the first opening and the second opening of the optical waveguide substrate, respectively, before providing the third optical waveguide, 18. The first optical waveguide device, the second optical waveguide device, and the optical waveguide substrate are integrated by a resin filled in each of the first opening and the second opening. Manufacturing method of optical connection module.

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