JP2004069824A - Optical wiring board - Google Patents

Optical wiring board Download PDF

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Publication number
JP2004069824A
JP2004069824A JP2002226060A JP2002226060A JP2004069824A JP 2004069824 A JP2004069824 A JP 2004069824A JP 2002226060 A JP2002226060 A JP 2002226060A JP 2002226060 A JP2002226060 A JP 2002226060A JP 2004069824 A JP2004069824 A JP 2004069824A
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Japan
Prior art keywords
optical wiring
light emitting
optical
receiving element
substrate
Prior art date
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Pending
Application number
JP2002226060A
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Japanese (ja)
Inventor
Koichi Kumai
熊井　晃一
Taketo Tsukamoto
塚本　健人
Mamoru Ishizaki
石崎　守
Atsushi Sasaki
佐々木　淳
Hatsune Hara
原　初音
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Toppan Inc
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Toppan Printing Co Ltd
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Priority to JP2002226060A priority Critical patent/JP2004069824A/en
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  • Optical Couplings Of Light Guides (AREA)
  • Optical Integrated Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide an optical wiring board having highly fine optical wiring on a supporting board in which the reference surface of a portion for installing an optical wiring layer and the reference surface of a portion for installing a photodetector and/or a light emitting device have different heights on the supporting board, and also having improved latitude of design on which a 90° optical path conversion structure can be formed in an arbitrary portion. <P>SOLUTION: The optical wiring board is provided with the optical wiring layer, the photodetector and/or the light emitting device on the supporting board in which the height of the board in a portion for installing the optical wiring layer and that for installing the photodetector and/or the light emitting device are different. The optical wiring layer comprises at least an optical wiring film and an adhesive layer. Moreover, the portion for installing the optical wiring layer on the supporting board has a shape capable accepting insertion of the optical wiring film. The portion for installing the photodetector and/or the light emitting device on the supporting board has a shape capable of accepting insertion of the above devices. <P>COPYRIGHT: (C)2004,JPO

Description

【０００１】
【発明の属する技術分野】
本発明は、光配線層と受光素子及び／又は発光素子を設置した光配線基板に関する。
【０００２】
【従来の技術】
現在、プリント基板上の銅による電気配線の一部を光ファイバー又は光導波路による光配線に置き換え、電気信号の代わりに光信号を利用する光配線基板の開発が行われている。
【０００３】
このような光配線基板１０としては、光配線層を設置する部分と受光素子及び／又は発光素子を設置する部分の高さが同じである支持基板１１上に光配線層２０と受光素子及び／又は発光素子１２を積重ね、光配線層と発光／受光素子をミラー等による９０°光路変換構造により、光学的に結合し、前記素子をバンプ１３で電気配線（図示せず）に電気的に結合する構造が用いられている（図１参照）。
【０００４】
この場合、光配線層の厚さが大きい場合に、発光／受光素子と支持基板を電気的に接続するバンプが大きくなるという問題がある。そこで、図２のように支持基板上の光配線層を設置する部分ａと受光素子及び／又は発光素子を設置する部分ｂの基準となる面の高さを異ならせ、結果として、支持基板と発光／受光素子を近接させ、バンプを小さくする構造が提案されている（例えば、特開２００１−１４１９６５号公報参照）。
【０００５】
しかしながら、前記のような支持基板上に光配線層を積層する場合、従来の液体状の光配線層形成材料をスピンコート法により塗布、硬化を繰り返す、いわゆるビルドアップ法では膜厚の制御や設置部分の形状への追従が困難であり、高精細な光配線が作成できない問題がある。
【０００６】
また、従来のビルドアップ法では、任意の場所に９０°光路変換構造を作成することが困難であり、設計の自由度が少ない問題がある。
【０００７】
【発明が解決しようとする課題】
本発明は係る従来技術の欠点に鑑みてなされたもので、支持基板上の光配線層を設置する部分と受光素子及び／又は発光素子を設置する部分の基準となる面の高さが異なる支持基板上に高精細な光配線を有する光配線基板を提供することを目的とする。また、任意の場所に９０°光路変換構造を作成可能とし、設計自由度を向上させた光配線基板を提供することを目的とする。
【０００８】
【課題を解決するための手段】
本発明において上記の課題を達成するために、まず請求項１の発明では、光配線層を設置する部分と受光素子及び／又は発光素子を設置する部分の面の高さが異なる支持基板上に、光配線層と受光素子及び／又は発光素子を設置した光配線基板において、該光配線層が少なくとも光配線フィルム及び接着剤層からなることを特徴とする光配線基板である。
請求項２の発明では、前記支持基板上の光配線層を設置する部分の形状が、光配線フィルムを嵌入可能な形状であることを特徴とする請求項１記載の光配線基板である。
請求項３の発明では、前記支持基板上の受光素子及び／又は発光素子を設置する部分の形状が、該素子を嵌入可能な形状であることを特徴とする請求項１又は２のいずれかに記載の光配線基板である。
【０００９】
【発明の実施の形態】
本発明の光配線基板において、その断面図を図３乃至図７に示す。その斜視図を図８乃至図９に示す。
【００１０】
本発明に係る光配線基板は、光配線層を設置する部分と受光素子及び／又は発光素子を設置する部分の基準となる面の高さが異なる支持基板１１上に、受光素子及び／又は発光素子１２と、接着剤層２２と光配線フィルム２１を積層した光配線層２０を設置した構造をとる。
【００１１】
支持基板１１はシリコン基板、ガラス基板、エポキシ基板、ポリイミド基板を用いることができるが、これに限定されることはない。また、支持基板１１に一般的な電気配線基板を使用することも可能である。また、光配線層を設置する部分と受光素子及び／又は発光素子を設置する部分の面の高さが異なる形状の作成は、前記基板をエッチングすることにより、又は、前記基板に樹脂等をビルトアップすることにより行なう。ここで、支持基板上の光配線層を設置する部分の形状と、受光素子及び／又は発光素子を設置する部分の形状は特に限定されるものではないが、位置合わせの容易性及び外部からの光の入射を防止するため、それぞれ光配線フィルム、該素子を嵌入可能な形状であることが好ましい。なお、面の高さとは、その部分の切断面の一番低い平面の高さを言う。
【００１２】
発光素子もしくは受光素子１２はフリップチップであることが望ましいが、これに限定されるものではない。、前記素子をバンプ１３で電気配線に電気的に結合する。
【００１３】
光配線フィルム２１には、エポキシ系、ポリイミド系、アクリル系、シリコーン系の材料が使用できるが、これに限定されるものではない。また、光配線フィルムの形態としては、光ファイバ、コアの無い光導波路、コアを有する光導波路を使用できるが、これに限定されるものではない。
【００１４】
更に、光配線フィルムの支持基板への設置法としては、図３に記載のように、光配線層を設置する部分（図３中ａ参照）が受光素子及び／又は発光素子を設置する部分の面の高さが低い場合（図３中ｂ参照）と、図４〜図５に記載のように、光配線層を設置する部分（図４中ａ参照）が受光素子及び／又は発光素子を設置する部分（図４中ｂ参照）の面の高さより高い場合がある。後者の場合は、光配線フィルムが素子上まで延伸された形状（図４中ｃ参照）となり、また、上部から、任意の場所に９０°光路変換構造を作成可能となるため、設計自由度が向上する。
【００１５】
接着剤層２２には、一般に用いられているエポキシ系、アクリル系、ウレタン系、ポリイミド系の接着剤を用いることができるが、これに限定される事はない。ただし、接着剤層２２中を光信号が透過する場合、屈折率を制御した光学接着剤を用いることが望ましい。
【００１６】
接着剤層２２には、紫外線硬化型もしくは熱硬化型の接着剤を用いることが出きるが、これに限定されることはない。
【００１７】
また、接着剤層２２に高い断熱特性を有する材料を用いることで、基板１１と光配線フィルム２１の熱伝導を遮断することができる。ガラスウール、珪素土、石綿、コルク等を混合した樹脂および発泡性樹脂を用いることができるが、これに限定されるものではない。また、接着剤中に中空フィラーなどの添加剤を混入することにより断熱特性を向上させることもできる。
【００１８】
更に、接着剤層２２の体積を増やすことで、図５及び図６記載のように、光配線フィルムと面発光／受光素子を該接着剤層で固定することができる。この場合、９０°光路変換構造は金属ミラーを用いることが望ましいが、これに限定されるものではない。
【００１９】
接着剤層２２は、まず、接着剤を支持基板に塗工後、光配線フィルム２１を支持基板に接着しても、光配線フィルム２１に接着剤を塗工後、支持基板に接着してもよい。また、基板１１もしくは光配線フィルム２１上の一部に塗工しても全面に塗工してもよい。
【００２０】
また、同様の工程を繰り返すことにより、２層以上の光配線フィルムを積層する事ができる。基板上の同一の場所に複数の光配線フィルムを積層してもよいし、基板上の異なった場所に複数の光配線フィルムを積層しても良い。
【００２１】
支持基板１１の光配線層を設置する部分ａと受光素子及び／又は発光素子を設置する部分ｂの面を、図７及び図８のように、光配線フィルム２１もしくは発光素子もしくは受光素子１２を勘入可能な形状とすることで、突き当て効果により、各部材の位置精度を向上させることが可能となる。また、接着剤の流動エリアを制限することができるので、実装面積を最適化し、高密度集積を実現できる利点がある。また、使用する接着剤の量を最小限とすることができる。
【００２２】
ここで、支持基板の光配線層を設置する部分と受光素子及び／又は発光素子を設置する部分の面を、光配線フィルムもしくは発光素子もしくは受光素子を嵌入可能な形状とする場合について説明補足する。まず、突き当て効果を利用する部分以外については光配線フィルム積層および発光素子および受光素子実装のため形状寸法に若干の余裕を持たせることが望ましい。また、９０°光路変換構造を有する場合には、その部分で光配線フィルムと発光素子もしくは受光素子を重ねることになり、ひさし状となってはみ出す場合が有る。さらには、光配線フィルムは基板外に延長された形状になっていてもよい。基板外に延長された部分については、任意の形状が可能である。このような僅かな寸法の違いを有する場合であっても、光配線フィルムと支持基板の重なりと支持基板の光配線層を設置する部分と受光素子及び／又は発光素子を設置する部分が同じ形状であれば良い。
【００２３】
【実施例】
以下に本発明を実施例をもって説明するが、本発明がそれらに限定解釈されるものではない。また、以下の記載では、光配線フィルムの積層数を１層として説明するが、必ずしも１層である必要はない。また、光配線フィルムの積層箇所を１ヶ所とするが、必ずしも１ヶ所である必要はない。また、以下の記載では光配線をマルチモードとして説明するが、必ずしもマルチモードである必要はない。
【００２４】
＜実施例１＞
まず、主材としてエピコート８２８（油化シェルエポキシ（株））を、硬化材としてはトリエチレンテトラミン（ＴＥＴＡ）（和光純薬工業（株））を使用し、それらを重量比１０：１で混合することで接着剤を調製した。
【００２５】
図９（ａ）に示すように、光配線層を設置する部分が受光素子及び／又は発光素子を設置する部分の面の高さより、１５０μｍ低い支持基板１１上に、接着剤２３をディスペンサーで滴下した。
【００２６】
図９（ｂ）に示すように、接着剤層２２上に、光配線フィルム２１を積層した。この時、接着剤層２２の膜厚は５μｍとなった。基板１１全体を１００℃、１時間加熱し、接着剤層２２を硬化させた。
【００２７】
図９（ｃ）に示すように、基板１１上に発光／受光素子１２を実装し、光配線フィルム２１との光接続を確認した。
【００２８】
＜実施例２＞
実施例１と同様の工程により、接着剤を調製した。
【００２９】
図１０（ａ）に示すように、基板１１上に発光／受光素子１２を実装した。
【００３０】
図１０（ｂ）に示すように、光配線層を設置する部分が受光素子及び／又は発光素子を設置する部分の面の高さより、１５０μｍ高い支持基板１１上に、接着剤２３をディスペンサーで滴下した。
【００３１】
図１０（ｃ）に示すように、接着剤層２２上に、光配線フィルム２１を積層した。この時、接着剤層２２の膜厚は５μｍとなった。
【００３２】
基板１１全体を１００℃、１時間加熱し、接着剤層２２を硬化させた。発光／受光素子１２と光配線フィルム２１との光接続を確認した。
【００３３】
＜実施例３＞
実施例１と同様の工程により、接着剤を調製した。
【００３４】
図１１（ａ）に示すように、基板１１上に発光／受光素子１２を実装した。
【００３５】
図１１（ｂ）に示すように、光配線層を設置する部分が受光素子及び／又は発光素子を設置する部分の面の高さが、１５０μｍ高い支持基板１１上に、接着剤２３をディスペンサーで滴下した。
【００３６】
図１１（ｃ）に示すように、接着剤層２２上に、光配線フィルム２１を積層した。この時、接着剤層２２の膜厚は５μｍとなった。
【００３７】
基板１１全体を１００℃、１時間加熱し、接着剤層２２を硬化させた。発光／受光素子１２と光配線フィルム２１との光接続を確認した。
【００３８】
＜実施例４＞
実施例１と同様の工程により、接着剤を調製した。図１２（ａ）に示すように、基板１１上に発光／受光素子１２を実装した。
【００３９】
図１２（ｂ）に示すように、光配線層を設置する部分が受光素子及び／又は発光素子を設置する部分の面の高さが、１５０μｍ高い支持基板１１上に、接着剤２３をディスペンサーで滴下した。
【００４０】
図１２（ｃ）に示すように、接着剤層２２上に、光配線フィルム２１を積層した。この時、接着剤層２２の膜厚は５μｍとなった。
【００４１】
基板１１全体を１００℃、１時間加熱し、接着剤層２２を硬化させた。発光／受光素子１２と光配線フィルム２１との光接続を確認した。
【００４２】
【発明の効果】
本発明は、次のような効果がある。
第１に、支持基板上の光配線層を設置する部分と受光素子及び／又は発光素子を設置する部分の基準となる面の高さが異なる支持基板上に高精細な光配線を有する光配線基板を提供することが可能となる。これにより、光配線フィルムの光特性が向上し、支持基板の選択範囲が広がることとなる。
【００４３】
第２に、あらかじめ任意の形状の光配線フィルムを作成し、これを積層することで、また、光配線フィルムを積層後、任意形状に加工することにより、任意の箇所に９０°光路変換構造を作成可能となる。これにより、光配線基板の設計自由度が大きくなる。
【００４４】
【図面の簡単な説明】
【図１】従来技術の光配線基板における垂直方向に切断する断面図。
【図２】従来技術の光配線基板における垂直方向に切断する断面図。
【図３】本発明の光配線基板の説明図。
【図４】本発明の光配線基板の説明図。
【図５】本発明の光配線基板の説明図。
【図６】本発明の光配線基板の説明図。
【図７】本発明の光配線基板の説明図。
【図８】本発明の光配線基板の説明図。
【図９】実施例１に係る光配線基板の製造方法の説明図。
【図１０】実施例２に係る光配線基板の製造方法の説明図。
【図１１】実施例３に係る光配線基板の製造方法の説明図。
【図１２】実施例４に係る光配線基板の製造方法の説明図。
【符号の説明】
１０　光配線基板
１１　支持基板
１２　発光素子又は受光素子
２０　光配線層
２１　光配線フィルム
２２　接着剤層
２３　接着剤[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to an optical wiring board provided with an optical wiring layer and a light receiving element and / or a light emitting element.
[0002]
[Prior art]
At present, an optical wiring board is being developed in which a part of the electrical wiring made of copper on a printed circuit board is replaced with an optical wiring made of an optical fiber or an optical waveguide, and an optical signal is used instead of an electrical signal.
[0003]
As such an optical wiring board 10, the optical wiring layer 20, the light receiving element and / or the light receiving element and / or the light receiving element and / or the light emitting element are installed on the support substrate 11 having the same height. Alternatively, the light emitting element 12 is stacked, the optical wiring layer and the light emitting / receiving element are optically coupled by a 90 ° optical path conversion structure using a mirror or the like, and the element is electrically coupled to electric wiring (not shown) by the bump 13. (See FIG. 1).
[0004]
In this case, when the thickness of the optical wiring layer is large, there is a problem that a bump for electrically connecting the light emitting / receiving element and the support substrate becomes large. Therefore, as shown in FIG. 2, the height of the reference surface of the portion a on which the optical wiring layer is provided on the supporting substrate and the portion b on which the light receiving element and / or the light emitting element are provided are different from each other. There has been proposed a structure in which light-emitting / light-receiving elements are brought close to each other to reduce the size of a bump (see, for example, JP-A-2001-141965).
[0005]
However, when the optical wiring layer is laminated on the support substrate as described above, the conventional liquid optical layer forming material is repeatedly applied and cured by a spin coating method. There is a problem that it is difficult to follow the shape of the portion, and it is not possible to create a high-definition optical wiring.
[0006]
Further, with the conventional build-up method, it is difficult to create a 90 ° optical path conversion structure at an arbitrary place, and there is a problem that the degree of freedom in design is small.
[0007]
[Problems to be solved by the invention]
The present invention has been made in view of the above-mentioned drawbacks of the related art, and has a difference in height of a reference surface between a portion on which an optical wiring layer is provided and a portion on which a light receiving element and / or a light emitting element are provided on a support substrate. It is an object of the present invention to provide an optical wiring substrate having a high-definition optical wiring on a substrate. It is another object of the present invention to provide an optical wiring board in which a 90 ° optical path conversion structure can be created at an arbitrary place and the degree of freedom in design is improved.
[0008]
[Means for Solving the Problems]
In order to achieve the above object in the present invention, first, according to the first aspect of the present invention, a portion on which an optical wiring layer is provided and a portion on which a light receiving element and / or a light emitting element are provided have different surface heights on a supporting substrate. An optical wiring board provided with an optical wiring layer, a light receiving element and / or a light emitting element, wherein the optical wiring layer comprises at least an optical wiring film and an adhesive layer.
According to the second aspect of the present invention, there is provided the optical wiring board according to the first aspect, wherein a portion of the supporting substrate on which the optical wiring layer is provided has a shape into which an optical wiring film can be fitted.
In the invention of claim 3, the shape of a portion on the support substrate where the light receiving element and / or the light emitting element is installed is a shape into which the element can be fitted. It is an optical wiring board as described.
[0009]
BEST MODE FOR CARRYING OUT THE INVENTION
FIGS. 3 to 7 are sectional views of the optical wiring board of the present invention. 8 and 9 show perspective views thereof.
[0010]
The optical wiring board according to the present invention includes a light receiving element and / or a light emitting element on a support substrate 11 having a different height as a reference surface between a part where an optical wiring layer is installed and a part where a light receiving element and / or a light emitting element is installed. A structure in which the element 12 and the optical wiring layer 20 in which the adhesive layer 22 and the optical wiring film 21 are laminated is provided.
[0011]
The support substrate 11 can be a silicon substrate, a glass substrate, an epoxy substrate, or a polyimide substrate, but is not limited thereto. It is also possible to use a general electric wiring board for the support substrate 11. In addition, the formation of a shape in which the height of the surface where the optical wiring layer is provided and the surface where the light receiving element and / or the light emitting element are installed is different is performed by etching the substrate, or by building a resin or the like on the substrate. Perform by raising. Here, the shape of the portion on which the optical wiring layer is provided on the supporting substrate and the shape of the portion on which the light receiving element and / or the light emitting element are provided are not particularly limited. In order to prevent light from entering, it is preferable that each of the optical wiring films and the element has a shape that can be fitted therein. The height of the surface refers to the height of the lowest plane of the cut surface of that portion.
[0012]
The light emitting element or the light receiving element 12 is desirably a flip chip, but is not limited to this. The element is electrically connected to the electric wiring by the bump 13.
[0013]
The optical wiring film 21 can be made of an epoxy-based, polyimide-based, acrylic-based, or silicone-based material, but is not limited thereto. In addition, as a form of the optical wiring film, an optical fiber, an optical waveguide without a core, and an optical waveguide having a core can be used, but are not limited thereto.
[0014]
Further, as shown in FIG. 3, as a method of installing the optical wiring film on the support substrate, a portion where the optical wiring layer is installed (see a in FIG. 3) is a portion where the light receiving element and / or the light emitting element is installed. When the height of the surface is low (see b in FIG. 3), and as shown in FIGS. 4 and 5, the portion where the optical wiring layer is provided (see a in FIG. 4) has a light receiving element and / or a light emitting element. In some cases, the height may be higher than the height of the surface of the portion (see b in FIG. 4). In the latter case, the optical wiring film has a shape extended to the upper side of the element (see c in FIG. 4), and a 90 ° optical path conversion structure can be formed at an arbitrary position from above, so that the degree of design freedom is increased. improves.
[0015]
For the adhesive layer 22, generally used epoxy-based, acrylic-based, urethane-based, and polyimide-based adhesives can be used, but are not limited thereto. However, when an optical signal is transmitted through the adhesive layer 22, it is desirable to use an optical adhesive whose refractive index is controlled.
[0016]
For the adhesive layer 22, an ultraviolet-curable or thermosetting adhesive can be used, but the present invention is not limited to this.
[0017]
Further, by using a material having a high heat insulating property for the adhesive layer 22, heat conduction between the substrate 11 and the optical wiring film 21 can be cut off. A resin and a foamable resin mixed with glass wool, silicon earth, asbestos, cork, and the like can be used, but are not limited thereto. In addition, the heat insulating property can be improved by mixing an additive such as a hollow filler into the adhesive.
[0018]
Further, by increasing the volume of the adhesive layer 22, the optical wiring film and the surface light emitting / receiving element can be fixed by the adhesive layer as shown in FIGS. In this case, it is desirable to use a metal mirror for the 90 ° optical path conversion structure, but it is not limited to this.
[0019]
The adhesive layer 22 may be formed by first applying the adhesive to the support substrate and then bonding the optical wiring film 21 to the support substrate, or applying the adhesive to the optical wiring film 21 and then bonding the optical wiring film 21 to the support substrate. Good. Further, it may be applied to a part of the substrate 11 or the optical wiring film 21 or to the entire surface.
[0020]
Further, by repeating the same steps, two or more optical wiring films can be laminated. A plurality of optical wiring films may be laminated at the same location on the substrate, or a plurality of optical wiring films may be laminated at different locations on the substrate.
[0021]
The surface of the portion a of the support substrate 11 where the optical wiring layer is provided and the portion b where the light receiving element and / or the light emitting element are provided are connected to the optical wiring film 21 or the light emitting element or the light receiving element 12 as shown in FIGS. By adopting a shape that can be inserted, it is possible to improve the positional accuracy of each member due to the butting effect. Further, since the flow area of the adhesive can be limited, there is an advantage that the mounting area can be optimized and high-density integration can be realized. Also, the amount of adhesive used can be minimized.
[0022]
Here, a supplementary explanation will be given for a case where the surface of the portion on which the optical wiring layer is provided and the surface on which the light receiving element and / or the light emitting element are installed have a shape into which the optical wiring film or the light emitting element or the light receiving element can be fitted. . First, it is desirable to give a slight margin to the shape and dimensions of the portions other than the portion utilizing the abutting effect for laminating the optical wiring film and mounting the light emitting element and the light receiving element. In the case where a 90 ° optical path conversion structure is provided, the optical wiring film and the light-emitting element or the light-receiving element are overlapped at that portion, and may protrude in an eaves shape. Furthermore, the optical wiring film may have a shape extended outside the substrate. The part extended outside the substrate can have any shape. Even if there is such a slight difference in dimensions, the overlap between the optical wiring film and the support substrate, the portion where the optical wiring layer of the support substrate is installed, and the portion where the light receiving element and / or the light emitting element are installed have the same shape. Is fine.
[0023]
【Example】
Hereinafter, the present invention will be described with reference to Examples, but the present invention should not be construed as being limited thereto. Further, in the following description, the number of laminated optical wiring films will be described as one layer, but it is not necessarily required to be one layer. In addition, although the optical wiring film is laminated at one place, it is not necessarily required to be one place. Further, in the following description, the optical wiring is described as a multi-mode, but it is not necessarily required to be a multi-mode.
[0024]
<Example 1>
First, Epicoat 828 (Yukaka Epoxy Co., Ltd.) was used as the main material, and triethylenetetramine (TETA) (Wako Pure Chemical Industries, Ltd.) was used as the hardening material, and they were mixed at a weight ratio of 10: 1. Thus, an adhesive was prepared.
[0025]
As shown in FIG. 9A, the adhesive 23 is dropped by a dispenser on the support substrate 11 in which the portion where the optical wiring layer is installed is 150 μm lower than the surface of the portion where the light receiving element and / or the light emitting element is installed. did.
[0026]
As shown in FIG. 9B, the optical wiring film 21 was laminated on the adhesive layer 22. At this time, the thickness of the adhesive layer 22 was 5 μm. The entire substrate 11 was heated at 100 ° C. for 1 hour to cure the adhesive layer 22.
[0027]
As shown in FIG. 9C, the light emitting / receiving element 12 was mounted on the substrate 11, and the optical connection with the optical wiring film 21 was confirmed.
[0028]
<Example 2>
An adhesive was prepared in the same manner as in Example 1.
[0029]
As shown in FIG. 10A, a light emitting / receiving element 12 was mounted on a substrate 11.
[0030]
As shown in FIG. 10B, the adhesive 23 is dropped by a dispenser on the support substrate 11 in which the portion where the optical wiring layer is installed is 150 μm higher than the surface of the portion where the light receiving element and / or the light emitting element is installed. did.
[0031]
As shown in FIG. 10C, the optical wiring film 21 was laminated on the adhesive layer 22. At this time, the thickness of the adhesive layer 22 was 5 μm.
[0032]
The entire substrate 11 was heated at 100 ° C. for 1 hour to cure the adhesive layer 22. Optical connection between the light emitting / receiving element 12 and the optical wiring film 21 was confirmed.
[0033]
<Example 3>
An adhesive was prepared in the same manner as in Example 1.
[0034]
As shown in FIG. 11A, a light emitting / receiving element 12 was mounted on a substrate 11.
[0035]
As shown in FIG. 11B, the adhesive 23 is dispensed with a dispenser on the support substrate 11 in which the portion where the optical wiring layer is installed and the surface where the light receiving element and / or the light emitting element are installed has a height of 150 μm. It was dropped.
[0036]
As shown in FIG. 11C, the optical wiring film 21 was laminated on the adhesive layer 22. At this time, the thickness of the adhesive layer 22 was 5 μm.
[0037]
The entire substrate 11 was heated at 100 ° C. for 1 hour to cure the adhesive layer 22. Optical connection between the light emitting / receiving element 12 and the optical wiring film 21 was confirmed.
[0038]
<Example 4>
An adhesive was prepared in the same manner as in Example 1. As shown in FIG. 12A, a light emitting / receiving element 12 was mounted on a substrate 11.
[0039]
As shown in FIG. 12B, the adhesive 23 is dispensed with a dispenser on the support substrate 11 in which the portion where the optical wiring layer is installed and the surface where the light receiving element and / or the light emitting element are installed has a height of 150 μm. It was dropped.
[0040]
As shown in FIG. 12C, the optical wiring film 21 was laminated on the adhesive layer 22. At this time, the thickness of the adhesive layer 22 was 5 μm.
[0041]
The entire substrate 11 was heated at 100 ° C. for 1 hour to cure the adhesive layer 22. Optical connection between the light emitting / receiving element 12 and the optical wiring film 21 was confirmed.
[0042]
【The invention's effect】
The present invention has the following effects.
First, an optical wiring having a high-definition optical wiring on a support substrate in which the height of a surface serving as a reference between a portion on which an optical wiring layer is provided on a support substrate and a portion on which a light receiving element and / or a light emitting element are provided is different. A substrate can be provided. Thereby, the optical characteristics of the optical wiring film are improved, and the selection range of the support substrate is expanded.
[0043]
Second, a 90 ° optical path conversion structure can be formed at an arbitrary position by preparing an optical wiring film having an arbitrary shape in advance and laminating the optical wiring film, and processing the optical wiring film into an arbitrary shape after laminating the optical wiring film. Can be created. This increases the degree of freedom in designing the optical wiring board.
[0044]
[Brief description of the drawings]
FIG. 1 is a cross-sectional view of a conventional optical wiring substrate cut in a vertical direction.
FIG. 2 is a cross-sectional view of a conventional optical wiring substrate cut in a vertical direction.
FIG. 3 is an explanatory view of an optical wiring board of the present invention.
FIG. 4 is an explanatory view of an optical wiring board of the present invention.
FIG. 5 is an explanatory view of an optical wiring board of the present invention.
FIG. 6 is an explanatory view of an optical wiring board of the present invention.
FIG. 7 is an explanatory view of an optical wiring board of the present invention.
FIG. 8 is an explanatory view of an optical wiring board of the present invention.
FIG. 9 is an explanatory diagram of the method for manufacturing the optical wiring board according to the first embodiment.
FIG. 10 is an explanatory diagram of the method for manufacturing the optical wiring board according to the second embodiment.
FIG. 11 is an explanatory diagram of the method for manufacturing the optical wiring board according to the third embodiment.
FIG. 12 is an explanatory diagram of the method for manufacturing the optical wiring board according to the fourth embodiment.
[Explanation of symbols]
Reference Signs List 10 optical wiring substrate 11 support substrate 12 light emitting element or light receiving element 20 optical wiring layer 21 optical wiring film 22 adhesive layer 23 adhesive

Claims (3)

光配線層を設置する部分と受光素子及び／又は発光素子を設置する部分の面の高さが異なる支持基板上に、光配線層と受光素子及び／又は発光素子を設置した光配線基板において、該光配線層が少なくとも光配線フィルム及び接着剤層からなることを特徴とする光配線基板。An optical wiring board on which an optical wiring layer and a light receiving element and / or a light emitting element are installed on a support substrate having a different surface height between a part where the optical wiring layer is installed and a part where the light receiving element and / or the light emitting element is installed, An optical wiring board, wherein the optical wiring layer comprises at least an optical wiring film and an adhesive layer. 前記支持基板上の光配線層を設置する部分の形状が、光配線フィルムを嵌入可能な形状であることを特徴とする請求項１記載の光配線基板。2. The optical wiring board according to claim 1, wherein a portion of the support substrate on which the optical wiring layer is provided has a shape into which an optical wiring film can be fitted. 前記支持基板上の受光素子及び／又は発光素子を設置する部分の形状が、該素子を嵌入可能な形状であることを特徴とする請求項１又は２のいずれかに記載の光配線基板。The optical wiring board according to claim 1, wherein a shape of a portion on the support substrate on which the light receiving element and / or the light emitting element is installed is a shape into which the element can be fitted.
JP2002226060A 2002-08-02 2002-08-02 Optical wiring board Pending JP2004069824A (en)

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WO2006012195A1 (en) * 2004-06-30 2006-02-02 Intel Corporation Optoelectronic flip-chip package with optical waveguide accomodated in upper layers of substrate board
WO2008114696A1 (en) * 2007-03-16 2008-09-25 Hitachi Chemical Company, Ltd. Adhesive composition for optical waveguide, adhesive film for optical waveguide and adhesive sheet for optical waveguide each using the same, and optical device using any of them
JP2008260908A (en) * 2007-03-16 2008-10-30 Hitachi Chem Co Ltd Adhesive composition for optical waveguide, and adhesive film for optical waveguides using the same, and optical device using these
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WO2008114696A1 (en) * 2007-03-16 2008-09-25 Hitachi Chemical Company, Ltd. Adhesive composition for optical waveguide, adhesive film for optical waveguide and adhesive sheet for optical waveguide each using the same, and optical device using any of them
US8200059B2 (en) 2007-03-16 2012-06-12 Hitachi Chemical Company, Ltd. Adhesive composition for optical waveguide, adhesive film for optical waveguide and adhesive sheet for optical waveguide each using the same, and optical device using any of them
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