JP2019009179A - Capacitor and manufacturing method of capacitor - Google Patents

Abstract

To restrain decrease in mounting strength to an external unit due to deterioration of a nut, when an attachment part having a metal nut is provided in an external member.SOLUTION: A film capacitor includes a resin case 400, a capacitor element to be housed in the case 400, a filling resin filling the interior of the case 400, and an attachment hub 420 provided on one side of the case 400. The attachment hub 420 includes a metal nut 430 having a plated surface and insert molded to the case 400 so as to be in the same orientation as one side of the case 400. The nut 430 includes a screw hole 431 formed from one end face 430b thereof toward the other end face 430b and not reaching the other end face 430b, and a through hole 432 formed to continue from the screw hole 431 and reaching the other end face 430b, and does not penetrate one face of the case 400, and is not exposed to the inside of the case 400.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a capacitor such as a film capacitor, and a method for manufacturing such a capacitor.

  Patent Document 1 discloses a capacitor module in which a capacitor element having bus bars connected to both end faces is accommodated in a mold case and the mold case is filled with a mold resin. Thus, by covering the capacitor element with the mold resin, the capacitor element can be protected from moisture and the like.

  In the capacitor module of Patent Document 1, a mounting portion is provided in the mold case. The attachment portion is used when the capacitor module is attached to an external device or the like.

  The mounting portion of such a mold case can be configured by insert-molding a metal nut into the mold case. In the case of such a configuration, conventionally, a cap nut having a bottomed screw hole is often used as the nut.

  Patent Document 2 describes a method for manufacturing an insert-molded product in which a cap nut is insert-molded.

JP 2014-203893 A JP 2006-321061 A

  Usually, the surface of the nut is plated with zinc or the like in order to prevent rust and corrosion. The nut is immersed in the plating solution, and the plating solution convects around the nut. By such convection of the plating solution, the plating adheres to the surface of the nut sufficiently thickly.

  However, in the case of a cap nut, since the screw hole has a bottom, the plating solution is less likely to convection inside the screw hole, and plating having a sufficient thickness is difficult to adhere to the inside of the screw hole. For this reason, when a cap nut is used for the mold case of the capacitor module that can be exposed to moisture, there is a concern that rust or the like is likely to occur inside the screw hole. Therefore, there is a concern that the mounting strength of the capacitor module to an external device or the like may be reduced due to the deterioration of the cap nut.

  In view of such a problem, the present invention can suppress a decrease in mounting strength to an external device or the like due to deterioration of the nut when the mounting member having a metal nut is provided on the exterior member in which the capacitor element is accommodated. It is an object of the present invention to provide a capacitor and a method of manufacturing a capacitor that can easily manufacture such a capacitor.

  The capacitor according to the first aspect of the present invention includes a resin exterior member, a capacitor element accommodated in the exterior member, a filling resin filled in the exterior member, and one surface of the exterior member. And a mounting portion used for mounting the capacitor. Here, the attachment portion includes a metal nut that is insert-molded in the exterior member so as to be oriented in the same direction as the one surface of the exterior member. The nut is formed from one end surface of the nut toward the other end surface, does not reach the other end surface, and has a screw hole having a screw groove on an inner peripheral surface thereof, and is formed so as to continue from the screw hole. And does not penetrate one surface of the exterior member and is not exposed to the inside of the exterior member.

  According to a second aspect of the present invention, there is provided a method for manufacturing a capacitor, including a step of manufacturing a case in which a metal nut having a plated surface is insert-molded, and a step of accommodating a capacitor element in the case. . In the method of manufacturing a capacitor according to this aspect, the nut is formed from one end surface of the nut toward the other end surface, does not reach the other end surface, and has a screw hole having a screw groove on an inner peripheral surface thereof, and the screw hole And a through hole formed so as to continue to the other end surface. In the manufacturing process of the case, a first mold member including a first molding surface that forms the outer side of the case and a protrusion protruding from the first molding surface, and the first molding surface A mold including a second mold member including a second molding surface that faces and forms the inside of the case is prepared, and one end surface of the nut is in close contact with the first molding surface and the first mold surface is provided. The first mold is configured such that the screw hole of the nut is closed by the molding surface and the through-hole is closed from the screw hole side by the protrusion passing through the screw hole. The nut is set on a member, and the first mold member on which the nut is set and the second mold member are spaced from each other end surface of the nut and the second molding surface. And a mold part having the shape of the case is formed inside the mold. The molten resin to the mold portion is the case is implanted is formed.

  ADVANTAGE OF THE INVENTION According to this invention, when the attaching part which has a metal nut is provided in the exterior member in which a capacitor | condenser element is accommodated, the fall of the attachment strength to the external apparatus etc. by deterioration of a nut can be suppressed.

  The effects and significance of the present invention will become more apparent from the following description of embodiments. However, the embodiment described below is merely an example when the present invention is implemented, and the present invention is not limited to what is described in the following embodiment.

FIG. 1 is a perspective view of a film capacitor according to an embodiment. FIG. 2 is an exploded perspective view of the film capacitor according to the embodiment. 3A is a side cross-sectional view of the case cut at the position of the bottom mounting boss according to the embodiment, and FIG. 3B is the position of the front mounting boss according to the embodiment. FIG. 3C is a side cross-sectional view of the nut according to the present embodiment. 4A and 4B are cross-sectional views of a mold used for case injection molding according to the embodiment. FIG. 5 is a diagram showing a flow of a case manufacturing process by injection molding according to the embodiment. 6A and 6B are a cross-sectional view of a mold used in a case manufacturing process and a cross-sectional view of a case manufactured using the mold, respectively, according to a comparative example. 7A and 7B are cross-sectional views of a mold used for case injection molding according to a modification. FIG. 8A is a side sectional view of the case cut at the position of the bottom mounting boss according to the modified example, and FIG. 8B is cut at the position of the front mounting boss according to the modified example. It is side surface sectional drawing of the done case.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. For convenience, front and rear, left and right, and up and down directions are appropriately appended to each drawing. In addition, the direction of illustration shows the relative direction of the film capacitor 1 etc. to the last, and does not show an absolute direction.

  In the present embodiment, the film capacitor 1 corresponds to a “capacitor” recited in the claims. The case 400 corresponds to an “exterior member” recited in the claims. Further, the mounting boss 420 corresponds to the “mounting portion” recited in the claims. Furthermore, the upper mold member 610 and the front mold member 620 correspond to a “first mold member” recited in the claims. Furthermore, the upper molding surface 611 and the front molding surface 621 correspond to the “first molding surface” recited in the claims. Further, the closing projections 613 and 623 correspond to “projections” recited in the claims. Further, the lower mold member 630 corresponds to a “second mold member” recited in the claims. Furthermore, the lower molding surface 631 corresponds to a “second molding surface” recited in the claims.

  However, the above description is only for the purpose of associating the configuration of the claims with the configuration of the embodiment, and the invention described in the claims is incorporated into the configuration of the embodiment by the above association. It is not limited at all.

<Structure of film capacitor>
First, the film capacitor 1 according to the present embodiment will be described. The film capacitor 1 is manufactured by a capacitor manufacturing method according to the present embodiment described later.

  FIG. 1 is a perspective view of a film capacitor 1 according to the present embodiment. FIG. 2 is an exploded perspective view of the film capacitor 1 according to the present embodiment. FIG. 3A is a side sectional view of the case 400 cut at the position of the bottom mounting boss 420 according to the present embodiment, and FIG. 3B is a front view according to the present embodiment. It is side surface sectional drawing of case 400 cut | disconnected in the position of the attachment boss | hub 420, FIG.3 (c) is side surface sectional drawing of the nut 430 based on this Embodiment. 3A and 3B, the screw groove 431a is not shown in the screw hole 431 of the nut 430.

  The film capacitor 1 includes a capacitor element 100, a first bus bar 200, a second bus bar 300, a case 400, and a filling resin 500. The film capacitor 1 is an electronic component that can be mounted on an external device or the like, and the capacitor element 100 is an electric element.

  Capacitor element 100 is formed by stacking two metallized films deposited with aluminum on a dielectric film, winding or laminating the stacked metallized films, and pressing them flatly. In the capacitor element 100, a first end face electrode 101 is formed on one end face by blowing a metal such as zinc, and a second end face electrode 102 is also formed on the other end face by blowing a metal such as zinc. The

  The capacitor element 100 of the present embodiment is formed of a metallized film in which aluminum is vapor-deposited on a dielectric film, but in addition to this, metallization in which other metals such as zinc and magnesium are vapor-deposited. It may be formed by a film. Or the capacitor | condenser element 100 may be formed with the metallized film which vapor-deposited several metals among these metals, and may be formed with the metallized film vapor-deposited the alloy of these metals. .

  The first bus bar 200 and the second bus bar 300 are formed in a rectangular plate shape using a conductive material such as copper. The first bus bar 200 and the second bus bar 300 have their one end portions electrically connected to the first end face electrode 101 and the second end face electrode 102 of the capacitor element 100 by a connecting method such as soldering or welding, respectively. The capacitor element 100 extends upward.

  Capacitor element 100 to which first bus bar 200 and second bus bar 300 are connected is accommodated in case 400.

  Case 400 is made of resin, and is formed of, for example, polyphenylene sulfide (PPS) resin that is a thermoplastic resin. Case 400 has a substantially rectangular parallelepiped box shape, and an upper surface is opened. The case 400 is provided with mounting tabs 410 on the left and right sides. The mounting tab 410 is formed with a circular mounting hole 411 penetrating in the vertical direction. In addition, the case 400 is provided with a mounting boss 420 so as to protrude from these surfaces at the center of the front surface and the center of the bottom surface slightly to the left.

  As shown in FIGS. 3A and 3B, the mounting boss 420 has a substantially cylindrical shape and includes a metal nut 430. The nut 430 is insert-molded in the case 400 as a base material so as to be in the same direction as the surface (front surface, bottom surface) on which the mounting boss 420 is provided. One end surface 430a side of the nut 430 is exposed to the outside. Further, the nut 430 does not penetrate the front surface (bottom surface) of the case 400 and is not exposed to the inside of the case 400. That is, the nut 430 is in a state where the other end surface 430b side is closed by the front surface (bottom surface) of the case 400. As described above, in the present embodiment, even when insert molding of the nut 430 is performed on one surface of the case 400, the metal nut 430 is not exposed to the inside of the case 400, and thus is accommodated in the case 400. Insulation between the capacitor element 100 and the nut 430 can be sufficiently ensured.

  As shown in FIG. 3C, the nut 430 has a cylindrical outer shape, is formed from the one end surface 430a toward the other end surface 430b and does not reach the other end surface 430b, and the screw hole 431. And a through hole 432 that is formed so as to reach the other end surface 430b. A screw groove 431 a is formed on the inner peripheral surface of the screw hole 431. A thread groove is not formed in the through hole 432. Further, the inner diameter D1 of the through hole 432 is made smaller than the inner diameter D2 of the screw hole 431. Note that the shape of the nut 430 does not have to be cylindrical, and may be, for example, a quadrangular prism or a hexagonal prism.

  The nut 430 is formed of a metal material such as iron. The surface of the nut 430 is plated with zinc or the like to prevent rust and corrosion. The nut 430 is immersed in the plating solution in the manufacturing process. The plating solution convects around the nut 430, and the plating adheres to the surface of the nut 430 sufficiently thick by the convection of the plating solution. When the nut 430 is not provided with the through hole 432 and the screw hole 431 is closed, the plating solution is less likely to convection inside the screw hole 431, and plating with a sufficient thickness is formed inside the screw hole 431. Is difficult to adhere. In the present embodiment, since the through hole 432 is provided in the nut 430, the plating solution can easily pass through the screw hole 431 and the through hole 432, and the plating solution can easily convect inside the screw hole 431. Therefore, in the nut 430 of the present embodiment, plating with a sufficient thickness is likely to adhere inside the screw hole 431.

  The attachment tab 410 and the attachment boss 420 are used when attaching the film capacitor 1 to an external device or the like. For example, the mounting tab 410 is fixed to a mounting boss provided in an external device or the like with a screw passed through the mounting hole 411. Further, the mounting boss 420 is fixed to the frame provided in the external device or the like with screws. At this time, a screw is fastened to the nut 430.

  Here, when a screw having a screw part longer than the screw hole 431 is used as a screw fastened to the nut 430, the screw may be overtightened. However, since the inner diameter D1 of the through hole 432 is smaller than the inner diameter D2 of the screw hole 431, the nut 430 cannot be tightened any more when the tip of the screw reaches the position of the through hole 432. Therefore, it is possible to prevent the tip of the screw from reaching the wall surface of the case 400 and damaging the wall surface.

  As shown in FIG. 1, a case 400 in which the capacitor element 100 is accommodated is filled with a filling resin 500. The filling resin 500 is made of a thermosetting resin such as an epoxy resin, is injected into the case 400 in a molten state, and is cured when the case 400 is heated. Filling resin 500 covers capacitor element 100 and part of first bus bar 200 and second bus bar 300, and protects them from moisture and impact.

  As described above, in the present embodiment, the other end surface 430 b side of the nut 430 is not exposed inside the case 400. For this reason, there is no possibility that the liquid filling resin 500 injected into the case 400 leaks outside through the through hole 432 and the screw hole 431 of the nut 430.

  The other ends of the first bus bar 200 and the second bus bar 300 protrude upward from the upper surface of the case 400. External terminals drawn from a circuit board or the like of the external device are connected to these other end portions.

<Film capacitor manufacturing method>
Next, a method for manufacturing the film capacitor 1 will be described.

  4A and 4B are cross-sectional views of a mold 600 used for injection molding of the case 400 according to the present embodiment. 4A shows a mold 600 that is cut at a position where the mounting boss 420 on the bottom surface is formed and the nut 430 is set on the upper mold member 610. FIG. 4B shows the mounting boss on the front surface. A mold 600 is shown in which a nut 430 is set on a front mold member 620, which is cut at a position where 420 is formed.

  In the mold 600 of the present embodiment, the case 400 is formed upside down. Of course, if the configuration of the mold 600 is upside down from that of FIGS. 4A and 4B, the case 400 is formed in a state that is not upside down.

  Case 400 is formed by injection molding in a case manufacturing process included in the manufacturing process of film capacitor 1. A mold 600 for forming the case 400 is made of a steel material, and an upper mold member 610 movable in the vertical direction, a front mold member 620 movable in the front-rear direction, and a fixed lower mold. The member 630 is combined to be configured. The upper mold member 610 may be fixed and the lower mold member 630 may be movable.

  The upper mold member 610 is formed with an upper molding surface 611 that forms the outside of the bottom surface, right side surface, left side surface, and rear surface of the case 400. The upper molding surface 611 is formed with an accommodation recess 612 in which the nut 430 is accommodated. The housing recess 612 has a substantially cylindrical shape, and the inner diameter D3 in the vicinity of the bottom is the same as the outer diameter D0 of the nut 430, but the outer diameter of the nut 430 is the resin material (PPS). The outer diameter D0 of the nut 430 is made slightly larger so as to be covered with the resin. In addition, a columnar blocking projection 613 is formed on the upper molding surface 611 so as to protrude from the center of the bottom surface of the housing recess 612. The outer diameter D5 of the blocking projection 613 is made equal to the inner diameter D1 of the through hole 432 of the nut 430. The length of the closing projection 613 is made equal to the depth of the housing recess 612. Further, a magnet 614 is disposed in the upper mold member 610 in the vicinity of the bottom surface of the housing recess 612.

  The front mold member 620 is formed with a front molding surface 621 that forms the outside of the front surface of the case 400. The front molding surface 621 is formed with an accommodation recess 622 in which the nut 430 is accommodated and a closing projection 623 located in the accommodation recess 622. The configuration of the housing recess 622 and the closing projection 623 is the same as the configuration of the housing recess 612 and the closing projection 613 of the upper mold member 610. A magnet 624 is disposed in the front mold member 620 in the vicinity of the bottom surface of the housing recess 622.

  The lower mold member 630 is formed with a lower molding surface 631 that forms the inside of the bottom surface, front surface, right side surface, left side surface, and rear surface of the case 400. The lower molding surface 631 faces the upper molding surface 611 and the front molding surface 621.

  Inside the mold 600 to which the upper mold member 610, the front mold member 620, and the lower mold member 630 are coupled, there is a case between the upper molding surface 611, the front molding surface 621, and the lower molding surface 631. A mold part 600a having a shape of 400 is formed.

  FIG. 5 is a diagram showing a flow of a case manufacturing process by injection molding according to the present embodiment.

  As shown in FIG. 5, in the case manufacturing process, a preparation process, a molding process, and a removal process are sequentially performed.

  In the preparation process, the mold 600 is prepared. Then, a nut 430 is set in each of the receiving recess 612 of the upper mold member 610 and the receiving recess 622 of the front mold member 620. At this time, as shown in FIG. 4A, in the upper mold member 610, one end surface 430a of the nut 430 is in close contact with the bottom surface of the housing recess 612, that is, the upper molding surface 611, and the screw of the nut 430 is formed on the upper molding surface 611. While the hole 431 is closed, the through hole 432 is closed from the screw hole 431 side at the tip of the closing projection 613 passed through the screw hole 431. The nut 430 is held in the housing recess 612 mainly by the magnetic force of the magnet 614. Similarly, as shown in FIG. 4B, in the front mold member 620, one end surface 430 a of the nut 430 is in close contact with the bottom surface of the housing recess 622, that is, the front molding surface 621, and the nut on the front molding surface 621. The screw hole 431 of 430 is closed, and the through hole 432 is closed from the screw hole 431 side at the tip of the closing projection 623 that is passed through the screw hole 431. The nut 430 is held in the housing recess 622 mainly by the magnetic force of the magnet 624. Thereafter, the upper mold member 610 in which the nut 430 is set, the front mold member 620 in which the nut 430 is set, and the lower mold member 630 are closed. A gap is formed between the other end surface 430b of the nut 430 set on the upper mold member 610 and the front mold member 620 and the lower molding surface 631 of the lower mold member 630.

  In the molding process, a melted PPS resin is injected into the mold part 600a of the closed mold 600 and filled into the mold part 600a. Here, in the upper mold member 610, the inlet of the screw hole 431 of the nut 430 is closed by the upper molding surface 611, and the through hole 432 is closed by the closing protrusion 613. Similarly, in the front mold member 620, the entrance of the screw hole 431 of the nut 430 is closed by the front molding surface 621, and the through hole 432 is closed by the closing protrusion 623. This prevents the PPS resin filled in the mold part 600a from entering the screw hole 431 of the nut 430. When the PPS resin spreads in the mold part 600a, the mold 600 is left for a predetermined time, and the PPS resin in the mold part 600a is solidified in the shape of the case 400 by natural cooling. Thereby, the case 400 is formed.

  In the take-out process, the mold 600 is separated and the case 400 is taken out.

  Thus, when case 400 is manufactured in the case manufacturing process, capacitor element 100, first bus bar 200, and second bus bar 300 are accommodated in manufactured case 400 in the subsequent process. In the subsequent further process, when the filling resin 500 is filled in the case 20 and cured, the film capacitor 1 is completed.

<Effect of Embodiment>
According to the configuration of the film capacitor 1 of the present embodiment, the following effects can be achieved.

  By providing the nut 430 with a through-hole 432 that connects from the screw hole 431 to the other end surface 430b, the plating solution can easily convect inside the screw hole 431, and a sufficiently thick plating is attached to the inside of the screw hole 431. It becomes easy. Thereby, since it becomes difficult to generate | occur | produce rust etc. inside the screw hole 431, degradation of the nut 430 can be suppressed and the fall of the attachment strength to the external apparatus etc. of the film capacitor 1 can be suppressed.

  In addition, since the metal nut 430 is not exposed to the inside of the case 400, the insulation between the capacitor element 100 accommodated in the case 400 and the nut 430 can be sufficiently ensured.

  Further, in the nut 430, the inner diameter D1 of the through hole 432 is smaller than the inner diameter D2 of the screw hole 431. For this reason, when a screw having a screw part longer than the screw hole 431 is mistakenly used, even if the screw is excessively tightened, the tip of the screw can be stopped at the position of the through hole 432, and the tip of the screw Can be prevented from reaching the wall surface of the case 400 and damaging the wall surface.

  Furthermore, according to the method for manufacturing a capacitor of the present embodiment, the following effects can be achieved.

  Since the through hole 432 of the nut 430 is closed by the closing protrusions 613 and 623, the through hole 432 is formed on the lower molding surface 631 of the lower mold member 630 as shown in the comparative example of FIG. The resin material may be interposed between the other end surface 430b of the nut 430 and the lower molding surface 631. Thereby, in the manufactured case 400, the metal nut 430 is not exposed to the inside of the case 400. Therefore, it is possible to ensure sufficient insulation between the capacitor element 100 accommodated in the case 400 and the nut 430. Further, there is no possibility that the liquid filling resin 500 injected into the case 400 leaks outside through the through hole 432 and the screw hole 431 of the nut 430. In addition, when it is set as the structure which closes the through-hole 432 with the lower shaping | molding surface 631 of the lower mold member 630 like FIG. 6A, the manufactured case 400 like FIG. The nut 430 is exposed inside the case 400.

  Further, in the nut 430, the inner diameter D1 of the through hole 432 is smaller than the inner diameter D2 of the screw hole 431, and the outer diameter D5 of the closing protrusions 613 and 623 is also smaller than the inner diameter D2 of the screw hole 431. When the through-hole 432 is blocked by 623, the blocking protrusions 613 and 623 easily pass through the screw hole 431.

  The embodiment of the present invention has been described above, but the present invention is not limited to the above embodiment, and the application example of the present invention can be modified in various ways in addition to the above embodiment. Is possible.

  For example, in the above embodiment, the mounting boss 420 having the nut 430 is provided on the front surface and the bottom surface of the case 400. However, the surface of the case 400 on which the mounting boss 420 is provided, the number of mounting bosses 420 on one surface, and the number of mounting bosses 420 on the entire case 400 may be arbitrary.

  In the above embodiment, in the nut 430, the inner diameter D1 of the through hole 432 is smaller than the inner diameter D2 of the screw hole 431. However, the inner diameter D1 of the through hole 432 may be equal to the inner diameter D2 of the screw hole 431. Also in this case, when the screw is tightened excessively, the tip of the screw can be stopped at the position of the through hole 432, and damage to the wall surface of the case 400 can be prevented. However, if the inner diameter D1 of the through-hole 432 is smaller than the inner diameter D2 of the screw hole 431, the tip of the screw is likely to stop, so that the effect of preventing damage to the wall surface of the case 400 is likely to increase.

  Furthermore, in the above embodiment, when the outer diameter D5 of the closing projections 613 and 623 is made equal to the inner diameter D1 of the through hole 432 of the nut 430, the nut 430 is set in the mold 600 in the preparation process. The distal end portions of the closing projections 613 and 623 are inserted into the through holes 432. However, as shown in FIGS. 7A and 7B, when the outer diameter D5 of the closing projections 613 and 623 is made larger than the inner diameter D1 of the through-hole 432 of the nut 430, the nut 430 is removed in the preparation step. When set in the mold 600, the inlets of the through holes 432 may be blocked by the tip portions of the blocking protrusions 613 and 623. In this case, as shown in FIGS. 8A and 8B, in the case 400, the through hole 432 of the nut 430 is filled with a resin material (PPS resin).

  Further, in the above embodiment, the case 400 is formed of PPS resin. However, case 400 may be formed of a resin material other than PPS resin, such as polybutylene terephthalate (PBT) resin. Also in this case, the capacitor manufacturing method of the above embodiment can be used.

  Furthermore, the number of capacitor elements 100 included in the film capacitor 1 is not limited to that of the above embodiment, and can be changed as appropriate according to the required electric capacity. That is, although one capacitor element 100 is disposed in the case 400 in the above embodiment, the present invention is not limited to this, and a plurality of capacitor elements 100 may be disposed in the case 400.

  Furthermore, in the above embodiment, the capacitor element 100 is formed by stacking two metallized films obtained by vapor-depositing aluminum on a dielectric film and winding or laminating the stacked metallized films. Alternatively, the capacitor element 100 may be formed by stacking a metallized film in which aluminum is vapor-deposited on both sides of the dielectric film and an insulating film, and winding or laminating them.

  Furthermore, the capacitor manufactured by the method for manufacturing a capacitor of the present invention is not limited to the film capacitor 1 as in the above embodiment, and may be a capacitor other than the film capacitor 1.

  In addition, the embodiment of the present invention can be variously modified as appropriate within the scope of the technical idea shown in the claims.

  In the description of the above embodiment, the terms indicating directions such as “upward” and “downward” indicate relative directions that depend only on the relative positional relationship of the constituent members, and include vertical and horizontal directions. It does not indicate the absolute direction.

  INDUSTRIAL APPLICABILITY The present invention is useful for manufacturing capacitors and capacitors used in various electronic devices, electric devices, industrial devices, vehicle electrical equipment, and the like.

1 Film capacitor (capacitor)
100 Capacitor element 400 Case (exterior member)
420 Mounting boss (Mounting part)
430 Nut 430a One end surface 430b Other end surface 431 Screw hole 431a Screw groove 432 Through hole 500 Filling resin 600 Mold 600a Mold part 610 Upper mold member (first mold member)
611 Upper molding surface (first molding surface)
613 Blocking protrusion (protrusion)
610 Front mold member (first mold member)
621 Front molding surface (first molding surface)
623 Protrusion part (protrusion part)
630 Lower mold member (second mold member)
631 Lower molding surface (second molding surface)

Claims (4)

In the capacitor
A resin exterior member;
A capacitor element housed inside the exterior member;
A filling resin filled in the exterior member;
Provided on one surface of the exterior member, and an attachment portion used for attachment of the capacitor,
The mounting portion includes a metal nut that is insert-molded in the exterior member so as to be in the same direction as one surface of the exterior member, and has a surface plated.
The nut is
A screw hole formed from one end surface of the nut toward the other end surface and not reaching the other end surface but having a thread groove on an inner peripheral surface thereof, and a through hole formed so as to continue from the screw hole and reaching the other end surface And including
Does not penetrate one surface of the exterior member and is not exposed to the interior of the exterior member.
Capacitor characterized by that. The capacitor of claim 1,
The inner diameter of the through hole is smaller than the inner diameter of the screw hole.
Capacitor characterized by that. A method of manufacturing a capacitor, including a step of manufacturing a case in which a metal nut plated on a surface is insert-molded, and a step of accommodating a capacitor element in the case,
The nut is formed from one end surface of the nut toward the other end surface, does not reach the other end surface, and has a screw hole having a screw groove on an inner peripheral surface thereof, and is formed so as to continue from the screw hole. Including a through hole,
In the manufacturing process of the case,
A first mold member including a first molding surface that forms the outer side of the case and a protrusion protruding from the first molding surface, and an inner side of the case that faces the first molding surface A mold including a second mold member including a second molding surface is prepared;
One end surface of the nut is in close contact with the first molding surface, and the screw hole of the nut is closed with the first molding surface, and the screw is inserted into the screw through the inside of the screw hole. The nut is set on the first mold member so that the through hole is closed from the hole side,
The first mold member on which the nut is set and the second mold member are closed in a state where a gap is generated between the other end surface of the nut and the second molding surface, A mold part having the shape of the case is formed inside the mold,
The case is formed by injecting molten resin into the mold part,
A method of manufacturing a capacitor. In the manufacturing method of the capacitor according to claim 3,
The inner diameter of the through hole and the outer diameter of the protrusion are smaller than the inner diameter of the screw hole,
A method of manufacturing a capacitor.

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