CN109844880B - Capacitor with a capacitor element - Google Patents
Capacitor with a capacitor element Download PDFInfo
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- CN109844880B CN109844880B CN201780062986.7A CN201780062986A CN109844880B CN 109844880 B CN109844880 B CN 109844880B CN 201780062986 A CN201780062986 A CN 201780062986A CN 109844880 B CN109844880 B CN 109844880B
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- capacitor element
- connection terminal
- terminal portion
- bus bar
- capacitor
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- 239000003990 capacitor Substances 0.000 title claims abstract description 168
- 229920005989 resin Polymers 0.000 claims abstract description 87
- 239000011347 resin Substances 0.000 claims abstract description 87
- 239000010408 film Substances 0.000 description 31
- 238000012986 modification Methods 0.000 description 17
- 230000004048 modification Effects 0.000 description 17
- 238000000465 moulding Methods 0.000 description 17
- 125000006850 spacer group Chemical group 0.000 description 14
- 238000003780 insertion Methods 0.000 description 10
- 230000037431 insertion Effects 0.000 description 10
- 238000000429 assembly Methods 0.000 description 9
- 230000000712 assembly Effects 0.000 description 9
- 239000011104 metalized film Substances 0.000 description 9
- 238000000151 deposition Methods 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 239000000126 substance Substances 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 239000000428 dust Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 4
- 230000000630 rising effect Effects 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- 229920001187 thermosetting polymer Polymers 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 238000010030 laminating Methods 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 238000004804 winding Methods 0.000 description 3
- 229910052725 zinc Inorganic materials 0.000 description 3
- 239000011701 zinc Substances 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/02—Mountings
- H01G2/04—Mountings specially adapted for mounting on a chassis
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/14—Organic dielectrics
- H01G4/18—Organic dielectrics of synthetic material, e.g. derivatives of cellulose
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/224—Housing; Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
A film capacitor (1) is provided with a capacitor element assembly (10) and an insulating exterior resin (20) that covers the capacitor element assembly (10). The capacitor element assembly (10) includes a capacitor element, a left bus bar connected to a left end face electrode of the capacitor element, and a right bus bar connected to a right end face electrode of the capacitor element. The left and right bus bars have left and right connecting terminal portions (220, 320) formed at one end portions of the bus bars and exposed from a front surface (20a) of an exterior resin (20) to be connected to an external terminal, and a 1 st raised portion (21) and a 2 nd raised portion (22) raised from the front surface (20a) are formed integrally with the exterior resin (20) on the front surface (20a) of the exterior resin (20) so as to be present on a path connecting the left and right connecting terminal portions (220, 320).
Description
Technical Field
The present invention relates to capacitors.
Background
In the film capacitor of patent document 1, a connection terminal portion to which an external terminal is connected is formed at a distal end portion of the external lead terminal. The capacitor module is covered with an exterior resin, and connection terminal portions of the external lead terminals are exposed from an upper surface of the exterior resin.
Documents of the prior art
Patent document
Patent document 1: JP 2014-216453 publication
Disclosure of Invention
Problems to be solved by the invention
In the above-described film capacitor, a path between the connection terminal portion of one bus bar and the connection terminal portion of the other bus bar having the opposite polarity to the connection terminal portion is formed as a substantially flat surface on the upper surface of the exterior resin. Therefore, when water caused by dust or dew condensation is accumulated in the path, the 2 connection terminal portions as the different poles are easily connected by the dust or water, and when the thin film capacitor is used in such a state, a leakage path (tracking) may be generated between the 2 connection terminal portions.
In view of the above problems, an object of the present invention is to provide a capacitor capable of preventing occurrence of a leakage current path between connection terminal portions having different polarities.
Means for solving the problems
A capacitor according to a main aspect of the present invention includes a capacitor element assembly and an insulating exterior resin covering the capacitor element assembly. Here, the capacitor element assembly includes a capacitor element, a 1 st bus bar connected to one end surface electrode of the capacitor element, and a 2 nd bus bar connected to the other end surface electrode of the capacitor element. The 1 st bus bar has a 1 st connecting terminal portion formed at one end portion of the 1 st bus bar, exposed from one surface of the exterior resin, and connected to an external terminal, and the 2 nd bus bar has a 2 nd connecting terminal portion formed at one end portion of the 2 nd bus bar, exposed from the one surface of the exterior resin, and connected to an external terminal. On the one surface of the exterior resin, a raised portion raised from the one surface is present on a path connecting the 1 st connection terminal portion and the 2 nd connection terminal portion, and the raised portion is formed integrally with the exterior resin.
ADVANTAGEOUS EFFECTS OF INVENTION
According to the present invention, it is possible to provide a capacitor capable of preventing occurrence of a leakage current path between connection terminal portions which are different in polarity.
The effects and significance of the present invention will become more apparent from the following description of the embodiments. However, the embodiments described below are merely examples for implementing the present invention, and the present invention is not limited to the descriptions of the embodiments described below.
Drawings
Fig. 1 is a perspective view of a film capacitor according to an embodiment.
Fig. 2 is a perspective view of 2 capacitor element packages before being covered with an outer coating resin according to the embodiment.
Fig. 3 is a perspective view of 2 capacitor element modules in an upside-down state according to the embodiment.
Fig. 4 is an exploded perspective view of the capacitor element assembly according to the embodiment.
Fig. 5 is a longitudinal sectional view of a front portion of the film capacitor cut at positions of a left connection terminal portion and a right connection terminal portion of one capacitor element assembly according to the embodiment.
Fig. 6(a) is a front view of a molding box in a state of accommodating 2 capacitor element modules according to the embodiment, and fig. 6(b) is a longitudinal sectional view of a front portion of the molding box cut along line a-a' of fig. 6(a) according to the embodiment.
Fig. 7 is a vertical sectional view of a molding box cut along line B-B' of fig. 6(a) according to the embodiment.
Fig. 8(a) is a perspective view of the front portion of the film capacitor according to modification 1, and fig. 8(b) is a perspective view of the front portion of the film capacitor according to modification 2.
Fig. 9(a) to (c) are front views of film capacitors according to other modifications.
Detailed Description
A film capacitor 1 according to an embodiment of the capacitor of the present invention will be described below with reference to the drawings. For convenience, the front-back, left-right, and up-down directions are appropriately shown in the drawings. In addition, the illustrated directions only indicate relative directions of the film capacitors 1, and do not indicate absolute directions.
In the present embodiment, the thin film capacitor 1 corresponds to "a capacitor" described in the scope of claims. The front surface 20a corresponds to "one surface" described in the scope of claims. The 1 st raised part 21 and the 2 nd raised part 22 correspond to "raised parts" described in the scope of claims. The left end face electrode 111 corresponds to "one end face electrode" described in the scope of claims, and the right end face electrode 112 corresponds to "the other end face electrode" described in the scope of claims. Further, the left bus bar 200 corresponds to the "1 st bus bar" described in the scope of claims, and the right bus bar 300 corresponds to the "2 nd bus bar" described in the scope of claims. Further, the left connecting terminal portion 220 corresponds to the "1 st connecting terminal portion" described in the scope of claims, and the right connecting terminal portion 320 corresponds to the "2 nd connecting terminal portion" described in the scope of claims.
However, the above description is only for the purpose of associating the structure of the scope of the claims with the structure of the embodiment, and the invention described in the scope of the claims is not limited to the structure of the embodiment because of the above association.
Fig. 1 is a perspective view of a film capacitor 1 according to the present embodiment. Fig. 2 is a perspective view of 2 capacitor element packages 10 before being covered with the outer resin 20 according to the present embodiment. Fig. 3 is a perspective view of 2 capacitor element modules 10 in the upside-down state according to the present embodiment. Fig. 4 is an exploded perspective view of the capacitor element assembly 10 according to the present embodiment. Fig. 5 is a longitudinal sectional view of the front portion of the film capacitor 1 cut at the positions of the left connection terminal portion 220 and the right connection terminal portion 320 of one capacitor element assembly 10 according to the present embodiment. In addition, in fig. 5, the film capacitor 1 is depicted in a state where its front surface is upward.
The film capacitor 1 includes 2 capacitor element modules 10 arranged in the left-right direction, and an outer resin 20 covering the capacitor element modules 10.
The capacitor element assembly 10 includes a capacitor element group 100, a left bus bar 200, a right bus bar 300, 2 upper spacers 400, and 2 lower spacers 500.
The capacitor element group 100 is composed of a plurality of capacitor elements 110 arranged in the vertical and lateral directions. In the present embodiment, the capacitor element group 100 is composed of 40 capacitor elements 110. The capacitor elements 110 are stacked up and down in 6 stages, and 7 capacitor elements 110 are arranged in front and back in the central 4 stages, and 6 capacitor elements 110 are arranged in front and back in the uppermost and lowermost stages. Both end surfaces of each capacitor element 110 face in the left-right direction.
The capacitor element 110 is formed by stacking 2 metallized films obtained by depositing aluminum on a dielectric film, winding or laminating the stacked metallized films, and pressing the films into a flat shape. In capacitor element 110, left end face electrode 111 is formed on the left end face by sputtering of a metal such as zinc, and right end face electrode 112 is formed on the right end face by sputtering of a metal such as zinc.
The capacitor element 110 may be formed of a metallized film obtained by depositing another metal such as zinc or magnesium, in addition to a metallized film obtained by depositing aluminum on a dielectric film. Alternatively, the capacitor element 110 may be formed of a metallized film obtained by depositing a plurality of metals among these metals, or may be formed of a metallized film obtained by depositing an alloy of these metals.
The left bus bar 200 is composed of a left bus bar main body 210 and 2 left connection terminal portions 220. The left bus bar main body 210 is formed of a conductive material, such as a copper plate, and includes a left electrode terminal portion 211 and a left terminal mounting portion 212. The left bus bar body 210 is formed by, for example, appropriately cutting and bending a single copper plate, and the left electrode terminal 211 and the left terminal mounting portion 212 are integrated.
The left electrode terminal portion 211 has a substantially rectangular shape, and covers the left end surface electrode 111 of each capacitor element 110. The left electrode terminal 211 has 24 openings 213 arranged in the front-back direction and the vertical direction. Further, in the left electrode terminal portion 211, a pair of electrode pins 214 are formed at the upper end edge, the lower end edge, and the rear end edge thereof, and the upper edge of each opening portion 213 corresponding to the left end surface electrode 111 of each capacitor element 110.
The left terminal mounting portion 212 extends rightward from the front end edge of the left electrode terminal portion 211, and covers the peripheral surfaces of the front 4 capacitor elements 110. The lower portion of the left terminal mounting portion 212 largely protrudes to the right, and the protruding portions 212a are arranged in the vertical direction to form 2 insertion holes 215 for mounting the left connection terminal portion 220 (see fig. 5).
The left connection terminal portion 220 is formed of a conductive material such as copper, and has a substantially cylindrical shape. A 1 st screw hole 221 having a female screw is formed in a front surface of the left connection terminal portion 220. In addition, a 2 nd screw hole 222 (refer to fig. 5) formed with a female screw is formed at the rear of the left connection terminal part 220. The 2 nd screw hole 222 is smaller than the 1 st screw hole 221 and connected to the 1 st screw hole 221. Further, in the left connecting terminal portion 220, an annular 1 st flange portion 223 and an annular 2 nd flange portion 224 are provided on the circumferential surface of the rear portion, and a recessed portion 225 recessed toward the center side (in the direction along the front surface 20a of the exterior resin 20) of the left connecting terminal portion 220 is formed between the 1 st flange portion 223 and the 2 nd flange portion 224.
The left terminal mounting portion 212 is disposed such that 2 left connection terminal portions 220 are arranged in the vertical direction to be close to each other. The 2 nd screw hole 222 of each left connecting terminal portion 220 is matched with each insertion hole 215 of the left terminal mounting portion 212. The screw 230 is fixed to the 2 nd screw hole 222 through the insertion hole 215, and the left connection terminal portions 220 are fixed to the left terminal mounting portion 212. Further, each of the left connecting terminal portions 220 and the left terminal mounting portion 212 are also fixed by soldering.
The right bus bar 300 is composed of a right bus bar main body 310 and 2 right connection terminal portions 320. The right bus bar main body 310 is formed of a conductive material such as a copper plate, and includes a right electrode terminal portion 311 and a right terminal mounting portion 312. The right bus bar main body 310 is formed by, for example, appropriately cutting and bending a single copper plate, and the right electrode terminal 311 and the right terminal mounting portion 312 are integrated.
The right electrode terminal portion 311 has a substantially rectangular shape, and covers the right end surface electrode 112 of each capacitor element 110. In the right electrode terminal portion 311, 24 openings 313 are formed in a row in the front-back direction and the up-down direction. In the right electrode terminal portion 311, a pair of electrode pins 314 are formed at the upper end edge, the lower end edge, and the rear end edge thereof, and the upper edge of each opening portion 313, corresponding to the right end surface electrode 112 of each capacitor element 110.
The right terminal mounting portion 312 extends leftward from the front end edge of the right electrode terminal portion 311, and covers the peripheral surfaces of the front 4 capacitor elements 110. The right terminal mounting portion 312 largely projects at its upper portion to the left, and 2 insertion holes 315 (see fig. 5) for mounting the right connection terminal portion 320 are formed in the projecting portion 312a in a vertically aligned manner.
Right connecting terminal portion 320 has the same configuration as left connecting terminal portion 220, and includes 1 st screw hole 321, 2 nd screw hole 322, 1 st flange portion 323, 2 nd flange portion 324, and recessed portion 325. The right terminal mounting portions 312 are disposed so as to be adjacent to each other and arranged in the vertical direction, and the right connection terminal portions 320 are disposed in the vertical direction. Each right connection terminal portion 320 is fixed to the right terminal mounting portion 312 by a screw 330. Further, the right connecting terminal portion 320 and the right terminal mounting portion 312 are also fixed by soldering.
The left bus bar 200 is electrically connected to the left end surface electrode 111 of each capacitor element 110 by soldering each electrode pin 214 of the left electrode terminal portion 211 to the left end surface electrode 111 with solder S. The right bus bar 300 is electrically connected to the right end surface electrode 112 of each capacitor element 110 by soldering each electrode pin 314 of the right electrode terminal portion 311 to the right end surface electrode 112 with solder S. The capacitor element group 100, the left bus bar 200, and the right bus bar 300 are bonded by the solder S.
The 2 left connection terminal portions 220 and the 2 right connection terminal portions 320 are arranged in a straight line up and down with a sufficient insulation distance left on the front side of the capacitor element assembly 10. Left connection terminal portion 220 and right connection terminal portion 320 have opposite polarities.
The 2 upper spacers 400 are disposed on the capacitor elements 110 at the foremost and rearmost parts of the uppermost stage of the capacitor element group 100. Further, 2 lower spacers 500 are disposed under capacitor elements 110 at the forefront and rearmost of the lowermost stage of capacitor element group 100.
The exterior resin 20 is formed of a thermosetting resin such as an epoxy resin, and protects the 2 capacitor element assemblies 10 from moisture and impact. Further, the exterior resin 20 has insulation properties.
The outer shape of the outer resin 20 has a substantially rectangular parallelepiped shape. From front surface 20a of outer package resin 20, 2 left connection terminal portions 220 and 2 right connection terminal portions 320 of left capacitor element assembly 10 and 2 left connection terminal portions 220 and 2 right connection terminal portions 320 of right capacitor element assembly 10 are exposed forward. The 4 upper spacers 400 are partially exposed upward from the upper surface 20b of the outer resin package 20, and the 4 lower spacers 500 are entirely embedded in the outer resin package 20.
External terminals (not shown) are connected to left connection terminal portion 220 and right connection terminal portion 320 exposed from outer resin 20. At this time, a screw (not shown) for connecting the external terminal to the 1 st screw hole 221 of the left connection terminal portion 220 is fixed, and a screw (not shown) for connecting the external terminal to the 1 st screw hole 321 of the right connection terminal portion 320 is fixed.
On the front surface 20a of the exterior resin 20, a 1 st rising portion 21 rising from the front surface 20a to surround 2 left connection terminal portions 220 and a 2 nd rising portion 22 rising from the front surface 20a to surround 2 right connection terminal portions 320 are formed. The 1 st raised part 21 and the 2 nd raised part 22 are formed in an elongated circular shape that is long in the vertical direction when viewed from the front. As a result, a part of the 1 st bump portion 21 and a part of the 2 nd bump portion 22 are present on a path connecting the left connection terminal portion 220 and the right connection terminal portion 320 which are different in polarity from each other in the capacitor element assembly 10 on the left side and a path connecting the left connection terminal portion 220 and the right connection terminal portion 320 which are different in polarity from each other in the capacitor element assembly 10 on the right side. In addition, although the left connection terminal portion 220 of the left capacitor element assembly 10 and the left connection terminal portion 220 or the right connection terminal portion 320 of the right capacitor element assembly 10 are made to have different polarities, a part of the 1 st bump portion 21 and a part of the 2 nd bump portion 22 are present on a path connecting these portions. Further, although the right connection terminal portion 320 of the left capacitor element assembly 10 is different in polarity from the left connection terminal portion 220 or the right connection terminal portion 320 of the right capacitor element assembly 10, a part of the 1 st bump portion 21 and a part of the 2 nd bump portion 22 are present on a path connecting these portions.
As shown in fig. 5, when the film capacitor 1 is installed at the installation site of the vehicle or the like so that the front surface 20a of the exterior resin 20 is located at the upper side, foreign matter such as dust, dew condensation water, or the like is likely to be deposited on the front surface 20a of the exterior resin 20. However, since the 1 st raised portion 21 and the 2 nd raised portion 22 are present on the route connecting the 2 left connection terminal portions 220 and the 2 right connection terminal portions 320 on the front surface 20a of the exterior resin 20, even if foreign matter is accumulated on the route, the foreign matter is cut by the level difference between the front surface 20a of the exterior resin 20 and the 1 st raised portion 21 and the 2 nd raised portion 22. Accordingly, the left connection terminal portion 220 and the right connection terminal portion 320 are less likely to be electrically connected by a foreign substance.
Similarly, the left and right connection terminals 220 and 320 of one capacitor element assembly 10 and the left and right connection terminals 220 and 320 of the other capacitor element assembly 10 are also less likely to be electrically connected by a foreign substance.
Here, the 1 st raised part 21 comes into contact with the outer peripheral surface of the left connection terminal part 220, and the resin constituting the 1 st raised part 21 enters the recessed part 225 of the left connection terminal part 220. Accordingly, even if left connection terminal portion 220 receives a force in a direction of coming out from outer package resin 20, since 2 nd flange portion 224 is caught by the resin entering recess portion 225, left connection terminal portion 220 is less likely to move in a direction of coming out from outer package resin 20. Similarly, the 2 nd raised portion 22 contacts the outer peripheral surface of the right connection terminal portion 320, and the resin constituting the 2 nd raised portion 22 enters the recessed portion 325 of the right connection terminal portion 320. Therefore, the right connection terminal portion 320 is also less likely to move in a direction of separating from the exterior resin 20.
Next, an example of a method (process) of forming the exterior resin 20 around the 2 capacitor element packages 10 will be described.
Fig. 6(a) is a front view of the molding box 2 in a state of accommodating 2 capacitor element assemblies 10 according to the present embodiment, and fig. 6(b) is a longitudinal sectional view of a front portion of the molding box 2 cut along line a-a' of fig. 6(a) according to the present embodiment. Fig. 7 is a vertical sectional view of the molding box 2 cut along line B-B' of fig. 6(a) according to the present embodiment.
In order to cover 2 capacitor element packages 10 with the outer coating resin 20, a molding box 2 filled with a thermosetting resin in a molten state is used.
The molding box 2 is formed into a substantially rectangular parallelepiped box shape by a front panel 610, a rear panel 620, a bottom panel 630, a left panel 640, and a right panel 650, which are made of a metal material such as aluminum, and has an open upper surface. In the housing chamber 2a inside the molding box 2, 2 capacitor element assemblies 10 are housed in a left-right array with a predetermined gap. The housing chamber 2a is larger than the size of the 2 capacitor element packages 10 to be housed by the thickness of the outer resin 20.
A 1 st recess 611 for forming the 1 st raised part 21 and a 2 nd recess 612 for forming the 2 nd raised part 22 are formed behind the front panel 610. Further, 21 st insertion holes 613 slightly larger than the outer diameter of the left connection terminal portion 220 are formed in a vertical array on the bottom surface 611a of the 1 st recessed portion 611, and 2 nd insertion holes 614 slightly larger than the outer diameter of the right connection terminal portion 320 are formed in a vertical array on the bottom surface 612a of the 2 nd recessed portion 612.
2 capacitor element modules 10 are accommodated in the accommodating chamber 2a of the molding box 2 to which the front plate 610 is not attached. In this case, the left connection terminal portion 220 and the right connection terminal portion 320 of the capacitor element assembly 10 face the front side surface of the housing chamber 2a (the molded case 2). And then the front panel 610 is installed from the front. The 2 left connection terminal portions 220 are inserted into the 1 st insertion holes 613, and the 2 right connection terminal portions 320 are inserted into the 2 nd insertion holes 614. The thickness of the front panel 610 is set so that the inserted left and right connection terminal portions 220 and 320 do not protrude from the front panel 610. Screws 660 are fixed to 1 st screw hole 221 of left connection terminal portion 220 and 1 st screw hole 321 of right connection terminal portion 320, and screws 660 fasten left connection terminal portion 220 and right connection terminal portion 320 forward, so that the front surface of 1 st flange portion 223 of left connection terminal portion 220 is strongly in close contact with bottom surface 611a of 1 st recess portion 611, and the front surface of 1 st flange portion 323 of right connection terminal portion 320 is strongly in close contact with bottom surface 612a of 2 nd recess portion 612.
A gap into which molten resin enters is formed between each capacitor element assembly 10 housed in the housing chamber 2a and the bottom plate 630 of the molding box 2 by the lower spacer 500.
In the molding box 2, after the front panel 610 is mounted, a front fixing strip 670 and a rear fixing strip 680 are built between the left side panel 640 and the right side panel 650 at the front and rear of the upper surface thereof. Front fixing bar 670 has recessed portions 671 into which the upper portions of front 2 upper spacers 400 disposed on capacitor element group 100 are fitted, and presses these upper spacers 400 from above. Rear fixing bar 680 has concave portions 681 into which the upper portions of rear 2 upper spacers 400 disposed in capacitor element group 100 are fitted, and presses upper spacers 400 from above.
Resin in a molten state is injected from above into the housing chamber 2a of the molding box 2 in which 2 capacitor element assemblies 10 are placed, and the housing chamber 2a is filled with the resin to a position shown by a chain line in fig. 7, that is, a position slightly lower than the front fixing bar 670 and the rear fixing bar 680 and burying the capacitor element group 100. The resin enters the 1 st concave part 611 to form the 1 st convex part 21, and the resin enters the 2 nd concave part 612 to form the 2 nd convex part 22.
At this time, the 1 st flange portion 223 of the left connection terminal portion 220 strongly adheres to the bottom surface 611a of the 1 st recess portion 611, and the 1 st flange portion 323 of the right connection terminal portion 320 strongly adheres to the bottom surface 612a of the 2 nd recess portion 612, whereby the resin is prevented from leaking to the outside through the 1 st insertion hole 613 and the 2 nd insertion hole 614. Further, a plurality of projections 501 are formed on the lower surface of the lower spacer 500, and the resin passes between these projections 501, whereby the flow of the resin can be suppressed from being obstructed by the lower spacer 500. Further, since 2 capacitor element assemblies 10 are pressed from above by front fixing bar 670 and rear fixing bar 680 via 4 upper spacers 400, it is possible to prevent the 2 capacitor element assemblies 10 immersed in the molten resin, particularly the rear portions thereof, from floating upward.
When the housing chamber 2a is filled with a thermosetting resin, the molding box 2 is heated. The resin is thereby hardened, and the exterior resin 20 having the 1 st raised part 21 and the 2 nd raised part 22 is formed. After that, the film capacitor 1 in which the formation of the exterior resin 20 is completed is removed from the molding case 2.
In the present embodiment, by using the molding box 2 having the above-described configuration, the outer resin 20 having the 1 st raised part 21 and the 2 nd raised part 22 can be easily formed only by injecting a thermosetting resin from above into the molding box 2 in which the capacitor element assembly 10 is placed.
< effects of the embodiment >
As described above, according to the present embodiment, the following effects are obtained.
Even if a foreign matter is accumulated on the path connecting the 2 left connection terminal portions 220 and the 2 right connection terminal portions 320, the foreign matter is broken by the level difference between the front surface 20a of the exterior resin 20 and the 1 st raised portion 21 and the 2 nd raised portion 22, and the left connection terminal portions 220 and the right connection terminal portions 320 are hard to be electrically connected by the foreign matter. For this reason, when the film capacitor 1 is used, a leakage flow path can be prevented from being generated between the left connection terminal portion 220 and the right connection terminal portion 320. Similarly, the left and right connection terminals 220 and 320 of one capacitor element assembly 10 and the left and right connection terminals 220 and 320 of the other capacitor element assembly 10 are not easily electrically connected to each other by a foreign object, and a leak path therebetween can be prevented.
Further, since the 1 st raised part 21 and the 2 nd raised part 22 are formed integrally with the exterior resin 20, it is not necessary to separately manufacture the components corresponding to the 1 st raised part 21 and the 2 nd raised part 22 with insulating materials and equip the components to the left connection terminal portion 220 and the right connection terminal portion 320, and an increase in the number of components and manufacturing man-hours can be avoided.
Further, since the resin constituting the 1 st raised portion 21 enters the recessed portion 225 of the left connection terminal portion 220 and the resin constituting the 2 nd raised portion 22 enters the recessed portion 325 of the right connection terminal portion 320, the 2 nd flange portions 224 and 324 are caught by the resin entering the recessed portions 225 and 325, and the left connection terminal portion 220 and the right connection terminal portion 320 are hard to move in a direction of coming off from the exterior resin 20. This prevents deformation and damage of the left and right bus bars 200 and 300 due to movement of the left and right connection terminal portions 220 and 320.
The embodiments of the present invention have been described above, but the present invention is not limited to the above embodiments, and various modifications other than the above embodiments are possible in the application examples of the present invention.
< modification example 1>
Fig. 8(a) is a perspective view of the front portion of the film capacitor 1 according to the modification 1.
In the present modification, on the front surface 20a of the exterior resin 20, the 3 rd bulging portion 23 in the shape of an oval ring is formed integrally with the exterior resin 20 so as to surround 2 left connection terminal portions 220. Similarly, the 4 th bulging portion 24 in an oblong annular shape is formed integrally with the exterior resin 20 so as to surround the 2 right connection terminal portions 320.
In the case of the configuration of the present modification, since the 3 rd bump 23 and the 4 th bump 24 are present on the front surface 20a of the exterior resin 20 on the path connecting the 2 left connection terminal portions 220 and the 2 right connection terminal portions 320, even if foreign matter such as dust is accumulated on the path, the foreign matter is divided by the level difference between the front surface 20a of the exterior resin 20 and the 3 rd bump 23 and the 4 th bump 24. This makes it difficult for the left and right connection terminals 220 and 320 to be electrically connected by a foreign substance. It is possible to prevent a leakage flow path from being generated between the left and right connection terminal portions 220 and 320.
Similarly, the left and right connection terminals 220 and 320 of one capacitor element assembly 10 and the left and right connection terminals 220 and 320 of the other capacitor element assembly 10 are also less likely to be electrically connected by a foreign substance, and the occurrence of leakage current paths therebetween can be prevented.
In the present modification, the 3 rd raised part 23 and the 4 th raised part 24 correspond to the "raised part" described in the scope of claims.
< modification example 2>
Fig. 8(b) is a perspective view of the front part of the film capacitor 1 according to the modification 2.
In the present modification, front surface 20a of outer resin 20 is formed integrally with outer resin 20 at a rib-shaped 5 th bump 25 extending in the left-right direction at a position between 2 left connection terminal portions 220 and 2 right connection terminal portions 320. Similarly, rib-shaped 6 th bump 26 extending in the vertical direction is formed integrally with outer package resin 20 at an intermediate position between 2 left connecting terminal portions 220 of one capacitor element assembly 10 and 2 left connecting terminal portions 220 of the other capacitor element assembly 10, and at an intermediate position between 2 right connecting terminal portions 320 of one capacitor element assembly 10 and 2 right connecting terminal portions 320 of the other capacitor element assembly 10. The 25 th ridge portions 25 and the 26 th ridge portions 26 are connected at the center portion of the front surface 20a of the exterior resin 20 to form a cross shape.
In the case of the configuration of the present modification, since the 5 th bulging portion 25 is present on the front surface 20a of the exterior resin 20 on the path connecting the 2 left connection terminal portions 220 and the 2 right connection terminal portions 320, even if foreign matter such as dust is accumulated on the path, the foreign matter is divided by the level difference between the front surface 20a of the exterior resin 20 and the 5 th bulging portion 25. This makes it difficult for the left and right connection terminals 220 and 320 to be electrically connected by a foreign substance. It is possible to prevent a leakage flow path from being generated between the left and right connection terminal portions 220 and 320.
Similarly, by providing the 6 th bump 26 between the left connection terminal portion 220 and the right connection terminal portion 320 of one capacitor element assembly 10 and the left connection terminal portion 220 and the right connection terminal portion 320 of the other capacitor element assembly 10, it is difficult to bring the electric connection state by a foreign substance, and it is possible to prevent the occurrence of a leak path between them.
In the present modification, the 5 th bump 25 corresponds to the "bump" described in the scope of claims.
< other modifications >
In the above embodiment, the film capacitor 1 includes 2 capacitor element assemblies 10. The film capacitor 1 may have 1 capacitor element assembly 10. Alternatively, the film capacitor 1 may include 3 or more capacitor element assemblies 10.
In the above embodiment, in the capacitor element assembly 10, 2 left connecting terminal portions 220 are arranged adjacent to each other and aligned with each other in the left bus bar 200, and 2 right connecting terminal portions 320 are arranged adjacent to each other and aligned with each other in the right bus bar 300. However, the arrangement of the left connection terminal portions 220 and the right connection terminal portions 320 may be any arrangement, and for example, as shown in fig. 9(a) to (c), in the capacitor element assembly 10, 2 left connection terminal portions 220 of the left bus bar 200 and 2 right connection terminal portions 320 of the right bus bar may be alternately arranged in the vertical direction. In this case, as shown in fig. 9(a), the 1 st raised portion 21 is formed around each of the left connection terminal portions 220, and the 2 nd raised portion 22 is formed around each of the right connection terminal portions 320. As shown in fig. 9(b), the 3 rd raised portion 23 may be formed around each left connection terminal portion 220, and the 4 th raised portion 24 may be formed around each right connection terminal portion 320. Further, as shown in fig. 9(c), the 5 th bump 25 may be formed between the left connecting terminal portion 220 and the right connecting terminal portion 320 which are alternately arranged. In the case of the configuration of fig. 9(a) and (b), any one of the 1 st raised part 21 and the 2 nd raised part 22 may not be provided, or any one of the 3 rd raised part 23 and the 4 th raised part 24 may not be provided. Fig. 9(a) to (c) are front views of the film capacitor 1 according to another modification. The film capacitor 1 of the present modification includes 1 capacitor element assembly 10, but may include a plurality of capacitor element assemblies 10.
Further, the number of the left connecting terminal portions 220 provided to the left bus bar 200 may be 1 instead of a plurality of the left connecting terminal portions, and the number of the right connecting terminal portions 320 provided to the right bus bar 300 may be 1 instead of a plurality of the right connecting terminal portions.
Further, in the above embodiment, the left and right connection terminal portions 220 and 320 are formed in a substantially cylindrical shape. The shapes of the left and right connection terminal portions 220 and 320 may be any shapes. However, it is desirable that the 1 st flange portions 223 and 323 and the 2 nd flange portions 224 and 324 can be easily formed.
Further, in the above embodiment, in the left bus bar 200, the left connection terminal portion 220 is constituted by a member different from the left bus bar main body 210. Similarly, in the right bus bar 300, the right connection terminal portion 320 is constituted by a member different from the right bus bar main body 310. However, the left connection terminal portion 220 and the left bus bar main body 210 may be formed integrally by 1 member, and the right connection terminal portion 320 and the right bus bar main body 310 may be formed integrally by 1 member.
Further, the number of capacitor elements 110 constituting the capacitor element group 100 may be any number. The number of capacitor elements 110 included in the capacitor element assembly 10 may be 1 instead of a plurality of capacitor elements as in the case of the capacitor element assembly 100.
Further, in the above embodiment, the capacitor element 110 is formed by stacking 2 metallized films obtained by depositing aluminum on a dielectric film and winding or laminating the stacked metallized films, but alternatively, the capacitor element 110 may be formed by stacking metallized films obtained by depositing aluminum on both surfaces of a dielectric film and an insulating film and winding or laminating them.
In the above embodiment, the thin film capacitor 1 is given as an example of the capacitor of the present invention. However, the present invention can be applied to capacitors other than the film capacitor 1.
The embodiments of the present invention can be modified in various ways within the scope of the technical idea described in the claims.
In the description of the above embodiments, the terms "upper" and "lower" and the like indicating directions indicate relative directions depending only on relative positional relationships of constituent members, and do not indicate absolute directions such as vertical directions and horizontal directions.
Industrial applicability
The present invention is useful for capacitors used in various electronic devices, electrical devices, industrial devices, electric devices of vehicles, and the like.
Description of reference numerals
1 thin film capacitor (condenser);
10 a capacitor element assembly;
20 outer packaging resin;
20a front surface (one side);
21 st raised part (raised part);
22 nd raised part (raised part);
23 rd 3 raised part (raised part);
24 th bump (bump);
25 th bump (bump);
100 capacitor element groups;
110 a capacitor element;
111 left end face electrode (one end face electrode);
112 right end face electrode (the other end face electrode);
200 left bus bar (1 st bus bar);
220 left connection terminal portion (1 st connection terminal portion);
225 a recessed portion;
300 right bus bar (2 nd bus bar);
320 right connection terminal portion (2 nd connection terminal portion);
325 recessed portion.
Claims (4)
1. A capacitor is provided with:
a capacitor element assembly; and
an insulating outer resin covering two or more surfaces of the capacitor element package,
the capacitor element assembly includes:
a capacitor element;
a 1 st bus bar connected to one end surface electrode of the capacitor element; and
a 2 nd bus bar connected to the other end face electrode of the capacitor element,
the 1 st bus bar has a 1 st connecting terminal portion formed at one end portion of the 1 st bus bar, exposed from one surface of the exterior resin, and connected to an external terminal,
the 2 nd bus bar has a 2 nd connecting terminal portion formed at one end portion of the 2 nd bus bar, exposed from the one surface of the exterior resin, and connected to an external terminal,
a raised portion raised from the one surface of the exterior resin is present on a path connecting the 1 st connection terminal portion and the 2 nd connection terminal portion,
the bulging portion is formed integrally with the exterior resin,
the raised portion is located between the 1 st connecting terminal portion and the 2 nd connecting terminal portion, and has a rib shape extending in a direction intersecting with an arrangement direction of the 1 st connecting terminal portion and the 2 nd connecting terminal portion.
2. The capacitor of claim 1, wherein,
the ridge portion is formed so as to surround at least one of the 1 st connection terminal portion and the 2 nd connection terminal portion.
3. The capacitor of claim 2, wherein,
the raised part is contacted with the outer surface of the at least one connecting terminal part,
a concave portion that is concave in a direction along the one surface of the exterior resin is formed on the outer surface of the at least one connection terminal portion,
the resin constituting the ridge portion enters the depression portion.
4. A capacitor is provided with:
a capacitor element assembly; and
an insulating outer resin covering two or more surfaces of the capacitor element package,
the capacitor element assembly includes:
a capacitor element;
a 1 st bus bar connected to one end surface electrode of the capacitor element; and
a 2 nd bus bar connected to the other end face electrode of the capacitor element,
the 1 st bus bar has a 1 st connecting terminal portion formed at one end portion of the 1 st bus bar, exposed from one surface of the exterior resin, and connected to an external terminal,
the 2 nd bus bar has a 2 nd connecting terminal portion formed at one end portion of the 2 nd bus bar, exposed from the one surface of the exterior resin, and connected to an external terminal,
a raised portion raised from the one surface of the exterior resin is present on a path connecting the 1 st connection terminal portion and the 2 nd connection terminal portion,
the bulging portion is formed integrally with the exterior resin,
the raised portion is formed so as to surround at least one of the 1 st connection terminal portion and the 2 nd connection terminal portion,
the raised part is contacted with the outer surface of the at least one connecting terminal part,
a concave portion that is concave in a direction along the one surface of the exterior resin is formed on the outer surface of the at least one connection terminal portion,
the resin constituting the ridge portion enters the depression portion.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016-205822 | 2016-10-20 | ||
| JP2016205822 | 2016-10-20 | ||
| PCT/JP2017/034234 WO2018074138A1 (en) | 2016-10-20 | 2017-09-22 | Capacitor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109844880A CN109844880A (en) | 2019-06-04 |
| CN109844880B true CN109844880B (en) | 2021-04-23 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201780062986.7A Active CN109844880B (en) | 2016-10-20 | 2017-09-22 | Capacitor with a capacitor element |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2018074138A1 (en) |
| CN (1) | CN109844880B (en) |
| WO (1) | WO2018074138A1 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7079184B2 (en) * | 2018-10-31 | 2022-06-01 | ニチコン株式会社 | Film capacitors and capacitor units |
| JP7175721B2 (en) * | 2018-11-12 | 2022-11-21 | ニチコン株式会社 | Molding method for film capacitor and its mold |
| EP4120298A4 (en) | 2020-04-28 | 2024-05-22 | Murata Manufacturing Co., Ltd. | Capacitor module |
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- 2017-09-22 WO PCT/JP2017/034234 patent/WO2018074138A1/en active Application Filing
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Also Published As
| Publication number | Publication date |
|---|---|
| CN109844880A (en) | 2019-06-04 |
| WO2018074138A1 (en) | 2018-04-26 |
| JPWO2018074138A1 (en) | 2019-08-22 |
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