JP2019007032A5 - - Google Patents

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JP2019007032A5
JP2019007032A5 JP2017120821A JP2017120821A JP2019007032A5 JP 2019007032 A5 JP2019007032 A5 JP 2019007032A5 JP 2017120821 A JP2017120821 A JP 2017120821A JP 2017120821 A JP2017120821 A JP 2017120821A JP 2019007032 A5 JP2019007032 A5 JP 2019007032A5
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Prior art keywords
slurry
nickel
mass
organic
producing
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JP2017120821A
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JP7091611B2 (en
JP2019007032A (en
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Claims (13)

液相法により作製した粒径100nm未満のニッケル微粒子に水を添加して水スラリーを製造する水スラリー製造工程と、
前記水スラリーに、有機溶剤と分散移行促進剤を添加して、該有機溶剤のスラリーに置換して有機スラリーを製造する有機スラリー製造工程と、
前記有機スラリーに、分散剤の存在下、100MPa以上の圧力下で分散処理を施す高圧分散工程と、
分散処理を施した前記有機スラリーをペースト化するペースト化工程と、を有する
ニッケルペーストの製造方法。
A water slurry producing step of producing water slurry by adding water to nickel fine particles having a particle size of less than 100 nm produced by a liquid phase method;
In the water slurry, an organic solvent and a dispersion migration accelerator are added, and an organic slurry production step of producing an organic slurry by substituting with a slurry of the organic solvent,
A high pressure dispersion step of subjecting the organic slurry to a dispersion treatment in the presence of a dispersant under a pressure of 100 MPa or more;
A method of manufacturing a nickel paste, comprising: a paste forming step of forming the dispersion-treated organic slurry into a paste.
前記水スラリー製造工程において、前記ニッケル微粒子に、前記水スラリー中の水含有量が30質量%以上90質量%以下となるように水を添加する
請求項1に記載のニッケルペーストの製造方法。
The method for producing a nickel paste according to claim 1, wherein in the water slurry production step, water is added to the nickel fine particles so that the water content in the water slurry is 30% by mass or more and 90% by mass or less.
前記有機スラリー製造工程において、前記水スラリーに、前記ニッケル微粒子100質量%に対して10質量%以上70質量%以下の有機溶剤を添加する
請求項1又は2に記載のニッケルペーストの製造方法。
The method for producing a nickel paste according to claim 1, wherein in the organic slurry production step, an organic solvent of 10% by mass or more and 70% by mass or less is added to 100% by mass of the nickel fine particles in the water slurry.
前記有機スラリー製造工程において、前記水スラリーに、前記ニッケル微粒子100質量%に対して0.1質量%以上3質量%以下の分散移行促進剤を添加する
請求項1乃至3のいずれか1項に記載のニッケルペーストの製造方法。
In the said organic-slurry manufacturing process, 0.1 mass% or more and 3 mass% or less of a dispersion migration promoter are added to said water slurry with respect to 100 mass% of said nickel fine particles. A method for producing the nickel paste described.
前記高圧分散工程において、酸化剤の存在下で分散処理を施す
請求項1乃至4のいずれか1項に記載のニッケルペーストの製造方法。
The method for producing a nickel paste according to claim 1, wherein in the high-pressure dispersion step, the dispersion treatment is performed in the presence of an oxidizing agent.
前記高圧分散工程において、前記分散剤を、ニッケル微粒子100質量%に対し、0.01質量%以上5.5質量%以下となる割合で前記有機スラリーに添加する
請求項1乃至5のいずれか1項に記載のニッケルペーストの製造方法。
In the high-pressure dispersion step, the dispersant is added to the organic slurry in a proportion of 0.01% by mass or more and 5.5% by mass or less with respect to 100% by mass of nickel fine particles. Item 2. A method for producing a nickel paste according to item.
前記有機スラリー製造工程において、油中水滴型エマルション型の有機スラリーを製造する
請求項1乃至6のいずれか1項に記載のニッケルペーストの製造方法。
The method for producing a nickel paste according to claim 1, wherein a water-in-oil type emulsion type organic slurry is produced in the organic slurry producing step.
有機スラリー製造工程において得られる有機スラリー中の水含有量は、3質量%以下である
請求項1乃至7のいずれか1項に記載のニッケルペーストの製造方法。
The method for producing a nickel paste according to any one of claims 1 to 7, wherein a water content in the organic slurry obtained in the organic slurry production step is 3% by mass or less.
液相法により作製した粒径100nm未満のニッケル微粒子に水を添加して水スラリーを製造する水スラリー製造工程と、
前記水スラリーに、有機溶剤と分散移行促進剤を添加して、該有機溶剤のスラリーに置換して有機スラリーを製造する有機スラリー製造工程と、
前記有機スラリーに、分散剤の存在下、100MPa以上の圧力下で分散処理を施す高圧分散工程と、を有する
ニッケル有機スラリーの製造方法。
A water slurry producing step of producing water slurry by adding water to nickel fine particles having a particle size of less than 100 nm produced by a liquid phase method;
In the water slurry, an organic solvent and a dispersion migration accelerator are added, and an organic slurry production step of producing an organic slurry by substituting with a slurry of the organic solvent,
A high pressure dispersion step of subjecting the organic slurry to a dispersion treatment in the presence of a dispersant under a pressure of 100 MPa or more.
少なくとも、ニッケル微粒子と、分散移行促進剤とを含有するニッケルペーストであって、
前記ニッケルペーストを膜厚30μmとなるように印刷後、120℃で40分間、空気中で乾燥させ得られた乾燥膜を直径40mmの円板状に切断し、JIS Z−8741に準拠して、入射角45°で測定したグロス値が、150以上である
ニッケルペースト。
At least nickel fine particles, a nickel paste containing a dispersion migration accelerator,
After printing the nickel paste to a film thickness of 30 μm, it was dried in air at 120° C. for 40 minutes, and the obtained dried film was cut into a disc having a diameter of 40 mm, according to JIS Z-8741. A nickel paste whose gloss value measured at an incident angle of 45° is 150 or more.
前記ニッケルペーストをアプリケーター(ギャップ厚5μm)を用いてガラス基板上に塗布後、120℃で5分間、空気中で乾燥させ、作成した膜厚3μmの乾燥膜について、光干渉式表面形状測定装置を用いて測定した場合の表面粗さが0.06μm以下である
請求項10に記載のニッケルペースト。
After applying the nickel paste onto a glass substrate using an applicator (gap thickness 5 μm), it was dried in air at 120° C. for 5 minutes, and a dry film having a thickness of 3 μm was prepared with an optical interference type surface profile measuring device. The nickel paste according to claim 10, which has a surface roughness of 0.06 µm or less when measured by using the nickel paste.
前記ニッケルペーストを膜厚30μmとなるように印刷後、120℃で40分間、空気中で乾燥させ得られた乾燥膜を直径40mmの円板状に切断し、厚み及び質量を測定し、該厚み及び該質量より算出した乾燥膜密度が5g/cm以上である
請求項10又は11に記載のニッケルペースト。
After printing the nickel paste so as to have a film thickness of 30 μm, it was dried in air at 120° C. for 40 minutes, and the obtained dried film was cut into a disc shape having a diameter of 40 mm, and the thickness and mass were measured. And the dry film density calculated from the mass is 5 g/cm 3 or more, The nickel paste according to claim 10.
少なくとも、ニッケル微粒子と、分散移行促進剤とを含有するニッケル有機スラリーであって、At least nickel fine particles, a nickel organic slurry containing a dispersion migration accelerator,
前記ニッケル有機スラリー中に含まれる粒子のメジアン径(DThe median diameter of the particles contained in the nickel organic slurry (D 50Fifty )が700nm以下である) Is less than 700 nm
ニッケル有機スラリー。Nickel organic slurry.
JP2017120821A 2017-06-20 2017-06-20 Nickel paste and its manufacturing method, and nickel organic slurry manufacturing method Active JP7091611B2 (en)

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JP2019007032A JP2019007032A (en) 2019-01-17
JP2019007032A5 true JP2019007032A5 (en) 2020-07-16
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JP7332980B2 (en) * 2019-03-29 2023-08-24 戸田工業株式会社 Non-aqueous dispersion containing barium titanate particles and method for producing the same
CN114694973A (en) * 2022-05-05 2022-07-01 肇庆绿宝石电子科技股份有限公司 Method for preparing conducting polymer by ultrasonic wave and solid capacitor
CN117457389A (en) * 2023-11-29 2024-01-26 广东微容电子科技有限公司 Method for treating ceramic element before printing internal electrode paste

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JPH05299288A (en) * 1992-04-17 1993-11-12 Tokin Corp Manufacture of laminated ceramic capacitor
JP3778074B2 (en) * 2001-10-23 2006-05-24 住友金属鉱山株式会社 Method for producing nickel powder dispersed organic slurry
JP4302453B2 (en) * 2003-07-03 2009-07-29 サカタインクス株式会社 Ni powder dispersion method and Ni powder dispersion obtained by the method
JP4495644B2 (en) * 2004-07-30 2010-07-07 Jfeミネラル株式会社 Metal super fine slurry
JP2006183066A (en) * 2004-12-27 2006-07-13 Sumitomo Metal Mining Co Ltd Nickel powder-dispersed organic slurry and method for producing the same
JP6179274B2 (en) * 2013-08-27 2017-08-16 住友金属鉱山株式会社 Nickel paste manufacturing method and nickel paste
JP6562196B2 (en) * 2014-05-08 2019-08-21 国立大学法人北海道大学 Copper fine particle sintered body and method for producing conductive substrate
WO2016047760A1 (en) * 2014-09-26 2016-03-31 住友金属鉱山株式会社 Nickel paste and nickel paste production method
WO2016125581A1 (en) * 2015-02-06 2016-08-11 国立大学法人北海道大学 Composite fine particles, dispersion liquid, production method and use of said composite fine particles, and production method and use of said dispersion liquid

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