JP2019001147A - Liquid injection head and liquid injection device - Google Patents

Abstract

To provide a liquid injection head capable of suppressing peeling off of a wiring mounting portion due to warpage of a constitution member, and a liquid injection device.SOLUTION: A liquid injection head comprises: head units (4) injecting liquid; flexible cables (29) of which one end portions are fixed to head substrates (45) possessed by the head units; and common members (15, 17) fixed with a plurality of head units. When three directions orthogonal to one another are individually defined as a first direction (Y), a second direction (X) and a third direction (Z), and when the common members are placed on a virtual surface defined by the first direction and the second direction, the third direction becomes a thickness direction and the common members are longer in the first direction than in the second direction. In a plan view from the third direction, a fixing region where the flexible cables and the head substrates are fixed is longer in the second direction than in the first direction.SELECTED DRAWING: Figure 5

Description

  The present invention relates to a liquid ejecting head including a plurality of head units that eject liquid from nozzles, and a liquid ejecting apparatus including the liquid ejecting head.

  As this liquid ejecting head, for example, there is an ink jet recording head used in an image recording apparatus such as an ink jet recording apparatus, but recently, taking advantage of the feature that a very small amount of liquid can be accurately landed at a predetermined position. It is also applied to various manufacturing equipment. For example, a display manufacturing apparatus for manufacturing a color filter such as a liquid crystal display, an electrode forming apparatus for forming an electrode such as an organic EL (Electro Luminescence) display or FED (surface emitting display), a chip for manufacturing a biochip (biochemical element) Applied to manufacturing equipment. The recording head for the image recording apparatus ejects liquid ink, and the color material ejecting head for the display manufacturing apparatus ejects solutions of R (Red), G (Green), and B (Blue) color materials. The electrode material ejecting head for the electrode forming apparatus ejects a liquid electrode material, and the bioorganic matter ejecting head for the chip manufacturing apparatus ejects a bioorganic solution.

  As the above-described liquid jet head, there has been proposed a liquid jet head configured as a longer liquid jet head by arranging a plurality of head units. For example, in Patent Document 1, a plurality of head units are fixed to a fixing plate as a support member with an adhesive, and the fixing plate is attached to a holder member, and as a whole in a predetermined direction (for example, the nozzle row direction). A long recording head is disclosed. Further, one end of a flexible cable for supplying a drive signal to the actuator is connected to the head unit, and the other end of the flexible cable is connected to a circuit board disposed on the holder member. The mounting portion (in other words, the fixed region) between the flexible cable and the head unit and the mounting portion between the flexible cable and the circuit board are each along the longitudinal direction of the liquid jet head. That is, the plurality of terminals in the mounting portion are along the longitudinal direction of the liquid ejecting head. In a liquid ejecting head having such a configuration, warping may occur due to, for example, a difference in coefficient of thermal expansion between constituent members. In particular, warpage tends to be greater in the long direction. And in the structure where the mounting part of the flexible cable which is an electrical contact as described above is along the longitudinal direction of the liquid jet head, there is a problem that the mounting part is likely to be peeled off due to warpage in the longitudinal direction. there were. For this reason, in the liquid jet head of Patent Document 1, a plurality of metal correction plates are provided to prevent warping. This suppresses warping of the liquid ejecting head.

Japanese Patent Laying-Open No. 2015-231722

  In the configuration in which the warp of the liquid jet head is suppressed by the correction plate as described above, the number of parts is increased correspondingly, and there is a problem that the size, shape, and the like of the constituent members are restricted by arranging the correction plate. there were.

  The present invention has been made in view of such circumstances, and an object thereof is to provide a liquid ejecting head and a liquid ejecting apparatus capable of suppressing peeling of a mounting portion of a flexible cable due to warping of constituent members. It is to provide.

The present invention has been proposed to achieve the above object, and a head unit for ejecting liquid;
A flexible cable having one end fixed to a head substrate of the head unit;
A common member to which a plurality of the head units are fixed;
With
When the three directions orthogonal to each other are defined as a first direction, a second direction, and a third direction, respectively, the common member is placed on a virtual plane determined by the first direction and the second direction. The direction is the thickness direction, and is longer in the first direction than in the second direction,
In a plan view from the third direction, a fixed region where the flexible cable and the head substrate are fixed is longer in the second direction than in the first direction.

  According to the present invention, the fixed region where the flexible cable and the head substrate are fixed, that is, the mounting portion of the flexible cable on the head substrate is longer in the second direction than the first direction which is the long direction of the common member. Therefore, even when a common member or another constituent member that is long in the first direction is warped in the first direction, peeling is less likely to occur in the fixed region. For this reason, even if it is a case where members, such as a straightening board for suppressing curvature, are not provided separately, it becomes possible to control poor connection etc. of a mounting part.

The present invention also includes a head unit that ejects liquid;
One end portion is fixed to the head substrate of the head unit, and a flexible cable that supplies a drive signal to the head unit;
A common member to which a plurality of the head units are fixed;
With
When the three directions orthogonal to each other are defined as a first direction, a second direction, and a third direction, respectively, the common member is placed on a virtual plane determined by the first direction and the second direction. The direction is the thickness direction, and is longer in the first direction than in the second direction,
In the flexible cable, a bent portion between a portion along the head substrate and a portion extending in a direction intersecting the head substrate is the second direction rather than the first direction in a plan view from the third direction. It is characterized by being long.

  According to the present invention, in the flexible cable, the bending portion between the portion along the head substrate and the portion extending in the direction intersecting the head substrate is in the second direction rather than the first direction which is the long direction of the common member. Therefore, even when a common member or another constituent member that is long in the first direction is warped in the first direction, the fixing region, that is, the flexible cable mounting portion on the head substrate is hardly peeled off. Become. For this reason, even if it is a case where members, such as a straightening board for suppressing curvature, are not provided separately, it becomes possible to control poor connection etc. of a mounting part.

In each of the above configurations, a circuit board to which the other end of the flexible cable is fixed,
It is desirable to adopt a configuration in which the area where the flexible cable and the circuit board are fixed in the plan view is longer in the second direction than in the first direction.

  According to this configuration, the area where the flexible cable and the circuit board are fixed, that is, the mounting portion of the flexible cable on the circuit board is longer in the second direction than in the first direction. Even when the constituent member that is long in the first direction is warped in the first direction, peeling is less likely to occur in the mounting portion.

In each of the above configurations, a circuit board to which the other end of the flexible cable is fixed,
In the flexible cable, a configuration in which a bent portion between a portion along the circuit board and a portion extending in a direction crossing the circuit board is longer in the second direction than in the first direction is adopted. It is desirable.

  According to this configuration, since the bent portion between the portion along the circuit board and the portion extending in the direction intersecting the circuit board is longer in the second direction than the first direction, the common member or other Even when a component that is long in the first direction is warped in the first direction, peeling is less likely to occur in the mounting portion of the flexible cable on the circuit board.

The present invention also includes a head unit that ejects liquid;
One end portion is fixed to the head substrate of the head unit, and a flexible cable that supplies a drive signal to the head unit;
A common member to which a plurality of the head units are fixed;
A circuit board to which the other end of the flexible cable is fixed;
With
When the three directions orthogonal to each other are defined as a first direction, a second direction, and a third direction, respectively, the common member is placed on a virtual plane determined by the first direction and the second direction. The direction is the thickness direction, and is longer in the first direction than in the second direction,
A region where the flexible cable and the circuit board are fixed in plan view from the third direction is longer in the second direction than in the first direction.

  According to the present invention, the region where the flexible cable and the circuit board are fixed, that is, the mounting portion of the flexible cable on the circuit board is longer in the second direction than in the first direction. Even when the constituent member that is long in the first direction is warped in the first direction, peeling is less likely to occur in the mounting portion.

Furthermore, the present invention provides a head unit that ejects liquid,
One end portion is fixed to the head substrate of the head unit, and a flexible cable that supplies a drive signal to the head unit;
A common member to which a plurality of the head units are fixed;
A circuit board to which the other end of the flexible cable is fixed;
With
When the three directions orthogonal to each other are defined as a first direction, a second direction, and a third direction, respectively, the common member is placed on a virtual plane determined by the first direction and the second direction. The direction is the thickness direction, and is longer in the first direction than in the second direction,
In the flexible cable, a bent portion between a portion along the circuit board and a portion extending in a direction intersecting the circuit board is more in the second direction than in the first direction in a plan view from the third direction. It is characterized by being long.

  According to the present invention, since the bent portion between the portion along the circuit board and the portion extending in the direction intersecting the circuit board is longer in the second direction than the first direction, the common member or the circuit board is obtained. In addition, even when a constituent member that is elongated in the first direction is warped in the first direction, peeling is less likely to occur in the mounting portion of the flexible cable on the circuit board.

In each of the above configurations, a plurality of the circuit boards are provided,
It is desirable to employ a configuration in which the plurality of circuit boards are covered with the common member, and a cover member that is longer in the first direction than in the second direction is provided.

  According to this configuration, since there are a plurality of circuit boards, the size of each circuit board can be reduced and the warp of the circuit board can be reduced as compared with the case where there is only one circuit board. For this reason, it becomes difficult to produce peeling in the mounting part of the flexible cable in a circuit board. Further, since the circuit board is sandwiched between the cover member and the common member, the circuit board can be protected.

  In each of the above configurations, it is desirable that the flexible cable adopts a configuration in which the flexible cable is bent between the head substrate and the circuit substrate.

  According to this configuration, since the flexible cable is bent between the head substrate and the circuit board, even if the common member or the other long structural member in the first direction is warped, the flexible cable is only bent. Since there is a margin in the length, the influence of the warp can be mitigated. As a result, it is possible to more reliably suppress peeling at the mounting portion of the flexible cable.

  In each of the above configurations, it is desirable that the flexible cable adopts a configuration that is bent between the head substrate and the circuit substrate.

  According to this configuration, since the flexible cable is bent between the head substrate and the circuit substrate, even if the common member or the other long component member in the first direction is warped, only the amount that is bent. Since there is room in the length of the flexible cable, the influence of the warp can be mitigated. As a result, it is possible to more reliably suppress peeling at the mounting portion of the flexible cable.

In each of the above configurations, a holder member that is longer in the first direction than in the second direction in the plan view,
The holder member is
A first recess formed on the first surface side and housing the head unit; and a second recess formed on the second surface side opposite to the first surface and storing the circuit board. It is desirable to employ a configuration having the same.

  According to this configuration, since the recess is provided on each of the first surface side and the second surface side, the strength of the structure such as the wall that defines each recess is increased on the first surface side and the second surface side. Are aligned. As a result, the holder member is not easily deformed such as warping or twisting.

  In each of the above configurations, a configuration in which the thermal expansion coefficient of the holder member and the thermal expansion coefficient of the common member are different can be employed.

  According to this configuration, even when the holder member and the common member are likely to warp due to the difference in thermal expansion coefficient, peeling of the mounting portion of the flexible cable can be suppressed. For this reason, it is not restricted by the difference in a thermal expansion coefficient, but the freedom degree of selection of the material of a holder member and a common member improves. In addition, it is possible to grasp in advance whether the warp is larger depending on the material, and it is easy to take a measure in which the long direction of the mounting portion of the flexible cable arranged in the constituent member is the second direction.

In each of the above configurations, the head unit is longer in the first direction than in the second direction,
A plurality of the head units may employ a configuration arranged along the first direction.

  According to this configuration, the liquid ejecting head can be elongated in the first direction.

  In each of the above configurations, it is desirable to adopt a configuration in which the region where the flexible cable and the head substrate are fixed in the plan view overlaps with the region where the head unit and the common member are fixed.

  According to this configuration, the head substrate can be reduced in size compared to a configuration in which the region where the flexible cable and the head substrate are fixed does not overlap the region where the head unit and the common member are fixed. It becomes possible to arrange at high density. In addition, since the area of the fixing region can be secured wider, the head unit and the common member can be more reliably fixed.

In each of the above configurations, the position where the flexible cable is separated from the head substrate is biased with respect to the center of the head unit in the first direction,
The flexible cable fixed to the head substrate of the head unit located on both sides in the first direction among the plurality of head units is disposed farther from the center of the common member in the first direction. It is desirable to adopt a configuration.

  According to this configuration, among the plurality of head units, the flexible cable fixed to the head substrate of the head unit located on both sides in the first direction is such that the flexible cable that easily generates heat is the center of the common member in the first direction. The temperature gradient in the liquid ejecting head can be reduced by being arranged farther from (in other words, on the outer side). As a result, it is possible to suppress variations in characteristics of the head units based on temperature changes.

  In each of the above configurations, it is desirable that the thickness of the wiring at the one end is smaller than the thickness of the wiring at the other end.

  According to this configuration, since the thickness of the wiring at one end of the flexible cable is thinner than the thickness of the wiring at the other end, the dimension in the second direction of the fixing region with the head substrate can be reduced. As a result, the size of the head unit in the second direction can be further reduced. On the other hand, since the thickness of the wiring at the other end is larger than the thickness of the wiring at the one end, the resistance of the wiring can be reduced.

  In each of the above-described configurations, it is desirable that the wiring pitch at the one end is narrower than the wiring pitch at the other end.

  According to this configuration, since the wiring pitch at one end of the flexible cable is narrower than the wiring pitch at the other end, the dimension in the second direction of the fixing region with the head substrate can be reduced. As a result, the size of the head unit in the second direction can be further reduced. On the other hand, since the wiring pitch at the other end is wider than the wiring pitch at the one end, the wiring work at the other end is facilitated.

In each of the above configurations, the direction in which the wires at the one end are aligned is the width direction of the flexible cable,
It is desirable to adopt a configuration in which the direction in which the wires at the other end are arranged is the length direction of the flexible cable.

  According to this configuration, since the direction in which the wirings at one end are arranged is the width direction of the flexible cable, the dimension in the second direction of the fixing region with the head substrate at the one end can be reduced. As a result, the size of the head unit in the second direction can be further reduced. On the other hand, since the direction in which the wires at the other end are arranged is the length direction of the flexible cable, the degree of freedom of the wiring layout at the other end is increased. That is, the pitch and thickness of the wiring at the other end can be set more freely.

  The liquid ejecting apparatus according to the aspect of the invention includes the liquid ejecting head having any one of the above-described configurations.

  According to the present invention, it is possible to suppress peeling at the mounting portion of the flexible cable due to warpage of a common member or other constituent members that are long in the first direction, so that the reliability of the liquid ejecting apparatus is further improved.

It is a perspective view explaining the structure of one form of a liquid ejecting apparatus. FIG. 6 is an exploded perspective view of an embodiment of a liquid ejecting head. It is a bottom view of one form of a liquid ejecting head. It is the sectional view on the AA line in FIG. FIG. 4 is a sectional view taken along line BB in FIG. 3. It is a disassembled perspective view of one form of a head unit. It is a partial top view of a head unit. It is sectional drawing in the X direction of a head unit. It is CC sectional view taken on the line in FIG. It is a front view explaining the structure of one form of a flexible cable. It is a figure explaining the relationship between the fixed area | region of a flexible cable and a flow-path formation board | substrate, and the fixed area | region of a flow-path formation board | substrate and a fixed board. It is a figure explaining the other example of the relationship between the fixed area | region of a flexible cable and a flow-path formation board | substrate, and the fixed area | region of a flow-path formation board | substrate and a fixed board. FIG. 10 is an exploded perspective view of a liquid jet head according to a second embodiment. FIG. 6 is a cross-sectional view in the Y direction of a liquid jet head according to a second embodiment. It is a figure explaining the structure of the flexible cable in 2nd Embodiment. It is a schematic diagram explaining the modification regarding electrical joining with the terminal part of a flexible cable, and the head board | substrate terminal part of a flow-path formation board | substrate. It is a figure explaining the structure of the modification of a flexible cable.

  DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments for carrying out the present invention will be described with reference to the accompanying drawings. Note that, in the embodiments described below, various limitations are made as preferred specific examples of the present invention. However, the scope of the present invention is not limited to the following description unless otherwise specified. However, the present invention is not limited to this embodiment. In the following, an ink jet printer (hereinafter simply referred to as printer 1) equipped with an ink jet recording head (hereinafter simply referred to as recording head 3), which is a kind of liquid ejecting head, as the liquid ejecting apparatus of the present invention. )) As an example.

  The configuration of the printer 1 will be described with reference to FIG. In the figure, the three directions orthogonal to each other are the X direction (corresponding to the second direction in the present invention), the Y direction (corresponding to the first direction in the present invention), and the Z direction (in the third direction in the present invention). Equivalent). The printer 1 is an apparatus that records an image or the like by ejecting liquid ink onto the surface of a recording medium S such as recording paper. The printer 1 includes a recording head 3 having a plurality of head units 4, a transport mechanism 5 for transporting a recording medium S, and a recording medium transported to a position facing each nozzle surface of the head unit 4 (see FIG. 2). A medium support portion 6 (also called a platen) for supporting S is provided inside the apparatus main body 7.

  The recording head 3 in the present embodiment is a line head that is longer in the Y direction perpendicular to the X direction than the X direction, with the conveyance direction of the recording medium S being the X direction. Further, the Z direction when the recording head 3 is placed on a virtual plane determined in the X direction and the Y direction is the thickness direction of each constituent member constituting the recording head 3 or the recording head 3 (in other words, each The stacking direction of the constituent members). This thickness direction is the smallest dimension among the dimensions in the X direction, Y direction, and Z direction of constituent members, in particular, common members such as a holder member 15 and a fixing plate 17 described later. The recording head 3 is connected to a liquid supply tube 8 that communicates with the inside of an ink cartridge (not shown) that stores ink, which is a kind of liquid. Ink from the ink cartridge is supplied to the flow path member 13 described later via the liquid supply tube 8. A configuration in which the ink cartridge is mounted on the upper surface of the recording head 3 can also be employed. Further, the recording head 3 is configured such that an external wiring (not shown) such as an FFC for supplying a driving signal from the control unit to the recording head is connected to a connector 36 of the circuit board 16 described later through the cable insertion port 9. Has been.

  The transport mechanism 5 includes a pair of upper and lower first transport rollers 10 a disposed on the upstream side in the X direction with respect to the medium support portion 6, and a pair of upper and lower surfaces disposed on the downstream side in the X direction with respect to the medium support portion 6. 2 conveyance rollers 10b. The recording medium S from the supply side is transported toward the discharge side through the medium support unit 6 while being sandwiched between the upper and lower rollers by driving of the transport rollers 10a and 10b. In some cases, the transport mechanism includes an endless belt or a drum. In such a configuration, the belt or the drum functions as a medium support unit. Furthermore, as the medium support portion, a structure that adsorbs the recording medium by electrostatic force or a structure that adsorbs the recording medium by generating a negative pressure with a suction pump or the like can be adopted.

  2 is an exploded perspective view of the recording head 3 as viewed obliquely from above, FIG. 3 is a bottom view of the recording head 3, and FIG. 4 is a cross-sectional view taken along the line AA in FIG. 5 is a cross-sectional view taken along line BB in FIG. 3 (that is, a cross-sectional view in the Y direction). The recording head 3 in the present embodiment includes a flow path member 13 in which a flow path for supplying ink to each head unit 4 is formed, a cover member 14, a holder member 15, a circuit board 16, and the head unit 4. And a fixed plate 17.

  The holder member 15 is a member on a substantially rectangular parallelepiped that is longer in the Y direction than in the X direction in a plan view from the Z direction, and is made of, for example, a synthetic resin. On the lower surface (corresponding to the first surface in the present invention) side of the holder member 15, a first housing recess 19 (corresponding to the first recess in the present invention) for housing the plurality of head units 4 is provided. In addition, on the upper surface (corresponding to the second surface in the present invention) side of the holder member 15, a second housing recess 20 (corresponding to the second recess in the present invention) for housing the circuit board 16 is provided by the partition plate 21. It is formed in a state separated from the housing recess 19. A side wall 22 extending in a direction intersecting with the partition plate 21 is formed around the partition plate 21. The side walls 22 extend from the four edges of the partition plate 21 toward the first housing recess 19 side and the second housing recess 20 side, respectively. Therefore, as shown in FIGS. 4 and 5, the holder member 15 has a substantially H shape in cross-sectional view. Moreover, the depth D1 of the 1st accommodation recessed part 19 and the depth D2 of the 2nd accommodation recessed part 20 are arrange | equalized by the same grade. More specifically, each of D1 and D2 is set to be in the range of 80% or more and 120% or less with respect to the center value of the depth of the housing recesses 19 and 20 in the specification and design. More desirably, each of D1 and D2 is in the range of 95% to 105% with respect to the center value. Thus, since the accommodation recessed parts 19 and 20 are formed in each of the upper surface side and lower surface side of the holder member 15, it is suppressed that the side wall 22 functions as a load-bearing wall and the partition plate 21 deform | transforms. Further, since the depths D1 and D2, that is, the heights of the side wall 22 from the partition plate 21 are equal to each other on the first accommodation recess 19 side and the second accommodation recess 20 side, the accommodation recesses 19 and 20 are provided. The strength of the structure such as a wall that divides each wall is less likely to be biased. Thereby, a deformation | transformation of the holder member 15 long in a Y direction is suppressed more effectively.

  The first accommodating recess 19 has a concave shape that opens to the lower surface of the holder member 15, and the plurality of head units 4 fixed to the fixing plate 17 are accommodated therein. That is, the opening on the lower surface side of the first housing recess 19 is sealed by the fixing plate 17, and each head unit 4 is housed in a space defined by the first housing recess 19 and the fixing plate 17. In addition, the 1st accommodation recessed part 19 may be provided for every head unit 4, and may be provided continuously over several head units 4. FIG. Such a holder member 15 can be said to be a kind of common member common to the head units 4.

  In the holder member 15, similarly, the head units 4 that are longer in the Y direction than in the X direction in plan view are alternately arranged along the Y direction. The head unit 4 includes a nozzle plate 26 in which nozzle rows 25a and 25b in which a plurality of nozzles 24 are arranged in the Y direction, a flow path forming substrate 45 in which a flow path such as a pressure chamber 51 is formed, A head chip in which a piezoelectric element 60 and the like functioning as a drive source (in other words, an actuator) for ejecting ink from the nozzles 24 is unitized. As shown in FIG. 3, each head unit 4 has a nozzle row 25 in a posture along the Y direction (that is, a posture in which the longitudinal direction of the head unit 4 is along the Y direction), and in the X direction, that is, a recording medium. A plurality of arrangement positions in the transport direction of S are staggered and arranged in the Y direction. Thus, by arranging the head units 4 elongated in the Y direction along the Y direction, the recording head 3 can be elongated. That is, a larger recording head 3 called a so-called large format is obtained. Adjacent head units 4 are in a positional relationship such that the arrangement positions in the Y direction of some of the nozzles 24 in the nozzle row 25 overlap each other. For this reason, the row | line | column of the nozzle 24 continuous over the Y direction can be formed. In the present embodiment, the configuration in which a total of four head units 4 are provided is illustrated, but the present invention is not limited to this.

  As shown in FIG. 2, the partition plate 21 of the holder member 15 has a communication channel 27 for supplying ink from the cover member 14 side to the head unit 4 side, in the thickness direction of the partition plate 21. That is, it is formed so as to penetrate the Z direction. A flow path connecting portion 31 (see FIGS. 4 and 5) projecting from the lower surface of the cover member 14 is connected to the opening of the communication flow path 27 on the second housing recess 20 side. In the present embodiment, two communication channels 27 are provided for each head unit 4. In addition, the partition plate 21 is provided with a wiring insertion port 28 through which the flexible cable 29 of the head unit 4 is inserted so as to penetrate the thickness direction of the partition plate 21. The flexible cable 29 of the head unit 4 housed in the first housing recess 19 has a lower surface side of the partition plate 21, that is, the first housing recess 19 is inserted from the side into the wiring insertion port 28, and the upper surface side of the partition plate 21. That is, it is pulled out to the second housing recess 20 side.

  The circuit board 16 is disposed in the second housing recess 20. The circuit board 16 is a rigid board provided with electronic components, wiring, and the like. In the present embodiment, one circuit board 16 is provided for the two head units 4. For this reason, a total of two circuit boards 16 are arranged in the second receiving recess 20 in the second receiving recess 20. The configuration is not limited to the configuration in which one circuit board 16 is provided for the two head units 4, and one circuit board 16 may be provided for each head unit 4. A common circuit board 16 may be provided for all the head units 4 arranged. In the configuration in which a plurality of circuit boards 16 are provided, the size of each circuit board 16 can be reduced compared to the case where only one circuit board 16 is provided, and the warpage of each circuit board 16 can be reduced. Can be reduced. For this reason, peeling becomes difficult to occur in the mounting portion of the flexible cable 29 on the circuit board 16.

  As shown in FIG. 2, the circuit board 16 in the present embodiment has a crank shape following the layout of the two corresponding head units 4 in plan view from the Z direction. A circuit board terminal portion 35 to which the second terminal portion 34 of the flexible cable 29 is connected is provided on the upper surface of the circuit board 16 (in other words, the surface facing the cover member 14). In the present embodiment, the circuit board terminal portion 35 is longer in the Y direction than in the X direction in plan view. That is, the terminals constituting the circuit board terminal portion 35 are arranged along the Y direction. Further, on the upper surface of the circuit board 16, a clearance hole 37 into which the flow path connection portion 31 of the cover member 14 is inserted is provided at a position corresponding to the communication flow path 27 of the holder member 15. That is, the flow path connection portion 31 of the cover member 14 is connected to the communication flow path 27 through the escape hole 37. Further, on the upper surface of the circuit board 16, a connector 36 to which an external wiring inserted into the second housing recess 20 through the cable insertion port 9 is connected is provided.

  The cover member 14 is a rectangular parallelepiped member that is longer in the Y direction than in the X direction in plan view, and is made of a synthetic resin in the same manner as the holder member 15. The cover member 14 is fixed to the holder member 15 by a fixing method such as bonding with an adhesive, screwing, or welding in a state in which the upper opening of the second housing recess 20 of the holder member 15 is closed. Inside the cover member 14, a supply channel 39 for supplying ink to the communication channel 27 of the holder member 15 is provided. In plan view, the supply flow path 39 extends along the upper and lower surfaces of the cover member 14 from the opening position on the upper surface of the cover member 14 to the position overlapping the corresponding communication flow path 27 of the holder member 15. It is extended in the direction. A part of the downstream side of the communication channel 27 is formed in the channel connection part 31 projecting from the lower surface of the cover member 14, and the end surface of the channel connection part 31 (with the communication channel 27 and Open to the surface on the connected side.

  The fixed plate 17 is a metal plate that is longer in the Y direction than in the X direction in plan view. The fixing plate 17 is fixed to the lower surface of the holder member 15 by adhesion or the like in a state in which the opening of the first housing recess 19 is closed. The fixing plate 17 is provided with an opening 40 that exposes the nozzle surface 26 a (see FIG. 3) of each head unit 4 for each head unit 4. The head unit 4 is fixed to the peripheral edge of the opening 40 on the upper surface of the fixing plate 17 (in other words, the surface on the first housing recess 19 side) by an adhesive or the like. Thus, the fixing plate 17 in this embodiment functions as a kind of common member common to the plurality of head units 4. The fixing plate 17 and the cover member 14 are indirectly fixed to each other via the holder member 15. For this reason, the circuit board 16 is covered between the fixing plate 17 and the cover member 14. As a result, the circuit board 16 is protected from ink and dust.

  In the present embodiment, a total of four flow path members 13 are arranged in the X direction on the upper surface of the cover member 14. An inlet 41 corresponding to the liquid supply tube 8 of the flow path member 13 is opened on the upper surface of each flow path member 13. The inflow port 41 is in communication with a supply channel 39 that is open on the upper surface of the cover member 14 via a liquid channel formed inside the channel member 13. The flow path member 13 has a function of adjusting the supply pressure to the head unit 4 side of the ink supplied from the liquid supply tube 8 and filtering the ink with a filter (not shown). Then, ink is supplied from the flow path member 13 to the head unit 4 through the supply flow path 39 and the communication flow path 27.

  FIG. 6 is an exploded perspective view of one form of the head unit 4. FIG. 7 is a partial plan view of the head unit 4 (that is, in the vicinity of the accommodating space 50 described later). In the drawing, the reservoir forming substrate 47, the compliance substrate 48, and the flexible cable 29 are not shown. 8 is a cross-sectional view of the head unit 4 in the X direction, and FIG. 9 is a cross-sectional view of the head unit 4 in FIG. The head unit 4 in the present embodiment has a rectangular parallelepiped shape that is longer in the Y direction than in the X direction in plan view. A wiring board is formed from a wiring opening 43 provided at one end in the Y direction, which is the longitudinal direction, on the upper surface of the head unit 4 (in other words, the surface on the side of the partition plate 21 in the state of being accommodated in the first accommodating recess 19). The flexible cable 29 is inserted. In addition, two ink inlets 44 are provided at the center of the upper surface of the head unit 4 in the Y direction. The ink introduction port 44 is a portion that communicates with the communication flow path 27 and into which ink from the flow path member 13 is introduced.

  The head unit 4 in this embodiment includes a flow path forming substrate 45 (a kind of head substrate in the present invention), a nozzle plate 26, a protective substrate 46, a reservoir forming substrate 47, a compliance substrate 48, a drive IC 49, Flexible cable 29. The nozzle plate 26, the flow path forming substrate 45, and the protective substrate 46 are laminated in this order by an adhesive or the like, and further, the reservoir forming substrate 47 and the compliance substrate 48 are laminated on the protective substrate 46 in this order. In addition, the drive IC 49 is disposed in the accommodating space 50 formed in the protective substrate 46 between the flow path forming substrate 45 and the reservoir forming substrate 47.

  The flow path forming substrate 45 is made of, for example, a silicon single crystal plate. A plurality of pressure chambers 51 are arranged on the flow path forming substrate 45 along the Y direction corresponding to each nozzle 24 by anisotropic etching. In the present embodiment, two rows of pressure chambers 51 are formed on the flow path forming substrate 45 in correspondence with the two nozzle rows 25 formed on the nozzle plate 26. In the flow path forming substrate 45, a communication part 52 as a liquid supply path is formed in a region outside the X direction of the pressure chamber 51, and the communication part 52 and each pressure chamber 51 are provided for each pressure chamber 51. Are communicated with each other via an ink supply path 53. The ink supply path 53 is formed with a narrower width than the pressure chamber 51, and imparts a flow path resistance to the ink flowing into the pressure chamber 51 from the communication portion 52.

  In the nozzle plate 26, nozzles 24 communicating with the end portions of the pressure chambers 51 on the side opposite to the ink supply path 53 are formed. The nozzle plate 26 is made of glass ceramics, a silicon single crystal substrate, stainless steel, or the like. The nozzle plate 26 in the present embodiment is formed to be slightly smaller than the flow path forming substrate 45. The flow path forming substrate 45 and the nozzle plate 26 are joined by an adhesive, a heat welding film, or the like. In the nozzle plate 26, the lower surface opposite to the surface to which the flow path forming substrate 45 is bonded is the nozzle surface. In the present embodiment, the fixing plate 17 is joined around the nozzle plate 26 joined to the substantially central portion of the lower surface of the flow path forming substrate 45. That is, when the fixing plate 17 is joined to the lower surface of the flow path forming substrate 45, the nozzle plate 26 is disposed in the opening 40 formed in the fixing plate 17 (see FIGS. 3 to 5).

  An elastic film 55 constituting a diaphragm is formed on the surface of the flow path forming substrate 45 opposite to the surface to which the nozzle plate 26 is bonded. The elastic film 55 is made of, for example, silicon dioxide. On the elastic film 55, an insulating film 56 made of an oxide film is formed. The insulating film 56 is made of, for example, zirconium oxide. The elastic film 55 and the insulating film 56 constitute a diaphragm.

  On the insulating film 56, a lower electrode 57 made of a metal such as platinum (Pt) or a metal oxide such as strontium ruthenate (SrRuO), a piezoelectric layer 58 having a perovskite structure, gold (Au), iridium (Ir) ) And the like, and a piezoelectric element 60 made of a metal. In general, one of the electrodes of the piezoelectric element 60 is a common electrode, and the other electrode and the piezoelectric layer 58 are patterned corresponding to each pressure chamber 51. A portion where piezoelectric distortion occurs due to application of drive voltage to both electrodes 57 and 59 functions as a piezoelectric active portion. In this embodiment, the lower electrode 57 is a common electrode of the piezoelectric element 60 and the upper electrode 59 is an individual electrode of the piezoelectric element 60. However, the lower electrode 57 is a piezoelectric element for the convenience of the driving IC 49 and wiring. It is also possible to adopt a configuration in which 60 individual electrodes are used and the upper electrode 59 is a common electrode of the piezoelectric element 60. In any case, a piezoelectric active part is formed for each pressure chamber 51. Further, here, the piezoelectric element 60 and the diaphragm made of the elastic film 55 and the insulating film 56 that are displaced by driving the piezoelectric element 60 function as an actuator.

  A lead electrode 61 as a lead electrode made of, for example, gold (Au) or the like is connected to the upper electrode 59 constituting each piezoelectric element 60, and this lead electrode 61 is an area between the rows of pressure chambers 51. Has been pulled out. The lead electrode 61 is formed, for example, by patterning a metal layer made of gold (Au) or the like for each piezoelectric element 60.

  The protective substrate 46 has a piezoelectric element housing space 63 in a state where a space that does not hinder the deformation of the piezoelectric element 60 is secured in a region facing the piezoelectric element 60. Two piezoelectric element accommodating spaces 63 are provided corresponding to each row of the pressure chambers 51. The protective substrate 46 is bonded to the flow path forming substrate 45 on which the piezoelectric element 60 is formed with an adhesive. As a material of the protective substrate 46, for example, glass, a ceramic material, a resin, a silicon substrate, or the like is employed. Further, the protective substrate 46 is provided with an ink storage space portion 64 extending from a region corresponding to the communication portion 52 of the flow path forming substrate 45 to the piezoelectric element accommodation space portion 63. In the present embodiment, the ink reservoirs 64 are provided in series along the row of pressure chambers 51, and communicate with the communicating portion 52 of the flow path forming substrate 45 to form a common ink chamber for each pressure chamber 51. A reservoir 65 (also called a manifold) is configured.

  Further, in the protective substrate 46, an accommodation cavity 50 that penetrates the protective substrate 46 in the thickness direction, that is, the Z direction is provided in a region corresponding to the space between the pressure chambers 51. The leading end portion of the lead electrode 61 drawn out from the piezoelectric element 60 is exposed at the bottom of the accommodation space 50. The drive IC 49 in this embodiment is housed in the housing space 50. The drive IC 49 is disposed on the tip of the lead electrode 61 exposed in the housing space 50, and the tip of the lead electrode 61 and an output terminal (not shown) of the drive IC 49 are electrically connected. On the flow path forming substrate 45, a head substrate terminal portion 62 electrically connected to an input terminal portion (not shown) of the drive IC 49 is extended to a position corresponding to the wiring opening 43 (see FIG. 7 and FIG. 9). The head substrate terminal portion 62 is configured by a plurality of terminals arranged in parallel along the X direction. Strictly speaking, the head substrate terminal portion 62 is formed on the diaphragm (that is, the elastic film 55 and the insulating film 56) laminated on the flow path forming substrate 45. Suppose that it is indirectly formed on the flow path forming substrate 45. The first terminal portion 33 of the flexible cable 29 inserted through the wiring opening 43 is connected to the head substrate terminal portion 62. As described above, the head substrate terminal portion 62 is arranged so as to be biased toward one end portion in the Y direction with respect to the central portion of the flow path forming substrate 45 in plan view in the flow path forming substrate 45. Details of the flexible cable 29 will be described later.

  A reservoir forming substrate 47 is disposed on the protective substrate 46. A girder 67 is formed at a substantially central portion of the reservoir forming substrate 47 along the Y direction so as to cover the upper portion of the accommodation space 50. A heat conducting member 68 is disposed between the beam 67 and the drive IC 49 and is in contact with the beam 67 and the drive IC 49, respectively. As the heat conduction member 68, resin such as adhesive, silicon grease, grease in which silicon is highly filled with ceramic filler, and a heat radiation sheet can be used.

  A compliance substrate 48 including a sealing film 69 and a support plate 70 is bonded onto the reservoir forming substrate 47. The sealing film 69 is made of a flexible material (for example, a polyphenylene sulfide (PPS) film having a thickness of several μm), and the sealing film 69 forms one of the ink storage empty portions 64 constituting the reservoir 65. The surface is sealed. The support plate 70 is made of a hard material such as metal (for example, stainless steel (SUS) having a thickness of several tens of μm). Since the region of the support plate 70 that faces the ink storage space 64 is a through opening 71 that is completely removed in the Z direction, which is the thickness direction, one surface of the ink storage space 64 is flexible. It is sealed only by the sealing film 69 having

  In such a head unit 4, the circuit board 16 and the flexible cable 29 are connected from the control unit of the printer 1 in a state where ink is taken in from the flow path member 13 and the ink flow from the reservoir 65 to the nozzle 24 is filled with ink. The driving signal is transmitted to the driving IC 49 through the driving IC 49, and the driving signal is selectively applied to each piezoelectric element 60 by the control of the driving IC 49. The piezoelectric element 60 is deformed according to the waveform of the applied drive signal, and pressure deformation occurs in each pressure chamber 51 due to this deformation. Then, ink droplets are ejected from the nozzles 24 by this pressure fluctuation. In addition, the structure of the head unit 4 is not restricted to what was illustrated, The thing of a various structure is employable. For example, regarding the compliance substrate 48, the configuration disposed on the upper surface side of the head unit 4 is illustrated, but a configuration disposed on the lower surface side of the flow path forming substrate 45 can also be adopted. That is, in the case of this configuration, the compliance substrate 48 having an opening for exposing the nozzle plate 26 is bonded around the nozzle plate 26 bonded to the substantially central portion of the lower surface of the flow path forming substrate 45. In this case, the fixing plate 17 is bonded to the compliance substrate 48, and only the nozzle plate 26 is exposed in the opening 40 of the fixing plate 17.

  FIG. 10 is a front view illustrating the configuration of one form of the flexible cable 29. In the flexible cable 29 according to the present invention, a pattern of wirings 73 and 74 and terminal portions 33 and 34 are formed on one surface of a rectangular base film 72 such as polyimide. In the figure, only a part of the wirings 73 and 74 is shown. A first terminal portion 33 connected to the head substrate terminal portion 62 is provided at one end portion of the flexible cable 29 (in other words, the lower end portion in FIG. 10). The first terminal portion 33 has a plurality of first terminals 76 arranged in parallel along the width direction of the flexible cable 29, that is, the X direction in a state of being connected to the head unit 4. It is long in the X direction. For this reason, the wiring 73 at one end of the flexible cable 29 is also arranged along the width direction of the flexible cable 29.

  Further, at the other end of the flexible cable 29 and on one edge in the width direction of the flexible cable 29 (in other words, the left edge in FIG. 9), the circuit board terminal portion of the circuit board 16 is provided. A second terminal portion 34 connected to 35 is formed along the length direction of the flexible cable 29. The second terminal portion 34 has a plurality of second terminals 77 arranged in parallel along the length direction of the base film 72 and is long in the length direction. For this reason, the wiring 73 at the other end of the flexible cable 29 is also arranged along the length direction of the flexible cable 29.

  Thus, since the direction in which the wiring 73 is arranged in the one end portion of the flexible cable 29 is the width direction of the flexible cable 29, the dimension in the X direction of the fixing region between the one end portion of the flexible cable 29 and the flow path forming substrate 45. Can be reduced. Thereby, the size of the head unit 4 in the X direction can be further reduced. The width of the flexible cable 29 is preferably narrower than the width of the head unit 4 in the X direction. As a result, the head units 4 can be arranged with higher density without being restricted by the size (particularly width) of the flexible cable 29. Moreover, since the direction in which the wirings at the other end of the flexible cable 29 are arranged is the length direction of the flexible cable, the degree of freedom of the layout of the wiring at the other end is increased. That is, as described below, the pitch and thickness of the wiring 73 at the other end can be set more freely.

  Here, the width of the first terminal 76 (in other words, the dimension in the terminal juxtaposition direction) is narrower than the width of the second terminal 77. For this reason, the thickness of the wiring 73 connecting these terminals 76 and 77 is relatively thin on the first terminal 76 side (in other words, one end portion), and on the second terminal 77 side (in other words, the other end portion). Then it is relatively thick. Further, the formation pitch of the first terminals 76 is narrower than the formation pitch of the second terminals 77. For this reason, the formation pitch of the wiring 73 is also relatively narrow on the first terminal 76 side and relatively wide on the second terminal 77 side. By employ | adopting such a structure, the width | variety of the 1st terminal part 33 in the one end part of the flexible cable 29 can be made small. For this reason, the width | variety in the X direction of the head board | substrate terminal part 62 of the flow-path formation board | substrate 45 to which this 1st terminal part 33 is connected can be made small. Thereby, it becomes possible to contribute to size reduction of the head unit 4 in the X direction. Moreover, since the thickness of the wiring 73 is thicker than that of the one end at the other end of the flexible cable 29, the wiring resistance can be reduced. In particular, in the present embodiment, the wiring 73 that is farther from the first terminal portion 33 at one end at the other end has a longer wiring length, and accordingly the resistance tends to increase. By increasing the thickness, the increase in resistance can be reduced. Moreover, since the formation pitch of the wiring 73 is wider than that of the one end portion, wiring work on the circuit board 16 is facilitated. Thereby, electrical contact failure etc. are reduced.

  The first terminal portion 33 at one end of the flexible cable 29 is connected to the head substrate terminal portion 62 in the flow path forming substrate 45. In the mounting operation of the flexible cable 29 to the head substrate terminal portion 62, one end portion of the flexible cable 29 is formed with, for example, terminal portions 33 and 34 and wiring 73 from a virtually set bending line L1 (see FIG. 10). It is bent (in other words, mountain-folded) toward the other surface side opposite to the one surface (see FIGS. 5, 6, and 9). Hereinafter, this bent portion is referred to as a first bent portion 78. As a result, the portion closer to the first terminal portion 33 than the first bent portion 78 is in a state along the flow path forming substrate 45 that is the head substrate, and faces the head substrate terminal portion 62. In the present embodiment, this portion corresponds to a portion along the flow path forming substrate 45 that is a head substrate. In this case, the portion on the other end side from the first bent portion 78 is a portion extending in a direction intersecting the flow path forming substrate 45 (in other words, a direction away from the flow path forming substrate 45). Regarding the state “along the flow path forming substrate 45”, the portion closer to the first terminal portion 33 than the first bent portion 78 is completely parallel to the upper surface (in other words, the mounting surface) of the flow path forming substrate 45. The state is not limited to a certain state, and is in a state along the flow path forming substrate 45 as long as it is closer to the upper surface of the flow path forming substrate 45 than the other portions of the flexible cable 29 (note that “will be described later” The same is true for the state along the circuit board 16). Further, regarding the first bent portion 78, in the present embodiment, the configuration bent in a cornered state is illustrated, but a portion having a certain width (a smaller curvature) bent more gently. It is also possible (the same applies to the second bending portion 79 described later).

  The first terminal portion 33 and the head substrate terminal portion 62 of the flexible cable 29 are electrically connected by, for example, a non-conductive adhesive (NCP: Non-Conductive Paste) or a sheet-like material thereof, One end of the flexible cable 29 is fixed to the flow path forming substrate 45. Since the non-conductive adhesive does not contain conductive particles, the element-side terminal and the wiring-side terminal can be joined while preventing a short circuit between adjacent terminals even in a configuration in which the distance between adjacent terminals is relatively narrow. is there. For this reason, it can respond to the densification of a terminal.

  The electrical connection portion between the first terminal portion 33 and the head substrate terminal portion 62, that is, the fixed region (in other words, the mounting portion) where the flexible cable 29 and the flow path forming substrate 45 are fixed to each other is a flow path formation. It is longer in the X direction than in the Y direction in a plan view orthogonal to the mounting surface of the substrate 45. In other words, the first bent portion 78 is longer in the X direction than in the Y direction in plan view. For this reason, for example, due to the difference in thermal expansion coefficient between the constituent members of the recording head 3, even when the constituent member that is long in the Y direction warps in the Y direction, the mounting portion and the first bent portion 78 are in the Y direction. Compared with the configuration along, the stress due to warpage is less likely to act on the mounting portion. For this reason, even in the recording head 3 having a longer constituent member as in this embodiment, peeling of the mounting portion between the first terminal portion 33 and the head substrate terminal portion 62 that are electrical contacts is suppressed. It becomes possible. For this reason, it becomes possible to suppress the connection defect etc. of a mounting part, without requiring members, such as a correction board for suppressing the curvature of a head structural member separately.

  In the flexible cable 29, the portion on the other end side from the first bent portion 78 stands up so as to extend in a direction away from the flow path forming substrate 45 toward the circuit board 16, that is, in a direction crossing the flow path forming substrate 45. Then, it is drawn upward from the wiring opening 43 of the head unit 4. When the head unit 4 is accommodated in the first accommodating recess 19, the flexible cable 29 drawn out from the wiring opening 43 is inserted into the wiring insertion opening 28 provided in the partition plate 21 of the holder member 15, so that the second It is pulled out to the housing recess 20 side. The other end portion of the flexible cable 29 drawn out to the second housing recess 20 side is one surface on which terminal portions 33 and 34 and wirings 73 are formed from a virtually set folding line L2 (see FIG. 10). It is bent toward the side (in other words, a valley fold) (see FIG. 5). Hereinafter, this bent portion is referred to as a second bent portion 79. In this state, the portion on the second terminal portion 34 side of the second bent portion 79 is in a state along the mounting surface of the circuit board 16 and faces the circuit board terminal portion 35. In this case, a portion of the flexible cable 29 on the one end side of the second bending portion 79 is a portion extending in a direction intersecting the circuit board 16 (in other words, a direction away from the circuit board 16).

  The second terminal portion 34 and the circuit board terminal portion 35 of the flexible cable 29 are electrically connected by a non-conductive adhesive or the like, similar to the case of joining the first terminal portion 33 and the head substrate terminal portion 62, The other end of the flexible cable 29 is fixed to the circuit board 16. The connection between the terminal portions is not limited to the exemplified non-conductive adhesive, and may be electrically connected by an anisotropic conductive adhesive (ACP), solder, or the like.

  As shown in FIG. 5, the first terminal portion 33 at one end of the flexible cable 29 is fixed to the head substrate terminal portion 62, and the second terminal portion 34 at the other end is fixed to the circuit substrate terminal portion 35, When the mounting of the flexible cable 29 is completed, the flexible cable 29 is bent between the flow path forming substrate 45 and the circuit board 16. In the present embodiment, the length from the first bent portion 78 to the second bent portion 79 is from the upper surface (in other words, the mounting surface) of the flow path forming substrate 45 to the upper surface of the circuit board 16 (in other words, the mounting surface). The distance is adjusted to 101 [%] or more and 140 [%] or less. Thus, since the length of the part has a margin, even if the constituent member that is longer in the Y direction than in the X direction is warped, the influence of the warp can be alleviated accordingly (that is, Even when warping occurs, it is difficult for the flexible cable 29 to be in tension. As a result, peeling at the mounting portion of the flexible cable 29 can be more reliably suppressed.

  Here, as shown in FIG. 5, FIG. 6, FIG. 9, and the like, the position where the flexible cable 29 is separated from the flow path forming substrate 45 in each head unit 4 (that is, the position of the first bent portion 78) is In the Y direction, the head unit 4 is biased toward one end with respect to the center. As shown in FIG. 2, the flexible cable 29 fixed to the flow path forming substrate 45 of the head unit 4 located on both sides in the Y direction among the plurality of head units 4 is fixed to the fixing plate 17 or Are arranged farther from the center of the common member such as the holder member 15. The flexible cable 29 that easily generates heat is disposed farther from the center of the common member (or the center of the recording head 3), that is, a position where the temperature is likely to drop (in other words, the temperature is relatively low). The temperature gradient in the recording head 3 can be reduced by disposing it outside the position that is easy to escape. As a result, it is possible to suppress variations in ejection characteristics of the head units 4 based on temperature changes.

  FIG. 11 is a partial cross-sectional view in the Y direction for explaining the relationship between the fixing area (in other words, the mounting portion) of the flexible cable 29 and the flow path forming substrate 45 and the fixing area of the flow path forming substrate 45 and the fixing plate 17. . FIG. 12 is a partial cross section in the Y direction for explaining another example of the relationship between the fixing region (mounting portion) of the flexible cable 29 and the flow path forming substrate 45 and the fixing region of the flow path forming substrate 45 and the fixing plate 17. FIG. As shown in FIG. 11, in the present embodiment, the fixing region (in other words, the mounting portion) between the flexible cable 29 and the flow path forming substrate 45, that is, the first terminal portion 33 and the head substrate terminal portion 62. The connection region overlaps the fixed region of the flow path forming substrate 45 and the fixing plate 17 in plan view. That is, when the width in the Y direction in the fixing region of the flow path forming substrate 45 and the fixing plate 17 is w1, the fixing region of the flexible cable 29 and the flow path forming substrate 45 is located within the range of the width w1. . On the other hand, in the example of FIG. 12, the fixing region between the flexible cable 29 and the flow path forming substrate 45 does not overlap with the fixing region between the flow path forming substrate 45 and the fixing plate 17, and the inner side from the range of the width w1. (In other words, it is off to the center side of the flow path forming substrate 45 in the Y direction). In this case, assuming that the width w1 required as a fixing region between the flow path forming substrate 45 and the fixing plate 17 is constant, the length of the flow path forming substrate 45 in the Y direction is correspondingly increased in the configuration of the example of FIG. w3 becomes long. Further, if the length w3 is to be kept small, it is difficult to secure the width w1 required as the fixed region, which may reduce the adhesive strength. On the other hand, according to the configuration of the present embodiment, the length w2 in the Y direction of the flow path forming substrate 45 can be made shorter than in the example of FIG. Thereby, the flow path formation board | substrate 45 can be reduced in size, and the head unit 4 can be further reduced in size. For this reason, it becomes possible to arrange the head units 4 with higher density. Further, since the area of the fixing region can be secured wider, the head unit 4 and the fixing plate 17 can be fixed more reliably.

  In addition, regarding the fixed area | region of the flexible cable 29 and the flow-path formation board | substrate 45 in this embodiment, since the Y direction is long, while it is short in the X direction, the area of a fixed area | region is comparatively small. In a configuration in which such a fixed region extends over the entire surface of the head substrate, for example, there is a problem that the flexible cable 29 is increased in size. In addition, there is a problem that peeling due to a difference in thermal expansion coefficient between the flexible cable 29 and the substrate to be fixed easily occurs. On the other hand, although the fixing area of the flexible cable 29 and the flow path forming substrate 45 in this embodiment has a small area, the size of the flexible cable 29 can be kept small, which contributes to downsizing of the head unit 4. Can do. Further, even if there is a difference in thermal expansion coefficient between the flexible cable 29 and the flow path forming substrate 45, the influence can be suppressed.

  In this embodiment, the thermal expansion coefficient of the synthetic resin holder member 15 is different from the thermal expansion coefficient of the metal fixing plate 17. Due to the difference in thermal expansion coefficient between them, even when the holder member 15 and the fixing plate 17 are likely to warp, peeling of the mounting portion of the flexible cable 29 can be suppressed. For this reason, it is not restricted by the difference in a thermal expansion coefficient, but the freedom degree of selection of the material of the holder member 15 and the fixing plate 17 improves. In addition, it is possible to grasp in advance a constituent member that warps greatly (or warps easily) based on the material, and the longitudinal direction of the mounting portion of the flexible cable 29 arranged on the constituent member is set to the X direction. It is easy to take countermeasures and management. And since it is possible to suppress peeling at the mounting portion of the flexible cable 29 due to warpage of the constituent members elongated in the Y direction, the reliability of the printer 1 is improved.

  FIG. 13 is an exploded perspective view of the recording head 3 in the second embodiment. FIG. 14 is a cross-sectional view in the Y direction of the recording head 3 in the second embodiment. Further, FIG. 15 is a front view of the flexible cable 29 in the second embodiment. In addition, the same code | symbol is attached | subjected to the structure same as 1st Embodiment, and the description is abbreviate | omitted suitably. In the present embodiment, the fixing plate 17 in the first embodiment is not provided. The nozzle plate 26 provided individually for each head unit 4 in the first embodiment functions as a common member common to the plurality of head units 4 in the present embodiment. That is, the nozzle plate 26 in the present embodiment is composed of a single plate material that is longer in the Y direction than in the X direction in plan view, and a plurality of nozzles 24 and these nozzles 24 are arranged in a region corresponding to each head unit 4. Nozzle rows 25 each having nozzles 24 arranged in parallel are formed. In the first embodiment, a plurality of circuit boards 16 are provided. However, in this embodiment, a single circuit board 16 common to all the head units 4 accommodated in the holder member 15 is used. It has become. In the circuit board 16, a wiring opening 81 is formed at a position corresponding to the wiring insertion port 28 of the holder member 15. That is, when the flexible cable 29 is wired to the circuit board 16, the flexible cable 29 is inserted into the wiring insertion port 28 provided in the partition plate 21 of the holder member 15 and is inserted into the wiring opening 81. Then, it is pulled out to the upper surface side of the circuit board 16.

  As shown in FIG. 15, the second terminal portion 34 in the present embodiment is formed along the width direction of the flexible cable 29 (in other words, the X direction) at the other end portion of the flexible cable 29. That is, the second terminals 77 constituting the second terminal portion 34 are arranged in parallel along the width direction of the flexible cable 29. For this reason, the wiring 73 at the other end of the flexible cable 29 is also arranged along the width direction of the flexible cable 29. Correspondingly, the circuit board terminal portion 35 of the circuit board 16 is also formed along the X direction. And the electrical connection part of the 2nd terminal part 34 and the circuit board terminal part 35, ie, the fixed area | region (in other words, mounting part) to which the flexible cable 29 and the circuit board 16 were mutually fixed, is planar view. It is long in the X direction. In other words, the second bent portion 79 is longer in the X direction than in the Y direction in plan view. For this reason, also in the present embodiment, even when a constituent member that is longer in the Y direction than in the X direction in the plan view among the constituent members of the recording head 3 is warped in the Y direction, it is the first electrical contact. It is possible to suppress peeling of the mounting portion between the two terminal portion 34 and the circuit board terminal portion 35. Other configurations are the same as those in the first embodiment.

  FIG. 16 is a schematic diagram for explaining a modification example regarding electrical joining between the terminal portion 33 of the flexible cable 29 and the head substrate terminal portion 62 of the flow path forming substrate 45. In each of the embodiments described above, the terminal portions 33 and 34 of the flexible cable 29 are respectively the head substrate terminals in the fixing region of the flexible cable 29 and the flow path forming substrate 45 or the fixing region of the flexible cable 29 and the circuit board 16. Although the structure electrically joined with the part 62 and the circuit board terminal part 35 was illustrated, it is not restricted to this. For example, in the modification shown in FIG. 16, the head substrate terminal portion 62 is provided at a position different from the fixed region between the flexible cable 29 and the flow path forming substrate 45. The flexible cable 29 and the flow path forming substrate 45 are fixed by an adhesive, while the terminal portion 33 and the head substrate terminal portion 62 of the flexible cable 29 are electrically joined by wire bonding via the wire 83. ing. Similarly, the second terminal portion 34 of the flexible cable 29 and the circuit board terminal portion 35 of the circuit board 16 may be electrically joined in the same manner by wire bonding.

  By adopting such a configuration in which electrical connection is performed by wire bonding, the head substrate to which the flexible cable 29 is fixed is not necessarily limited to those provided with electrode terminals, wirings, or the like. . For example, a configuration is adopted in which the flexible cable 29 is fixed to the protective substrate 46, and the head substrate terminal portion 62 and the first terminal portion 33 on the flow path forming substrate 45 are electrically connected from the portion by wire bonding. It is also possible. In this example, the protective substrate 46 corresponds to the head substrate in the present invention.

  FIG. 17 is a front view for explaining another modified example of the flexible cable 29. In the first embodiment, the configuration in which the flexible cable 29 is bent between the flow path forming substrate 45 and the circuit board 16 is exemplified. However, the configuration is not limited thereto. For example, the flexible cable 29 is connected to the flow path forming substrate 45. A configuration in which the circuit board 16 and the circuit board 16 are bent can also be adopted. For example, the flexible cable 29 of the modified example shown in FIG. 17 is bent by approximately 90 ° at each of the first bent portion 84 in the middle and the second bent portion 85 at a different position. Such a bending method of the flexible cable 29 can be arbitrarily selected according to the layout of the formation position of the terminal portion on the substrate to be mounted. Since the flexible cable 29 is bent between the flow path forming substrate 45 and the circuit board 16 as described above, the flexible cable 29 has a margin in the length as in the first embodiment. Thereby, even if the constituent member that is longer in the Y direction than in the X direction is warped, the influence of the warp can be reduced accordingly. As a result, peeling at the mounting portion of the flexible cable 29 can be more reliably suppressed.

  Further, as the recording head 3 in the above-described embodiment, a so-called line-type recording head that ejects ink to the recording medium S without being scanned in the width direction is illustrated, but the present invention is not limited thereto, and the width of the recording medium S is not limited thereto. The present invention can be similarly applied to a so-called serial type recording head that ejects ink while reciprocating in the direction.

  In the above description, the ink jet recording head 3 which is a kind of liquid ejecting head has been described as an example. However, the present invention can be applied to other liquid ejecting heads that employ a configuration in which a plurality of head units are fixed to a common member. Can also be applied. For example, a color material ejecting head used for manufacturing a color filter such as a liquid crystal display, an electrode material ejecting head used for forming an electrode such as an organic EL (Electro Luminescence) display, FED (surface emitting display), a biochip (biochemical element) The present invention can also be applied to bioorganic matter ejecting heads and the like used in the production of

  DESCRIPTION OF SYMBOLS 1 ... Printer, 2 ... Recording medium, 3 ... Recording head, 4 ... Head unit, 5 ... Conveyance mechanism, 6 ... Medium support part, 7 ... Apparatus main body, 8 ... Liquid supply tube, 9 ... Cable insertion port, 10 ... Conveyance Roller, 13 ... flow path member, 14 ... cover member, 15 ... holder member, 16 ... circuit board, 17 ... fixing plate, 19 ... first receiving recess, 20 ... second receiving recess, 21 ... partition plate, 22 ... side wall , 24 ... Nozzle, 25 ... Nozzle row, 26 ... Nozzle plate, 27 ... Communication channel, 28 ... Wiring insertion port, 29 ... Flexible cable, 31 ... Channel connection, 33 ... First terminal, 34 ... Second Terminal part, 35 ... Circuit board terminal part, 36 ... Connector, 37 ... Escape hole, 39 ... Supply flow path, 40 ... Opening part, 41 ... Inlet, 43 ... Opening for wiring, 44 ... Ink inlet, 45 ... Current Path forming substrate, 46... Protective substrate, 47 Reservoir forming substrate 48 ... Compliance substrate 49 ... Drive IC 50 ... Accommodating space 51 ... Pressure chamber 52 ... Communication part 53 ... Individual supply path 55 ... Elastic film 56 ... Insulating film 57 ... Lower electrode , 58 ... Piezoelectric layer, 59 ... Upper electrode, 60 ... Piezoelectric element, 61 ... Lead electrode, 62 ... Head substrate terminal part, 63 ... Piezoelectric element accommodation empty part, 64 ... Ink storage empty part, 65 ... Reservoir, 67 ... Girder, 68 ... heat conducting member, 69 ... sealing film, 70 ... support plate, 71 ... through opening, 72 ... base film, 73 ... wiring, 76 ... first terminal, 77 ... second terminal, 78 ... first bending 79, second bent portion, 81 ... opening for wiring, 83 ... wire, 84 ... first bent portion, 85 ... second bent portion

Claims (18)

A head unit for ejecting liquid;
A flexible cable having one end fixed to a head substrate of the head unit;
A common member to which a plurality of the head units are fixed;
With
When the three directions orthogonal to each other are defined as a first direction, a second direction, and a third direction, respectively, the common member is placed on a virtual plane determined by the first direction and the second direction. The direction is the thickness direction, and is longer in the first direction than in the second direction,
In the plan view from the third direction, the fixed region in which the flexible cable and the head substrate are fixed is longer in the second direction than in the first direction. A head unit for ejecting liquid;
One end portion is fixed to the head substrate of the head unit, and a flexible cable that supplies a drive signal to the head unit;
A common member to which a plurality of the head units are fixed;
With
When the three directions orthogonal to each other are defined as a first direction, a second direction, and a third direction, respectively, the common member is placed on a virtual plane determined by the first direction and the second direction. The direction is the thickness direction, and is longer in the first direction than in the second direction,
In the flexible cable, a bent portion between a portion along the head substrate and a portion extending in a direction intersecting the head substrate is the second direction rather than the first direction in a plan view from the third direction. A liquid jet head characterized by being long. A circuit board to which the other end of the flexible cable is fixed;
3. The liquid according to claim 1, wherein a region where the flexible cable and the circuit board are fixed in the plan view is longer in the second direction than in the first direction. Jet head. A circuit board to which the other end of the flexible cable is fixed;
In the flexible cable, a bent portion between a portion along the circuit board and a portion extending in a direction crossing the circuit board is longer in the second direction than in the first direction. The liquid ejecting head according to claim 1 or 2. A head unit for ejecting liquid;
One end portion is fixed to the head substrate of the head unit, and a flexible cable that supplies a drive signal to the head unit;
A common member to which a plurality of the head units are fixed;
A circuit board to which the other end of the flexible cable is fixed;
With
When the three directions orthogonal to each other are defined as a first direction, a second direction, and a third direction, respectively, the common member is placed on a virtual plane determined by the first direction and the second direction. The direction is the thickness direction, and is longer in the first direction than in the second direction,
An area in which the flexible cable and the circuit board are fixed in a plan view from the third direction is longer in the second direction than in the first direction. A head unit for ejecting liquid;
One end portion is fixed to the head substrate of the head unit, and a flexible cable that supplies a drive signal to the head unit;
A common member to which a plurality of the head units are fixed;
A circuit board to which the other end of the flexible cable is fixed;
With
When the three directions orthogonal to each other are defined as a first direction, a second direction, and a third direction, respectively, the common member is placed on a virtual plane determined by the first direction and the second direction. The direction is the thickness direction, and is longer in the first direction than in the second direction,
In the flexible cable, a bent portion between a portion along the circuit board and a portion extending in a direction intersecting the circuit board is more in the second direction than in the first direction in a plan view from the third direction. A liquid jet head characterized by being long. A plurality of the circuit boards are provided,
7. The device according to claim 3, further comprising a cover member that covers the plurality of circuit boards with the common member and is longer in the first direction than in the second direction. 8. The liquid jet head according to Item.   The liquid ejecting head according to claim 3, wherein the flexible cable is bent between the head substrate and the circuit substrate.   The liquid ejecting head according to claim 3, wherein the flexible cable is bent between the head substrate and the circuit substrate. A holder member that is longer in the first direction than in the second direction in the plan view;
The holder member is
A first recess formed on the first surface side and housing the head unit; and a second recess formed on the second surface side opposite to the first surface and storing the circuit board. The liquid ejecting head according to claim 3, wherein the liquid ejecting head has a liquid ejecting head.   The liquid ejecting head according to claim 10, wherein a thermal expansion coefficient of the holder member is different from a thermal expansion coefficient of the common member. The head unit is longer in the first direction than in the second direction,
The liquid ejecting head according to claim 1, wherein the plurality of head units are arranged along the first direction.   The region where the flexible cable and the head substrate are fixed in the plan view overlaps with a region where the head unit and the common member are fixed. The liquid jet head described in 1. The position where the flexible cable is separated from the head substrate is biased with respect to the center of the head unit in the first direction,
The flexible cable fixed to the head substrate of the head unit located on both sides in the first direction among the plurality of head units is disposed farther from the center of the common member in the first direction. The liquid ejecting head according to claim 1, wherein the liquid ejecting head is a liquid ejecting head.   The liquid ejecting head according to claim 1, wherein a thickness of the wiring at the one end is smaller than a thickness of the wiring at the other end.   16. The liquid jet head according to claim 1, wherein the wiring pitch at the one end is narrower than the wiring pitch at the other end. The direction in which the wires at the one end are aligned is the width direction of the flexible cable,
17. The liquid jet head according to claim 1, wherein a direction in which the wirings in the other end portion are arranged is a length direction of the flexible cable.   A liquid ejecting apparatus comprising the liquid ejecting head according to claim 1.

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