JP2018537868A - 充填ポートおよび表面実装用終端部をもつ、体積効率を改良した湿式電解コンデンサー - Google Patents
充填ポートおよび表面実装用終端部をもつ、体積効率を改良した湿式電解コンデンサー Download PDFInfo
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- 239000003990 capacitor Substances 0.000 title claims abstract description 107
- 238000000034 method Methods 0.000 claims abstract description 15
- 238000004891 communication Methods 0.000 claims abstract description 13
- 239000003792 electrolyte Substances 0.000 claims abstract description 12
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims description 33
- 229910052715 tantalum Inorganic materials 0.000 claims description 32
- 238000004519 manufacturing process Methods 0.000 claims description 13
- 239000011244 liquid electrolyte Substances 0.000 claims description 10
- 229910052751 metal Inorganic materials 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 10
- 239000011521 glass Substances 0.000 claims description 8
- 238000003466 welding Methods 0.000 claims description 8
- 229920001971 elastomer Polymers 0.000 claims description 5
- 238000007789 sealing Methods 0.000 claims description 4
- 238000000926 separation method Methods 0.000 claims description 4
- 238000003825 pressing Methods 0.000 claims description 3
- 239000000806 elastomer Substances 0.000 claims description 2
- 239000004811 fluoropolymer Substances 0.000 claims description 2
- 229920002313 fluoropolymer Polymers 0.000 claims description 2
- 229920003051 synthetic elastomer Polymers 0.000 claims description 2
- 239000005061 synthetic rubber Substances 0.000 claims description 2
- 239000008188 pellet Substances 0.000 description 11
- 239000000463 material Substances 0.000 description 7
- 230000003647 oxidation Effects 0.000 description 7
- 238000007254 oxidation reaction Methods 0.000 description 7
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 6
- 239000004810 polytetrafluoroethylene Substances 0.000 description 6
- 239000002893 slag Substances 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 5
- 239000010955 niobium Substances 0.000 description 5
- 229910000484 niobium oxide Inorganic materials 0.000 description 5
- 239000007787 solid Substances 0.000 description 5
- ZKATWMILCYLAPD-UHFFFAOYSA-N niobium pentoxide Chemical compound O=[Nb](=O)O[Nb](=O)=O ZKATWMILCYLAPD-UHFFFAOYSA-N 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- 239000010405 anode material Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 229910052758 niobium Inorganic materials 0.000 description 3
- 239000005060 rubber Substances 0.000 description 3
- 239000004696 Poly ether ether ketone Substances 0.000 description 2
- 239000011324 bead Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 229920002530 polyetherether ketone Polymers 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004063 acid-resistant material Substances 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 239000012761 high-performance material Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 1
- URLJKFSTXLNXLG-UHFFFAOYSA-N niobium(5+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Nb+5].[Nb+5] URLJKFSTXLNXLG-UHFFFAOYSA-N 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- -1 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000007784 solid electrolyte Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
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- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/008—Terminals
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
- H01G13/006—Apparatus or processes for applying terminals
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/022—Electrolytes; Absorbents
- H01G9/035—Liquid electrolytes, e.g. impregnating materials
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/04—Electrodes or formation of dielectric layers thereon
- H01G9/06—Mounting in containers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/08—Housing; Encapsulation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/08—Housing; Encapsulation
- H01G9/10—Sealing, e.g. of lead-in wires
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/145—Liquid electrolytic capacitors
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- Chemical Kinetics & Catalysis (AREA)
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Abstract
【選択図】図7
Description
前記本体の壁部に充填ポートを貫通形成する工程、
前記本体の前記内部領域内に容量性素子を設けるとともに、この容量性素子を前記本体から分離する工程、
前記陽極端部にカバーを被せる工程、
前記充填ポートから前記本体の前記内部領域内に電解質を導入する工程、
前記充填ポートに隣接して充填ポートプラグを位置決めする工程、
前記充填ポートプラグ全体に渡り前記本体の外面に前記充填ポートカバーを被せ、前記充填ポートプラグを前記充填ポートに押し付けて、前記充填ポートをシールする工程、
前記容量性素子と電気連絡し、かつ前記本体から分離されたコンデンサーの外面に表面実装陽極終端部を形成する工程、および
前記本体と電気連絡する前記コンデンサーの外面に表面実装陰極終端部を形成する工程を有していればよい。
105:本体
110:電解質
120:陽極
130:陰極
140:ブシュ
145:溝
150:Oリング
202:本体、ケース
203:内部領域
204:角部
206:陽極端部
208:陰極端部
209:内面
210:左側
211:陰極層
212:右側
214:上部
215:ラップ
216:底部
217:空隙
218:充填ポート
219:壁
220:絶縁性挿入体
222、244、252、260:開口
224:フランジ
226:角部
228:壁部
230:容量性素子、固形ペレット陽極体、コンデンサー
231:正面
232:陽極ワイヤ、カバー、GTMS陽極管
234、304:カバー
236:挿入体部分
237:外側部分
238:壁部
240:内向き面
242:陽極管
243、246、264:チャネル
248、256、282:第1壁部分
249:分離性シム
250、258、284:第2壁部分
254:陽極終端部
262:リップ、リップ部分
268:間隙
270:内端
272、274:外端
276:端部
280:陰極終端部
300:液体電解質
302:プラグ
a:埋設法
b:溶接法
Claims (19)
- 内部領域を形成する本体であって、この本体の壁部に形成した充填ポートを有し、そして陰極端部およびこれに対向する陽極端部を有する本体、
前記充填ポートに隣接して位置決めした締め付け充填ポートプラグ、
前記充填ポートプラグに隣接して位置決めされ、前記充填ポートプラグを前記充填ポートに締め付け、前記充填ポートをシールする充填ポートカバー、
前記本体の内部に位置決めされ、かつ前記本体から分離した容量性素子、
前記容量性素子と電気連絡し、前記本体から分離した表面実装陽極終端部、
前記本体と電気連絡する表面実装陰極終端部、および
前記本体の前記内部領域に収めた液体電解質を有することを特徴とする湿式電解表面実装コンデンサー。
- さらに、前記本体の前記陰極端部に隣接した前記本体の前記内部領域内に位置決めした絶縁性挿入体を有し、この絶縁性挿入体を前記容量性素子に係合するように形成するとともに、前記本体から前記容量性素子を分離するように構成した請求項1に記載の湿式電解表面実装コンデンサー。
- さらに、前記容量性素子が前記容量性素子の表面から前記本体の前記陽極端部に向かって延在し、かつ前記本体から外部にアクセスできる陽極ワイヤを有する請求項1に記載の湿式電解表面実装コンデンサー。
- 前記陽極端部が開放し、そしてさらにこの開放陽極端部を塞ぐように位置決めされた前記本体の前記陽極端部に隣接してカバーを有する請求項3に記載の湿式電解表面実装コンデンサー。
- 前記カバーが、ガラス/金属シール(GTMS)カバーを有する請求項4に記載の湿式電解表面実装コンデンサー。
- 前記GTMSカバーが外側導電性部分、非導電性中心挿入体部分、およびこの中心部分を軸方向に貫通延在する陽極管を有し、前記陽極ワイヤをこの陽極管内に位置決めした請求項5に記載の湿式電解表面実装コンデンサー。
- さらに、前記陽極終端部と前記カバーとの間に位置決めした分離性シムを有し、この陽極終端部および分離性シムに貫通形成したチャネル内に前記陽極管が延在する請求項1に記載の湿式電解表面実装コンデンサー。
- 前記本体が全体として矩形形状を有する請求項1に記載の湿式電解表面実装コンデンサー。
- 前記充填ポートプラグが、合成ゴムおよび/またはフルオロポリマーエラストマーを有する請求項1に記載の湿式電解表面実装コンデンサー。
- 前記表面実装陽極終端部および前記表面実装陰極終端部それぞれが、前記コンデンサー本体の底部側にその一部を有する請求項1に記載の湿式電解表面実装コンデンサー。
- さらに、前記本体の少なくとも一部を覆う絶縁性ラップを有する請求項1に記載の湿式電解表面実装コンデンサー。
- 前記陽極端部または前記陰極端部以外の前記本体の一部に前記充填ポートを位置決めした請求項1に記載の湿式電解表面実装コンデンサー。
- 前記表面実装陽極終端部または前記表面実装陰極終端部の任意の部分とは異なる前記本体側に前記充填ポートを位置決めした請求項12に記載の湿式電解表面実装コンデンサー。
- 前記本体をタンタルで構成した請求項1に記載の湿式電解表面実装コンデンサー。
- 内部領域を構成し、開放陽極端部およびこれに対向する閉じた陰極端部を有する本体を形成する工程、
前記本体の壁部に充填ポートを貫通形成する工程、
前記本体の前記内部領域内に容量性素子を設けるとともに、この容量性素子を前記本体から分離する工程、
前記陽極端部にカバーを被せる工程、
前記充填ポートから前記本体の前記内部領域内に電解質を導入する工程、
前記充填ポートに隣接して充填ポートプラグを位置決めする工程、
前記充填ポートプラグ全体に渡り前記本体の外面に前記充填ポートカバーを被せ、前記充填ポートプラグを前記充填ポートに押し付けて、前記充填ポートをシールする工程、
前記容量性素子と電気連絡し、かつ前記本体から分離されたコンデンサーの外面に表面実装陽極終端部を形成する工程、および
前記本体と電気連絡する前記コンデンサーの外面に表面実装陰極終端部を形成する工程を有することを特徴とする湿式電解表面実装コンデンサーの製造方法。
- 前記カバーが外側導電性部分、非導電性中心挿入体部分、およびこの中心部分を軸方向に貫通延在する陽極管を有するGTMSカバーを有し、そしてさらに前記本体の前記陽極端部に隣接して前記カバーを溶接して、前記本体を塞ぐ工程を有する請求項15に記載の製造方法。
- 前記容量性素子がさらにこの表面から延在する陽極ワイヤを有し、そして前記陽極管を介して、かつ前記表面実装陽極終端部と電気連絡する前記陽極ワイヤを位置決めする工程を有する請求項16に記載の製造方法。
- さらに、前記陽極管の少なくとも一部に前記陽極ワイヤの少なくとも一部を溶接する工程を有する請求項17に記載の製造方法。
- さらに、前記陽極終端部の少なくとも一部に前記陽極管の少なくとも一部を溶接する工程を有する請求項18に記載の製造方法。
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US14/942,011 | 2015-11-16 | ||
US14/942,011 US9947479B2 (en) | 2015-11-16 | 2015-11-16 | Volumetric efficiency wet electrolyte capacitor having a fill port and terminations for surface mounting |
PCT/US2016/060916 WO2017087202A1 (en) | 2015-11-16 | 2016-11-08 | Improved volumetric efficiency wet electrolyte capacitor having a fill port and terminations for surface mounting |
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JP2018537868A true JP2018537868A (ja) | 2018-12-20 |
JP2018537868A5 JP2018537868A5 (ja) | 2020-01-09 |
JP7034081B2 JP7034081B2 (ja) | 2022-03-11 |
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EP (1) | EP3378078A4 (ja) |
JP (1) | JP7034081B2 (ja) |
KR (1) | KR102373285B1 (ja) |
CN (1) | CN108463867B (ja) |
IL (1) | IL259309B (ja) |
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US9947479B2 (en) * | 2015-11-16 | 2018-04-17 | Vishay Sprague, Inc. | Volumetric efficiency wet electrolyte capacitor having a fill port and terminations for surface mounting |
US10381166B2 (en) * | 2016-05-25 | 2019-08-13 | Vishay Sprague, Inc. | High performance and reliability solid electrolytic tantalum capacitors and screening method |
US11189431B2 (en) | 2018-07-16 | 2021-11-30 | Vishay Sprague, Inc. | Low profile wet electrolytic tantalum capacitor |
US11024464B2 (en) * | 2018-08-28 | 2021-06-01 | Vishay Israel Ltd. | Hermetically sealed surface mount polymer capacitor |
CN113168966B (zh) * | 2018-11-29 | 2024-01-16 | 京瓷Avx元器件公司 | 含有顺序气相沉积的电介质膜的固体电解电容器 |
CN109817461B (zh) * | 2019-03-08 | 2021-09-28 | 中国振华(集团)新云电子元器件有限责任公司 | 一种非电解质钽电解电容器正负极贴片焊接工艺 |
US11742149B2 (en) | 2021-11-17 | 2023-08-29 | Vishay Israel Ltd. | Hermetically sealed high energy electrolytic capacitor and capacitor assemblies with improved shock and vibration performance |
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CN108463867B (zh) | 2021-06-04 |
WO2017087202A1 (en) | 2017-05-26 |
US20180366273A1 (en) | 2018-12-20 |
US9947479B2 (en) | 2018-04-17 |
CN108463867A (zh) | 2018-08-28 |
TW201719698A (zh) | 2017-06-01 |
IL259309A (en) | 2018-07-31 |
EP3378078A1 (en) | 2018-09-26 |
IL259309B (en) | 2022-05-01 |
US10600576B2 (en) | 2020-03-24 |
US20170140876A1 (en) | 2017-05-18 |
KR20180134325A (ko) | 2018-12-18 |
TWI716488B (zh) | 2021-01-21 |
KR102373285B1 (ko) | 2022-03-10 |
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