JP2018522514A5 - - Google Patents

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Publication number
JP2018522514A5
JP2018522514A5 JP2017560960A JP2017560960A JP2018522514A5 JP 2018522514 A5 JP2018522514 A5 JP 2018522514A5 JP 2017560960 A JP2017560960 A JP 2017560960A JP 2017560960 A JP2017560960 A JP 2017560960A JP 2018522514 A5 JP2018522514 A5 JP 2018522514A5
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JP
Japan
Prior art keywords
metal casing
receiving element
power receiving
metal
magnetic field
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Application number
JP2017560960A
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English (en)
Japanese (ja)
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JP2018522514A (ja
JP6605625B2 (ja
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Priority claimed from US15/167,680 external-priority patent/US10333350B2/en
Publication of JP2018522514A publication Critical patent/JP2018522514A/ja
Publication of JP2018522514A5 publication Critical patent/JP2018522514A5/ja
Application granted granted Critical
Publication of JP6605625B2 publication Critical patent/JP6605625B2/ja
Active legal-status Critical Current
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JP2017560960A 2015-05-29 2016-05-27 金属体の直接場貫通を使用したワイヤレス電力伝達 Active JP6605625B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201562168483P 2015-05-29 2015-05-29
US62/168,483 2015-05-29
US15/167,680 US10333350B2 (en) 2015-05-29 2016-05-27 Wireless power transfer using direct field penetration through a metal object
US15/167,680 2016-05-27
PCT/US2016/034833 WO2016196372A1 (en) 2015-05-29 2016-05-27 Wireless power transfer using direct field penetration through a metal object

Publications (3)

Publication Number Publication Date
JP2018522514A JP2018522514A (ja) 2018-08-09
JP2018522514A5 true JP2018522514A5 (cg-RX-API-DMAC7.html) 2019-09-26
JP6605625B2 JP6605625B2 (ja) 2019-11-13

Family

ID=57399030

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017560960A Active JP6605625B2 (ja) 2015-05-29 2016-05-27 金属体の直接場貫通を使用したワイヤレス電力伝達

Country Status (5)

Country Link
US (1) US10333350B2 (cg-RX-API-DMAC7.html)
EP (1) EP3304690B1 (cg-RX-API-DMAC7.html)
JP (1) JP6605625B2 (cg-RX-API-DMAC7.html)
CN (1) CN107690742B (cg-RX-API-DMAC7.html)
WO (1) WO2016196372A1 (cg-RX-API-DMAC7.html)

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KR102593172B1 (ko) * 2016-10-05 2023-10-24 삼성전자 주식회사 루프 안테나를 갖는 전자 장치
US12224788B2 (en) * 2017-05-25 2025-02-11 Spigen Korea Co., Ltd. Magnetic auxiliary devices for mobile devices
US10469119B2 (en) * 2017-05-25 2019-11-05 Spigen Korea Co., Ltd. Magnetic mount for electronic devices
US12191902B2 (en) 2017-05-25 2025-01-07 Spigen Korea Co., Ltd. Mobile electronic device cases for electromagnetic shielding
CN108695993A (zh) * 2018-05-29 2018-10-23 电子科技大学 一种基于陶瓷谐振器的多级无线功率传输系统
JP2020096414A (ja) * 2018-12-10 2020-06-18 シャープ株式会社 ケース
CN209434964U (zh) * 2019-02-18 2019-09-24 邢益涛 一种具有卡环结构的无线充电发射装置
US11502554B2 (en) 2020-01-23 2022-11-15 Wen Cai Methods and apparatus for online foreign object detection in wireless charging systems
WO2021157652A1 (ja) * 2020-02-06 2021-08-12 東レ株式会社 炭素繊維強化複合材料、積層炭素繊維複合材料、積層複合材料、ワイヤレス給電器向けケースおよびワイヤレス受電器向けケース
WO2024030614A1 (en) * 2022-08-05 2024-02-08 Resonant Link, Inc. High efficiency wireless power transfer to implantable devices
JP2024039913A (ja) * 2022-09-12 2024-03-25 トヨタ自動車株式会社 送電コイルユニット

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JP3887828B2 (ja) 1997-11-20 2007-02-28 セイコーエプソン株式会社 電子機器
US7599743B2 (en) * 2004-06-24 2009-10-06 Ethicon Endo-Surgery, Inc. Low frequency transcutaneous energy transfer to implanted medical device
US7808090B2 (en) * 2004-09-09 2010-10-05 Semiconductor Energy Laboratory Co., Ltd. Wireless chip
US20070217163A1 (en) 2006-03-15 2007-09-20 Wilson Greatbatch Implantable medical electronic device with amorphous metallic alloy enclosure
US9084343B2 (en) * 2009-05-20 2015-07-14 Koninklijke Philips N.V. Electronic device having an inductive receiver coil with ultra-thin shielding layer and method
US9496732B2 (en) * 2011-01-18 2016-11-15 Mojo Mobility, Inc. Systems and methods for wireless power transfer
US10115520B2 (en) * 2011-01-18 2018-10-30 Mojo Mobility, Inc. Systems and method for wireless power transfer
US20120274148A1 (en) * 2011-04-27 2012-11-01 Samsung Electro-Mechanics Co., Ltd. Contactless power transmission device and electronic device having the same
US9531195B2 (en) 2011-04-29 2016-12-27 Cyberonics, Inc. Inductively rechargeable implantable device with reduced eddy currents
WO2013056021A1 (en) 2011-10-13 2013-04-18 Access Business Group International Llc Composite metal surface
CN104011814B (zh) * 2011-12-21 2017-08-15 阿莫先恩电子电器有限公司 磁场屏蔽片及其制造方法和无线充电器用接收装置
US9743565B2 (en) 2012-01-08 2017-08-22 Access Business Group International Llc Wireless power transfer through conductive materials
JP5890191B2 (ja) * 2012-02-06 2016-03-22 トヨタ自動車株式会社 送電装置、受電装置、および電力伝送システム
JP5942530B2 (ja) 2012-03-28 2016-06-29 カシオ計算機株式会社 非接触充電システム及び電子機器
JP6112383B2 (ja) * 2012-06-28 2017-04-12 パナソニックIpマネジメント株式会社 携帯端末
JP5696810B2 (ja) * 2012-09-26 2015-04-08 株式会社村田製作所 アンテナ装置およびアンテナ装置を備えた電子機器
KR101444552B1 (ko) * 2012-12-21 2014-10-30 삼성전기주식회사 자성체 시트, 자성체 시트의 제조방법 및 자성체 시트를 포함하는 무접점 전력 충전 장치
WO2014167881A1 (ja) * 2013-04-08 2014-10-16 株式会社村田製作所 通信端末
US10096903B2 (en) 2013-04-12 2018-10-09 Panasonic Intellectual Property Management Co., Ltd. Antenna, antenna device and communication device
CN103346623A (zh) * 2013-07-15 2013-10-09 曾超宁 低频透射式电力传输装置
EP3057114B1 (en) * 2013-08-08 2018-09-19 IHI Corporation Resonator
JP6171726B2 (ja) * 2013-08-23 2017-08-02 株式会社Ihi 非接触給電装置の製造方法
US10186912B2 (en) * 2013-09-13 2019-01-22 Qualcomm Incorporated Pickup coil design for tight spaces and asymmetrical coupling
US9461500B2 (en) 2013-11-21 2016-10-04 Htc Corporation Wireless charging receiving device and wireless charging system using the same
JP2015149833A (ja) * 2014-02-06 2015-08-20 デクセリアルズ株式会社 電子機器

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