JP2018522422A - 太陽電池アレイシステム及び製造方法 - Google Patents
太陽電池アレイシステム及び製造方法 Download PDFInfo
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Abstract
Description
述べられたように、システムは、小さく(例えば15−20cm2未満など)単一の及び多接合太陽電池を利用し、ここで、正と負の端子は、太陽電池の裏面に提供され、またはそうでなければ配置される。例は、シリコンの単及び多結晶セル、量子セル、CdTeセル、CIGSセル及びIII−V族セルを含む。
これに限定されない例において、パネルは、CTE効果を最小化してパネルの硬さを最大化するために、PCB層の中にカーボンファイバ補強材を組み込む、改良したPCB形態を利用する。
セルを敷設する工程は、標準のエレクトロニクス工業のPnP設備に適合するように構成される。はんだペースト及び/または予備成形物は、太陽電池とPCBの間の電気的な接続を達成するために利用される。相互接続材料の構成は、ペースト形態及び予備成形物において、例えば、Sn96、Sn63、及びAuSnを含む。
組み立て工程は、標準のエレクトロニクス製造及び検査工程を利用する。PCBにおけるセルのパッキングの因子は、セルのX及びY方向の両方の空間を、従来の実用の0.030インチから0.003インチほどの空間に対して、減らすことによって最適化された。
個々の電力モジュールは、PCBと最も大きい許されることができる組み立て工程の大きさの工業の最もよい実用を利用することによって、生み出される。電力モジュールの中の電圧モジュールの設計は、NREと設計コストを最小限にするために標準の形態に基づくことができる。電力モジュールは、アレイ電力を増加するように、大きなパネルの組み立て品の中に配置される。これらの電力モジュールは、それぞれの電力モジュールの中に一体化されるコネクタ/接続を備える全電力アレイを形成するために、接続される。
PCBに連結される複数の太陽電池によって、形成される、電力モジュールは、大きなアレイを形成するために、固定された下地構造の上に配置される。下地構造は、電力モジュールの支持体、押し下げ機構の配置、及びヒンジ取り付け部の機構を提供する。別の実施形態において、柔軟な構造またはパネルは、お互いに複数の固定された支持構造を取り付けて使われることができる。これにより、1つの固定された構造は、さまざまな動作を提供する柔軟な構造を備える別の固定された構造に対して、動作し、関節となることを許す。
Claims (12)
- 宇宙空間品質の太陽電池アレイの製造方法であって、
複数の太陽電池を有する太陽電池ウェハを供給し、
保護カバーガラスで太陽電池ウェハを覆い、
太陽電池ウェハとカバーガラスの両方を複数の太陽電池に切り出すことにおいて、それぞれの太陽電池は、正の電気の接点と負の電気の接点を有し、正の電気の接点と負の電気の接点の両方は、太陽電池の共通の、裏面に配置されて、切り出し、
それぞれの太陽電池の正の電気の接点と負の電気の接点が、プリント回路基板の対応する電気の接点に電気的に連結するように、それぞれの太陽電池の裏面がプリント回路基板の前面と接触して、プリント回路基板の上に太陽電池を配置することにおいて、プリント回路基板は、太陽電池から太陽電池への相互接続配線及びバイパス、及びブロッキングダイオードを含む電気の配線を有して、配置する、
ことを備える宇宙空間品質の太陽電池アレイの製造方法。 - 保護カバーガラスは、太陽電池ウェハを複数の太陽電池に切り出す前に太陽電池ウェハ上に配置される、請求項1に記載の方法。
- 保護カバーガラスは、太陽電池ウェハを複数の太陽電池に切り出した後、複数の太陽電池上に配置され、また、一方で、複数の太陽電池が、プリント回路基板に配置される、請求項1に記載の方法。
- プリント回路基板は、固定されている、請求項1に記載の方法。
- プリント回路基板は、柔軟性がある、請求項1に記載の方法。
- プリント回路基板は、太陽電池アレイパネルとして機能する、請求項1に記載の方法。
- さらに太陽電池アレイパネルの上へ、太陽電池を備えるプリント回路基板を配置することを備える、請求項1に記載の方法。
- 太陽電池ウェハは、20cm2程度の大きさの太陽電池に切り出される、請求項1に記載の方法。
- さらに、プリント回路基板の裏面へ、バイパスとブロッキングダイオードを設置することを備える、請求項1に記載の方法。
- ピックアンドプレースロボットが、プリント回路基板の上に太陽電池を配置するために使われる、請求項1に記載の方法。
- ピックアンドプレースロボットが、人が干渉することなく、プリント回路基板の上に太陽電池を配置するために自動的に使われる、請求項1に記載の方法。
- 太陽電池ウェハとカバーガラスの両方を複数の太陽電池に切り出すステップは、切削工具を使って、切削工具の一回の動作で、太陽電池ウェハとカバーガラスの両方を切り開くことを備える、請求項1に記載の方法。
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WO2019003415A1 (ja) | 2017-06-30 | 2019-01-03 | 三菱電機株式会社 | 太陽光発電装置、太陽電池パドル、宇宙構造物および太陽光発電装置の製造方法 |
CN107919852A (zh) * | 2017-12-15 | 2018-04-17 | 武汉工程大学 | 一种以pcb板为底板的集成式光伏组件 |
CA3137371A1 (en) | 2019-04-26 | 2020-10-29 | Pharos Solar Llc | Half-cell photovoltaic modules |
DE102019006095A1 (de) * | 2019-08-29 | 2021-03-04 | Azur Space Solar Power Gmbh | Vereinzelungsverfahren zur Vereinzelung einer mehrere Solarzellenstapel umfasssenden Halbleiterscheibe |
AU2020406244B2 (en) | 2019-12-19 | 2022-06-16 | Airbus Defence And Space Sas | Photovoltaic module and flexible satellite solar generator |
CN111416010B (zh) * | 2020-03-04 | 2021-11-26 | 上海空间电源研究所 | 一种太阳电池电路高压防护设计结构及其制备方法 |
CN112909110A (zh) * | 2021-01-14 | 2021-06-04 | 航天科工空间工程发展有限公司 | 一种适配卷式太阳翼的柔性太阳电池阵 |
US11967661B1 (en) | 2021-01-27 | 2024-04-23 | Bae Systems Space & Mission Systems Inc. | Solar panel design and methods for magnetic cleanliness |
FR3131442A1 (fr) * | 2021-12-29 | 2023-06-30 | Centre National d'Études Spatiales | Panneau solaire comportant notamment une pluralité de zones de composants électroniques connectées entre elles par une pluralité de câbles électriques. |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08298334A (ja) * | 1995-04-26 | 1996-11-12 | Mitsubishi Electric Corp | 太陽電池板 |
JPH11238896A (ja) * | 1997-12-16 | 1999-08-31 | Sharp Corp | 太陽電池の製造方法および保護カバー用素材板 |
JP2001332753A (ja) * | 2000-05-22 | 2001-11-30 | Boeing Co:The | 軽量の太陽電池モジュールおよびその製造方法 |
WO2005091378A2 (de) * | 2004-03-19 | 2005-09-29 | Sunways Ag | Solarzellenmodule |
JP2010506733A (ja) * | 2006-10-17 | 2010-03-04 | フライズ・メタルズ・インコーポレイテッド | 電気装置の配線に使用するための材料および関連する方法 |
JP2011171529A (ja) * | 2010-02-19 | 2011-09-01 | Nippon Steel Corp | 電力用半導体素子 |
JP2012510183A (ja) * | 2008-11-26 | 2012-04-26 | マイクロリンク デバイセズ, インク. | エミッタ層に接触する裏面バイアを備えた太陽電池 |
WO2012160765A1 (ja) * | 2011-05-20 | 2012-11-29 | パナソニック株式会社 | 多接合型化合物太陽電池セル、多接合型化合物太陽電池およびその製造方法 |
US20130112233A1 (en) * | 2011-10-31 | 2013-05-09 | Kevin Michael Coakley | Interdigitated foil interconnect for rear-contact solar cells |
Family Cites Families (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4509248A (en) * | 1982-03-04 | 1985-04-09 | Spire Corporation | Encapsulation of solar cells |
GB8714991D0 (en) | 1987-06-26 | 1987-08-05 | Britax Wingard Ltd | Exterior rear view mirror |
US5021099A (en) * | 1988-08-09 | 1991-06-04 | The Boeing Company | Solar cell interconnection and packaging using tape carrier |
US5185042A (en) | 1991-08-01 | 1993-02-09 | Trw Inc. | Generic solar cell array using a printed circuit substrate |
CN1169228C (zh) | 1995-08-24 | 2004-09-29 | 佳能株式会社 | 太阳能电池组件,其制造方法以及建筑物构件 |
US6337283B1 (en) * | 1999-12-30 | 2002-01-08 | Sunpower Corporation | Method of fabricating a silicon solar cell |
US6300158B1 (en) * | 2000-08-28 | 2001-10-09 | Iowa Thin Films | Integrated solar power module |
US20050161079A1 (en) * | 2002-11-12 | 2005-07-28 | Gray Randolph D. | System and apparatus for charging an electronic device using solar energy |
US20080223429A1 (en) * | 2004-08-09 | 2008-09-18 | The Australian National University | Solar Cell (Sliver) Sub-Module Formation |
US7554031B2 (en) * | 2005-03-03 | 2009-06-30 | Sunpower Corporation | Preventing harmful polarization of solar cells |
US7468485B1 (en) | 2005-08-11 | 2008-12-23 | Sunpower Corporation | Back side contact solar cell with doped polysilicon regions |
EP1964165B1 (en) | 2005-12-21 | 2018-03-14 | Sunpower Corporation | Fabrication processes of back side contact solar cells |
US7235736B1 (en) * | 2006-03-18 | 2007-06-26 | Solyndra, Inc. | Monolithic integration of cylindrical solar cells |
US20080251121A1 (en) * | 2007-04-12 | 2008-10-16 | Charles Stone | Oxynitride passivation of solar cell |
US8614395B1 (en) | 2007-11-01 | 2013-12-24 | Sandia Corporation | Solar cell with back side contacts |
US20090266395A1 (en) * | 2007-11-08 | 2009-10-29 | Sunrgi | Solar concentration and cooling devices, arrangements and methods |
JP5152858B2 (ja) * | 2008-08-22 | 2013-02-27 | シャープ株式会社 | 太陽電池モジュールおよびその製造方法 |
US20110272006A1 (en) * | 2009-01-16 | 2011-11-10 | Yasushi Sainoo | Solar cell module and method for manufacturing solar cell module |
TW201210058A (en) * | 2010-05-12 | 2012-03-01 | Applied Materials Inc | Method of manufacturing crystalline silicon solar cells using epitaxial deposition |
JP2013165087A (ja) * | 2010-05-31 | 2013-08-22 | Sanyo Electric Co Ltd | 半導体モジュールおよび半導体モジュールの製造方法 |
US20120024337A1 (en) * | 2010-07-29 | 2012-02-02 | John Bellacicco | Apparatus facilitating wiring of multiple solar panels |
US8232129B2 (en) | 2010-12-16 | 2012-07-31 | The Boeing Company | Bonding solar cells directly to polyimide |
US20140167677A1 (en) * | 2011-07-13 | 2014-06-19 | Harold E. Voelkner | Long-lasting, high power density and flexible photovoltaic (pv) crystalline cell panel, a method for manufacturing the solar panel and integrated solar power generation and supply system |
WO2013062734A1 (en) * | 2011-10-26 | 2013-05-02 | Applied Materials, Inc. | Monolothic module assembly for standard crystalline silicon solar cells |
US20140196779A1 (en) * | 2012-04-06 | 2014-07-17 | Solar Junction Corporation | Multi-junction solar cells with through-substrate vias |
US9515217B2 (en) * | 2012-11-05 | 2016-12-06 | Solexel, Inc. | Monolithically isled back contact back junction solar cells |
TWI578411B (zh) * | 2014-04-03 | 2017-04-11 | 精材科技股份有限公司 | 晶片封裝體的製造方法 |
US20150287865A1 (en) * | 2014-04-07 | 2015-10-08 | Solaero Technologies Corp. | Parallel interconnection of neighboring solar cells via a common back plane |
-
2016
- 2016-07-14 JP JP2018503797A patent/JP7030683B2/ja active Active
- 2016-07-14 EP EP16831027.4A patent/EP3329521B1/en active Active
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- 2017-11-21 US US15/819,196 patent/US10770606B2/en active Active
-
2020
- 2020-07-31 US US16/944,739 patent/US11264522B2/en active Active
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08298334A (ja) * | 1995-04-26 | 1996-11-12 | Mitsubishi Electric Corp | 太陽電池板 |
JPH11238896A (ja) * | 1997-12-16 | 1999-08-31 | Sharp Corp | 太陽電池の製造方法および保護カバー用素材板 |
JP2001332753A (ja) * | 2000-05-22 | 2001-11-30 | Boeing Co:The | 軽量の太陽電池モジュールおよびその製造方法 |
WO2005091378A2 (de) * | 2004-03-19 | 2005-09-29 | Sunways Ag | Solarzellenmodule |
JP2010506733A (ja) * | 2006-10-17 | 2010-03-04 | フライズ・メタルズ・インコーポレイテッド | 電気装置の配線に使用するための材料および関連する方法 |
JP2012510183A (ja) * | 2008-11-26 | 2012-04-26 | マイクロリンク デバイセズ, インク. | エミッタ層に接触する裏面バイアを備えた太陽電池 |
JP2011171529A (ja) * | 2010-02-19 | 2011-09-01 | Nippon Steel Corp | 電力用半導体素子 |
WO2012160765A1 (ja) * | 2011-05-20 | 2012-11-29 | パナソニック株式会社 | 多接合型化合物太陽電池セル、多接合型化合物太陽電池およびその製造方法 |
US20130112233A1 (en) * | 2011-10-31 | 2013-05-09 | Kevin Michael Coakley | Interdigitated foil interconnect for rear-contact solar cells |
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EP3329521A4 (en) | 2019-03-06 |
TW201711372A (zh) | 2017-03-16 |
EP3329521A1 (en) | 2018-06-06 |
EP3329521B1 (en) | 2022-07-06 |
US11264522B2 (en) | 2022-03-01 |
US10770606B2 (en) | 2020-09-08 |
TWI648946B (zh) | 2019-01-21 |
US20180097133A1 (en) | 2018-04-05 |
WO2017019308A1 (en) | 2017-02-02 |
US20200357940A1 (en) | 2020-11-12 |
JP7030683B2 (ja) | 2022-03-07 |
ES2926948T3 (es) | 2022-10-31 |
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