JP2018502040A5 - - Google Patents
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- Publication number
- JP2018502040A5 JP2018502040A5 JP2017533968A JP2017533968A JP2018502040A5 JP 2018502040 A5 JP2018502040 A5 JP 2018502040A5 JP 2017533968 A JP2017533968 A JP 2017533968A JP 2017533968 A JP2017533968 A JP 2017533968A JP 2018502040 A5 JP2018502040 A5 JP 2018502040A5
- Authority
- JP
- Japan
- Prior art keywords
- energy
- electromagnetic beam
- less
- diffusion bond
- absorbing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000009792 diffusion process Methods 0.000 claims 10
- 239000000463 material Substances 0.000 claims 10
- 239000013590 bulk material Substances 0.000 claims 7
- 239000012212 insulator Substances 0.000 claims 5
- 238000000034 method Methods 0.000 claims 5
- 229910052755 nonmetal Inorganic materials 0.000 claims 5
- 238000007789 sealing Methods 0.000 claims 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims 2
- 238000010521 absorption reaction Methods 0.000 claims 2
- 238000005260 corrosion Methods 0.000 claims 2
- 230000007797 corrosion Effects 0.000 claims 2
- 230000005670 electromagnetic radiation Effects 0.000 claims 2
- 229910052594 sapphire Inorganic materials 0.000 claims 2
- 239000010980 sapphire Substances 0.000 claims 2
- 239000010936 titanium Substances 0.000 claims 2
- 229910052719 titanium Inorganic materials 0.000 claims 2
- 230000002745 absorbent Effects 0.000 claims 1
- 239000002250 absorbent Substances 0.000 claims 1
- 239000011810 insulating material Substances 0.000 claims 1
- 238000003825 pressing Methods 0.000 claims 1
- 230000005855 radiation Effects 0.000 claims 1
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201462096706P | 2014-12-24 | 2014-12-24 | |
| US62/096,706 | 2014-12-24 | ||
| US14/976,475 | 2015-12-21 | ||
| US14/976,475 US10124559B2 (en) | 2014-12-24 | 2015-12-21 | Kinetically limited nano-scale diffusion bond structures and methods |
| PCT/US2015/067390 WO2016106323A1 (en) | 2014-12-24 | 2015-12-22 | Kinetically limited nano-scale diffusion bond structures and methods |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2018502040A JP2018502040A (ja) | 2018-01-25 |
| JP2018502040A5 true JP2018502040A5 (https=) | 2020-04-16 |
| JP6761419B2 JP6761419B2 (ja) | 2020-09-23 |
Family
ID=55262895
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017533968A Active JP6761419B2 (ja) | 2014-12-24 | 2015-12-22 | 速度論的に制限されたナノスケールの拡散ボンド構造及び方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (3) | US10124559B2 (https=) |
| EP (1) | EP3237141B1 (https=) |
| JP (1) | JP6761419B2 (https=) |
| KR (1) | KR102474915B1 (https=) |
| CN (1) | CN107107251B (https=) |
| WO (1) | WO2016106323A1 (https=) |
Families Citing this family (34)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10124559B2 (en) | 2014-12-24 | 2018-11-13 | Medtronic, Inc. | Kinetically limited nano-scale diffusion bond structures and methods |
| US10136535B2 (en) | 2014-12-24 | 2018-11-20 | Medtronic, Inc. | Hermetically-sealed packages including feedthrough assemblies |
| US9968794B2 (en) | 2014-12-24 | 2018-05-15 | Medtronic, Inc. | Implantable medical device system including feedthrough assembly and method of forming same |
| US9865533B2 (en) | 2014-12-24 | 2018-01-09 | Medtronic, Inc. | Feedthrough assemblies |
| US20170100597A1 (en) * | 2015-10-12 | 2017-04-13 | Medtronic, Inc. | Sealed implantable medical device and method of forming same |
| US10772228B2 (en) | 2015-11-03 | 2020-09-08 | Medtronic, Inc. | Sealed package including electronic device and power source |
| US10098589B2 (en) | 2015-12-21 | 2018-10-16 | Medtronic, Inc. | Sealed package and method of forming same |
| US10252371B2 (en) * | 2016-02-12 | 2019-04-09 | The Boeing Company | Diffusion-bonded metallic materials |
| US20190177219A1 (en) | 2016-06-03 | 2019-06-13 | Raymond Miller Karam | Method and apparatus for vacuum insulated glazings |
| US10580544B2 (en) | 2016-12-07 | 2020-03-03 | Medtronic, Inc. | Power source and method of forming same |
| US10463285B2 (en) | 2017-04-03 | 2019-11-05 | Medtronic, Inc. | Hermetically-sealed package and method of forming same |
| US10542921B2 (en) | 2017-04-03 | 2020-01-28 | Medtronic, Inc. | Hermetically-sealed package and method of forming same |
| US10918874B2 (en) | 2018-06-28 | 2021-02-16 | Medtronic, Inc. | Sealed package and method of forming same |
| DE102018120011B4 (de) * | 2018-08-16 | 2022-06-15 | Trumpf Laser Und Systemtechnik Gmbh | Schweißverfahren zum Verbinden eines transparenten, aluminiumoxidhaltigen ersten Substrats mit einem opaken zweiten Substrat |
| US10888009B2 (en) * | 2018-10-26 | 2021-01-05 | Medtronic, Inc. | Method of forming a sealed package |
| US11865639B2 (en) | 2019-12-13 | 2024-01-09 | Medtronic, Inc. | Hermetic assembly and device including same |
| US11633611B2 (en) | 2019-12-19 | 2023-04-25 | Medtronic, Inc. | Feedthrough assembly and device including same |
| US20210186422A1 (en) * | 2019-12-20 | 2021-06-24 | Medtronic, Inc. | Implantable medical device with metal and polymer housing |
| WO2022018069A2 (de) * | 2020-07-22 | 2022-01-27 | Trumpf Laser- Und Systemtechnik Gmbh | Vorrichtung und verfahren zum fügen mindestens zweier fügepartner |
| CN116056756A (zh) * | 2020-09-09 | 2023-05-02 | 美敦力公司 | 电子封装和包括该电子封装的植入式医疗装置 |
| US11725995B2 (en) | 2021-02-01 | 2023-08-15 | Medtronic, Inc. | Pressure sensor assembly for use in implantable medical device including a substrate having via that extends through substrate along via axis between first major surface and second major surface of substrate |
| US12290693B2 (en) | 2021-02-01 | 2025-05-06 | Medtronic, Inc. | Feedthrough header assembly and device including same |
| US12082354B2 (en) | 2021-02-01 | 2024-09-03 | Medtronic, Inc. | Electronic package and device including same |
| WO2022165297A1 (en) | 2021-02-01 | 2022-08-04 | Medtronic, Inc. | Feedthrough header assembly and device including same |
| EP4395956A1 (en) | 2021-08-30 | 2024-07-10 | Corning Incorporated | Laser bonding of glass to thin metal foil |
| US12485276B1 (en) | 2021-12-03 | 2025-12-02 | Greatbatch Ltd. | Miniature active implantable medical device having a high-purity fused silica wafer assembly micro-bonded to a titanium power source housing |
| WO2023152610A1 (en) | 2022-02-08 | 2023-08-17 | Medtronic, Inc. | Feedthrough assembly and implantable medical device including same |
| WO2025046334A1 (en) | 2023-08-31 | 2025-03-06 | Medtronic, Inc. | Feedthrough assembly and device including same |
| WO2025158310A1 (en) | 2024-01-24 | 2025-07-31 | Medtronic, Inc. | Pressure sensor assembly and implantable medical device including same |
| US20250263346A1 (en) | 2024-02-19 | 2025-08-21 | Greatbatch Ltd | Micro-Scale Diffusion Bonding of an Optically Transparent Ceramic To a Conductive Metal |
| WO2025226825A1 (en) * | 2024-04-23 | 2025-10-30 | The Board Of Trustees Of The Leland Stanford Junior University | Wafer-scale thin-film titanium:sapphire photonics |
| WO2025250759A1 (en) | 2024-05-31 | 2025-12-04 | Medtronic, Inc. | Implantable medical device and enclosure including vent |
| WO2026038093A1 (en) | 2024-08-13 | 2026-02-19 | Medtronic, Inc. | Flexible implantable medical device |
| WO2026043723A1 (en) | 2024-08-23 | 2026-02-26 | Medtronic, Inc. | Modular non-hermetic implantable medical device |
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| JPS59101296A (ja) | 1982-12-02 | 1984-06-11 | Mitsubishi Heavy Ind Ltd | レ−ザ溶接装置 |
| NL8303109A (nl) | 1983-09-08 | 1985-04-01 | Philips Nv | Werkwijze voor het aan elkaar bevestigen van twee delen. |
| NL8600216A (nl) | 1986-01-30 | 1987-08-17 | Philips Nv | Werkwijze voor het vervaardigen van een halfgeleiderinrichting. |
| NL8902271A (nl) | 1989-09-12 | 1991-04-02 | Philips Nv | Werkwijze voor het verbinden van twee lichamen. |
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| EP1903000B1 (fr) | 2006-09-25 | 2019-09-18 | Sorin CRM SAS | Composant biocompatible implantable incorporant un élément actif intégré tel qu'un capteur de mesure d'un paramètre physiologique, microsystème électromécanique ou circuit électronique |
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| US9171721B2 (en) | 2010-10-26 | 2015-10-27 | Medtronic, Inc. | Laser assisted direct bonding |
| US8666505B2 (en) | 2010-10-26 | 2014-03-04 | Medtronic, Inc. | Wafer-scale package including power source |
| US8796109B2 (en) | 2010-12-23 | 2014-08-05 | Medtronic, Inc. | Techniques for bonding substrates using an intermediate layer |
| US9492990B2 (en) * | 2011-11-08 | 2016-11-15 | Picosys Incorporated | Room temperature glass-to-glass, glass-to-plastic and glass-to-ceramic/semiconductor bonding |
| CN104125870A (zh) * | 2012-02-14 | 2014-10-29 | 东曹Smd有限公司 | 低偏转溅射靶组件及其制造方法 |
| US10124559B2 (en) | 2014-12-24 | 2018-11-13 | Medtronic, Inc. | Kinetically limited nano-scale diffusion bond structures and methods |
-
2015
- 2015-12-21 US US14/976,475 patent/US10124559B2/en active Active
- 2015-12-22 EP EP15828908.2A patent/EP3237141B1/en active Active
- 2015-12-22 CN CN201580071155.7A patent/CN107107251B/zh active Active
- 2015-12-22 JP JP2017533968A patent/JP6761419B2/ja active Active
- 2015-12-22 KR KR1020177020574A patent/KR102474915B1/ko active Active
- 2015-12-22 WO PCT/US2015/067390 patent/WO2016106323A1/en not_active Ceased
-
2018
- 2018-10-10 US US16/156,760 patent/US10981355B2/en active Active
-
2021
- 2021-03-15 US US17/202,234 patent/US12454117B2/en active Active
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