JP2018501546A5 - - Google Patents

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Publication number
JP2018501546A5
JP2018501546A5 JP2017523332A JP2017523332A JP2018501546A5 JP 2018501546 A5 JP2018501546 A5 JP 2018501546A5 JP 2017523332 A JP2017523332 A JP 2017523332A JP 2017523332 A JP2017523332 A JP 2017523332A JP 2018501546 A5 JP2018501546 A5 JP 2018501546A5
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JP
Japan
Prior art keywords
core
temperature
determining
threshold
cores
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2017523332A
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English (en)
Japanese (ja)
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JP2018501546A (ja
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Publication date
Priority claimed from US14/675,409 external-priority patent/US9582052B2/en
Application filed filed Critical
Publication of JP2018501546A publication Critical patent/JP2018501546A/ja
Publication of JP2018501546A5 publication Critical patent/JP2018501546A5/ja
Pending legal-status Critical Current

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JP2017523332A 2014-10-30 2015-10-05 マルチコアプロセッサの熱緩和 Pending JP2018501546A (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201462072975P 2014-10-30 2014-10-30
US62/072,975 2014-10-30
US14/675,409 US9582052B2 (en) 2014-10-30 2015-03-31 Thermal mitigation of multi-core processor
US14/675,409 2015-03-31
PCT/US2015/054048 WO2016069209A1 (en) 2014-10-30 2015-10-05 Thermal mitigation of multi-core processor

Publications (2)

Publication Number Publication Date
JP2018501546A JP2018501546A (ja) 2018-01-18
JP2018501546A5 true JP2018501546A5 (enExample) 2018-10-25

Family

ID=55852598

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017523332A Pending JP2018501546A (ja) 2014-10-30 2015-10-05 マルチコアプロセッサの熱緩和

Country Status (5)

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US (2) US9582052B2 (enExample)
EP (1) EP3213202B1 (enExample)
JP (1) JP2018501546A (enExample)
CN (1) CN107111518B (enExample)
WO (1) WO2016069209A1 (enExample)

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US10496141B2 (en) * 2016-03-17 2019-12-03 Qualcomm Incorporated System and method for intelligent thermal management in a system on a chip having a heterogeneous cluster architecture
US11399720B2 (en) 2016-04-05 2022-08-02 Qulacomm Incorporated Circuits and methods providing temperature mitigation for computing devices
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US10884811B2 (en) * 2017-06-04 2021-01-05 Apple Inc. Scheduler for AMP architecture with closed loop performance controller using static and dynamic thread grouping
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US10985982B2 (en) * 2017-09-27 2021-04-20 Sonos, Inc. Proximal playback devices
CN107817836A (zh) * 2017-10-27 2018-03-20 界首广播电视台 发射机与多功器系统的控温方法
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CN110794949A (zh) * 2019-09-27 2020-02-14 苏州浪潮智能科技有限公司 一种基于部件温度自动分配计算资源的降功耗方法和系统
CN110764605B (zh) * 2019-10-30 2021-11-02 Oppo广东移动通信有限公司 多核处理器控制方法、装置、电子设备及存储介质
WO2022036712A1 (zh) * 2020-08-21 2022-02-24 华为技术有限公司 一种频率控制方法及装置
US12346775B2 (en) * 2021-12-22 2025-07-01 Red Hat, Inc. Migrating quantum services based on temperature thresholds
CN114356570A (zh) * 2021-12-31 2022-04-15 联想(北京)有限公司 一种处理器调节方法、系统及电子设备
CN117271427B (zh) * 2022-06-14 2025-09-05 北京有竹居网络技术有限公司 处理器以及用于数据处理的方法、设备和存储介质
US20240272698A1 (en) * 2023-02-13 2024-08-15 Qualcomm Incorporated Thermal mitigation systems and methods for multi-core processors
CN116935904A (zh) * 2023-07-10 2023-10-24 山东华芯半导体有限公司 一种固态存储设备温控方法
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US9582052B2 (en) 2014-10-30 2017-02-28 Qualcomm Incorporated Thermal mitigation of multi-core processor

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