JP2018501546A5 - - Google Patents
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- JP2018501546A5 JP2018501546A5 JP2017523332A JP2017523332A JP2018501546A5 JP 2018501546 A5 JP2018501546 A5 JP 2018501546A5 JP 2017523332 A JP2017523332 A JP 2017523332A JP 2017523332 A JP2017523332 A JP 2017523332A JP 2018501546 A5 JP2018501546 A5 JP 2018501546A5
- Authority
- JP
- Japan
- Prior art keywords
- core
- temperature
- determining
- threshold
- cores
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 claims description 32
- 230000006870 function Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201462072975P | 2014-10-30 | 2014-10-30 | |
| US62/072,975 | 2014-10-30 | ||
| US14/675,409 US9582052B2 (en) | 2014-10-30 | 2015-03-31 | Thermal mitigation of multi-core processor |
| US14/675,409 | 2015-03-31 | ||
| PCT/US2015/054048 WO2016069209A1 (en) | 2014-10-30 | 2015-10-05 | Thermal mitigation of multi-core processor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2018501546A JP2018501546A (ja) | 2018-01-18 |
| JP2018501546A5 true JP2018501546A5 (enExample) | 2018-10-25 |
Family
ID=55852598
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017523332A Pending JP2018501546A (ja) | 2014-10-30 | 2015-10-05 | マルチコアプロセッサの熱緩和 |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US9582052B2 (enExample) |
| EP (1) | EP3213202B1 (enExample) |
| JP (1) | JP2018501546A (enExample) |
| CN (1) | CN107111518B (enExample) |
| WO (1) | WO2016069209A1 (enExample) |
Families Citing this family (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102210770B1 (ko) * | 2014-09-02 | 2021-02-02 | 삼성전자주식회사 | 반도체 장치, 반도체 시스템 및 그 제어 방법 |
| US9582052B2 (en) | 2014-10-30 | 2017-02-28 | Qualcomm Incorporated | Thermal mitigation of multi-core processor |
| US9958921B2 (en) * | 2015-03-09 | 2018-05-01 | Advanced Micro Devices, Inc. | Power management to change power limits based on device skin temperature |
| US20170039093A1 (en) * | 2015-08-04 | 2017-02-09 | Futurewei Technologies, Inc. | Core load knowledge for elastic load balancing of threads |
| KR20170069730A (ko) * | 2015-12-11 | 2017-06-21 | 삼성전자주식회사 | 온도 및 공간적인 위치에 따라 코어들의 동작들을 관리하는 연산 처리 장치, 및 연산 처리 장치를 포함하는 전자 장치 |
| US10496141B2 (en) * | 2016-03-17 | 2019-12-03 | Qualcomm Incorporated | System and method for intelligent thermal management in a system on a chip having a heterogeneous cluster architecture |
| US11399720B2 (en) | 2016-04-05 | 2022-08-02 | Qulacomm Incorporated | Circuits and methods providing temperature mitigation for computing devices |
| US9753773B1 (en) | 2016-10-19 | 2017-09-05 | International Business Machines Corporation | Performance-based multi-mode task dispatching in a multi-processor core system for extreme temperature avoidance |
| US9747139B1 (en) | 2016-10-19 | 2017-08-29 | International Business Machines Corporation | Performance-based multi-mode task dispatching in a multi-processor core system for high temperature avoidance |
| US10884811B2 (en) * | 2017-06-04 | 2021-01-05 | Apple Inc. | Scheduler for AMP architecture with closed loop performance controller using static and dynamic thread grouping |
| CN107390834A (zh) * | 2017-06-30 | 2017-11-24 | 广东欧珀移动通信有限公司 | 终端设备、温升控制方法、控制装置及存储介质 |
| US10985982B2 (en) * | 2017-09-27 | 2021-04-20 | Sonos, Inc. | Proximal playback devices |
| CN107817836A (zh) * | 2017-10-27 | 2018-03-20 | 界首广播电视台 | 发射机与多功器系统的控温方法 |
| WO2019199358A2 (en) * | 2017-12-06 | 2019-10-17 | Plume Design, Inc. | Thermal management of wireless access points |
| US11119830B2 (en) * | 2017-12-18 | 2021-09-14 | International Business Machines Corporation | Thread migration and shared cache fencing based on processor core temperature |
| CN108834187B (zh) * | 2018-06-12 | 2021-05-28 | 深圳市沃特沃德股份有限公司 | 移动终端及其温控方法 |
| US11188379B2 (en) | 2018-09-21 | 2021-11-30 | International Business Machines Corporation | Thermal capacity optimization for maximized single core performance |
| US11256232B2 (en) | 2019-07-16 | 2022-02-22 | Motorola Solutions, Inc. | Thermal mitigation within a converged radio device |
| KR102785460B1 (ko) | 2019-07-22 | 2025-03-26 | 삼성전자주식회사 | 전자 장치 및 전자 장치에서 발열 기반의 데이터 처리량 제어 방법 |
| CN110794949A (zh) * | 2019-09-27 | 2020-02-14 | 苏州浪潮智能科技有限公司 | 一种基于部件温度自动分配计算资源的降功耗方法和系统 |
| CN110764605B (zh) * | 2019-10-30 | 2021-11-02 | Oppo广东移动通信有限公司 | 多核处理器控制方法、装置、电子设备及存储介质 |
| WO2022036712A1 (zh) * | 2020-08-21 | 2022-02-24 | 华为技术有限公司 | 一种频率控制方法及装置 |
| US12346775B2 (en) * | 2021-12-22 | 2025-07-01 | Red Hat, Inc. | Migrating quantum services based on temperature thresholds |
| CN114356570A (zh) * | 2021-12-31 | 2022-04-15 | 联想(北京)有限公司 | 一种处理器调节方法、系统及电子设备 |
| CN117271427B (zh) * | 2022-06-14 | 2025-09-05 | 北京有竹居网络技术有限公司 | 处理器以及用于数据处理的方法、设备和存储介质 |
| US20240272698A1 (en) * | 2023-02-13 | 2024-08-15 | Qualcomm Incorporated | Thermal mitigation systems and methods for multi-core processors |
| CN116935904A (zh) * | 2023-07-10 | 2023-10-24 | 山东华芯半导体有限公司 | 一种固态存储设备温控方法 |
| US20250284307A1 (en) * | 2024-03-06 | 2025-09-11 | Nvidia Corporation | Processor clock scaling technique |
Family Cites Families (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020087903A1 (en) * | 2000-12-29 | 2002-07-04 | James Hermerding | Mechanism for managing power generated in a computer system |
| US8037445B2 (en) * | 2003-08-20 | 2011-10-11 | Hewlett-Packard Development Company, L.P. | System for and method of controlling a VLSI environment |
| US7263457B2 (en) | 2006-01-03 | 2007-08-28 | Advanced Micro Devices, Inc. | System and method for operating components of an integrated circuit at independent frequencies and/or voltages |
| US20080005591A1 (en) | 2006-06-28 | 2008-01-03 | Trautman Mark A | Method, system, and apparatus for dynamic thermal management |
| US20080263324A1 (en) * | 2006-08-10 | 2008-10-23 | Sehat Sutardja | Dynamic core switching |
| US7783903B2 (en) * | 2007-08-07 | 2010-08-24 | International Business Machines Corporation | Limiting power consumption by controlling airflow |
| US7886172B2 (en) * | 2007-08-27 | 2011-02-08 | International Business Machines Corporation | Method of virtualization and OS-level thermal management and multithreaded processor with virtualization and OS-level thermal management |
| US7934110B2 (en) * | 2007-09-25 | 2011-04-26 | Intel Corporation | Dynamically managing thermal levels in a processing system |
| US7962774B2 (en) * | 2007-10-04 | 2011-06-14 | Wisconsin Alumni Research Foundation | Over-provisioned multicore processor |
| JP2010039802A (ja) * | 2008-08-06 | 2010-02-18 | Nec Corp | マルチプロセッサシステム、スケジューリング方法およびそのプログラム |
| US20110138395A1 (en) | 2009-12-08 | 2011-06-09 | Empire Technology Development Llc | Thermal management in multi-core processor |
| JP5392848B2 (ja) * | 2010-01-06 | 2014-01-22 | エヌイーシーコンピュータテクノ株式会社 | 情報処理装置及びその制御方法 |
| US8418187B2 (en) * | 2010-03-01 | 2013-04-09 | Arm Limited | Virtualization software migrating workload between processing circuitries while making architectural states available transparent to operating system |
| US10049957B2 (en) | 2011-03-03 | 2018-08-14 | International Business Machines Corporation | On-chip control of thermal cycling |
| US8942857B2 (en) * | 2011-04-22 | 2015-01-27 | Qualcomm Incorporated | Method and system for thermal load management in a portable computing device |
| US8788866B2 (en) * | 2011-04-25 | 2014-07-22 | Qualcomm Incorporated | Method and system for reducing thermal load by monitoring and controlling current flow in a portable computing device |
| JP5651578B2 (ja) * | 2011-12-28 | 2015-01-14 | 株式会社東芝 | 平滑化装置、プログラム、及びシステム |
| US8904204B2 (en) * | 2012-06-29 | 2014-12-02 | International Business Machines Corporation | Managing computing resources through aggregated core management |
| KR102005765B1 (ko) | 2012-12-17 | 2019-07-31 | 삼성전자주식회사 | 시스템-온 칩과, 이의 동작 방법 |
| US9037882B2 (en) * | 2013-02-27 | 2015-05-19 | Qualcomm Incorporated | System and method for thermal management in a portable computing device using thermal resistance values to predict optimum power levels |
| US20140240031A1 (en) | 2013-02-27 | 2014-08-28 | Qualcomm Incorporated | System and method for tuning a thermal strategy in a portable computing device based on location |
| BR112015022711A2 (pt) * | 2013-03-14 | 2017-07-18 | Rivada Networks Llc | método de arbitragem dinâmica de espectro, servidor de comunicação para realizar arbitragem dinâmica, e, meio de armazenamento legível por computador |
| US9261935B2 (en) * | 2013-07-01 | 2016-02-16 | Advanced Micro Devices, Inc. | Allocating power to compute units based on energy efficiency |
| US9342135B2 (en) * | 2013-10-11 | 2016-05-17 | Qualcomm Incorporated | Accelerated thermal mitigation for multi-core processors |
| US9582052B2 (en) | 2014-10-30 | 2017-02-28 | Qualcomm Incorporated | Thermal mitigation of multi-core processor |
-
2015
- 2015-03-31 US US14/675,409 patent/US9582052B2/en active Active
- 2015-10-05 JP JP2017523332A patent/JP2018501546A/ja active Pending
- 2015-10-05 CN CN201580058053.1A patent/CN107111518B/zh active Active
- 2015-10-05 EP EP15787339.9A patent/EP3213202B1/en active Active
- 2015-10-05 WO PCT/US2015/054048 patent/WO2016069209A1/en not_active Ceased
-
2017
- 2017-02-23 US US15/441,124 patent/US10114443B2/en active Active