JP2018500770A5 - - Google Patents

Claims (15)

In the method of forming a hole plug:
Forming a laminate structure comprising at least one dielectric layer and a first conductive foil on a first side of the dielectric layer;
A non-penetrating hole or blind hole extending from the second side of the dielectric layer toward the first conductive foil and passing at least partially through the dielectric layer is formed in the laminate structure. a step, the aspect ratio of depth to diameter of the hole is 20: 1 than der is, the hole has a larger hole lower tip angle than 125 degrees, the steps;
Depositing via fill ink in the holes;
Drying and / or curing the viafill ink to form a hole plug;
A method characterized by comprising. The method of claim 1 further comprises:
Forming the laminate structure to further comprise a second conductive foil on the second side of the dielectric layer, wherein the second conductive foil is penetrated by the hole; Method. The method of claim 1 further comprises:
Forming said laminate structure to further comprise a disposable layer on said second dielectric foil. The method of claim 1 further comprises:
Forming a plated through hole through the hole plug material. The method of claim 1, wherein the aspect ratio of the holes is:
(A) less than 10: 1,
(B) less than 5: 1,
(C) less than 3: 1 or (d) less than 1: 1. 2. The method of claim 1, wherein the hole has a hole lower tip angle of 155 degrees or greater.   The method of claim 1, wherein the drill is configured to form a trimmed lower corner in the hole.   The method of claim 1, wherein the deposition of the via fill ink is assisted by vacuum.   The method of claim 1 wherein the thickness of the first conductive foil is 12 ounces or less, 2 ounces or less, or 1 ounce or less.   2. The method of claim 1, wherein the dielectric layer has a thickness of 20 mils or less, 16 mils or less, or 12 mils or less.   The method according to claim 1, wherein the hole plug is a plating resist or a material that prevents metal plating. In a laminate structure with hole plugs:
A laminate structure comprising at least a dielectric layer and a first conductive foil on a first side of the dielectric layer;
A non-penetrating hole or blind hole extending from the second side of the dielectric layer to the first conductive foil in the laminate structure, wherein the aspect ratio of depth to diameter is 20 : 1 less der is, a hole or blind hole does not penetrate having pores greater lower tip angle than 125 degrees;
Via fill ink deposited in the hole to form a hole plug;
A laminate structure characterized by comprising: The laminate structure according to claim 12 further comprises:
A laminated structure characterized in that the second conductive foil penetrates through the hole. The laminate structure according to claim 12 further comprises:
A laminate structure comprising a plated through hole through the hole plug material. In the method of forming a hole plug:
Forming a laminate structure comprising: a dielectric layer; a first conductive foil on a first side of the dielectric layer; and a second conductive foil on a second side of the dielectric layer; ;
Partially removing the second conductive foil to form an opening on the second conductive foil and exposing a portion of the dielectric layer;
Performing laser drilling through an exposed portion of the laminate structure to form a non-through hole or blind hole extending toward the first conductive foil and at least partially through the dielectric layer, The aspect ratio of the depth and diameter of the holes is less than 20 to 1;
Depositing via fill ink in the holes;
Curing the via fill ink to form a hole plug;
A method characterized by comprising: