EP3238512A4 - Hole plug for thin laminate - Google Patents

Hole plug for thin laminate Download PDF

Info

Publication number
EP3238512A4
EP3238512A4 EP15874375.7A EP15874375A EP3238512A4 EP 3238512 A4 EP3238512 A4 EP 3238512A4 EP 15874375 A EP15874375 A EP 15874375A EP 3238512 A4 EP3238512 A4 EP 3238512A4
Authority
EP
European Patent Office
Prior art keywords
hole plug
thin laminate
laminate
thin
plug
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP15874375.7A
Other languages
German (de)
French (fr)
Other versions
EP3238512A1 (en
Inventor
Shinichi Iketani
Dale Kersten
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanmina Corp
Original Assignee
Sanmina Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanmina Corp filed Critical Sanmina Corp
Publication of EP3238512A1 publication Critical patent/EP3238512A1/en
Publication of EP3238512A4 publication Critical patent/EP3238512A4/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H05K3/0035—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material of blind holes, i.e. having a metal layer at the bottom
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/421—Blind plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0207—Partly drilling through substrate until a controlled depth, e.g. with end-point detection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0713—Plating poison, e.g. for selective plating or for preventing plating on resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047—Drilling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
EP15874375.7A 2014-12-23 2015-12-28 Hole plug for thin laminate Pending EP3238512A4 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201462096011P 2014-12-23 2014-12-23
US201462096817P 2014-12-24 2014-12-24
PCT/US2015/067736 WO2016106428A1 (en) 2014-12-23 2015-12-28 Hole plug for thin laminate

Publications (2)

Publication Number Publication Date
EP3238512A1 EP3238512A1 (en) 2017-11-01
EP3238512A4 true EP3238512A4 (en) 2018-08-22

Family

ID=56151554

Family Applications (1)

Application Number Title Priority Date Filing Date
EP15874375.7A Pending EP3238512A4 (en) 2014-12-23 2015-12-28 Hole plug for thin laminate

Country Status (5)

Country Link
EP (1) EP3238512A4 (en)
JP (1) JP2018500770A (en)
KR (1) KR102594179B1 (en)
CN (1) CN107211539A (en)
WO (1) WO2016106428A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113964613B (en) * 2021-12-16 2022-04-22 苏州浪潮智能科技有限公司 Method, device and equipment for reducing stub of high-speed connector and readable medium

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5010232A (en) * 1989-01-27 1991-04-23 Hitachi Seiko, Ltd. Method of and apparatus for perforating printed circuit board
US20120234587A1 (en) * 2011-03-15 2012-09-20 Fujitsu Limited Printed wiring board, printed circuit board unit, electronic apparatus and method for manufacturing printed wiring board

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03228396A (en) * 1990-02-01 1991-10-09 Toshiba Corp Manufacture of multilayer printed circuit board
JP2001274204A (en) * 2000-03-24 2001-10-05 Hitachi Cable Ltd Bimetal substrate and bga structure
JP2002344144A (en) * 2001-03-14 2002-11-29 Toppan Printing Co Ltd Wiring board, method of multilayer the same and surface protective film
JP2002319763A (en) * 2001-04-24 2002-10-31 Matsushita Electric Ind Co Ltd Multilayer wiring board and its producing method
JP2008103548A (en) * 2006-10-19 2008-05-01 Sumitomo Electric Ind Ltd Multilayer printed wiring board, and its manufacturing method
CN103687342B (en) * 2013-12-02 2016-08-31 广州美维电子有限公司 A kind of printed circuit board with disconnected hole and preparation method thereof

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5010232A (en) * 1989-01-27 1991-04-23 Hitachi Seiko, Ltd. Method of and apparatus for perforating printed circuit board
US20120234587A1 (en) * 2011-03-15 2012-09-20 Fujitsu Limited Printed wiring board, printed circuit board unit, electronic apparatus and method for manufacturing printed wiring board

Also Published As

Publication number Publication date
KR20170098239A (en) 2017-08-29
EP3238512A1 (en) 2017-11-01
WO2016106428A1 (en) 2016-06-30
JP2018500770A (en) 2018-01-11
KR102594179B1 (en) 2023-10-26
CN107211539A (en) 2017-09-26

Similar Documents

Publication Publication Date Title
EP3193600A4 (en) Smyd inhibitors
EP3171299A4 (en) Multi-smartcard
EP3116503A4 (en) Hptp-beta inhibitors
EP3129108A4 (en) Hoverboard
EP3395777A4 (en) Laminate
EP3165360A4 (en) Laminate
EP3125784A4 (en) Perforator
EP3135485A4 (en) Laminate
EP3106479A4 (en) Polybutadiene
EP3543007A4 (en) Laminate
EP3223301A4 (en) Film-forming device
EP3434475A4 (en) Laminate
EP3213915A4 (en) Laminate
EP3437852A4 (en) Laminate
EP3166949A4 (en) Thienothiophene-isoindigo
EP3412450A4 (en) Laminate
EP3308955A4 (en) Laminate
EP3238512A4 (en) Hole plug for thin laminate
EP3180003A4 (en) Pkc-epsilon inhibitors
EP3110412A4 (en) 4-benzylsulfonyl-2-butenenitrile
AU2014902614A0 (en) An OviTrap
AU2014904384A0 (en) Isolation component
AU2014902058A0 (en) An Assay - II
AU2014904195A0 (en) Means for Communicating
AU2014905171A0 (en) GroundControl

Legal Events

Date Code Title Description
STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE INTERNATIONAL PUBLICATION HAS BEEN MADE

PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: REQUEST FOR EXAMINATION WAS MADE

17P Request for examination filed

Effective date: 20170720

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

AX Request for extension of the european patent

Extension state: BA ME

DAV Request for validation of the european patent (deleted)
DAX Request for extension of the european patent (deleted)
A4 Supplementary search report drawn up and despatched

Effective date: 20180724

RIC1 Information provided on ipc code assigned before grant

Ipc: H05K 1/11 20060101ALI20180718BHEP

Ipc: H05K 3/42 20060101AFI20180718BHEP

Ipc: H05K 3/00 20060101ALI20180718BHEP

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: EXAMINATION IS IN PROGRESS

17Q First examination report despatched

Effective date: 20210514

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: EXAMINATION IS IN PROGRESS