JP2018203839A - Epoxy resin composition for encapsulation, manufacturing method of epoxy resin composition for encapsulation, and manufacturing method of semiconductor device - Google Patents

Abstract

To provide an epoxy resin composition for encapsulation capable of suppressing scattering unevenness when arranged in a mold, and less in generation of dusting, a manufacturing method of the epoxy resin composition for encapsulation, and a manufacturing method of a semiconductor device.SOLUTION: There is provided a powdery epoxy resin composition for encapsulation containing particles 210 having a smooth side surface 211 with a column shape, and a bottom surface 212 which is a fracture surface. There is provided an epoxy resin composition for encapsulation having percentage of the particles 210 with particle diameter of 2 mm or more of 3 mass% or more.SELECTED DRAWING: Figure 1

Description

  The present invention relates to an epoxy resin composition for sealing, a method for manufacturing an epoxy resin composition for sealing, and a method for manufacturing a semiconductor device, and more specifically, for sealing that can be used for sealing semiconductor elements by compression molding. The present invention relates to an epoxy resin composition, a method for producing the sealing epoxy resin composition, and a method for producing a semiconductor device using the sealing epoxy resin composition.

  Conventionally, semiconductor elements such as transistors, ICs, and LSIs are protected by a sealing material. From the viewpoint of productivity improvement, cost reduction, and the like, a resin composition is used as a sealing material.

  Examples of the sealing method using the resin composition include a transfer molding method using a tablet-like resin composition and a compression molding method using a particulate resin composition. For example, in Patent Document 1, a granular epoxy resin composition is placed in a mold and heated, and the epoxy resin composition is cured so that the molten epoxy resin composition surrounds the semiconductor element. Sealing is described.

Japanese Patent No. 5343830

  In order to improve the productivity of the semiconductor device, it is required to suppress the unevenness of the wrapping when placing the epoxy resin composition in the mold or to improve the transportability.

  For example, in Patent Document 1, by using a granular epoxy resin composition having a specific particle size distribution, which is produced by a centrifugal milling method, a pulverizing sieving method, a hot cut method, or the like, It is disclosed to suppress clogging and the like.

  However, as disclosed in Patent Document 1, when a granular epoxy resin composition composed of particles having a small particle diameter prepared by pulverization is used, even if the unevenness can be suppressed, the epoxy resin composition Powdering tends to occur from the surface of the particles. As a result, material loss occurs and the working environment deteriorates. It is not easy to suppress whispering and prevent dusting.

  An object of the present invention is to suppress the unevenness of creaking when placed in a mold and to reduce the occurrence of dusting, a method for producing the sealing epoxy resin composition, and the sealing It is providing the manufacturing method of the semiconductor device using the epoxy resin composition for water.

  The sealing epoxy resin composition according to an embodiment of the present invention is a particulate sealing epoxy resin composition, and the sealing epoxy resin composition is cylindrical and has a smooth side surface and crushing. Particles having a bottom surface that is a surface.

  The manufacturing method of the epoxy resin composition for sealing which concerns on one Embodiment of this invention mixes the component of the said epoxy resin composition for sealing, and produces the mixture, and the said mixture is extrusion-molded. A step of producing a strand-shaped molded product, and a step of crushing the molded product.

  The manufacturing method of the semiconductor device which concerns on one Embodiment of this invention is a manufacturing method of a semiconductor device provided with a semiconductor element and the sealing material which seals the said semiconductor element, The said epoxy resin composition for sealing is used. And a step of disposing the sealing material by molding the sealing epoxy resin composition by a compression molding method.

  ADVANTAGE OF THE INVENTION According to this invention, while being able to suppress the nonuniformity at the time of arrange | positioning to a metal mold | die, there is little generation | occurrence | production of powdering, the manufacturing method of this epoxy resin composition for sealing, and this sealing The manufacturing method of the semiconductor device using the epoxy resin composition for can be obtained.

It is a microscope picture of the epoxy resin composition for sealing of the Example of this invention. It is the schematic which shows one particle | grains of the epoxy resin composition for sealing based on one Embodiment of this invention. It is general | schematic sectional drawing which shows each process of the manufacturing method of the semiconductor device based on one Embodiment of this invention. 1 is a schematic cross-sectional view showing a semiconductor device manufactured by a method for manufacturing a semiconductor device according to an embodiment of the present invention. It is a microscope picture of the epoxy resin composition for sealing of a comparative example. FIG. 6A is a photograph showing the result of a nonuniformity test of the sealing epoxy resin composition of the example of the present invention. FIG. 6B is a photograph showing the results of a nonuniformity test of the sealing epoxy resin composition of the comparative example.

<Epoxy resin composition for sealing>
With reference to FIG.1 and FIG.2, the epoxy resin composition for sealing which concerns on one Embodiment of this invention is demonstrated.

  The sealing epoxy resin composition according to an embodiment of the present invention is particulate, and includes particles 210 having a cylindrical side and a smooth side surface 211 and a bottom surface 212 that is a crushing surface.

  When the sealing epoxy resin composition includes the particles 210 having a cylindrical side surface and the smooth side surface 211, the sealing epoxy resin composition is easily rolled, and the sealing epoxy resin composition is easily disposed on the mold. For this reason, the unevenness of whispering is suppressed. In addition, since the side surface 211 is smooth, dusting from the side surface 211 hardly occurs.

  The bottom surface 212 being a crushing surface means that the particle 210 was produced by crushing a molded product larger than that. Since the particles 210 are produced not by cutting but by crushing, burrs of the particles 210 are suppressed. For this reason, the ease of rolling of the particles 210 is not easily disturbed. In addition, powdering may occur from the bottom surface 212 which is a crushing surface, but since the side surface 211 is smooth, the ratio of the crushing surface to the entire surface of the particle 210 is kept low.

  Moreover, since the cylindrical particle 210 is included, when the epoxy resin composition for sealing is assembled, a gap is easily formed between the particles of the epoxy resin composition for sealing. Therefore, the bulk density of the sealing epoxy resin composition tends to be low. For this reason, when the epoxy resin composition for sealing is gathered and spread, it is easy to spread and this also suppresses unevenness of the spreading.

  As described above, it is possible to suppress the unevenness in disposing the sealing epoxy resin composition in the mold, and it is possible to suppress the occurrence of dusting from the sealing epoxy resin composition.

  The sealing epoxy resin composition according to an embodiment of the present invention will be described with reference to FIGS. 1 and 2.

  The epoxy resin composition for sealing according to this embodiment is in the form of particles. The particle size of the particles contained in the sealing epoxy resin composition is preferably in the range of 0.05 to 5.00 mm. The particle size of the particles contained in the sealing epoxy resin composition is more preferably in the range of 0.10 to 3.00 mm.

  The sealing epoxy resin composition of the present embodiment includes columnar particles 210. As shown in FIG. 2, the columnar particle 210 has a smooth side surface 211 and a bottom surface 212 that is a crushing surface.

  The particles 210 are cylindrical. That the particle 210 is cylindrical also means that the particle 210 is substantially cylindrical. That is, the particle 210 may have an elliptic cylinder shape or an oblique cylinder shape. Further, the particle 210 may have a bent columnar shape. That is, the particle 210 may have a bent central axis.

  The smooth side surface 211 may not be completely smooth and may have smooth unevenness. The smooth side surface 211 preferably has a gloss. When the side surface 211 is smooth, the particles 210 are more likely to roll, and powdering from the side surface 211 is less likely to occur. The arithmetic average roughness Ra of the side surface 211 is preferably in the range of 1 μm to 500 μm. The arithmetic average roughness Ra of the side surface 211 is more preferably in the range of 1 μm to 100 μm. The arithmetic average roughness Ra can be measured using, for example, a laser microscope, a commercially available surface roughness measuring machine, or the like.

  The bottom surface 212 is a crushing surface. The crushing surface is a surface generated when the particle 210 is produced by crushing a molded product larger than the particle 210. The bottom surface 212 which is a crushing surface is a rough surface having an edge. The bottom surface 212 may have rough unevenness. The arithmetic average roughness Ra of the bottom surface 212 is, for example, in the range of 5 μm to 1000 μm. The arithmetic average roughness Ra of the bottom surface 212 is more preferably in the range of 5 μm to 200 μm.

  The diameter of the bottom surface 212 of the particle 210 is preferably 5 mm or less. When the diameter of the bottom surface 212 is within this range, occurrence of dusting can be easily suppressed. The diameter of the bottom surface 212 is more preferably 3 mm or less. Although the minimum of the diameter of the bottom face 212 of the particle | grains 210 is not specifically limited, For example, it may be 0.3 mm or more. Moreover, it is preferable that the length of the particle | grains 210 exists in the range of 0.1-5.0 mm. It becomes easy to suppress generation | occurrence | production of powdering because the length of the particle | grains 210 exists in this range. More preferably, the length of the particles 210 is in the range of 0.3 to 1.0 mm.

  The sealing epoxy resin composition may include particles other than the columnar particles 210. The epoxy resin composition for sealing may contain, for example, spherical particles or powder particles. It is preferable that the ratio of the particle | grains 210 contained in the epoxy resin composition for sealing exists in the range of 50-100 mass%. In this case, it is possible to further suppress the unevenness in disposing the sealing epoxy resin composition in the mold and further prevent the occurrence of dusting. The proportion of the particles 210 contained in the sealing epoxy resin composition is more preferably in the range of 80 to 100% by mass.

  It is preferable that the epoxy resin composition for sealing has a particle size distribution in which the proportion of particles having a particle size of 2 mm or more is 3% by mass or more. The powdering of particles having a particle diameter of 2 mm or more is less than the powdering of particles having a particle diameter of less than 2 mm. Therefore, when the sealing epoxy resin composition has a particle size distribution in which the ratio of particles having a particle diameter of 2 mm or more is 3% by mass or more, generation of dusting of the sealing epoxy resin composition can be further suppressed. it can. More preferably, the epoxy resin composition for sealing has a particle size distribution in which the proportion of particles having a particle size of 2 mm or more is 5% by mass or more. Moreover, it is also preferable that the ratio of the particle | grains with a particle size of 2 mm or more is 7 mass% or less. The particle size distribution can be obtained by sieving the particle size by overlapping two or more sieves so that the sieve with a large mesh is in the upper stage. For example, 2.0 mm, 1.7 mm, 850 μm, and 500 μm aperture sieves are stacked in this order from the top, and the sample is put on the uppermost sieve, and after sieving, the sample remaining on each sieve It can be obtained by measuring the weight.

<Composition of epoxy resin composition for sealing>
The composition of the epoxy resin composition for sealing according to one embodiment of the present invention is not particularly limited, and may have a known and commonly used composition used as a sealing material. Hereinafter, the composition of the epoxy resin composition for sealing will be described.

  The epoxy resin composition for sealing may contain, for example, an epoxy resin (A), a curing agent (B), a curing accelerator (C), and an inorganic filler (D).

  An epoxy resin (A) can contain the well-known and usual epoxy resin used for manufacture of a sealing material. The epoxy resin (A) is, for example, an alkylphenol novolak type epoxy resin; a naphthol novolak type epoxy resin; a phenol aralkyl type epoxy resin having a skeleton; a biphenyl aralkyl type epoxy resin; a naphthol aralkyl type epoxy resin having a skeleton; Triphenylmethane epoxy resin; Tetrakisphenol ethane epoxy resin; Dicyclopentadiene epoxy resin; Stilbene epoxy resin; Bisphenol epoxy resin; Biphenyl epoxy resin; Naphthalene epoxy resin; Alicyclic epoxy resin; Resin; Glycidylamine type epoxy resin obtained by reaction of polyamine and epichlorohydrin; and Obtained by reaction of polybasic acid and epichlorohydrin It may contain one or more components selected from the group consisting of glycidyl ester type epoxy resin. The quantity of the epoxy resin (A) with respect to the whole epoxy resin composition for sealing may be in the range of 5-35 mass%, for example.

  A hardening agent (B) can contain the well-known and usual hardening agent used for manufacture of a sealing material. The curing agent (B) is, for example, a novolak type resin; a phenol aralkyl resin having a phenylene skeleton or a biphenylene skeleton; an aralkyl type resin having a phenylene skeleton or a biphenylene skeleton; a polyfunctional phenol resin; a dicyclopentadiene type phenol resin; It can contain at least one component selected from the group consisting of a resin; a bisphenol-type resin; and a triazine-modified novolak resin.

  A hardening accelerator (C) can contain the well-known and usual hardening accelerator used for manufacture of a sealing material. Examples of the curing accelerator (C) include phosphonium salts, triarylphosphines, tetraphenylphosphonium / tetraphenylborate, imidazoles such as 2-methylimidazole, and 1,8-diazabicyclo (5,4,0) undecene- One or more components selected from the group consisting of 7 can be contained.

  An inorganic filler (D) can contain the well-known and usual inorganic filler mix | blended with a sealing material. The inorganic filler (D) is, for example, fused silica, spherical silica, spherical fused silica, crushed silica, crystalline silica, spherical alumina, magnesium oxide, boron nitride, aluminum nitride, etc .; high dielectric constant filler; magnetic filler; A flame retardant; and one or more components selected from the group consisting of silicon nitride, talc, barium sulfate, calcium carbonate, mica powder, and the like. The amount of the inorganic filler (D) with respect to the epoxy resin composition for sealing may be in the range of 70 to 95% by mass, for example.

  The epoxy resin composition for sealing may contain additives other than the above components. Examples of the additive include a silane coupling agent, a flame retardant, a flame retardant aid, a release agent, an ion trap agent, a pigment, a colorant, a low stress agent, a tackifier, and a silicone flexible agent.

  The silane coupling agent may have two or more alkoxy groups. Examples of the silane coupling agent include β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, N-phenyl-γ-aminopropyltrimethoxysilane, γ-glycidoxypropyltrimethoxysilane, and γ-mercaptopropyltrimethoxy. One or more components selected from the group consisting of silane, γ- (2-aminoethyl) aminopropyltrimethoxysilane, γ-mercaptopropylmethyldimethoxysilane, γ-anilinopropyltrimethoxysilane, and hexamethyldisilazane. Can be contained.

  The flame retardant can contain a novolac-type brominated epoxy resin, a metal hydroxide, or the like. The flame retardant may contain, for example, at least one of diantimony trioxide and diantimony pentoxide.

  The release agent can contain, for example, one or more components selected from the group consisting of carnauba wax, stearic acid, montanic acid, and carboxyl group-containing polyolefin.

  The ion trapping agent can contain a known compound having an ion trapping ability. For example, the ion trapping agent can contain hydrotalcites, bismuth hydroxide and the like.

  Examples of the stress reducing agent include butadiene rubber and a silicone compound.

<Method for producing epoxy resin composition for sealing>
The manufacturing method of the epoxy resin composition for sealing which concerns on one Embodiment of this invention is demonstrated.

  The manufacturing method of the epoxy resin composition for sealing according to the present embodiment includes a step of mixing the components of the epoxy resin composition for sealing to produce a mixture, and an extrusion molding of the mixture to form a strand-shaped molded product. A step of producing, and a step of crushing the molded product.

  In order to produce the sealing epoxy resin composition of the present embodiment, first, the components of the sealing epoxy resin composition are blended and mixed uniformly with a mixer, a blender or the like to prepare a mixture. Next, this mixture is melt-mixed in a heated state by a kneader such as a hot roll or a kneader. At this time, it is preferable that heating temperature exists in the range of 90-130 degreeC, for example.

  Next, this mixture is extruded to produce a strand-shaped molded product. At this time, for example, using an extruder, the mixture is melted by heating to a temperature in the range of, for example, 50 to 100 ° C., and the mixture is further extruded from a plurality of round holes of the extruder, thereby forming a molded product. Can be produced. The molded product is cooled and solidified. For example, the mixture can be cooled and solidified by placing the molded product extruded from the extruder on a cooling belt that rotates at high speed. At this time, the cooling rate is preferably within a range of 0.5 to 1.5 K / s, for example. Next, the molded product is crushed by a known method. Thereby, the epoxy resin composition for sealing is obtained.

  In the method for producing an epoxy resin composition for sealing according to this embodiment, in order to crush a strand-shaped molded product, a sealing including cylindrical particles 210 having a smooth side surface 211 and a bottom surface 212 which is a crushing surface. An epoxy resin composition for stopping can be obtained. Further, since the strand-shaped molded product is crushed, burrs are less likely to occur in the particles 210 as compared with the case of cutting with a cutter. The absence of burrs in the particles 210 can prevent the burr from inhibiting the ease of rolling of the columnar particles 210.

<Method for Manufacturing Semiconductor Device>
The manufacturing method of the semiconductor device using the epoxy resin composition for sealing which concerns on one Embodiment of this invention is demonstrated, referring FIG. 3A-FIG. 3E and FIG. The manufacturing method of the semiconductor device 30 of the present embodiment includes a step of placing the sealing epoxy resin composition 200 on the mold 10 (placement step) and a step of molding the sealing epoxy resin composition 200 by a compression molding method. The process of producing the sealing material 100 by doing (compression molding process) is included. The method preferably includes a step of weighing the sealing epoxy resin composition 200 (a weighing step). The method also preferably includes a step of preheating the sealing epoxy resin composition 200 disposed in the mold 10 (preheating step). Further, the method preferably includes a step (post-curing step) of heating the sealing material 100 manufactured by the compression molding method. These steps will be described.

(Weighing process)
First, as shown in FIG. 3A, the sealing epoxy resin composition 200 is weighed. Specifically, the particulate sealing epoxy resin composition 200 is supplied into the container 20, and the amount of the sealing epoxy resin composition 200 in the container 20 is measured by a known measuring means. In the case where the sealing epoxy resin composition 200 is directly supplied to the lower mold 11 provided in the compression molding machine 1, the sealing epoxy resin composition 200 is measured by the measuring unit provided in the compression molding machine 1. Good.

(Arrangement process)
Next, a mold 10 shown in FIG. 3B is prepared. The mold 10 is provided in the compression molding machine 1. The mold 10 includes a lower mold 11 and an upper mold 12. The lower mold 11 is configured to store the sealing epoxy resin composition 200. The upper mold 12 is disposed to face the lower mold 11. A substrate 13 is attached to the surface on the side facing the lower mold 11 of the upper mold 12. A plurality of semiconductor elements 14 are provided on the substrate 13. The substrate 13 is, for example, a lead frame or a wiring board, and the semiconductor element 14 is, for example, a semiconductor chip such as an IC chip. And in an arrangement | positioning process, as shown to FIG. 3B, the epoxy resin composition 200 for sealing is arrange | positioned in the prepared metal mold | die 10. As shown in FIG. Specifically, the sealing epoxy resin composition 200 is disposed on the lower mold 11. In this embodiment, the particles 210 included in the sealing epoxy resin composition 200 are columnar and have smooth side surfaces 211, so that they are easy to roll. For this reason, the nonuniformity at the time of arrange | positioning the epoxy resin composition 200 for sealing containing the particle | grains 210 to the lower mold | type 11 (mold | die 10) can be suppressed, and as shown to FIG. 6A, the epoxy resin composition for sealing 200 can be uniformly spread in the lower mold 11 (mold 10). Furthermore, since the epoxy resin composition 200 for sealing of this embodiment is cylindrical and contains the particle | grains 210 which have the smooth side surface 211, there is little generation | occurrence | production of powdering. For this reason, when arrange | positioning the epoxy resin composition 200 for sealing to the lower mold | type 11 (metal mold | die 10), it is hard to generate | occur | produce dusting and can prevent the loss of material and the deterioration of a working environment.

(Preheating process)
Next, as shown in FIG. 3C, the lower mold 11 is heated to preheat the sealing epoxy resin composition 200 disposed in the mold 10. The temperature of the lower mold 11 during the preheating is preferably in the range of 130 to 200 ° C, for example. The heating time is preferably in the range of 2 to 300 seconds, and more preferably in the range of 30 to 40 seconds. However, the temperature of the lower mold 11 during the preheating is appropriately adjusted according to the composition of the sealing epoxy resin composition 200 to be used.

(Compression molding process)
Next, as shown in FIG. 3D, the sealing material 100 is produced by molding the sealing epoxy resin composition 200 by a compression molding method. Specifically, the lower mold 11 is moved toward the upper mold 12 while heating the mold 10. At this time, the molten epoxy resin composition 200 for sealing flows so as to cover the semiconductor element 14. As a result, the semiconductor element 14 is sealed with the sealing epoxy resin composition 200. In the present embodiment, the sealing epoxy resin composition 200 is uniformly spread in the lower mold 11 (mold 10). For this reason, unfilling of the epoxy resin composition 200 for sealing can be suppressed. Furthermore, the cylindrical particles 210 contained in the sealing epoxy resin composition 200 tend to have a large contact area with the lower mold 11 (mold 10). For this reason, heat is easily transferred to the sealing epoxy resin composition 200 by heating, and the sealing epoxy resin composition 200 is easily dissolved in the lower mold 11 (mold 10). It is preferable that the temperature of the lower mold | type 11 in a compression molding process exists in the range of 130-200 degreeC, for example. Moreover, it is preferable that a compression pressure exists in the range of 5-20 Mpa, for example. The compression time is preferably 100 seconds or less, for example. However, the temperature, compression pressure, and compression time of the lower mold 11 in the compression molding process are appropriately adjusted according to the composition of the sealing epoxy resin composition 200 to be used.

(Post-curing process)
Next, as shown in FIG. 3E, the sealing epoxy resin composition 200 is cured. Specifically, the sealing epoxy resin composition 200 is cured by holding the sealing epoxy resin composition 200 in the mold 10 and holding it for a predetermined time while heating. Thereby, the sealing material 100 which is the hardened | cured material of the epoxy resin composition 200 for sealing is formed, and the several semiconductor element 14 is sealed with this sealing material 100. FIG. The temperature of the mold 10 in the post-curing step is preferably in the range of 1430 to 200 ° C., for example, and is preferably held within this range of 1 to 10 minutes. However, the temperature and holding time of the mold 10 in the post-curing step are appropriately adjusted according to the composition of the sealing epoxy resin composition 200 to be used. After the sealing epoxy resin composition 200 is cured, the semiconductor element 14 and the substrate 13 may be removed from the mold 10.

  The semiconductor device 30 in which the semiconductor element 14 is sealed by the sealing material 100, which is a cured product of the sealing epoxy resin composition 200, is obtained by the above process. It is not restricted and you may provide the other process. Further, as shown in FIG. 4, the semiconductor device 30 manufactured by the above process is sealed so as to cover the substrate 13, the plurality of semiconductor elements 14 provided on the substrate 13, and the plurality of semiconductor elements 14. The sealing material 100 to be included is included.

1. Production of Examples The compositions of the examples were prepared as follows.

The following components were prepared as raw materials for the composition.
Epoxy resin: biphenyl type epoxy resin, manufactured by Mitsubishi Chemical Corporation, product number YX4000H
・ Curing agent: biphenyl aralkyl resin, manufactured by Meiwa Kasei Co., Ltd., part number MEH-7851SS
・ Curing accelerator: manufactured by Hokuko Chemical Co., Ltd., product number KXM
Inorganic filler: fused silica, manufactured by DENKA CORPORATION, product number FB8752FC
Mold release agent: Carbana wax, manufactured by Dainichi Chemical Co., Ltd., product number F1-100
Pigment: Carbon black, manufactured by Mitsubishi Chemical Corporation, product number MA600

  These components were blended and mixed uniformly with a mixer to prepare a mixture. This mixture was melt-mixed at 100 ° C. using a twin-screw kneader. Next, this mixture was extruded using a known method to produce a strand-like molded product. The mixture was crushed with a crusher to obtain a particulate composition.

  The photograph which expanded this composition 40 times with the microscope is shown in FIG. As shown in FIG. 1, the particle | grains 210 contained in a composition are cylindrical shape, and have the smooth side surface 211 and the bottom face 212 which is a crushing surface.

2. Production of Comparative Example A composition of a comparative example was prepared as follows.

  As raw materials for the composition, the same components as in the examples were prepared.

  These components were blended in the same proportions as in the examples, and were mixed uniformly with a mixer to prepare a mixture. This mixture was melt-mixed at 100 ° C. using a twin-screw kneader. Next, this mixture was crushed with a crusher to obtain a particulate composition.

  The photograph which expanded this composition 40 times with the microscope is shown in FIG. As shown in FIG. 5, the particles contained in the composition are irregular and have a rough surface.

3. Evaluation of Kimura unevenness 10 g of each of the composition of the example and the composition of the comparative example was sown in a mold having a size of 5 × 20 cm using a compression molding machine (model number FFT1030) manufactured by TOWA Corporation. A photograph of the composition of the example applied to the mold is shown in FIG. 6A, and a photograph of the composition of the comparative example applied to the mold is shown in FIG. 6B. The black background ratio was calculated using the image data of the photographs in FIGS. 6A and 6B. The black background ratio is obtained by binarizing the image data of the photographs in FIG. 6A and FIG. 6B and calculating the percentage of the area of the region where the composition is arranged with respect to the area of the mold. The black background ratio in the case where the composition of the example shown in FIG. 6A was put in a mold was 89%. When the composition of the comparative example shown in FIG. 6B was spread on a mold, the black background ratio was 73%.

4). Bulk density evaluation After putting the composition of an Example into the container which has a volume of 100 cm < ³ >, the mass of the composition in a container was measured. From the results, the bulk density of the compositions of the examples was calculated. The bulk density of the composition of the example was 0.89 g / cm ³ . The bulk density of the composition of the comparative example was calculated in the same manner. The bulk density of the composition of the comparative example was 0.96 g / cm ³ .

5. Evaluation of dusting First, two polyethylene bags with a capacity of 2 kg were prepared. Next, 500 g of the composition of the example was placed in the first bag. The composition in the first bag was put into the second bag from a height of 25 cm with the dust collector activated. Thereafter, the amount of dust attached to the first bag and the amount of dust collected by the dust collector when the composition was charged were measured. This evaluation test was performed 10 times. As a result, in the composition of the example, the average adhesion amount in 10 evaluation tests was 0.44%, and the average dust collection amount was 0.70%. The same evaluation test was performed 10 times for the composition of the comparative example. As a result, in the composition of the comparative example, the average adhesion amount of 10 evaluation tests was 1.52%, and the average dust collection amount was 1.65%.

6). Measurement of particle size distribution 2.0 mm, 1.7 mm, 850 μm, and 500 μm sieves are stacked in this order from the top, and the composition of the example is put into the uppermost sieve. The weight of the example composition remaining above was measured. The particle size distribution of the composition of the comparative example was measured in the same manner. As a result, the ratio of particles having a particle size of 2 mm or more in the particle size distribution of the composition of the example was 5% by mass. Moreover, the ratio of the particle | grains with a particle size of 2 mm or more in the particle size distribution of the composition of a comparative example was 3 mass%.

210 particles 211 side surface 212 bottom surface

Claims (4)

It is a particulate epoxy resin composition for sealing,
The sealing epoxy resin composition is cylindrical and includes particles having a smooth side surface and a bottom surface that is a crushing surface.
An epoxy resin composition for sealing. Having a particle size distribution in which the proportion of particles having a particle size of 2 mm or more is 3 mass% or more
The epoxy resin composition for sealing according to claim 1. A method for producing the sealing epoxy resin composition according to claim 1, comprising:
Mixing the components of the sealing epoxy resin composition to produce a mixture;
A step of extruding the mixture to produce a strand-shaped molding;
Crushing the molded product;
The manufacturing method of the epoxy resin composition for sealing containing this. A method for manufacturing a semiconductor device comprising: a semiconductor element; and a sealing material that seals the semiconductor element.
Placing the epoxy resin composition for sealing according to any one of claims 1 to 3 in a mold;
A step of producing the sealing material by molding the sealing epoxy resin composition by a compression molding method;
A method for manufacturing a semiconductor device, comprising: