JP2018197336A5 - - Google Patents

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JP2018197336A5
JP2018197336A5 JP2018067689A JP2018067689A JP2018197336A5 JP 2018197336 A5 JP2018197336 A5 JP 2018197336A5 JP 2018067689 A JP2018067689 A JP 2018067689A JP 2018067689 A JP2018067689 A JP 2018067689A JP 2018197336 A5 JP2018197336 A5 JP 2018197336A5
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component
sealing sheet
mass
parts
sheet according
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JP2018067689A
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JP2018197336A (en
JP6512562B2 (en
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Claims (16)

接着剤層を有する、封止シートであって、
前記接着剤層は、変性ポリオレフィン系樹脂（Ａ）、及び多官能エポキシ化合物（Ｂ）を含有する接着剤組成物から形成されたシート状物であり、
前記シート状物が下記要件（Ｉ）及び（II）を満たす、封止シート。
・要件（Ｉ）：前記シート状物の８０℃における貯蔵弾性率Ｇ’が０．３ＭＰａ以下である。
・要件（II）：前記シート状物を１２０℃の環境下で２０分間静置した際の、前記シート状物の１ｃｍ３当たり発生するアウトガス量が、２０ｍｇ／ｃｍ３以下である。 A sealing sheet having an adhesive layer,
The adhesive layer is a sheet-like material formed from an adhesive composition containing the modified polyolefin resin (A) and the polyfunctional epoxy compound (B),
The sealing sheet in which the sheet-like material satisfies the following requirements (I) and (II).
Requirement (I): The storage elastic modulus G ′ at 80 ° C. of the sheet-like material is 0.3 MPa or less.
Requirement (II): The amount of outgas generated per cm 3 of the sheet-like material when the sheet-like material is allowed to stand in an environment of 120 ° C. for 20 minutes is 20 mg / cm 3 or less. 成分（Ａ）の含有量が、前記接着剤組成物の有効成分の全量に対して、１５〜７０質量％である、請求項１に記載の封止シート。 The sealing sheet according to claim 1, wherein the content of the component (A) is 15 to 70% by mass with respect to the total amount of active ingredients of the adhesive composition. 成分（Ｂ）が、多官能脂環式エポキシ化合物及び多官能脂肪族エポキシ化合物から選ばれる１種以上である、請求項１又は２に記載の封止シート。 The sealing sheet of Claim 1 or 2 whose component (B) is 1 or more types chosen from a polyfunctional alicyclic epoxy compound and a polyfunctional aliphatic epoxy compound. 成分（Ｂ）が、２５℃において液体である多官能エポキシ化合物（Ｂ１）を含有する、請求項１〜３のいずれか一項に記載の封止シート。  The sealing sheet as described in any one of Claims 1-3 in which a component (B) contains the polyfunctional epoxy compound (B1) which is a liquid at 25 degreeC. 成分（Ｂ）が、２５℃において固体である多官能エポキシ化合物（Ｂ２）をさらに含有し、  Component (B) further contains a polyfunctional epoxy compound (B2) that is solid at 25 ° C.,
成分（Ｂ１）と成分（Ｂ２）の含有割合（質量比〔成分（Ｂ１）：成分（Ｂ２）〕）は、１００：１〜１：１である、請求項４に記載の封止シート。  The encapsulating sheet according to claim 4, wherein the content ratio (mass ratio [component (B1): component (B2)]) of the component (B1) and the component (B2) is 100: 1 to 1: 1. 成分（Ｂ）の含有量が、成分（Ａ）１００質量部に対して、２５〜２００質量部である、請求項１〜５のいずれか一項に記載の封止シート。 The content of component (B), the component (A) 100 parts by mass of a 25 to 200 parts by weight, the sealing sheet according to any one of claims 1-5. さらに、粘着付与剤（Ｃ）を含有する、請求項１〜６のいずれか一項に記載の封止シート。 Furthermore, the sealing sheet as described in any one of Claims 1-6 containing a tackifier (C). 成分（Ｃ）の含有量が、成分（Ａ）１００質量部に対して、１〜２００質量部である、請求項７に記載の封止シート。 The encapsulating sheet according to claim 7 , wherein the content of the component (C) is 1 to 200 parts by mass with respect to 100 parts by mass of the component (A). さらに、イミダゾール系硬化触媒（Ｄ）を含有する、請求項１〜８のいずれか一項に記載の封止シート。 Furthermore, the sealing sheet as described in any one of Claims 1-8 containing an imidazole series curing catalyst (D). 成分（Ｄ）の含有量が、成分（Ａ）１００質量部に対して、０．１〜１０質量部である、請求項９に記載の封止シート。 The sealing sheet according to claim 9 , wherein the content of the component (D) is 0.1 to 10 parts by mass with respect to 100 parts by mass of the component (A). さらに、シランカップリング剤（Ｅ）を含有する、請求項１〜１０のいずれか一項に記載の封止シート。 Furthermore, the sealing sheet as described in any one of Claims 1-10 containing a silane coupling agent (E). 成分（Ｅ）の含有量が、成分（Ａ）１００質量部に対して、０．０１〜１０質量部である、請求項１１に記載の封止シート。 The content of component (E) is the component (A) 100 parts by mass of a 0.01 to 10 parts by weight, the sealing sheet according to claim 1 1. さらに、基材層とガスバリア層とを備えたガスバリア性フィルムを有する、請求項１〜１２のいずれか一項に記載の封止シート。 Furthermore, having a gas-barrier film comprising a substrate layer and a gas barrier layer, a sealing sheet according to any one of claims 1 to 1 2. 前記ガスバリア性フィルムのガスバリア層と、前記接着剤層とが直接積層した構成である、請求項１３に記載の封止シート。 The gas barrier layer of the gas barrier film, and the adhesive layer is formed by laminating directly the sealing sheet according to claim 1 3. 前記ガスバリア層が、高分子化合物を含み、改質処理が施された高分子層である、請求項１３又は１４に記載の封止シート。 Wherein the gas barrier layer comprises a polymer compound, modification treatment is a polymer layer applied, the sealing sheet according to claim 1 3 or 1 4. 有機ＥＬ素子、有機ＥＬディスプレイ素子、液晶ディスプレイ素子、又は太陽電池素子を、請求項１〜１５のいずれか一項に記載の封止シートで封止してなる、封止体。 The organic EL element, an organic EL display device, a liquid crystal display element, or a solar cell element, by encapsulating the sealing sheet according to any one of claims 1 to 1 5, the sealing body.
JP2018067689A 2016-09-07 2018-03-30 Adhesive composition, sealing sheet, and sealing body Active JP6512562B2 (en)

Applications Claiming Priority (10)

Application Number Priority Date Filing Date Title
JP2016174662 2016-09-07
JP2016174662 2016-09-07
JP2016174661 2016-09-07
JP2016174661 2016-09-07
JP2017107484 2017-05-31
JP2017107482 2017-05-31
JP2017107482 2017-05-31
JP2017108518 2017-05-31
JP2017107484 2017-05-31
JP2017108518 2017-05-31

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2017558039A Division JP6329330B1 (en) 2016-09-07 2017-09-06 Sealing sheet and sealing body

Publications (3)

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JP2018197336A JP2018197336A (en) 2018-12-13
JP2018197336A5 true JP2018197336A5 (en) 2019-03-07
JP6512562B2 JP6512562B2 (en) 2019-05-15

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JP2017558039A Active JP6329330B1 (en) 2016-09-07 2017-09-06 Sealing sheet and sealing body
JP2018067689A Active JP6512562B2 (en) 2016-09-07 2018-03-30 Adhesive composition, sealing sheet, and sealing body

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JP (2) JP6329330B1 (en)
KR (1) KR102348192B1 (en)
CN (1) CN109790427B (en)
TW (1) TWI742153B (en)
WO (1) WO2018047868A1 (en)

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KR102380827B1 (en) * 2016-11-18 2022-03-30 린텍 가부시키가이샤 Adhesive composition, encapsulation sheet, and encapsulant
KR102469843B1 (en) * 2017-05-31 2022-11-22 린텍 가부시키가이샤 Adhesive sheet, and encapsulation body
WO2018221574A1 (en) * 2017-05-31 2018-12-06 リンテック株式会社 Adhesive composition, adhesive sheet and sealed body
TWI758484B (en) * 2017-05-31 2022-03-21 日商琳得科股份有限公司 Adhesive composition, adhesive sheet and seal
KR102483012B1 (en) * 2017-05-31 2022-12-29 린텍 가부시키가이샤 Adhesive composition, adhesive sheet, and encapsulant
TWI799557B (en) * 2018-03-28 2023-04-21 日商琳得科股份有限公司 Resin composition, sealing sheet and sealing body
CN113506848A (en) * 2018-05-24 2021-10-15 大日本印刷株式会社 Sealing material sheet for self-luminous display or direct backlight, self-luminous display, and direct backlight
JP7280257B2 (en) * 2018-06-15 2023-05-23 リンテック株式会社 Resin composition, encapsulating sheet and encapsulating body

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JP4798803B2 (en) * 2008-01-22 2011-10-19 日東電工株式会社 Reactive adhesive composition for fixing electronic parts and adhesive sheet thereof
JP2013120804A (en) * 2011-12-06 2013-06-17 Daicel Corp Sheet-like covering agent, and method for covering or method for manufacturing electronic device
JP5914778B2 (en) 2014-01-23 2016-05-11 株式会社ダイセル Sealing composition
JP5700166B1 (en) * 2014-08-01 2015-04-15 東洋インキＳｃホールディングス株式会社 Adhesive composition, laminate, storage device packaging, storage device container, and storage device
KR102178215B1 (en) * 2014-08-27 2020-11-12 도요보 가부시키가이샤 Low dielectric adhesive composition
JP5900680B1 (en) * 2015-03-25 2016-04-06 東洋インキＳｃホールディングス株式会社 Adhesive composition, laminate, storage device packaging, storage device container, and storage device
TWI729034B (en) * 2015-12-01 2021-06-01 日商琳得科股份有限公司 Adhesive composition, sealing plate and sealing body
TWI751989B (en) * 2015-12-01 2022-01-11 日商琳得科股份有限公司 Adhesive composition, sealing plate and sealing body
JP6353990B1 (en) * 2016-09-07 2018-07-04 リンテック株式会社 Adhesive composition, sealing sheet, and sealing body
WO2018047920A1 (en) * 2016-09-07 2018-03-15 リンテック株式会社 Adhesive composition, sealing sheet, and sealed body

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