JP2018186309A5 - - Google Patents
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- Publication number
- JP2018186309A5 JP2018186309A5 JP2018161319A JP2018161319A JP2018186309A5 JP 2018186309 A5 JP2018186309 A5 JP 2018186309A5 JP 2018161319 A JP2018161319 A JP 2018161319A JP 2018161319 A JP2018161319 A JP 2018161319A JP 2018186309 A5 JP2018186309 A5 JP 2018186309A5
- Authority
- JP
- Japan
- Prior art keywords
- local connection
- connection wiring
- wiring
- electrically connected
- protruding semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims 29
- 239000002184 metal Substances 0.000 claims 5
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018161319A JP6598949B2 (ja) | 2018-08-30 | 2018-08-30 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018161319A JP6598949B2 (ja) | 2018-08-30 | 2018-08-30 | 半導体装置 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015059529A Division JP6396834B2 (ja) | 2015-03-23 | 2015-03-23 | 半導体装置 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019181351A Division JP6818107B2 (ja) | 2019-10-01 | 2019-10-01 | 半導体装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2018186309A JP2018186309A (ja) | 2018-11-22 |
| JP2018186309A5 true JP2018186309A5 (enrdf_load_stackoverflow) | 2019-02-21 |
| JP6598949B2 JP6598949B2 (ja) | 2019-10-30 |
Family
ID=64355159
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018161319A Active JP6598949B2 (ja) | 2018-08-30 | 2018-08-30 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6598949B2 (enrdf_load_stackoverflow) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2025126580A1 (ja) * | 2023-12-14 | 2025-06-19 | 株式会社ソシオネクスト | 半導体集積回路装置 |
| WO2025126579A1 (ja) * | 2023-12-14 | 2025-06-19 | 株式会社ソシオネクスト | 半導体集積回路装置 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005116969A (ja) * | 2003-10-10 | 2005-04-28 | Toshiba Corp | 半導体装置及びその製造方法 |
| JPWO2009104358A1 (ja) * | 2008-02-21 | 2011-06-16 | 株式会社アドバンテスト | リング発振器 |
| US8258577B2 (en) * | 2009-06-04 | 2012-09-04 | International Business Machines Corporation | CMOS inverter device with fin structures |
| JP2012155471A (ja) * | 2011-01-25 | 2012-08-16 | Renesas Electronics Corp | デューティ調整回路の設計装置及び設計方法 |
| JP2014103254A (ja) * | 2012-11-20 | 2014-06-05 | Renesas Electronics Corp | 半導体装置およびその製造方法 |
| WO2015029280A1 (ja) * | 2013-08-28 | 2015-03-05 | パナソニック株式会社 | 半導体集積回路装置 |
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2018
- 2018-08-30 JP JP2018161319A patent/JP6598949B2/ja active Active