JP2018185268A - Inspection circuit board and semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve the reliability and reduce the size of a semiconductor device including a semiconductor element not having an inspection function.SOLUTION: Provided is an inspection circuit board 10 constituting an inspection circuit for inputting/outputting an inspection signal so as to scan the external input/output terminals of a semiconductor element not having an inspection function. The inspection circuit board includes a boundary scan cell 11 for inputting/outputting an inspection signal so as to scan the external input/output terminals of a semiconductor element 12, with terminals provided that can establish electrical continuity with the external input/output terminals of the semiconductor element, the boundary scan cell being provided within the inspection circuit board or on a second surface that is the reverse side of a first surface, with a wiring pattern for connecting the semiconductor element and the boundary scan cell formed within the inspection circuit board.SELECTED DRAWING: Figure 2

Description

  The present disclosure relates to an inspection circuit board constituting an inspection circuit that inputs and outputs an inspection signal so as to scan an external input / output terminal of a semiconductor element that does not have an inspection function, and a semiconductor device having the inspection circuit board.

  Japanese Patent Application Laid-Open No. 2004-133620 discloses a test circuit board that constitutes a test circuit that inputs and outputs test data so as to sequentially scan external input / output terminals of an integrated circuit, and is a bare chip for an integrated circuit that does not have a test function. And a test cell each having a TAP controller, and having an auxiliary intermediate board that is approximately the same size as the package of the integrated circuit, and mounting the integrated circuit on the circuit board via the auxiliary intermediate board In addition, the inspection cell is mounted on the auxiliary intermediate substrate, and the electrode of the inspection cell is connected to the wiring pattern of the auxiliary intermediate substrate via the solder ball, and the inspection cell is connected via the wiring pattern of the auxiliary intermediate substrate. An inspection circuit board connected to an integrated circuit having no inspection function is disclosed.

Japanese Patent No. 11-218560

  The present disclosure provides an inspection circuit board and a semiconductor device that can improve the reliability and miniaturization of a semiconductor device having a semiconductor element that does not have an inspection function.

  An inspection circuit board in the present disclosure is an inspection circuit board that constitutes an inspection circuit that inputs and outputs an inspection signal so as to scan an external input / output terminal of a semiconductor element that does not have an inspection function. A boundary scan cell that inputs and outputs an inspection signal so as to scan an output terminal is provided, and a terminal that can be electrically connected to the external input / output terminal of the semiconductor element is provided on a first surface. The wiring pattern for connecting the semiconductor element and the boundary scan cell is formed in the inspection circuit board, which is provided in the inspection circuit board or on the second surface which is the back surface of the first surface. Has been.

  Since the inspection circuit board according to the present disclosure includes a boundary scan cell that inputs and outputs an inspection signal so as to scan the external input / output terminals of the semiconductor element, the external input / output terminals of the semiconductor element that does not have the inspection function are provided. The condition can be checked. For this reason, since the joining state at the time of mounting of a semiconductor element can be confirmed, the reliability of a semiconductor device can be improved. In addition, since the boundary scan cell is provided in the inspection circuit board or on the second surface which is the back surface of the first surface, the size of the semiconductor device in the height direction can be suppressed. Therefore, it is possible to improve the reliability and reduce the size of a semiconductor device including a semiconductor element that does not have an inspection function.

1 is a schematic block diagram of a semiconductor device according to a first embodiment. 1 is a longitudinal sectional view of a semiconductor device according to a first embodiment. Schematic plan view of a vehicle when the semiconductor device 1 according to the first embodiment is used as an in-vehicle camera A longitudinal sectional view of a semiconductor device according to a second embodiment Vertical section of a semiconductor device according to the third embodiment Schematic block diagram of a semiconductor device according to a comparative example

  Hereinafter, embodiments will be described with reference to the drawings. However, more detailed description than necessary may be omitted. For example, detailed descriptions of already well-known matters and repeated descriptions for substantially the same configuration may be omitted. This is to avoid the following description from becoming unnecessarily redundant and to facilitate understanding by those skilled in the art.

  The accompanying drawings and the following description are provided to enable those skilled in the art to fully understand the present disclosure, and are not intended to limit the subject matter described in the claims.

[Embodiment]
[1-1. Task]
Hereinafter, the problem of this embodiment will be described. In recent years, an in-vehicle camera has been mounted for use in rearward confirmation during parking. Further, an in-vehicle camera has been installed to provide a detection function to the in-vehicle camera, detect people and objects inside and outside the vehicle, analyze the information, alert the driver, and control the vehicle.

  An in-vehicle camera having a detection function is required to have high quality and reliability in order to directly connect with safety and security such as collision prevention.

  In-vehicle cameras are equipped with CCD (Charge Coupled Device) and CMOS (Complementary Metal Oxide Semiconductor) image sensors, and the number of BGA (Ball grid array) packages that can be provided with a large number of pins is increased by increasing the number of functional pins. It is coming. Here, in the BGA, solder melted by a dispenser is applied to the terminals arranged in a lattice pattern on the bottom surface of the package, and an electrode (also referred to as a solder ball) formed in a hemisphere is formed by the surface tension of the solder. BGA package products are mounted on a mounting board by solder reflow, but there is a problem that probe pins cannot be applied to BGA after reflow mounting. Further, since the appearance inspection of the solder joint portion cannot be directly performed, an inspection using X-rays has been attempted. However, there is a case where an open defect of the solder connection cannot be detected, and there is a problem that the location of the mounting defect is not known.

  One of the failure determination methods for these mounting defects is a boundary scan standardized as the international standard IEEE 1149.1. Here, the boundary scan is a technique for examining the state of a terminal or changing a value input / output by the terminal using a boundary scan cell installed between the terminal and internal logic.

  FIG. 6 is a schematic block diagram of a semiconductor device according to a comparative example. As shown in FIG. 6, as an example, the semiconductor device 5 according to the comparative example includes two integrated circuits 53 having a boundary scan function. The integrated circuit 53 includes an internal logic circuit 59 and a TAP controller 54 (Test Access Port). The semiconductor device 5 according to the comparative example is connected to the host computer 21 via a control line, and a test control signal is supplied from the host computer 21 via this control line. As described above, the boundary scan inspection is performed on the semiconductor device 5 by performing the control from the host computer 21 through the control line.

  Many CPUs (Central Processing Units) and FPGAs (Field-Programmable Gate Arrays) support boundary scan, but many custom ICs and image sensors do not have a built-in TAP controller and support boundary scans. Absent. As described above, in the case of a semiconductor element in which a TAP (Test Access Port) controller is not incorporated, there is a problem in that reliability is low because boundary scan cannot be performed.

  In order to perform a boundary scan with a semiconductor element that does not have a built-in TAP controller, it is necessary to mount an external TAP controller. For example, in Patent Document 1, an auxiliary intermediate substrate having a size substantially the same as a package of an integrated circuit is provided by adding an inspection cell made of a bare chip and having a TAP controller to an integrated circuit having no inspection function. The integrated circuit is mounted on the circuit board via the auxiliary intermediate substrate, and the inspection cell is mounted on the auxiliary intermediate substrate, and the electrode of the inspection cell is connected to the wiring pattern of the auxiliary intermediate substrate via the solder ball. An inspection board circuit is disclosed in which an inspection cell is connected to an integrated circuit having no inspection function via a wiring pattern of an auxiliary intermediate board.

However, this trial also requires a height area equivalent to the auxiliary intermediate board, although the area of the circuit board does not increase in order to mount the auxiliary intermediate board for mounting the bare chip (TAP controller). There is a problem that miniaturization is difficult. Specifically, the in-vehicle camera is currently used as a rear camera and a front camera of a vehicle, and as a size, a product having a size of 23 mm in length × 23 mm in width × 30 mm in height is mounted, but 23 mm in length × 23 mm in width. X It is difficult to reduce the size so as to be within a height of 30 mm. Furthermore, the electronic mirror 32 that replaces the side mirror also has a design problem, and further miniaturization is desired.

  Furthermore, it is necessary to mount a plurality of bare chips (TAP controllers) corresponding to at least the integrated circuit to be measured on the auxiliary intermediate substrate, which causes a problem of increasing costs.

  Each embodiment has been made in view of such circumstances, and provides an inspection circuit board and a semiconductor device that can improve the reliability and miniaturization of a semiconductor device having a semiconductor element that does not have an inspection function. Furthermore, each embodiment provides an inspection circuit board and a semiconductor device that can reduce the cost.

(First embodiment)
The first embodiment will be described below with reference to FIGS.

[1-2. Constitution]
FIG. 1 is a schematic block diagram of a semiconductor device 1 according to the first embodiment.

  As shown in FIG. 1, the semiconductor device 1 according to the first embodiment includes, as an example, a semiconductor element 12 that does not have an inspection function and a semiconductor element 13 that has an inspection function. Here, the inspection function will be described below as an example of the boundary scan function.

  The semiconductor element 12 not having the boundary scan function has the internal logic 121 mounted thereon, but does not have a TAP controller mounted thereon. On the other hand, the semiconductor element 13 having a boundary scan function includes an internal logic 131 and a TAP controller 132. The semiconductor element 12 is a custom IC (Integrated Circuit) or an image sensor. In the present embodiment, as an example, the semiconductor element 12 will be described below as an image sensor. On the other hand, the semiconductor element 13 is, for example, an integrated circuit (IC).

  Further, the semiconductor device 1 includes a boundary scan cell 11 for adding a boundary scan function to the semiconductor element 12 that does not have the boundary scan function. The boundary scan cell 11 includes a supply circuit 111 that supplies a test signal to the semiconductor element 12, a reception circuit 112 that receives the test signal output from the semiconductor element 12, and a TAP that switches between the supply circuit 111 and the reception circuit 112 for control. And a controller 113. The boundary scan cell 11 is, for example, a chip on which a supply circuit 111, a reception circuit 112, and a TAP controller 113 are mounted.

  In this way, by configuring the TAP controller 113 to switch and control the supply circuit 111 and the receiving circuit 112, the number of TAP controllers in the boundary scan cell 11 can be reduced from two to one. The boundary scan cell 11 can be downsized. Furthermore, when the semiconductor element 12 is an image sensor, a small in-vehicle camera can be provided. In Patent Document 1, a plurality of TAP controllers corresponding to at least the integrated circuit to be measured are required on the auxiliary intermediate substrate. However, since inspection can be performed with a single TAP controller, the cost can be suppressed.

  The semiconductor device 1 according to the first embodiment is connected to a host computer 21 via a control line, and a test control signal is supplied from the host computer 21 via this control line. As described above, the boundary scan inspection is performed on the inspection circuit board 10 by performing the control from the host computer 21 via the control line.

  FIG. 2 is a longitudinal sectional view of the semiconductor device according to the first embodiment. As shown in FIG. 2, the semiconductor device 1 includes an inspection circuit board 10, and a boundary scan cell 11 is mounted inside the inspection circuit board 10. The inspection circuit board 10 inputs and outputs inspection signals so as to scan the external input / output terminals of the semiconductor element 12 having no inspection function.

  On the surface (first surface) of the inspection circuit board 10, a plurality of terminals 41 provided so as to be electrically connected to the external input / output terminals of the semiconductor element 12 are provided. In order to connect the semiconductor element 12 that does not have the boundary scan function and the boundary scan cell 11, a wiring pattern 16 that connects each of the plurality of terminals 41 and the boundary scan cell 11 is formed in the inspection circuit substrate 10. On the surface (first surface) of the inspection circuit board 10, an integrated circuit (here, an image sensor as an example) 12 having no boundary scan function is fixed to the corresponding terminal 41 by each solder ball 15. Here, the solder balls 15 are made of BGA, for example. As a result, the semiconductor element 12 is connected to the boundary scan cell 11 via the solder ball 15, the terminal 41, and the wiring pattern 16.

  In addition, a plurality of terminals 42 are provided on the back surface (second surface) of the inspection circuit board 10 so as to be electrically connected to the external input / output terminals of the semiconductor element 13. In order to connect the semiconductor element 13 having the boundary scan function and the boundary scan cell 11, a wiring pattern 16 is formed in the inspection circuit board 10. On the back surface (second surface) of the inspection circuit board 10, the semiconductor element 13 having a boundary scan function is fixed to the corresponding terminal 42 by each solder ball 19. Here, the solder balls 19 are made of BGA, for example. Thereby, the semiconductor element 13 is connected to the boundary scan cell 11 via the solder ball 19, the terminal 42, and the wiring pattern 16.

  In this embodiment, as an example, the test circuit board 10 and the semiconductor elements 12 and 13 are soldered by solder balls 15 and 19 formed of BGA, but are soldered by LGA (Land grid array). May be. Here, the LGA is obtained by arranging planar electrode pads in a grid pattern instead of BGA solder balls. The same effect can be obtained even if this LGA is soldered.

  Further, a terminal 43 is provided on the inspection circuit board 10 in order to add a boundary scan function as required.

  FIG. 3 is a schematic plan view of the vehicle when the semiconductor device 1 according to the first embodiment is used as an in-vehicle camera. The semiconductor device 1 according to the first embodiment may be used as the rear camera 31 or the front camera 33 of the vehicle 4. The semiconductor device 1 according to the first embodiment may be used as an electronic mirror 32 that replaces the side mirror.

[1-3. Effect]
As described above, the inspection circuit board 10 according to the first embodiment constitutes an inspection circuit that inputs and outputs inspection signals so as to scan the external input / output terminals of the semiconductor element 12 that does not have an inspection function. The inspection circuit board 10 includes a boundary scan cell 11 that inputs and outputs inspection signals so as to sequentially scan external input / output terminals of the integrated circuit. A terminal capable of conducting with an external input / output terminal of the semiconductor element 12 is provided on the first surface. The boundary scan cell 11 is provided in the inspection circuit board 10. A wiring pattern 16 for connecting the semiconductor element 12 and the boundary scan cell 11 is formed in the inspection circuit board 10.

  With this configuration, the inspection circuit board 10 includes the boundary scan cell 11 for inputting / outputting the inspection signal so as to scan the external input / output terminal of the semiconductor element 12, so that the semiconductor element 12 having no inspection function is provided. The state of the external input / output terminal can be inspected. For this reason, since the joining state at the time of mounting of the semiconductor element 12 can be confirmed, the reliability of the semiconductor device 1 can be improved. Further, since the boundary scan cell 11 is provided in the inspection circuit board 10, the size of the semiconductor device 1 in the height direction can be suppressed. Accordingly, it is possible to improve the reliability and reduce the size of the semiconductor device 1 including the semiconductor element 12 having no inspection function.

[Other embodiments]
As described above, the embodiments have been described as examples of the technology disclosed in the present application. However, the technology in the present disclosure is not limited to this, and can also be applied to embodiments that have been changed, replaced, added, omitted, and the like.

Therefore, other embodiments will be exemplified below.
(Second Embodiment)
FIG. 4 is a longitudinal sectional view of the semiconductor device according to the second embodiment. As shown in FIG. 4, in the semiconductor device 2 according to the second embodiment, both an integrated circuit (here, an image sensor as an example) 12 having no inspection function and a semiconductor element 13 having an inspection function are included in an inspection circuit board. It is fixed to the surface (first surface) 17 by solder balls 15 and 19, respectively.

  The inspection circuit board 17 includes a boundary scan cell 11 that inputs and outputs inspection signals so as to scan external input / output terminals of the semiconductor elements 12 and 13. Terminals 41 and 43 that can be electrically connected to external input / output terminals of the semiconductor elements 12 and 13 are provided on the surface (first surface), respectively. The boundary scan cell 11 is provided in the inspection circuit board 17. Further, a wiring pattern 16 b for connecting the semiconductor elements 12 and 13 and the boundary scan cell 11 is formed in the inspection circuit board 17. Thereby, the semiconductor element 12 is connected to the boundary scan cell 11 via the solder ball 15, the terminal 41, and the wiring pattern 16b. Further, the semiconductor element 13 is connected to the boundary scan cell 11 through the solder ball 19, the terminal 43, and the wiring pattern 16b.

  As described above, in the semiconductor device 2 according to the second embodiment, the semiconductor element 12 and the semiconductor element 13 are provided on the same surface of the inspection circuit board 17. Thereby, the thickness of the semiconductor device 2 can be reduced. These can be implemented without changing the reflow mounting method on the substrate.

(Third embodiment)
In the first and second embodiments, the boundary scan cell 11 is provided in the inspection circuit board. In the second embodiment, the boundary scan cell 11 is provided on the back surface (second surface) of the test circuit board. ).

  FIG. 5 is a longitudinal sectional view of the semiconductor device according to the third embodiment. As shown in FIG. 4, in the semiconductor device 3 according to the third embodiment, both the integrated circuit (here, an image sensor as an example) 12 having no inspection function and the semiconductor element 13 having an inspection function are inspected circuit boards. It is fixed to the surface (first surface) 18 by solder balls 15 and 19, respectively. On the other hand, the inspection circuit board 18 includes a boundary scan cell 11, and the boundary scan cell 11 is fixed to the back surface of the test circuit board 18.

  Similarly to the second embodiment, terminals 41 and 43 that can be electrically connected to external input / output terminals of the semiconductor elements 12 and 13 are provided on the surface (first surface), respectively. A wiring pattern 16 c for connecting the semiconductor elements 12 and 13 and the boundary scan cell 11 is formed in the inspection circuit board 18. Thereby, the semiconductor element 12 is connected to the boundary scan cell 11 via the solder ball 15, the terminal 41, and the wiring pattern 16c. Further, the semiconductor element 13 is connected to the boundary scan cell 11 via the solder ball 19, the terminal 43, and the wiring pattern 16c.

  As described above, according to the semiconductor device 3 according to the third embodiment, since the boundary scan cell 11 is provided on the back surface (second surface) of the inspection circuit board 18, the thickness of the inspection circuit board 18. Can be reduced.

  In each embodiment, the semiconductor element 13 has been described as having a boundary scan function. However, the present invention is not limited to this, and the semiconductor element 13 may not have a boundary scan function. In that case, the boundary scan cell 11 may input / output the inspection signal so as to scan the external input / output terminal of the semiconductor element 13.

  In each embodiment, the case where the semiconductor device includes two semiconductor elements has been described. However, the present invention is not limited to this, and the number of semiconductor elements may be one or three or more. For example, in the case where the semiconductor device includes two or more types of semiconductor elements, it is sufficient that one of the semiconductor elements does not have an inspection function.

1, 2, 3, 5 Semiconductor device 4 Vehicle 10, 17, 18 Inspection circuit board 11 Boundary scan cell 111 Supply circuit 112 Reception circuit 113 TAP controller 12 Semiconductor element 121 Internal logic circuit 13 Semiconductor element 14 TAP controller 15, 19 Solder ball 16, 16b, 16c Wiring pattern 53 Integrated circuit 54 TAP controller 59 Internal logic circuit 21 Host computer 31 Rear camera 32 Electronic mirror 33 Front camera 41, 42, 43 Terminal

Claims (8)

An inspection circuit board constituting an inspection circuit that inputs and outputs an inspection signal so as to scan an external input / output terminal of a semiconductor element that does not have an inspection function,
A boundary scan cell that inputs and outputs an inspection signal so as to scan an external input / output terminal of the semiconductor element,
A terminal capable of electrical connection with the external input / output terminal of the semiconductor element is provided on the first surface;
The boundary scan cell is provided in a second surface which is the back surface of the inspection circuit board or the first surface,
A test circuit board, wherein a wiring pattern for connecting the semiconductor element and the boundary scan cell is formed in the test circuit board. The boundary scan cell is
A supply circuit for supplying an inspection signal to the semiconductor element;
A receiving circuit for receiving an inspection signal output from the semiconductor element;
A TAP controller for switching and controlling the supply circuit and the receiving circuit;
The inspection circuit board according to claim 1. The inspection circuit board according to claim 2, wherein the boundary scan cell is a chip on which the supply circuit, the reception circuit, and the TAP controller are mounted. The inspection circuit board according to claim 1, wherein the semiconductor element is an image sensor. A first semiconductor element having no inspection function;
The inspection circuit board according to any one of claims 1 to 4, which constitutes an inspection circuit that inputs and outputs an inspection signal so as to scan an external input / output terminal of the first semiconductor element;
A semiconductor device comprising: A second semiconductor element;
The semiconductor device according to claim 5, wherein the first semiconductor element and the second semiconductor element are provided on a first surface of the inspection circuit board. The semiconductor device according to claim 6, wherein the boundary scan cell is provided on a second surface that is a back surface of the first surface of the inspection circuit board. The semiconductor device according to claim 5, wherein the first semiconductor element is an image sensor.