JP2018182180A5 - - Google Patents

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Publication number
JP2018182180A5
JP2018182180A5 JP2017082569A JP2017082569A JP2018182180A5 JP 2018182180 A5 JP2018182180 A5 JP 2018182180A5 JP 2017082569 A JP2017082569 A JP 2017082569A JP 2017082569 A JP2017082569 A JP 2017082569A JP 2018182180 A5 JP2018182180 A5 JP 2018182180A5
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JP
Japan
Prior art keywords
metal foil
electronic module
module according
resin
wiring pattern
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JP2017082569A
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Japanese (ja)
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JP2018182180A (en
JP6495368B2 (en
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Priority claimed from JP2017082569A external-priority patent/JP6495368B2/en
Priority to JP2017082569A priority Critical patent/JP6495368B2/en
Priority to EP18788521.5A priority patent/EP3564991B1/en
Priority to US16/606,738 priority patent/US11049780B2/en
Priority to PCT/JP2018/015881 priority patent/WO2018194062A1/en
Priority to CN201880024003.5A priority patent/CN110494974B/en
Publication of JP2018182180A publication Critical patent/JP2018182180A/en
Publication of JP2018182180A5 publication Critical patent/JP2018182180A5/ja
Priority to TW108109037A priority patent/TWI686121B/en
Publication of JP6495368B2 publication Critical patent/JP6495368B2/en
Application granted granted Critical
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Description

さらに、本発明に係る電子モジュールは、前記配線パターンが、半田付け可能な金属箔で構成され、該金属箔が、前記絶縁性樹脂で前記回路部を封止する際の成形温度以下の融点又は再結晶温度を有する材料で構成されている。 Furthermore , in the electronic module according to the present invention, the wiring pattern is composed of a solderable metal foil, and the metal foil has a melting point equal to or lower than a molding temperature when the circuit portion is sealed with the insulating resin. that consists of a material having a recrystallization temperature.

上記のように、配線パターンを構成する金属箔が、成形温度以下の融点又は再結晶温度を有する材料から構成されていれば、絶縁性樹脂で回路部を封止する際の成形温度により金属箔が熱膨張し、金属箔を構成する金属材料の少なくとも一部が溶融又は軟化する。これにより溶融した樹脂が勢いよく流れ込んだとしても、金属箔が変形に耐え得ることができるので、回路部を封止する成形時の金属箔の熱膨張により基材が受けるストレスを軽減することができる。 As described above, if the metal foil constituting the wiring pattern is made of a material having a melting point or a recrystallization temperature equal to or lower than the molding temperature, the metal foil is formed by the molding temperature when the circuit portion is sealed with the insulating resin. Is thermally expanded, and at least part of the metal material constituting the metal foil is melted or softened . As a result, even if the molten resin flows in vigorously, the metal foil can withstand deformation, so that the stress applied to the base material by the thermal expansion of the metal foil during molding for sealing the circuit portion can be reduced. it can.

Claims (8)

柔軟性を有するとともに絶縁性を有する基材と、該基材の少なくとも一方の面上に形成される配線パターンに光デバイス及び電子デバイスのうちの少なくとも一方のデバイスが実装された回路部と、該回路部を絶縁性樹脂で封止する樹脂体とを備え、
前記配線パターンが金属箔で構成され、該金属箔が、前記絶縁性樹脂で前記回路部を封止する際の成形温度以下の融点を有する材料で構成されていることを特徴とする電子モジュール。 A substrate having flexibility and insulation, and a circuit unit in which at least one of an optical device and an electronic device is mounted on a wiring pattern formed on at least one surface of the substrate; and A resin body that seals the circuit portion with an insulating resin,
The electronic module, wherein the wiring pattern is made of a metal foil, and the metal foil is made of a material having a melting point equal to or lower than a molding temperature when the circuit portion is sealed with the insulating resin . 柔軟性を有するとともに絶縁性を有する基材と、該基材の少なくとも一方の面上に形成される配線パターンに光デバイス及び電子デバイスのうちの少なくとも一方のデバイスが実装された回路部と、該回路部を絶縁性樹脂で封止する樹脂体とを備え、
前記配線パターンが金属箔で構成され、該金属箔が、前記絶縁性樹脂で前記回路部を封止する際の成形温度以下の再結晶温度を有する材料で構成されていることを特徴とする電子モジュール。 A substrate having flexibility and insulation, and a circuit unit in which at least one of an optical device and an electronic device is mounted on a wiring pattern formed on at least one surface of the substrate; and A resin body that seals the circuit portion with an insulating resin,
The wiring pattern is made of a metal foil, and the metal foil is made of a material having a recrystallization temperature equal to or lower than a molding temperature when the circuit portion is sealed with the insulating resin. module. 前記金属箔が、半田付け可能な金属箔で構成されている請求項１又は２に記載の電子モジュール。   The electronic module according to claim 1, wherein the metal foil is composed of a solderable metal foil. 前記金属箔が、半田箔で構成されている請求項１，２又は３に記載の電子モジュール。   The electronic module according to claim 1, wherein the metal foil is made of a solder foil. 前記基材の一方の面上に、導電性を有する下地層を備え、前記金属箔は、前記下地層の上に形成されている請求項１乃至４のいずれかに記載の電子モジュール。   5. The electronic module according to claim 1, further comprising a base layer having conductivity on one surface of the base material, wherein the metal foil is formed on the base layer. 前記基材が通気性を有する材料で構成されている請求項１乃至５のいずれかに記載の電子モジュール。   The electronic module according to claim 1, wherein the base material is made of a material having air permeability. 前記基材が、多数のガラス繊維からなるガラスクロスで構成され、該ガラスクロスの実装側の一方の面とは反対側の他方の面に柔軟性を有する樹脂層を備えている請求項１乃至６のいずれかに記載の電子モジュール。   The said base material is comprised with the glass cloth which consists of many glass fibers, and is equipped with the resin layer which has a softness | flexibility in the other surface on the opposite side to the one surface of the mounting side of this glass cloth. 7. The electronic module according to any one of 6. 前記樹脂層が、ウレタン樹脂により構成されている請求項７に記載の電子モジュール。   The electronic module according to claim 7, wherein the resin layer is made of a urethane resin.
JP2017082569A 2017-04-19 2017-04-19 Electronic module Active JP6495368B2 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2017082569A JP6495368B2 (en) 2017-04-19 2017-04-19 Electronic module
CN201880024003.5A CN110494974B (en) 2017-04-19 2018-04-17 Electronic module and method for manufacturing the same
US16/606,738 US11049780B2 (en) 2017-04-19 2018-04-17 Electronic module and method for manufacturing same
PCT/JP2018/015881 WO2018194062A1 (en) 2017-04-19 2018-04-17 Electronic module and method for manufacturing same
EP18788521.5A EP3564991B1 (en) 2017-04-19 2018-04-17 Method for manufacturing an electronic module
TW108109037A TWI686121B (en) 2017-04-19 2019-03-18 Electronic module and its manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017082569A JP6495368B2 (en) 2017-04-19 2017-04-19 Electronic module

Publications (3)

Publication Number Publication Date
JP2018182180A JP2018182180A (en) 2018-11-15
JP2018182180A5 true JP2018182180A5 (en) 2018-12-27
JP6495368B2 JP6495368B2 (en) 2019-04-03

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Country Status (6)

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US (1) US11049780B2 (en)
EP (1) EP3564991B1 (en)
JP (1) JP6495368B2 (en)
CN (1) CN110494974B (en)
TW (1) TWI686121B (en)
WO (1) WO2018194062A1 (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20210321524A1 (en) * 2020-04-13 2021-10-14 Flex Ltd. Electronic encapsulation through stencil printing
CN114126207B (en) * 2020-08-27 2024-03-26 致伸科技股份有限公司 Film circuit board and manufacturing method thereof
CN116529734A (en) * 2021-01-14 2023-08-01 凸版印刷株式会社 Card medium and method for manufacturing card medium

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JP3281859B2 (en) * 1997-12-22 2002-05-13 三洋電機株式会社 Manufacturing method of hybrid integrated circuit device
JP4555436B2 (en) 2000-06-29 2010-09-29 富士通株式会社 Resin molding method for thin film resin substrate and high frequency module
JP2006066486A (en) * 2004-08-25 2006-03-09 Towa Corp Resin sealing mold
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