JP2018181697A - Heating apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a heating apparatus which inhibits the escape of heat from a support material to a columnar support.SOLUTION: A heating apparatus includes a tabular support material 10 having a first surface and a second surface substantially orthogonal to a first direction, and having a resistance heating element internally, and a columnar support 20 extending in the first direction, bonded to the second surface of the support material, and having felly located on the inside of the felly of the support material over the whole circumference, when viewing in first direction. An inner cavity 18 is formed in the support material on the columnar support side for the resistance heating element. The cavity exists in the inside part H1 from the resistance heating element to the second surface, out of the support material, and surrounded by the felly of the columnar support, when viewing in first direction, and includes an inner cavity portion where volume fraction for the inside part is larger than 50%.SELECTED DRAWING: Figure 3

Description

  The technology disclosed herein relates to a heating device.

  There is known a heating apparatus (also referred to as a "susceptor") that heats to a predetermined processing temperature (e.g., about 400 to 650C) while holding an object (e.g., a semiconductor wafer). The heating apparatus is used, for example, as a part of a semiconductor manufacturing apparatus such as a film forming apparatus (a CVD film forming apparatus or a sputtering film forming apparatus) or an etching apparatus (a plasma etching apparatus or the like).

  In general, the heating apparatus includes a plate-like holding body having a holding surface and a back surface substantially orthogonal to a predetermined direction (hereinafter, referred to as “first direction”), and a columnar support. The columnar support is a column extending in the first direction, is joined to the back surface of the holder, and the outer edge is located inside the outer edge of the holder over the entire circumference when viewed in the first direction (e.g. 1). A resistive heating element is disposed inside the holder. When a voltage is applied to the resistance heating element through an electrode terminal and a power receiving electrode (not shown), the resistance heating element generates heat, and the object held on the holding surface of the holding body is heated.

JP, 2009-256789, A

  In the conventional heating apparatus described above, the heat generated in the resistance heating element inside the holding body is easily dissipated to the side of the columnar support via the portion between the resistance heating element and the back surface in the holding body, Variations in temperature distribution may occur, which may result in low temperature uniformity (in-plane uniformity) in the holding surface.

  The present specification discloses a technology that can solve the above-described problems.

  The technology disclosed in the present specification can be realized, for example, as the following form.

(1) A heating device disclosed in the present specification is a plate having a first surface and a second surface substantially orthogonal to a first direction, and a holder having a resistance heating element inside; A columnar support which is a pillar extending in a first direction, is joined to the second surface of the holder, and whose outer edge is located inside the outer edge of the holder over the entire circumference in the first direction And a heating device for heating an object held on the first surface of the holding body, wherein a cavity is provided on the side of the columnar support with respect to the resistance heating element inside the holding body. The cavity is an inner portion of the holding body from the resistance heating element to the second surface and is surrounded by the outer edge of the columnar support in the first direction. In the inner part, with a volume fraction of about 50% with respect to the inner part Including a large inner cavity portion. According to this heating apparatus, a cavity is formed on the side of the columnar support relative to the resistance heating element inside the holding body. The cavity comprises an inner cavity portion. The inner cavity portion is an inner portion of the holding body from the resistance heating element to the second surface, and is present in the inner portion overlapping the columnar support in the first direction view, and the volume ratio to the inner portion is It is a hollow portion larger than 50%. As a result, the heat insulating effect between the resistance heating element and the columnar support is improved inside the holding body, so that the heat is prevented from escaping from the holding body to the columnar support (hereinafter referred to as "heating"). be able to.

(2) In the heating device, the shape of the end on the support side in the columnar support is annular, and the cavity is the annular end of the annular support in the columnar support in the first direction. It may be configured to include an inner peripheral cavity portion located on the inner peripheral side. According to the heating device, the cavity includes the inner peripheral cavity portion located on the inner peripheral side of the annular end of the columnar support in the first direction. As a result, the heat insulating effect on the inner peripheral side of the annular end of the columnar support can be enhanced as compared with the configuration in which the cavity does not include the inner peripheral cavity portion, so heat transfer from the support to the columnar support can be achieved. Can be effectively suppressed.

(3) In the heating device, the shape of the end on the support side in the columnar support is annular, and the cavity is the annular end of the columnar support in the first direction. It may be configured to include a first continuous cavity portion which is continuous over the entire circumference of the overlapping portion. According to the heating device, the cavity includes the first continuous cavity portion which is continuous over the entire circumference of the portion overlapping the end of the annular support in the columnar support in the first direction. As a result, since the heat insulation effect can be enhanced particularly in a portion where heat generation easily occurs compared to the configuration in which the cavity does not include the first continuous cavity portion, heat generation from the holding body to the columnar support is effectively performed. It can be suppressed.

(4) In the heating device, the cavity is located outside the outer edge of the columnar support in the first direction view, and includes a second continuous cavity portion continuous over the entire circumference of the columnar support. It is also good. According to the heating device, the cavity includes the second continuous cavity portion located outside the outer edge of the pillared support in the first direction view and continuous over the entire circumference of the pillared support. As a result, the heat insulating effect around the columnar support can be enhanced compared to the configuration in which the cavity does not include the second continuous cavity portion, so that the heat transfer from the holding body to the columnar support is effectively suppressed. be able to.

(5) In the heating device, the cavity includes a plurality of annular portions substantially centered on the axis of the columnar support in the first direction view and different in distance from the axis, and the first direction The width of each of the annular portions may be wider than the distance between the annular portions in any direction along a virtual straight line perpendicular to the axis and passing through the axis. According to the heating device, the heat transfer from the holding body to the columnar support can be effectively suppressed as compared with a configuration in which the width of each annular portion is narrower than the distance between the annular portions.

(6) In the heating device, the cavity is a vacuum cavity connected to a vacuum suction device, and the first surface side relative to the resistance heating element in the holding body is the first surface. The structure may be characterized in that a gas path extending in a direction substantially orthogonal to the direction of is formed. According to the heating device, since the gas path and the vacuum cavity are disposed on the opposite sides of each other via the resistance heating element, it is possible to secure the degree of freedom of the gas path arrangement from the support to the columnar support Can be effectively suppressed.

  Note that the technology disclosed in the present specification can be realized in various forms, and can be realized, for example, in the form of a heating device, a component for a semiconductor manufacturing apparatus, a manufacturing method thereof, and the like. .

It is a perspective view which shows roughly the external appearance structure of the heating apparatus 100 in this embodiment. It is an explanatory view showing roughly the section composition of heating device 100 in this embodiment. It is an explanatory view showing roughly the section composition of heating device 100 in this embodiment. It is a flowchart which shows the manufacturing method of the heating apparatus 100 in this embodiment. FIG. 6 is an explanatory view schematically showing green sheet laminates 10A to 10C constituting a holding body 10. It is an explanatory view showing temperature distribution in sample 1 of heating device 100 when resistance heating element 50 generates heat. It is an explanatory view showing temperature distribution in sample 2 of heating device 100 when resistance heating element 50 generates heat. It is an explanatory view showing temperature distribution in sample 3 of heating device 100 when resistance heating element 50 generates heat. It is an explanatory view showing temperature distribution in modification 1 of heating device 100 when resistance heating element 50 generates heat. It is an explanatory view showing temperature distribution in modification 2 of heating device 100 when resistance heating element 50 generates heat.

A. This embodiment:
A-1. Configuration of heating device 100:
FIG. 1 is a perspective view schematically showing an appearance configuration of a heating device 100 in the present embodiment, and FIGS. 2 and 3 are explanatory views schematically showing a cross-sectional configuration of the heating device 100 in the present embodiment. . 2 shows the XZ cross-sectional configuration of the heating device 100 at the position II-II in FIG. 3, and FIG. 3 shows the XY cross-sectional configuration of the heating device 100 at the position III-III in FIG. It is done. Further, in FIG. 3, the columnar support 20 is shown by a dotted line. In each figure, mutually orthogonal XYZ axes for specifying the direction are shown. In this specification, for convenience, the Z-axis positive direction is referred to as the upward direction, and the Z-axis negative direction is referred to as the downward direction. However, the heating device 100 is actually installed with an orientation different from such an orientation. May be

  The heating apparatus 100 is an apparatus for heating an object (for example, a semiconductor wafer W) to a predetermined processing temperature (for example, about 400 to 650 ° C.) and is also called a susceptor. The heating apparatus 100 is used, for example, as a part of a semiconductor manufacturing apparatus such as a film forming apparatus (a CVD film forming apparatus or a sputtering film forming apparatus) or an etching apparatus (a plasma etching apparatus or the like).

  As shown in FIGS. 1 and 2, the heating device 100 includes a holder 10 and a columnar support 20.

(Support 10)
The holding body 10 is a substantially disk-shaped member having a holding surface S1 and a back surface S2 which are substantially orthogonal to a predetermined direction (vertical direction in the present embodiment). The holder 10 is made of, for example, a ceramic containing AlN (aluminum nitride) or Al ₂ O ₃ (alumina) as a main component. In addition, the main component here means the component with most content ratio (weight ratio). The diameter of the holding body 10 is, for example, about 100 mm or more and 500 mm or less, and the thickness (length in the vertical direction) of the holding body 10 is, for example, about 3 mm or more and 10 mm or less. The predetermined direction (vertical direction) corresponds to the first direction in the claims, and the holding surface S1 of the holder 10 corresponds to the first surface in the claims, and the back surface of the holder 10 S2 corresponds to the second surface in the claims.

  As shown in FIG. 2, a resistance heating element 50 as a heater for heating the holding body 10 is disposed inside the holding body 10. The resistance heating element 50 is formed of, for example, a conductive material such as tungsten or molybdenum. The pair of end portions of the resistance heating element 50 is disposed on the peripheral side of the holding body 10. Further, inside the holding body 10, a pair of via conductors 52 are provided. Each via conductor 52 is a linear conductor extending in the vertical direction, and the upper end of each via conductor 52 is connected to each end of the resistance heating element 50. In the vicinity of the central portion of the back surface S2 of the holding body 10, a pair of power reception electrodes 54 is disposed. The lower end of each via conductor 52 is connected to each power receiving electrode 54 via a conductive path 53 extending in the radial direction of the holder 10. Thus, the resistance heating element 50 and each power receiving electrode 54 are electrically connected. Note that other configurations (the gas path 14 and the vacuum cavity 18 and the like) in the holding body 10 will be described later.

(Columnar support 20)
The columnar support 20 is a substantially cylindrical member extending in the predetermined direction (vertical direction), and an electrode through hole 22 penetrating in the vertical direction from the upper surface S3 to the lower surface S4 of the columnar support 20 is formed. The columnar support 20 is formed of, for example, a ceramic containing AlN or Al ₂ O ₃ as a main component, similarly to the holder 10. The outer diameter of the columnar support 20 is smaller than the outer diameter of the holding body 10, specifically, for example, about 30 mm or more and 90 mm or less, and the height (length in the vertical direction) of the columnar support 20 is It is about 100 mm or more and 300 mm or less.

  The holding body 10 and the columnar support 20 are arranged such that the back surface S2 of the holding body 10 and the upper surface S3 of the columnar support 20 face in the vertical direction. The columnar support 20 is bonded in the vicinity of the central portion of the back surface S2 of the holder 10 via a bonding layer 30 formed of a known bonding material. As shown in FIG. 3, in the present embodiment, the outer edge 20E of the columnar support 20 is located inside the outer edge 10E of the holding body 10 over the entire circumference in the vertical direction (Z-axis direction).

  As shown in FIG. 2, a plurality (two in the present embodiment) of electrode terminals 70 are accommodated in the electrode through holes 22 of the columnar support 20. Each electrode terminal 70 is a substantially cylindrical conductive member, and is formed of, for example, nickel. An upper end portion of the electrode terminal 70 on the holding body 10 side is joined to the power receiving electrode 54 via a metal brazing material 56 (for example, a gold brazing material). The diameter of the electrode terminal 70 is substantially the same (for example, 3 mm or more and 6 mm or less) over the entire length in the vertical direction. When a voltage is applied from a power source (not shown) to the resistance heating element 50 through the electrode terminals 70, the power receiving electrodes 54, the via conductors 52, etc., the resistance heating element 50 generates heat, and the holding body 10 is held. The semiconductor wafer W held on the surface S1 is heated to the predetermined processing temperature.

  In the columnar support 20, a gas through hole 24 and a vacuum through hole 26 are further formed. Each of the gas through hole 24 and the vacuum through hole 26 extends in substantially the same direction as the vertical direction, and is a hole having a substantially circular cross section having an inner diameter substantially the same over the entire length in the vertical direction. The lower end of the gas through hole 24 is connected to a gas supply source (not shown) via a connection pipe (not shown), and the upper end of the gas through hole 24 is formed inside the holding body 10 It is in communication with a gas path 14 or the like described later. The purge gas (for example, nitrogen, argon) introduced from the gas supply source to the gas connection hole 82 is supplied to the gas through hole 24 and the gas path 14 of the holding body 10 and discharged to the outside of the columnar support 20. Thereby, the temperature distribution of the holding body 10 can be controlled. The lower end portion of the vacuum through hole 26 is connected to a vacuum suction device (for example, a vacuum pump not shown) via a connection pipe (not shown), and the upper end of the vacuum through hole 26 is the holder 10 It is in communication with a vacuum cavity 18 described below, which is formed inside. When the vacuum suction device operates, the semiconductor wafer W is vacuum-adsorbed on the holding surface S1 of the holder 10 by the vacuum through holes 26 and the vacuum cavity 18 and the like being in a vacuum state.

(Gas passage 14 of holder 10 and cavity 18 for vacuum)
As shown in FIG. 2, a gas path 14 and a vacuum cavity 18 are formed inside the holding body 10. These are not closed spaces closed inside the holding body 10 but open spaces communicating with the outside of the holding body 10. The gas path 14 is formed on the holding surface S1 side with respect to the resistance heating element 50. The gas path 14 is a path (space) extending in a plane direction orthogonal to the vertical direction (Z-axis direction) between the holding surface S1 of the holding body 10 and the resistance heating body 50, and, for example, It extends concentrically. The gas passage 14 communicates with the gas through holes 24 formed in the above-described columnar support 20 via the gas communication holes (not shown), and a plurality of gas discharge holes (shown in FIG. (Not shown). In the present embodiment, the vacuum path 16 is formed inside the gas path 14.

  As shown in FIG. 2, the vacuum cavity 18 is formed on the side of the columnar support 20 (rear surface S <b> 2) with respect to the resistance heating element 50. Further, as shown in FIG. 3, the vacuum cavity 18 is a space along a direction orthogonal to the vertical direction, and has a substantially circular shape centering on the central axis O of the holding body 10 in the vertical direction. The vacuum cavity 18 is present in at least the inner portion H1 of the holder 10. The inner portion H1 of the holding body 10 is surrounded by the outer edge 20E of the columnar support 20 in the vertical direction (Z-axis direction) of the holding body 10, and from the resistance heating element 50 in the direction perpendicular to the vertical direction. It is a portion up to the back surface S2. That is, the inner portion H1 is a portion overlapping the thick portion of the columnar support 20 and the electrode through hole 22 in the vertical direction. Hereinafter, a portion of the vacuum cavity 18 present in the inner portion H1 will be referred to as "inner cavity portion H2". The volume ratio of the inner cavity portion H2 to the inner portion H1 (= (volume of the inner cavity portion H2 / volume of the inner portion H1) × 100) is greater than 50%. The vacuum cavity 18 corresponds to the cavity in the claims. The vacuum cavity 18 communicates with a plurality of suction holes (not shown) opened in the holding surface S1 via the vacuum path 16. In the vacuum cavity 18, the volume of the hollow portion on the outer peripheral side of the outer edge 20E of the columnar support 20 in the vertical direction (hereinafter, referred to as "outer peripheral side hollow portion") is smaller than the volume of the inner hollow portion H2. When the volume of the inner cavity portion H2> the volume of the outer cavity portion, the heat insulating effect can be obtained while maintaining the strength of the holder 10.

A-2. Method of manufacturing heating device 100:
Next, a method of manufacturing the heating device 100 in the present embodiment will be described. FIG. 4 is a flowchart showing a method of manufacturing the heating device 100, and FIG. 5 is an explanatory view schematically showing three green sheet laminates 10A to 10C constituting the holding body 10. As shown in FIG. The manufacturing method of the holding body 10 is as follows, for example. First, as shown in FIG. 5, three green sheet laminates 10A to 10C are prepared (S110). First, an organic solvent is added to a mixture of aluminum nitride powder, yttrium oxide (Y ₂ O ₃ ) powder, an acrylic binder, and an appropriate amount of dispersant and plasticizer, and mixed in a ball mill to obtain a green sheet. Make a slurry for the The green sheet slurry is formed into a sheet by a casting apparatus and then dried to prepare a plurality of green sheets. In addition, a metallized paste is produced by adding a conductive powder such as tungsten or molybdenum to a mixture of an aluminum nitride powder, an acrylic binder, and an organic solvent and kneading. By printing this metallizing paste, for example, using a screen printing apparatus, an unsintered conductor layer to be the resistance heating element 50, the power receiving electrode 54 and the like is formed on a specific green sheet later. Further, by printing a metallizing paste in a state in which via holes are provided in advance in the green sheet, a non-sintered conductor portion to be the via conductor 52 later is formed. Then, a predetermined number of green sheets among the plurality of green sheets produced are laminated and thermocompression-bonded, and the outer periphery is cut if necessary, to produce the first green sheet laminate 10A. In addition, a predetermined number of green sheets including green sheets on which unsintered conductor layers to be the resistance heating element 50 and the via conductors 52 are formed are laminated and pressure-bonded, and the outer periphery is cut if necessary. The green sheet laminate 10B of A groove 14G to be the gas path 14 and a groove 16G to be the path 16 for vacuum are formed on the upper surface of the second green sheet laminate 10B. In addition, a predetermined number of green sheets including a green sheet on which a green conductor layer to be the conductive path 53 or the via conductor 52 is formed is stacked and pressure-bonded, and the outer periphery is cut if necessary. A green sheet laminate 10C is produced. A recess 18G to be the vacuum cavity 18 is formed on the top surface of the third green sheet laminate 10C.

  Next, the lower surface of the first green sheet laminate 10A and the upper surface of the second green sheet laminate 10B are opposed to each other, and the lower surface of the second green sheet laminate 10B and the upper surface of the third green sheet laminate 10C. And press-bond the three green-sheet laminates 10A to 10C, and degrease and fire the green-sheet laminates 10A to 10C after pressure-bonding to prepare a fired body (S120). . The surface of this sintered body is polished. By the above steps, the holder 10 is manufactured.

  Moreover, the columnar support 20 is produced (S130). The method for producing the columnar support 20 is, for example, as follows. First, an organic solvent is added to a mixture of aluminum nitride powder, yttrium oxide powder, PVA binder, and an appropriate amount of dispersant and plasticizer, and mixed in a ball mill to obtain a slurry. The slurry is granulated with a spray dryer to prepare a raw material powder. Next, the raw material powder is filled in a rubber mold in which cores corresponding to the electrode through holes 22, the gas through holes 24 and the vacuum through holes 26 are placed, and cold isostatic pressing is performed to obtain a molded body. The resulting molded body is degreased, and the degreased body is further fired. The columnar support 20 is manufactured by the above steps.

  Next, the holder 10 and the columnar support 20 are joined (S140). After lapping is performed on the back surface S2 of the support 10 and the upper surface S3 of the columnar support 20 as necessary, at least one of the back surface S2 of the support 10 and the upper surface S3 of the columnar support 20 is, for example, rare earth or organic A known bonding agent made into a paste by mixing a solvent and the like is uniformly applied, and then degreasing is performed. Next, the back surface S2 of the holding body 10 and the top surface S3 of the columnar support 20 are stacked and fired to bond the holding body 10 and the columnar support 20.

  After the holding body 10 and the columnar support 20 are joined, each electrode terminal 70 is inserted into each electrode through hole 22 and the upper end portion of each electrode terminal 70 is brazed to each power receiving electrode 54 by, for example, a gold brazing material To do (S150). The heating device 100 having the above-described configuration is manufactured by the above manufacturing method.

A-3. Temperature distribution in samples 1 to 3 of heating apparatus 100:
FIGS. 6-8 is explanatory drawing which shows the temperature distribution in the samples 1-3 of the heating apparatus 100 when the resistance heating element 50 heat | fever-generates. The upper part of each figure schematically shows a part of the XZ cross-sectional configuration of each sample, and the middle part schematically shows a part of the XY cross-sectional configuration of the sample at the position of QQ in the upper part. There is. A portion of each sample is one of the two parts divided by one virtual plane including the central axis O of the holder 10 (the part on the negative side in the X-axis direction). In the lower part, the temperature distribution in the sample is shown. In this temperature distribution, the darker the shaded area, the higher the temperature.

  As shown in the upper and middle parts of FIG. 6, the vacuum cavity 18X of the sample 1 is a substantially circular cavity in the vertical direction (Z-axis direction), and the outer edge 18E of the vacuum cavity 18X (vacuum cavity 18 The inner peripheral wall of the holding body 10 to be formed is located inside (the center axis O side of the holding body 10) the outer edge 20E (the outer edge of the inner portion H1) of the columnar support 20 over the entire circumference. The volume ratio of the inner cavity portion H2 to the inner portion H1 (= (volume of the inner cavity portion H2 / volume of the inner portion H1) × 100 or less, referred to as “inner cavity volume fraction”) in a vertical direction is greater than 50%, It is less than 100%. Further, the shape of the end of the columnar support 20 on the holder 10 side (the shape formed by the electrode through hole 22 of the columnar support 20 and the outer edge 20E) is substantially annular. The vacuum cavity 18X is an inner peripheral cavity portion 18AX located on the inner peripheral side (inner peripheral side than the electrode through hole 22 of the columnar support 20) of the substantially annular end of the columnar support 20 in the vertical direction. including.

  As shown in the lower part of FIG. 6, in the sample 1, the temperature distribution of the holder 10 is relatively higher than the temperature of the columnar support 20, and is substantially uniform except for the peripheral portion of the holder 10. . That is, while the temperature of the holding surface S1 of the holding body 10 is maintained substantially uniform, the heat generated by the resistance heating element 50 may escape from the holding body 10 to the columnar support 20 (hereinafter referred to as "heat"). It is suppressed. This is due to the presence of the vacuum cavity 18 having a heat transfer coefficient lower than that of the forming material (ceramics) of the columnar support 20 between the resistance heating element 50 and the columnar support 20, so that the inside of the support 10 is obtained. The heat insulation effect between the resistance heating element 50 and the columnar support 20 is improved.

  The vacuum cavity 18 of the sample 2 is substantially the same as the configuration shown in FIGS. 2 and 3 described above. Specifically, as also shown in the upper and middle parts of FIG. 7, the vacuum cavity 18 of the sample 2 is a substantially circular cavity in the vertical direction (Z-axis direction), and the outer edge 18E of the vacuum cavity 18 Is located on the outer side (the outer peripheral side of the holding body 10) than the outer edge 20E of the columnar support 20 (the outer edge of the inner portion H1) over the entire circumference. For this reason, the vacuum cavity 18 is located on the inner peripheral side of the substantially annular end of the columnar support 20 in the vertical direction (the inner peripheral side of the electrode through holes 22 of the columnar support 20). It includes a hollow portion 18A and a first continuous hollow portion 18B continuous over the entire circumference of a portion overlapping the annular end of the columnar support 20 in a vertical direction. Furthermore, the vacuum cavity 18 includes a second continuous cavity portion 18C located outside the outer edge 20E of the pillared support 20 in a vertical direction and continuous over the entire circumference of the outer edge 2E of the pillared support 20. The inner cavity volume fraction of sample 2 is 100%.

  As shown in the lower part of FIG. 7, in the sample 2, the temperature of the holder 10 is generally higher than that of the sample 1 and is substantially uniform over the entire holding surface S1. That is, in the sample 2, the vacuum cavity 18 includes the first continuous cavity portion 18 B and the second continuous cavity portion 18 C, so that, between the resistance heating element 50 and the columnar support 20, inside the holding body 10. It can be said that the heat insulation effect in the

  As shown in the upper and middle parts of FIG. 8, in the sample 3, the vacuum cavity 18Y is substantially centered on the central axis O of the holder 10 (columnar support 20) in the vertical direction, and the distance from the central axis O Are different from each other in the first vacuum cavity 18Y1 and the second vacuum cavity 18Y2. The first vacuum cavity 18Y1 is a substantially circular cavity as viewed in the vertical direction (Z-axis direction). The second vacuum cavity 18Y2 is a substantially annular cavity as viewed in the vertical direction. The outer edge 18E of the second vacuum cavity 18Y2 is located inside the outer edge 20E of the columnar support 20 (the outer edge of the inner portion H1) along the entire circumference. The inner cavity volume fraction of sample 3 is lower than the inner cavity volume fraction of sample 1. Further, in the radial direction of the holder 10, the separation width D2 between the first vacuum cavity 18Y1 and the second vacuum cavity 18Y2 is the width D1 of the first vacuum cavity 18Y1 or the second vacuum cavity 18Y2. Narrower.

  As shown in the lower part of FIG. 8, in the sample 3, the temperature of the holding body 10 is generally low since the inner cavity volume ratio is low compared to the sample 1 and the sample 2, and the temperature distribution of the holding surface S1 is slightly It is fluctuating. However, the heat insulating effect between the resistance heating element 50 and the columnar support 20 is improved in the inside of the holding body 10 as compared with the configuration in which no cavity exists between the resistance heating element 50 and the columnar support 20. It can be said that

A-4. Effects of the present embodiment:
As described above, according to the heating device 100 of the present embodiment, the vacuum cavities 18, 18X, 18Y2 (FIG. 2 and FIG. 2) are provided on the side of the columnar support 20 with respect to the resistance heating element 50 inside the holder 10. See FIG. 3 and FIGS. 6 to 8 Hereinafter, “vacuum cavity 18 etc.” is formed. The vacuum cavity 18 or the like includes an inner cavity portion H2 which is present in the inner portion H1 and whose inner cavity volume ratio is larger than 50%. Thereby, since the heat insulation effect between the resistance heating element 50 and the columnar support 20 is improved in the inside of the holding body 10, heat transfer from the holding body 10 to the columnar support 20 can be suppressed. And the temperature variation of holding side S1 of holding object 10 can be controlled by control of this heat radiation.

  In the above samples 1 to 3, the vacuum cavity 18 and the like are located on the inner peripheral side hollow portions 18A and 18AX located on the inner peripheral side of the annular end of the columnar support 20 in the vertical direction (FIGS. 2 and 3 See FIGS. 6 to 8 Hereinafter, the “inner circumferential side hollow portion 18A etc.” is included. As a result, the heat insulating effect on the inner peripheral side of the annular end portion of the columnar support 20 can be enhanced as compared with the configuration in which the vacuum cavity 18X and the like do not include the inner peripheral side hollow portion 18A and the like. The heat transfer to the columnar support 20 can be effectively suppressed.

  Further, in the sample 1, the vacuum cavity 18 is a first continuous cavity portion 18B continuous over the entire circumference of a portion overlapping the annular end of the columnar support 20 in the vertical direction (see FIGS. 3 and 6). )including. As a result, the heat insulating effect can be enhanced particularly in a portion where heat drawing is apt to occur, as compared with the configuration (for example, samples 2 and 3) in which the vacuum cavity 18 does not include the first continuous cavity portion 18B. The heat transfer to the columnar support 20 can be effectively suppressed.

  Further, in the sample 1, the vacuum cavity 18 is located outside the outer edge 20E of the columnar support 20 in the vertical direction, and the second continuous cavity portion 18C continuous over the entire circumference of the columnar support 20 (FIG. 3) And see FIG. As a result, the heat insulating effect around the columnar support 20 can be enhanced compared to the configuration in which the vacuum cavity 18 does not include the second continuous cavity portion 18C, so that the heat from the holding body 10 to the columnar support 20 Pulling can be effectively suppressed.

  In the sample 3, the vacuum cavity 18Y is substantially centered on the central axis O of the holder 10 (columnar support 20) in the vertical direction, and the plurality of annular portions 18Y1 different in distance from the central axis O , 18Y2. Further, in an arbitrary direction orthogonal to the vertical direction and along an imaginary straight line passing through the central axis O, the width D1 of each of the annular portions 18Y1 and 18Y2 is wider than the distance D2 between the annular portions 18Y1 and 18Y2. Thereby, compared to a configuration in which the width D1 of each of the annular portions 18Y1 and 18Y2 is narrower than the distance D2 between the annular portions 18Y1 and 18Y2, heat transfer from the holding body 10 to the columnar support 20 can be effectively suppressed. .

  Further, according to the present embodiment, the gas path 14 and the vacuum cavity 18 are disposed on the opposite sides of the resistance heating element 50. For this reason, as compared with the configuration in which the gas passage 14 and the vacuum cavity 18 are disposed on the same side with respect to the resistance heating element 50, the degree of freedom in arrangement of each of the gas passage 14 and the vacuum cavity 18 is It can suppress being restricted.

B. Modification:
The technology disclosed in the present specification is not limited to the above-described embodiment, and can be modified into various forms without departing from the scope of the present invention. For example, the following modifications are also possible.

  The structure of the heating apparatus 100 in the said embodiment is an illustration to the last, and can be variously deformed. For example, in the above embodiment, the outer shapes of the holding body 10 and the columnar support 20 in the Z-axis direction are substantially circular, but may be other shapes. Moreover, the electrode terminal accommodated in the through hole (electrode through hole 22) formed in the columnar support 20 is not limited to the terminal electrically connected to the resistance heating element 50, and for example, a high frequency generating plasma The terminal may be a terminal electrically connected to the (RF) electrode or a terminal electrically connected to a suction electrode for electrostatic adsorption. In addition, the columnar support 20 may have a configuration in which at least one of the gas through hole 24 and the vacuum through hole 26 is not formed. In the above embodiment, the power receiving electrode 54 is disposed in the recess 12 formed in the back surface S2 of the holding body 10, but may be disposed on the back surface S2 of the holding body 10. In short, the power receiving electrode may be disposed on the second surface side of the holder.

  Further, in the holding body 10, at least one of the gas path 14 and the path 16 for vacuum may not be formed. The vacuum cavity 18 may not include the inner cavity portion 18A as long as the inner cavity volume fraction satisfies the condition of more than 50%. Further, in the above embodiment, in the vacuum cavity 18, the volume of the hollow portion on the outer peripheral side of the outer edge 20E of the columnar support 20 in the vertical direction (hereinafter referred to as "outer peripheral side hollow portion") is that of the inner hollow portion H2. Although smaller than the volume, the present invention is not limited thereto, and the volume of the outer peripheral cavity portion may be larger than the volume of the inner cavity portion H2. Conversely, the vacuum cavity 18 may not include the outer peripheral cavity portion.

  In the above embodiment, the shapes of the first continuous cavity portion 18B and the second continuous cavity portion 18C are both annular in a vertical direction, but the present invention is not limited to this. As long as the shape is continuous over the circumference, it may be a shape other than the annular shape.

  In the above embodiment, the vacuum cavity 18 is exemplified as the cavity in the claims. However, the present invention is not limited to this, and a gas path such as a purge gas may be used, or a sealed space may be used. Good. Further, the shape of the cavity in the vertical direction is not limited to a substantially circular shape, and may be a rectangular shape, an annular shape, or the like, and may be a plurality of cavities disposed on the same plane and independent of each other. From the viewpoint of temperature uniformity (in-plane uniformity) in the holding surface, the shape of the cavity in the vertical direction is substantially symmetrical with respect to the central axis O of the holding body 10 (for example, circular or annular) Is preferred.

  FIG. 9 and FIG. 10 are explanatory diagrams showing the temperature distribution in modified examples 1 and 2 of the heating device 100 when the resistance heating element 50 generates heat. On the upper side of the middle stage, a part of the XY cross-sectional configuration of the sample at the position of Q1-Q1 on the upper stage is schematically shown, and on the lower side of the middle stage, the XY cross-sectional configuration of the sample at the position of Q2-Q2 on the upper stage A portion of is schematically shown. In the first modification shown in FIG. 9, the vacuum cavity 18Z has a first annular shape substantially centered on the central axis O of the holder 10 (columnar support 20) in the vertical direction and having different distances from the central axis O. It comprises a portion 18Z1 and a second annular portion 18Z2. The first vacuum cavity 18Z1 is a substantially circular cavity as viewed in the vertical direction (Z-axis direction). The second vacuum cavity 18Z2 is a substantially annular cavity as viewed in the vertical direction. The outer edge 18E of the second vacuum cavity 18Z2 is located inside the outer edge 20E (the outer edge of the inner portion H1) of the columnar support 20 along the entire circumference. Furthermore, the vacuum cavity 18Z includes a third annular portion 18Z3 located between the resistance heating element 50 and the first annular portion 18Z1 and the second annular portion 18Z2. The third annular portion 18Z3 is an annular cavity overlapping the entire annular region between the inner peripheral edge of the first annular portion 18Z1 and the outer peripheral edge of the second annular portion 18Z2 in the vertical direction. As shown in the lower part of FIG. 9, in the first modification, the temperature of the holder 10 is generally higher than that of the sample 3 and is substantially uniform over the entire holding surface S1. In the first modification, since the vacuum cavity 18Z includes the third annular portion 18Z3, the inner cavity volume fraction is smaller than the configuration without the cavity corresponding to the third annular portion 18Z3 (for example, the sample 3 described above). Because the height is high, the heat insulating effect between the resistance heating element 50 and the columnar support 20 is improved inside the holding body 10. The second modification of FIG. 10 is configured such that the positional relationship between the first annular portion 18Z1 and the second annular portion 18Z2 and the third annular portion 18Z3 in the vertical direction is reversed with respect to the first modification of FIG. It is. Even in such a configuration, since the inner cavity volume ratio is high as compared with the configuration without the cavity corresponding to the third annular portion 18Z3 (for example, the above-mentioned sample 3), the resistance heating element 50 is The heat insulation effect between the and the columnar support 20 can be improved.

  Moreover, the formation material of each member which comprises the heating apparatus 100 in the said embodiment is an illustration to the last, and each member may be formed with another material. For example, in the heating device 100 according to the above-described embodiment, the holder 10 and the columnar support 20 are made of ceramic mainly composed of aluminum nitride or alumina, but at least one of the holder 10 and the columnar support 20 However, it may be made of other ceramics. Further, the holding body 10 may be made of a material other than ceramics (for example, a metal such as aluminum or an aluminum alloy). Similarly, the forming material such as the electrode terminal 70 may be another material.

  The present invention is applicable not only to a susceptor but also to another holding device (for example, an electrostatic chuck or the like) that includes a ceramic plate and a base plate and holds an object on the surface of the ceramic plate.

  Moreover, the manufacturing method of the heating apparatus 100 in the said embodiment is an example to the last, and can be variously deformed.

2E: outer edge 10: holding body 10A to 10C: green sheet laminate 10E: outer edge 12: recess 14: gas passage 14G: groove 16: passage for vacuum 16G: groove 18, 18X, 18Y, 18Z: cavity for vacuum 18A, 18AX Inner cavity portion 18B: First continuous cavity portion 18C: Second continuous cavity portion 18E: Outer edge 18G: Concave portion 20: Columnar support 20E: Outer edge 22: Electrode through hole 24: Gas through hole 26: Vacuum through-hole 30: bonding layer 50: resistance heating element 52: via conductor 53: conductive path 54: power receiving electrode 56: metal brazing material 70: electrode terminal 82: gas connection hole 100: heating device D1: width D2: spacing Width H1: inner portion H2: inner hollow portion O: central axis S1: holding surface S2: back surface S3: upper surface S4: lower surface W: semiconductor wafer

Claims (6)

A holder having a plate-like shape having a first surface and a second surface substantially orthogonal to the first direction, and having a resistance heating element therein;
A columnar support extending in the first direction, which is joined to the second surface of the support, and whose outer edge is located inside the outer edge of the support over the entire circumference when viewed in the first direction Body,
A heating device for heating an object held on the first surface of the holder;
A cavity is formed on the side of the columnar support relative to the resistance heating element inside the holding body,
The hollow is present in an inner portion of the holding body from the resistance heating element to the second surface and is surrounded by the outer edge of the columnar support in the first direction view. A heating device, characterized in that it comprises an inner cavity portion whose volume fraction with respect to the inner portion is greater than 50%. In the heating device according to claim 1,
The shape of the end on the support side of the columnar support is annular,
The heating device according to claim 1, wherein the hollow includes an inner peripheral side hollow portion positioned on an inner peripheral side of the annular end portion of the columnar support in the first direction. In the heating device according to claim 1 or 2,
The shape of the end on the support side of the columnar support is annular,
The heating device according to claim 1, wherein the cavity includes a first continuous cavity portion which is continuous over the entire circumference of a portion overlapping the end of the annular support in the first direction. The heating device according to any one of claims 1 to 3.
The heating device, wherein the cavity is located outside the outer edge of the pillared support in the first direction view, and includes a second continuous hollow portion continuous over the entire circumference of the pillared support. The heating device according to any one of claims 1 to 4.
The cavity includes a plurality of annular portions substantially centered on the axis of the columnar support in the first direction view and different in distance from the axis, and orthogonal to the first direction and the axis A heating device, characterized in that the width of each of the annular portions is wider than the distance between the annular portions in any direction along a virtual straight line passing through. The heating device according to any one of claims 1 to 5,
The cavity is a vacuum cavity connected to a vacuum suction device,
A heating device characterized in that a gas path extending in a direction substantially orthogonal to the first direction is formed on the first surface side with respect to the resistance heating element inside the holding body.

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