JP2019127426A - Manufacturing method for ceramic member and ceramic member - Google Patents

Abstract

To provide a ceramic member that suppresses the exfoliation of an external electrode from the ceramic member while maintaining high compactness of the ceramic member.SOLUTION: A manufacturing method for ceramic member includes: a preparation process of preparing a laminate that comprises a first ceramic green sheet body with external electrodes formed on a first surface and a second ceramic green sheet body, and where the second ceramic green sheet body is laminated on a second surface side of the first ceramic green sheet body; a firing process that makes a ceramic firing body with a first ceramic part and a second ceramic part by firing the laminate; and a HIP process that makes the ceramic member by conducting HIP to the ceramic firing body. After the firing process and before the HIP process, density of the second ceramic part is higher than that of the first ceramic part.SELECTED DRAWING: Figure 4

Description

  The technology disclosed herein relates to a method of manufacturing a ceramic member.

  For example, an electrostatic chuck is used as a holding device for holding a wafer when manufacturing a semiconductor. The electrostatic chuck includes a ceramic member and a chuck electrode provided inside the ceramic member, and an electrode pad (external electrode) electrically connected to the chuck electrode is formed on the surface of the ceramic member. There is. In such a configuration, the electrostatic chuck utilizes the electrostatic attractive force generated when a voltage is applied to the chuck electrode from the power source through the electrode pad, and thereby the surface of the ceramic member (hereinafter referred to as “attraction surface”). ) Adsorb and hold the wafer.

  In recent years, in order to cope with the miniaturization of semiconductors using wafers, it has become important to suppress the generation of particles during the process. Therefore, for the ceramic member of the electrostatic chuck, for example, in order to suppress generation of particles due to plasma, higher density is required. In general, it is difficult to obtain a ceramic member having high required compactness simply by performing atmospheric pressure firing. Therefore, hot isostatic pressing (hereinafter referred to as "HIP") is conventionally known as a treatment for improving the compactness of a ceramic member. This HIP is, for example, a process in which an inert gas such as argon gas is used as a pressure medium, and the synergistic effect of gas pressure and heating is used to densify the ceramic member. By carrying out HIP after normal pressure firing, a ceramic member having high required compactness can be obtained.

  In relation to such a technique, as a method of manufacturing an electrostatic chuck provided with an internal electrode layer, a laminate is produced by laminating a plurality of sheet-like alumina green sheets via the internal electrode layer, and There is known a method of obtaining an electrostatic chuck provided with a densified ceramic member by firing the laminate and subjecting it to HIP treatment (see, for example, Patent Documents 1 and 2).

JP 2012-178415 A JP 11-294455 A

  However, in the case of the ceramic member provided with the electrode pad electrically connected to the chuck electrode, the ceramic member shrinks with the densification by the HIP treatment, while the electrode pad shrinks less than the ceramic member, Peeling may occur at the bonding interface with the electrode pad. That is, in the conventional method for manufacturing a ceramic member, it is difficult to suppress peeling of the electrode pad formed on the surface of the ceramic member from the ceramic member while improving the compactness of the ceramic member by HIP processing. There is.

  Such a problem is not limited to the electrode pad connected to the chuck electrode, but is a ceramic in which an electrode pad connected to the heater electrode and an electrode pad connected to a radio frequency (RF) electrode are formed on the surface of the ceramic member. This is a common problem in general member manufacturing methods. In addition to the electrode pad, the method is generally common to the method of manufacturing a ceramic member in which an external electrode such as a heater electrode is formed on the surface of the ceramic member. Furthermore, in the case of manufacturing a ceramic member provided with a ceramic member constituting a vacuum chuck, a CVD heater, a shower head or the like and an external electrode formed on the surface of the ceramic member as well as the ceramic member constituting an electrostatic chuck. Common to all

  In this specification, the technique which can solve the subject mentioned above is disclosed.

  The technology disclosed in the present specification can be realized as, for example, the following forms.

(1) A method for manufacturing a ceramic member disclosed in the present specification includes a first ceramic green sheet body in which an external electrode is formed on a first surface, and a second ceramic green sheet body. A preparatory step of preparing a laminate in which the second ceramic green sheet body is laminated on the second surface side opposite to the first surface of one ceramic green sheet body; and firing the laminate. And a firing step of producing a ceramic fired body including a first ceramic portion generated from the first ceramic green sheet body and a second ceramic portion generated from the second ceramic green sheet body, and By performing hot isostatic pressing on the ceramic fired body, A HIP step of preparing a La-mix member, in the manufacturing method of the ceramic member comprising, after the firing step, before the HIP process, the density of the second ceramic part is higher than the density of said first ceramic portion. According to the method for producing a ceramic member, since the HIP step of performing HIP on the ceramic fired body is performed after the firing step, it is possible to realize densification of the ceramic member to be manufactured. Further, in the method of manufacturing a ceramic member of the present invention, the density of the second ceramic portion is higher than the density of the first ceramic portion on which the external electrode is formed after the firing step and before the HIP step. Therefore, in the low-density first ceramic portion, the shrinkage due to HIP is suppressed, and the occurrence of peeling at the bonding interface between the first ceramic portion and the external electrode can be suppressed. Therefore, according to the method for manufacturing a ceramic member, it is possible to obtain a ceramic member that achieves both suppression of external electrode peeling and high density.

(2) In the method for manufacturing a ceramic member, after the firing step and before the HIP step, the closed porosity of the first ceramic portion is higher than 5.0% and the second ceramic portion is closed. The porosity may be 5.0% or less. According to the manufacturing method of the present ceramic member, the shrinkage due to HIP is further suppressed by making the closed porosity of the first ceramic portion higher than 5.0% before the HIP step after the firing step, and the first ceramic It is possible to further suppress the occurrence of peeling at the bonding boundary between the portion and the external electrode. Further, in the method of manufacturing a ceramic member of the present invention, by setting the closed porosity of the second ceramic member before the HIP step to 5.0% or less after the firing step, further densification by HIP can be achieved. Therefore, according to the method for manufacturing a ceramic member of the present invention, it is possible to obtain a ceramic member in which the suppression of the occurrence of peeling of the external electrode and the height of the compactness are compatible in high dimensions.

(3) In the method of manufacturing a ceramic member, the closed porosity of the second ceramic portion may be 1.0% or less after the HIP step. According to the method for manufacturing a ceramic member, since the closed porosity of the second ceramic portion after the HIP process is extremely small, a ceramic member having high density and high electric resistance can be obtained. Therefore, according to the method for producing a ceramic member, it is possible to obtain a ceramic member in which the occurrence of peeling of the external electrode is suppressed, the density is high, and the electric resistance is also high.

(4) In the method of manufacturing a ceramic member, the material for forming the second ceramic green sheet body contains alumina as a main component, and the density of the second ceramic portion is 3.970 g / cm after the HIP step. It is good also as a structure which is ^three or more. According to the manufacturing method of the present ceramic member, when the main component of the forming material of the second ceramic green sheet body is alumina, the density of the second ceramic portion after the HIP step is 3.970 g / cm ³ or more Since it is high, it is possible to obtain a ceramic member having high density and high electric resistance. Therefore, according to the manufacturing method of the present ceramic member, it is possible to obtain a ceramic member in which the occurrence of peeling of the external electrode is suppressed, the height of the compactness, and the height of the electrical resistance are parallel.

(5) In the method of manufacturing a ceramic member, an object may be held on the surface of the ceramic member opposite to the surface on which the external electrode is formed. According to the method for manufacturing a ceramic member, a ceramic member used for a holding device that holds an object on the surface is a surface portion on the side opposite to the surface on which an external electrode is formed, which is a surface that holds the object. Is densified, it is possible to suppress the generation of particles when the surface portion is irradiated with plasma or the like. Therefore, according to the method for manufacturing the ceramic member, it is possible to obtain a ceramic member that achieves both suppression of peeling of the external electrode and suppression of generation of particles realized by high density.

(6) A ceramic member disclosed in the present specification includes a first ceramic part having an external electrode formed on a first surface, and a first ceramic part opposite to the first surface of the first ceramic part. And a second ceramic part laminated on the surface side of the second ceramic part, the closed porosity of the second ceramic part is lower than the closed porosity of the first ceramic part, and the second ceramic part The closed porosity of the ceramic part is 1.0% or less. According to the present ceramic member, the closed porosity of the second ceramic portion is lower than the closed porosity of the first ceramic portion where the external electrode is formed, and the closed porosity of the second ceramic portion is 1. Very low at less than 0%. That is, while the adhesion between the first ceramic portion and the external electrode is maintained, the second ceramic portion is highly densified, so that when the second ceramic portion is irradiated with plasma or the like Generation of particles and a high withstand voltage ceramic member can be obtained. Therefore, according to the present ceramic member, it is possible to achieve both suppression of peeling of the external electrode and suppression of generation of particles realized by high density.

(7) In the ceramic member, an object may be held on the surface of the ceramic member opposite to the surface on which the external electrode is formed. According to this ceramic member, the surface of the ceramic member used for the holding device that holds the object on the surface is the surface that holds the object and is opposite to the surface on which the external electrode is formed. Therefore, the generation of particles when the surface portion is irradiated with plasma or the like can be suppressed. Therefore, according to the present ceramic member, it is possible to achieve both suppression of particle generation and high withstand voltage.

  The technology disclosed in the present specification can be realized in various forms. For example, a ceramic member, a holding device such as an electrostatic chuck including a ceramic member, a vacuum chuck, or a CVD heater, a ceramic member It can be realized in the form of a semiconductor manufacturing apparatus component such as a shower head, a manufacturing method thereof and the like.

1 is a perspective view schematically showing an external configuration of an electrostatic chuck 10 in the present embodiment. It is explanatory drawing which shows roughly the XZ cross-sectional structure of the electrostatic chuck 10 in this embodiment. It is explanatory drawing which shows typically XY cross-section structure of the electrostatic chuck 10 in this embodiment. It is a flowchart which shows the manufacturing method of the electrostatic chuck 10 in this embodiment. It is explanatory drawing which shows schematically the manufacturing method of the electrostatic chuck 10 in this embodiment. It is explanatory drawing which shows a performance evaluation result.

A. Embodiment:
A-1. Configuration of electrostatic chuck 10:
FIG. 1 is a perspective view schematically showing an appearance configuration of the electrostatic chuck 10 in the present embodiment, and FIG. 2 is an explanatory view schematically showing an XZ cross-sectional configuration of the electrostatic chuck 10 in the present embodiment. FIG. 3 is an explanatory view schematically showing an XY cross-sectional configuration of the electrostatic chuck 10 in the present embodiment. 2 shows the XZ cross-sectional configuration of the electrostatic chuck 10 at the position II-II in FIG. 3, and FIG. 3 shows the XY cross-sectional configuration of the electrostatic chuck 10 at the position III-III in FIG. It is shown. In each figure, XYZ axes orthogonal to each other for specifying the direction are shown. In this specification, for convenience, the positive direction of the Z-axis is referred to as the upward direction, and the negative direction of the Z-axis is referred to as the downward direction. However, the electrostatic chuck 10 is actually installed in an orientation different from such an orientation. It may be done.

  The electrostatic chuck 10 is a device for attracting and holding an object (for example, the wafer W) by electrostatic attraction, and is used, for example, to fix the wafer W in a vacuum chamber of a semiconductor manufacturing apparatus. The electrostatic chuck 10 includes a ceramic member 100 and a base member 200 arranged in a predetermined arrangement direction (in the present embodiment, the vertical direction (Z-axis direction)). The ceramic member 100 and the base member 200 are disposed such that the lower surface S2 (see FIG. 2) of the ceramic member 100 and the upper surface S3 of the base member 200 face each other in the arrangement direction.

  The ceramic member 100 is a plate-like member having a substantially circular planar upper surface (hereinafter referred to as “adsorption surface”) S1 substantially orthogonal to the arrangement direction (Z-axis direction) described above, and is formed of ceramics. The configuration of the ceramic member 100 will be described in detail later. The diameter of the ceramic member 100 is, for example, about 50 mm to 500 mm (usually, about 200 mm to 350 mm), and the thickness of the ceramic member 100 is, for example, about 1 mm to 10 mm.

Various ceramics can be used as a material for forming the ceramic member 100. From the viewpoint of strength, wear resistance, plasma resistance, etc., for example, aluminum oxide (alumina, Al ₂ O ₃ ) or aluminum nitride (AlN) is used. It is preferable to use ceramics containing as a main component. In the present specification, the main component means a component having the largest content ratio (weight ratio).

  As shown in FIG. 2, inside the ceramic member 100, a chuck electrode 400 formed of a conductive material (for example, tungsten, molybdenum, platinum or the like) is provided. The shape of the chuck electrode 400 when viewed in the Z-axis direction is, for example, a substantially circular shape. When a voltage is applied to the chuck electrode 400 from a power source (not shown), an electrostatic attractive force is generated, and the wafer W is attracted and fixed to the adsorption surface S1 of the ceramic member 100 by the electrostatic attractive force.

  Inside the ceramic member 100, a heater electrode 500 formed of a resistive heating element containing a conductive material (for example, tungsten, molybdenum, platinum or the like) is provided. As shown in FIG. 3, the shape of the heater electrode 500 when viewed in the Z-axis direction is, for example, a substantially spiral shape. When a voltage is applied to the heater electrode 500 from a power source (not shown), the heater electrode 500 generates heat, thereby warming the ceramic member 100 and warming the wafer W held on the suction surface S1 of the ceramic member 100. Thereby, the temperature control of the wafer W is realized.

  As shown in FIG. 2, a recess 14 and a recess 16 are formed on the lower surface S <b> 2 of the ceramic member 100. The recess 14 is a portion where a part of the lower surface S2 of the ceramic member 100 is recessed toward the chuck electrode 400 side. In the present embodiment, the shape of the recess 14 when viewed in the Z-axis direction is substantially circular. The concave portion 16 is also a portion in which a part of the lower surface S2 of the ceramic member 100 is recessed toward the heater electrode 500, and the shape of the concave portion 16 when viewed in the Z-axis direction is substantially circular like the concave portion 14. .

  An electrode pad 42 electrically connected to the chuck electrode 400 via the via 41 is disposed on the bottom surface (surface substantially orthogonal to the Z-axis direction) of the recess 14 of the ceramic member 100. In the present embodiment, the shape of the electrode pad 42 when viewed in the Z-axis direction is substantially circular. The electrode pad 42 and the via 41 are formed of a conductive material (for example, tungsten, molybdenum, platinum or the like). The electrode pad 42 is exposed from the ceramic member 100 in the entire thickness direction (Z-axis direction). However, as long as the lower surface of the electrode pad 42 is exposed from the ceramic member 100, a part or the whole of the electrode pad 42 in the thickness direction may be embedded in the ceramic member 100. Even with such a configuration, it can be said that the electrode pad 42 is disposed on the lower surface S <b> 2 of the ceramic member 100. The lower surface S2 of the ceramic member corresponds to the first surface in the claims, and the electrode pad 42 corresponds to the outer electrode in the claims. Further, an electrode pad 52 electrically connected to the heater electrode 500 through the via 51 is disposed on the bottom surface of the recess 16 of the ceramic member 100. The configurations of the electrode pad 52 and the via 51 are the same as those of the electrode pad 42 and the via 41, and thus the description thereof is omitted.

  The base member 200 is, for example, a circular flat plate member having the same diameter as the ceramic member 100 or a diameter larger than that of the ceramic member 100, and is made of, for example, a metal (aluminum, aluminum alloy or the like). The diameter of the base member 200 is, for example, about 220 mm to 550 mm (usually 220 mm to 350 mm), and the thickness of the base member 200 is, for example, about 20 mm to 40 mm.

  The base member 200 is joined to the ceramic member 100 by a joining portion 300 disposed between the lower surface S2 of the ceramic member 100 and the upper surface S3 of the base member 200. The joining portion 300 is made of an adhesive material such as a silicone resin, an acrylic resin, or an epoxy resin, for example. The thickness of the bonding portion 300 is, for example, about 0.1 mm to 1 mm. Note that the bonding portion 300 may be disposed on the entire lower surface S2 of the ceramic member 100, or may be disposed only on a part of the lower surface S2.

  A refrigerant channel 210 is formed inside the base member 200. When a refrigerant (for example, a fluorine-based inert liquid or water) flows through the refrigerant flow path 210, the base member 200 is cooled, and heat transfer between the base member 200 and the ceramic member 100 via the joint portion 300 ( The ceramic member 100 is cooled by the heat application, and the wafer W held on the suction surface S1 of the ceramic member 100 is cooled. Thereby, control of the temperature distribution of the wafer W is realized.

A-2. Configuration for supplying power to the chuck electrode 400 and the heater electrode 500:
Next, a configuration for feeding power to the chuck electrode 400 and the heater electrode 500 will be described with reference to FIG.

  The electrostatic chuck 10 has a configuration for supplying power to the chuck electrode 400. As shown in FIG. 2, in the base member 200, a terminal through hole 22 opened in the upper surface S3 of the base member 200 is formed. In the present embodiment, the terminal through hole 22 has a circular cross section (a cross section parallel to the surface direction), and is a hole penetrating the base member 200 in the Z axis direction.

  Further, as described above, the recess 14 is formed in the lower surface S2 of the ceramic member 100. At a position between the terminal through hole 22 formed in the base member 200 and the concave portion 14 formed in the ceramic member 100, a through hole penetrating the joint portion 300 in the Z-axis direction is formed in the joint portion 300. ing. Therefore, the terminal through-hole 22 formed in the base member 200 and the recess 14 formed in the ceramic member 100 constitute an integral hole communicating with each other via the through-hole formed in the joint portion 300. .

  A columnar electrode terminal 44 extending in the Z-axis direction is disposed in the terminal through hole 22 formed in the base member 200. In the present embodiment, the electrode terminal 44 has a circular cross section (a cross section parallel to the surface direction). The upper end of the electrode terminal 44 reaches the electrode pad 42, and the electrode terminal 44 is bonded to the electrode pad 42 by, for example, a metal brazing material.

  In order to insulate between the base member 200 and the electrode terminal 44 disposed in the terminal through hole 22, the insulating member 60 is disposed in the terminal through hole 22. The insulating member 60 continuously surrounds the electrode terminal 44 so as to be interposed between the electrode terminal 44 and the surface of the terminal through hole 22. The insulating member 60 is made of an insulating material such as resin or ceramics. Note that bonding is performed around the insulating member 60, specifically, between the insulating member 60 and the electrode terminal 44, between the insulating member 60 and the ceramic member 100, and between the insulating member 60 and the base member 200. The material is arranged. The adhesive is made of, for example, an adhesive such as silicone resin, acrylic resin, or epoxy resin, and bonds the insulating member 60 to the electrode terminal 44, the ceramic member 100, and the base member 200.

  The configuration for supplying power to the chuck electrode 400 is as described above. When the electrostatic chuck 10 is used, a voltage is applied to the chuck electrode 400 from a power supply (not shown) through a conductive path from the power supply (not shown) to the chuck electrode 400 through the electrode terminal 44, the electrode pad 42 and the via 41. . Thereby, an electrostatic attractive force for attracting and fixing the wafer W to the attracting surface S1 is generated.

  Note that the configuration for supplying power to the heater electrode 500 is the same as the configuration for supplying power to the chuck electrode 400. That is, as shown in FIG. 2, a through hole 24 for a terminal opened in the upper surface S3 of the base member 200 is formed in the inside of the base member 200, and a recess 16 is formed in the lower surface S2 of the ceramic member 100. The terminal through hole 24 formed in the base member 200 and the recess 16 formed in the ceramic member 100 constitute an integral hole communicated with each other through the through hole formed in the joint portion 300. ing. Further, on the lower surface S2 of the ceramic member 100, an electrode pad 52 electrically connected to the heater electrode 500 through the via 51 is disposed. A columnar electrode terminal 54 is disposed in the terminal through hole 24 formed in the base member 200, and the electrode terminal 54 is joined to the electrode pad 52. Further, in the terminal through hole 24, an insulating member 80 continuously surrounding the electrode terminal 54 is disposed so as to be interposed between the electrode terminal 54 and the surface of the terminal through hole 24. When the electrostatic chuck 10 is used, a voltage is applied to the heater electrode 500 from a power supply (not shown) through the conduction path from the power source (not shown) to the heater electrode 500 through the electrode terminal 54, the electrode pad 52 and the via 51. . Thereby, the heater electrode 500 generates heat.

A-3. Detailed configuration of the ceramic member 100:
Next, the detailed configuration of the ceramic member 100 will be described in detail. As shown in FIG. 2, the ceramic member 100 includes an upper ceramic portion 101 and a lower ceramic portion 103 disposed below the upper ceramic portion 101. The upper ceramic part 101 is located on the surface of the ceramic member 100 opposite to the lower surface S2 of the lower ceramic part 103, and holds the wafer W on the surface (that is, the adsorption surface). That is, the upper surface S 1 of the ceramic member 100 is the upper surface of the upper ceramic portion 101, and the lower surface S 2 of the ceramic member 100 is the lower surface of the lower ceramic portion 103. The upper ceramic portion 101 corresponds to a second ceramic portion in the claims, and the lower ceramic portion 103 corresponds to a first ceramic portion in the claims. The method of specifying the upper ceramic portion 101 and the lower ceramic portion 103 in the ceramic member 100 will be described later in “A-7. Method of specifying internal configuration of ceramic member 100”.

  As described above, the electrode pads 42 and 52 are formed on the lower surface S <b> 2 of the lower ceramic portion 103. In the present embodiment, the heater electrode 500 is provided inside the lower ceramic portion 103, and the chuck electrode 400 is provided inside the upper ceramic portion 101.

In the present embodiment, the main component of the material for forming the ceramic member 100 (the upper ceramic portion 101 and the lower ceramic portion 103) is alumina. Further, the density of the upper ceramic portion 101 is 3.970 g / cm ³ or more. The closed porosity of the upper ceramic portion 101 is lower than the closed porosity of the lower ceramic portion 103, and the closed porosity of the upper ceramic portion 101 is 1.0% or less.

A-4. Method for manufacturing electrostatic chuck 10:
Next, a method for manufacturing the electrostatic chuck 10 in the present embodiment will be described. FIG. 4 is a flowchart showing a method of manufacturing the electrostatic chuck 10 in the present embodiment. Moreover, FIG. 5 is explanatory drawing which shows roughly the manufacturing method of the electrostatic chuck 10 in this embodiment.

  First, the lower ceramic green sheet body 103a including the heater electrode 500 and having the electrode pads 42 and 52 formed on the bottom surfaces of the recesses 14 and 16 is manufactured (S110, see FIG. 5A). Specifically, first, alumina raw material, butyral resin, plasticizer, and solvent are mixed, and the resulting mixture is formed into a sheet by the doctor blade method, thereby producing one or more lower ceramic green sheets. Do. In addition, it is necessary to form through holes and recesses 14 and 16, fill the ink for vias, and apply the electrode ink for forming the electrode pads 42 and 52 and the heater electrode 500 to a predetermined lower ceramic green sheet. Process. Thereafter, one or more lower ceramic green sheets are laminated to produce a lower ceramic green sheet body 103a. In addition, as the ink for vias and the ink for electrodes, for example, a metallized ink in a slurry form is used by mixing a conductive material such as tungsten or molybdenum, an alumina raw material, ETCEL (registered trademark) resin, and a solvent. Here, the lower ceramic green sheet body 103a corresponds to the first ceramic green sheet body in the claims.

  Next, the upper ceramic green sheet body 101a including the chuck electrode 400 is produced (S120, see B in FIG. 5). Specifically, first, one or more upper ceramic green sheets are produced in the same manner as the method of manufacturing the lower ceramic green sheet body 103a. However, the particle diameter of the alumina raw material powder used in the upper ceramic green sheet body 101a is different from the particle diameter of the alumina raw material powder used in the lower ceramic green sheet body 103a from the manufacturing method of the lower ceramic green sheet body 103a. Next, necessary processing such as formation of through holes, filling of via ink, and application of electrode ink for forming the chuck electrode 400 is performed on a predetermined upper ceramic green sheet. Thereafter, one or more upper ceramic green sheets are stacked to produce an upper ceramic green sheet body 101a. Here, the upper ceramic green sheet body 101a corresponds to the second ceramic green sheet body in the claims.

  Next, the upper ceramic green sheet body 101a is laminated on the upper surface S5 of the lower ceramic green sheet body 103a to fabricate a laminate 100a (S130, see C in FIG. 5). Specifically, by stacking the upper ceramic green sheet body 101a obtained in step S120 on the upper surface S5 of the lower ceramic green sheet body 103a obtained in step S110, thermocompression bonding, and processing to a predetermined size, A laminate 100a is obtained.

  Next, after degreasing the laminated body 100a in nitrogen, the ceramic fired body 100b is produced by firing at normal temperature in a humidified hydrogen nitrogen atmosphere at a predetermined temperature (for example, 1450 to 1550 ° C.) (S140). In the sintered ceramic body 100b, a portion formed of the upper ceramic green sheet body 101a is referred to as an upper ceramic portion 101b, and a portion formed of the lower ceramic green sheet body 103a is referred to as a lower ceramic portion 103b.

  As described above, in this embodiment, the particle size of the alumina raw material powder used for the production of the upper ceramic green sheet body 101a is smaller than the particle size of the alumina raw material powder used for the production of the lower ceramic green sheet body 103a. Therefore, after the firing step (S140) and before the HIP step (S150) described later, that is, in the ceramic fired body 100b, the density of the upper ceramic portion 101b is higher than the density of the lower ceramic portion 103b. Further, after the firing step (S140) and before the HIP step (S150), the closed porosity of the lower ceramic portion 103b is higher than 5.0%, preferably 10% or less, and the closed porosity of the upper ceramic portion 101b is It is 5.0% or less. In addition, after the firing step (S140) and before the HIP step (S150), the average pore diameter of the closed pores in the upper ceramic portion 101b is 10 μm or less, more preferably 5 μm or less. A method for specifying the density and the closed porosity will be described later. In addition, the pore diameter of the closed pores can be obtained by the following method, for example. First, the ceramic fired body is cut, and the cut surface is planarly polished, and then the processed surface is imaged at a magnification of 1000 with a scanning electron microscope (SEM), and then individual closed pores appear in the field of view (92 μm × 120 μm) The maximum length of is taken as the pore diameter, and their average value is determined. The average value of the pore diameter is determined for five SEM images, and the average value of the five SEM images is taken as the pore diameter of the closed pores of the ceramic fired body.

  Next, the ceramic member 100 is produced by performing hot isostatic pressing (HIP) on the ceramic sintered body 100b (S150). HIP is a process for densifying an object by using an inert gas such as argon gas as a pressure medium and utilizing a synergistic effect of gas pressure and heating. The gas pressure of HIP is, for example, 100 to 200 MPa, and the processing temperature of HIP is, for example, 1350 to 1450 ° C. By performing HIP, it is possible to obtain the ceramic member 100 having a higher density than the state before the HIP step (S150), that is, the ceramic fired body 100b.

  Next, the ceramic member 100 and the base member 200 are joined via the joining part 300 (S160). Specifically, in addition to the ceramic member 100, a base member 200 and a resin adhesive (not shown) are prepared. The base member 200 is made of, for example, an aluminum alloy. The adhesive is, for example, a silicone-based adhesive. An adhesive is disposed between the ceramic member 100 and the base member 200 and heated while being pressurized in a vacuum. Thereby, the adhesive is cured to form the bonding portion 300, and the ceramic member 100 and the base member 200 are bonded by the bonding portion 300.

  Next, the electrode terminals 44, 54 are bonded to the electrode pads 42, 52, and the insulating members 60, 80 are installed around the electrode terminals 44, 54 (S170). For joining the electrode terminals 44 and 54 to the electrode pads 42 and 52, for example, in the concave portions 14 and 16 on the lower surface S2 side of the ceramic member 100, a substantially cylindrical jig similar to the insulating members 60 and 80 described above (see FIG. (Not shown) and the electrode terminals 44, 54 are positioned by inserting the electrode terminals 44, 54 into the hollow holes of the jig, the electrode terminals 44, 54 may be soldered to the electrode pads 42, 52, for example. Bond by bonding. After the bonding between the electrode terminals 44 and 54 and the electrode pads 42 and 52 is completed, the jig is removed. Further, for the installation of the insulating members 60, 80 around the electrode terminals 44, 54, for example, the insulating members 60, 80 are positioned on the inner periphery of the recessed portions 14, 16 of the ceramic member 100, , 80 and the electrode terminals 44, 54 or between the insulating members 60, 80 and the ceramic member 100. Thereafter, post-processing (polishing of the outer periphery, etc.) is performed if necessary. The electrostatic chuck 10 having the above-described configuration is manufactured by the above manufacturing method.

A-5. Effects of the present embodiment:
As described above, the method for manufacturing the ceramic member 100 constituting the electrostatic chuck 10 of the present embodiment includes the lower ceramic green sheet body 103a in which the electrode pads 42 and 52 are formed on the lower surface S2, and the upper ceramic green sheet body. And preparing a laminate 100a including the upper ceramic green sheet 101a on the upper surface S5 of the lower ceramic green sheet 103a, and firing the laminate 100a. A firing step (S140) for producing a ceramic fired body 100b including a lower ceramic portion 103b generated from the lower ceramic green sheet body 103a and an upper ceramic portion 101b generated from the upper ceramic green sheet body 101a. Comprising the, by performing hot isostatic pressing (HIP) with respect to the ceramic fired body 100b, a HIP process for producing a ceramic member 100 (S150), the. Further, in the method of manufacturing the ceramic member 100 of the present embodiment, the density of the upper ceramic portion 101b is higher than the density of the lower ceramic portion 103b after the firing step (S140) and before the HIP step (S150). Thereby, as will be described below, it is possible to obtain a ceramic member 100 that achieves both suppression of peeling of the electrode pads 42 and 52 and high density.

  That is, in the method for manufacturing the ceramic member 100 according to the present embodiment, after the firing step (S140), the HIP step (S150) for performing HIP on the ceramic fired body 100b is performed. Can be realized. At this time, by performing HIP, the ceramic fired body 100b is shrunk, and peeling may occur between the manufactured ceramic member 100 and the electrode pads 42, 52. However, in the method of manufacturing the ceramic member 100, the density of the upper ceramic portion 101b is higher than the density of the lower ceramic portion 103b in which the electrode pads 42 and 52 are formed after the firing step (S140) and before the HIP step (S150). high. Therefore, in the lower ceramic portion 103b having a low density, shrinkage due to HIP is suppressed, and the occurrence of peeling at the bonding interface between the lower ceramic portion 103b and the electrode pads 42 and 52 can be suppressed. In other words, in the method of manufacturing the ceramic member 100 according to this embodiment, the density of the upper ceramic portion 101b and the density of the lower ceramic portion 103b before the HIP step (S150) after the firing step (S140) are the same as the upper ceramic portion 101b. In order to achieve the density to be densified in the HIP step (S150) and the shrinkage behavior to prevent peeling from the electrode pads 42 and 52 in the HIP step (S150) in the lower ceramic portion 103b, It is set. Therefore, according to the method of manufacturing the ceramic member 100, it is possible to obtain the ceramic member 100 in which the suppression of the occurrence of peeling of the electrode pads 42 and 52 from the lower ceramic portion 103 and the high density of the ceramic member 100 are compatible. it can.

  In particular, the ceramic member 100 is a member constituting a part of the electrostatic chuck 10 which is a component for a semiconductor manufacturing apparatus. Therefore, for example, the manufacturing method of the present embodiment is adopted as a manufacturing method of the ceramic member 100 in which high density is particularly required to suppress generation of particles by irradiating the ceramic member 100 with plasma. Is preferred.

A-6. Performance evaluation:
The performance evaluation described below was performed on the ceramic member 100 constituting the electrostatic chuck 10. FIG. 6 is an explanatory diagram showing the performance evaluation results. In FIG. 6, for each sample, the particle size of the raw material powder of the ceramic green sheet, the firing conditions in the firing step (S140), and after the firing step (S140) and before the HIP step (S150) (in FIG. 6 and below) The density and the closed porosity in the ceramic parts 101b and 103b of the ceramic fired body 100b (also simply referred to as “before the HIP process”), and the density and density in the ceramic parts 101 and 103 of the ceramic member 100 after the HIP process (S150) The closed porosity and the evaluation result for each evaluation item are shown.

(For each sample)
As shown in FIG. 6, molded articles of seven samples (samples S1 to S7) were used for performance evaluation. The compacts of the respective samples have different particle sizes and firing conditions of the alumina raw material powder, and as a result, characteristics such as density and closed porosity before and after the HIP step (S150) and after the HIP step (S150) are different from each other ing.

  The ceramic members 100 of the samples S1 to S7 are manufactured by the method of manufacturing the ceramic member 100 of the present embodiment described above. That is, the ceramic members 100 of the samples S1 to S7 were manufactured by a manufacturing method in which processing is performed in the order of the preparation step (S110, S120, and S130 in FIG. 4), the firing step (S140), and the HIP step (S150). It is a thing.

  The method for manufacturing the ceramic members 100 of the samples S1 to S7 is as follows in more detail. First, alumina raw material and butyral resin for lower ceramic green sheet (ceramic green sheet for forming lower ceramic portion 103) having an average particle diameter (0.46 to 0.7 μm, see FIG. 6) determined for each sample A plurality of lower ceramic green sheets were produced by mixing the plasticizer and the solvent, and forming the obtained mixture into a sheet by a doctor blade method. Also, necessary processing such as formation of through holes and depressions 14, filling of via ink, application of electrode ink for forming heater electrode 500 and external electrode 42, etc. is performed on a predetermined lower ceramic green sheet. The As a via ink and an electrode ink, a metallized ink in a slurry form was used by mixing tungsten, molybdenum, an alumina raw material, ETCEL (registered trademark) resin, and a solvent. A plurality of lower ceramic green sheets subjected to the predetermined processing described above are stacked to produce a lower ceramic green sheet body 103a. In addition, the particle diameter of the alumina raw material powder of each sample is a value of an average particle diameter calculated using a laser diffraction / scattering equation.

  Next, an alumina raw material and butyral for an upper ceramic green sheet (ceramic green sheet for forming the upper ceramic portion 101) having an average particle size (0.46 to 0.6 μm, see FIG. 6) determined for each sample A resin, a plasticizer, and a solvent were mixed, and the resulting mixture was formed into a sheet by a doctor blade method, thereby producing a plurality of upper ceramic green sheets. In addition, necessary processing such as formation of through holes, filling of via ink, application of electrode ink for formation of chuck electrode 400 and the like was performed on a predetermined upper ceramic green sheet. As the via ink and the electrode ink, a metallized ink prepared in the same manner as described above was used. A plurality of upper ceramic green sheets subjected to the predetermined processing described above are stacked to produce an upper ceramic green sheet body 101a.

  Next, the upper ceramic green sheet body 101a was laminated on the upper surface S5 of the lower ceramic green sheet body 103a to fabricate a laminate 100a. Next, the laminate 100a is degreased in nitrogen and then fired at atmospheric pressure for 1 hour at a temperature (1490 ° C. or 1510 ° C., see FIG. 6) determined for each sample in a humidified hydrogen nitrogen atmosphere, A ceramic fired body 100b was produced. Next, the ceramic member 100 was produced by performing hot isostatic pressing (HIP) with respect to the ceramic sintered body 100b. The gas pressure during HIP was 176 MPa, the treatment temperature was 1400 ° C., and the treatment time was 4 hours. Ceramic members 100 of samples S1 to S7 were produced by the above manufacturing method.

  As shown in FIG. 6, when the ceramic member 100 of each sample is manufactured, the density of the upper ceramic portion 101 and the lower ceramic portion 103 constituting the ceramic member 100 is measured after the HIP step (S150). The closed porosity was calculated from the measured density. The densities of the upper ceramic portion 101b and the lower ceramic portion 103b constituting the ceramic fired body 100b before the HIP step (S150) were measured in the same manner as the ceramic member 100, and the closed porosity was calculated.

The density of the ceramic member 100 of each sample was measured by a known Archimedes method by cutting out the ceramic portion from each of the upper ceramic portion 101 and the lower ceramic portion 103 of the ceramic member 100 of each sample and cutting out the ceramic portion. Moreover, the closed porosity of the ceramic member 100 of each sample was calculated from the density measured in each ceramic part. That is, the theoretical density of alumina, which is a forming material of the upper ceramic portion 101 and the lower ceramic portion 103, is 3.980 g / cm ³ and calculated based on the formula (1-measured density / theoretical density) × 100. did. With respect to the upper ceramic portion 101b and the lower ceramic portion 103b of the ceramic fired body 100b, the density was measured in the same manner as described above, and the closed porosity was calculated.

In the performance evaluation, evaluation regarding peeling, evaluation regarding densification, and evaluation regarding withstand voltage were performed. In the evaluation regarding peeling, the presence or absence of peeling between the lower ceramic portion 103 and the electrode pad 42 is confirmed after the HIP step (S150), and when the peeling does not occur, it is evaluated as pass (o) and peeling is When it occurred, it was evaluated as rejected (x). In the evaluation regarding densification, when the density of the upper ceramic part 101 after the HIP step (S150) is 3.970 g / cm ³ or more, it is evaluated as pass (◯), and when it is less than 3.970 g / cm ^3. It evaluated as rejection (x).

  Moreover, in the evaluation regarding withstand voltage, the withstand voltage is measured for the ceramic member 100 of each sample after the HIP step (S150), and when it is 20 kV or more, it is evaluated as pass (◯), and when it is less than 20 kV. It was evaluated as rejected (x). Regarding the withstand voltage of the ceramic member 100 of each sample, a test piece of 15 mm × 15 mm × thickness 0.3 mm was prepared by cutting out the ceramic portion from the upper ceramic portion 101 of the sample ceramic member 100. Then, the withstand voltage of each test piece was measured, and the average value of the withstand voltages of the 20 test pieces was taken as the withstand voltage of the sample.

As shown in FIG. 6, samples S5 and S6 were evaluated as pass (o) in the evaluation on densification and evaluation on withstand voltage, but failed (x) in the evaluation on peeling. In HIP step (S150) before, the density of the lower ceramics portion 103b of the sample S5, a 3.905g / cm ^3, was equally as high as the density 3.905g / cm ³ of the upper ceramic part 101b. Therefore, as a result of promoting densification of the lower ceramic portion 103b in the subsequent HIP step (S150), the lower ceramic portion 103b shrinks, and the bonding interface between the lower ceramic portion 103 and the electrode pad 42 after the HIP step (S150) It is considered that exfoliation occurred at. In addition, the sample S6 also, the density of the lower ceramics portion 103b in the HIP step (S150) before is 3.815g / cm ^3, for equally high and the density 3.815g / cm ³ of the upper ceramics portion 101b, the sample S5 Similarly, it is considered that peeling occurred at the bonding interface between the lower ceramic portion 103 and the electrode pad 42.

Although the sample S7 was evaluated as pass (o) in the evaluation regarding peeling, it was evaluated as disqualified (x) in the evaluation regarding densification and the evaluation regarding withstand voltage. In the sample S7, the density of the upper ceramic portion 101b constituting the surface for holding the wafer is 3.779 g / cm ³ before the HIP step (S150), compared to the density 3.779 g / cm ³ of the lower ceramic portion 103b. Since it is not high, it is considered that the shrinkage of the upper ceramic part 101b was not promoted in the subsequent HIP process (S150), and the densification of the upper ceramic part 101b was not promoted. In particular, it is considered that the reason why the evaluation regarding the withstand voltage was rejected (x) was because the density of the upper ceramic portion 101 after the HIP step (S150) was as low as 3.808 g / cm ³ .

  On the other hand, samples S1 to S4 were evaluated as pass (o) in any of the evaluation on peeling, the evaluation on densification, and the evaluation on withstand voltage. In any of the samples S1 to S4, the density of the lower ceramic part 103b before the HIP step (S150) is not higher than the density of the upper ceramic part 101b. That is, the density of the lower ceramic part 103b is lower than the density of the upper ceramic part 101b. For this reason, it is considered that shrinkage due to HIP is suppressed in the lower ceramic portion 103b, and occurrence of peeling at the bonding interface between the lower ceramic portion 103 and the electrode pad 42 after the HIP step (S150) can be suppressed. On the other hand, in any of the samples S1 to S4, since the density of the upper ceramic portion 101b is higher than the density of the lower ceramic portion 103b, the densification by HIP is promoted in the upper ceramic portion 101b, and the upper portion after the HIP step (S150) It is considered that the ceramic part 101 was able to have high density and high withstand voltage.

  Further, in any of the samples S1 to S4, since the closed porosity of the lower ceramic portion 103b is higher than 5.0% before the HIP step (S150), shrinkage due to HIP is suppressed in the lower ceramic portion 103b. (S150) It is considered that the occurrence of peeling at the bonding interface between the lower ceramic portion 103 and the electrode pad 42 after that could be suppressed. On the other hand, in any of the samples S1 to S4, since the closed porosity of the upper ceramic portion 101b before the HIP step (S150) is 5.0% or less, the densification by HIP is promoted in the upper ceramic portion 101b, It is considered that the upper ceramic part 101 after the step (S150) was able to have high density and high withstand voltage.

Moreover, in any of the samples S1 to S4, the withstand voltage was as high as 60 kV or higher. This is because the closed porosity of the upper ceramic portion 101 after the HIP step (S150) is 1.0% or less, and the density of the upper ceramic portion 101 after the HIP step (S150) is 3.970 g / cm ^3. This is thought to be due to the fact that

In this performance evaluation, the density and / or closed porosity of the upper ceramic portion 101b and the lower ceramic portion 103b before the HIP step (S150) are adjusted by adjusting the particle size of the raw material powder forming the ceramic green sheet. did. For example, for sample S1 and sample S3 in FIG. 6, the particle size of the alumina raw material powder used for the lower ceramic green sheet body 103a was 0.60 μm for sample S1 and 0.70 μm for sample S3. Thereby, the density and closed porosity of the lower ceramic portion 103b of the ceramic fired body 100b after the firing step (S140) (before the HIP step (S150)) are 3.779 g / cm ³ and 5.05% in the sample S1. Sample S3 was 3.698 g / cm ³ and 7.09%. In the sample S2 and the sample S4, the particle diameter of the alumina raw material powder used for the upper ceramic green sheet body 101a was 0.60 μm in the sample S2 and 0.46 μm in the sample S4. Thereby, the density and the closed porosity of the upper ceramic portion 101b of the ceramic fired body 100b after the firing step (S140) (before the HIP step (S150)) are 3.815 g / cm ³ and 4.15% in the sample S2. For the sample S4, it was 3.913 g / cm ³ and 1.68%. The firing conditions (firing temperature and firing time) of sample S1 and sample S3 and the firing conditions of sample S2 and sample S4 are the same.

  Thus, according to this performance evaluation, before the HIP step (S150), the density of the upper ceramic part 101b constituting the surface holding the wafer is higher than the density of the lower ceramic part 103b to which the electrode pad 42 is bonded, Furthermore, by manufacturing the ceramic fired body 100b so that the closed porosity of the upper ceramic portion 101b is 5.0% or less and the closed porosity of the lower ceramic portion 103b is higher than 5.0%, the HIP process (S150). 2.) After that, it was confirmed that it is possible to obtain a ceramic member 100 in which the suppression of occurrence of peeling of the electrode pad 42 and the height of the compactness are compatible.

A-7. Method of Identifying Internal Configuration of Ceramic Member 100:
The internal configuration of the ceramic member 100, that is, the method for specifying the upper ceramic portion 101 and the lower ceramic portion 103 in the ceramic member 100 is as follows. First, a cross section parallel to the vertical direction of the ceramic member 100 is arbitrarily set, and an SEM image (for example, 300 times) in FIB-SEM (acceleration voltage 1.5 kV) is obtained at an arbitrary position of the cross section.

  In the obtained SEM image, a plurality of lines orthogonal to the vertical direction of the ceramic member 100 are drawn from above at a predetermined interval (for example, an interval of 10 μm). The length of the part corresponding to closed pores on each straight line is measured, and the ratio of the total length of the part corresponding to closed pores to the total length of the straight line is taken as the closed porosity on the line. And change of the 1st closed porosity on the arbitrary line (henceforth "the 1st line"), and the 2nd closed porosity in the line located in the lowermost direction of the 1st line concerned The rate is calculated as the rate of change in the first line. Among the rates of change calculated in this manner, a first line whose value of the rate of change is equal to or higher than a threshold (for example, 2% or more) and which is the uppermost line is specified. Then, with the first line as a boundary, the portion from the upper surface S1 to the first line of the ceramic member 100 is identified as the upper ceramic portion 101. On the other hand, the lower ceramic portion 103 specifies the first line located at the lowermost position with the change rate equal to or higher than the above threshold, and the first line extends from the lower surface S2 of the ceramic member 100 with the first line as a boundary. The portion up to is identified as the lower ceramic portion 103.

B. Variations:
The technology disclosed in the present specification is not limited to the above-described embodiment, and can be modified into various forms without departing from the gist thereof. For example, the following modifications are possible.

  The configuration of the electrostatic chuck 10 in the above embodiment is merely an example, and can be variously modified. Moreover, the material which forms each member which comprises the electrostatic chuck 10 is an example to the last, and each member may be formed with another material.

  In the ceramic member 100 of the above embodiment, the electrode pads 42 and 52 are arranged on the bottom surfaces of the recesses 14 and 16 formed on the lower surface S2 of the ceramic member 100. It is sufficient that the ceramic member 100 is exposed to the outside of the lower surface. That is, the electrode pads 42 and 52 may be disposed on a flat portion of the lower surface S2 of the ceramic member 100 which is not a recess.

  In the ceramic member 100 of the above embodiment, the electrode pads 42 and 52 are electrically connected to the chuck electrode 400 and the heater electrode 500, respectively. However, the electrode pad generates a high frequency (RF) that generates plasma. It may be configured to be electrically connected to an electrode or the like.

  In the ceramic member 100 of the above embodiment, the chuck electrode 400 is included in the upper ceramic portion 101, but the chuck electrode 400 may be included in the lower ceramic portion 103. Further, in the ceramic member 100 of the above embodiment, the heater electrode 500 is included in the lower ceramic portion 103, but the heater electrode 500 may be included in the upper ceramic portion 101.

  In the ceramic member 100 of the above embodiment, the number of ceramic portions in the ceramic member 100 is two, that is, the upper ceramic portion 101 and the lower ceramic portion 103, but between the upper ceramic portion 101 and the lower ceramic portion 103 In addition, one or a plurality of other ceramic parts may be provided. In this case, the density relationship between the ceramic parts is preferably such that the lower ceramic part 103 is the lowest, the upper ceramic part is higher, and the upper ceramic part 101 is the highest. Also, one or more other ceramic parts may be provided on the lower side in the Z-axis direction of the lower ceramic part 103.

  In the ceramic member 100 of the above embodiment, the recesses 14 and 16 in the lower surface S2 of the lower ceramic portion 103 are formed by perforating the lower ceramic green sheet before firing, but polishing after firing. The structure may be formed by processing. In that case, after producing the lower ceramic part 103b by a baking process (S140), the recessed parts 14 and 16 are formed by the said grinding | polishing process, and the electrode pads 42 and 52 are arrange | positioned after that.

  In the ceramic member 100 according to the above embodiment, although the upper ceramic green sheet body 101a and the lower ceramic green sheet body 103a are laminated after being stacked, the upper ceramic green sheet body 101a and the lower ceramic green sheet body are laminated before being laminated. The upper ceramic green sheet body 101a and the lower ceramic green sheet body 103a after size processing may be laminated by respectively subjecting the size 103a to size processing.

The method of manufacturing the ceramic member 100 in the above embodiment is merely an example, and various modifications are possible. For example, in the method of manufacturing the ceramic member 100 according to the above embodiment, the particle diameter of the alumina raw material powder used for the upper ceramic green sheet body 101a is smaller than the particle diameter of the alumina raw material powder used for the lower ceramic green sheet body 103a. Although the density of the upper ceramic part 101b is larger than the density of the lower ceramic part 103b, for example, by other methods such as different firing conditions such as firing temperature and firing time when firing the laminate 100a, The density of the upper ceramic portion 101b and the density of the lower ceramic portion 103b may be made different. For example, in sample S3 and sample S4 in FIG. 6, the particle sizes of the raw material powders of both samples are 0.70 μm in the lower ceramic green sheet body 103a and 0.46 μm in the upper ceramic green sheet body 101a. . However, while the density of the lower ceramic portion 103b of the sample S3 fired at the firing temperature of 1490 ° C. was 3.698 g / cm ³ , the density of the sample S4 fired at the firing temperature of 1510 ° C., which is a higher firing temperature than the sample S3. The density of the lower ceramic portion 103 b was 3.776 g / cm ³ , which was higher than that of the sample S3. Further, the upper ceramic portion 101b of the sample S3 and the sample S4 is similar to the lower ceramic portion 103b, and the density of the upper ceramic portion 101b of the sample S4 fired at a higher firing temperature than the sample S3 is 3.913 g / cm. ^{3 and} was higher than the density 3.905 g / cm ³ of the upper ceramic portion 101 b of the sample S3. In this way, the density can be varied depending on the firing temperature.

  In the method of manufacturing the ceramic member 100 of the present embodiment, after the lower ceramic green sheet body 103a is manufactured in step S110 shown in FIG. 4, the upper ceramic green sheet body 101a is manufactured in step S120. Step S110 may be performed after S120.

  The present invention is applicable not only to the ceramic member 100 constituting the electrostatic chuck 10, but also to ceramic members constituting other holding devices such as a vacuum chuck and a CVD heater, and methods for manufacturing them. Furthermore, it is applicable not only to a holding | maintenance apparatus but the ceramic member which comprises components for semiconductor manufacturing apparatuses, such as a shower head, and its manufacturing method.

10: electrostatic chuck 14: concave portion 16: concave portion 22: through hole for terminal 24: through hole for terminal 41: via 42: external electrode (electrode pad) 44: electrode terminal 51: via 52: external electrode (electrode pad) 54 : Electrode terminal 60: Insulating member 80: Insulating member 100: Ceramic member 100a: Laminated body 100b: Ceramics sintered body 101: Upper ceramic portion 101a: Upper ceramic green sheet body 101b: Upper ceramic portion 103: Lower ceramic portion 103a: Lower ceramic Green sheet body 103b: lower ceramic portion 200: base member 210: refrigerant flow path 300: joint portion 400: chuck electrode 500: heater electrode W: wafer

Claims (7)

A first ceramic green sheet body having an external electrode formed on a first surface and a second ceramic green sheet body, the first ceramic green sheet body being opposite to the first surface Preparing a laminated body in which the second ceramic green sheet body is laminated on the second surface side;
A ceramic fired body comprising: a first ceramic portion produced from the first ceramic green sheet body by firing the laminate; and a second ceramic portion produced from the second ceramic green sheet body A firing step to produce
In a method for producing a ceramic member, comprising: a HIP process for producing a ceramic member by performing hot isostatic pressing on the ceramic fired body,
After the firing step and before the HIP step, the density of the second ceramic part is higher than the density of the first ceramic part.
A manufacturing method of a ceramic member characterized by things. In the manufacturing method of the ceramic member according to claim 1,
After the firing step, before the HIP step, the closed porosity of the first ceramic portion is higher than 5.0%, and the closed porosity of the second ceramic portion is 5.0% or less.
A manufacturing method of a ceramic member characterized by things. In the method of manufacturing a ceramic member according to claim 1 or 2,
After the HIP step, the closed porosity of the second ceramic portion is 1.0% or less.
A manufacturing method of a ceramic member characterized by things. In the method of manufacturing a ceramic member according to any one of claims 1 to 3.
The forming material of the second ceramic green sheet body contains alumina as a main component,
After the HIP step, the density of the second ceramic portion is 3.970 g / cm ³ or more.
A manufacturing method of a ceramic member characterized by things. In the manufacturing method of the ceramic member as described in any one of Claim 1- Claim 4,
An object is held on the surface of the ceramic member opposite to the surface on which the external electrode is formed.
A manufacturing method of a ceramic member characterized by things. A first ceramic portion having an external electrode formed on a first surface, and a second ceramic portion laminated on a second surface side opposite to the first surface of the first ceramic portion In a ceramic member comprising:
The closed porosity of the second ceramic portion is lower than the closed porosity of the first ceramic portion, and the closed porosity of the second ceramic portion is 1.0% or less.
A ceramic member characterized by the above. In the ceramic member according to claim 6,
An object is held on the surface of the ceramic member opposite to the surface on which the external electrode is formed.
A ceramic member characterized by the above.

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