JP2018181523A - Manufacturing method of organic el display panel - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing method of an organic EL display panel capable of reducing quality deterioration accompanying repair by reducing occurrence of bleeding and overflow of paste and suppressing collapse of the shape of a repair spot.SOLUTION: A manufacturing method of an organic EL display panel includes a step of forming a plurality of banks 14 arranged in parallel and extending in one direction on a substrate 11, a step of detecting defects 3 in the formed banks 14, and a step of repairing the detected defects by installing a solid repair part 5 on the substrate 11.SELECTED DRAWING: Figure 8

Description

  The present disclosure relates to a method of manufacturing an organic EL display panel in which organic EL (Electro Luminescence) elements utilizing an electroluminescence phenomenon of an organic material are arranged in a matrix, and in particular to a process of forming a bank.

  In recent years, organic EL display panels have been put to practical use as light emitting display devices. In the organic EL display panel, each organic EL element has a basic structure in which a light emitting layer containing an organic light emitting material is disposed between a pair of electrodes of an anode and a cathode, and when driven, between the pair of electrodes It is a current-driven light emitting element generated as a result of recombination of holes injected from the anode to the light emitting layer and electrons injected from the cathode to the light emitting layer when a voltage is applied.

In the manufacture of the organic EL display panel, the substrate is partitioned by banks, and a light emitting layer is formed in each partition. The bank is formed by patterning in a bank shape by a photolithographic method using a photosensitive thermosetting resin, and heating and baking.
In order to form a light emitting layer, a wet method is often used in which an ink for forming a light emitting layer containing a polymer material or a low-molecular-weight thin film-forming property is applied to a concave space by an inkjet method or the like. According to this wet method, the organic functional layer including the light emitting layer can be relatively easily formed even in a large panel.

Unexamined-Japanese-Patent No. 2016-71992

  If a defect such as partial breakage occurs in the bank or foreign matter adheres in the manufacturing process of the organic EL display panel as described above, the defective portion is present when forming the light emitting layer in the subsequent steps In some cases, different colors of ink applied to one another across a bank may be mixed to cause color mixing. This color mixing may extend to a plurality of pixels along the banks, particularly in the configuration where the banks extend in the column direction, and may cause a serious display failure.

Therefore, for example, in Patent Document 1, a thermosetting paste-like repair material is applied so as to surround the periphery of the defect portion present in the bank, and heat curing is performed to form wrinkles, thereby suppressing the expansion of color mixture. Technology is disclosed.
However, when the paste-like repair material is applied, bleeding and overflow occur, and the repair material may adhere to unnecessary places. In addition, depending on the characteristics of the paste, it is difficult to form the crucible into a desired shape, and the shape of the crucible may be broken. As a result, the quality of the organic EL element may be adversely affected.

  In view of the above problems, the present disclosure reduces the occurrence of paste bleeding and overflow in the repair of banks in the manufacturing process of the organic EL display panel, and suppresses the collapse of the shape of the repair portion, thereby deteriorating the quality associated with the repair. It aims at providing the manufacturing method of the organic EL display panel which can be reduced.

  In a method of manufacturing an organic EL display panel according to an aspect of the present disclosure, a step of forming a plurality of banks arranged in parallel to one another extending in one direction on a substrate, and detecting a defective portion in the formed bank And a step of repairing the detected defect by installing a solid repair part on the substrate.

  According to the method of manufacturing an organic EL display panel of the present disclosure, repair can be performed without using a paste-like repair material, and the occurrence of paste bleeding and overflow can be reduced. In addition, since the repair is performed using the repair parts which are already in shape, it is possible to repair without breaking the shape of the repair portion without depending on the characteristics of the paste.

It is a schematic block diagram which shows the structure of an organic electroluminescence display. It is a top view which shows typically the schematic structure seen from the display surface side of a display panel. It is the partially expanded sectional view which cut | disconnected the display panel by the A-A 'line | wire. It is a flowchart which shows the manufacturing process of a display panel. It is a figure which shows typically the defective part of a bank. It is a figure which shows typically the defective part of a bank. It is a figure which shows typically that color mixing has generate | occur | produced in the defective part of a bank. It is a figure which shows typically the weir formed by repair of the bank. It is a flow chart which shows an example of repair processing of a bank. It is a schematic block diagram which shows an example of the dispenser apparatus used for repair of a bank. It is a figure which shows typically the application position set around the defect part. It is a figure which shows typically a mode that an adhesive paste is apply | coated. It is a schematic block diagram which shows an example of the manipulator apparatus used for repair of a bank. It is a figure which shows typically a mode that repair parts are installed. It is a figure which shows typically that the range of a color mixing area | region is limited by formation of a haze. It is a figure which shows typically the bank reconfigure | reconstructed by repair. It is a flow chart which shows an example of repair processing of a bank. It is a figure which shows typically the cut-in position set around the defect part. It is a figure which shows typically a mode that a part of bank is removed. It is a figure which shows typically that generation | occurrence | production of a color mixing area | region is suppressed by the reconfiguration | reconstruction of a bank. It is a figure which shows the shape of repair parts typically.

<< Summary of Embodiment >>
In a method of manufacturing an organic EL display panel according to aspect 1 of the present disclosure, a step of forming a plurality of banks arranged in parallel with each other and extending in one direction on a substrate, and detecting a defective portion in the formed bank And a step of repairing the detected defect by installing a solid repair part on the substrate.

  In the method of manufacturing an organic EL display panel according to aspect 2 of the present disclosure, in the method of manufacturing an organic EL display panel according to aspect 1, the repair of the defective portion is a defect among the plurality of concave spaces formed by the plurality of banks. It is characterized by including the process of forming the weir which surrounds a defective part by installing a repair part near the defective part in the concave space of the both sides of the bank in which a part exists.

In the method of manufacturing an organic EL display panel according to aspect 3 of the present disclosure, in the method of manufacturing an organic EL display panel according to aspect 1, the repair for the defective portion removes a portion including the defective portion of the bank in which the defective portion exists. It is characterized by including a process, and a process of installing repair parts in a removed part of a bank where a defect exists.
In the method of manufacturing an organic EL display panel according to aspect 4 of the present disclosure, in the method of manufacturing an organic EL display panel according to aspect 1, the defective portion is repaired by applying a paste containing a photosensitive material; It is characterized by including the steps of: installing a repair part on the paste; and curing the paste by irradiating ultraviolet light.

In the method of manufacturing an organic EL display panel according to aspect 5 of the present disclosure, in the method of manufacturing an organic EL display panel according to aspect 1, further, before the step of forming a bank, the step of forming repair parts outside the substrate It is characterized by including.
In the method of manufacturing an organic EL display panel according to aspect 6 of the present disclosure, in the method of manufacturing an organic EL display panel according to aspect 1, a repair part is further formed on the substrate by photolithography using the same material as the bank. It is characterized by including a process.

<< Embodiment >>
[1. Configuration of Organic EL Display Panel]
FIG. 1 is a schematic block diagram showing the configuration of the organic EL display device 1 having the display panel 100 according to the first embodiment.
As shown in FIG. 1, the organic EL display device 1 includes a display panel 100 and a drive control unit 101 connected thereto. The display panel 100 is a panel utilizing an electroluminescence phenomenon of an organic material, and a plurality of organic EL elements 10 are arranged in a matrix on a substrate. The drive control unit 101 includes four drive circuits 102 to 105 and a control circuit 106.

The arrangement of the drive control unit 101 with respect to the display panel 100 is not limited to this.
FIG. 2 is a plan view schematically showing a schematic configuration as viewed from the display surface side of the display panel 100. As shown in FIG. FIG. 3 is a partially enlarged cross-sectional view of the display panel 100 taken along line AA ′ of FIG. The display panel 100 is a so-called top emission type, and the Z direction side is a display surface.

As shown in FIG. 3, the display panel 100 includes a base substrate 11, a pixel electrode 12, a bank 14, an organic light emitting layer 15, and a common electrode 17 as main components thereof. Then, assuming that the organic EL element 10 having the organic light emitting layer 15 corresponding to any of the red (R), green (G) and blue (B) light emission colors is a sub pixel, as shown in FIG. It is arranged in a matrix.
Note that FIG. 2 shows a state in which the common electrode 17 is removed.
[2. Material of Organic EL Display Panel]
(1) Base Substrate The base substrate 11 has a substrate main body, a TFT (thin film transistor) layer, and an interlayer insulating layer.

The substrate main body portion is a portion to be a base material of the display panel 100, and can be formed of any of insulating materials such as non-alkali glass, soda glass, polycarbonate resin, polyester resin, and alumina.
The TFT layer is provided for each sub-pixel on the surface of the substrate main body, and a pixel circuit including a thin film transistor element is formed in each of the sub-pixels.

  The interlayer insulating layer is formed on the TFT layer. The interlayer insulating layer is made of an organic insulating material such as polyimide resin, acrylic resin, novolac type phenol resin, or an inorganic insulating material such as SiO (silicon oxide) or SiN (silicon nitride). In addition to ensuring electrical insulation between them, it has the function of suppressing the influence on the underlying surface on which the pixel electrode 12 is formed, by planarizing the step even if there is a step on the upper surface of the TFT layer.

(2) Pixel electrode The pixel electrode 12 is a pixel electrode provided individually for each sub-pixel, and, for example, Ag (silver), Al (aluminum), aluminum alloy, Mo (molybdenum), APC (silver, palladium, It consists of light-reflective electrically-conductive materials, such as an alloy of copper. In the present embodiment, the pixel electrode 12 is an anode.

(3) Bank On the upper surface of the base substrate and the pixel electrode, a plurality of strip-like banks 14 are provided in parallel in a plan view extending in the Y direction. The bank 14 is made of an insulating organic material (for example, an acrylic resin, a polyimide resin, a novolac phenolic resin, etc.).
As the bank material, a composition comprising a thermosetting resin which is cured by the application of heat is used. Then, the composition contains a photopolymerization initiator and the like which causes the polymerization to be initiated by irradiation with UV light.

As a kind of resin, the thermosetting resin which has ethylenic double bond, such as a (meth) acroyl group, an allyl group, a vinyl group, a vinyloxy group, is mentioned, for example. Moreover, you may add the crosslinking agent which bridge | crosslinks with respect to these resin, for example, an epoxy compound and a polyisocyanate compound.
In addition, a fluorine-containing fluorinated polymer may be introduced into this resin structure. Examples of fluorinated polymers include photosensitive resists containing a fluorine resin such as a fluorinated polyolefin resin, a fluorinated polyimide resin, and a fluorinated polyacrylic resin.

As a specific example of the resin which introduce | transduced the fluorinated polymer, Lumiflon (LUMIFLON (trademark), Asahi Glass) which is a copolymer of fluoroethylene and vinyl ether is mentioned.
Alternatively, an ink repellent may be added to the resin.
The cross section of each bank 14 is trapezoidal as shown in FIG. 3, and a groove space partitioned by the banks 14 is formed between the banks 14 and the organic light emitting layer 15 is formed there. .

The bank 14 functions as a structure that prevents the applied ink from overflowing when the organic light emitting layer 15 is formed by a wet method.
(4) Organic light emitting layer The organic light emitting layer 15 is a site where carriers (holes and electrons) recombine to emit light, and includes an organic material corresponding to any color of R, G, and B.

The organic light emitting layer 15 is formed in a groove-shaped concave space (the groove space 20 in FIG. 6) which extends in the Y direction and is partitioned by the bank 14 described above.
The organic light emitting layers 15 having different colors are disposed with the bank 14 interposed therebetween.
As a material of the organic light emitting layer 15, for example, polyparaphenylene vinylene (PPV), polyfluorene, oxinoid compound, perylene compound, coumarin compound, azacoumarin compound, oxazole compound, oxadiazole compound, perinone compound, pyrrolopyrrole compound, naphthalene Compound, anthracene compound, fluorene compound, fluoranthene compound, tetracene compound, pyrene compound, coronene compound, quinolone compound and azaquinolone compound, pyrazoline derivative and pyrazolone derivative, rhodamine compound, chrysene compound, phenanthrene compound, cyclopentadiene compound, stilbene compound, diphenylquinone Compounds, styryl compounds, butadiene compounds, dicyanomethylenepyran compounds, dicyanomethylenethiopyran compounds , Fluorescein compounds, pyrilium compounds, thiapyrilium compounds, selenapyrilium compounds, telluropyrilium compounds, aromatic aldadiene compounds, oligophenylene compounds, thioxanthene compounds, cyanine compounds, acridine compounds, metal complexes of 8-hydroxyquinoline compounds, 2-bipyridine compounds Metal complexes of Schiff salts, complexes of Schiff salts and Group III metals, fluorescent materials such as oxine metal complexes, and rare earth complexes.

(5) Common electrode The common electrode 17 is formed of a light transmitting material having conductivity, such as ITO or IZO, for example, and provided over all the sub-pixels.
In the present embodiment, the common electrode 17 is a cathode.
(6) Repair Parts If a defective part is detected in the bank 14, repair is performed on the detected defective part using the repair part 5.

  The repair part 5 functions as a structure that prevents the applied ink from overflowing, is a solid structure previously formed in a shape suitable for repair, and has water repellency. In the present embodiment, the shape of repair part 5 is rectangular when viewed from the top, and the short side is approximately the same as the width of bank 14 in the X direction, and the long side is a groove space partitioned by bank 14. The width is about the same as the width of the X direction 20, the height is the same as the bank 14, and the cross section is trapezoidal like the bank.

The repair part 5 is formed, for example, by patterning a thermosetting photosensitive resin on a substrate for repair parts different from the base substrate 11 using a photolithography method, and heating and baking.
The repair part 5 is made of an insulating organic material (for example, acrylic resin, polyimide resin, novolac phenol resin, etc.). As a constituent material of the repair part 5, a composition made of a thermosetting resin that is cured by applying heat is used. Then, the composition contains a photopolymerization initiator and the like which causes the polymerization to be initiated by irradiation with UV light. As a kind of resin, the thermosetting resin which has ethylenic double bond, such as a (meth) acroyl group, an allyl group, a vinyl group, a vinyloxy group, is mentioned, for example. Moreover, you may add the crosslinking agent which bridge | crosslinks with respect to these resin, for example, an epoxy compound and a polyisocyanate compound. In addition, a fluorine-containing fluorinated polymer may be introduced into this resin structure. Examples of fluorinated polymers include photosensitive resists containing a fluorine resin such as a fluorinated polyolefin resin, a fluorinated polyimide resin, and a fluorinated polyacrylic resin. As a specific example of the resin which introduce | transduced the fluorinated polymer, Lumiflon (LUMIFLON (trademark), Asahi Glass) which is a copolymer of fluoroethylene and vinyl ether is mentioned. Alternatively, an ink repellent may be added to the resin.

The repair part 5 may be made of the same material as the bank material, or may be made of a different material.
(7) Adhesive Paste The repair part 5 is fixed on the base substrate 11 by the photosensitive adhesive paste 6.
The adhesive paste 6 is made of an insulating organic material (for example, an acrylic resin, a polyimide resin, a novolac phenolic resin, etc.). As a constituent material of the adhesive paste 6, a composition made of a thermosetting resin that is cured by the application of heat is used. Then, the composition contains a photopolymerization initiator and the like which causes the polymerization to be initiated by irradiation with UV light. As a kind of resin, the thermosetting resin which has ethylenic double bond, such as a (meth) acroyl group, an allyl group, a vinyl group, a vinyloxy group, is mentioned, for example. Moreover, you may add the crosslinking agent which bridge | crosslinks with respect to these resin, for example, an epoxy compound and a polyisocyanate compound. In addition, a fluorine-containing fluorinated polymer may be introduced into this resin structure. Examples of fluorinated polymers include photosensitive resists containing a fluorine resin such as a fluorinated polyolefin resin, a fluorinated polyimide resin, and a fluorinated polyacrylic resin. As a specific example of the resin which introduce | transduced the fluorinated polymer, Lumiflon (LUMIFLON (trademark), Asahi Glass) which is a copolymer of fluoroethylene and vinyl ether is mentioned. Alternatively, an ink repellent may be added to the resin.
[3. Manufacturing method of organic EL display panel]
FIG. 4 is a flowchart showing a manufacturing process of the display panel 100.

The manufacturing method of the display panel 100 is demonstrated based on the flowchart of FIG.
First, the base substrate 11 is prepared. The base substrate 11 can be manufactured by a known TFT manufacturing method.
Next, the pixel electrode 12 made of a metal material is formed on the base substrate 11 for each sub-pixel by vacuum evaporation or sputtering (step S1).

Next, the bank 14 is formed (step S2).
First, a negative photosensitive resin composition is prepared as a bank material, and this bank material is uniformly coated on the upper surface of the base substrate 11 and the pixel electrode 12. Then, the layer of the applied bank material is patterned and formed into a bank shape by photolithography. That is, a mask having an opening matched to the pattern of the bank 14 to be formed is superimposed on the bank material layer, and exposure is performed from above the mask. The bank material is then patterned to form a bank pattern by washing out excess bank material with an alkaline developer. By the development processing, a bank molded body (an unbaked bank) is pattern-formed on the base substrate 11. A groove space 20 is formed between adjacent bank moldings.

  Next, the formed bank compact is heated and fired. As a heating method at the time of firing, for example, in a hot air drying furnace, the bank molded body formed on the base substrate 11 is heated by applying hot air. In addition, the method of irradiating a heat ray with an infrared ray lamp and the method of heating with a hot plate can also be performed. The bank 14 is formed by firing. The bank 14 thus formed may be further processed to adjust the contact angle of the surface of the bank 14 with the ink applied in the next step. Alternatively, in order to impart liquid repellency to the surface of the bank 14, the surface may be treated with a predetermined alkaline solution, water, an organic solvent or the like, or may be subjected to plasma treatment.

Next, the presence or absence of the defective portion 3 in each bank 14 is checked (step S3), and if there is the defective portion 3, the defective portion 3 is repaired (step S4).
In the present embodiment, it is possible to form a weir surrounding defect portion 3 by installing a repair part in groove space 20 between banks 14 in the vicinity of detected defect portion 3 with respect to defect portion 3. It is repair. The details of the repair for the defective portion 3 will be described later.

  Subsequently, an ink for forming a light emitting layer is applied to the groove space 20 between the banks 14. This ink is a mixture of an organic material forming the organic light emitting layer 15 and a solvent, and is applied in each groove space 20 using an inkjet method. Then, the solvent contained in the applied ink layer 15a is evaporated and dried, and if necessary, the organic light emitting layer 15 is formed in each groove space 20 by heating and baking (step S5).

Next, the common electrode 17 is formed on the organic light emitting layer 15 and the bank 14 (step S6). For example, the common electrode 17 is formed of a material such as ITO or IZO by sputtering or the like.
The display panel 100 is completed through the above steps.
[4. Bank defects]
The defective portion 3 of the bank 14 will be described with reference to FIG.

In the example shown in FIG. 5, foreign matter adheres on one bank 14 to form a defective portion 3.
When foreign matter is present on the bank 14 in this manner, ink is applied to the groove space 20 adjacent to the bank 14 to form a dome-shaped ink layer, and the ink layer contacts the foreign matter. There is a possibility that inks of different luminescent colors (for example, red ink and green ink) may be mixed.

In the example shown in FIG. 6A, the foreign matter enters one bank 14, and the foreign matter penetrates the wall surface of the bank 14 to the adjacent groove space to form the defect portion 3.
In the example shown in FIG. 6B, the foreign matter intrudes under one bank 14, and the foreign matter penetrates to the adjacent groove space to form the defect portion 3.
As described above, even when foreign matter is present inside or below the bank 14, if the adhesion between the foreign matter and the bank material is poor, a gap is created to form an ink flow path, or the foreign matter is a fiber piece Since the ink absorbs the ink, the foreign matter itself becomes the ink flow path. Therefore, color mixing occurs between ink layers formed in groove spaces adjacent to each other with foreign matter interposed therebetween.

  In the example shown in FIG. 6C, a part of the bank 14 is broken and becomes the defective portion 3. Such breakage in the bank 14 occurs, for example, in the exposure step to the bank material layer, where the portion which has been insufficiently exposed and desired to be polymerized is washed away in the next development step. Even in the case where a break occurs in this way, color mixing occurs between ink layers formed in adjacent groove spaces through the break.

  In FIG. 7, red ink is applied to one groove space 20 adjacent to the bank 14 having the defect portion 3, and the green ink is applied to the ink layer 15 a (R) and the other groove space 20. It is a top view which shows the state in which 15a (G) was formed. As shown in the figure, a mixed color area formed by mixing the red ink of the ink layer 15 a (R) and the green ink of the ink layer 15 a (G) around the bank 14 having the defect portion 3 through the defect portion 3. Spreads in each ink layer 15a. This mixed color region may extend long in the Y direction, and its length may be about 1 cm.

In order to reduce the quality deterioration of the organic EL panel due to such color mixing, detection of the defective portion 3 and repair of the defective portion 3 are performed.
[5. Method of detecting defects]
A method of detecting the defective portion 3 in step S3 of FIG. 4 will be described.
The detection of the defective portion 3 is performed, for example, by photographing a surface image of the bank 14 formed in step S2 and inspecting a pattern of the surface image.

In this detection step, among the banks 14 formed on the base substrate 11, there is a possibility that the defective portion 3 is detected in some of the banks 14, the defective portion 3 in all the banks 14 May be zero.
[6. Repairing method of bank having defective portion]
The repair of the detected defective portion 3 will be described.

In the present embodiment, as shown in FIG. 8, the repair of the defective portion 3 is performed by forming a weir for stopping the ink by installing the repair part 5 so as to surround the periphery of the detected defective portion 3. .
As shown in the flowchart of FIG. 9, a photosensitive adhesive paste 6 (hereinafter simply referred to as paste 6) is applied around the defect portion 3 (step S21), and the repair part 5 is applied at the position where the paste 6 is applied. The defective portion 3 is repaired by the process of installing (step S22), irradiating UV light, curing the paste 6, and fixing the repair part 5 (step S23).

  The process of applying the paste 6 around the defect portion 3 will be described in detail. FIG. 10 is a schematic configuration view showing an example of a dispenser device 200 used for applying the paste 6. The dispenser device 200 includes, on a base 201, a table 202 on which the base substrate 11 is placed, and a head unit 210 to which a dispenser 212 is attached. The table 202 can be moved in the Y direction based on an instruction from the controller 230, and the head unit 210 can be moved in the X direction and the Z direction according to an instruction from the controller 230. Therefore, the dispenser 212 attached to the head unit 210 is directed by the controller 230 to the base substrate 11 above the base substrate 11 placed on the table 202 in the X, Y, and Z directions. You can move relative to

The dispenser 212 included in the dispenser device 200 is a needle type dispenser, and a tank 214 for storing the paste 6 is attached to the tip portion thereof, and the needle 213 moves up and down so as to penetrate the inside of the tank 214. The paste 6 adhered to the needle 213 can be applied in microliter units.
Driving of the needle 213 in the dispenser 212 is performed based on a control signal from the controller 230.

In the storage unit 231 of the controller 230 of the dispenser device 200, the detected position of the defect portion 3 is stored. The dispenser apparatus 200 applies the paste to a position set around the defect 3 based on the position of the defect 3 stored in the storage unit 231.
Here, in each groove space 20 adjacent to both sides of the bank 14 having the defect portion 3, two points sandwiching the defect portion 3 in the Y direction, the bank 14 next to the bank 14 in which the defect portion 3 exists The paste 6 is applied to a plurality of positions set along the extending line.

FIG. 11A is a view showing the application position set around the defect portion 3.
As shown in the figure, in the groove space 20 adjacent to both sides of the bank 14 having the defect portion 3 with respect to the central portion of the foreign object 3, through the point A1 separated by a distance a1 in the Y direction in the X direction Application points P1, P2, P3 and P4 are set along the extending wrinkle forming line and the wrinkle forming line extending in the X direction through a point A2 separated by a distance a2 in the direction opposite to the Y direction.

Here, the distance a1 may be the same as or different from the distance a2, but the length of the foreign substance 3 is set to an appropriate length so that the entire foreign substance 3 is sandwiched between the points A1 and A2 and not too large. Set
FIG. 11B is a view schematically showing a cross section of the base substrate 11 along the wrinkle forming line passing through the point A1.

The dispenser apparatus 200 applies the paste 6 sequentially with the needle 213 at the application points P1, P2, P3, and P4 set as described above.
12 (a) to 12 (g) are diagrams showing how the paste 6 is sequentially applied to the application points P1, P2,.
First, as shown in FIGS. 12 (a) and 12 (b), the needle 213 and the tank 214 are positioned at the application point P1, and the needle 213 is moved downward to adhere the paste 6 to the needle 213 and The paste 6 is applied to the application point P1 by approaching the application point P1.

  The paste has fluidity until it is applied, but the mountain shape is maintained after application, and as shown in FIG. 12C, a peak of the paste 6 is formed at the application point P1. Subsequently, as shown in FIGS. 12D and 12E, the needle 213 is pulled up into the tank 241, and the needle 213 and the tank 214 are moved to the application point P2. Then, the needle 213 is moved downward, and the needle 213 to which the paste 6 is attached is brought close to the application point P2, thereby applying the paste 6 to the application point P2. Thus, as shown in FIG. 12 (f), the peaks of the paste 6 formed at the application point P2 are connected to the peaks of the paste 6 formed at the application point P1. Subsequently, as shown in FIG. 12 (g), the needle 213 is pulled up and moved to the application point P3. Then, similarly, a peak of the paste 6 is formed at the application point P3 and connected to the peak of the paste 6 at the application point P2. In this manner, the peaks of the paste 6 are continuous in a shape extending from the point A1 on the bank 14 having the defect portion 3 to the adjacent bank 14.

The above steps are repeated, and as shown in FIG. 11A, the paste 6 is applied to four defect forming lines for one defect portion 3, and the step of applying the paste 6 around the defect portion 3 is completed. Do.
Next, the process of installing the repair part 5 will be described in detail. FIG. 13 is a schematic configuration view showing an example of a manipulator device 300 used for installing the repair part 5. In the manipulator apparatus 300, a table 302 on which the base substrate 11 is mounted, a table 303 on which the repair part 5 is mounted, a head unit 310 to which the imaging element 311 is attached, and a probe 321 are mounted on the base 301 And two arm portions 320.

The head unit 310 can be moved in the X direction and the Y direction according to an instruction from the controller 330. Then, while moving the imaging element along the upper surface of the base substrate 11 placed on the table 302, image data of the upper surface of the base substrate 11 can be acquired, and the acquired image can be displayed on the monitor 340.
The two arm units 320 can move independently in the X direction, Y direction and Z direction according to the instruction of the controller 330, and change the attitude of the probe 321 around the X axis, Y axis and Z axis It is possible to As a result, with respect to the base substrate 11 placed on the table 302 and the repair part 5 placed on the table 303, it is possible to make the probe 321 take any posture in any direction and distance. In the present embodiment, the probe 321 is made of tungsten.

FIGS. 14 (a) to 14 (e) are diagrams showing how the repair part 5 is installed on the base substrate 11 by operating the manipulator device 300. FIG.
First, as shown in FIG. 14A, the arm portion 320 is operated to move the probe 321 onto the table 303, the attitude of the probe 321 is controlled, and the repair part 5 placed on the table 303 is gripped. Do. Subsequently, as shown in FIG. 14B, while holding the repair part 5 by the probe 321, the arm portion 320 is operated to place the adhesive paste on the base substrate 11 on which the repair part 5 is placed on the table 302. Move to the position where it was applied. Next, as shown in FIG. 14C, the arm portion 320 is operated to move the probe 321 downward to bring the repair part 5 into contact with the paste 6 applied on the base substrate 11. Subsequently, as shown in FIG. 14D, the attitude of the probe 321 is controlled to separate from the repair part 5 and the arm part 320 is operated to move the probe 321 to the upper side of the repair part 5 and then downward. It is moved to press the repair part 5 against the base substrate 11. Thereafter, as shown in FIG. 14E, the arm portion 320 is operated to pull up the probe 321, and the installation of the repair part 5 on the base substrate 11 is completed.

The above steps are repeated, as shown in FIG. 11A, the repair parts 5 are installed on four wrinkle forming lines for one defect portion 3 and the process of installing the repair parts 5 in FIG. 8 is completed. .
After installing the repair part 5, the paste 6 is irradiated with UV light using an exposure device, and the paste 6 is cured to fix the repair part 5, thereby completing the repair of the defective portion 3.
[7. effect]
According to the present embodiment, as shown in FIG. 8, repair parts 5 are provided in pairs in each of groove spaces 20 on both sides of bank 14 having defect portion 3. The groove space 20 is divided into a first space SA consisting of a space part close to the defect 3 and two second spaces SB consisting of a space part not close to the defect 3. And the defect part 3 is enclosed by two 1st space SA.

  When the organic light emitting layer 15 is formed in each groove space 20 after repairing the defective portion 3 of the bank 14, the ink is also applied to the first space SA and the second space SB, and the organic light emitting layer 15 is formed. . Therefore, in the panel after the light emitting layer is formed, the organic light emitting layer 15 formed in the first space SA and the organic light emitting layer 15 formed in the second space SB are partitioned by the repair part 5 It becomes a state.

FIG. 15 shows that in the organic EL display panel according to the present embodiment, after the ridges 5 are formed around the bank 14 having the foreign material 3, red ink is in one groove space 20 adjacent to the bank 14. It is a top view which shows the state in which green ink was apply | coated and it apply | coated to the other groove space 20, and ink layer 15a (G) was formed.
As shown in FIG. 7, if the repair part 5 is not installed around the bank 14 having the defective portion 3, the red ink of the ink layer 15 a (R) and the green ink of the ink layer 15 a (G) are defective portions. A mixed color area formed by mixing via 3 spreads in each ink layer 15a.

On the other hand, when the repair part 5 is installed around the bank 14 having the defective portion 3, the groove space 20 is in the first space SA close to the defective portion 3 sandwiched between the repair parts 5 and the repair part It divides into two 2nd space SB which does not adjoin to the defect part 3 which exists on the outer side of 5 pairs. Therefore, as shown in FIG. 15, the color mixing area is limited to the range of the first space SA.
As described above, the range of the color mixing area generated by the defect portion 3 is limited to the narrow first space SA adjacent to the defect portion 3, so that the effect of suppressing the spread of the color mixing range can be obtained. Defects can be reduced.

In addition, the amount of paste used can be reduced as compared to the case where a wrinkle is formed by molding a paste-like repair material. This can reduce the occurrence of paste bleeding and overflow.
In addition, since the repair part 5 which is already in shape is used, it does not depend on the characteristics of the paste, it is difficult to lose its shape, and it is possible to form wrinkles having high flatness and strong water repellency.
[8. Modified example]
Although the display panel 100 according to the embodiment has been described, the present disclosure is not limited at all to the above embodiment except for the essential characteristic components. For example, an embodiment obtained by applying various modifications to those skilled in the art to the embodiment, and an embodiment realized by arbitrarily combining components and functions in each embodiment without departing from the spirit of the present invention. Are also included in the present disclosure. Below, the modification of the display panel 10 is demonstrated as an example of such a form.

(1) In the above-described embodiment, as shown in FIG. 8, the repair part 5 is installed to surround the periphery of the detected defect 3 as shown in FIG. But the repair of the defect 3 is not limited to this.
For example, as shown in FIG. 16, repair of the defective portion 3 is performed by removing a portion including the defective portion 3 of the bank 14 and reconfiguring the bank 14 by installing the repair part 5 in the removed portion. It is also good.

  In this repair method, as shown in the flowchart of FIG. 17, a portion of the bank 14 including the defect portion 3 is removed (step S31), and the photosensitive paste 6 is applied to the removed portion (step S32). The repair part 5 is installed at the position where it is applied (step S33), UV light is irradiated, the paste 6 is cured and the repair part 5 is fixed (step S34), and the repair for the defective portion 3 is performed. Do.

The process of removing a portion including the defective portion 3 of the bank 14 will be described in detail.
FIG. 18 is a diagram showing a cutting position set around the defect portion 3. As shown in the figure, in the groove space 20 adjacent to both sides of the bank 14 having the defect portion 3, a point B1 separated by a distance b1 in the Y direction and a Y direction opposite to the center portion of the foreign object 3 A point B2 separated by a distance b2 in the direction of is set as the cut-in position. Here, the distance b1 and the distance b2 may be the same or different, but an appropriate length so that the entire defect 3 is sandwiched between the points B1 and B2 and is not too large. Set to

FIGS. 19 (a) to 19 (d) are diagrams showing how the manipulator device 300 is operated to remove a part of the bank 14. FIG.
First, as shown in FIG. 19A, the arm portion 320 is operated to move the probe 321 onto the table 302, and the attitude of the probe 321 is controlled to set the cutting positions B1 and B2 set in the bank 14. Make a cut. Subsequently, as shown in FIG. 19B, the attitude of the probe 321 is controlled to set the bank 14 and the base substrate 11 in the Z direction between the cutting position B1 and the cutting position B2 of the bank 14 in the Y direction. Plug in between Next, as shown in FIG. 19C, the arm portion 320 is operated to lift the probe 321, and a portion including the defective portion 3 between the cut position B1 and the cut position B2 of the bank 14 (hereinafter referred to as a defect Turn up part 14x). Thereafter, as shown in FIG. 19D, the attitude of the probe 321 is controlled to grip the defective portion 14x, and the arm portion 320 is operated to pull up the probe 321 to remove the defective portion 14x from the bank 14.

In the process of applying the photosensitive paste 6 to the removed portion after removing the defective portion 14x from the bank 14, as in step S21 of FIG. 9, a plurality of application positions are set, and the dispenser is set to the set application position. The paste is applied using the apparatus 200.
After applying the photosensitive paste 6, in the step of installing the repair part 5 on the part to which the paste 6 is applied, the repair part 5 created in advance using the manipulator device 300 is the same as step S22 of FIG. Place on top of paste. At this time, the shape of the repair part 5 is rectangular when viewed from the top, and the short side is about the same as the width of the bank 14 in the X direction, and the long side is the length b1 + b2 of the defective portion removed from the bank 14 The height is the same as that of the bank 14 and the cross section is trapezoidal as in the case of the bank 14.

After installing the repair part 5, in the step of irradiating the paste 6 with UV light to harden the paste, the paste 6 is irradiated with UV light using an exposure device as in step S23 of FIG. 9.
By these steps, as shown in FIG. 16, the bank 14 can be reconfigured by removing a portion including the defective portion 3 of the bank 14 and installing the repair part 5 in the removed portion.

In FIG. 20, after the bank 14 is reconstructed using the repair part 5, the red ink is applied to one groove space 20 adjacent to the bank 14 to form the ink layer 15a (R), and the other groove space 20. It is a top view which shows the state in which the green ink was apply | coated to and the ink layer 15a (G) was formed.
As shown in FIG. 7, if the repair part 5 is not installed around the bank 14 having the defective portion 3, the red ink of the ink layer 15 a (R) and the green ink of the ink layer 15 a (G) are defective portions. A mixed color area formed by mixing via 3 spreads in each ink layer 15a.

On the other hand, when the repair parts 5 are installed and the bank 14 is reconfigured, no color mixing area occurs because the defective portion 3 no longer exists in the bank 14.
As described above, in the repair method for reconfiguring the bank 14 using the repair parts 5, no color mixing area is generated, so that the emission color defect in the display panel 100 can be reduced.
(2) In the above-mentioned embodiment, although the repair parts 5 use what is created and stocked beforehand, it is not restricted to this. For example, when forming the bank 14 on the base substrate 11 in step S2 of FIG. 2, the repair part 5 is created in the margin area of the base substrate 11 and the margin area of the base substrate 11 is prepared when repairing the bank 14 The repair part 5 created in the above may be used. At this time, the repair part 5 can be created by the same method as the bank 14. That is, a negative photosensitive resin composition is prepared as a repair part material, and the repair part material is uniformly applied on the margin area of the base substrate 11. Then, a layer of the applied repair part material is patterned and formed by photolithography. That is, a mask having an opening matched to the pattern of repair parts 5 to be formed is superimposed on the repair parts material layer, and exposure is performed from above the mask. Thereafter, the repair part material is patterned by washing out excess repair part material with an alkaline developer. By the development processing, a repair part molded body (an unbaked repair part) is pattern-formed on the margin area of the base substrate 11. Then, the formed repair part molding is heated and fired to complete the repair part 5.

(3) In the above-mentioned embodiment, although the shape of repair part 5 presupposed that a cross section is a trapezoid as shown to Fig.21 (a), it is not this limitation. For example, as shown in FIG. 21 (b), the cross section may be semicircular, or as shown in FIG. 21 (c), the cross section may be triangular.
(4) In the above embodiment, the paste 6 is applied onto the base substrate 11 using the dispenser device 200. However, the paste 6 may be applied by an inkjet method.

(5) In the above embodiment, a hole injection layer may be formed between the pixel electrode 12 and the organic light emitting layer 15, and an electron transport layer is formed between the organic light emitting layer 15 and the common electrode 17. It may be formed.
The hole injection layer has a function of assisting the generation of holes and injecting and transporting holes stably to the organic light emitting layer 15. The hole injection layer is made of, for example, an oxide such as silver (Ag), molybdenum (Mo), chromium (Cr), vanadium (V), tungsten (W), nickel (Ni), iridium (Ir) or PEDOT A layer of conductive polymer material such as a mixture of polythiophene and polystyrene sulfonic acid).

  The electron transport layer has a function of transporting electrons injected from the common electrode 17 to the organic light emitting layer 15. For example, oxadiazole derivative (OXD), triazole derivative (TAZ), phenanthroline derivative (BCP, Bphen) And so on.

  The organic EL display panel and the organic EL display device according to the present disclosure can be widely used for a television set, a device such as a personal computer, a mobile phone, or various other electronic devices having a display panel.

DESCRIPTION OF SYMBOLS 1 organic electroluminescence display 3 defect part 5 repair parts 10 organic electroluminescent element 11 base substrate 12 pixel electrode 14 bank 15 organic light emitting layer 15a ink layer 17 common electrode 20 concave space (groove space)
100 display panel

Claims (6)

Forming a plurality of banks arranged in parallel with one another extending in one direction on a substrate;
Detecting a defect in the formed bank;
And a step of repairing the detected defective portion by placing a solid repair part on the substrate. The repair with respect to the defective portion is performed by installing the repair part in the vicinity of the defective portion in the concave space on both sides of the bank in which the defective portion is present among the plurality of concave spaces formed by the plurality of banks. The method of manufacturing an organic EL display panel according to claim 1, further comprising the step of forming a weir surrounding the defect portion. The repair for the said defective part is
Removing a portion including the defective portion of the bank in which the defective portion is present;
Installing the repair part at a removed portion of the bank where the defective portion exists;
A method of manufacturing an organic EL display panel according to claim 1, comprising: The repair for the said defective part is
Applying a paste containing a photosensitive material;
Placing the repair part on the applied paste;
Irradiating ultraviolet light to cure the paste;
A method of manufacturing an organic EL display panel according to claim 1, comprising: The method further includes the step of producing the repair part outside the substrate before the step of forming the bank.
A method of manufacturing an organic EL display panel according to claim 1. The method of manufacturing an organic EL display panel according to claim 1, further comprising the step of forming the repair part on the substrate by photolithography using the same material as the bank.

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