JP2016071992A - Organic el display device manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To manufacture an organic EL display device having favorable display characteristics by easily repairing a bank when a burst or a defective part due to a foreign substance occurs in the bank.SOLUTION: An organic EL display device manufacturing method comprises the steps of: preliminarily burning a bank compact 14a formed on a base substrate 11; detecting a defective part 3 occurring in the bank compact 14a; and repairing the bank when the defective part 3 is detected. The bank repairing method comprises the steps of: coating a surface of the base substrate 11 with repairing materials for formation of a dam from a dispenser 21 so as to surround the defective part 3 to form a dam compound 5a; and performing final burning on the dam compact 5a and the bank compound 14a. A heating temperature T1 at the time of preliminary burning is set at a temperature over a temperature where thermal hardening of a thermosetting resin of the bank compound 14a starts, the heating temperature T1 being set to be lower than a heating temperature T2 at the time of final burning.SELECTED DRAWING: Figure 5

Description

  The present invention relates to a method for manufacturing an organic EL display device, and more particularly to a step of forming a bank.

In recent years, an organic EL display panel in which a plurality of organic EL elements are arranged in a matrix on a substrate has been put to practical use as a light-emitting display device. This organic EL display panel has high visibility because each organic EL element performs self-emission, and is excellent in impact resistance because it is a complete solid element.
In the organic EL display panel, each organic EL element has a basic structure in which a light emitting layer containing an organic light emitting material is disposed between a pair of electrodes of an anode and a cathode. This is a current-driven light-emitting element that is generated by recombination of holes injected from the anode into the light-emitting layer and electrons injected from the cathode into the light-emitting layer.

In an organic EL display panel, the light emitting layer of each organic EL element and the light emitting layer of an adjacent organic EL element are generally partitioned by a bank made of an insulating material.
In addition, an organic layer such as a hole injection layer, a hole transport layer, and a hole injection / transport layer is interposed between the anode and the light emitting layer as necessary, and also between the cathode and the light emitting layer as necessary. An electron injection layer, an electron transport layer, or an electron injection / transport layer is interposed.

In an organic EL display panel for full color display, such organic EL elements form RGB subpixels, and adjacent RGB subpixels are combined to form a single pixel.
In manufacturing such an organic EL display panel, there is a step of forming a bank on a substrate and forming a light emitting layer or the like in a concave space partitioned by the bank. The bank is formed by patterning into a bank shape by a photolithography method using a photosensitive thermosetting resin, followed by heating and baking.

  For forming the light emitting layer, a wet method is often used in which ink for forming a light emitting layer containing a polymer material or a low molecule having good thin film formability is applied to a concave space by an inkjet method or the like. According to this wet method, an organic functional layer including a light emitting layer can be formed relatively easily even in a large panel.

WO2010 / 013654

In the organic EL display panel as described above, when the bank is partially broken in the manufacturing process or when a defect occurs due to foreign matter adhering to the bank, the defect exists when the light emitting layer is formed. Ink of different colors applied across the bank may be mixed and color mixing may occur.
In an organic EL display panel manufactured using a panel in which the color mixture has occurred, the emission color in the range where the color mixture has occurred is different from the original color and may cause a display failure.

Therefore, there is a demand for a technique for suppressing the occurrence of display defects in the display panel by repairing the bank in which the defect has occurred.
In the flat display substrate manufacturing technology, for example, in Patent Document 1, after patterning the partition wall material, a part around the breaking portion is removed, and a repair material made of an ink-repellent polymer is applied to the removed portion. And the technique of repairing a broken part is disclosed.

  By using such a technique, a bank molded body is formed on a substrate, and when the bank molded body has a defective portion, a repair material is applied to the defective portion for repair, and then the bank molded body is repaired. By heating and baking, a bank is formed with the defective portion repaired. Therefore, it is possible to prevent inks having different colors from being mixed by applying ink to the area partitioned by the formed bank.

However, when a repair material is applied to the defective portion of the bank molded body for repair, the shape of the bank molded body may be broken around the repaired portion. If the shape of the formed bank collapses, the light emitting layer formed between the banks is not formed in the original shape, which causes display defects.
The present invention has been made in view of the above problems, and an object of the present invention is to provide a method for manufacturing an organic EL display device that can display well even when a bank is damaged or a defective portion due to foreign matter occurs in a bank during the manufacturing process of the organic EL display device. And

  In order to achieve the above object, a method for manufacturing an organic EL display device according to one aspect of the present invention includes: forming a bank material including a thermosetting resin into a bank shape on a substrate; When a defective part is detected, the defective part is repaired by applying a repair material containing a thermosetting resin to the location where the defective part is present in the bank molded body, and the repair material is applied. A method for manufacturing an organic EL display device by forming a bank by heating and firing the formed bank molded body, and forming a light emitting layer in each of the recessed spaces partitioned by the formed bank. After the bank molded body is formed and before the repair material is applied, the bank molded body is pre-fired by heating, and the heating temperature at the time of pre-baking is determined by the thermosetting resin contained in the bank material. Above a temperature for starting thermal curing, it is set lower than the heating temperature and the time of the firing.

According to the manufacturing method of the organic EL display device of the above aspect, since the defective portion of the bank molded body is repaired by applying a repair material, the light emitting layer is formed by applying ink to the concave space partitioned by the bank. When forming, it can suppress that the area | region where an ink layer mixes a color through a defect part spreads.
Further, before the repair material is applied to the defective part of the bank molded body, the bank molded body is pre-fired by being heated above the temperature at which the thermosetting resin contained in the bank material starts thermosetting. Therefore, it is possible to prevent the shape deterioration of the bank molded body accompanying the application of the repair material.

Here, although the liquid repellency of the bank surface is somewhat lowered by performing pre-baking, the heating temperature in the pre-baking is set lower than the heating temperature in main baking the bank molded body to which the repair material is applied. Therefore, the degree of decrease in liquid repellency on the bank surface can be kept small.
Therefore, according to the manufacturing method of the organic EL display device of the above aspect, the display performance of the organic EL display device can be improved.

2 is a schematic block diagram illustrating a configuration example of an organic EL display device 1. FIG. 2 is a partial plan view of an organic EL display panel 100. FIG. FIG. 3 is a partially enlarged cross-sectional view of the display panel 100 taken along line AA ′ in FIG. 2. 5 is a schematic process diagram illustrating a manufacturing process of the display panel 100. FIG. 4 is a cross-sectional view schematically showing a part of the manufacturing process of the display panel 100. FIG. (A) is a perspective view which shows an example of the defective part which arises in a bank, (b) is a perspective view which shows a mode that the weir concerning Embodiment 1 is formed around the defective part. (A), (b) is a figure which shows the defective part which arose in the bank by the foreign material, (c) is the defect part which arose in the bank by the breakdown. It is a schematic block diagram which shows an example of the repair apparatus used for the detection and repair of a bank defect part. It is a figure which shows the application | coating position set in the image around a defect part. (A)-(g) is a figure which shows a mode that a weir is formed by apply | coating a repair material. It is a figure which shows the effect by formation of the weir concerning Embodiment 1, Comprising: (a) shows the comparative example in which the weir is not formed, when (a) is formed. 11A is a cross-sectional view taken along the line CC in FIG. 11A, and FIG. 11B is a cross-sectional view illustrating a state where the ink layer 15a is formed on the base substrate 11. FIG. (A), (b) is a schematic diagram explaining the effect by the bank formation method of this embodiment. It is the photograph of the sample which conducted experiment 1. FIG. (A) is a figure explaining the method of Experiment 2 and 3, (b) is a figure which shows the result of Experiment 3. FIG. (A) is a perspective view which shows the shape of the dam concerning Embodiment 2, (b) is a top view of the state which formed the ink layer, after forming a dam in a groove space. (A) is a perspective view which shows the shape of the weir concerning Embodiment 3, (b) is a top view of the state which formed the ink layer after forming a weir in groove space. (A)-(d) is a figure which shows the example which repairs the defective part which arose in the pixel bank in the display panel concerning Embodiment 4. FIG. In the display panel according to the fifth embodiment, (a) is a diagram in which a part of the bank 14a is lost and a defective portion 3 is generated, and (b) is a repair portion in which a repair material is embedded in the defective portion 3 with a dispenser. 6 is a diagram in which 6 is formed.

<Background to Invention>
The reason why the shape of the bank molded body collapses with the application of the repair material was considered as follows.
A thermosetting resin is generally used for the bank material and the repair material. After the bank material is applied in a bank shape on the substrate and the repair material is applied, the bank formed body and the repair material are 200 to 220 ° C. A repaired bank is formed on the substrate by heating and baking at a temperature.

Here, since the repair material to be applied contains a liquid component such as a solvent, when the repair material is applied so as to come into contact with the bank molded body, the liquid component in the repair material is removed from the bank molded body. It spreads along the surface.
In addition, since the polymerization of the thermosetting resin does not progress so much in the unfired stage, the bank molded body partially re-dissolves when it comes into contact with the wet-spread solvent, etc. It is thought that the shape of

Here, in order to prevent the shape deterioration of the bank molded body due to the application of the repair material, it is considered that the bank molded body may be fired before the repair material is applied. However, in that case, after applying the repair material, it is necessary to perform firing again to cure the thermosetting resin contained in the repair material, so that the substrate and the bank molded body are fired twice. become.
And, if the bank molded body is baked twice at a high temperature of 200 ° C. or higher, the liquid repellency of the surface of the formed bank is lowered, so that the ink for forming the light emitting layer between the banks is removed. When applied, it causes ink color mixing. In addition, when the TFT layer is formed on the substrate, the characteristics of the TFT layer may be deteriorated if baking is performed twice at a high temperature of 200 ° C. or higher.

Therefore, before applying the repair material, the polymerization of the thermosetting resin contained in the bank molded body is advanced to some extent to prevent the shape deterioration of the bank molded body due to the application of the repair material, and the bank molded body is 200 ° C. or higher. The present invention has been devised by investigating a method of preventing firing twice at a high temperature.
<Aspect of the Invention>
A method for manufacturing an organic EL display device according to an aspect of the present invention includes: forming a bank material including a thermosetting resin into a bank shape on a substrate; detecting a defect portion in the formed bank formed body; Is detected, the defective part is repaired by applying a repair material containing a thermosetting resin to the part where the defective part exists in the molded body, and the bank molded body to which the repair material is applied is heated and fired. A method for manufacturing an organic EL display device by forming a bank and forming a light emitting layer in each of the concave spaces partitioned by the formed bank, and after forming the bank molded body, a repair material Before the coating, the bank molding is pre-baked by heating, and the heating temperature at the pre-baking is equal to or higher than the temperature at which the thermosetting resin contained in the bank material starts thermosetting. And repair material is set lower than the heating temperature at which the fired molded body coated.

According to the manufacturing method of the organic EL display device of the above aspect, since the defective portion of the bank molded body is repaired by applying a repair material, the light emitting layer is formed by applying ink to the concave space partitioned by the bank. When forming, it can suppress that the area | region where an ink layer mixes a color through a defect part spreads.
Further, before the repair material is applied to the defective part of the bank molded body, the bank molded body is pre-fired by being heated above the temperature at which the thermosetting resin contained in the bank material starts thermosetting. Therefore, it is possible to prevent the shape deterioration of the bank molded body accompanying the application of the repair material.

Here, although the liquid repellency of the bank surface is somewhat lowered by performing pre-baking, the heating temperature in the pre-baking is set lower than the heating temperature in main baking the molded body on which the repair material is applied. Therefore, the degree of decrease in liquid repellency on the bank surface can be kept small.
Therefore, according to the manufacturing method of the organic EL display device of the above aspect, the display performance of the organic EL display device can be improved.

In the method for manufacturing an organic EL display device according to the above aspect, the heating temperature during the pre-baking is preferably 100 ° C. or higher. Moreover, it is preferable to set it as 150 degrees C or less.
In the method for manufacturing an organic EL display device according to the above aspect, by applying a repair material, in each of the concave spaces adjacent to both sides of the portion where the defective portion is present in the bank molded body, the concave space is formed into the defective portion. You may form the weir which partitions off into the 1st space which consists of a space part which adjoins, and the 2nd space which consists of a space part which is not close to a defect part.

<Embodiment 1>
[Overall configuration of organic EL display device]
FIG. 1 is a schematic block diagram illustrating a configuration of an organic EL display device 1 having a display panel 100 according to the first embodiment.
As shown in FIG. 1, the organic EL display device 1 includes a display panel 100 and a drive control unit 101 connected thereto. The display panel 100 is a panel using an electroluminescence phenomenon of an organic material, and as shown in FIG. 2, a plurality of organic EL elements 10 are arranged in a matrix on a substrate. The drive control unit 101 includes four drive circuits 102 to 105 and a control circuit 106.

The arrangement of the drive control unit 101 with respect to the display panel 100 is not limited to this.
[Configuration of organic EL display panel]
FIG. 2 is a plan view schematically showing a schematic configuration viewed from the display surface side of the display panel 100. 3 is a partially enlarged cross-sectional view of the display panel 100 taken along the line AA ′ of FIG. The display panel 100 is a so-called top emission type, and has a display surface on the Z direction side.

The configuration of the display panel 100 will be described with reference to FIGS.
As shown in FIG. 3, the display panel 100 includes, as main components, a base substrate 11, a pixel electrode 12, a hole injection layer 13, a bank 14, an organic light emitting layer 15, an electron transport layer 16, a common electrode 17, and a sealing. Layer 18 is provided. Then, the organic EL element 10 having the organic light emitting layer 15 corresponding to any one of the emission colors of red (R), green (G), and blue (B) is set as a sub pixel, and as shown in FIG. Arranged in a matrix.

2 shows a state in which the electron transport layer 16, the common electrode 17, and the sealing layer 18 are removed.
[Base substrate]
The base substrate 11 includes a substrate body 11a, a TFT (thin film transistor) layer 11b, and an interlayer insulating layer 11c.

The substrate body 11a is a part that becomes a base material of the display panel 100, and can be formed of any of insulating materials such as alkali-free glass, soda glass, polycarbonate resin, polyester resin, and alumina.
The TFT layer 11b is provided for each subpixel on the surface of the substrate main body 11a, and a pixel circuit including a thin film transistor element is formed in each.

  The interlayer insulating layer 11c is formed on the TFT layer 11b. The interlayer insulating layer 11c is made of an organic insulating material such as polyimide resin, acrylic resin, or novolak type phenol resin, or an inorganic insulating material such as SiO (silicon oxide) or SiN (silicon nitride). The TFT layer 11b and the pixel electrode 12 are formed. And has a function of flattening even if a step exists on the upper surface of the TFT layer 11b and suppressing the influence on the base surface on which the pixel electrode 12 is formed.

[Pixel electrode]
The pixel electrode 12 is a pixel electrode provided for each sub-pixel, for example, Ag (silver), Al (aluminum), aluminum alloy, Mo (molybdenum), APC (silver, palladium, copper alloy), etc. The light-reflective conductive material. In the present embodiment, the pixel electrode 12 is an anode.

A known transparent conductive film may be further provided on the surface of the pixel electrode 12. As a material of the transparent conductive film, for example, indium tin oxide (ITO) or indium zinc oxide (IZO) can be used. The transparent conductive film is interposed between the pixel electrode 12 and the hole injection layer 13 and has a function of improving the bonding property between the respective layers.
[Hole injection layer]
The hole injection layer 13 is made of, for example, an oxide such as silver (Ag), molybdenum (Mo), chromium (Cr), vanadium (V), tungsten (W), nickel (Ni), iridium (Ir), or PEDOT. It is a layer made of a conductive polymer material such as (mixture of polythiophene and polystyrene sulfonic acid). Among the above, the hole injection layer 13 made of metal oxide has a function of injecting and transporting holes to the organic light emitting layer 15 in a stable manner or assisting the generation of holes.

[bank]
A plurality of strip-shaped banks 14 are provided in parallel on the surface of the hole injection layer 13 in a plan view extending in the Y direction. The bank 14 is made of an insulating organic material (for example, an acrylic resin, a polyimide resin, a novolac type phenol resin, or the like).
The cross section of each bank 14 is trapezoidal as shown in FIG. 3, and a groove space defined by the bank 14 is formed between the banks 14, and the organic light emitting layer 15 is formed there. .

The bank 14 functions as a structure that prevents the applied ink from overflowing when the organic light emitting layer 15 is formed by a wet method.
[Organic light emitting layer]
The organic light emitting layer 15 is a site where carriers (holes and electrons) recombine and emits light, and includes an organic material corresponding to any of R, G, and B colors.

The organic light emitting layer 15 is formed in a groove-like concave space (groove space 20 in FIG. 6) that extends in the Y direction and is partitioned by the bank 14.
The organic light emitting layers 15 having different colors are arranged with the bank 14 in between.
Examples of the material of the organic light emitting layer 15 include polyparaphenylene vinylene (PPV), polyfluorene, oxinoid compound, perylene compound, coumarin compound, azacoumarin compound, oxazole compound, oxadiazole compound, perinone compound, pyrrolopyrrole compound, naphthalene. Compound, anthracene compound, fluorene compound, fluoranthene compound, tetracene compound, pyrene compound, coronene compound, quinolone compound and azaquinolone compound, pyrazoline derivative and pyrazolone derivative, rhodamine compound, chrysene compound, phenanthrene compound, cyclopentadiene compound, stilbene compound, diphenylquinone Compound, styryl compound, butadiene compound, dicyanomethylenepyran compound, dicyanomethylenethiopyran compound , Fluorescein compound, pyrylium compound, thiapyrylium compound, serenapyrylium compound, telluropyrylium compound, aromatic ardadiene compound, oligophenylene compound, thioxanthene compound, cyanine compound, acridine compound, 8-hydroxyquinoline compound metal complex, 2-bipyridine compound And fluorescent materials such as Schiff salt and group III metal complexes, oxine metal complexes and rare earth complexes.

[Electron transport layer]
The electron transport layer 16 has a function of transporting electrons injected from the common electrode 17 to the organic light-emitting layer 15, and includes, for example, an oxadiazole derivative (OXD), a triazole derivative (TAZ), a phenanthroline derivative (BCP, Bphen) or the like.
[Common electrode]
The common electrode 17 is formed of, for example, a light-transmitting material having conductivity such as ITO or IZO, and is provided over all subpixels.

In the present embodiment, the common electrode 17 is a cathode.
[Sealing layer 18]
The sealing layer 18 is provided to protect the hole injection layer 13, the organic light emitting layer 15, the electron transport layer 16, and the common electrode 17 from moisture and oxygen.
Although not shown, a black matrix, a color filter, or the like may be formed on the sealing layer 18.

[Display panel manufacturing method]
FIG. 4 is a schematic process diagram showing the manufacturing process of the display panel 100.
FIG. 5 is a cross-sectional view schematically showing a bank forming process and a light emitting layer forming process in the manufacturing process of the display panel 100.
A method for manufacturing the display panel 100 will be described with reference to FIGS.

First, the TFT layer 11b is formed on the substrate body 11a (step S1).
Subsequently, an interlayer insulating layer 11c is formed on the TFT layer 11b by a photoresist method using an organic material having excellent insulating properties to obtain the base substrate 11 (step S2). The thickness of the interlayer insulating layer 11c is about 4 μm, for example. Although not shown in the sectional view of FIG. 3 and the process diagram of FIG. 4, the contact hole 2 (see FIG. 2) is formed when the interlayer insulating layer 11c is formed.

Next, the pixel electrode 12 made of a metal material having a thickness of about 400 [nm] is formed on the base substrate 11 for each sub-pixel by vacuum deposition or sputtering (step S3).
Subsequently, a hole injection layer 13 is formed by uniformly depositing tungsten oxide on the base substrate 11 and the pixel electrode 12 by sputtering or the like (step S4).
Bank formation:
Next, the bank 14 is formed (steps S5 to S9).

First, a negative photosensitive resin composition is prepared as a bank material, and this bank material is uniformly applied on the hole injection layer 13 as shown in FIG. 5A (step S5).
As the bank material, a composition made of a thermosetting resin that is cured by applying heat is used. The composition includes a photopolymerization initiator that initiates polymerization by irradiation with UV light.

As a kind of resin, the thermosetting resin which has ethylenic double bonds, such as a (meth) acryloyl group, an allyl group, a vinyl group, a vinyloxy group, is mentioned, for example. Moreover, you may add the crosslinking agent which bridge | crosslinks with respect to these resin, for example, an epoxy compound, a polyisocyanate compound.
Further, a fluorinated polymer containing fluorine may be introduced into the resin structure. Examples of the fluorinated polymer include a photosensitive resist containing a fluorinated resin such as a fluorinated polyolefin resin, a fluorinated polyimide resin, and a fluorinated polyacrylic resin.

Specific examples of the resin into which the fluorinated polymer is introduced include LUMIFLON (registered trademark, Asahi Glass), which is a copolymer of fluoroethylene and vinyl ether.
By introducing fluorine into the resin, ink repellency can be imparted to the weir 5 formed.
Alternatively, an ink repellent agent may be added to the resin. The amount of ink repellent added is 0.01 to 10 wt%. By making the addition amount of the ink repellent within this range, the storage stability of the resin composition is good and the liquid repellency of the formed weir 5 to the ink is also good. Then, the applied bank material layer is patterned into a bank shape by photolithography (step S6).

That is, as shown in FIG. 5B, a mask having an opening corresponding to the pattern of the bank 14 to be formed is overlaid on the bank material layer and exposed from above the mask.
Thereafter, the bank material is patterned by washing out the excess bank material with an alkaline developer to form a bank pattern. As shown in FIG. 5 (c), a bank molded body 14 a (unfired bank) is pattern-formed on the base substrate 11. A groove space 20 is formed between adjacent bank molded bodies 14a.

Next, the formed bank molded body 14a is heated and pre-baked (step S6).
As a heating method at the time of pre-baking, for example, as shown in FIG. 5D, in a hot air drying furnace, hot air is applied to the bank molded body 14 a formed on the base substrate 11 to heat it. In addition, it can also carry out by the method of irradiating a heat ray with an infrared lamp, and the method of heating with a hot plate.

The temperature of the base substrate 11 gradually rises with heating, and after gradually maintaining at the heating temperature T1, which is the highest temperature, gradually falls.
The heating temperature T1 at this time is a temperature at which the thermosetting (polymerization reaction) of the bank material can proceed to some extent and does not reach the completion of the polymerization reaction. The heating time (time for maintaining at the heating temperature T1) is about 20 to 30 minutes.

Usually, when the thermosetting resin reaches 100 ° C. or higher, thermosetting is started and polymerization proceeds. Therefore, the heating temperature T1 is preferably set to 100 ° C. or higher.
On the other hand, when the heating temperature T1 is set to a high temperature of about 200 ° C., the polymerization of the thermosetting resin proceeds excessively in the preliminary baking stage, and the liquid repellency of the surface of the bank molded body 14 after the main baking is likely to be impaired. Therefore, the heating temperature T1 is preferably set to a temperature lower than the heating temperature T2 at the time of the main firing, and is set to 150 ° C. or lower.

Next, the presence / absence of a defective portion in each bank formed body 14a is checked (step S7), and if there is a defective portion, it is repaired.
Although this bank repair will be described in detail later, a repair material is applied to the groove space 20 between the bank formed bodies 14a in the vicinity of the detected defective portion 3 and dried (step S8). FIG. 5 (e) shows a state in which the repair material is applied to the groove space 20 adjacent to the bank molded body 14a in which the defect portion 3 exists, and the dam molded body 5a is formed.

Thereafter, as shown in FIG. 5 (f), the bank molded body 14a and the dam molded body 5a are heated and subjected to main firing, whereby the bank 14 and the dam 5 are completed, and the repair of the defective portion 3 is completed. (Step S9). In the main firing, the bank molded body 14a and the dam molded body 5a are heated to complete the polymerization reaction of the thermosetting resin.
As a heating method, as in the case of the pre-baking, in addition to a method in which hot air is applied to the bank molded body 14a formed on the base substrate 11 in a hot air drying furnace, a method of irradiating heat rays with an infrared lamp, A method of heating with a hot plate can be used. Then, the temperature of the base substrate 11 gradually increases with heating, and after gradually maintaining at the heating temperature T2 that is the maximum temperature, it gradually decreases.

The heating temperature T2 in the main baking is set to a high temperature (200 ° C. to 220 ° C.) in order to complete the polymerization of the thermosetting resin, and the heating time is, for example, about 60 minutes.
FIG. 5F shows a state in which the bank 14 is formed and the weir 5 is formed by the main firing, that is, a state in which the repaired bank 14 is formed.
The bank 14 thus formed may be further subjected to a process of adjusting the contact angle of the surface of the bank 14 with respect to the ink applied in the next step. Alternatively, in order to impart liquid repellency to the surface of the bank 14, a surface treatment may be performed with a predetermined alkaline solution, water, an organic solvent, or the like, or a plasma treatment may be performed.

Subsequently, as shown in FIG. 5G, ink for forming a light emitting layer is applied to the groove space 20 between the banks 14. This ink is a mixture of an organic material constituting the organic light emitting layer 15 and a solvent, and is applied to each groove space 20 by an ink jet method.
Then, the solvent contained in the applied ink layer 15a is evaporated and dried, and heated and fired as necessary, whereby the organic light emitting layer 15 is formed in each groove space 20 as shown in FIG. It is formed (step S10).

Next, on the organic light emitting layer 15 and the bank 14, the material which comprises the electron carrying layer 16 is formed into a film by the vacuum evaporation method, and the electron carrying layer 16 is formed (step S11).
Then, a material such as ITO or IZO is formed by sputtering or the like to form the common electrode 17 (step S12).
Then, a light transmissive material such as SiN or SiON is formed on the surface of the common electrode 17 by a sputtering method or a CVD method to form the sealing layer 18 (step S13).

The display panel 100 is completed through the above steps.
[Method to detect and repair defective bank]
(Defect 3)
First, the defect portion 3 present in the bank molded body 14a will be described.
The defective portion 3 is a portion in which foreign matter existing in the bank molded body 14a or a part of the bank molded body 14a is lost.

The foreign object is, for example, a metal piece derived from the manufacturing apparatus, or dust / dust that exists in the air. And dust is often a fiber piece.
In the example shown in FIG. 6A, foreign matter adheres to the defective portion 3 on one bank molded body 14a.
When there is a foreign substance on the bank molded body 14a as described above, an ink layer 15a is formed which is applied in the groove space 20 adjacent to the bank 14 and is piled up in a dome shape as shown in FIG. 5 (g). Then, the ink layer 15a may come into contact with the foreign matter, and inks with different emission colors (for example, red ink and green ink) may be mixed.

In the example shown in FIG. 7A, foreign matter enters one bank molded body 14a, and the foreign matter penetrates the wall surface of the bank 14 to the adjacent groove space to form the defective portion 3.
In the example shown in FIG. 7B, foreign matter enters under one bank molded body 14a, and the foreign matter penetrates to the adjacent groove space to form the defective portion 3.
As described above, even when foreign matter exists in or below the bank molded body 14a, if the adhesion between the foreign matter and the bank material is poor, a gap is formed to form an ink flow path, or the foreign matter may be a fiber fragment. In this case, since the ink is absorbed, the foreign matter itself becomes an ink flow path. Accordingly, color mixing occurs between the ink layers 15a formed in the adjacent groove spaces with the foreign matter in between.

  In the example shown in FIG. 7C, a part of the bank molded body 14 a is broken and becomes the defective portion 3. Such breakdown in the bank formed body 14a is caused, for example, in the exposure process for the bank material layer shown in FIG. 5B, where the exposure was insufficient and the polymerization was not so much performed in the next development process. Caused by. Even when a breakdown occurs in this way, color mixing occurs between the ink layers 15a formed in adjacent groove spaces through the breakdown.

When the display panel 100 is manufactured using a panel in which a color mixture region is generated in the light emitting layer, the color mixture region emits light with a light emission color different from the original light emission color. Generally, when phosphors having different emission colors are mixed, the emission color of the phosphor having a long wavelength becomes dominant.
For example, a mixed color region generated by mixing red ink and green ink as shown in FIG. 11B emits red light. Therefore, in the region that should emit light in green, the region that is a mixed color region emits light in red, and if this mixed color region is widened, it causes light emission color defects.

As described above, the portion where the foreign matter or breakage has occurred in the bank molded body 14a is caused by the color mixture of inks having different emission colors and causes the emission color defect.
7A and 7B, when foreign matter enters under or inside the bank molded body 14a, the bank 14 swells upward at that location, and the bank height increases. On the other hand, FIG. As shown in (c), the height of the bank 14 is lowered at the place where the bank molded body 14a is broken.

[Detection of defective part 3]
Detection of the defective portion 3 in the bank molded body 14a is performed, for example, by photographing a surface image of the bank molded body 14a formed on the base substrate 11 and pattern inspection of the surface image.
FIG. 8 is a schematic configuration diagram showing an example of a repair device used for detecting a bank defect portion and repairing it.

  The repair device 200 includes a table 202 on which the base substrate 11 is placed and a head unit 210 to which an image sensor 211 and a dispenser 212 are attached. The table 202 can be moved in the Y direction based on an instruction from the controller 230, and the head unit 210 can be moved in the X direction and the Z direction according to an instruction from the controller 230.

Accordingly, the image pickup device 211 and the dispenser 212 attached to the head unit 210 are in the X direction and Y direction with respect to the base substrate 11 above the base substrate 11 placed on the table 202 according to an instruction from the controller 230. Direction relative to the Z direction.
Using the repair device 200, image data on the upper surface of the base substrate 11 is acquired while moving the imaging device 211 along the upper surface of the base substrate 11, and stored in the storage unit 231 of the controller 230.

The controller 230 detects the defect portion 3 by comparing the portions of the bank molded bodies 14a one after another in the image data and detecting a difference. When the defective part 3 is detected, the detected position of the defective part 3 (the position of the center O of the defective part 3 in the X direction and the Y direction) is stored in the storage unit 231.
Note that, in such a detection process, there is a possibility that the defective portion 3 is detected in some of the bank molded bodies 14a formed on the base substrate 11, and all the bank molded bodies are detected. There is a possibility that the defect portion 3 is zero in the body 14a.

And when the defect part 3 is detected in any bank molded object 14a, the repair is performed.
[How to repair banks with defects]
Next, a repair material for dam formation is applied from the dispenser 21 so as to surround the periphery of the defective portion 3 on the base substrate 11 placed on the table 202 in the repair device 200 to form the dam 5. By doing so, the bank molded body 14a is repaired.

  Here, as shown in FIG. 6B, two points A1 and A2 sandwiching the defective portion 3 in the Y direction in each groove space 20 adjacent to both sides of the bank formed body 14a having the defective portion 3. From the above, the dam molded body 5a is formed in a shape extending over the bank molded body 14a adjacent to the bank molded body 14a in which the defect portion 3 exists. That is, a total of four weirs 5 partitioned in the X direction are formed in a cross-beam shape in the groove space 20 surrounding the periphery of the defect portion 3.

The dispenser 212 provided in the repair device 200 is a needle-type dispenser, and a tank 214 that stores a repair material is attached to a tip portion thereof, and the needle 213 moves up and down so as to penetrate the tank 214. The repair material adhered to the needle 213 can be applied in units of microliters.
The needle 213 in the dispenser 212 is driven based on a control signal from the controller 230.

As the repair material, a resin composition that is cured by applying light or heat can be used.
Examples of the resin include curable resins having an ethylenic double bond such as a (meth) acryloyl group, an allyl group, a vinyl group, and a vinyloxy group.
Moreover, you may add the crosslinking agent which bridge | crosslinks with respect to resin, for example, an epoxy compound and a polyisocyanate compound.

  Moreover, you may use the fluoropolymer in which the fluorine was introduce | transduced in this resin structure. By introducing fluorine into the resin of the repair material, ink repellency can be imparted to the formed weir 5. Alternatively, various ink repellent agents may be added to the resin. By making the addition amount of the ink repellent agent 0.01 to 10 wt%, the storage stability of the resin composition is good and the ink repellency of the weir 5 to be formed is also good.

  Note that, as the resin for the repair material, the same resin as the bank material for forming the bank molded body 14a may be used. However, in the case of the bank material, an acid component soluble in the alkali developer is contained, but it is preferable that the repair material forming the weir does not contain an acid component soluble in the alkali developer. This is because the development is not performed when the weir molded body 5a is formed, and the solvent resistance of the weir 5 is reduced when the acid component remains in the weir 5.

To the repair material, a solvent and a photopolymerization initiator are appropriately added to such a resin composition.
As a solvent, it has the solubility with respect to resin, The solvent whose boiling point is about 150-250 degreeC can use 1 type, or 2 or more types.
Various commercially available photopolymerization initiators can be used as the photopolymerization initiator.
At the time of applying the repair material, the solid content of the repair material is adjusted to, for example, 20 to 90 wt%, and the viscosity is adjusted to, for example, 10 to 50 cP (centipoise).

The addition amount of a photoinitiator is 0.1-50 wt% with respect to the total solid content, for example, Preferably it is 5 weight%-30 weight%.
The formation of the dam body 5a is performed by applying a repair material from the dispenser 212 to a plurality of positions set along a line (weir formation line) in which the dam 5 is to be formed in the groove space 20.

In the controller 230 of the repairing apparatus 200, the image data of the bank formed body 14a and the position of the defective part 3 are stored as described above, so positions set around the defective part 3 on the basis of the position. Can be applied accurately.
FIG. 9A is a diagram showing application positions set around the defect portion 3 in this image.

As shown in this figure, a point A1 that is a distance a1 away in the Y direction passes through the groove space 20 adjacent to both sides of the bank formed body 14a having the defective portion 3 with the central portion of the defective portion 3 as a reference O. Coating points P1, P2, P3, and P4 along the weir formation line extending in the X direction and the weir formation line extending in the X direction through the point A2 separated by a distance a2 in the direction opposite to the Y direction. Set.
Here, the distance a1 and the distance a2 may be the same or different, but the length is appropriate so that the entire defect portion 3 is sandwiched between the points A1 and A2 and is not too large. Set to.

FIG. 9B is a diagram schematically showing a cross section along the weir formation line passing through the point A <b> 1 in the base substrate 11.
The repair device 200 forms the weir molded body 5a by sequentially applying the repair material with the needle 213 at the application points P1, P2, P3, and P4 thus set.
10 (a) to 10 (g) are diagrams showing how the weir molded body 5a is formed by sequentially applying repair materials to the application points P1, P2,...

First, as shown in FIGS. 10A and 10B, the needle 213 and the tank 214 are positioned at the application point P1, the needle 213 is moved downward, and the repair material is attached to the needle 213. The repair material is applied to the application point P1 by approaching the application point P1.
The repair material has fluidity until it is applied, but after application, the mountain shape is maintained, and as shown in FIG. 10C, a pile of repair material is formed at the application point P1.

Subsequently, as shown in FIG. 10D, the needle 213 is pulled up into the tank 241 and the needle 213 and the tank 214 are moved to the application point P2. Then, the repair material is applied to the application point P2 by moving the needle 213 downward and bringing the needle 213 to which the repair material is attached closer to the application point P2.
Accordingly, as shown in FIG. 10E, the pile of repair material formed at the application point P2 is connected to the pile of repair material formed at the application point P1.

Subsequently, as shown in FIG. 10 (f), the needle 213 is pulled up and moved to the application point P3. In the same manner, a pile of repair material is formed at the application point 3 and connected to the pile of repair material at the application point P2.
In this way, the piles of the repair material are connected in a shape extending from the point A1 on the bank molded body 14a having the defective portion 3 to the adjacent bank molded body 14a. Then, the applied pile of repair material is dried and exposed as necessary to form the weir molded body 5a.

In the subsequent main firing step, the applied repair material is cured, so that the weir 5 having more stable physical properties is formed.
As shown in FIG. 6B, each of the groove spaces 20 on both sides of the bank 14 having the defect portion 3 is provided with a pair of weirs 5. 3 is partitioned into a first space SA composed of a space portion close to 3 and two second spaces SB composed of a space portion not close to the defect portion 3. The defective portion 3 is surrounded by the two first spaces SA.

  As described above, after repairing the defective portion 3 of the bank 14 and forming the organic light emitting layer 15 in each groove space 20 in the light emitting layer forming step of the next step S9, the first space SA and the second space SB are formed. Also, the ink is applied to form the organic light emitting layer 15. Therefore, in the panel after the light emitting layer is formed, the organic light emitting layer 15 formed in the first space SA and the organic light emitting layer 15 formed in the second space SB are partitioned by the weir 5. It becomes.

[Effects of the above bank forming method]
FIG. 11A shows a panel according to the embodiment in which, after the weir 5 is formed around the bank 14 having the defect portion 3, red ink is placed in one groove space 20 adjacent to the bank 14. FIG. 6 is a plan view showing a state in which an ink layer 15a (R) is applied and green ink is applied to the other groove space 20 to form an ink layer 15a (G). FIG. 11B shows a state in which the ink layer 15a (R) and the ink layer 15a (G) are formed in the adjacent groove space 20 across the bank 14 in the comparative example in which the weir 5 is not formed. FIG.

As shown in FIG. 11B, when the dam 5 is not formed around the bank 14 having the defect portion 3, the color mixture region formed by mixing the red ink and the blue ink through the defect portion 3 is as follows. It spreads within each ink layer 15a. This color mixture region may extend long in the Y direction, and its length may be about 1 cm.
When the display panel 100 is manufactured, the mixed color region emits light with a light emission color different from the original light emission color. As described above, the mixed color region where the red ink and the green ink are mixed emits red light. Therefore, in the region that should emit light in green, the region that is a mixed color region emits light in red, which causes defective emission color.

On the other hand, in the present embodiment, as described above, the weirs 5 are formed in pairs around the banks 14 having the defect portions 3, and the groove portions 20 are sandwiched between the pairs of the weirs 5. Is partitioned into a first space SA that is close to and a second space SB that is not close to the defective portion 3 outside the pair of weirs 5. As a result, the color mixture area is limited as follows.
FIG. 12A is a cross-sectional view taken along the line CC in FIG. 11A, and the ink layer 15a (G) is formed by applying ink to the groove space 20 where the weir 5 is formed. Is a cross section cut in the Y direction.

When ink for forming a light emitting layer is applied to each groove space 20 between the banks 14, the first space SA sandwiched between the pair of weirs 5 and the pair of weirs 5, as shown in FIG. Ink layers 15a (G) are formed in the two second spaces SB on the outside.
Here, as shown in FIG. 11A, the red ink and the green ink may be mixed through the defect portion 3 and the space portion SA may become a mixed color region, but is formed in the first space SA. The ink layer 15a and the ink layer 15a formed in the second space SB outside the pair of weirs 5 are separated by the weirs 5, and thus do not mix with each other.

Therefore, even if there is a mixed color area in the first space SA, the mixed space does not extend beyond the weir 5 and the second space SB does not spread.
As described above, in the present embodiment, the range of the color mixture region generated by the defect portion 3 is limited to the narrow first space SA close to the defect portion 3, so that an effect of suppressing the spread of the color mixture range is obtained. Luminous color defects in the display panel 100 can be reduced.

As for the gap between the defective portion 3 and the weir 5, if this gap is too narrow, the light emitting layer is not formed for the reason that the ink is landed in the region sandwiched between the weirs 5, for example, to be repelled. Sometimes. Therefore, it is preferable to secure a sufficient distance for applying ink in the region sandwiched between the weirs 5 as the distance between the points A1 and A2.
On the other hand, in order to obtain the effect of reducing the luminescent color defect, it is preferable to set the distance between the points A1 and A2 as small as possible, and at this point, it should be set to be equal to or less than the length of the subpixel in the Y direction. preferable.

The width of the weir 5 is preferably 50 μm or less because if the width is too large, the weir 5 itself may stand out when the display panel 100 is viewed.
In the line bank, when ink color mixture occurs, the color mixture range is widened and light emission color defects are likely to occur. Therefore, particularly for the line bank, the effect obtained by repairing the weir 5 is great. However, as will be described later in the modification, the effect can be obtained by forming the weir 5 not only in the line bank but also in the pixel bank.

(Effect of pre-baking process)
According to the bank forming method described above, since the pre-baking is performed before repairing the bank molded body having a defective portion with the repair material, the shape of the bank molded body collapses as the repair material is applied. Can be prevented.
This effect will be described in detail below.

FIGS. 13A and 13B are schematic diagrams for explaining the effect of the bank forming method of the present embodiment, in which FIG. 13A is an example in which preliminary firing is performed, and FIG. 13B is in which preliminary firing is performed. There is no comparative example.
In the comparative example, as shown in FIG. 13B, a phenomenon occurs in which the shape in the vicinity of the portion in contact with the weir molded body 5a at the edge of the bank molded body 14a deteriorates.

Such deterioration of the shape of the bank occurs because the applied repair material is in contact with the bank molded body 14a, so that liquid components such as a resin monomer and a solvent contained in the repair material are white in the figure. It is considered that this is due to spreading and spreading along the surface of the bank molded body 14a as indicated by an arrow, and partial dissolution of the bank molded body 14a in the wet-spread liquid component.
On the other hand, in the embodiment, as shown in FIG. 13A, the shape deterioration of the bank molded body 14a does not occur. This is because the bank molded body 14 is pre-fired before the repair material is applied, and therefore the thermosetting resin of the bank molded body 14a is in a state where the thermosetting has started and the polymerization has progressed to some extent. Conceivable.

  That is, if thermosetting of the thermosetting resin in the bank molded body 14a starts and the polymerization proceeds to some extent, even if the applied repair material comes into contact with the bank molded body 14a, the liquid component will block the edge of the bank molded body 14a. This is probably because the edge of the bank molded body 14a is not re-dissolved in the spread liquid component even if the liquid component is difficult to spread and spreads through the edge of the bank molded body 14a.

  In the embodiment, although the liquid repellency of the surface of the bank 14 is slightly reduced by performing preliminary firing, the heating temperature T1 in the preliminary firing is lower than the heating temperature T2 in the main firing. It is not exposed to a high temperature of about 200 ° C. during firing. Therefore, the degree of liquid repellency reduction on the surface of the bank 14 can be suppressed to a small level. Therefore, the light emitting layer can be formed in a favorable shape, and the display performance in the organic EL display device can be improved.

Further, the TFT layer 11b included in the base substrate 11 also has a lower heating temperature T1 at the time of pre-baking than the heating temperature T2 at the time of main baking, so that it is possible to suppress deterioration in characteristics of the TFT layer 11b due to heat.
In order to confirm the effect of the pre-baking as described above, the following experiment was conducted.
(Experiment 1) Pre-baking temperature and shape deterioration of bank molded body A bank molded body 14a was formed on a test substrate by a photolithography method, and a plurality of samples cut to a size of 30 mm x 30 mm were produced. As the bank material, a fluorine-containing polymer (a copolymer of fluoroethylene and vinyl ether) was used as the bank material.

And each sample was pre-baked by heating on a hot plate. Here, the heating temperature T1 at the time of preliminary firing is set to three temperatures (50 ° C., 100 ° C., 150 ° C.), and the heating time is set to three times (20 minutes, 40 minutes, 60 minutes), The combination was performed under a total of nine heating conditions.
Next, a weir molded body 5a was formed by applying a repair material to the sample that had been pre-fired under each condition, and the degree of deterioration of the shape at the edge portion of the bank molded body 14a was observed. The same fluorine-containing polymer as the bank material was used for the repair material.

A photograph of each sample in which Experiment 1 was performed is shown in FIG.
In the sample with the heating temperature T1 at the pre-baking of 50 ° C., the edge part (the part indicated by the arrow in the figure) of the bank molded body 14a collapses regardless of whether the heating time is 20 minutes, 40 minutes, or 60 minutes. It was observed that shape deterioration occurred.
On the other hand, in the samples with heating temperatures T1 of 100 ° C. and 150 ° C. at the time of preliminary firing, no shape deterioration was observed in the edge portion of the bank molded body 14a even when the heating time was 20 minutes, 40 minutes, or 60 minutes. .

From the above results, it can be seen that the shape deterioration of the bank molded body 14a can be prevented when the repair material is applied by heating the bank molded body 14a at a temperature of 100 ° C. or higher and performing preliminary firing.
Further, it indicates that heating at about 50 ° C. is not sufficient for starting thermosetting of the thermosetting resin contained in the bank material, and it is desirable to perform heating at about 100 ° C. or higher.

(Experiment 2) Pre-baking temperature and ink contact angle A bank material was applied on a test substrate to form a bank material layer, and a plurality of samples cut to a size of 30 mm × 30 mm were prepared. Each sample was heated on a hot plate. The heating conditions here are the same as in Experiment 1 above, the heating temperature is set to 50 ° C, 100 ° C, and 150 ° C, and the heating time is set to 20 minutes, 40 minutes, and 60 minutes. A total of nine heating conditions were carried out by combining one heating temperature and three heating times.

Then, for the sample heated under each heating condition, as shown in FIG. 15A, ink droplets for forming a light emitting layer are dropped on the surface of the bank material layer, and the contact angle of the ink with respect to the surface of the bank material layer. Was measured.
The ink used here is a butyl benzoate solvent, a polyfluorene polymer (product name: Poly (9,9-di-n-dodecylfluorenyl-2,7-diyl), manufactured by Aldrich), and the concentration is 1. 0 wt%.

The larger the contact angle, the greater the liquid repellency with respect to the ink on the surface of the bank material layer.
The measurement result of the contact angle is shown in FIG.
Compared to when the heating temperature is 50 ° C., when the heating temperature is 100 ° C. and 150 ° C., the contact angle is reduced, but a contact angle of 60 ° or more is secured.

From this result, the higher the heating temperature at the time of preliminary firing, the lower the liquid repellency with respect to the ink on the surface of the bank molded body 14a. It can be seen that liquidity can be secured to some extent.
Thus, by ensuring the liquid repellency with respect to the ink on the surface of the bank 14, the effect of preventing ink color mixing can be obtained.

FIG. 12B is a cross-sectional view showing a state in which each groove space 20 between the banks 14 on the base substrate 11 is filled with ink for forming a light emitting layer to form an ink layer 15a. From this figure, it can be seen that when the contact angle of the ink layer 15a with respect to the upper surface of the bank 14 is small, the adjacent ink layers 15a contact each other across the bank 14 and color mixing is likely to occur.
On the other hand, when the liquid repellency with respect to the ink on the surface of the bank 14 is high, the contact angle of the ink layer 15a with respect to the upper surface of the bank 14 is increased, so that the ink layers 15a adjacent to each other across the bank 14 are less likely to contact each other. Color mixing is also less likely to occur.

(Experiment 3)
As in Experiment 2 above, a bank material layer was formed by applying a solid bank material on a test substrate, and a plurality of samples cut to a size of 30 mm × 30 mm were prepared. Each sample was placed on a hot plate. And heated.
As for the heating conditions here, some of the samples were baked once at 220 ° C. for 60 minutes, which is the heating temperature during the main baking. Another sample was fired twice at 220 ° C.-60 minutes.

And the contact angle of the ink with respect to the bank material layer surface was measured by the method similar to Experiment 2 about the sample which heat-fired on each condition.
The measurement result of the contact angle is shown in the graph of FIG.
According to the result of the experiment 2, the contact angle of the ink with respect to the surface of the bank material layer before firing is 60 ° or more, but as shown in FIG. 15, firing is performed once at the heating temperature (220 ° C.) corresponding to the main firing. Then, the contact angle is reduced to about 53 °. Further, in the case where the firing is performed twice, the contact angle is further reduced by about 0.5 ° as compared with the case where the firing is performed only once.

From this result, it can be seen that the number of firings at a high temperature as in the main firing is preferably one rather than two in order to maintain the liquid repellency with respect to the ink on the surface of the bank 14.
It can also be seen that, in order to maintain the liquid repellency with respect to the ink on the surface of the bank 14, it is preferable to set the heating temperature T1 in the preliminary firing lower than the heating temperature T2 in the main firing.

  In Experiments 1 to 3, an experiment was performed using a copolymer of fluoroethylene and vinyl ether as the thermosetting resin of the bank material. However, the experiment was performed using a thermosetting resin having an ethylenic double bond. If present, the heating temperature at which the thermosetting is started and the polymerization proceeds is substantially the same. Therefore, the results of Experiments 1 to 3 can be widely applied when a thermosetting resin having an ethylenic double bond is used as the bank material.

Furthermore, the thermosetting resin generally used as a bank material starts thermosetting at a temperature of about 100 ° C. or higher, and can be completed by heating at 200 to 220 ° C. Therefore, the results of Experiments 1 to 3 can be widely applied when a thermosetting resin is used as the bank material.
<Embodiment 2>
The configuration of the display panel 100 according to the second embodiment and the manufacturing method thereof are the same as the configuration and the manufacturing method described in the first embodiment.

Moreover, although the point which forms the dam molding 5a in each groove space 20 adjacent to the both sides of the bank molding 14a in which the defect part 3 exists is also the same, the shape of the dam molding 5a to be formed is different.
The bank forming step is as described in the first embodiment, and after the bank molded body 14a is pre-fired, the bank molded body 14a having the defective portion 3 is repaired with a repair material. The bank material, the repair material, the preliminary firing, the heating temperature of the main firing, and the like are also as described in the first embodiment.

FIG. 16A is a perspective view showing the shape of the dam body 5a according to the second embodiment, and FIG. 16B is a plan view in which the ink layer is formed after the dam 5 is formed in the groove space.
As shown in FIG. 16B, the weir molded body 5a according to the present embodiment has one of two points (point A1 and point A2) sandwiching the defect portion 3 in the Y direction when the XY plane is viewed in plan view. It is formed in a shape extending from the (point A1) to the other (point A2), bypassing the defect portion 3. In addition, a point A3 on the way from the point A1 to the point A2 is in contact with the bank 14 adjacent to the bank 14 where the defect portion 3 exists.

The method of forming the weir molded body 5a is the same as the method described with reference to FIGS. 10A to 10F in the first embodiment, and reaches the point A2 from the point A1 through the point A3. By sequentially applying repair materials to a plurality of application points set along the weir formation line, the weir molded body 5a can be formed.
As shown in FIG. 16A, the groove spaces 20 are formed in the defect portions 3 by the dam moldings 5 a formed in the groove spaces 20 adjacent to both sides of the bank 14 having the defect portions 3 in this way. It is partitioned into a first space SA composed of adjacent space portions and two second spaces SB composed of space portions not adjacent to the defect portion 3. The defective portion 3 is surrounded by the two first spaces SA.

Therefore, the effect of suppressing the color mixture range is obtained as in the first embodiment.
That is, as shown in FIG. 16B, when ink for forming a light emitting layer is applied to the groove space 20 between the banks 14, the red ink and the blue ink are mixed through the defect portion 3. Accordingly, even if a color mixture region is formed, the color mixture region does not extend beyond the weir 5 and into the second space SB. Since the range of the color mixture region generated by the defective portion 3 is limited to the narrow first space SA close to the defective portion 3, the light emission color defect in the display panel 100 can be reduced.

Further, since the weir molded body 5a is formed by applying a repair material so as to surround the periphery of the defect portion 3, the point that repair is easy is the same as in the first embodiment.
On the other hand, as compared with the weir 5 of the first embodiment, in the weir 5 of the present embodiment, the area occupied by the first space SA is smaller, so that the emission color defects in the display panel 100 can be further suppressed. .

Also, in the bank forming process of the present embodiment, as in the first embodiment, the bank molded body 14a having the defective portion 3 is repaired with a repair material after the bank molded body 14a is pre-fired. Therefore, it can prevent that the shape of a bank fabrication object collapses with application of repair material.
<Embodiment 3>
The configuration and the manufacturing method of the display panel 100 according to the third embodiment are the same as the configuration and the manufacturing method described in the first embodiment.

Moreover, when repairing the defective part 3 in the bank molded body 14a, the point that the dam molded body 5a is formed in each groove space 20 adjacent to the bank molded body 14a in which the defective part 3 exists is the same. The shape of the weir molded body 5a is different.
The bank forming step is as described in the first embodiment, and after the bank formed body 14a is pre-fired, the bank formed body 14a having the defective portion 3 is repaired with a repair material. The bank material, the repair material, the preliminary firing, the heating temperature of the main firing, and the like are as described in the first embodiment.

FIG. 17A is a perspective view showing the shape of the weir molded body 5a according to the third embodiment, and FIG. 17B is a plan view in which the ink layer 15a is formed after the weir 5 is formed in the groove space 20. FIG. is there.
Similarly to the second embodiment, the dam molded body 5a according to the present embodiment also has two points A1 that sandwich the defect portion 3 in the Y direction when the XY plane is viewed in a plan view, as shown in FIG. , A2 is formed so as to bypass the defect portion 3 from one side and the other, but is different from the second embodiment in that it is not in contact with the bank 14 adjacent to the bank 14 where the defect portion 3 exists. Yes. In other words, in the present embodiment, the maximum distance b at which each weir molded body 5a is separated from the center of the defect portion 3 in the X direction is set to be smaller than the width of the groove space 20 (X direction width).

The formation method of this dam molding 5a is also the same as the method described with reference to FIGS. 10A to 10G in the first embodiment, and is along the dam formation line from point A1 to point A2. The weir molded body 5a can be formed by sequentially applying the repair material to the plurality of application points set in the above.
In this way, by forming the weir molded body 5a in each groove space adjacent to both sides of the bank 14 having the defect portion 3, as shown in FIG. Since it is partitioned into a first space SA made up of adjacent space portions and a second space SB made up of space portions not close to the defect portion 3, the effect of suppressing the color mixing range is obtained as in the first embodiment.

That is, as shown in FIG. 17B, when the light emitting layer forming ink is applied to the groove space 20 between the banks 14, the red ink and the blue ink are mixed through the defect portion 3. Even if a mixed color area is formed, the mixed color area does not exceed the weir 5 and therefore does not spread into the second space SB.
Moreover, since the dam molded body 5a is formed by applying a repair material so as to surround the periphery of the defective portion 3, the same applies to the point that the repair is easy.

On the other hand, in the present embodiment, the area occupied by the first space SA adjacent to the defect portion 3 partitioned by the weir 5 is further reduced as compared with the first and second embodiments. Luminous color defects can be further suppressed.
Also, in the bank forming process of the present embodiment, as in the first embodiment, the bank molded body 14a having the defective portion 3 is repaired with a repair material after the bank molded body 14a is pre-fired. Therefore, it can prevent that the shape of a bank fabrication object collapses with application of repair material.

<Embodiment 4>
In the first to third embodiments, the case where the defective portion is repaired with respect to the line bank has been described, but the same can be applied to the pixel bank.
FIGS. 18A to 18D are diagrams showing an example of repairing a defective portion generated in a pixel bank in a display panel having the pixel bank.

The pixel banks shown in FIGS. 18A to 18D include a plurality of banks 24 (horizontal banks) extending in the X direction in addition to a plurality of banks 14 (vertical banks) extending in the Y direction. The organic EL element 10 is formed in a rectangular region surrounded by the banks 14 and 24.
In any case, in the bank 14 extending in the Y direction, a weir 5 is formed in each of the recessed spaces 20 adjacent to both sides of the bank in which the defect portion 3 exists, and the weir 5 is recessed. The space 20 is partitioned into a space close to the defect portion 3 and a space not close to the defect portion 3.

In (a), in the same manner as in the first embodiment, the weir 5 is formed in each concave space 20 on both sides of the bank 14 where the defect portion 3 exists, from each of the points A1 and A2 to the opposing bank 14. Are formed in pairs.
In this case as well, even if a color mixture due to the defective portion 3 is formed when the ink is applied, the range in which the color mixture spreads is limited between the pair of weirs 5, so that the effect of suppressing the emission color defect is obtained. It is done.

In (b), as in the second embodiment, the weir 5 is formed in each concave space 20 on both sides of the bank 14 where the defective portion 3 exists, in a form that bypasses the defective portion 3 from the point A1 and extends to the point A2. Has been.
In this case as well, even if color mixing occurs due to the defective portion 3 when the ink is applied, the range in which the color mixing spreads is limited to the range surrounded by the weirs 5, so that the effect of suppressing the emission color defect can be obtained. .
Although not shown, the weir 5 of the third embodiment can be applied to the pixel bank, and the effect of suppressing the emission color defect can be obtained.

In (c), the position of the defective portion 3 in the bank 14 is a position relatively close to the bank 24. The weirs 5 are formed in the concave spaces 20 on both sides of the bank 14 where the defect portion 3 exists, in a form that bypasses the defect portion 3 from the point A1 and extends to the bank 24.
Also in this case, even if a color mixture caused by the defective portion 3 is formed when the ink is applied, the range in which the color mixture spreads is limited to the range surrounded by the two weirs 5 and the bank 24. The effect which suppresses is acquired.

In (d), the position of the defect portion 3 is a position where the bank 14 and the bank 24 intersect, and the defect portion 3 extends over the four concave spaces 20.
In each of the four recessed spaces 20, a weir 5 is formed.
That is, the two weirs 5 are formed so as to bypass the defective portion 3 from the point A1 and extend to the bank 24, and the remaining two weirs 5 bypass the defective portion 3 from the point A2 to the bank 24. The weir 5 is formed in a wide form.

In this case, when ink is applied, color mixing may occur between the four concave spaces 20 due to the defective portion 3, but even if the color mixing is formed, the range where the color mixing spreads is four weirs 5. Therefore, it is possible to obtain an effect of suppressing defective emission color.
Even in such a pixel bank, as described in the first embodiment, the bank forming process is performed by pre-sintering the bank molded body 14a and repairing the bank molded body 14a having the defective portion 3 with a repair material. By doing so, it is possible to prevent the shape deterioration of the bank molded body accompanying the application of the repair material.

<Embodiment 5>
In the above first to fourth embodiments, the method of forming the weir 5 in the concave space 20 was used to repair the bank 14 having the defective portion 3, but in this embodiment, the defective portion 3 itself is repaired. Repair with filling material.
In the example shown in FIG. 19A, a part of the bank molded body 14 a is lost and becomes a defective portion 3.

In the example shown in FIG. 19B, the repair portion 6 is formed by embedding a repair material in the defect portion 3. The repair material can be embedded in the defective portion 3 using the dispenser 212 described in the first embodiment.
Even when the repair material is embedded in the defect portion 3 to repair the defect portion 3 of the bank 14 as described in the first embodiment, after the preliminary firing of the bank molded body 14a is performed, By applying the repair material, it is possible to prevent the shape of the bank molded body 14a from collapsing with the application of the repair material.

<Modification>
1. In the first to fourth embodiments, the pre-baking of the bank molded body 14a is performed before the detection of the defective portion 3. However, the pre-baking of the bank molded body 14a may be performed after the detection of the defective portion 3. There is an effect.
2. In the above embodiment, the bank molded body 14a is formed by a photolithography method, but the method of forming the bank molded body 14a is not limited to the photolithography method.

For example, the bank molded body 14a can be formed by applying a bank material containing a thermosetting resin onto the substrate in a bank shape by an imprint method.
Even in that case, similarly to the above-described embodiment, the bank formed body 14a is pre-fired, the defect portion 3 is detected, and the repair material is applied, so that the repaired bank 14 is formed and the same effect is obtained. be able to.

  3. In the above embodiment, the top emission type organic EL panel has been described as an example. However, the present invention can also be applied to a bottom emission type organic EL panel.

  The manufacturing method of the organic EL display device according to the present invention manufactures an organic EL display device used for, for example, various display devices for home use or public facilities, or for business use, television devices, displays for portable electronic devices, and the like. Is available.

DESCRIPTION OF SYMBOLS 1 Organic EL display device 3 Defect part 5 Weir 5a Weir molding 6 Repair part 10 Organic EL element 11 Base substrate 12 Pixel electrode 13 Hole injection layer 14 Bank 14a Bank molding 15a Ink layer 15 Organic light emitting layer 16 Electron transport layer 17 Common Electrode 18 Sealing layer 20 Concave space (groove space)
24 Bank 100 Display panel 200 Repair device 212 Dispenser

Claims (3)

On the substrate, bank material containing thermosetting resin is molded into bank shape,
Detect defects in the formed bank molding,
When a defective part is detected, repair the defective part by applying a repair material containing a thermosetting resin to a place where the defective part is present in the bank molded body,
A bank is formed by heating and firing the bank molded body to which the repair material is applied,
A method of manufacturing an organic EL display device by forming a light emitting layer in each of recessed spaces partitioned by a formed bank,
After the bank formed body is formed, before the repair material is applied, the bank formed body is pre-fired by heating,
The heating temperature during the preliminary firing is
The thermosetting resin contained in the bank material is at or above the temperature at which thermosetting starts, and is lower than the heating temperature at the time of main firing,
A method for manufacturing an organic EL display device. The heating temperature during the preliminary firing is
100 ° C or higher and 150 ° C or lower,
A method for producing an organic EL display device according to claim 1. By applying the repair material,
In each of the recessed spaces adjacent to both sides of the portion where the defect portion exists in the bank molded body,
Forming a weir that partitions the concave space into a first space composed of a space portion close to the defect portion and a second space composed of a space portion not close to the defect portion;
The manufacturing method of the organic electroluminescence display of Claim 1 or 2.