JP2018101558A - Organic el display panel and method for manufacturing the same for reducing generation of consecutive dark dot accompanying bank repair - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an organic EL display panel capable of suppressing the number of dark dots consecutively generated while avoiding influences of color mixing on pixels in a column direction.SOLUTION: A rectangular region segmented by a column bank and a row bank includes first to fourth dam regions. A first rectangular region and a second rectangular region are disposed adjoining to a defective portion in a band region where a defective portion of the column bank belongs. One of the third rectangular region and the fourth rectangular region belongs to a band region separated by at least one band region from the band region where the first rectangular region and the second rectangular region are formed, and is arranged in the same column position as the first and second dams.SELECTED DRAWING: Figure 10

Description

  The present disclosure relates to an organic EL display panel, and more particularly to an improvement that reduces the occurrence of continuous dark spots due to repair of a bank.

A bank of an organic EL display panel is a partition made of an insulating material arranged in a matrix on or above a substrate. There are two types of banks: a row bank extending in the row direction and a column bank extending in the column direction. is there. A region partitioned by a plurality of row banks and a plurality of column banks is called a “rectangular region”, and an organic EL display element is configured by forming an organic functional layer therein.
Hereinafter, an outline of a conventional method for producing an organic EL display panel will be described. In a conventional method for manufacturing an organic EL display panel, a bank is formed on a substrate, and an organic functional layer such as a light emitting layer is formed in a rectangular region partitioned by the bank. A wet method is widely used to form this organic functional layer. The wet method is a method of forming an organic functional layer by applying an ink containing a high molecular material or a low molecule with good thin film formability to a rectangular region by inkjet. Patent Document 1 discloses a method for manufacturing an organic EL display panel in which a bank molded body is pre-fired prior to dam formation using a repair material.

  By the way, in the prior art, in the ink application by the wet method, the ink liquid ejected for a certain rectangular area may leak to the adjacent rectangular area beyond the line bank. Such leakage of the ink liquid occurs due to defective formation of the row bank or foreign matter attached to the row bank. In order to avoid leakage of the ink liquid, in the conventional manufacturing process of the organic EL display panel, the presence or absence of a defective portion of the bank is inspected after the row bank and the column bank are formed. Panels in which ink leakage has occurred at multiple pixels in the column direction cannot be shipped, so in the conventional manufacturing method, all the enclosing defects are found, regardless of the possibility of color mixing. Safety measures were taken to repair the pixels.

Japanese Unexamined Patent Publication No. 2016-71992

However, the repaired pixel becomes a dark spot due to the structure, and in the repair for all the pixels surrounding the defective portion as described above, the dark spots due to the repair are concentrated around the defective portion. Due to such concentration, there is a problem in that the presence of dark spots becomes conspicuous and causes deterioration in display quality.
An object of the present disclosure is to provide an organic EL display panel that can disperse dark spots and make it inconspicuous while avoiding the influence of color mixing on pixels in the column direction.

An organic EL display panel according to one embodiment of the present disclosure is provided.
A substrate,
A pixel electrode disposed at a position corresponding to each of a plurality of pixels on the substrate;
A plurality of row banks covering edges in the column direction of the pixel electrodes and extending in the row direction;
A plurality of column banks covering edges of the pixel electrodes in the row direction and extending in the column direction;
A plurality of organic light emitting layers formed in a rectangular region delimited by a plurality of adjacent column banks and a plurality of adjacent row banks;
A common electrode facing the pixel electrode,
A defect portion exists in any of the plurality of column banks, and the first rectangular region and the second rectangular region on both sides of the column bank in which the defect portion exists, and at the same column position as the first rectangular region In a third rectangular area and a fourth rectangular area at the same column position as the second rectangular area, a weir made of repair material is formed in a taller posture than the row bank,
At least one rectangular area without a weir is interposed between the first rectangular area and the third rectangular area and between the second rectangular area and the fourth rectangular area. And

  In the present disclosure, at least one rectangular region without a weir is interposed between the first rectangular region and the third rectangular region and between the second rectangular region and the fourth rectangular region. By providing the weir, the rectangular area that becomes a dark spot is not concentrated around the defect portion. Since the presence of the rectangular region that becomes a dark spot due to the formation of the weir becomes inconspicuous, in the present disclosure, it is possible to avoid the deterioration in display quality caused by the bank repair.

FIG. 1A shows a 4 × 4 rectangular area partitioned by five row banks and five column banks. FIG. 1B shows an example in which all pixels located at the coordinates of X = 2 and all pixels located at the coordinates of X = 3 have become dark spots. FIG. 1C shows an organic EL display panel in which the mixed color range extends to all the pixels in the column direction. FIG. 1D shows four pixels in which a defective portion was found but no color mixture occurred. FIG. 2 (a) shows a layout of a plurality of rectangular regions in which weir regions are formed because there is a suspicion of color mixing. FIG. 2B shows a pixel layout in which the influence of the color mixture due to the inflow of ink remains in the four pixels surrounding the defect portion. FIG. 2C shows a pixel that has become a dark spot due to the formation of a weir despite the absence of color mixing. FIG. 2D shows a pixel layout of an organic EL display panel in which repairs are made to the 10 defective portions found. 1 is a schematic block diagram showing a configuration of an organic EL display device 1 having an organic EL display panel 100 according to Embodiment 1. FIG. 2 is a plan view schematically showing a schematic configuration of the organic EL display panel 100 as viewed from the display surface side. FIG. FIG. 3 is a partially enlarged cross-sectional view of the organic EL display panel 100 taken along line AA ′ of FIG. FIG. 6 is a schematic process diagram illustrating a manufacturing process of the organic EL display panel 100. (A)-(h) is sectional drawing which shows typically a bank formation process and a light emitting layer formation process in the manufacturing process of the organic electroluminescence display panel 100. FIG. It is a schematic block diagram which shows an example of the repair apparatus used for the detection of a bank defect part, and its repair. A pixel layout in which a defective portion exists in the jth horizontal region of the screen and a pixel P (i, j) and a pixel P (i + 1, j) are adjacent to each other in the defective portion is shown. FIG. 10 (a) shows a selection pattern referred to as a discoloration point repair. FIG. 10B shows a selection pattern called the same color dark spot repair. FIG. 10C shows a selection pattern called same color & different color disappearance repair. FIG.5 (d) is sectional drawing which shows the landing target of repair material. 11 (a) to 11 (g) are diagrams showing how the weir molded body 13 is formed by sequentially applying repair materials to the target points P1, P2,... It is a flowchart which shows the specific procedure of repair object. FIG. 13A is a flowchart showing a processing procedure for repairing a different color blinking point. FIG. 13B shows the processing procedure for the same color disappearance repair. FIG. 13C is a flowchart showing a processing procedure for repairing the same color and different color disappearance point. FIG. 14 (a) shows an aspect in which the different color disappearance repair is applied. FIG. 14B shows the arrangement of dark spots when the different color dark spots have been repaired but no color mixture has occurred. FIG. 14 (c) shows the arrangement of dark spots when different color dark spots are repaired and color mixing occurs. FIG. 14D shows an example of a dark spot distribution in the organic EL display panel. FIG. 15 (a) shows a situation where the same color disappearance repair is applied. FIG. 15B shows the arrangement of dark spots when the same color dark spot repair is performed but no color mixture occurs. FIG. 15C shows the arrangement of dark spots when the same color dark spots are repaired and color mixing occurs. FIG. 15D shows an example of a dark spot distribution in the organic EL display panel. FIG. 16A shows a situation where the same color & different color disappearance repair is applied. FIG. 16B shows the arrangement of dark spots when the same color & different color dark spot repair is performed but no color mixture occurs. FIG. 16C shows the arrangement of the dark spots when the same color & different color dark spots are repaired and color mixing occurs. FIG. 16D shows an example of a dark spot distribution in the organic EL display panel.

<Background to the Aspect of the Present Disclosure>
Inventors have repeatedly examined the deterioration of the display quality of the generated organic EL display panel due to the color mixture of ink materials in the research process so far.
First, the color mixing of the ink material caused by the defective portion of the column bank will be described.
FIG. 1A shows a rectangular area corresponding to 4 × 4 pixels partitioned by five column banks 51c1, 51c2, 51c3, 51c4, 51c5 and five row banks 52r1, 52r2, 52r3, 52r4, 52r5. Show. “R”, “G”, and “B” in the drawing indicate that each of the rectangular regions in the drawing corresponds to a red sub-pixel, a green sub-pixel, and a blue sub-pixel arranged in the row direction. By setting gradations for each of the red sub-pixel, green sub-pixel, and blue sub-pixel and causing them to emit light simultaneously, each primary color of RGB can form a natural color pixel having a unique gradation. In addition, each of the red subpixel, the green subpixel, and the blue subpixel in FIG. 3 is referred to as a “subpixel”. The “pixel” of the present disclosure is a concept that includes both RGB set pixels and sub-pixels (pixels for each RGB primary color), and these are properly used depending on the object to be expressed. In the rectangular area corresponding to 4 × 4 pixels in FIG. 1, it is assumed that a defective portion is found between the row bank 52r3 and the row bank 52r4 in the column bank 51c3. If the ink material is applied and the formation of the organic light emitting layer is started while ignoring the existence of the defective part, ink leakage through the defective part occurs, and two adjacent banks with the row bank 51c3 as a boundary are generated. Color mixing occurs in the pixels G (2, 3) and B (3, 3). In the line bank method, since the height of the row bank is set low, the mixed color range extends to two adjacent sub-pixel columns via the column bank 51c3. As a result, as shown in FIG. 1B, all subpixels located at the coordinates of X = 2 and all subpixels located at the coordinates of X = 3 become dark spots (dark spots due to color mixing). FIG. 1C shows an organic EL display panel in which the mixed color range extends to all the sub-pixels in the column direction. In this organic EL display panel, a defective display due to color mixing has spread in the range of 1080 subpixels out of 1920 × 1080 RGB set pixels. Therefore, such an organic EL display panel cannot be shipped as a product. Therefore, bank repair is performed in the manufacture of a conventional line bank type organic EL display panel. In bank repair, two sub-pixels adjacent to the defective part and two sub-pixels positioned one above are selected as repair targets, and a weir is formed in a row bank that partitions these repair targets. The FIG. 2 (a) shows a layout of a plurality of rectangular regions in which weir regions are formed because there is a suspicion of color mixing. In this layout, G (2, 2), B (3, 2), G (3, 2), B (3, 3) are formed with weirs having the same height as the column bank.

  Since the thus formed weir has the same height as the row bank, even if the ink material flows in through the defective portion, the influence of the color mixture due to the flowing in as shown in FIG. It remains in the four sub-pixels surrounding. Even if color mixing of the ink material due to the defective portion occurs due to the repair due to such dam formation, the generated dark spots remain at two different color dark spots and two same color dark spots.

  The different color disappearance point is a dark spot generated when the organic light emitting layer of two rectangular regions continuous in the row direction falls into light emission failure, and the same color disappearance point is the organic light emission of two rectangular regions continuous in the column direction. It is a dark spot that occurs when the layer falls into a defective light emission. The same color discoloration point and the different color discoloration point include those caused by color mixture and those caused by forming a weir for column bank repair. This is because in the dam formation, the ink material does not reach the end of the portion where the repair material is discharged, and a short circuit occurs between the anode metal and the cathode.

  The problem here is the ratio of the defective portion to be found and the serious defective portion that causes color mixing. FIG. 1D shows a plurality of row banks in which no ink color mixture occurred in the subsequent organic light emitting layer forming step, although there were defective portions. Since the ink color mixture did not occur, even if such a sub-pixel is displayed, the sub-pixel does not become a dark spot. In the conventional bank repair, repair is performed on the periphery of a column bank where color mixing has not actually occurred, and the number of sub-pixels that become mischievous points is increased. FIG. 2C shows a sub-pixel that has become a dark spot due to the formation of a weir despite the absence of color mixing. In FIG. 2C, since the G sub-pixel and the B sub-pixel are dark spots, one RGB set is not formed. Since two RGB sets in which the G sub-pixel and the B sub-pixel are dark spots are consecutive in the column direction, the lack of pixels is recognized by the viewer.

  According to the study by the inventors, this ratio is about 10 to 1. However, if one of the ten defective portions causes color mixing, the substrate itself becomes defective. Therefore, as a safety measure, all detected defective portions are targeted for repair. FIG. 2D shows a pixel layout of the organic EL display panel in which repairs are made to the ten defective portions that have been found. Since there are ten pixel omissions due to a series of the same color disappearance points and different color disappearance points, it cannot be said that the display quality is high.

Even if multiple pixels in the column direction may become a dark spot, repairing a pixel that has a possibility of color mixture will increase the number of missing pixels and there is room for improvement. There is a problem that is large.
<Outline of Embodiment for Implementing the Present Disclosure>
1) As an aspect of the organic EL display panel, an organic EL display panel in which a plurality of pixels are arranged in a matrix,
A substrate,
A pixel electrode disposed at a position corresponding to each of a plurality of pixels on the substrate;
A plurality of row banks covering edges in the column direction of the pixel electrodes and extending in the row direction;
A plurality of column banks covering edges of the pixel electrodes in the row direction and extending in the column direction;
A plurality of organic light emitting layers formed in a rectangular region delimited by a plurality of adjacent column banks and a plurality of adjacent row banks;
A common electrode facing the pixel electrode,
A defect portion exists in any of the plurality of column banks, and the first rectangular region and the second rectangular region on both sides of the column bank in which the defect portion exists, and at the same column position as the first rectangular region In a third rectangular area and a fourth rectangular area at the same column position as the second rectangular area, a weir made of repair material is formed in a taller posture than the row bank,
At least one rectangular area without a weir is interposed between the first rectangular area and the third rectangular area and between the second rectangular area and the fourth rectangular area. And
Thereby, at least one rectangular area without a weir is interposed between the first rectangular area and the third rectangular area, or between the second rectangular area and the fourth rectangular area. Therefore, when no color mixture occurs in the line immediately above and directly below the pixel adjacent to the defective portion, the dark spots are dispersed and appear at the jumped positions. Since the number of dark spots is reduced and the viewer is not aware of missing pixels due to dark spot concentration, the occurrence of dark spots due to dam formation does not lead to display defects.

    2) As an aspect of the organic EL display panel in which any one of the third rectangular region and the fourth rectangular region is spaced apart, the first rectangular region and the third rectangular region are arranged in the column direction of the substrate. It is possible to adopt an aspect in which one rectangular region that is adjacent and does not have a weir is interposed between the second rectangular region and the fourth rectangular region. In this aspect, the number of occurrences of the same color disappearance point and the different color disappearance point is one, and the same color disappearance point and the different color disappearance point are not continuous. This makes it possible to manufacture a high-quality organic EL display panel that is not affected by the presence of defective portions in the column bank.

  3) As a mode in which both the third rectangular area and the fourth rectangular area are arranged apart from each other, the second rectangular area and the fourth rectangular area are provided between the first rectangular area and the third rectangular area. One rectangular area without the weir may be interposed between each area. In this aspect, the number of occurrences of the same color disappearance point is 0, the occurrence number of different color disappearance points is 2, and the same color disappearance point is not continuous. . This makes it possible to manufacture a high-quality organic EL display panel that is not affected by the presence of defective portions in the column bank.

  4) As a mode in which one of the third rectangular region and the fourth rectangular region is arranged apart and the other is arranged with a further distance, the first rectangular region and the third rectangular region are arranged between the first rectangular region and the third rectangular region. One rectangular region without a weir may be interposed, and two rectangular regions without the weir may be interposed between the second rectangular region and the fourth rectangular region. Since the number of different color dark spots is only one, the influence of missing pixels due to dark spot concentration is minimized. This makes it possible to manufacture a high-quality organic EL display panel that is not affected by the presence of defective portions in the column bank.

5) The height of the column bank from the substrate may be higher than that of the row bank.
6) As an aspect of the manufacturing method for manufacturing the organic EL display panel, a step of forming a pixel electrode at a position corresponding to each of a plurality of pixels on the substrate;
Forming a plurality of row banks so as to cover edges in the column direction of the pixel electrodes, and extending in the row direction;
Forming a plurality of column banks so as to cover edges in the row direction of the pixel electrodes, and extending in the column direction, thereby dividing a region on the substrate into a plurality of rectangular regions;
Detecting a defect from a plurality of formed row banks;
The first rectangular area and the second rectangular area on both sides of the column bank where the detected one defective portion exists, the third rectangular area at the same column position as the first rectangular area, and the same column position as the second rectangular area A step of forming a weir made of a repair material with a taller posture than the row bank in the fourth rectangular region in
Forming an organic light emitting layer by applying an ink containing an organic light emitting material to each of the plurality of rectangular regions and drying;
Forming a common electrode to face the pixel electrode;
A mode in which at least one rectangular region without a weir is interposed between the first rectangular region and the third rectangular region and between the second rectangular region and the fourth rectangular region. It can be. In this way, by selecting the third rectangular region and the fourth rectangular region, the weir that suppresses the flow of ink removes the non-dotted pixels from the first and second rectangular regions adjacent to the column bank in which the defective portion exists. Formed in separated rectangular areas. When no color mixture occurs in the line immediately above and immediately below the pixel adjacent to the defective portion, the pixels that become dark spots due to the weir installation occur every other line. Since the dark spots are dispersed and appear at the jumping positions, the continuous dark spots are reduced, and the occurrence of the dark spots due to the weir formation does not lead to display defects.

7) As an aspect of the manufacturing method for selecting either the third rectangular region or the fourth rectangular region apart,
In the row direction of the substrate, the first rectangular region and the third rectangular region are adjacent to each other, and a rectangular region without the weir is between the second rectangular region and the fourth rectangular region. One mode can be adopted. In this aspect, the number of occurrences of the same color discoloration point and the different color discoloration point is one, and the same color discoloration point and the different color discoloration point are not continuous. . This makes it possible to manufacture a high-quality organic EL display panel that is not affected by the presence of defective portions in the column bank.

8) As an aspect of the manufacturing method in which both the third rectangular area and the fourth rectangular area are arranged apart from each other,
One rectangular region without a weir can be interposed between the first rectangular region and the third rectangular region, and between the second rectangular region and the fourth rectangular region. .
In this aspect, the number of occurrences of the same color disappearance point is 0, the occurrence number of different color disappearance points is 2, and the same color disappearance point is not continuous. Disappear. This makes it possible to manufacture a high-quality organic EL display panel that is not affected by the presence of defective portions in the column bank.

  9) As an aspect of the manufacturing method in which one of the third rectangular region and the fourth rectangular region is arranged apart and the other is arranged further apart, the above-described method is performed between the first rectangular region and the third rectangular region. One rectangular region without a weir may be interposed, and two rectangular regions without the weir may be interposed between the second rectangular region and the fourth rectangular region. Since the number of occurrence of the different color dark spots is only one, the influence on the display quality due to the dark spot concentration is minimized. This makes it possible to manufacture a high-quality organic EL display panel that is not affected by the presence of defective portions in the column bank.

10) The height of the column bank from the substrate may be higher than that of the row bank.
<Embodiment 1>
[Overall configuration of organic EL display device]
FIG. 3 is a schematic block diagram illustrating a configuration of the organic EL display device 1 including the organic EL display panel 100 according to the first embodiment.

  As shown in FIG. 3, the organic EL display device 1 includes an organic EL display panel 100 and a drive control unit 101 connected thereto. The organic EL display panel 100 is a panel using an electroluminescent phenomenon of an organic material, and a plurality of organic EL elements are arranged in a matrix on a substrate as shown in FIG. The drive control unit 101 includes scanning line drive circuits 102 and 103, signal line drive circuits 104 and 105, and a control circuit 106.

The scanning line driving circuits 102 and 103 output a scanning line signal having a content for selecting one of a plurality of pixel lines constituting the frame image.
The signal line driving circuits 104 and 105 may select a pixel line selected by the scanning line signal if a scanning line signal having a content for selecting one of the plurality of pixel lines is output from the scanning line driving circuits 102 and 103. A line pixel signal is output to a plurality of organic EL elements belonging to. The line pixel signal consists of the luminance of each primary color component of each pixel of the line pixel (indicating how bright each primary color component of each pixel has), and is selected from a plurality of organic EL elements. The brightness value is supplied to the pixel line corresponding to the position. Then, each organic EL element has an amplified current Id (Y (i (i)) having a value corresponding to the luminance Y (i, j, k) of the kth primary color component of the pixel located at the coordinate (i, j). , j, k)) flows. Here, among the connection lines of the scanning line driving circuits 11 and 12 and the signal line driving circuits 13 and 14, those corresponding to the dark spots are disconnected, and weirs are formed in the rectangular areas corresponding to the dark spots. Therefore, there is an unapplied portion of ink, and a short circuit between a pixel electrode (to be described later) and a common electrode occurs in the unapplied portion. The arrangement of the drive control unit 101 with respect to the organic EL display panel 100 is not limited to this.

[Configuration of organic EL display panel]
FIG. 4 is a plan view schematically showing a schematic configuration viewed from the display surface side of the organic EL display panel 100. As shown in FIG. 4, row banks 12 r 1, 12 r 2, 12 r 3 are formed in the column direction on the display surface of the organic EL display panel 10. These row banks extend in the row direction to divide the plane of the organic EL display panel into a plurality of band-like regions. These band-like regions are regions selected by the scanning line signal and correspond to line pixels for one row of the frame image.

  The column banks 11c11, 11c21, 11c31, 11c41 are formed in the row direction. The column bank extends in the column direction on the plane of the organic EL display panel so that each of the plurality of band-shaped regions is divided into a plurality of rectangular regions (R (1,1), G (2,1), B (3, 1), R (4,1), G (5,1), B (6,1), R (7,1), G (8,1), R (1,2), G (2,2 ), B (3,2), R (4,2), G (5,2), B (6,2), R (7,2), G (8,2), R (1,3) , G (2,3), B (3,3), R (4,3), G (5,3), B (6,3), R (7,3), G (8,3)・ ・ ・ ・). These rectangular areas correspond to the sub-pixels of the RGB set pixels constituting the frame image to be displayed. The reference numerals of these rectangular areas are a combination of an alphabet indicating the primary color to be displayed (RGB distinction) and coordinate values. Below each rectangular area corresponding to the primary color sub-pixel, there is an organic EL element and a corresponding drive circuit. By setting the luminance to the organic EL elements of the red subpixel, green subpixel, and blue subpixel arranged in the row direction and causing them to emit light simultaneously, each primary color of RGB constitutes a natural color pixel having a unique gradation. be able to.

  FIG. 5 is a partially enlarged cross-sectional view of the organic EL display panel 100 taken along line AA ′ in FIG. The organic EL display panel 100 is a so-called top emission type, and the Z direction side is a display surface. As shown in FIG. 5, the organic EL display panel 100 includes, as main components, a base substrate 21, a pixel electrode 22, a hole injection layer 23, banks 11 c 11 and 11 c 21, an organic light emitting layer 25, an electron transport layer 26, and a common electrode. 27, a sealing layer 28 is provided. Then, an organic EL element having an organic light emitting layer 25 corresponding to any one of red (R), green (G), and blue (B) emission colors is used as a primary color subpixel, and as shown in FIG. Are arranged in a matrix.

[Base substrate]
The base substrate 21 includes a substrate body 21a, a TFT (thin film transistor) layer 21b, and an interlayer insulating layer 21c.
The substrate body portion 21a is a portion that becomes a base material of the organic EL display panel 100, and may be formed of any of insulating materials such as non-alkali glass, soda glass, polycarbonate resin, polyester resin, and alumina. it can.

The TFT layer 21b is provided for each primary color subpixel on the surface of the substrate body 21a, and a pixel circuit including a thin film transistor element is formed in each TFT layer 21b.
The interlayer insulating layer 21c is formed on the TFT layer 21b. The interlayer insulating layer 21c is made of an organic insulating material such as polyimide resin, acrylic resin, or novolak type phenol resin, or an inorganic insulating material such as SiO (silicon oxide) or SiN (silicon nitride). The TFT layer 21b and the pixel electrode 22 are formed. And has a function of flattening even if a step exists on the upper surface of the TFT layer 21b and suppressing the influence on the base surface on which the pixel electrode 22 is formed.

[Pixel electrode]
The pixel electrode 22 is a pixel electrode provided for each primary color sub-pixel. For example, Ag (silver), Al (aluminum), aluminum alloy, Mo (molybdenum), APC (silver, palladium, copper alloy) It consists of light-reflective conductive materials such as. In the present embodiment, the pixel electrode 22 is an anode.

A known transparent conductive film may be further provided on the surface of the pixel electrode 22. As a material of the transparent conductive film, for example, indium tin oxide (ITO) or indium zinc oxide (IZO) can be used. The transparent conductive film is interposed between the pixel electrode 22 and the hole injection layer 23 and has a function of improving the bonding property between the layers.
[Hole injection layer]
The hole injection layer 23 may be made of, for example, an oxide such as silver (Ag), molybdenum (Mo), chromium (Cr), vanadium (V), tungsten (W), nickel (Ni), iridium (Ir), or PEDOT. It is a layer made of a conductive polymer material such as (mixture of polythiophene and polystyrene sulfonic acid). Among the above, the hole injection layer 23 made of metal oxide has a function of injecting and transporting holes to the organic light emitting layer 25 in a stable manner or assisting the generation of holes.

[bank]
On the surface of the hole injection layer 23, a plurality of strip-like banks 11c11 and 11c21 are provided in parallel in a plan view extending in the Y direction. The banks 11c11 and 11c21 are made of an insulating organic material (for example, an acrylic resin, a polyimide resin, a novolac type phenol resin, or the like).

The cross section of each bank 11c11, 11c21 is trapezoidal as shown in FIG. 5, and among the band-like regions defined by row banks, the banks 11c11, 11c21 are defined by the banks 11c11, 11c21. A rectangular region is formed, and the organic light emitting layer 25 is formed there.
The banks 11c11 and 11c21 function as a structure that prevents the applied ink from overflowing when the organic light emitting layer 25 is formed by a wet method.

[Organic light emitting layer]
The organic light emitting layer 25 is a site where carriers (holes and electrons) recombine and emits light, and includes an organic material corresponding to any of R, G, and B colors. The organic light emitting layer 25 is formed in a groove-like concave space (rectangular region 20 in FIG. 5) that extends in the Y direction and is partitioned by the banks 11c11 and 11c21.

The organic light emitting layers 25 having different colors are disposed with the banks 11c11 and 11c21 interposed therebetween.
Examples of the material of the organic light emitting layer 25 include polyparaphenylene vinylene (PPV), polyfluorene, oxinoid compound, perylene compound, coumarin compound, azacoumarin compound, oxazole compound, oxadiazole compound, perinone compound, pyrrolopyrrole compound, naphthalene. Compound, anthracene compound, fluorene compound, fluoranthene compound, tetracene compound, pyrene compound, coronene compound, quinolone compound and azaquinolone compound, pyrazoline derivative and pyrazolone derivative, rhodamine compound, chrysene compound, phenanthrene compound, cyclopentadiene compound, stilbene compound, diphenylquinone Compound, styryl compound, butadiene compound, dicyanomethylenepyran compound, dicyanomethylenethiopyran compound , Fluorescein compound, pyrylium compound, thiapyrylium compound, serenapyrylium compound, telluropyrylium compound, aromatic ardadiene compound, oligophenylene compound, thioxanthene compound, cyanine compound, acridine compound, 8-hydroxyquinoline compound metal complex, 2-bipyridine compound And fluorescent materials such as Schiff salt and group III metal complexes, oxine metal complexes and rare earth complexes.

[Electron transport layer]
The electron transport layer 26 has a function of transporting electrons injected from the common electrode 27 to the organic light emitting layer 25. For example, an oxadiazole derivative (OXD), a triazole derivative (TAZ), a phenanthroline derivative (BCP, Bphen) or the like.
[Common electrode]
The common electrode 27 is formed of, for example, a light-transmitting material having conductivity such as ITO or IZO, and is provided over all primary color subpixels. In the present embodiment, the common electrode 27 is a cathode.

[Sealing layer]
The sealing layer 28 is provided to protect the hole injection layer 23, the organic light emitting layer 25, the electron transport layer 26, and the common electrode 27 from moisture and oxygen.
Although not shown, a black matrix, a color filter, or the like may be formed on the sealing layer 28.

[Display panel manufacturing method]
FIG. 6 is a schematic process diagram showing a manufacturing process of the organic EL display panel 100. FIG. 7 is a cross-sectional view schematically showing a bank forming process and a light emitting layer forming process in the manufacturing process of the organic EL display panel 100. A method of manufacturing the organic EL display panel 100 will be described with reference to FIGS. 5 and 7 based on the process diagram of FIG.

First, the TFT layer 21b is formed on the substrate body 21a (step S1).
Subsequently, an interlayer insulating layer 21c is formed on the TFT layer 21b by a photoresist method using an organic material having excellent insulating properties to obtain the base substrate 21 (step S2). The thickness of the interlayer insulating layer 21c is about 4 μm, for example. Although not shown in the sectional view of FIG. 5 and the process diagram of FIG. 7, a contact hole (not shown) is formed when the interlayer insulating layer 21c is formed.

Next, the pixel electrode 22 made of a metal material having a thickness of about 400 [nm] is formed on the base substrate 21 for each primary color sub-pixel by vacuum deposition or sputtering (step S3).
Subsequently, a hole injection layer 23 is formed by uniformly depositing tungsten oxide on the base substrate 21 and the pixel electrode 22 by sputtering or the like (step S4).
Next, banks 11c11 and 11c21 are formed (steps S5 to S10). First, a negative photosensitive resin composition is prepared as a bank material, and this bank material is uniformly applied on the hole injection layer 23 as shown in FIG.

As the bank material, a composition made of a thermosetting resin that is cured by applying heat is used. The composition includes a photopolymerization initiator that initiates polymerization by irradiation with UV light.
As a kind of resin, the thermosetting resin which has ethylenic double bonds, such as a (meth) acryloyl group, an allyl group, a vinyl group, a vinyloxy group, is mentioned, for example. Moreover, you may add the crosslinking agent which bridge | crosslinks with respect to these resin, for example, an epoxy compound, a polyisocyanate compound.

Further, a fluorinated polymer containing fluorine may be introduced into the resin structure. Examples of the fluorinated polymer include a photosensitive resist containing a fluorinated resin such as a fluorinated polyolefin resin, a fluorinated polyimide resin, and a fluorinated polyacrylic resin.
Specific examples of the resin into which the fluorinated polymer is introduced include LUMIFLON (registered trademark, Asahi Glass), which is a copolymer of fluoroethylene and vinyl ether.

By introducing fluorine into the resin, ink repellency can be imparted to the formed weir.
Alternatively, an ink repellent agent may be added to the resin. The amount of ink repellent added is 0.01 to 10 wt%. By making the addition amount of the ink repellent within this range, the storage stability of the resin composition is good, and the liquid repellency of the weir to be formed is also good. Subsequently, the applied bank material layer is patterned into a bank shape by photolithography (step S5).

That is, as shown in FIG. 7B, a mask having an opening corresponding to the pattern of the banks 11c11 and 11c21 to be formed is overlaid on the bank material layer and exposed from above the mask.
Thereafter, the bank material is patterned by washing out the excess bank material with an alkaline developer to form a bank pattern. As shown in FIG. 7C, the formed bodies (unfired banks) of the banks 11 c 11 to 11 c 31 are pattern-formed on the base substrate 21. A rectangular region 20 is formed between the molded bodies of the adjacent banks 11c11 to 11c31.

  Next, the formed bodies of the formed banks 11c11 to 11c31 are heated and preliminarily fired (step S6). As a heating method at the time of pre-baking, for example, as shown in FIG. 7 (d), in a hot air drying furnace, hot air is applied to the molded body of the banks 11 c 11 to 11 c 31 formed on the base substrate 21 and heated. In addition, it can also carry out by the method of irradiating a heat ray with an infrared lamp, and the method of heating with a hot plate.

The temperature of the base substrate 21 gradually increases with heating, and gradually decreases after maintaining for a certain period of time at the heating temperature T1, which is the maximum temperature.
The heating temperature T1 at this time is a temperature at which the thermosetting (polymerization reaction) of the bank material can proceed to some extent and does not reach the completion of the polymerization reaction. The heating time (time for maintaining at the heating temperature T1) is about 20 to 30 minutes.

Usually, when the thermosetting resin reaches 100 ° C. or higher, thermosetting is started and polymerization proceeds. Therefore, the heating temperature T1 is preferably set to 100 ° C. or higher.
On the other hand, when the heating temperature T1 is set to a high temperature of about 200 ° C., the polymerization of the thermosetting resin proceeds excessively at the preliminary baking stage, and the liquid repellency of the surface of the bank molded body after the main baking is likely to be impaired. Therefore, the heating temperature T1 is preferably set to a temperature lower than the heating temperature T2 at the time of the main firing, and is set to 150 ° C. or lower.

Next, the presence or absence of a defective portion in the molded body of each of the banks 11c11 to 11c31 is checked (step S7). If there is a defective portion, the two subpixels adjacent to the defective portion and the band-like region located above the two subpixels are located. The two sub-pixels to be identified are specified as repair targets (step S8).
After specifying the repair target in this way, the weir is formed by discharging the repair material along the row bank that divides the sub-pixel to be repaired (step S9).

As will be described in detail later, the weir formation is performed by applying a repair material to the rectangular region 20 between the molded bodies of the banks 11c11 to 11c31 and drying it in the vicinity of the detected defective portion. FIG. 7E shows a state where the repair material is applied to the rectangular region 20 adjacent to the molded body of the banks 11c11 to 11c31 where the defective portion exists, and the dam molded body 13 is formed.
After that, as shown in FIG. 7 (f), the formed bodies of the banks 11c11 to 11c31 and the formed body of the weirs are heated and subjected to main firing, so that the two row banks 11c11 and 11c21 and the row banks are formed. The intervening weir is completed and the repair of the defective portion is completed (step S10). In the main firing, the molded body and the weir molded body of the banks 11c11 to 11c31 are heated to complete the polymerization reaction of the thermosetting resin.

  As a heating method, as in the case of the pre-baking, in addition to a method in which hot air is applied to the molded body of the banks 11c11 to 11c31 formed on the base substrate 21 in a hot air drying furnace, heat rays are irradiated with an infrared lamp. And a method of heating with a hot plate can be used. Then, the temperature of the base substrate 21 gradually increases with heating, and gradually decreases after being maintained at a heating temperature T2 that is the maximum temperature for a certain period of time.

The heating temperature T2 in the main baking is set to a high temperature (200 ° C. to 220 ° C.) in order to complete the polymerization of the thermosetting resin, and the heating time is, for example, about 60 minutes.
FIG. 7F shows a state in which banks 11c11 and 11c21 are formed and weirs are formed by the main firing, that is, repaired banks 11c11 and 11c21 are formed.

  The bank 11c11, 11c21 formed in this way may be further subjected to a process of adjusting the contact angle of the surface of the bank 11c11, 11c21 with the ink applied in the next step. Alternatively, in order to impart liquid repellency to the surfaces of the banks 11c11 and 11c21, surface treatment may be performed with a predetermined alkaline solution, water, an organic solvent, or the like, or plasma treatment may be performed.

Subsequently, as shown in FIG. 7G, ink 25m for forming a light emitting layer is applied to the rectangular region 20 between the banks 11c11 and 11c21. This ink is a mixture of an organic material constituting the organic light emitting layer 25 and a solvent, and is applied to each rectangular region 20 using an ink jet method.
Then, the solvent contained in the layer of the applied ink 25m is evaporated and dried, and is heated and fired as necessary, so that the organic light emitting layer 25 is formed in each rectangular region 20 as shown in FIG. Is formed (step S11).

Next, the material constituting the electron transport layer 26 is formed on the organic light emitting layer 25 and the banks 11c11 and 11c21 by a vacuum vapor deposition method to form the electron transport layer 26 (step S12).
A material such as ITO or IZO is formed by sputtering or the like to form the common electrode 27 (step S13). Then, a light-transmitting material such as SiN or SiON is formed on the surface of the common electrode 27 by sputtering or CVD to form the sealing layer 28 (step S14). The organic EL display panel 100 is completed through the above steps.

[Detection of defective parts]
[Method to detect and repair defective bank]
First, a defective portion that causes ink color mixture will be described. The defective part includes a part that is generated when a foreign substance enters under or inside the bank molded body and a part that is generated when a part of the bank molded body is lost.

The former defective portion (defect portion caused by foreign matter entering under or inside the bank molded body) will be described. The foreign object is, for example, a metal piece derived from the manufacturing apparatus, or dust / dust that exists in the air. And dust is often a fiber piece.
When foreign matter enters the bank molded body, the foreign matter may penetrate the wall surface of the row bank to the adjacent rectangular area. Moreover, when a foreign substance enters under one bank molded object, the foreign substance may penetrate to the adjacent rectangular area. When the adhesion between the foreign matter and the bank material is poor, a gap is generated by the foreign matter inside or under the bank molded body, and the ink is unplugged. When the foreign matter is a fiber piece, the ink is absorbed by the foreign matter, and the foreign matter itself becomes a flow path, and the ink leaks to other rectangular areas.

  The latter defect part (defect part by the defect | deletion of a bank molded object) is demonstrated. Defects in the bank molded body are caused by exposure failure to the bank material layer. In such a poorly exposed portion, the bank material is not sufficiently polymerized. The bank molded body is destroyed by washing away the etching agent in the subsequent development process. As a result, ink color mixture occurs in the rectangular regions adjacent to each other through the broken row bank.

When the organic EL display panel 10 is manufactured using a panel in which a color mixture region is generated in the light emitting layer, the color mixture region emits light with a light emission color different from the original light emission color. Generally, when phosphors having different emission colors are mixed, the emission color of the phosphor having a long wavelength becomes dominant.
For example, a mixed color region generated by mixing red ink and green ink emits red light. Therefore, in the region that should emit light in green, the region that is a mixed color region emits light in red, and if this mixed color region is widened, it causes light emission color defects.

As described above, the portion where the foreign matter or breakage has occurred in the bank molded body is caused by the color mixture of inks having different emission colors and causes the emission color defect.
When foreign matter enters under or inside the bank molded body, the row bank 11 swells upward at that location and the bank height increases, and at the location where the bank molded body breaks down, the height of the row bank 11 decreases. .

Detection of defective portions in the molded bodies of the banks 11c11 to 11c31 is performed, for example, by photographing a surface image of the molded bodies of the banks 11c11 to 11c31 formed on the base substrate 21 and pattern inspection of the surface images.
FIG. 8 is a schematic configuration diagram showing an example of a repair device used for detecting a bank defect portion and repairing it. The repair device 200 includes a table 202 on which the base substrate 21 is placed and a head unit 210 to which an image sensor 211 and a dispenser 212 are attached. The table 202 can be moved in the Y direction based on an instruction from the controller 230, and the head unit 210 can be moved in the X direction and the Z direction according to an instruction from the controller 230.

Therefore, the image pickup device 211 and the dispenser 212 attached to the head unit 210 are in the X direction and Y direction with respect to the base substrate 21 above the base substrate 21 placed on the table 202 according to an instruction from the controller 230. Direction relative to the Z direction.
Using the repair device 200, image data on the upper surface of the base substrate 21 is acquired and moved in the storage unit 231 of the controller 230 while moving the imaging device 211 along the upper surface of the base substrate 21.

In the image data, the controller 230 compares the portions of the molded bodies of the banks 11c11 to 11c31 one after another, and detects a difference, thereby detecting a defective portion. When a defective part is detected, the position of the detected defective part (the position of the center O of the defective part in the X direction and the Y direction) is stored in the storage unit 231.
In addition, in such a detection process, there is a possibility that a defective part may be detected in the moldings of some banks 11c11 to 11c31 among the moldings of the banks 11c11 to 11c31 formed on the base substrate 21. There is also a possibility that the defect portion is zero in the molded bodies of all the banks 11c11 to 11c31. And when a defective part is detected by the molded object of any bank 11c11-11c31, the repair object is specified.

[How to repair banks with defective parts]
Next, a repair material for dam formation is applied from the dispenser 212 so as to surround the periphery of the defective portion on the base substrate 21 placed on the table 202 in the repair device 200 to form the dam. Thus, the molded bodies of the banks 11c11 to 11c31 are repaired.
The dispenser 212 provided in the repair device 200 is a needle-type dispenser, and a tank for storing a repair material is attached to the tip of the dispenser, and the needle 213 moves up and down so as to penetrate the tank 214. The repair material attached to 213 can be applied in units of microliters.

The needle 213 in the dispenser 212 is driven based on a control signal from the controller 230. As the repair material, a resin composition that is cured by applying light or heat can be used.
Examples of the resin include curable resins having an ethylenic double bond such as a (meth) acryloyl group, an allyl group, a vinyl group, and a vinyloxy group.

Moreover, you may add the crosslinking agent which bridge | crosslinks with respect to resin, for example, an epoxy compound and a polyisocyanate compound.
Moreover, you may use the fluoropolymer in which the fluorine was introduce | transduced in this resin structure.
By introducing fluorine into the resin of the repair material, ink repellency can be imparted to the weir formed. Alternatively, various ink repellent agents may be added to the resin. By making the addition amount of the ink repellent agent 0.01 to 10 wt%, the storage stability of the resin composition is good, and the ink repellency of the weir formed is also good.

  In addition, you may use the same thing as resin of the bank material which forms the molded object of the bank 11c11-11c31 as resin of repair material. However, in the case of the bank material, an acid component soluble in the alkali developer is contained, but it is preferable that the repair material forming the weir does not contain an acid component soluble in the alkali developer. This is because when the weir compact is formed, development is not performed, and if the acid component remains in the weir, the solvent resistance of the weir decreases.

To the repair material, a solvent and a photopolymerization initiator are appropriately added to such a resin composition.
As a solvent, it has the solubility with respect to resin, The solvent whose boiling point is about 150-250 degreeC can use 1 type, or 2 or more types.
Various commercially available photopolymerization initiators can be used as the photopolymerization initiator.
At the time of applying the repair material, the solid content of the repair material is adjusted to, for example, 20 to 90 wt%, and the viscosity is adjusted to, for example, 10 to 50 cP (centipoise).

The addition amount of a photoinitiator is 0.1-50 wt% with respect to the total solid content, for example, Preferably it is 5 weight%-30 weight%.
The formation of the dam body is performed by applying a repair material from the dispenser 212 to a plurality of positions set along a line (weir formation line) in which the dam 13 is to be formed in the rectangular region 20.

[Identify sub-pixels to be repaired]
In the controller 230 of the repair device 200, the image data of the molded body of the banks 11c11 to 11c31 and the position of the defective portion are stored as described above. In step S8, two subpixels adjacent to the defective portion are stored. And two subpixels located in the strip | belt-shaped area | region above it are specified as repair object. Here, as shown in FIG. 9, the defective portion exists in the j-th band-shaped region of the screen, and the sub pixel P (i, j) and the sub pixel P (i + 1, j) are present in the defective portion. It shall be next to each other. In this case, a sub-pixel to be repaired is selected from 2 × 3 sub-pixels or 2 × 4 sub-pixels having the sub-pixel P (i, j) as the lower left pixel. Such repair target selection patterns include those shown in FIGS. 10 (a) to 10 (c). FIG. 10A shows a selection pattern called a discoloration point repair, and P (i, j) and P (i + 1, j) adjacent to the defect portion and the (j−1) -th one above the selected pattern. The sub-pixel belonging to the belt-like region j-1 and the sub-pixel belonging to the j-2th belt-like region j-2 that is two levels higher are specified as the targets for dam formation.

FIG. 10B shows a selection pattern called the same-color-discolored dot repair, and P (i, j) and P (i + 1, j) adjacent to the defective portion and P (i, j) and P (i +1, j) Two subpixels belonging to the j-2th band-like region j-2 two above are specified as the targets for weir formation.
FIG. 10C shows a selection pattern called “same color & different color dark spot repair”, and P (i, j), P (i + 1, j), P (i, j), P adjacent to the defect portion. Subpixels belonging to the (j−2) -th band-shaped region j-2 that separates one band-shaped region from (i + 1, j), and P (i, j), P (i + 1, The sub-pixel belonging to the j-3th strip-shaped region j-3 that separates the two strip-shaped regions from j) is specified as a target for dam formation.

Thus, a target position for discharging the repair material is set at a position along the row bank of the sub-pixel selected as the repair target.
P1, P2, P3, P4, and P5 in the figure are target positions set along the row bank of each sub-pixel to be repaired. As shown in the figure, target points P1, P2, P3, and P4 are set along the row bank of subpixels selected as repair targets. FIG. 10D is a diagram schematically showing a cross section along the weir formation line.

The repair device 200 forms a weir molded body by sequentially discharging the repair material with the needle 213 at the target points P1, P2, P3, and P4 set along the row banks that divide the sub-pixels to be repaired. (Step S8 in FIG. 6).
11 (a) to 11 (g) are diagrams showing how the weir molded body 13 is formed by sequentially applying repair materials to the target points P1, P2,...

First, as shown in FIGS. 11A and 11B, the needle 213 and the tank 214 are positioned at the target point P1, the needle 213 is moved downward, the repair material is attached to the needle 213, and the needle 213 is moved. By approaching the target point P1, the repair material is discharged to the target point P1.
The repair material has fluidity until it is discharged, but after the discharge, the mountain shape is maintained, and as shown in FIG. 11C, a pile of the repair material is formed at the target point P1.

  Subsequently, as shown in FIG. 11D, the needle 213 is pulled up into the tank 214, and the needle 213 and the tank 214 are moved to the target point P2. Then, the repair material is discharged to the target point P2 by moving the needle 213 downward and bringing the needle 213 to which the repair material is attached closer to the target point P2. As a result, as shown in FIG. 10E, the peak of the repair material formed at the target point P2 is connected to the peak of the repair material formed at the target point P1.

  Subsequently, as shown in FIG. 10 (f), the needle 213 is pulled up and moved to the target point P3. Similarly, a pile of repair material is formed at the target point P3 and connected to the pile of repair material at the target point P2. In this way, the piles of the repair material are connected in a shape extending from the molded body of the banks 11c11 to 11c31 having the defective portion to the molded body of the adjacent banks 11c11 to 11c31. Then, the applied pile of repair material is dried and exposed as necessary to form a weir molded body. In the subsequent main firing step, the applied repair material is cured, so that a weir having more stable physical properties is formed. Which of the repair target selection patterns shown in FIGS. 10 (a) to 10 (c) is used depends on the distribution of dark spots in the periphery of the defective portion. Determine.

  FIG. 12 is a flowchart showing a repair target identification procedure. Steps L1 to L3 in this flowchart define a loop structure with the variable m as a control variable. The variable m is a variable that indicates each of the plurality of defective portions found in the previous inspection process. In the flowchart of FIG. 12, the variable m is initialized (step L1), and the processes of steps J1 to J3 and steps S20 to S24 are executed. The continuation condition for this loop is that the variable m is equal to or less than the maximum number (Yes in step L2). In this case, the variable m is incremented (step L3) and the process returns to immediately after step L1. An end condition for such a loop is that the variable m exceeds the maximum number of defective parts found (No in step L2).

  The processing performed in the loop is as follows. The m-th defective sub-pixel is set to P (i, j) (step S20), and a determination step including steps J1, J2, and J3 is executed. Step J1 determines whether there is no peripheral dark spot pixel in the range of 2 × 4 subpixels where P (i, j) is the lower left subpixel, and it is possible to secure a 2 × 4 subpixel. It is a judgment. Here, the peripheral dark spot pixel is a sub-pixel that becomes a dark spot due to the presence of the 1st to (m-1) th defective portions. In this flowchart, sub-pixels to be repaired are selected so as not to cause continuity with such peripheral dark spot pixels. If Step J1 is Yes, the repair that needs to secure the widest area, that is, the same color & different color disappearance repair is executed (Step S21). Step J2 determines whether there are no peripheral dark pixels in the range of 2 × 3 sub-pixels with P (i, j) as the lower left pixel, and 2 × 3 sub-pixels can be secured. It is. Of the plurality of column banks of the organic EL display panel, 2 × 4 sub-pixels that exist at the left and right ends in the row direction or the column direction and have P (i, j) as the lower left sub-pixel, 2 × 3 If the sub-pixel cannot be secured, the determinations in steps J1 and J2 are No. The same applies to the case where there are dark spots due to other defective portions.

When Step J1 is No and Step J2 is No, it is assumed that repair that does not require the most pixel area is executed, that is, 2 × 2 sub-pixels surrounding the defective portion are specified as repair targets (Step S22).
Even if Step J1 is No, if Step J2 is Yes, the same color dark spot repair and the different color dark spot repair are selectively executed according to the positions of the peripheral dark spot pixels. Step J3 is a determination as to whether one of P (i, j-3) and P (i + 1, j-3) is not a peripheral dark spot pixel. If only one is not a peripheral dark spot pixel, a different color dark spot repair is executed (step S23). If both are not peripheral dark spot pixels, the same color dark spot repair is executed (step S24).

[Discolored spot repair]
FIG. 13A is a flowchart showing a processing procedure for repairing a different color blinking point. Of P (i, j-3) and P (i + 1, j-3), the X coordinate of the peripheral non-disappearing pixel is set to dstX (step S32), P (i, j-3), P (i Among the +1, j-3), the X coordinate of the peripheral dark spot pixel is set as UndstX (step S33). Then, weirs are formed along the upper row bank of P (i, j), (i + 1, j) and the row bank at the lower end of P (dstX, j-2), (undstX, j−1) (step S34). ).

  As a situation where the different color dark spot repair is applied, a situation where defective portions and dark spots are distributed as shown in FIG. In this situation, G (2, 13) and B (3, 13) are adjacent to the defective part, and the sub-pixel G (2, 10) three above G (2, 13) becomes the dark spot. Shows the situation. In this situation, when the processes of FIGS. 12 and 13 are executed, G (2, 13) becomes P (i, j), B (3, 13) becomes P (i + 1, j), and dstX Is set to X = 3, and undstX is set to X = 2 (S32 and S33 in FIG. 13A). This is because three points above B (3, 13) are not a dark spot. Therefore, as shown in FIG. 13 (b), weirs 13c23 and weirs 13c33 are formed along the row banks at the lower end of G (2, 13) and B (3, 13) adjacent to the defective part, A weir 13c22 and a weir 13c31 are formed along the row bank at the upper end of G (2, 12) and B (3, 11) (S34 in FIG. 13A). Consecutive counts of dark spots by the weirs thus formed will be one different color dark spot count and one same color dark spot count. As a result, there is one RGB set in which the G sub-pixel and B sub-pixel become dark spots in the band-like area to which the missing part belongs, and the RGB area in which the G sub-pixel becomes dark spot in the band-like area above it. There is one set pixel and one RGB set pixel in which the B sub pixel is a dark spot. Since there is only one RGB set in which two sub-pixels become dark spots due to the interposition of sub-pixels in which no weir is formed, the user is not aware of missing sub-pixels. Further, since the dark spots are not continuous at the same row position, the user is not aware of the presence of dark spots.

  On the other hand, when color mixing occurs, as shown in FIG. 14C, the color mixing extends to the sub-pixels interposed in the two belt-like regions that are the targets of dam formation. Therefore, when color mixture occurs, the range of the same color disappearance point is expanded as compared with the repair shown in FIG. 2 (repair for 2 × 2 sub-pixels). However, the ratio of the defect portion that does not cause color mixture to the defect portion that causes color mixture is 9 to 1, and the dark spot sequence of one isolated sub-pixel or the width of one pixel is almost invisible to human vision. Since it is not recognized, as shown in FIG. 14D, the viewer is not aware of the presence of the defective portion that does not cause color mixing. Therefore, the display quality is improved as compared with the case where repair is performed on 2 × 2 sub-pixels for all defective portions.

[Same color flash repair]
FIG. 13B is a flowchart showing a processing procedure of the same color disappearance repair. A weir is formed along the row bank at the lower end of P (i, j), (i + 1, j) and the row bank at the upper end of P (i, j-2), (i + 1, j-2) (step S35). As a situation where the same color dark spot repair is applied, as shown in FIG. 15A, there may be a situation where defective portions and dark spots are distributed. In this situation, G (2, 13) and B (3, 13) are adjacent to the defective portion, and the sub-pixels are separated from G (2, 13) and B (3, 13) by four band-like regions. A situation where a certain G (2, 9), B (3, 9) is a dark spot is shown. In such a situation, when the processing of FIGS. 12 and 13 is executed, G (2, 13) becomes P (i, j) and B (3, 13) becomes P (i + 1, j). Two sub-pixels that are separated from each other by one band-like region are selected as repair targets. This is because the two sub-pixels that separate the band-like region by 1 from P (i, j) and P (i + 1, j) are not dark spots. Therefore, as shown in FIG. 15 (b), weirs 13c23 and weirs 13c33 are formed along the row banks at the lower end of G (2, 13) and B (3, 13) adjacent to the defective part, together with them. , G (2, 11), and B (3, 11), the weirs 13c21 and 13c31 are formed along the row banks at the upper end (S35 in FIG. 13B). Due to the formation of the weir, the continuous count of different color disappearance points is two, but the same color disappearance point count becomes zero. In FIG. 15B, among the RGB sets, there is an RGB set in which the G sub-pixel and the B sub-pixel become the dark spot every other band-like region. By interposing pixels in which no weir is formed, RGB sets in which the G sub-pixel and B sub-pixel become dark spots appear in a dispersed manner, so that the user is not aware of pixel loss.

  On the other hand, when color mixing of the ink material occurs in the subsequent organic light emitting layer forming step, the arrangement of the dark dot pixels is as shown in FIG. When the color mixture occurs, the number of the same color disappearance points is “2” and the number of the different color disappearance points is “3”. Therefore, when the color mixture occurs, the number of the same color disappearance points and the number of the different color disappearance points are 2 × Compared to the case of repairing two sub-pixels, the number is increased. Further, the number of consecutive sub-pixels at the same color disappearance point is “3”, and the same color disappearance point is larger. However, as described above, since the number of defective portions that cause color mixing is actually small, even if the number of different color darkening points increases and the same color darkening point increases in the defective portion where color mixing occurs, display quality is improved. The impact on is small.

[Same color & different color vanishing point repair]
FIG. 13C is a flowchart showing a processing procedure for repairing the same color and different color disappearance point. First, it is determined whether both of P (i, j-4) and P (i + 1, j-4) are peripheral dark spot pixels or one is a peripheral dark spot pixel (step J5). If both are peripheral dot pixels, then P (i, j-2), P (i + 1, j− along the row bank at the bottom of P (i, j), (i + 1, j) A weir is formed along the row bank at the upper end of 3) (step S41). If one is a peripheral dark spot pixel, the X coordinate of P (i, j-4), P (i + 1, j-4) that is not a peripheral dark spot pixel is set to dstX (step S42), and P ( Among i, j-4) and P (i + 1, j-4), the X coordinate of the peripheral dark spot pixel is set to undstX (step S43). Then, weirs are formed along the upper row banks of P (i, j) and (i + 1, j) and the lower row banks of P (dstX, j−3) and (undstX, j−2) (step S44). ).

  As a situation where the same color & different color dark spot repair is applied, a situation in which defective portions and dark spots are distributed as shown in FIG. In this situation, G (2, 14) and B (3, 14) are adjacent to the defective part, and the sub-pixel G (2, 10) four above G (2, 14) becomes a dark spot. Shows the situation. In this situation, when the processes of FIGS. 12 and 13 are executed, G (2, 14) becomes P (i, j), B (3, 14) becomes P (i + 1, j), and X = 3 is selected as dstX, and X = 2 is selected as undstX (S42 and S43 in FIG. 13). This is because four points above P (i + 1, j) are not dark spots. Therefore, as shown in FIG. 16 (b), weirs 13c24 and 13c34 are formed along the row banks at the lower ends of G (2, 14) and B (3, 14) adjacent to the defective portion, and together with them A weir 13c22 and a weir 13c31 are formed along the row bank at the upper end of G (2, 12) and B (3, 11) (S44 in FIG. 13B). Due to the formation of the weir, the continuous count of different color disappearance points is one, but the same color disappearance point count is zero.

In FIG. 16B, an RGB set in which the G sub-pixel and the B sub-pixel are dark spots exists inside the band-shaped area, and a pixel in which no weir is formed interposes the band-shaped area. There is an RGB set in which only one R sub-pixel is a dark spot, and only one B sub-pixel is a dark spot.
On the other hand, when color mixing of the ink material occurs in the subsequent organic light emitting layer forming step, the arrangement of the dark spot pixels is as shown in FIG. When color mixing occurs, the number of same color disappearance points is 2, and the number of different color disappearance points is “3”. Further, since the continuous lengths of the different color disappearance points are 3 and 4, when color mixing occurs, the number of different color disappearance points increases and the same color disappearance point increases. However, as described above, since the number of defective portions that cause color mixing is actually small, even if the number of different color darkening points increases and the same color darkening point increases in the defective portion where color mixing occurs, display quality is improved. The impact on is small. FIG. 16D shows a layout of the organic EL display panel in which the same color extinction points and different color extinction points are repaired for all the ten defect portions. Of the ten defect portions, the dark spot appearing in the nine defect portions where no color mixture has occurred is only one different color dark spot. Degree of display quality degradation due to the presence of a continuous count of the same color blinking point and a continuous count of the same color blinking point as compared to performing repair on 2 × 2 sub-pixels for all defective portions Is small.

In this way, if weir formation is performed using any of the different color extinction point repair, the same color extinction point repair, and the same color & different color extinction point repair, it is registered in the table as a peripheral extinction pixel surrounded by such a weir, and the repair target is specified later. Use.
<Modification>
According to the arrangement of the peripheral dark spot pixels, the same color dark spot repair, the different color dark spot repair, the same color & different color fade repair, and the repair for 2 × 2 sub-pixels are selectively executed. Only one of the point repair, the different color extinction point repair, and the same color & different color extinction repair may be executed uniformly. In addition, the plane of the organic EL display panel is divided into the center of the screen and the edge of the screen, and for defects that exist in the center of the screen, the same color & different color flash point repair is executed, and the defects that exist in the edge of the screen The same color disappearance point repair and different color disappearance point repair may be executed. For multiple defects, you may select the same color flash point repair, different color flash point repair, the same color & different color flash repair, or the same color flash point repair, different color flash point repair, same color & different color flash repair. You may choose.

In the first embodiment, the weir is formed along the row bank. However, the weir may be formed by laminating a repair material on the upper surface of the row bank. Alternatively, the weir may be formed by discharging a repair material so as to cross two rectangular regions adjacent to the defective portion or surround the defective portion with an L shape.
By pre-calculation, the optimal defect processing order may be calculated in advance, that is, various combinations with different defect processing orders may be created, First, calculate the one that has fewer consecutive numbers. In such a calculation, weir formation may be performed using a combination calculated when the number of consecutive dark spots is the smallest.

In the first embodiment, the bank molded body is pre-fired before the defective portion is detected. However, the bank molded body may be pre-fired after the defective portion is detected, and the same effect is obtained.
In the above embodiment, the bank molded body is formed by the photolithography method, but the method for forming the bank molded body is not limited to the photolithography method.
For example, a bank molding can be formed by applying a bank material containing a thermosetting resin onto a substrate in a bank shape by an imprint method.

Even in that case, similarly to the above embodiment, by performing preliminary firing of the bank molded body, detection of a defective portion, and application of a repair material, it is possible to form a repaired bank and obtain the same effect. .
In the above embodiment, the case where light generated in the organic light emitting layer is extracted from the common electrode 27 side (top emission) has been described as an example. However, light generated in the organic light emitting layer may be extracted from the pixel electrode 22 side. Yes (bottom emission). In this case, the pixel electrode 22 is composed of a transparent electrode such as ITO, IZO (registered trademark), or SnO2, and the common electrode 27 is gold (Au), platinum (Pt), nickel (Ni), chromium (Cr). , Copper (Cu), tungsten (W), aluminum (Al), molybdenum (Mo), or a reflective electrode made of a metal element or an alloy such as silver (Ag). The common electrode 27 may be composed of a composite film of a reflective electrode and a transparent electrode. In the case of bottom emission, the color filter can be provided, for example, between the TFT layer 21b and the interlayer insulating layer 21c in the substrate.

  For example, the material and thickness of each layer described in the above embodiment, the film formation method, the film formation conditions, or the like are not limited. In the above embodiment, the pixel electrode that is the anode electrode is provided on the side closer to the substrate on which the TFT layer is provided, and the common electrode that is the cathode electrode is provided on the far side. The present invention is not limited to this, and the same can be applied to the case where the cathode electrode is provided on the side closer to the substrate on which the TFT layer is provided and the anode electrode is provided on the far side.

  (6) Each of the embodiments described above shows a preferred specific example of the embodiment of the present disclosure. Numerical values, shapes, materials, constituent elements, arrangement positions and connection forms of constituent elements, processes, order of processes, and the like shown in the embodiments are merely examples, and are not intended to limit the embodiments of the present disclosure. In addition, among the constituent elements in the embodiment, steps that are not described in the independent claims indicating the highest concept of the embodiment of the present disclosure are described as arbitrary constituent elements that constitute a more preferable form. Further, for easy understanding of the invention, the scales of the components shown in the above-described embodiments may be different from actual ones. Further, the embodiment of the present disclosure is not limited by the description of each embodiment described above, and can be appropriately changed without departing from the gist of the embodiment of the present disclosure. Furthermore, in the organic EL display panel, there are also components such as circuit components and lead wires on the substrate, but various modes can be implemented based on ordinary knowledge in the technical field regarding electrical wiring and electrical circuits. Since it is not directly relevant to the description of the embodiment of the present disclosure, the description is omitted. Each figure shown above is a schematic diagram, and is not necessarily illustrated strictly.

  The organic EL display panel and the manufacturing method thereof according to the present invention, for example, manufacture an organic EL display device used for various display devices for home use or public facilities, or for business use, television devices, displays for portable electronic devices, and the like. It is available to do.

DESCRIPTION OF SYMBOLS 1 Organic EL display device 10 Organic EL display panel 11c11-11c81 Column bank 12r1-12r3 Row bank 13 Weir 20 Concave region 21 Substrate 21a Substrate body 21b TFT layer 21c Interlayer insulating layer 22 Pixel electrode 23 Hole injection layer 25 Organic light emitting layer 26 Electron Transport Layer 27 Common Electrode 28 Sealing Layer 102, 103 Scanning Line Drive Circuit 104, 105 Signal Line Drive Circuit 106 Control Circuit 200 Repair Device 201 Base 202 Table 210 Head Section 211 Imaging Element 212 Dispenser 213 Needle 214 Tank 230 Controller 231 Storage

Claims (10)

An organic EL display panel in which a plurality of pixels are arranged in a matrix,
A substrate,
A pixel electrode disposed at a position corresponding to each of a plurality of pixels on the substrate;
A plurality of row banks covering edges in the column direction of the pixel electrodes and extending in the row direction;
A plurality of column banks covering edges of the pixel electrodes in the row direction and extending in the column direction;
A plurality of organic light emitting layers formed in a rectangular region delimited by a plurality of adjacent column banks and a plurality of adjacent row banks;
A common electrode facing the pixel electrode,
A defect portion exists in any of the plurality of column banks, and the first rectangular region and the second rectangular region on both sides of the column bank in which the defect portion exists, and at the same column position as the first rectangular region In a third rectangular area and a fourth rectangular area at the same column position as the second rectangular area, a weir made of repair material is formed in a taller posture than the row bank,
At least one rectangular area without a weir is interposed between the first rectangular area and the third rectangular area, or between the second rectangular area and the fourth rectangular area. An organic EL display panel. In the row direction of the substrate, the first rectangular region and the third rectangular region are adjacent to each other, and a rectangular region having no weir is provided between the second rectangular region and the fourth rectangular region. 2. The organic EL display panel according to claim 1, wherein two organic EL display panels are interposed. One rectangular region without the weir is interposed between the first rectangular region and the third rectangular region, and between the second rectangular region and the fourth rectangular region. 2. The organic EL display panel according to claim 1. One rectangular area without the weir is interposed between the first rectangular area and the third rectangular area, and the weir is between the second rectangular area and the fourth rectangular area. 2. The organic EL display panel according to claim 1, wherein two non-rectangular regions are interposed. The organic EL display panel according to claim 1, wherein a height of the column bank from the substrate is higher than that of the row bank. A manufacturing method for manufacturing an organic EL display panel in which a plurality of pixels are arranged in a matrix,
Forming a pixel electrode at a position corresponding to each of a plurality of pixels on the substrate;
Forming a plurality of row banks so as to cover edges in the column direction of the pixel electrodes, and extending in the row direction;
Forming a plurality of column banks so as to cover edges in the row direction of the pixel electrodes, and extending in the column direction, thereby dividing a region on the substrate into a plurality of rectangular regions;
Detecting a defect from a plurality of formed row banks;
The first rectangular area and the second rectangular area on both sides of the column bank where the detected one defective portion exists, the third rectangular area at the same column position as the first rectangular area, and the same column position as the second rectangular area A step of forming a weir made of a repair material with a taller posture than the row bank in the fourth rectangular region in
Forming an organic light emitting layer by applying an ink containing an organic light emitting material to each of the plurality of rectangular regions and drying;
Forming a common electrode to face the pixel electrode;
At least one rectangular area without a weir is interposed between the first rectangular area and the third rectangular area and between the second rectangular area and the fourth rectangular area. The manufacturing method characterized by this. In the row direction of the substrate, the first rectangular region and the third rectangular region are adjacent to each other, and a rectangular region without the weir is between the second rectangular region and the fourth rectangular region. 7. The production method according to claim 6, wherein one is interposed. One rectangular region without a weir is interposed between each of the first rectangular region and the third rectangular region, and between the second rectangular region and the fourth rectangular region. The manufacturing method of Claim 6. One rectangular area without the weir is interposed between the first rectangular area and the third rectangular area, and the weir is between the second rectangular area and the fourth rectangular area. The manufacturing method according to claim 6, wherein two non-rectangular regions are interposed. The manufacturing method according to claim 6, wherein a height of the column bank from the substrate is higher than that of the row bank.

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