JP2018180368A - Ic tag label and attaching method of ic tag label - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an IC tag label hard to be peeled off from an attached object while ensuring brittle function applicable to dresses accessories.SOLUTION: An IC tag label 10 is an IC tag label having brittle function, which includes an inlet 13, a label top paper 1, and a hot-melt layer 8. The inlet is constituted of an antenna 4 and an IC chip 3 formed on one surface of a base material film 5, and a brittle processed part 6 and an antenna 7 which are formed on the other surface. The label top paper is laminated at the IC chip side of the inlet via an adhesive layer 2. The hot-melt layer is disposed over the antenna formed on the brittle processed part.SELECTED DRAWING: Figure 1

Description

  The present invention relates to an IC tag label having a brittle function and a method of attaching the IC tag label.

  The contactless IC tag is a technology capable of exchanging information with a reader / writer (also referred to as a reader / writer) by wireless communication. It has already been put into practical use in the fields of access control, logistics control, production process control, shoplifting prevention, and verification of the authenticity of expensive products.

  In the field of proof of authenticity of expensive goods, for example, an IC tag label is used as a seal for a bottle containing expensive liquor. Initially, it was used as a seal simply by using an IC tag label, but it was not possible to prevent the fraud to replace the IC tag label and replace it with inexpensive liquor.

  Therefore, for the purpose of making it difficult to peel off the IC tag label that has been sealed once, an IC tag label having a brittle function has been developed. This technology is an IC tag label having a configuration in which the label structure is easily broken when the label is firmly attached to an adherend and the label is peeled off.

  For example, Patent Document 1 discloses an inlet formed of an IC chip and an antenna formed on a base material for the purpose of providing an IC tag label having a high brittleness effect and whose brittleness function is unlikely to be disturbed, and In an IC tag label in which an upper sheet and a lower sheet are laminated on the front and back surfaces of the inlet via an adhesive layer and the adhesive layer is on the side other than the IC tag of the lower sheet, the IC tag label is characterized by having a cut in the lower sheet. It is disclosed.

  In this IC tag label, the base sheet or the base sheet and the inlet film are cut without exposing the cut to the outer surface or outer peripheral edge of the label, and thus the brittle function is less likely to be disturbed, and at the same time the appearance is brittle. It is an excellent technology that makes it difficult to understand the function.

  With the expansion of the application range of the IC tag label, various adherends to which the IC tag label is attached have come out, but it is difficult to apply this technology to clothes such as clothing. The reason is that the IC tag label can not be firmly adhered to a cloth or a sweater like through the adhesive layer. It is necessary to devise a mounting method. In addition, when attached to a non-rigid adherend such as a fashion item, the bend of the adherend may break the part having the brittle function of the label. Moreover, it will peel off easily only by sticking through an adhesive layer.

  Therefore, an IC tag label that can be applied to clothes such as clothing, does not break even when the part having a brittle function is in the outer peripheral part of the tag, and is difficult to peel off from the adherend has been highly desired.

JP, 2015-82175, A

In view of the above-described circumstances, the present invention is applicable to an article of clothing or the like, and an object of the present invention is to provide an IC tag label which does not have a fragile function and which is difficult to peel off from an adherend. .

As means for solving the above problems, the invention according to claim 1 is an IC tag label having a brittle function,
It has an inlet, a label top paper, and a hot melt layer,
The inlet comprises an antenna and an IC chip formed on one side of the base film, and the other side is composed of a brittle processed portion and an antenna formed thereon.
The label top paper is laminated on the IC chip side of the inlet through the adhesive layer,
The hot melt layer is an IC tag label characterized by being provided on the brittle processed portion.

The invention according to claim 2 is a method for attaching the IC tag label according to claim 1 to a fashion item,
Bringing the IC tag label into close contact with the attachment position of the article of clothing;
Stitching the label top paper and the hot melt layer at the periphery 14 of the IC tag label;
Melt-adhering the clothing item and the IC tag label including the suture portion by thermally melting the hot melt layer;
It is a mounting method of the IC tag label characterized by including.

  According to the IC tag label of the present invention, since the inlet sandwiched between the label top paper and the hot melt layer is smaller than the label top paper and the hot melt layer, the label top paper and the hot melt layer are sewn on the peripheral edge portion 14 of the inlet. As a result, the method for attaching an IC tag label according to the present invention can be implemented.

  In addition, according to the method for attaching an IC tag label of the present invention, the IC tag label of the present invention is brought into close contact with the attachment position, where the IC tag label is sewn onto the label upper paper of the peripheral portion 14 of the inlet and the hot melt layer. After that, in order to heat-melt the hot melt layer including the sutured part and thermally bond the IC tag label to the accessory, the brittle processed part of the inlet located inside the sutured part of the peripheral part 14 of the IC tag label is hardened hot There is no bending by the melt layer. Therefore, after attaching the IC tag label of the present invention to a fashion item, it is difficult to easily remove the IC tag label from the fashion item, and the brittle function of the IC tag label can be maintained.

BRIEF DESCRIPTION OF THE DRAWINGS The schematic sectional drawing which shows an example of the laminated constitution of the IC tag label of this invention. It is an explanatory view explaining an example of a method of attaching the IC tag label of the present invention to a fashion item, where (a) is a state in which the IC tag label is placed on the fashion item, (b) is a sewing part by putting the IC tag label on the fashion item The stitched state, (c) shows a state in which the IC tag label is thermocompression-bonded to heat-melt the hot melt layer, and the seal portion is melt-bonded to the clothing including the stitched portion.

<IC tag label>
The IC tag label of the present invention will be described with reference to FIG.
The IC tag label 10 of the present invention is an IC tag label having a brittle function.
The IC tag label 10 of the present invention is provided with an inlet 13, a label top paper 1, and a hot melt layer 8.

The inlet 13 includes an antenna 4 and an IC chip 3 formed on one surface of the base film 5. The other surface of the base film 5 is composed of a brittle processed portion 6 and an antenna 7 formed thereon.
The label top paper 1 is laminated on the side of the inlet 13 on the IC chip 3 via the adhesive layer 2.
The hot melt layer 8 is provided on the antenna 7 formed on the brittle processed portion 6

(Base film)
As the base film 5, plastic base materials such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN), and polycarbonate can be used. Also,
A paper base material etc. can be used, and when improving destruction property especially, paper, a foaming system PET film, etc. are used suitably.

(antenna)
The antennas 4 and 7 are materials for which Al, Cu, Ag, conductive ink and the like are suitably used, but the materials are not limited to this as long as they are conductive. The frequency of the IC tag can be HF, UHF, LF or the like. The antennas 4 and 7 are not particularly limited as long as they can form a circuit with a conductive material, and various ones can be used. For example, the method of forming a metal thin film in pattern shape by etching, and what formed conductive ink in pattern shape by printing etc. is mentioned.

  As a method of forming a metal thin film in a pattern by etching, a conductive thin film such as aluminum or copper is covered in a pattern with an etchant resistant material, and the conductive thin film is partially removed by an etching solution. A method of forming a conductive thin film in a pattern can be used. A jumper wire may be provided on the back surface of the inlet base at a portion where the wires intersect, and an opening for connection may be provided on the base film 5 for connection, or may be separately bonded using a jumper wire member You may As a method of forming a conductive ink in a pattern by printing, it is preferable to use a conductive paste in which particles made of a conductive material are dissolved or dispersed in a binder. The above-mentioned conductive material is preferably silver-based, and examples of the conductive paste include evaporation-dried silver paste which contains a resin of a binder, a solvent and silver powder to obtain conductivity by contact thereof. However, the conductive material is not limited to silver, and for example, metal powders such as copper and nickel, conductive carbon powder, conductive fibers, conductive whiskers and the like are dissolved or dispersed in a solvent together with a resin binder. it can. As a printing method, it can print and form by printing systems, such as screen printing, flexographic printing, a gravure, offset printing, for example. It is also possible to print conductive ink with a printer.

(IC chip)
The IC chip 3 is electrically connected to the antenna 4 and mounted on the inlet 13. Usually, the antenna 4 is mounted after being formed.

(Brittled processing part)
The brittle processed portion 6 is not particularly limited as long as the adhesion with the antenna 7 formed thereon can be reduced. For example, an adhesive layer or a pressure-sensitive adhesive layer may be used as long as the adhesive force with the base film 5 is weaker than the adhesive force between the hot melt layer 8 of the antenna 7 and the surface on which the melt bonding is performed. Further, even in the case of an adhesive layer or a pressure-sensitive adhesive layer having an adhesive force equivalent to that of the hot melt layer 8, the adhesive force can be strengthened or weakened by the surface roughness of the antenna 7. In this case, the surface roughness of the antenna 7 on the side of the brittle processed portion 6 may be reduced. This is possible only when the antenna 7 is made of metal foil such as copper foil.

(Paper on the label)
A material that is easy to tear is desirable for the label sheet 1. In the case of paper, high quality paper, medium paper, art paper, coated paper, etc. can be suitably used. In cases other than paper, synthetic paper such as PET (polyethylene terephthalate), PP (polypropylene), PVC (polyvinyl chloride), etc. can be used. It is desirable that the thickness be as thin as about 50 μm or less because it is easier to break and the brittle function is enhanced.

(Adhesive layer)
As the adhesive layer 2, a solvent type, an aqueous emulsion type, a hot melt type, an adhesive, or the like can be used.

  As the solvent type, natural rubber, synthetic rubber containing block copolymer system as a main component, rosin and its ester, tackifier resin such as terpene resin, softener such as phthalate ester, phosphate ester, toluene, N- Adhesion of rosin and its ester, terpene resin, etc. to acrylic resin mainly composed of polyacrylic ester obtained by radical polymerization in a solvent such as hexane or in a solvent mainly composed of ethyl acetate and toluene There are those comprising a imparting resin, a plasticizer such as phthalic acid ester and phosphoric acid ester, and a curing agent such as diisocyanate and aziridinyl group compound.

  As an aqueous emulsion type, an acrylic resin mainly composed of a polyacrylic acid ester obtained by emulsion polymerization in water is used as an emulsion composed of an additive such as an antifoaming agent, a leveling agent, a thickener and a titanium dispersion, etc. There is.

(Hot melt layer)
The hot melt layer 8 is mainly composed of an ethylene-vinyl acetate copolymer, and any of the above-mentioned solvent type, aqueous emulsion type and hot melt type (solventless type) can be used, among which acrylic is preferred. A pressure-sensitive adhesive layer using a water-based emulsion-type pressure-sensitive adhesive containing a resin as a main resin is more preferable in terms of flexibility between rollers, and from the viewpoints of responding to environmental problems, safety and economy. Is also a more advantageous adhesive.

  In addition, polyvinyl acetate, ethylene-vinyl acetate copolymer, polyacrylic acid ester type, polyvinyl chloride type, natural rubber, synthetic rubber, vinyl acetate-acrylic acid ester copolymer, polyester type, polyurethane type, etc. Water-insoluble polymer materials can also be used.

  These materials can be set within the aforementioned range of adhesion strength by optimization of additives, molecular weight and the like. The thickness is 10 to 100 μm. Most preferably, it is about 20 to 30 μm. However, from the results of the examples, it is preferable to use a substrateless adhesive.

<How to attach IC tag label>
The method for attaching an IC tag label of the present invention is a method for attaching an IC tag label to a fashion item.
This will be described with reference to FIG.
In the method of attaching the IC tag label 10 of the present invention, the step of bringing the IC tag label 10 into close contact with the attachment position of the accessory 11 (FIG. 2A), and the label top paper 1 and the hot melt layer at the peripheral portion 14 of the IC tag label 10 8 (Fig. 2 (b)) of suturing the fabric with the fabric 8 (Fig. 2 (b)), and a process of melting and bonding the decorative article 11 and the IC tag label 10 including the suture portion 12 by heat melting the hot melt layer 8 (Fig. 2) (C)) and.

  FIG. 2A shows a state in which the hot melt layer 8 side of the IC tag label 10 is brought into close contact with the position where the IC tag label 10 of the accessory 11 is attached. The state of being in close contact includes, for example, placing the clothes 11 on a table and simply placing the IC tag label 10 thereon. When placed, the peripheral edge portion 14 of the label top paper 1 adhered via the adhesive material layer 2 hangs down on the hot melt layer 8 by gravity and comes in contact with the surface of the inlet on which the IC chip 3 is mounted. In this state, the hot melt layer 8 is only in contact with the clothes 11 and is not bonded. The peripheral portion 14 refers to the peripheral portion of the IC tag label 10 of the present invention.

  Next, FIG. 2B shows a state in which the label-covered paper 1 and the hot melt layer 8 are sewn together with the clothes 11 and the stitching part 12 at the peripheral part 14 in FIG. 2A. The method of suturing may be normal stitching. For example, sewing may be performed using a sewing machine, or manual sewing may be performed. In this state, the IC tag label 10 can be removed by unsealing the sewn yarn of the suture portion 12.

  Next, FIG. 2C shows a state in which the hot melt layer 8 is thermally melted in the state of FIG. 2B and the decorative article 11 and the hot melt layer are melt-bonded. The hot melt layer 8 is changed to a hot melt hot melt layer 8 '. In this state, the suture portion 12 is also melt-bonded to the clothes 11 by the hot-melt layer 8 'which is heat-melted. The hot-melted hot melt layer 8 ′ penetrates into the interior of the decorative article 11 and solidifies. Therefore, the IC tag label 10 is melt-bonded by the hot-melt 8 ′ that is heat-melted to the clothes 11 and solidified in the area inside from the peripheral portion 14 including the stitching portion 12.

  The IC tag label 10 melt-bonded to the clothes 11 by hot melt is difficult to bend because it is solidified. Therefore, no force is applied to the brittle processed portion 6 of the inlet, so the brittle function of the IC tag label 10 is maintained. The portion without the heat-melted hot melt layer 8 'outside the peripheral portion 14 of the IC tag label 10 can be bent because it is not solidified.

DESCRIPTION OF SYMBOLS 1 ... Label upper paper 2 ... Adhesive material layer 3 ... IC chip 4 ... Antenna 5 ... Base film 6 ... Brittle processing part 7 ... Antenna 8 ... hot melt Layer 8 ′ ··· Heat-melted hot melt layer 9 ··· Peelable layer 10 ··· IC tag label 11 ··· Clothing 12 ··· Stitching portion 13 ··· Inlet 14 ··· Peripheral edge

Claims (2)

An IC tag label having a brittle function,
It has an inlet, a label top paper, and a hot melt layer,
The inlet comprises an antenna and an IC chip formed on one side of the base film, and the other side is composed of a brittle processed portion and an antenna formed thereon.
The label top paper is laminated on the IC chip side of the inlet through the adhesive layer,
An IC tag label characterized in that a hot melt layer is provided on an antenna formed on a brittle processed portion. A method of attaching the IC tag label according to claim 1 to a fashion item,
Bringing the IC tag label into close contact with the attachment position of the article of clothing;
Stitching the label top paper and the hot melt layer at the periphery of the IC tag label;
Melt-adhering the clothing item and the IC tag label including the suture portion by thermally melting the hot melt layer;
A method of attaching an IC tag label, comprising: