JP2011186842A - Cloth ic tag - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a fabric IC tag capable of being used with natural sense of touch and also enhancing resistance to washing by hand in cleaning and impact. <P>SOLUTION: The cloth IC tag includes the fabric IC tag consisting of a fabric substrate, a printed antenna consisting of a conductive ink formed on one side of the fabric substrate, an IC chip connected to the antenna electrically or electromagnetically, and a protective member laminated so as to cover from above inlet containing the antenna and the IC chip and be adhered with the woven substrate. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a cloth IC tag (defined later), and more particularly to a tag with an IC that is used by being attached to clothes such as suits, shirts, trousers, skirts, or cloth-like products such as sheets, blankets, and towels.

  Furthermore, the present invention relates to a woven name IC tag used by weaving a name, a mark or the like.

  In the clothes such as suits, shirts, trousers, skirts, etc., and cloth-like products such as sheets, blankets, towels, etc., the present invention relates to clothing such as the country of manufacture, manufacturer name, material, washing guidelines, etc. Many of the information is attached as cloth-like tags. In addition, a piece of cloth with the manufacturer's name and mark displayed by embroidery is sewn on the lining of the suit, and a piece of cloth with the company name embroidered on the chest of work clothes and uniforms. There are many. A technique of combining an IC with such a tag or cloth and using it as a so-called IC tag is already known.

  On the other hand, the IC tag has various names such as an electronic tag, a wireless tag, a wireless IC tag, and an RF tag. As this IC tag, there is a woven IC tag in which a basic part constituting an IC tag product, for example, an IC chip and an inlet made of a small antenna are integrated into a seal label shape. The IC chip stores information related to clothing such as the country of manufacture, manufacturer, and material of clothing, and a dedicated reader / writer using radio frequency (RF) is used for reading. That is, since the ID number (information representing the solid) stored in the IC tag is read, it is also called an alias RFID tag. The antenna is used to emit information stored in the IC chip to a reader or the like by radio waves.

  Conventionally, as the base material of this IC inlet, for example, as shown in Patent Document 1, a tough transparent heat-resistant sheet that has been stretched, specifically, a PET (PET: polyethylene terephthalate) base material that is one of them. Is widely used (Patent Document 1).

  Conventionally, as shown in Patent Document 2, a woven fabric (base fabric) that is a piece of fabric is composed of gold and silver thread (conductive part) and silk thread (insulating part), and a wiring pattern of the gold and silver thread (conductive part) There is one in which an antenna having a conductive region formed by the above and an insulating region exhibiting insulation is attached to the shoulder of an outer jacket (Patent Document 2). That is, the document 2 describes application of an antenna made of gold and silver thread to RFID (Radio Frequency Identification).

JP 2008-276451 A JP 2009-44439 A

However, like the former, IC inlets (basic parts that make up IC tag products) that use a lot of pet (PET) base materials have the hardness and workability of pets (PET), inadequate sewing, etc. Therefore, it was not suitable for the use of tag processing and attaching it to clothes.
If the IC inlet is forcibly attached to clothes, the flexibility of the clothes and the texture of the clothes are impaired. Also, it had to be unnatural.
Furthermore, in particular, when an IC chip constituting an IC inlet is joined to a PET (PET) film, it is difficult to obtain an anchor effect, so the IC chip can be easily removed from the PET (PET) base material. It was not resistant to impact.
Therefore, it is unsuitable for application to clothes that require washing, and there has been no practical application.

Further, as in the latter case, a conductive region formed by a wiring pattern of a conductive portion in a woven fabric that is a fabric is formed by a gold-silver thread having a conductive portion showing conductivity and a silk yarn showing insulation, and an insulating slot. The wearable antenna is not suitable for mass production because it has a special configuration in which a woven fabric is formed with gold and silver threads and silk threads, and the antenna is configured with these threads.
Also, the antenna made of gold and silver thread on the base fabric has a high resistance value for use in RFID, and there is no description on how to provide an IC chip specifically, Further, since the gold and silver thread is formed by vapor-depositing a metal layer on a base layer made of PET (PET), it cannot be actually used as an RFID as it is.
In addition, like Patent Document 1, it is difficult to obtain an anchor effect, it is easy to remove an IC chip from a PET (PET) base material, it is not resistant to scrubbing and impact during washing, and is practical for use in clothing. It's not the direction.

The present invention has been made in view of these problems, and its purpose is a cloth IC tag that can be used with a natural feel even when attached to clothing, and can be improved in resistance to fouling and impact during washing. Is to provide.
Here, the meaning of the term “cloth IC tag” in the present invention is defined. The “cloth IC tag” is a cloth-like tag having an IC chip and an antenna, and is a tag (attachment piece) that is attached to a product. In the present invention, a manufacturer sewn on a lining of a suit. In addition, a cloth piece that displays an IC or an antenna as a cloth piece that displays a name sewn on a work clothes is also included. However, it may be referred to as a “name IC tag” by paying attention to the function of displaying the manufacturer or name, and the name displayed by weaving the manufacturer or name with embroidery etc. is particularly referred to as “weaving name IC tag”. There is.

  In order to achieve the above object, the present invention provides a fabric substrate (a chemical fiber material having equivalent flexibility), a printed antenna made of conductive ink formed on one side of the fabric substrate, and the antenna. A cloth IC tag is constituted by an IC chip that is electrically or electromagnetically coupled, and a protective member that is laminated so as to cover the antenna and the inlet including the IC chip and adheres to the cloth base material. It is a feature.

  In order to achieve the above object, the present invention provides a cloth substrate (a chemical fiber material having equivalent flexibility), a printed antenna made of conductive ink formed on one side of the cloth substrate, An IC chip that is electrically or electromagnetically coupled to the antenna, a protective member that protects the antenna, the cloth base, an inlet made of the antenna and the IC chip, and laminated so as to cover the protective member, A cloth IC tag is composed of a heat seal member bonded to one surface of the first cloth base material.

  In order to achieve the above object, the present invention comprises a cloth base (a chemical fiber material having equivalent flexibility), a heat seal member, and a conductive ink formed on one side of the heat seal member. A printed antenna; an IC chip that is electrically or electromagnetically coupled to the antenna; and a protective member that protects the antenna, the IC chip, and the like. The cloth IC tag is configured by being bonded so as to sandwich an inlet made of an IC chip.

  In order to achieve the above object, the present invention provides a cloth substrate (a chemical fiber material having equivalent flexibility), a cloth on which an IC chip and an electrode are formed, a cloth on which an antenna is formed, and the IC chip. The antenna includes a protective member that protects the electrode, the IC chip and the antenna are electromagnetically coupled via the electrode to form a tag, and the fabric tag is laminated to cover the tag. It consists of a heat seal member joined to the cloth base material.

  ADVANTAGE OF THE INVENTION According to this invention, the conventional subject can be corrected, the bad texture can be improved, and the cloth IC tag with washing fastness can be obtained. As a result, it can be applied to clothes and the like.

It is the block diagram which showed typically the cross section of the woven name IC tag of the simple direct system which shows one Example of this invention. It is the block diagram which showed typically the cross section of the woven name IC tag of the bonding system which shows the other Example of this invention. It is the block diagram which showed typically the cross section of the woven name IC tag of the direct system which shows the other Example of this invention. It is the block diagram which showed typically the cross section of the tally type woven name IC tag which shows the further another Example of this invention. It is a figure which shows the woven name cloth surface etc. of the woven name IC tag which shows one Example of this invention. It is a figure which shows the woven name cloth back surface etc. of the woven name IC tag which shows one Example of this invention.

The fabric IC tag, particularly the woven name IC tag, is realized based on a protective member that protects a woven name base fabric, an inlet (printed antenna, IC chip), and the like.
Hereinafter, an embodiment of the present invention will be described with reference to the drawings, taking a woven name IC tag as an example of a cloth IC tag. In the present invention, the name includes all marks such as marks, logos, figures as well as names and company names.
First, the woven name IC tag is configured as shown in FIGS. 5 and 6, for example. FIG. 5 is a view showing the surface of the woven name cloth and its thickness of the woven name IC tag, and FIG. 6 is a view showing the back face of the woven name cloth and its thickness.

In the same figure, the woven name IC tag includes a woven name base material 1, and the surface 11 of the base material is formed by a well-known method such as printing or embroidery as shown in FIG. Has been. As shown in FIG. 6, a cloth inlet 23 including the IC chip 3 and the antenna 2 is formed on the back surface 12 of the substrate 1. The thickness t of the side surfaces 13 and 14 of the substrate 1 is configured to be 2 mm or less. These make it possible to use for clothing and the like. As the IC chip 3, in addition to known solid-state information, unique information according to the user, that is, information storing product warranty information, material component identification information, and the like may be used. As a result, for example, inventory management and recycling management can be performed on clothes and the like with the main weaving name IC tag. For example, as shown in FIG. 6, the antenna 2 may be formed in a crank shape symmetrical with respect to the left and right points about the IC chip 3.
Examples of the woven name IC tag of the present invention will be described below.

FIG. 1 is a cross-sectional view of an essential part schematically showing the configuration of a simplified direct method for a woven IC tag showing an embodiment of the present invention.
In FIG. 1, a woven name base material 1 in which a predetermined name is woven is a cloth that can be printed, or has a softness similar to a cloth, and is formed into a film-like chemical fiber material such as polyester chemical fiber, non-woven fabric, Examples include washing-resistant paper. Therefore, in the present invention, the cloth IC includes not only a cloth as a base material but also a chemical fiber material, a non-woven fabric, and a paper-resistant paper.

  Further, for example, in the cloth fabric, there are acetate satin (acetate satin weave), polyester satin (poloester satin weave), and in this specific example, polyester satin is preferable to acetate satin in view of fastness to washing. Many of these base materials, especially cloth fabrics, have an anchor effect of an adhesive when bonding an IC chip, and the bonding strength of the IC chip is characterized in that a bonding effect stronger than that of ordinary PET equipment can be obtained.

  The antenna 2 is printed with conductive ink mainly composed of silver on the woven name base material 1 (back surface / see FIG. 6) so as to face the name of the name base material 1 (front surface / see FIG. 5). It is constituted by. For example, a predetermined antenna printing pattern is printed on a base fabric (polyester satin) having an anchor effect directly by a conductive ink (manufactured by REXALPHA Toyo Ink) by a silk screen method. As the printing, a gravure printing method is also possible, but silkscreen printing is more effective from the thickness of the conductive ink film that the predetermined resistance value of the antenna can be easily obtained. Further, as the shape of the antenna 2, for example, as shown in FIG. 6, it is formed point-symmetrically with respect to the center position where the IC chip is mounted, and is formed in a crank shape so that the length thereof is formed in a straight line. It can be configured longer than

  The IC chip 3 records information representing a solid, for example, information that can specify a manufacturer, a material, and the like related to a product. The IC chip (Monza 2 Inpinj) is usually attached to the base fabric of the woven name base material 1. Bonding is performed in the same manner as the manufacturing method of the IC inlet being performed, and it is created as a cloth-based IC inlet.

  Reference numeral 4 denotes a protective member formed on the surface of the base fabric of the woven name base material 1 so as to protect the IC inlet (see FIG. 6) including the printed antenna 2 and the IC chip 3. For example, it is formed of a protective resin layer such as a urethane-based or vinyl chloride-based ink layer, and is provided for the purpose of preventing the antenna 2 from being oxidized, protecting the IC chip, and preventing falling off.

  The protective resin layer of the protective member 4 used on the surface of the inlet (the basic component of IC tag products, IC ink and printed antenna) does not impair flexibility, and the substrate 1 is firmly bonded to the base fabric. Is preferably made of a material that can secure the above. For example, it is used as an adhesive for vinyl chloride sol-type ink used for T-shirt pattern printing, silylated urethane resin used for a wide range of versatile adhesives, or clothing hemming tape. Polyamide resin and hot melt that are used can be used.

  Although the woven name IC tag is configured as described above, according to the IC tag of the embodiment, a flexible cloth-based IC tag can be obtained. Further, combined with the anchor effect at the time of bonding of the IC chip 3 to the base cloth and the strong adhesion effect of the protective member (protective resin layer) 4 to the base cloth 1, further prevention of falling off, that is, the IC chip or the printed antenna 2 is achieved. Can prevent falling off the base fabric.

  Further, according to the main weaving name IC tag, the main weaving name IC tag was attached to, for example, clothes, and the clothes were washed. As a result, the main weaving name IC tag could sufficiently withstand twisting and impact during washing. Further, according to the experiment results of the present applicant, the most suitable protective resin layer was coating of silylated urethane resin (manufactured by Konishi Co., Ltd.) or laminated laminate of polyamide film (manufactured by Nippon Matai). .

  The main name IC tag can be attached to clothing that requires washing. Therefore, it is important to suppress the thickness of the woven name IC tag (the dimension of the thickness portion t in FIGS. 5 and 6) to 2 mm or less. According to the present applicant, it is confirmed that the condition can be cleared by a prototype or the like.

  FIG. 2: is principal part sectional drawing which shows roughly the structure of the bonding system of the woven IC tag which shows the other Example of this invention. In the figure, reference numeral 5 denotes a heat seal member formed so as to cover the woven name base material 1, the antenna 2, the IC chip 3, the protective member 4, etc., and the member is made of, for example, a polyamide layer. In the drawing, the woven name base material 1 and other members are shown separately, but these are the protective member 4, IC chip 3, antenna 2, and heat seal member 5 laminated on the woven name base material 1. Configured to be.

As an application example of this embodiment, in addition to the above-described embodiment, that is, a woven name base material 1 ′ or a cloth fabric 1 ′ is prepared as a lamination partner separately from the woven name base material 1, Covering the IC chip 3, the cloth inlet including the printed antenna 2, and the protective resin layer 4 that protects the IC chip of the inlet with the woven name base material 1 'or the cloth fabric 1' and having a thermal adhesive property It is good also as a woven name IC tag integrated with the resin layer 5, for example, the heat-sealing polyamide resin or hot melt (resin for laminating such as hemming tape).
In short, the woven name IC tag shown in Example 1 is formed into a bag shape with the woven name base material 1 and another woven name base material 1 'or cloth, and these are configured to wrap the IC tag. .

  This embodiment can be said to be an IC inlet integrated woven name IC tag having a laminated structure of sandwich type inlets. This tag is not limited to cloth fabrics and woven name base materials, but is an IC tag laminated and laminated with an adhesive layer sandwiched between them as a protective resin layer 4. For example, it can be used as a general laundry tag.

  The example of the basic structure in the present embodiment is composed of a fabric base material of a woven name base material / a silylated urethane resin layer constituting an protective member / IC inlet / a polyamide resin layer constituting an heat seal member / IC inlet.

  FIG. 3 is a cross-sectional view of an essential part schematically showing the structure of a direct system of a woven IC tag showing still another embodiment of the present invention. In FIG. 3, reference numeral 5 denotes a heat-sealable heat seal member, and a polyamide resin film or a urethane resin film is used for the member, for example. The film is printed with a pattern that constitutes the antenna 2 with conductive ink, and the IC chip 3 is electrically joined to the antenna. The bonding of the IC chip 3 to the antenna may be either direct bonding or a strap method.

  That is, in this embodiment, an IC inlet including the IC chip 3 and the antenna 2 is provided on the heat seal film side first, and this is directly bonded to the woven name member or the base fabric by heat sealing and directly integrated. Is. Specifically, the antenna pattern is printed directly on the heat-sealable polyamide resin film or urethane resin film with conductive ink mainly composed of silver, or the antenna pattern is formed by etching, and the IC chip is attached. A woven name IC tag that is integrally bonded to a woven name base material or a base fabric with the IC inlet of the heat sealable film base material inside.

  Here, the same resin layer may be thinly provided in advance on the woven name base material 1 side, and the IC inlet may be embedded in the resin layer. The resin layer may be a film that is flexible, can be printed, has heat sealability, or is provided with a heat sealable member. Considering that the IC tag is attached to clothes, and considering the texture and heat seal bonding strength, a polyamide film or a urethane film is desirable.

  Further, the formation of antennas by etching is not excluded, and the base material can also be cited as a candidate if the base film has a proper etching property. Such a method is effective for producing a stable integrated IC tag when there is a concern that the ink film of the antenna printing may be broken due to large unevenness on the back surface of the woven name or when direct IC chip bonding is difficult. .

  FIG. 4 is a cross-sectional view of an essential part schematically showing the structure of a tally system for a woven IC tag showing still another embodiment of the present invention. A type in which an IC tag is bonded by a micro strap method is shown, and the strap is provided in advance on a heat-sealable film of the other side.

  In the figure, reference numeral 6 denotes a cloth tag portion, which is formed by superimposing a cloth 61 on which an electrode 62 and an IC chip 3 are formed and a cloth 61 'on which an antenna 2 is formed. The electrode 62 and the IC chip 3 are bonded with a micro strap tape 63. As illustrated, the antenna 2 and the electrode 62 are arranged to face each other and are electromagnetically coupled. That is, two electrodes 62 are provided opposite to a cloth 61 to which the IC chip 3 is attached, the IC chip 3 is connected between the electrodes, the antenna 2 provided on the cloth 61 ′ is arranged oppositely, and the antenna 2 And the electrode 21 are electromagnetically coupled.

The cloth tag portion 6 is coated with the protective resin 4 after the IC chip 3 is bonded to the cloth 61. The heat seal member 5 is affixed to the woven name base material 1 so as to cover the periphery of the cloth tag portion from above the cloth tag portion 6. Here, the cloth 61 ′ side of the cloth tag portion 6 is provided in the heat seal member 5 in advance.
In the drawings, some components are shown separately, but these are integrally formed in a stacked manner.

  If the base material (cloth 61) to which the IC chip 3 is bonded is a base material capable of etching a portion facing the base material (cloth 61 ') on which the conductive portion 3 constituting the antenna is formed, it is provided by etching. Also good. Alternatively, it may be provided by a printing method, but it is important to perform reliable alignment and secure heat seal bonding so that the periphery of the IC chip does not shift so that the antenna of the conductive portion 2 and the IC chip 3 are securely connected. is there.

  As described above, the present embodiment is an IC tag in which a base cloth on which an antenna is printed and a chemical fiber material are aligned and laminated using a micro strap provided on a heat-sealable film base. is there. The area around the micro strap is firmly bonded to the other base material due to the heat-seal base, which not only increases the fastness to washing, but also secures the antenna (3 ') printed on the opposite side of the micro strap IC chip. It joins and a communication function is ensured. Further, according to the present embodiment, the degree of freedom of the pattern of the antenna 2 is increased, which is effective in manufacturing.

  As in each of the embodiments described above, the woven name base fabric and the antenna that is a component of the IC inlet, and the IC chip to be bonded to the antenna, the resin layer that protects them, and the heat-sealable adhesive resin layer are combined. In the woven name IC tag based on the flexible cloth fabric, the IC chip 3 is attached by a conventional bonding method or microstrap method such as a conductive adhesive or a UV curable adhesive. A method that can ensure the conductivity reliably is appropriately selected according to the uneven shape of the substrate surface, the surface state of the conductive yarn, and the like. In particular, when the substrate is a cloth base, the anchor effect of the adhesive is increased, and it has been confirmed that the IC chip adheres firmly to the base cloth.

  By providing a protective member (protective resin layer) that adheres firmly to the base material on the inlet configured as described above, the periphery of the member IC chip 3 and the periphery of the antenna can be firmly fixed. It is possible to prevent breakage of the antenna and peeling of the IC chip joint against impact, and to obtain a flexible IC tag with higher washing fastness. The applicant has confirmed this through experiments.

  Although the woven IC tag of the present invention is premised on application to clothing, it can also be applied to clothing that requires washing and fastness.

1 Woven name material (base fabric)
1 'cloth substrate 2 printed antenna 3 IC chip 4 protective member (protective resin layer)
5 heat seal member 6 cloth tag portion 61, 61 'cloth 62 electrode 63 micro strap tape

Claims (11)

  A cloth substrate, a printed antenna made of conductive ink formed on one side of the cloth substrate, an IC chip electrically or electromagnetically coupled to the antenna, the antenna, and an inlet including the IC chip A cloth IC tag comprising: a protective member which is laminated so as to cover from above and adheres to the cloth base material.   The cloth IC tag according to claim 1, wherein the cloth base is made of cloth cloth or a woven name.   The cloth IC tag according to claim 2, wherein the cloth fabric or woven name is made of acetate satin or polyester satin, and the protective member is made of urethane resin or bisol chloride ink layer.   A first cloth base; a printed antenna made of conductive ink formed on one side of the first cloth base; an IC chip electrically or electromagnetically coupled to the antenna; and the IC chip The heat sealing member laminated to cover the protective member that protects the inlet including the antenna, the back surface of the first cloth base, the inlet, and the protective member, and the first cloth base. A cloth IC tag comprising an inlet, the protective member, and a second cloth base material covering the heat seal member so as to wrap.   The first fabric substrate is made of acetate satin or polyester satin, the protective member is made of a urethane resin or a bisol chloride ink layer, the urethane resin or a bisol chloride ink layer, The cloth IC tag according to claim 4, wherein the heat seal member is made of a polyamide or urethane resin layer.   A heat sealing member, a printed antenna made of conductive ink formed on one side of the heat sealing member, an IC chip electrically connected to the antenna, and a protective member for protecting the antenna, the IC chip, etc. A cloth IC tag comprising an IC tag configured by bonding the cloth base material and the heat seal member together so as to sandwich an inlet made of the antenna and the IC chip.   The cloth IC tag according to claim 6, wherein the heat seal member is made of a polyamide or urethane resin layer. A cloth base material, an IC chip, a cloth formed with an electrode bonded to the IC chip, and a cloth formed with an antenna, and the tag is formed by electromagnetically coupling the electrode and the antenna at a predetermined position. The configured fabric tag,
A cloth IC tag comprising: a heat seal member laminated on the cloth tag so as to cover the cloth tag and bonded to the cloth base material.   The cloth base material is made of acetate satin or polyester satin, the heat seal member is made of a urethane-based resin or a chlorinated bisol-based ink layer, and the adhesive material of the strap portion is made of a strap tape. 8. The cloth IC tag according to 8.   The cloth base material is a woven name base material, a woven name is formed on the surface of the woven name base material, and the cloth IC tag including the antenna facing the woven name is provided on the back surface. The cloth IC tag according to any one of claims 1 to 9, wherein   The cloth IC tag according to any one of claims 1 to 9, wherein the cloth IC tag is attached to clothing.

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