CN114096072A - Manufacturing process of high-precision radio frequency antenna - Google Patents
Manufacturing process of high-precision radio frequency antenna Download PDFInfo
- Publication number
- CN114096072A CN114096072A CN202111126623.XA CN202111126623A CN114096072A CN 114096072 A CN114096072 A CN 114096072A CN 202111126623 A CN202111126623 A CN 202111126623A CN 114096072 A CN114096072 A CN 114096072A
- Authority
- CN
- China
- Prior art keywords
- conductive ink
- antenna
- base material
- manufacturing
- high precision
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 20
- 239000000463 material Substances 0.000 claims abstract description 35
- 239000000758 substrate Substances 0.000 claims abstract description 21
- 239000011248 coating agent Substances 0.000 claims abstract description 15
- 238000000576 coating method Methods 0.000 claims abstract description 15
- 238000001035 drying Methods 0.000 claims abstract description 15
- 238000007639 printing Methods 0.000 claims abstract description 14
- 238000007790 scraping Methods 0.000 claims abstract description 10
- 239000004744 fabric Substances 0.000 claims description 24
- 238000000034 method Methods 0.000 claims description 16
- 229920003023 plastic Polymers 0.000 claims description 16
- 229910052751 metal Inorganic materials 0.000 claims description 13
- 239000002184 metal Substances 0.000 claims description 13
- 239000011888 foil Substances 0.000 claims description 10
- 238000009990 desizing Methods 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 7
- 229920005989 resin Polymers 0.000 claims description 7
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 4
- 229910052799 carbon Inorganic materials 0.000 claims description 4
- 238000009835 boiling Methods 0.000 claims description 3
- 239000002245 particle Substances 0.000 claims description 3
- 238000009999 singeing Methods 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 238000002203 pretreatment Methods 0.000 claims description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 2
- 229920002554 vinyl polymer Polymers 0.000 claims description 2
- 238000005406 washing Methods 0.000 claims description 2
- 238000004891 communication Methods 0.000 abstract description 12
- 238000007650 screen-printing Methods 0.000 abstract description 10
- 239000012535 impurity Substances 0.000 abstract description 6
- 230000000694 effects Effects 0.000 abstract description 3
- 239000002585 base Substances 0.000 description 19
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- GEHJYWRUCIMESM-UHFFFAOYSA-L sodium sulfite Chemical compound [Na+].[Na+].[O-]S([O-])=O GEHJYWRUCIMESM-UHFFFAOYSA-L 0.000 description 2
- 102000004190 Enzymes Human genes 0.000 description 1
- 108090000790 Enzymes Proteins 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 239000004115 Sodium Silicate Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000011010 flushing procedure Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 235000011121 sodium hydroxide Nutrition 0.000 description 1
- 239000001488 sodium phosphate Substances 0.000 description 1
- 229910000162 sodium phosphate Inorganic materials 0.000 description 1
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 1
- 229910052911 sodium silicate Inorganic materials 0.000 description 1
- 235000010265 sodium sulphite Nutrition 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
- H05K3/1225—Screens or stencils; Holders therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/225—Correcting or repairing of printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
Abstract
The invention discloses a manufacturing process of a high-precision radio frequency antenna, which comprises the following steps: pretreating the surface of a base material, and then covering a silk screen plate on the surface of the base material; coating conductive ink, scraping the conductive ink to enable the conductive ink to fill all meshes of the silk screen plate, scraping redundant conductive ink, drying, and removing the silk screen plate, so that an antenna circuit is obtained on the surface of the base material; printing an insulating wire on the antenna circuit and drying; printing a jumper wire on the gap bridge part of the insulated wire; and coating an insulating layer on the whole surface of the substrate. The manufacturing process can lead the substrate to be in close contact with the screen printing plate and the conductive ink because the substrate is pretreated in advance and impurities on the surface are removed, and the communication effect is not influenced by the fact that the conductive ink among different meshes is communicated due to the existence of gaps between the substrate and the screen printing plate and further the short circuit of a circuit is caused; and because the surface of the base material is smooth, the conductive ink can be uniformly distributed on the surface of the base material, so that the conductivity is improved, and the communication precision is further improved.
Description
Technical Field
The invention belongs to the technical field of manufacturing of radio frequency antennas, and particularly relates to a manufacturing process of a high-precision radio frequency antenna.
Background
Radio frequency identification and radio frequency communication technologies are generally used in various aspects of production and life of people, and currently, two ways are generally adopted for preparing radio frequency antennas, one way is to adopt a printed circuit board process, cut and clean a copper-clad plate, then paste a film on the surface of the copper-clad plate, and etch the copper-clad plate under an ultraviolet exposure condition to form a preset circuit pattern; the copper-clad plate adopted by the process has higher cost, so that the price of the manufactured radio frequency antenna is high, and the wide use of the radio frequency antenna is limited, therefore, at present, most of the radio frequency antenna adopts a second preparation mode, namely, a printed circuit is manufactured on a base material by adopting a screen printing mode, and the process is researched by persons in the industry for many years and is gradually mature at present.
With the development of communication technology, the requirement on communication precision is higher and higher, so how to improve the communication parameters of the radio frequency antenna becomes the key point of research and development of the industry people.
Disclosure of Invention
The invention aims to provide a manufacturing process of a high-precision radio-frequency antenna, which can improve the communication precision of the radio-frequency antenna.
In order to achieve the above purpose, the solution of the invention is:
a manufacturing process of a high-precision radio frequency antenna comprises the following steps:
step 1, pretreating the surface of a base material, and then covering a silk screen plate on the surface of the base material;
step 2, coating conductive ink on the surface of the substrate, leveling the conductive ink to enable the conductive ink to fill all meshes of the silk screen plate, scraping redundant conductive ink, drying, and removing the silk screen plate, so that an antenna circuit is obtained on the surface of the substrate;
step 3, printing an insulating wire on the antenna circuit and drying;
step 4, printing jumper wires on the gap bridge part of the insulated wires;
and 5, coating an insulating layer on the whole surface of the substrate.
In the step 1, the base material is paper, metal foil, cloth, vinyl material or plastic.
In step 2, the viscosity of the conductive ink is greater than 800cP, and the particle size is smaller than 125 micrometers.
The conductive ink is metal ink or carbon ink.
In the step 3, the insulated wire is made of UV resin.
In the step 5, the insulating layer is made of UV resin.
In the step 5, the thickness of the insulating layer is 1 to 50 micrometers.
In the step 1, when the fabric is used as the base material, the pretreatment method comprises the following steps: firstly, singeing the cloth, then desizing the cloth, and finally boiling the desized cloth.
In the step 1, when plastic is used as a base material, a high-pressure water gun is used for washing the surface of the plastic, so that pretreatment is realized.
In the step 1, when the metal foil is used as the base material, the plastic surface is pretreated by ultrasonic waves.
After the scheme is adopted, the invention has the following improvements:
(1) according to the invention, the substrate is pretreated in advance, and impurities on the surface are removed, so that the substrate can be in close contact with the screen printing plate and the conductive ink, and the communication effect cannot be influenced by the fact that the conductive ink is communicated among different meshes due to the existence of gaps between the substrate and the screen printing plate, and further, the short circuit of a circuit is caused; moreover, as the surface of the base material is smooth, the conductive ink can be uniformly distributed on the surface of the base material, so that the conductivity is improved, and the communication precision is further improved;
(2) when the conductive ink is manufactured specifically, corresponding process parameters and types of the conductive ink can be adjusted according to different base material materials, so that the communication precision of the product is further improved.
Detailed Description
The technical solution and the advantages of the present invention will be described in detail with reference to the following embodiments.
The invention provides a manufacturing process of a high-precision radio frequency antenna, which comprises the following steps:
step 1, covering a silk screen plate on the surface of a base material, wherein the base material can be paper, metal foil, cloth, ethylene material, plastic and the like;
in the step 1, firstly, the surface of the base material is pretreated to remove impurities, so that the conductive ink in the subsequent steps can be uniformly contacted with the surface of the base material, and the conductivity is improved;
step 2, coating conductive ink on the surface of the substrate, leveling by using a scraper blade to enable the conductive ink to fill all meshes of the silk screen plate, scraping redundant conductive ink, drying, and removing the silk screen plate, thereby obtaining an antenna circuit on the surface of the substrate;
in the step 2, the conductive ink can be selected from the types with the viscosity of more than 800cP and the particle size of less than 125 micrometers, and specifically, metal ink, carbon ink and the like can be adopted;
step 3, printing an insulating wire on the antenna circuit and drying;
step 4, printing jumper wires on the gap bridge part of the insulated wires;
and 5, coating an insulating layer on the surface of the whole substrate, wherein the thickness of the insulating layer can be designed to be 1-50 micrometers according to different substrate materials, applicable environments and the like.
In the above steps 3 and 5, the insulated wire and the insulating layer may be made of UV resin.
According to the radio frequency antenna manufactured through the steps, the conductive ink is in close contact with the surface of the base material, the conductive ink is well-defined in area due to the mesh intervals of the screen printing plate, the insulation effect among the areas is good, and the conductive ink is uniformly distributed on the surface of the base material, so that the conductive performance is improved, and the communication precision is further improved; experiments show that compared with the radio-frequency antenna manufactured by a general screen printing method, the conductivity of the radio-frequency antenna manufactured by the method can be improved by 5-13%, and the communication precision is improved by 0.8-1.9%.
Example 1
Step 1, selecting a fabric as a base material, and firstly pretreating the fabric to remove surface impurities, wherein the method specifically comprises the following steps: firstly, singeing the cloth to make the surface of the cloth smooth; then adopting modes of oxidant desizing, alkali desizing, acid desizing, enzyme desizing and the like to carry out desizing treatment, and improving the combination degree of the cloth and the conductive ink in the subsequent steps; finally, in order to remove the slurry and oil possibly remaining in the cloth, the desized cloth is boiled again, caustic soda can be used for boiling, and a certain amount of surfactants such as sodium silicate, sodium sulfite and sodium phosphate are added to improve the removal capacity;
paving the pretreated cloth, and covering a silk screen plate on the upper surface of the cloth;
step 2, coating conductive ink on the upper surface of the cloth and the silk screen plate combination, scraping the conductive ink by using a scraper blade to enable the conductive ink to fill and level all meshes of the silk screen plate, scraping redundant conductive ink, then putting the cloth coated with the conductive ink into a dryer, drying for 20min at the temperature of 150 ℃, separating the silk screen plate from the surface of the cloth after drying is completed, and thus obtaining an antenna circuit on the surface of the cloth;
step 3, printing an insulating wire on the antenna circuit and drying;
step 4, printing jumper wires on the gap bridge part of the insulated wires;
and 5, coating an insulating layer on the surface of the whole substrate, wherein the insulating layer is made of UV resin and the coating thickness is 25 microns.
Example 2
Step 1, selecting plastic as a base material, flushing the surface of the plastic by using a high-pressure water gun, removing impurities on the surface of the plastic, and covering a silk screen plate on the surface of the plastic to enable the surface of the plastic to be tightly attached to the silk screen plate;
step 2, coating carbon ink on the surface of the combination of the plastic and the silk screen plate, lightly scraping by using a scraper blade to enable all meshes of the silk screen plate to be filled with the conductive ink, scraping the redundant conductive ink, drying for 35min at the temperature of 100 ℃, and removing the silk screen plate, so that an antenna circuit is obtained on the surface of the plastic;
step 3, printing an insulated wire on the antenna circuit and drying, wherein the insulated wire is made of UV resin;
step 4, printing jumper wires on the gap bridge part of the insulated wires;
and 5, coating an insulating layer with the thickness of 40 microns on the whole surface of the substrate.
Example 3
Step 1, selecting a metal foil as a base material, cleaning impurities on the surface of the metal foil by adopting ultrasonic waves for 5-20min to ensure that the surface of the metal foil is smooth and flat, and then covering a silk screen plate on the surface of the metal foil;
step 2, flattening the screen printing plate on the surface of the metal foil, then coating conductive ink, leveling by using a scraper blade to fill all meshes of the screen printing plate with the conductive ink, scraping redundant conductive ink, drying, and then removing the screen printing plate, thereby obtaining an antenna circuit on the surface of the substrate;
step 3, printing an insulating wire on the antenna circuit and drying;
step 4, printing jumper wires on the gap bridge part of the insulated wires;
and 5, coating an insulating layer on the surface of the whole substrate, wherein the thickness of the insulating layer is 20 microns.
The above embodiments are only for illustrating the technical idea of the present invention, and the protection scope of the present invention is not limited thereby, and any modifications made on the basis of the technical scheme according to the technical idea of the present invention fall within the protection scope of the present invention.
Claims (10)
1. A manufacturing process of a high-precision radio frequency antenna is characterized by comprising the following steps:
step 1, pretreating the surface of a base material, and then covering a silk screen plate on the surface of the base material;
step 2, coating conductive ink on the surface of the substrate, leveling the conductive ink to enable the conductive ink to fill all meshes of the silk screen plate, scraping redundant conductive ink, drying, and removing the silk screen plate, so that an antenna circuit is obtained on the surface of the substrate;
step 3, printing an insulating wire on the antenna circuit and drying;
step 4, printing jumper wires on the gap bridge part of the insulated wires;
and 5, coating an insulating layer on the whole surface of the substrate.
2. A process for manufacturing a high precision rf antenna as claimed in claim 1, wherein: in the step 1, the base material is paper, metal foil, cloth, vinyl material or plastic.
3. A process for manufacturing a high precision rf antenna as claimed in claim 1, wherein: in the step 2, the viscosity of the conductive ink is more than 800cP, and the particle size is less than 125 micrometers.
4. A process for manufacturing a high precision rf antenna as claimed in claim 3, wherein: the conductive ink is metal ink or carbon ink.
5. A process for manufacturing a high precision rf antenna as claimed in claim 1, wherein: in the step 3, the insulated wire is made of UV resin.
6. A process for manufacturing a high precision rf antenna as claimed in claim 1, wherein: in the step 5, the insulating layer is made of UV resin.
7. A process for manufacturing a high precision rf antenna as claimed in claim 1, wherein: in the step 5, the thickness of the insulating layer is 1-50 microns.
8. A process for manufacturing a high precision rf antenna as claimed in claim 1, wherein: in the step 1, when the cloth is used as the base material, the pretreatment method comprises the following steps: firstly, singeing the cloth, then desizing the cloth, and finally boiling the desized cloth.
9. A process for manufacturing a high precision rf antenna as claimed in claim 1, wherein: in the step 1, when plastic is used as a base material, a high-pressure water gun is used for washing the surface of the plastic, so that pretreatment is realized.
10. A process for manufacturing a high precision rf antenna as claimed in claim 1, wherein: in the step 1, when the metal foil is used as a base material, the plastic surface is pretreated by ultrasonic waves.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111126623.XA CN114096072A (en) | 2021-09-26 | 2021-09-26 | Manufacturing process of high-precision radio frequency antenna |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111126623.XA CN114096072A (en) | 2021-09-26 | 2021-09-26 | Manufacturing process of high-precision radio frequency antenna |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114096072A true CN114096072A (en) | 2022-02-25 |
Family
ID=80296375
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111126623.XA Pending CN114096072A (en) | 2021-09-26 | 2021-09-26 | Manufacturing process of high-precision radio frequency antenna |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114096072A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1474353A (en) * | 2002-08-08 | 2004-02-11 | 深圳市华阳微电子有限公司 | Method for producing IC card paper-base radio frequency antenna and electronic label |
| JP2011186842A (en) * | 2010-03-09 | 2011-09-22 | Unitech Co Ltd | Cloth ic tag |
| WO2012078362A1 (en) * | 2010-11-22 | 2012-06-14 | ChamTech Technologies, Incorporated | Material used for at least one of propagation, emission and absorption of electromagnetic radiation |
-
2021
- 2021-09-26 CN CN202111126623.XA patent/CN114096072A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1474353A (en) * | 2002-08-08 | 2004-02-11 | 深圳市华阳微电子有限公司 | Method for producing IC card paper-base radio frequency antenna and electronic label |
| JP2011186842A (en) * | 2010-03-09 | 2011-09-22 | Unitech Co Ltd | Cloth ic tag |
| WO2012078362A1 (en) * | 2010-11-22 | 2012-06-14 | ChamTech Technologies, Incorporated | Material used for at least one of propagation, emission and absorption of electromagnetic radiation |
Non-Patent Citations (1)
| Title |
|---|
| 陈苑明等: ""导电银浆RFID天线过桥连接的可靠性研究"", 《包装工程》 * |
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| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20220225 |
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| RJ01 | Rejection of invention patent application after publication |