CN109874233A - A kind of method preparing electronic circuit, substrate, connector and electronic product - Google Patents
A kind of method preparing electronic circuit, substrate, connector and electronic product Download PDFInfo
- Publication number
- CN109874233A CN109874233A CN201910249669.7A CN201910249669A CN109874233A CN 109874233 A CN109874233 A CN 109874233A CN 201910249669 A CN201910249669 A CN 201910249669A CN 109874233 A CN109874233 A CN 109874233A
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- substrate
- electronic circuit
- plating
- insulating coating
- coating
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- 239000000758 substrate Substances 0.000 title claims abstract description 104
- 238000000034 method Methods 0.000 title claims abstract description 35
- 238000000576 coating method Methods 0.000 claims abstract description 77
- 239000011248 coating agent Substances 0.000 claims abstract description 75
- 238000007747 plating Methods 0.000 claims abstract description 54
- 238000002360 preparation method Methods 0.000 claims description 13
- 239000003365 glass fiber Substances 0.000 claims description 12
- 239000004033 plastic Substances 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 8
- 239000004744 fabric Substances 0.000 claims description 5
- 239000011241 protective layer Substances 0.000 claims description 5
- 238000005507 spraying Methods 0.000 claims description 5
- 239000010410 layer Substances 0.000 claims description 4
- 238000000608 laser ablation Methods 0.000 claims description 3
- 230000008054 signal transmission Effects 0.000 claims description 3
- 239000004568 cement Substances 0.000 claims description 2
- 240000007594 Oryza sativa Species 0.000 claims 1
- 235000007164 Oryza sativa Nutrition 0.000 claims 1
- VIKNJXKGJWUCNN-XGXHKTLJSA-N norethisterone Chemical compound O=C1CC[C@@H]2[C@H]3CC[C@](C)([C@](CC4)(O)C#C)[C@@H]4[C@@H]3CCC2=C1 VIKNJXKGJWUCNN-XGXHKTLJSA-N 0.000 claims 1
- 235000009566 rice Nutrition 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 abstract description 11
- 239000002184 metal Substances 0.000 abstract description 8
- 230000015572 biosynthetic process Effects 0.000 abstract description 5
- 239000000126 substance Substances 0.000 abstract description 5
- 238000002955 isolation Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 238000001311 chemical methods and process Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000003847 radiation curing Methods 0.000 description 1
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Abstract
The method that the invention discloses a kind of to prepare electronic circuit on substrate, comprising: insulating coating is covered on substrate；Laser removes the insulating coating of electronic circuit corresponding position on substrate, and activates the substrate at removal insulating coating position；Electronic circuit is obtained to substrate progress plating.The method that this kind prepares electronic circuit can be avoided the small pitch electronic route prepared and plating phenomenon of overflowing occurs.The method provided by the invention that electronic circuit is prepared on substrate on substrate by covering insulating coating, the insulating coating of electronic circuit to be prepared corresponding position on substrate is removed using laser later, line slot can be formed in this way, when to substrate progress plating, chemical plating solution can form electronic circuit at route groove location, it is not in excessive plating between the electronic circuit that the coat of metal is deposited on substrate surface formation since there are insulating coatings between adjacent line slot.The present invention also provides a kind of substrate of electronic circuit, connector and electronic products.
Description
Technical field
The invention belongs to electrical-chemistry method technical field more particularly to a kind of methods for preparing electronic circuit, substrate, connection
Part and electronic product.
Background technique
In current electronic product, (Laser Direct Structuring, laser are straight carrying out LDS for wiring substrate
Connect forming technique) after process, using the method for chemical plating, so that the coat of metal is deposited on substrate surface and form route.
During commonization plating, the gap (gap) between each route at least will be in 0.3mm, and just can guarantee is plated
Quality avoids the line short occurred by plating of overflowing, there is more and more small―gap suture demands, current LDS and the side for changing plating at present
, often there is the case where line short in the case where method can not be produced normally, be less than 0.3mm for gap.
Summary of the invention
Technical purpose of the invention is to provide a kind of method for preparing electronic circuit, substrate, connector and electronic product, should
The method that kind prepares electronic circuit can be avoided the small pitch electronic route prepared and plating phenomenon of overflowing occurs.
To solve the above problems, the technical solution of the present invention is as follows:
A method of preparing electronic circuit on substrate, comprising:
Insulating coating is covered on substrate；
Laser removes the insulating coating of electronic circuit corresponding position on the substrate, and activates removal institute
State the substrate at insulating coating position；
The electronic circuit is obtained to the substrate progress plating.
An embodiment according to the present invention, the insulating coating that covers on substrate further comprises:
A1 prepares PU coating or UV coating；
The PU coating or the UV coating are applied the route preparation area for being located at the substrate by A2.
An embodiment according to the present invention, the laser remove the institute of electronic circuit corresponding position on the substrate
Stating insulating coating further comprises:
B1, insulating coating described in laser ablation part form several line slots, the position of the line slot and to be prepared
The electronic circuit is corresponding；The spacing of the adjacent line slot is less than or equal to 0.3 millimeter.
An embodiment according to the present invention, it is described the electronic circuit is obtained to the substrate progress plating further to wrap
It includes:
C1, by progress plating in being put into of the substrate coating bath；
C2, the route after changing plating prepare area's spraying protective layer.
Based on same idea, the method that the present invention also provides a kind of to prepare electronic circuit on substrate, change plating before
Route preparation area on the substrate prepares line slot, and the position of the line slot is opposite with the electronic circuit to be prepared
It answers；
It is equipped with insulating coating between the adjacent line slot, overflows between the electronic circuit formed with preventing plating
Plating.
Based on same idea, the present invention also provides a kind of substrate of electronic circuit, the route on the substrate prepares area
Equipped with several line slots, the line slot forms the electronic circuit for changing plating, is equipped between the adjacent line slot exhausted
Edge coating.
An embodiment according to the present invention, the substrate are plastic rubber substrate, and the route preparation area of the plastic rubber substrate is equipped with glass
Glass fiber, the cloth set direction of the glass fibre move towards identical with the line slot.
The spacing of an embodiment according to the present invention, the adjacent line slot is less than or equal to 0.3 millimeter.
An embodiment according to the present invention, the width of the line slot are 0.5~1 millimeter.
An embodiment according to the present invention, the insulating coating are PU coating or UV coating.
An embodiment according to the present invention, the insulating coating with a thickness of 15~25 microns.
Based on same idea, the present invention also provides a kind of connectors, for connecting the signal transmission inside electronic product
Module, the substrate including the electronic circuit in above-described embodiment.
Based on same idea, the present invention also provides a kind of electronic products, including the electronic circuit in above-described embodiment
Substrate.
The present invention due to using the technology described above, makes it have the following advantages that and actively imitate compared with prior art
Fruit:
The method that electronic circuit is prepared on substrate in one embodiment of the invention by covering insulating coating on substrate,
The insulating coating for removing electronic circuit to be prepared corresponding position on substrate using laser later, can form route in this way
Slot, when to substrate progress plating, chemical plating solution can form electronic circuit at route groove location, due to adjacent line slot
Between there are insulating coating, be not in excessive plating, this kind between the electronic circuit that the coat of metal is deposited on substrate surface formation
The method for preparing electronic circuit cleverly avoids the generation for plating phenomenon of overflowing by the method for isolation adjacent electronics line slot, in turn
It can be avoided the small pitch electronic route prepared and plating phenomenon of overflowing occur.
Detailed description of the invention
Fig. 1 is a kind of flow chart of method that electronic circuit is prepared on substrate of the invention；
Fig. 2 is the flow chart that insulating coating is covered on substrate；
Fig. 3 is the specific steps block diagram that laser removes electronic circuit insulating coating of corresponding position on substrate；
Fig. 4 is 0.25 millimeter of spacing of the local line figure using prior art preparation；
Fig. 5 is 0.1 millimeter of spacing of the local line figure prepared using the method for the present invention；
Fig. 6 is the matrix structure diagram that step S1 is prepared in the present invention；
Fig. 7 is a kind of matrix structure diagram including line slot of the invention；
Fig. 8 is the partial sectional view of the route prepared of the invention.
Description of symbols:
1: substrate；2: electronic circuit；3: insulating coating；4: line slot；The area 5: Yi Du.
Specific embodiment
Below in conjunction with the drawings and specific embodiments to a kind of method for preparing electronic circuit proposed by the present invention, substrate, company
Fitting and electronic product are described in further detail.According to following explanation and claims, advantages and features of the invention will
It becomes apparent from.
Embodiment 1
Referring to Fig. 1 to Fig. 3, a method of preparing electronic circuit 2 on substrate 1, comprising:
S1: insulating coating 3 is covered on substrate 1；The product structure that this step is prepared is referring to Fig. 6；
Insulating coating 3 is covered on substrate 1 further comprises:
A1 prepares PU coating or UV coating；Specifically usable coating apparatus carries out coating operation to 1 surface of substrate.It is making
It needs to do after being sprayed when standby UV coating using automatic spraying machine UV radiation curing；If preparation is PU coating,
It needs to do baking-curing after being sprayed using automatic spraying machine.
PU coating or UV coating are applied the route preparation area for being located at substrate 1 by A2.
S2: laser removes the insulating coating 3 of the corresponding position on substrate 1 of electronic circuit 2, and activates removal insulating coating
Substrate 1 at 3 positions；The product structure that this step is prepared is referring to Fig. 7；
Substrate in the present embodiment can be the plastic material containing metallic element, and metallic element is usually with the shape of compound
Formula exists, and the substrate 1 at activation removal 3 position of insulating coating refers under superlaser effect, the plastic cement containing metallic element
Material can generate the metallic being embedded in plastic material, when changing plating based on metallic, in the area that laser irradiation is crossed
Domain generates the coat of metal.
The insulating coating 3 that laser removes the corresponding position on substrate 1 of electronic circuit 2 further comprises:
B1, laser ablation SI semi-insulation coating 3 form several line slots 4, the position of line slot 4 and electronics to be prepared
Route 2 is corresponding；The spacing of adjacent lines slot 4 is less than or equal to 0.3 millimeter.
Can be mutually isolated by insulating coating 3 between the adjacent lines slot 4 of formation, during changing plating, molten metal can be deposited on
Electronic circuit 2 is formed in each line slot 4, due to the isolation of insulating coating 3, there is no be electrically connected between adjacent electronic circuit 2
It connects, that is, is not in overflow to plate caused short circuit phenomenon.It should be noted that 2 layers of electronic circuit of thickness in the present embodiment is not
It can be more than the depth of corresponding line slot 4.
S3: electronic circuit 2 is obtained to 1 progress plating of substrate.The product structure that this step is prepared is referring to Fig. 5 and figure
8。
Obtaining electronic circuit 2 to 1 progress plating of substrate further comprises:
C1, by progress plating in 1 being put into coating bath of substrate；
Changing generally has pH value in coating bath be 12 or so ferric chloride solution, wherein there are also some catalyst and complex compounds.?
Changing will do it cleaning and baking after changing plating in coating bath.
C2, the route after changing plating prepare area's spraying protective layer.Protective layer, which mainly passes through, to be sprayed and is solidificated in product table
Face forms closed area, the substrate of metallic and chemical plating solution is avoided directly to contact, and reduces a possibility that overflowing plating.
The method that electronic circuit 2 is prepared on substrate 1 in the present embodiment by covering insulating coating 3 on substrate 1, it
The insulating coating 3 for removing the corresponding position on substrate 1 of electronic circuit 2 to be prepared using laser afterwards, can form route in this way
Slot 4, when to 1 progress plating of substrate, chemical plating solution can form electronic circuit 2 at 4 position of line slot, due to adjacent line
There are insulating coatings 3 between road slot 4, are not in excessive between the electronic circuit 2 that the coat of metal is deposited on the formation of 1 surface of substrate
Plating.The method that this kind prepares electronic circuit 2 cleverly avoids plating phenomenon of overflowing by the method for isolation adjacent electronics line slot 4
Occur, and then can be avoided the small pitch electronic route 2 prepared and plating phenomenon of overflowing occur.
Small spacing in the present embodiment can refer to the case where gap (gap) between each route is less than 0.3mm, for more next
More small―gap suture demands, referring to Fig. 4, current LDS and the method for changing plating can not be produced normally, for gap less than 0.3mm's
Situation can have the area Yi Du 5, the case where line short often occurs.The method provided in the present embodiment can be short to avoid route
The case where road.It should be understood that the method in the present embodiment is equally applicable the case where being greater than 0.3mm for gap.
Embodiment 2
Based on same idea, the present invention also provides a kind of methods that electronic circuit 2 is prepared on substrate 1, change before plating
Route preparation area on substrate 1 prepares line slot 4, and the position of line slot 4 is corresponding with electronic circuit 2 to be prepared；
It is equipped with insulating coating 3 between adjacent line slot 4, overflows between the electronic circuit 2 formed with preventing plating
Plating.The specific product structure for the product prepared is referring to Fig. 7 and Fig. 8.
It is mutually isolated by insulating coating 3 between adjacent lines slot 4 in route preparation area, during changing plating, molten metal meeting
Being deposited on formation electronic circuit 2 in each line slot 4 will not be deposited between adjacent electronic circuit 2 due to the isolation of insulating coating 3
It is being electrically connected, that is, is being not in overflow to plate caused short circuit phenomenon.It should be noted that 2 layers of electronic circuit in the present embodiment
Thickness does not exceed the depth of corresponding line slot 4.
Embodiment 3
Referring to Fig. 7, it is based on same idea, the route the present invention also provides a kind of substrate 1 of electronic circuit 2, on substrate 1
It prepares area and is equipped with several line slots 4, line slot 4 forms electronic circuit 2 for changing plating, is equipped with insulation between adjacent line slot 4
Coating 3.
Line slot 4 in the present embodiment forms electronic circuit 2 for changing plating, and when preparing route, molten metal can be deposited on
Electronic circuit 2 is formed in each line slot 4.Route prepares, phase mutually isolated by insulating coating 3 between the adjacent lines slot 4 in area
There is no electrical connections between adjacent electronic circuit 2, that is, are not in overflow to plate caused short circuit phenomenon.It should be noted that this
2 layers of electronic circuit of thickness in embodiment does not exceed the depth of corresponding line slot 4.
Further, substrate 1 is plastic rubber substrate 1, and the route preparation area of plastic rubber substrate 1 is equipped with glass fibre, glass fibre
Cloth set direction and line slot 4 move towards identical.The cloth set direction of glass fibre and line slot 4 move towards identical and can be understood as
The cloth set direction of glass fibre moves towards identical with the electronic circuit 2 prepared, can be further reduced plating phenomenon of overflowing in this way.
Further, the spacing of adjacent lines slot 4 is less than or equal to 0.3 millimeter.For more and more small―gap suture demands,
, often there are the feelings of line short in the case where method of current LDS and change plating can not be produced normally, be less than 0.3mm for gap
Condition.The case where substrate 1 provided in the present embodiment can be to avoid line short.It should be understood that in the present embodiment
The case where substrate 1 is greater than 0.3mm for gap is equally applicable, it is only necessary to adjust the spacing of adjacent lines slot 4.
Further, the width of line slot 4 is 0.5~1 millimeter.
Further, insulating coating 3 is PU coating or UV coating.
Further, insulating coating 3 with a thickness of 15~25 microns.
Further, substrate 1 is the plastic rubber substrate containing glass fiber material, and glass fiber material can increase the tensile strength of product.
In addition, the trend of glass fiber material is also factor in need of consideration, for route of the gap less than 0.1mm, protective layer is being measured
There is the possibility to fall off when production, the trend for controlling glass fiber material helps that the yield of product can be improved.
Embodiment 4
Based on same idea, the present invention also provides a kind of connectors, for connecting the signal transmission inside electronic product
Module, the substrate including the electronic circuit in above-described embodiment.
Embodiment 5
Based on same idea, the present invention also provides a kind of electronic products, including the electronic circuit in above-described embodiment
Substrate.
Embodiments of the present invention are explained in detail above in conjunction with attached drawing, but the present invention is not limited to above-mentioned implementations
Mode.Even if to the present invention, various changes can be made, if these variations belong to the model of the claims in the present invention and its equivalent technologies
Within enclosing, then still fall within the protection scope of the present invention.
Claims (13)
1. a kind of method for preparing electronic circuit on substrate characterized by comprising
Insulating coating is covered on substrate；
Laser removes the insulating coating of electronic circuit corresponding position on the substrate, and activates removal described absolutely
The substrate of edge coating positions；
The electronic circuit is obtained to the substrate progress plating.
2. the method for electronic circuit is prepared on substrate as described in claim 1, which is characterized in that described to be covered on substrate
Insulating coating further comprises:
A1 prepares PU coating or UV coating；
The PU coating or the UV coating are applied the route preparation area for being located at the substrate by A2.
3. the method for electronic circuit is prepared on substrate as claimed in claim 2, which is characterized in that described in the laser removes
The insulating coating of electronic circuit corresponding position on the substrate further comprises:
B1, insulating coating described in laser ablation part form several line slots, the position of the line slot with it is to be prepared described
Electronic circuit is corresponding；The spacing of the adjacent line slot is less than or equal to 0.3 millimeter.
4. the method for electronic circuit is prepared on substrate as claimed in claim 2 or claim 3, which is characterized in that described to the base
Material progress plating obtains the electronic circuit:
C1, by progress plating in being put into of the substrate coating bath；
C2, the route after changing plating prepare area's spraying protective layer.
5. a kind of method for preparing electronic circuit on substrate, which is characterized in that change the route system of plating before on the substrate
Line slot is prepared in preparation area, and the position of the line slot is corresponding with the electronic circuit to be prepared；
It is equipped with insulating coating between the adjacent line slot, plating of overflowing occurs between the electronic circuit formed with preventing plating.
6. a kind of substrate of electronic circuit, which is characterized in that the route preparation area on the substrate is equipped with several line slots, described
Line slot forms the electronic circuit for changing plating, is equipped with insulating coating between the adjacent line slot.
7. the substrate of electronic circuit as claimed in claim 6, which is characterized in that the substrate is plastic rubber substrate, the plastic cement
The route preparation area of substrate is equipped with glass fibre, and the cloth set direction of the glass fibre moves towards identical with the line slot.
8. the substrate of electronic circuit as claimed in claim 6, which is characterized in that the spacing of the adjacent line slot is less than or waits
In 0.3 millimeter.
9. the substrate of electronic circuit as claimed in claim 6, which is characterized in that the width of the line slot is 0.5~1 milli
Rice.
10. the substrate of electronic circuit as claimed in claim 6, which is characterized in that the insulating coating is that PU coating or UV are applied
Layer.
11. the substrate of electronic circuit as claimed in claim 6, which is characterized in that the insulating coating with a thickness of 15~25
Micron.
12. a kind of connector, for connecting the signal transmission module inside electronic product, which is characterized in that including claim 6
The substrate of electronic circuit described in~11 any one.
13. a kind of electronic product, which is characterized in that the substrate including electronic circuit described in claim 6~11 any one.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910249669.7A CN109874233A (en) | 2019-03-29 | 2019-03-29 | A kind of method preparing electronic circuit, substrate, connector and electronic product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910249669.7A CN109874233A (en) | 2019-03-29 | 2019-03-29 | A kind of method preparing electronic circuit, substrate, connector and electronic product |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109874233A true CN109874233A (en) | 2019-06-11 |
Family
ID=66921666
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910249669.7A Pending CN109874233A (en) | 2019-03-29 | 2019-03-29 | A kind of method preparing electronic circuit, substrate, connector and electronic product |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109874233A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111356296A (en) * | 2020-02-19 | 2020-06-30 | 中国电子产品可靠性与环境试验研究所（（工业和信息化部电子第五研究所）（中国赛宝实验室）） | Preparation method of circuit board precision line, circuit board precision line and circuit board |
| CN111479397A (en) * | 2020-04-30 | 2020-07-31 | 生益电子股份有限公司 | Circuit manufacturing method |
| CN114603259A (en) * | 2022-01-20 | 2022-06-10 | 维达力实业（赤壁）有限公司 | Method for treating surface of curtain coating cover plate |
| WO2024021438A1 (en) * | 2022-07-26 | 2024-02-01 | 德中（天津）技术发展股份有限公司 | Method for manufacturing circuit board by means of transferring material through opening made by laser, and software and apparatus |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103079366A (en) * | 2011-10-25 | 2013-05-01 | 青岛长弓塑模有限公司 | Method for manufacturing casing with circuit by spraying and laser carving |
| CN108558413A (en) * | 2018-07-02 | 2018-09-21 | 上海安费诺永亿通讯电子有限公司 | A kind of preparation method of ceramic base electronic circuit |
| CN210840248U (en) * | 2019-03-29 | 2020-06-23 | 上海安费诺永亿通讯电子有限公司 | Substrate for preparing electronic circuit, connecting piece and electronic product |
-
2019
- 2019-03-29 CN CN201910249669.7A patent/CN109874233A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103079366A (en) * | 2011-10-25 | 2013-05-01 | 青岛长弓塑模有限公司 | Method for manufacturing casing with circuit by spraying and laser carving |
| CN108558413A (en) * | 2018-07-02 | 2018-09-21 | 上海安费诺永亿通讯电子有限公司 | A kind of preparation method of ceramic base electronic circuit |
| CN210840248U (en) * | 2019-03-29 | 2020-06-23 | 上海安费诺永亿通讯电子有限公司 | Substrate for preparing electronic circuit, connecting piece and electronic product |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111356296A (en) * | 2020-02-19 | 2020-06-30 | 中国电子产品可靠性与环境试验研究所（（工业和信息化部电子第五研究所）（中国赛宝实验室）） | Preparation method of circuit board precision line, circuit board precision line and circuit board |
| CN111479397A (en) * | 2020-04-30 | 2020-07-31 | 生益电子股份有限公司 | Circuit manufacturing method |
| CN114603259A (en) * | 2022-01-20 | 2022-06-10 | 维达力实业（赤壁）有限公司 | Method for treating surface of curtain coating cover plate |
| WO2024021438A1 (en) * | 2022-07-26 | 2024-02-01 | 德中（天津）技术发展股份有限公司 | Method for manufacturing circuit board by means of transferring material through opening made by laser, and software and apparatus |
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