JP2018164092A5 - - Google Patents
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- Publication number
- JP2018164092A5 JP2018164092A5 JP2018101127A JP2018101127A JP2018164092A5 JP 2018164092 A5 JP2018164092 A5 JP 2018164092A5 JP 2018101127 A JP2018101127 A JP 2018101127A JP 2018101127 A JP2018101127 A JP 2018101127A JP 2018164092 A5 JP2018164092 A5 JP 2018164092A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- plasma
- period
- focus ring
- electrodes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- 239000000758 substrate Substances 0.000 claims 27
- 238000003672 processing method Methods 0.000 claims 6
- 238000001179 sorption measurement Methods 0.000 claims 4
- 238000004140 cleaning Methods 0.000 claims 3
- 238000010438 heat treatment Methods 0.000 claims 2
- 238000000034 method Methods 0.000 claims 2
- 238000009832 plasma treatment Methods 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018101127A JP2018164092A (ja) | 2018-05-28 | 2018-05-28 | 静電吸着方法、プラズマ処理方法及びプラズマ処理装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018101127A JP2018164092A (ja) | 2018-05-28 | 2018-05-28 | 静電吸着方法、プラズマ処理方法及びプラズマ処理装置 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014262170A Division JP6346855B2 (ja) | 2014-12-25 | 2014-12-25 | 静電吸着方法及び基板処理装置 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019193650A Division JP6781320B2 (ja) | 2019-10-24 | 2019-10-24 | 静電吸着方法、プラズマ処理方法及びプラズマ処理装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2018164092A JP2018164092A (ja) | 2018-10-18 |
| JP2018164092A5 true JP2018164092A5 (enrdf_load_stackoverflow) | 2019-03-14 |
Family
ID=63859300
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018101127A Ceased JP2018164092A (ja) | 2018-05-28 | 2018-05-28 | 静電吸着方法、プラズマ処理方法及びプラズマ処理装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2018164092A (enrdf_load_stackoverflow) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7398909B2 (ja) * | 2019-09-12 | 2023-12-15 | 東京エレクトロン株式会社 | 静電吸着方法及びプラズマ処理装置 |
| JP7390219B2 (ja) * | 2020-03-11 | 2023-12-01 | 東京エレクトロン株式会社 | エッジリングの保持方法、プラズマ処理装置、及び基板処理システム |
| US11551916B2 (en) * | 2020-03-20 | 2023-01-10 | Applied Materials, Inc. | Sheath and temperature control of a process kit in a substrate processing chamber |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000349141A (ja) * | 1999-06-09 | 2000-12-15 | Mitsubishi Electric Corp | プラズマ処理装置 |
| US6475336B1 (en) * | 2000-10-06 | 2002-11-05 | Lam Research Corporation | Electrostatically clamped edge ring for plasma processing |
| JP4547182B2 (ja) * | 2003-04-24 | 2010-09-22 | 東京エレクトロン株式会社 | プラズマ処理装置 |
| JP5657262B2 (ja) * | 2009-03-27 | 2015-01-21 | 東京エレクトロン株式会社 | プラズマ処理装置 |
| JP5302814B2 (ja) * | 2009-07-29 | 2013-10-02 | 株式会社日立ハイテクノロジーズ | プラズマ処理装置 |
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2018
- 2018-05-28 JP JP2018101127A patent/JP2018164092A/ja not_active Ceased