JP2018145489A - Plating apparatus and plating method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a plating apparatus and a plating method that can detect an abnormality of electrical resistance caused in a substrate.SOLUTION: A plating apparatus comprises: a resistance measuring device for measuring the electrical resistance of an edge part of an electrical conduction layer of a substrate which is a plating object; and a substrate holder for holding the substrate. The resistance measuring device is configured so as to be able to measure the electrical resistance of the substrate before the substrate is held by the substrate holder.SELECTED DRAWING: Figure 4

Description

  The present invention relates to a plating apparatus and a plating method.

  There is known a plating apparatus that holds a substrate such as a semiconductor wafer with a substrate holder and immerses the substrate in a plating solution in a plating tank. As shown in FIG. 13, the substrate holder includes a plurality of internal contacts 100 that contact the peripheral edge of the substrate W, and a plurality of external contacts 101 that are respectively connected to the internal contacts 100. Wirings 104 connecting the plurality of internal contacts 100 and the plurality of external contacts 101 are arranged inside the substrate holder. The external contact 101 is brought into contact with the power supply terminal 103 connected to the power source 105 when the substrate holder is disposed at a predetermined position in the plating tank. The current flows to the substrate W through the external contact 101 and the internal contact 100, and a metal film is formed on the surface of the substrate W in the presence of the plating solution.

  When the electrical resistance between an internal contact 100 and the substrate W (hereinafter simply referred to as the electrical resistance of the internal contact 100) is extremely high or extremely low, the current flowing through the plurality of internal contacts 100 becomes non-uniform, There may be a problem with the uniformity of the film thickness in the substrate surface. Therefore, there is a technique for inspecting the substrate and the substrate holder by measuring the resistance value against the current flowing from the internal contact of the substrate holder to the substrate while the substrate is held by the substrate holder (for example, Patent Documents 1 and 2).

Japanese Patent Laying-Open No. 2015-200017 JP 2005-146399 A

  In Patent Document 1, in a state where the substrate is held by the substrate holder, the electrical resistance to the current flowing from one electrical contact of the substrate holder through the substrate to the other electrical contact of the substrate holder is measured. When the electrical resistance is within the allowable range, the normal state is assumed. When the electrical resistance is not within the allowable range, it is determined that the substrate or the substrate holder is abnormal. There are two main causes for abnormal electrical resistance. One is a factor on the substrate side. For example, when the conductive layer (seed layer) is not uniformly formed on the surface of the substrate, or when unnecessary materials generated when applying a resist to the substrate remain on the substrate, the surface of the substrate is oxidized. In some cases, abnormal electrical resistance may occur. The other is a factor on the substrate holder side. When the internal contact of the substrate holder is deformed, or when foreign material such as resist adheres to the internal contact of the substrate holder, or when the plating solution adheres to the internal contact of the substrate holder, etc. Anomalies may occur. However, in the method disclosed in Patent Document 1, even when an abnormality occurs in the electrical resistance, it cannot be determined whether the cause is in the substrate or in the substrate holder. For example, if there is an abnormality in the substrate holder and there is no abnormality in the substrate itself, a normal plating process can be performed by replacing the substrate holder. However, in order to make such a determination, it is necessary to clarify whether the cause of the abnormal electrical resistance is on the substrate side or the substrate holder side. Therefore, an object of the present application is to be able to detect an abnormality in electrical resistance due to a cause generated in a substrate.

[Embodiment 1] According to Embodiment 1, a plating apparatus is provided. The plating apparatus includes a resistance measuring instrument for measuring an electric resistance of a conductive layer at an edge portion of a substrate that is an object to be plated, and a substrate for holding the substrate. And the resistance measuring instrument is configured to measure the electrical resistance of the substrate before holding the substrate by the substrate holder. According to the plating apparatus of the first aspect, it is possible to find a defect in the substrate by measuring the electric resistance of the conductive layer at the edge portion of the substrate immediately before starting the plating process. With the passage of time, an oxide film may be formed on the conductive layer at the edge portion of the substrate, or organic substances volatilized from the resist may adhere, so by determining the state of the substrate immediately before starting the plating process, A good plating process can be performed.

  [Mode 2] According to mode 2, in the plating apparatus according to mode 1, the resistance measuring device is configured to measure electrical resistances at a plurality of portions of the conductive layer of the edge portion of the substrate.

  [Mode 3] According to mode 3, in the plating apparatus according to mode 1 or mode 2, the resistance measuring instrument has a contact pin configured to come into contact with the conductive layer at the edge portion of the substrate.

  [Mode 4] According to mode 4, in the plating apparatus according to mode 3, the contact pins are configured to be movable in the circumferential direction of the substrate. According to the fourth aspect, by moving the contact pin without moving or rotating the substrate, it is possible to measure the electrical resistance of a plurality of regions of the edge portion of the substrate.

  [Embodiment 5] According to Embodiment 5, in the plating apparatus according to any one of Embodiments 1 to 4, the apparatus further includes an aligner for aligning the orientation of the substrate with a predetermined direction. It is configured to measure the electrical resistance of a substrate disposed on the aligner. According to the fifth aspect, the electrical resistance of a plurality of regions of the substrate can be measured using the rotation mechanism of the aligner. In addition, since a dedicated place for measuring the electrical resistance of the substrate is not required, it is possible to prevent an increase in the installation area of the plating apparatus.

  [Mode 6] According to Mode 6, in the plating apparatus according to any one of Modes 1 to 4, the plating apparatus further includes a fixing unit for fixing the substrate to the substrate holder, and the resistance measuring instrument includes: The electrical resistance of the substrate disposed in the fixing unit is measured. According to the sixth aspect, since a dedicated place for measuring the electric resistance of the substrate is not required, it is possible to prevent an increase in the installation area of the plating apparatus.

  [Mode 7] According to Mode 7, in the plating apparatus according to any one of Modes 1 to 6, the plating apparatus further includes a control device that receives a resistance value measured by the resistance measuring instrument. The substrate state is determined based on the received resistance value. According to the seventh aspect, the quality of the substrate can be automatically determined by the control device.

  [Embodiment 8] According to Embodiment 8, the plating apparatus according to any one of Embodiments 1 to 7 further includes an edge portion cleaning device for cleaning the edge portion of the substrate. According to the eighth aspect, the oxide film formed on the edge portion of the substrate or the attached foreign matter is cleaned by cleaning the edge portion of the substrate determined to be defective based on the measured value of the electrical resistance of the edge portion of the substrate. And the substrate can be in a good state.

  [Embodiment 9] According to Embodiment 9, a resistance measuring device for measuring the electrical resistance of the conductive layer at the edge portion of the substrate that is the object to be plated, a substrate holder for holding the substrate, and a control device including a computer, In the plating apparatus having the step of measuring the electrical resistance of the conductive layer at the edge portion of the substrate before holding the substrate which is the object to be plated on the substrate holder, and based on the measured electrical resistance of the substrate, the substrate And a step of determining the state of the computer are provided.

[Tenth Mode] According to the tenth aspect, in the computer program according to the ninth mode, the step of measuring the electrical resistance includes a step of measuring electrical resistances at a plurality of portions of the conductive layer on the edge portion of the substrate.

  [Mode 11] According to mode 11, in the computer program according to mode 9 or 10, the step of cleaning the edge portion of the substrate is further executed. According to the eleventh aspect, by cleaning the edge portion of the substrate determined to be defective based on the measured value of the electrical resistance of the edge portion of the plate, the oxide film formed on the edge portion of the substrate or the attached foreign matter And the substrate can be in a good state.

  [Mode 12] According to mode 12, in the computer program according to any one of modes 9 to 11, the step of measuring the electrical resistance of the conductive layer at the edge portion of the plated substrate after the plating process is further provided. Let it run. According to the twelfth aspect, it is possible to detect whether or not a leak has occurred in the substrate holder during the plating process by measuring the electrical resistance of the conductive layer at the edge portion of the substrate before and after the plating process.

  [Mode 13] According to mode 13, a computer-readable non-transitory recording medium in which a computer program according to any one of modes 9 to 12 is recorded is provided.

  [Embodiment 14] According to Embodiment 14, a plating method is provided, and the plating method measures the electrical resistance of the conductive layer at the edge portion of the substrate before holding the substrate as the object to be plated on the substrate holder. And determining the state of the substrate based on the measured electrical resistance of the substrate. According to the fourteenth aspect, it is possible to find a defect in the substrate by measuring the electric resistance of the conductive layer at the edge portion of the substrate immediately before starting the plating process. With the passage of time, an oxide film may be formed on the conductive layer at the edge portion of the substrate, or organic substances volatilized from the resist may adhere, so by determining the state of the substrate immediately before starting the plating process, A good plating process can be performed.

1 is an overall layout diagram of a plating apparatus according to an embodiment. It is a perspective view of the board | substrate holder used with the plating apparatus shown by FIG. It is sectional drawing which shows the electrical contact of the board | substrate holder shown by FIG. It is a side view which shows the resistance measuring device by one Embodiment roughly. It is a top view which shows roughly the resistance measuring device shown by FIG. It is a top view which shows the resistance measuring device by one Embodiment roughly. As an example, it is the graph which showed the measured value of the resistance of the board | substrate which used the copper from which thickness differs as a seed layer. It is a schematic top view which shows the aligner provided with the edge part cleaning apparatus by one Embodiment. It is a schematic sectional drawing of the aligner in the arrow 9-9 shown in FIG. It is a schematic sectional drawing of the aligner in arrow 10-10 shown in FIG. It is a flowchart which shows the plating method by one Embodiment. It is a flowchart which shows the plating method by one Embodiment. It is the schematic which shows the electrical path of a board | substrate holder. It is a top view which shows the resistance measuring device by one Embodiment roughly. It is a top view which shows the resistance measuring device by one Embodiment roughly. It is a top view which shows the resistance measuring device by one Embodiment roughly. It is a top view which shows the resistance measuring device by one Embodiment roughly. It is a schematic side view of the resistance measuring device of FIG. 14A-FIG. 14D. It is a top view which shows the resistance measuring device by one Embodiment roughly. It is a top view which shows the resistance measuring device by one Embodiment roughly. It is a schematic side view of the resistance measuring device of FIG. 16A and FIG. 16B. It is a top view which shows the resistance measuring device by one Embodiment roughly. It is a top view which shows the resistance measuring device by one Embodiment roughly. It is a top view which shows the resistance measuring device by one Embodiment roughly. It is a top view which shows the resistance measuring device by one Embodiment roughly. It is a schematic side view of the resistance measuring device of FIG. 18A-FIG. 18D. It is a top view which shows the resistance measuring device by one Embodiment roughly. It is a top view which shows the resistance measuring device by one Embodiment roughly. It is a schematic side view of the resistance measuring device of FIG. 20A and FIG. 20B.

  Hereinafter, embodiments of a plating apparatus and a substrate holder used in the plating apparatus according to the present invention will be described with reference to the accompanying drawings. In the accompanying drawings, the same or similar elements are denoted by the same or similar reference numerals, and redundant description of the same or similar elements may be omitted in the description of each embodiment. Further, the features shown in each embodiment can be applied to other embodiments as long as they do not contradict each other.

  FIG. 1 is an overall layout diagram of a plating apparatus according to an embodiment. As shown in FIG. 1, this plating apparatus is roughly divided into a load / unload unit 170A for loading a substrate to the substrate holder 60 or unloading the substrate from the substrate holder 60, and a processing unit 170B for processing the substrate. It is done.

  The load / unload unit 170A includes three hoops (Front-Opening Unified Pod: FOUP) 102, an aligner 40 for aligning the orientation flat (notation flat) and notch of the substrate in a predetermined direction, and after the plating process. And a spin rinse dryer 20 for drying the substrate by rotating it at a high speed. The hoop 102 stores a plurality of substrates such as semiconductor wafers in multiple stages. Near the spin rinse dryer 20, there is provided a fixing unit 120 on which the substrate holder 60 is placed and the substrate is attached and detached. In the center of these units 102, 40, 20, and 120, a substrate transfer device 122 including a transfer robot that transfers a substrate between these units is disposed.

  The fixing unit 120 is configured so that two substrate holders 60 can be placed thereon. In the fixing unit 120, the substrate is transferred between the one substrate holder 60 and the substrate transfer device 122, and then the substrate is transferred between the other substrate holder 60 and the substrate transfer device 122.

  The processing unit 170B of the plating apparatus includes a stocker 124, a pre-wet tank 126, a pre-soak tank 128, a first cleaning tank 130a, a blow tank 132, a second cleaning tank 130b, and the plating tank 10. In the stocker 124, the substrate holder 60 is stored and temporarily placed. In the pre-wet tank 126, the substrate is immersed in pure water. In the pre-soak tank 128, the oxide film on the surface of the conductive layer such as the seed layer formed on the surface of the substrate is removed by etching. In the first cleaning tank 130a, the pre-soaked substrate is cleaned with a cleaning liquid (pure water or the like) together with the substrate holder 60. In the blow tank 132, the substrate is drained after cleaning. In the second cleaning tank 130b, the substrate after plating is cleaned with the cleaning liquid together with the substrate holder 60. The stocker 124, the pre-wet tank 126, the pre-soak tank 128, the first cleaning tank 130a, the blow tank 132, the second cleaning tank 130b, and the plating tank 10 are arranged in this order.

The plating tank 10 includes, for example, a plurality of plating cells 134 provided with an overflow tank. Each plating cell 134 houses one substrate therein and immerses the substrate in a plating solution held inside. By applying a voltage between the substrate and the anode in the plating cell 134, plating such as copper plating is performed on the substrate surface.

  The plating apparatus includes a substrate holder transport device 140 that is located on the side of each of these devices and transports the substrate holder 60 together with the substrates between these devices, for example, employing a linear motor system. The substrate holder transport device 140 includes a first transporter 142 and a second transporter 144. The first transporter 142 is configured to transfer the substrate between the fixing unit 120, the stocker 124, the pre-wet tank 126, the pre-soak tank 128, the first cleaning tank 130 a, and the blow tank 132. The second transporter 144 is configured to transfer the substrate between the first cleaning tank 130 a, the second cleaning tank 130 b, the blow tank 132, and the plating tank 10. In another embodiment, the plating apparatus includes only one of the first transporter 142 and the second transporter 144, and any one of the transporters includes the fixing unit 120, the stocker 124, the pre-wet bath 126, The substrate may be transferred among the pre-soak tank 128, the first cleaning tank 130a, the second cleaning tank 130b, the blow tank 132, and the plating tank 10.

  FIG. 2 is a perspective view of the substrate holder 60 used in the plating apparatus shown in FIG. As shown in FIG. 2, the substrate holder 60 includes a first holding member 65 made of, for example, vinyl chloride and having a rectangular flat plate shape, and a second holding member attached to the first holding member 65 through a hinge 63 so as to be opened and closed. 66. A holding surface 68 for holding the substrate is provided at a substantially central portion of the first holding member 65 of the substrate holder 60. Further, on the outer side of the holding surface 68 of the first holding member 65, inverted L-shaped clampers 67 having protrusions protruding inward along the circumference of the holding surface 68 are provided at equal intervals. .

  A pair of substantially T-shaped hands 69 are connected to the end of the first holding member 65 of the substrate holder 60 as a support when the substrate holder 60 is transported or supported in a suspended manner. In the stocker 124 illustrated in FIG. 1, the substrate holder 60 is suspended and supported vertically by hooking the hand 69 on the upper surface of the peripheral wall of the stocker 124. Further, the substrate holder 60 is conveyed by holding the hand 69 of the substrate holder 60 supported by the suspension by the first transporter 142 or the second transporter 144. Note that the substrate holder 60 is also supported by being suspended on the peripheral walls via the hand 69 in the pre-wet tank 126, the pre-soak tank 128, the cleaning tanks 130a and 130b, the blow tank 132, and the plating tank 10.

  The hand 69 is provided with an external contact (not shown) for connection to an external power supply unit. The external contacts are electrically connected to a plurality of conductors 73 (see FIG. 3) provided on the outer periphery of the holding surface 68 via a plurality of wirings.

  The second holding member 66 includes a base portion 61 fixed to the hinge 63 and a ring-shaped seal holder 62 fixed to the base portion 61. A presser ring 64 for pressing and fixing the seal holder 62 against the first holding member 65 is rotatably mounted on the seal holder 62 of the second holding member 66. The presser ring 64 has a plurality of protrusions 64a that protrude outward at the outer peripheral portion thereof. The upper surface of the protruding portion 64a and the lower surface of the inwardly protruding portion of the clamper 67 have tapered surfaces that are inclined in opposite directions along the rotational direction.

When holding the substrate, first, the substrate is placed on the holding surface 68 of the first holding member 65 with the second holding member 66 open, and the second holding member 66 is closed. Subsequently, the presser ring 64 is rotated clockwise, and the protrusion 64 a of the presser ring 64 is slid into the inner projecting portion (lower side) of the clamper 67. Thus, the first holding member 65 and the second holding member 66 are tightened and locked to each other via the tapered surfaces provided on the presser ring 64 and the clamper 67, respectively, and the substrate is held. When releasing the holding of the substrate, the presser ring 64 is rotated counterclockwise while the first holding member 65 and the second holding member 66 are locked. As a result, the protrusion 64a of the presser ring 64 is removed from the inverted L-shaped clamper 67, and the holding of the substrate is released.

  FIG. 3 is a cross-sectional view showing electrical contacts of the substrate holder 60 shown in FIG. As shown in FIG. 3, the substrate W is placed on the holding surface 68 of the first holding member 54. Between the holding surface 68 and the first holding member 54, a plurality of (one in the figure) conductors 73 connected to a plurality of wires extending from external contacts provided in the hand 69 shown in FIG. Has been. When the substrate 73 is placed on the holding surface 68 of the first holding member 54, the conductor 73 has a spring characteristic on the surface of the first holding member 54 with the end portion of the conductor 73 on the side of the substrate W. A plurality of substrates are arranged outside the circumference of the substrate W so as to be exposed in this state.

  A surface of the seal holder 62 facing the first holding member 54 (a lower surface in the drawing) is pressed against the outer peripheral portion of the surface of the substrate W and the first holding member 54 when the substrate W is held by the substrate holder 60. A member 70 is attached. The seal member 70 includes a lip portion 70 a that seals the surface of the substrate W, and a lip portion 70 b that seals the surface of the first holding member 54.

  A support 71 is attached to the inside of the seal member 70 sandwiched between the pair of lip portions 70a and 70b. An electrical contact 72 configured to be able to supply power from the conductor 73 is fixed to the support 71 with, for example, a screw, and a plurality of electrical contacts 72 are arranged along the circumference of the substrate W. The electrical contact 72 has an electrical contact end portion 72 a extending toward the inside of the holding surface 68 and a leg portion 72 b configured to be able to supply power from the conductor 73.

  When the first holding member 65 and the second holding member 66 shown in FIG. 2 are locked, a short lip portion 70a on the inner peripheral surface side of the seal member 70 is formed on the surface of the substrate W as shown in FIG. The long lip portion 70b on the outer peripheral surface side is pressed against the surface of the first holding member 54. Accordingly, the gap between the lip portion 70a and the lip portion 70b is securely sealed, and the substrate W is held.

  In the region sealed by the seal member 70, that is, the region sandwiched between the pair of lip portions 70a and 70b of the seal member 70, the conductor 73 is electrically connected to the leg portion 72b of the electrical contact 72, and the electrical contact end The portion 72a contacts the seed layer on the edge portion of the substrate W. Accordingly, power can be supplied to the substrate W via the electrical contact 72 in a state where the substrate W is held by the substrate holder 60 while being sealed by the sealing member 70.

  As described above, a resist pattern is formed in advance on the substrate W on which the seed layer is formed. Before the substrate W is transported to the plating apparatus shown in FIG. 1, UV irradiation or the like is performed to remove the resist residue on the substrate surface (ashing process), and the resist surface is hydrophilized (discum process). ) Is performed. The substrate W that has been subjected to the ashing process and the discaming process is then transferred to the plating apparatus and held by the substrate holder 60. Here, on the seed layer on the edge portion of the substrate W where the resist is not applied, an oxide film is formed or an organic substance volatilized from the resist adheres as time elapses from the ashing process and the discaming process. There is. As shown in FIG. 3, since the electrical contact 72 contacts the edge portion of the substrate W, if an oxide film is formed on the seed layer on the edge portion of the substrate W or an organic substance adheres, a plurality of substrate holders 60 are formed. The contact resistance between the electrical contacts 72 may vary, and the uniformity of the plating film thickness may deteriorate.

In one embodiment, the plating apparatus includes a resistance measuring device 200 that measures the electrical resistance of the seed layer at the edge portion of the substrate W. In the present specification, the edge portion of the substrate W refers to a region where the electrical contact 72 can contact, or a periphery of the substrate W rather than a portion where the seal member 70 contacts when the substrate W is held by the substrate holder 60. An area on the part side. For example, in the present embodiment, it refers to a region on the outer peripheral side with respect to the portion where the lip portion 70a of the seal member 70 shown in FIG. 3 contacts, and is within a range of about 5 mm from the outer peripheral edge of the substrate W toward the center of the substrate. More preferably, it is within the range of about 2 mm. FIG. 4 is a side view schematically showing a resistance measuring device 200 according to an embodiment. FIG. 5 is a top view schematically showing the resistance measuring device 200 shown in FIG. In one embodiment, the resistance meter 200 can be located in the aligner 40 or the fixing unit 120. Alternatively, the resistance measuring device 200 may be provided in a dedicated resistance measuring station in the plating apparatus. The resistance measuring device 200 includes a resistance measuring head 202. The resistance measuring head 202 can be a disk-like structure having a diameter substantially the same as that of the substrate W to be measured or a diameter larger than the diameter of the substrate W. The resistance measuring head 202 is configured to be movable in a direction perpendicular to the surface of the substrate W by a moving mechanism (not shown). In one embodiment, the resistance measurement head 202 may be configured to be rotatable about the central axis of the resistance measurement head 202 and the central axis of the substrate W.

  As shown in FIGS. 4 and 5, the resistance measuring device 200 includes a contact pin 204 disposed on the lower surface of the resistance measuring head 202, that is, the surface facing the substrate W. The contact pin 204 is disposed on the resistance measurement head 202 at a position where the contact pin 204 contacts the edge portion of the substrate W when the resistance measurement head 202 moves in the direction of the substrate W. In the embodiment of FIG. 5, four contact pins 204 are shown, but the number of contact pins 204 can be arbitrary and at least one contact pin 204 is provided on the resistance measuring head 202. In one embodiment, the contact pin 204 may comprise a probe that provides resistance measurement by a four-probe method.

  In one embodiment, the resistance measuring instrument 200 can measure the resistance of a plurality of locations on the edge portion of the substrate W. When the resistance measuring device 200 is disposed on the aligner 40, the aligner 40 includes a rotation mechanism. Therefore, the substrate W disposed on the aligner 40 is rotated to bring the contact pins 204 into contact with a plurality of positions on the edge portion of the substrate W. And the resistance can be measured at each location. When a plurality of contact pins 204 are provided, the plurality of contact pins 204 may be simultaneously brought into contact with different portions of the substrate W, and the resistance at a plurality of locations on the substrate W may be measured simultaneously. When the resistance measuring device 200 is disposed on the aligner 40, the resistance measuring head 202 may not include a rotation mechanism. When the resistance measuring device 200 is provided in the fixing unit 120, the resistance measuring head 202 can be appropriately rotated to measure the resistance at a plurality of locations on the substrate W. In the case where a plurality of contact pins 204 are provided, the plurality of contact pins 204 may be simultaneously contacted with different locations on the substrate W, and the resistance at a plurality of locations on the substrate W may be measured simultaneously. When a plurality of contact pins 204 are provided, the rotation mechanism of the resistance measuring head 202 may not be provided.

  FIG. 6 is a top view schematically illustrating a resistance measuring device 200 according to an embodiment. In the embodiment of FIG. 6, the resistance measurement head 202 includes one contact pin 204. The resistance measuring head 202 in the embodiment of FIG. 6 can be moved in a radial direction or a circumferential direction of the substrate W by a moving mechanism (not shown), and can be moved in a direction perpendicular to the surface of the substrate W. . When the resistance measuring device 200 is disposed on the aligner 40, the resistance of a plurality of edge portions of the substrate W can be measured by rotating the substrate W by the aligner 40.

14A to 14D are top views schematically showing a resistance measuring device 200 according to an embodiment. In the embodiment of FIGS. 14A to 14D, the substrate W is a rectangular substrate, and is a substrate having a substantially rectangular parallelepiped shape. Further, in FIGS. 14A to 14D, only the substrate W and the resistance measuring device 200 are shown for clarity of illustration, and the other configurations are omitted. FIG. 15 is a schematic side view of the resistance measuring device 200 of FIGS. 14A to 14D. As shown in FIG. 15, the resistance measuring device 200 includes a support shaft member 206. The support shaft member 206 is configured to be rotatable by a motor or the like. Further, the support shaft member 206 is configured to be linearly movable in two parallel and orthogonal directions (the vertical and horizontal directions in FIGS. 14A to 14D) on the surface of the substrate W. Further, the support shaft member 206 is configured to be movable in a direction (vertical direction in FIG. 15) perpendicular to the surface of the substrate W. An extension member 208 extends from the support shaft member 206 in a direction parallel to the surface of the substrate W. The extending member 208 is configured to be able to expand and contract in a direction parallel to the surface of the substrate W. A resistance measuring head 202 is attached to the extending member 208. A contact pin 204 is attached to the resistance measuring head 202. The contact pin 204 may include a probe that realizes resistance measurement by, for example, a four-probe method. The contact pin 204 can measure the electric resistance of the edge portion of the substrate W by making contact with the edge portion of the substrate W.

  In order to measure the electrical resistance of the edge portion of the substrate W, the resistance measuring head 202 is moved to a position where the contact pin 204 contacts the edge portion of the substrate W. In the state shown in FIG. 14A, the support shaft member 206 can move along the direction of the edge portion of the substrate W. Therefore, it is possible to measure the electrical resistance at an arbitrary location on one edge portion of the substrate W. In the state shown in FIG. 14A, when the electrical resistance of one edge portion of the substrate W is measured, the support shaft member 206 is rotated by 90 degrees, and the length of the extending member 208 is changed as appropriate, so that it is shown in FIG. 14B. As a result, the position of the contact pin 204 can be aligned with the next edge portion. In the state shown in FIG. 14B, the electric resistance at an arbitrary position of the edge portion of the substrate W can be measured by moving the support shaft member 206 along the edge portion of the substrate W. Further, the support shaft member 206 is rotated 90 degrees to measure the electrical resistance of the next edge portion of the substrate W (FIG. 14C), and the support shaft member 206 is further rotated 90 degrees to The electrical resistance of the edge portion can be measured (FIG. 14D). As described above, the resistance measuring device 200 according to the embodiment shown in FIGS. 14A to 14D and 15 can measure the electrical resistance of the edge portion of the square substrate. Such a resistance measuring device 200 can be arranged in the aligner 40 or the fixing unit 120. Alternatively, the resistance measuring device 200 may be provided in a dedicated resistance measuring station in the plating apparatus. In the resistance measuring device 200 according to the embodiment shown in FIGS. 14A to 14D and FIG. 15, the mechanism for moving the substrate W may not be provided since the resistance measuring device 200 includes the moving mechanism.

  16A and 16B are top views schematically showing a resistance measuring device 200 according to an embodiment. In the embodiment of FIGS. 16A and 16B, the substrate W is a rectangular substrate, and is a substrate having a substantially rectangular parallelepiped shape. In FIG. 16A and FIG. 16B, only the substrate W and the resistance measuring device 200 are shown for clarity of illustration, and the other configurations are omitted. FIG. 17 is a schematic side view of the resistance measuring device 200 of FIGS. 16A and 16B. As shown in FIG. 17, the resistance measuring device 200 includes a support shaft member 206. The support shaft member 206 is configured to be rotatable by a motor or the like. Further, the support shaft member 206 is configured to be linearly movable in two parallel and orthogonal directions (vertical and horizontal directions in FIGS. 16A and 16B) on the surface of the substrate W. Further, the support shaft member 206 is configured to be movable in a direction (vertical direction in FIG. 17) perpendicular to the surface of the substrate W. Two extending members 208 extend in the opposite direction from the support shaft member 206 in a direction parallel to the surface of the substrate W. Each extending member 208 is configured to be extendable and contractible in a direction parallel to the surface of the substrate W. A resistance measuring head 202 is attached to each of the extending members 208. A contact pin 204 is attached to the resistance measuring head 202. The contact pin 204 may include a probe that realizes resistance measurement by, for example, a four-probe method. The contact pin 204 can measure the electric resistance of the edge portion of the substrate W by making contact with the edge portion of the substrate W.

In order to measure the electrical resistance of the edge portion of the substrate W, the resistance measuring head 202 is moved to a position where each contact pin 204 contacts the edge portion of the substrate W. In the state shown in FIG. 16A, the support shaft member 206 can move along the direction of the edge portion of the substrate W. Therefore, it is possible to simultaneously measure the electrical resistance at any location of the two edge portions of the substrate W. In the state shown in FIG. 16A, when the electrical resistances of the two edge portions of the substrate W are measured, the support shaft member 206 is rotated 90 degrees, and the length of the extension member 208 is changed as appropriate, so that it is shown in FIG. 16B. As a result, the position of the contact pin 204 can be aligned with the next edge portion. In the state shown in FIG. 16B, the electric resistance at an arbitrary position of the edge portion of the substrate W can be measured by moving the support shaft member 206 along the edge portion of the substrate W. As described above, the resistance measuring device 200 according to the embodiment shown in FIGS. 16A, 16B, and 17 includes the two resistance measuring heads 202, and thus simultaneously measures the electrical resistance of the two edge portions of the rectangular substrate. be able to. Such a resistance measuring device 200 can be arranged in the aligner 40 or the fixing unit 120. Alternatively, the resistance measuring device 200 may be provided in a dedicated resistance measuring station in the plating apparatus. In the resistance measuring device 200 according to the embodiment shown in FIGS. 16A, 16B, and 17, the movement measuring mechanism is provided in the resistance measuring device 200. Therefore, there is no need to have a mechanism for moving the substrate W.

  18A to 18D are top views schematically showing a resistance measuring device 200 according to an embodiment. In the embodiment of FIGS. 18A to 18D, the substrate W is a rectangular substrate, and is a substrate having a substantially rectangular parallelepiped shape. Further, in FIGS. 18A to 18D, only the substrate W and the resistance measuring device 200 are shown for clarity of illustration, and other configurations are omitted. FIG. 19 is a schematic side view of the resistance measuring device 200 of FIGS. 18A to 18D. As shown in FIG. 19, the resistance measuring device 200 includes a support shaft member 206. The support shaft member 206 is configured to be linearly movable in a direction parallel to the surface of the substrate W (the left-right direction in FIGS. 18A to 18D). Further, the support shaft member 206 is configured to be movable in a direction (vertical direction in FIG. 19) perpendicular to the surface of the substrate W. An extension member 208 extends from the support shaft member 206 in a direction parallel to the surface of the substrate W. The extending member 208 is configured to be able to expand and contract in a direction parallel to the surface of the substrate W. A resistance measuring head 202 is attached to the extending member 208. A contact pin 204 is attached to the resistance measuring head 202. The contact pin 204 may include a probe that realizes resistance measurement by, for example, a four-probe method. The contact pin 204 can measure the electric resistance of the edge portion of the substrate W by making contact with the edge portion of the substrate W. In the embodiment shown in FIG. 19, a mechanism for holding the substrate W (for example, the aligner 40 or the fixing unit 120) is provided with a rotation mechanism, and the substrate W can be rotated.

  In order to measure the electrical resistance of the edge portion of the substrate W, the length of the extension member 208 is adjusted to a position where the contact pin 204 contacts the edge portion of the substrate W. In the state shown in FIG. 18A, the support shaft member 206 can move along the direction of the edge portion of the substrate W. Therefore, it is possible to measure the electrical resistance at an arbitrary location on one edge portion of the substrate W. In the state shown in FIG. 18A, when the electrical resistance of one edge portion of the substrate W is measured, the substrate W is rotated by 90 degrees, and the length of the extending member 208 is appropriately changed, as shown in FIG. 18B. In addition, the position of the contact pin 204 can be aligned with the next edge portion. In the state shown in FIG. 18B, the electric resistance at an arbitrary position of the edge portion of the substrate W can be measured by moving the support shaft member 206 along the edge portion of the substrate W. Further, the substrate W is rotated 90 degrees to measure the electrical resistance of the next edge portion of the substrate W (FIG. 18C), and the substrate W is further rotated 90 degrees to change the electrical resistance of the next edge portion of the substrate W. Resistance can be measured (FIG. 18D). As described above, the resistance measuring device 200 according to the embodiment shown in FIGS. 18A to 18D and FIG. 19 can measure the electrical resistance of the edge portion of the square substrate. Such a resistance measuring device 200 can be arranged in the aligner 40 or the fixing unit 120. Alternatively, the resistance measuring device 200 may be provided in a dedicated resistance measuring station in the plating apparatus. In the embodiment shown in FIGS. 18A to 18D and FIG. 19, since the rotation mechanism is provided on the substrate W side, the resistance measuring device 200 may not be provided with the rotation mechanism.

20A and 20B are top views schematically showing a resistance measuring device 200 according to an embodiment. In the embodiment of FIGS. 20A and 20B, the substrate W is a rectangular substrate, and is a substrate having a substantially rectangular parallelepiped shape. 20A and 20B, only the substrate W and the resistance measuring device 200 are shown for clarity of illustration, and other configurations are omitted. FIG. 21 is a schematic side view of the resistance measuring device 200 of FIGS. 20A and 20B. As shown in FIG. 21, the resistance measuring device 200 includes a support shaft member 206. The support shaft member 206 is configured to be linearly movable in a direction parallel to the surface of the substrate W (the left-right direction in FIGS. 16A and 16B). Further, the support shaft member 206 is configured to be movable in a direction (vertical direction in FIG. 21) perpendicular to the surface of the substrate W. Two extending members 208 extend in the opposite direction from the support shaft member 206 in a direction parallel to the surface of the substrate W. Each extending member 208 is configured to be extendable and contractible in a direction parallel to the surface of the substrate W. A resistance measuring head 202 is attached to each of the extending members 208. A contact pin 204 is attached to the resistance measuring head 202. The contact pin 204 may include a probe that realizes resistance measurement by, for example, a four-probe method. The contact pin 204 can measure the electric resistance of the edge portion of the substrate W by making contact with the edge portion of the substrate W. In the embodiment shown in FIG. 21, a mechanism for holding the substrate W (for example, the aligner 40 or the fixing unit 120) is provided with a rotation mechanism, and the substrate W can be rotated.

  In order to measure the electrical resistance of the edge portion of the substrate W, the resistance measuring head 202 is moved to a position where each contact pin 204 contacts the edge portion of the substrate W. In the state shown in FIG. 20A, the support shaft member 206 can move along the direction of the edge portion of the substrate W. Therefore, it is possible to simultaneously measure the electrical resistance at any location of the two edge portions of the substrate W. In the state shown in FIG. 20A, when the electrical resistance of the two edge portions of the substrate W is measured, the substrate W is rotated by 90 degrees, and the length of the extending member 208 is appropriately changed, as shown in FIG. 20B. In addition, the position of the contact pin 204 can be aligned with the next edge portion. In the state shown in FIG. 20B, the electrical resistance at an arbitrary position of the edge portion of the substrate W can be measured by moving the support shaft member 206 along the edge portion of the substrate W. As described above, the resistance measuring device 200 according to the embodiment shown in FIGS. 20A, 20B, and 21 includes the two resistance measuring heads 202, and thus simultaneously measures the electrical resistances of the two edge portions of the rectangular substrate. be able to. Such a resistance measuring device 200 can be arranged in the aligner 40 or the fixing unit 120. Alternatively, the resistance measuring device 200 may be provided in a dedicated resistance measuring station in the plating apparatus. In the embodiment shown in FIGS. 20A, 20B, and 21, since the rotation mechanism is provided on the substrate W side, the resistance measuring device 200 may not be provided with the rotation mechanism.

  The resistance measuring device 200 is connected to the control device 500 (see FIGS. 1 and 4). The resistance value of the edge portion of the substrate W measured by the resistance measuring device 200 is transmitted to the control device 500. In the control device 500, it is determined whether or not the transmitted resistance value of the edge portion of the substrate W is within a predetermined range. As an embodiment, the predetermined range can be a value calculated theoretically from the thickness of the seed layer formed on the substrate W, for example. Alternatively, a predetermined range may be determined from an actual measurement value obtained by measuring in advance a resistance value of a standard substrate serving as a reference on which the seed layer is formed. In this case, the standard substrate may be a plurality of standard substrates having different seed layer thicknesses. A predetermined range of the resistance value is stored in the control device 500. FIG. 7 is a graph showing, as an example, measured values of resistance of a substrate using copper having different thicknesses as a seed layer.

When measuring the resistance value of the edge part of the several area | region of the board | substrate W with the resistance measuring device 200, when all the resistance values of each area | region are in a predetermined range, it is judged that it is a board | substrate which can be plated. it can. Furthermore, a criterion for determining that the plating process can be performed may be that the variation in the resistance value of each region is within a predetermined range. For example, it may be determined that the substrate can be plated when the variation in resistance value in each region is within a range of + 15% to −15%. The variation in the resistance value can be determined from, for example, the difference between the maximum value and the minimum value or the maximum deviation from the average value. Furthermore, when measuring the resistance value of the edge portion of the substrate W, the resistance value in the same region may be measured a plurality of times, and the average value may be used as the resistance value in that region.

  In one embodiment, the plating apparatus can include an edge cleaning device 45. As an example, the edge cleaning device 45 can be used to desorb (remove) organic substances formed on the seed layer on the edge of the substrate W. As an embodiment, the edge cleaning device 45 can be provided in the aligner 40. Alternatively, a dedicated station for the edge cleaning device 45 may be provided in the plating apparatus.

  FIG. 8 is a schematic top view of the aligner 40 including the edge portion cleaning device 45. FIG. 9 is a schematic cross-sectional view of the aligner 40 taken along the line 9-9 shown in FIG. 8, and FIG. 10 is a schematic cross-sectional view of the aligner 40 taken along the line 10-10 shown in FIG. As shown in FIGS. 8 to 10, the aligner 40 includes a base 41, a rotary stage 42, an aligner light source 43, a photodetector 44, and an edge cleaning device 45.

  The rotation stage 42 is configured to suck the back surface of the substrate W, and rotates the substrate W in the circumferential direction. The rotary stage 42 sucks the substrate W by an electrostatic suction type or a vacuum suction type. The aligner light source 43 is configured to irradiate light 46 near the edge portion of the substrate W rotated by the rotary stage 42. When the notch of the substrate W is moved to the position where the light 46 from the aligner light source 43 is irradiated by the rotation of the substrate W, the light 46 passes through the notch and reaches the photodetector 44. When the light detector 44 detects the light 46, the aligner 40 can recognize that the notch of the substrate W is located immediately below the aligner light source 43, and can align the orientation of the substrate W.

  The edge cleaning device 45 is a UV irradiation device or a plasma emission device. In the present embodiment, UV or plasma can be locally applied to the edge portion of the substrate W from above the substrate W. The edge cleaning device 45 can locally apply UV or plasma to the edge of the substrate W before being held by the substrate holder 60. In other words, the region other than the edge portion of the substrate W is not exposed to UV or plasma. By rotating the substrate W by the rotating stage 42, UV or plasma can be efficiently applied over the entire periphery of the edge portion of the substrate W. When UV or plasma is irradiated to the organic substance attached to the edge portion of the substrate W, the organic substance is decomposed to generate a volatile substance, and the organic substance that has become the volatile substance is volatilized and removed. The distance between the UV irradiation source of the UV irradiation apparatus or the plasma radiation port of the plasma radiation apparatus and the substrate W is preferably about 1 mm or more and about 10 mm or less. If this distance is less than 1 mm, there is a possibility that the substrate and the UV radiation source or the plasma radiation port of the plasma radiation device are in physical contact. If this distance exceeds 10 mm, UV or plasma may not be locally irradiated. In order to make it possible to irradiate the substrate and the UV irradiation source or the plasma radiation port of the plasma radiation apparatus more securely without being brought into physical contact with each other, this distance is set to about 2 mm or more and about 5 mm or less. More preferably.

  When the edge cleaning device 45 is a UV irradiation device, as the UV light source, for example, a high pressure mercury lamp, a low pressure mercury lamp, a black light, or a laser light source capable of emitting light in the UV region can be employed. . High-pressure mercury lamps, low-pressure mercury lamps, and black lights tend to diverge light, so when using these light sources, install the light source near the substrate W or use only an optical system at the edge. It is preferable to irradiate UV. When the edge cleaning device 45 is a plasma radiation device, for example, an atmospheric remote plasma device or the like can be employed.

The aligner 40 further irradiates the edge portion of the substrate W as excitation light with light in the ultraviolet region (200 nm to 380 nm), for example, light having a wavelength of 365 nm, from above the edge portion to the edge portion of the substrate W. A sensor (spectrophotometer) configured to measure the absorbance by observing the reflected light from the edge portion, or a sensor for irradiating light in the fluorescent region and monitoring the intensity of the reflected light (fluorescent reflection) A film thickness meter) may be provided.

  This sensor (not shown) may be provided in the edge part cleaning device 45, or may be provided separately in the aligner 40. The control device 500 of the plating apparatus according to this embodiment determines whether or not the contamination (organic matter and oxide film) of the edge portion depends on whether the absorbance or fluorescence intensity value measured by this sensor is larger than a preset threshold value. It is possible to determine whether it is sufficiently removed. Alternatively, by measuring the resistance of the edge portion of the substrate W using the resistance measuring instrument 200 described above, it may be determined whether or not the contaminant on the edge portion is sufficiently removed. For example, when it is determined that the contaminants at the edge portion are not sufficiently removed, the edge cleaning device 45 may repeatedly perform the step of locally radiating UV or plasma to the edge portion of the substrate W. Good. If it is determined that the contaminants at the edge portion have been sufficiently removed, the substrate W is transported to the fixing unit 120 by the substrate transport device 122, assuming that the removal of the organic matter has been completed. Subsequently, a series of plating processes are performed. In this way, it is determined whether or not the contaminant is present on the edge portion of the substrate W before the plating process, and then the plating process is performed on the substrate on which the contaminant does not remain on the edge portion. Further, it is possible to more reliably prevent the deterioration of the in-plane uniformity of the plating film thickness of the substrate W caused by the variation in the contact resistance of the electrical contacts of the substrate holder 60.

  The edge part cleaning device 45 may be configured differently from the above-described embodiment. For example, the edge cleaning device 45 may supply a chemical solution for removing an oxide film formed on the edge portion of the substrate W while rotating the substrate W. Alternatively, the edge cleaning device 45 rotates the substrate W while bringing a sponge or the like into contact with the edge portion of the substrate W to physically remove foreign matters such as organic substances and oxide films formed on the edge portion of the substrate W. Can be.

  FIG. 11 is a flowchart showing a plating method according to an embodiment. As one embodiment, the present plating method can be performed using the plating apparatus described above. First, the substrate W to be plated is received in the plating apparatus by the load / unload unit 170A (S102). The substrate W is transferred to the aligner 40 by the substrate transfer device 122, and the orientation of the substrate is adjusted to a predetermined direction by the aligner 40 (S104). Next, the electrical resistance of the seed layer at the edge portion of the substrate W is measured (S106). The electrical resistance can be measured by the resistance measuring instrument 200 described above. It is determined whether or not the measured electrical resistance is within a predetermined range (S108). Such a determination is made by the control device 500, for example. If the electrical resistance is not within the predetermined range, it is considered that uniform plating cannot be performed, and thus the substrate W is returned to the FOUP 102. The measurement of electrical resistance (S106 to S110) may be performed before aligning the substrate with the aligner 40 (S104). When the electrical resistance is within the predetermined range, the substrate W is held by the substrate holder 60 (S112). When the substrate W is held by the substrate holder 60, a continuity check is performed to determine whether or not current flows from the electrical contact of the substrate holder 60 to the substrate W (S114). Note that the continuity check may be omitted. Thereafter, a subsequent plating process is performed with the substrate W held by the substrate holder 60 (S116).

  According to this plating method, by measuring the electrical resistance of the seed layer that is the conductive layer at the edge portion of the substrate W, an abnormality of the substrate W can be detected, and unnecessary plating treatment can be avoided. In the technique of Patent Document 1 described above, it has not been possible to determine whether the abnormality in electrical resistance is a factor on the substrate side or a factor on the substrate holder side. However, in the plating method according to the present disclosure, the factor on the substrate side An abnormality in electrical resistance can be detected. Note that the seed layer which is a conductive layer is a layer containing a metal including at least one of Cu (copper), nickel (Ni), cobalt (Co), ruthenium (Ru), and palladium (Pd). Can do.

  FIG. 12 is a flowchart showing a plating method according to an embodiment. As one embodiment, the present plating method can be performed using the plating apparatus described above. First, the substrate W to be plated is received in the plating apparatus by the load / unload unit 170A (S202). The substrate W is transferred to the aligner 40 by the substrate transfer device 122, and the direction of the substrate is adjusted to a predetermined direction by the aligner 40 (S204). Next, the electrical resistance of the seed layer at the edge portion of the substrate W is measured (S206). The electrical resistance can be measured by the resistance measuring instrument 200 described above. It is determined whether or not the measured electrical resistance is within a predetermined range (S208). Such a determination is made by the control device 500, for example. If the electrical resistance is not within a predetermined range, if the conductive layer (seed layer) is not uniformly formed on the surface of the substrate, or if unnecessary materials generated when applying a resist to the substrate remain on the substrate, A case where the surface of the substrate is oxidized is considered. Therefore, the edge portion of the substrate W is cleaned (S210). The edge portion of the substrate W can be cleaned by, for example, the edge cleaning device 45 described above. After the edge portion of the substrate W is cleaned, the alignment of the substrate W is again performed by the aligner 40 (S204), and the electrical resistance of the edge portion of the substrate W is measured and determined (S206, S208). The measurement of electrical resistance (S106 to S110) may be performed before aligning the substrate with the aligner 40 (S104). When the electrical resistance is within the predetermined range, the substrate W is held by the substrate holder 60 (S212). When the substrate W is held by the substrate holder 60, a continuity check is performed to determine whether or not current flows from the electrical contact of the substrate holder 60 to the substrate W (S214). Note that the continuity check may be omitted. Thereafter, a subsequent plating process is performed with the substrate W held by the substrate holder 60 (S216). If the electrical resistance of the edge portion of the substrate W does not fall within a predetermined range even after the edge portion of the substrate W is cleaned, the substrate W is returned to the FOUP 102 and no plating process is performed on the substrate W. You may do it.

  According to such a plating method, when there is an abnormality in the edge portion of the substrate, the edge portion of the substrate can be cleaned so that the edge portion of the substrate is in an appropriate state and an appropriate plating process can be performed. it can. By measuring the electrical resistance of the seed layer, which is a conductive layer, at the edge portion of the substrate W, an abnormality on the substrate side can be detected, so that such a countermeasure can be taken.

  As one embodiment, the resistance measuring instrument 200 can be used as a leak detection function of the substrate holder 60. As described with reference to FIG. 3, when the substrate W is held by the substrate holder 60, the edge portion of the substrate W is isolated from the surface to be plated of the substrate W by the seal member 70. Therefore, in a state where sealing is properly performed, the plating solution does not touch the edge portion of the substrate W during the plating process. However, if the sealing is not performed properly, the plating solution may enter the region of the edge portion of the substrate W during the plating process. If the plating solution adheres to the edge portion of the substrate W, it is considered that the electrical resistance of the edge portion of the substrate W increases. Therefore, as described above, the electrical resistance of the edge portion of the substrate W is measured before holding the substrate W on the substrate holder 60, and the electrical resistance of the edge portion of the substrate W after the plating process (after S116 and S216). It is possible to detect whether or not a leak has occurred in the substrate holder 60. If the electrical resistance of the edge portion of the substrate W is increased before and after the plating process, there is a possibility that a leak has occurred in the substrate holder 60.

  The plating method and the substrate holder leak detection method may be implemented by a computer program. The program may be recorded on a non-transitory recording medium readable by a computer (for example, the control device 500). The non-transitory recording medium may be a storage device, for example. The non-transitory recording medium may be a CD-ROM or DVD-ROM, for example.

The embodiments of the present invention have been described above based on some examples. However, the above-described embodiments of the present invention are for facilitating understanding of the present invention and do not limit the present invention. . The present invention can be changed and improved without departing from the gist thereof, and the present invention naturally includes equivalents thereof. In addition, any combination or omission of each constituent element described in the claims and the specification is possible within a range where at least a part of the above-described problems can be solved or a range where at least a part of the effect is achieved. It is.

DESCRIPTION OF SYMBOLS 40 ... Aligner 45 ... Edge part cleaning apparatus 60 ... Substrate holder 120 ... Fixing unit 122 ... Substrate conveyance apparatus 200 ... Resistance measuring device 202 ... Resistance measuring head 204 ... Contact pin 500 ... Control device W ... Substrate

Claims (14)

A plating apparatus,
A resistance measuring instrument that measures the electrical resistance of the conductive layer at the edge of the substrate that is the object to be plated;
A substrate holder for holding the substrate;
Have
The resistance meter is configured to measure the electrical resistance of the substrate before holding the substrate by the substrate holder;
Plating equipment. The plating apparatus according to claim 1,
The resistance measuring instrument is configured to measure electrical resistances at a plurality of locations of the conductive layer at the edge portion of the substrate.
Plating equipment. The plating apparatus according to claim 1 or 2,
The resistance meter has a contact pin configured to contact the conductive layer at the edge of the substrate,
Plating equipment. The plating apparatus according to claim 3,
The contact pin is configured to be movable in the circumferential direction of the substrate.
Plating equipment. The plating apparatus according to any one of claims 1 to 4, further comprising:
It has an aligner for adjusting the orientation of the board to a predetermined direction.
The resistance meter is configured to measure an electrical resistance of a substrate disposed on the aligner;
Plating equipment. The plating apparatus according to any one of claims 1 to 4, further comprising:
A fixing unit for fixing the substrate to the substrate holder;
The resistance meter is configured to measure an electrical resistance of a substrate disposed in the fixing unit;
Plating equipment. The plating apparatus according to any one of claims 1 to 6, further comprising:
A control device for receiving a resistance value measured by the resistance measuring instrument;
The controller is configured to determine a state of the substrate based on the received resistance value;
Plating equipment. The plating apparatus according to any one of claims 1 to 7, further comprising:
Having an edge cleaning apparatus for cleaning the edge of the substrate;
Plating equipment. A resistance measuring instrument that measures the electrical resistance of the conductive layer at the edge of the substrate that is the object to be plated;
In a plating apparatus having a substrate holder for holding a substrate and a control device including a computer,
Measuring the electrical resistance of the conductive layer at the edge of the substrate before holding the substrate, which is a plating object, on the substrate holder;
Determining the state of the substrate based on the measured electrical resistance of the substrate;
A computer program for running. A computer program according to claim 9,
The step of measuring electrical resistance includes the step of measuring electrical resistance at a plurality of locations of the conductive layer at the edge portion of the substrate.
Computer program. The computer program according to claim 9 or 10, further comprising:
To perform the step of cleaning the edge of the substrate,
Computer program. A computer program according to any one of claims 9 to 11, further comprising:
After the plating process, for performing the step of measuring the electrical resistance of the conductive layer of the edge part of the plated substrate,
Computer program.   A computer-readable non-transitory recording medium in which the computer program according to any one of claims 9 to 12 is recorded. A plating method,
Measuring the electrical resistance of the conductive layer at the edge of the substrate before holding the substrate, which is a plating object, on the substrate holder;
Determining the state of the substrate based on the measured electrical resistance of the substrate;
Having
Plating method.