JP7127184B2 - Methods for inspecting plating equipment, substrate holders, resistance measurement modules, and substrate holders - Google Patents

Description

The present application relates to a plating apparatus, a substrate holder, a resistance measurement module, and a method of inspecting a substrate holder.

2. Description of the Related Art A plating apparatus is known in which a substrate such as a semiconductor wafer is held by a substrate holder and the substrate is immersed in a plating solution in a plating bath. As shown in FIG. 18, the substrate holder has a plurality of internal contacts 100 that contact the periphery of the substrate W, and a plurality of external contacts 101 that are connected to the internal contacts 100 respectively. Wiring 104 connecting the plurality of internal contacts 100 and the plurality of external contacts 101 is arranged inside the substrate holder. The external contact 101 is brought into contact with a power supply terminal 103 connected to a power supply 105 when the substrate holder is placed at a predetermined position in the plating tank. Current flows through the substrate W through the external contacts 101 and the internal contacts 100, forming a metal film on the surface of the substrate W in the presence of the plating solution.

When the electrical resistance between a given internal contact 100 and the substrate W (hereinafter simply referred to as the electrical resistance of the internal contact 100) is extremely high or extremely low, the current flowing through the plurality of internal contacts 100 becomes uneven, A problem may arise in the uniformity of the film thickness in the plane of the substrate. Therefore, there is a technique for inspecting the substrate and the substrate holder by measuring the resistance value against the current flowing from the internal contact of the substrate holder to the substrate while the substrate, which is the object to be plated, is held by the substrate holder (for example, Patent Document 1, 2).

JP 2015-200017 A JP-A-2005-146399

In Patent Document 1, in a state in which a substrate, which is an object to be plated, is held by a substrate holder, electrical resistance is measured against a current flowing from one electrical contact of the substrate holder through the substrate to another electrical contact of the substrate holder. When the electrical resistance is within the allowable range, the state is normal, and when the electrical resistance is not within the allowable range, the substrate or substrate holder is determined to be abnormal. There are two main reasons why the electrical resistance becomes abnormal. One factor is the board side. For example, if the conductive layer (seed layer) is not uniformly formed on the surface of the substrate, or if unnecessary substances generated when resist is applied to the substrate remain on the substrate, the surface of the substrate is oxidized. Abnormal electrical resistance may occur in some cases. Another factor is the substrate holder side. If the internal contact of the substrate holder is deformed, if foreign matter such as resist adheres to the internal contact of the substrate holder, or if plating solution adheres to the internal contact of the substrate holder, the electrical resistance will be reduced. abnormalities can occur. However, with the method disclosed in Patent Document 1, even if an abnormality occurs in electrical resistance, it cannot be determined whether the cause lies in the substrate or in the substrate holder. For example, if there is an abnormality in the substrate holder and there is no abnormality in the substrate itself, normal plating can be performed by replacing the substrate holder. Also, if there is an abnormality in the substrate and there is no abnormality in the substrate holder, the other substrates can be plated normally by replacing the substrate. However, in order to make such a judgment, it is necessary to clarify whether the cause of the abnormality in electrical resistance is on the substrate side or on the substrate holder side. Accordingly, one object of the present application is to enable detection of an abnormality in electrical resistance caused by a substrate holder.

[Mode 1] According to mode 1, there is provided a resistance measuring module for measuring the electrical resistance of a substrate holder, the substrate holder comprising an electric current contactable substrate for supplying current to the held substrate. The substrate holder can hold an inspection substrate for measuring the electrical resistance of the substrate holder, and the electrical contact contacts the inspection substrate while holding the inspection substrate. The resistance measurement module includes: a testing probe that can contact the testing substrate held by the substrate holder; and a resistance meter for measuring the value. According to the resistance measurement module according to Mode 1, it is possible to measure the electrical resistance of the substrate holder and detect an abnormality in the electrical contacts or electrical paths of the substrate holder.

[Mode 2] According to Mode 2, the resistance measurement module according to Mode 1 has a testing substrate having a plurality of electrically insulated regions.

[Mode 3] According to Mode 3, in the resistance measuring module according to Mode 2, the resistance measuring device is configured such that the inspection probes can come into contact with the plurality of regions of the inspection substrate.

[Mode 4] According to Mode 4, in the resistance measuring module according to Mode 3, the inspection probe of the resistance measuring device is configured to be movable in the in-plane direction of the inspection substrate.

[Mode 5] According to Mode 5, in the resistance measuring module according to Mode 3, the resistance measuring device has a support member, the inspection probe is attached to the support member, and the support member rotatable around an axis perpendicular to the plane of the substrate.

[Mode 6] According to Mode 6, in the resistance measurement module according to any one of Modes 3 to 5, the resistance measuring device has a plurality of test probes, each of the plurality of test probes: It is configured to be able to contact each of the plurality of regions of the inspection substrate.

[Mode 7] According to mode 7, there is provided a substrate holder comprising a substrate support for supporting a substrate and an electric current contactable substrate for supplying current to the held substrate. and a conductive plate disposed on the substrate support, wherein the electrical contact and the conductive plate are configured to be in contact with each other when the substrate holder does not hold the substrate. be. According to form 7, the electrical resistance of the substrate holder can be measured, and an abnormality in the electrical contact or electrical path of the substrate holder can be detected. In addition, it is possible to detect an abnormality in the electrical contacts or electrical paths of the substrate holder without using an inspection substrate.

[Embodiment 8] According to Embodiment 8, in the substrate holder according to Embodiment 7, a plurality of electrical contacts capable of contacting the substrate for supplying current to the held substrate; each of the plurality of electrical contacts and each of the plurality of conductive plates are configured to be in contact with each other when the substrate holder does not hold the substrate.

[Mode 9] According to mode 9, there is provided a method for inspecting a substrate holder, the method comprising the steps of causing the substrate holder to hold a substrate for inspection; contacting a contactable electrical contact of the substrate to the testing substrate; contacting the testing substrate with the testing probe; and between the electrical contact and the probe via the testing substrate. and measuring the resistance of the current flowing through. According to the method of aspect 9, the electrical resistance of the substrate holder can be measured, and an abnormality in the electrical contacts or electrical paths of the substrate holder can be detected.

[Mode 10] According to mode 10, the method according to mode 9 comprises the step of determining whether the substrate holder is usable based on the measured resistance value.

[Mode 11] According to mode 11, there is provided a method of inspecting a substrate holder, wherein the substrate holder includes a substrate support for supporting a substrate and a substrate for supplying current to the held substrate. and an electrical contact capable of contacting the substrate, and a conductive plate disposed on the substrate support, wherein the electrical contact and the conductive plate are arranged in a state in which the substrate holder does not hold the substrate. is configured to contact, the method comprising the steps of: contacting the electrical contact with the conductive plate; contacting a test probe with the conductive plate; and measuring the resistance of the current flowing between the probe. According to form 11, the electrical resistance of the substrate holder can be measured, and an abnormality in the electrical contacts or electrical paths of the substrate holder can be detected. In addition, it is possible to detect an abnormality in the electrical contacts or electrical paths of the substrate holder without using an inspection substrate.

[Mode 12] According to mode 12, the method according to mode 11 comprises determining whether the substrate holder is ready for use based on the measured resistance value.

[Mode 13] According to mode 13, there is provided a plating method, in which a substrate holder having a plurality of electrical contacts capable of coming into contact with a held substrate to be plated, the number of the plurality of electrical contacts and providing a conductive member having an equal number of conductive regions electrically isolated from each other and a resistance measurement module having probes; contacting each of the contacts with each of the plurality of current-carrying regions; and contacting the probe with each of the plurality of current-carrying regions to measure the resistance of the current flowing between the electrical contacts and the probe. determining whether or not the substrate holder is usable based on the measured resistance value; causing the substrate holder determined to be usable to hold the substrate to be plated; and a step of performing electrolytic plating by immersing the held substrate holder in a plating solution. According to the method of aspect 13, the electrical resistance of the substrate holder can be measured, and an abnormality in the electrical contacts or electrical paths of the substrate holder can be detected. The conductive member may be a test substrate or a conductive plate provided on a substrate holder.

[Mode 14] According to mode 14, when the control device for controlling the operation of the plating processing apparatus executes A computer-readable recording medium is provided in which a program for executing is recorded. The recording medium can be any recording medium, for example, a non-volatile recording medium such as a CD, DVD, hard disk, flash memory, or the like.

[Mode 15] According to mode 15, there is provided a program for causing a control device including a computer to execute the method described in mode 13.

[Mode 16] According to mode 16, there is provided a maintenance method for a plating apparatus, which includes the steps of switching the plating apparatus to a maintenance mode for inspecting substrate holders, and performing the following (1) to (4): (1) Place the substrate holder in the resistance measurement module to measure the electrical resistance of the substrate holder; (2) transmit the measured electrical resistance to the control device; (3) arranging the inspected substrate holders in the stocker; (4) inspecting uninspected substrate holders in the plating apparatus; It has a step of continuing the above processes (1) to (3) until it is completed, and a step of performing maintenance on the substrate holder whose electric resistance is determined not to be within a predetermined range by inspection. According to the maintenance method of mode 16, all substrate holders used in the plating apparatus can be inspected.

1 is an overall layout diagram of a plating apparatus according to one embodiment; FIG. 2 is a perspective view of a substrate holder according to one embodiment for use in the plating apparatus shown in FIG. 1; FIG. Figure 3 is a cross-sectional view showing electrical contacts of the substrate holder shown in Figure 2; FIG. 10 is a front view schematically illustrating a resistance measurement module, according to one embodiment; 5 is a side view of the resistance measurement module shown in FIG. 4; FIG. FIG. 10 illustrates a test substrate, according to one embodiment. FIG. 4 is a schematic diagram showing a movement mechanism of an inspection probe according to one embodiment; 1 is a schematic diagram of an inspection probe according to one embodiment; FIG. FIG. 4 is a cross-sectional view showing a state when measuring electrical resistance of a substrate holder that holds a test substrate, according to one embodiment; FIG. 4A is a plan view schematically illustrating a substrate holder according to one embodiment; Figure 11 is a cross-sectional view showing the electrical contacts of the substrate holder shown in Figure 10; FIG. 11 is a cross-sectional view showing a state in which the second holding member 66 is closed and electrical resistance is measured in the substrate holder shown in FIG. 10; FIG. 11 is a cross-sectional view showing a state in which the substrate holder shown in FIG. 10 holds a substrate to be plated. [0012] Figure 4 illustrates a flow of a method for inspecting a substrate holder, according to one embodiment. [0012] Figure 4 illustrates a flow of a method for inspecting a substrate holder, according to one embodiment. [0012] Figure 4 illustrates a flow of a method for inspecting a substrate holder, according to one embodiment. [0012] Figure 4 illustrates a flow of a method for inspecting a substrate holder, according to one embodiment. FIG. 4 is a schematic diagram showing an electrical path of a substrate holder;

DETAILED DESCRIPTION OF THE INVENTION Embodiments of a plating apparatus, a substrate holder, a resistance measurement module, and a method for inspecting a substrate holder according to the present invention will be described below with reference to the accompanying drawings. In the accompanying drawings, the same or similar elements are denoted by the same or similar reference numerals, and duplicate descriptions of the same or similar elements may be omitted in the description of each embodiment. Also, the features shown in each embodiment can be applied to other embodiments as long as they are not mutually contradictory.

FIG. 1 is an overall layout diagram of a plating apparatus according to one embodiment. As shown in FIG. 1, this plating apparatus is roughly divided into a load/unload section 170A for loading or unloading substrates onto or from the substrate holder 60, and a processing section 170B for processing the substrates. be done.

The loading/unloading unit 170A includes three FOUPs (Front-Opening Unified Pods: FOUPs) 102, an aligner 40 for aligning the orientation flats and notches of the substrate in a predetermined direction, A spin rinse dryer 20 is provided for drying the substrate by rotating it at high speed. The FOUP 102 accommodates a plurality of substrates such as semiconductor wafers in multiple stages. A fixing unit 120 is provided near the spin rinse dryer 20 to mount the substrate holder 60 and attach and detach the substrate. At the center of these units 102, 40, 20, and 120, a substrate transfer device 122, which is a transfer robot for transferring substrates between these units, is arranged.

The fixing unit 120 is configured so that two substrate holders 60 can be placed thereon. In the fixing unit 120 , the substrates are transferred between one substrate holder 60 and the substrate transfer device 122 and then transferred between the other substrate holder 60 and the substrate transfer device 122 .

The processing section 170B of the plating apparatus includes a resistance measurement module 200, a stocker 124, a pre-wet tank 126, a pre-soak tank 128, a first cleaning tank 130a, a blow tank 132, a second cleaning tank 130b, and a and a plating tank 10 . The resistance measurement module 200 is a module for measuring the electrical resistance of the substrate holder 60, which will be described later in detail. The stocker 124 stores and temporarily stores the substrate holder 60 . In the pre-wet tank 126, the substrate is immersed in pure water. In the presoak bath 128, the oxide film on the surface of the conductive layer such as the seed layer formed on the surface of the substrate is removed by etching. In the first cleaning tank 130a, the substrate after presoaking is cleaned together with the substrate holder 60 with a cleaning liquid (pure water or the like). In the blow tank 132, liquid draining from the substrate after cleaning is performed. In the second cleaning tank 130b, the plated substrate is cleaned together with the substrate holder 60 with a cleaning liquid. The resistance measurement module 200, the stocker 124, the pre-wet tank 126, the pre-soak tank 128, the first cleaning tank 130a, the blow tank 132, the second cleaning tank 130b, and the plating tank 10 are arranged in this order.

Plating bath 10 has, for example, a plurality of plating cells 134 with overflow baths. Each plating cell 134 accommodates one substrate inside and immerses the substrate in the plating solution held inside. By applying a voltage between the substrate and the anode in the plating cell 134, plating such as copper plating is performed on the surface of the substrate. For example, in the case of TSV (Through Silicon Via) plating, a barrier layer and/or an adhesive layer (eg, Ta, Ti, TiW, TiN, TaN, Ru, Co, Ni, W, etc.) and a seed layer (Cu, Ru, Ni, Co, etc.) may be formed.

The plating apparatus has a substrate holder conveying device 140, for example, employing a linear motor system, which is positioned to the side of each of these devices and conveys the substrate holder 60 together with the substrate between these devices. This substrate holder transfer device 140 has a first transporter 142 and a second transporter 144 . First transporter 142 is configured to transport substrates to and from resistance measurement module 200 , fixing unit 120 , stocker 124 , pre-wet reservoir 126 , pre-soak reservoir 128 , first cleaning reservoir 130 a and blow reservoir 132 . be. The second transporter 144 is configured to transport substrates to and from the first cleaning vessel 130 a , the second cleaning vessel 130 b , the blowing vessel 132 and the plating vessel 10 . In another embodiment, the plating apparatus includes only one of the first transporter 142 and the second transporter 144, and either transporter includes the resistance measurement module 200, the fixing unit 120, the stocker 124, The substrate may be transferred between the pre-wet bath 126, the pre-soak bath 128, the first cleaning bath 130a, the second cleaning bath 130b, the blow bath 132, and the plating bath 10.

The plating apparatus includes a control device 500 for controlling the overall operation of the plating apparatus. The control device 500 is also configured to control the operation of the resistance measurement module 200, which will be described later. The control device 500 can be composed of, for example, a general-purpose computer or a dedicated computer equipped with an input/output device, a display device, a storage device, etc., and a program for controlling the operation of the plating device is installed. be able to. Also, the control device 500 can operate the plating apparatus in a plating processing mode and a maintenance mode. The plating processing mode is a mode for plating a substrate, and the maintenance mode can be a mode for performing maintenance of the plating apparatus, for example, maintenance of the substrate holder.

FIG. 2 is a perspective view of substrate holder 60 used in the plating apparatus shown in FIG. As shown in FIG. 2, the substrate holder 60 includes a first holding member 65 made of, for example, vinyl chloride and in the shape of a rectangular flat plate, and a second holding member attached to the first holding member 65 via a hinge 63 so as to be freely openable and closable. 66. A holding surface 68 for holding the substrate is provided at substantially the center of the first holding member 65 of the substrate holder 60 . On the outside of the holding surface 68 of the first holding member 65, inverted L-shaped clampers 67 having inwardly projecting protrusions are provided at equal intervals along the circumference of the holding surface 68. .

A pair of substantially T-shaped hands 69 are connected to the ends of the first holding member 65 of the substrate holder 60 to serve as support portions when the substrate holder 60 is transported or suspended. In the stocker 124 shown in FIG. 1, the substrate holder 60 is vertically suspended by hooking a hand 69 on the upper surface of the peripheral wall of the stocker 124 . Also, the substrate holder 60 is transported by gripping the hand 69 of the suspended substrate holder 60 with the first transporter 142 or the second transporter 144 . Also in the resistance measurement module 200, the pre-wet bath 126, the pre-soak bath 128, the cleaning baths 130a and 130b, the blow bath 132, and the plating bath 10, the substrate holder 60 is suspended and supported by the peripheral wall thereof via the hand 69. be done.

The hand 69 is also provided with an external contact 71 (see FIG. 4) for connection to an external power supply. The external contact 71 is electrically connected to a plurality of electrical contacts 73 (see FIG. 3) provided on the outer circumference of the holding surface 68 via a plurality of wirings.

The second holding member 66 has a base 61 fixed to the hinge 63 and a ring-shaped seal holder 62 fixed to the base 61 . A pressing ring 64 for pressing and fixing the seal holder 62 against the first holding member 65 is rotatably attached to the seal holder 62 of the second holding member 66 . The pressing ring 64 has a plurality of protrusions 64a protruding outward from its outer periphery. The upper surface of the protrusion 64a and the lower surface of the inward projection of the clamper 67 have tapered surfaces that are inclined in opposite directions along the rotation direction.

When holding the substrate, first, the substrate is placed on the holding surface 68 of the first holding member 65 with the second holding member 66 opened, and the second holding member 66 is closed. Subsequently, the presser ring 64 is rotated clockwise so that the protrusion 64 a of the presser ring 64 slides inside (below) the inward protrusion of the clamper 67 . As a result, the first holding member 65 and the second holding member 66 are tightened and locked to hold the substrate via the tapered surfaces provided on the pressing ring 64 and the clamper 67, respectively. When releasing the holding of the substrate, the pressing ring 64 is rotated counterclockwise while the first holding member 65 and the second holding member 66 are locked. As a result, the ridge portion 64a of the pressing ring 64 is removed from the inverted L-shaped clamper 67, and the substrate is released from being held.

FIG. 3 is a cross-sectional view showing the electrical contacts of the substrate holder 60 shown in FIG. As shown in FIG. 3, the substrate W is placed on the holding surface 68 of the first holding member 65 . Between the holding surface 68 and the first holding member 65 are a plurality of (one in the figure) electrical contacts 73 connected to a plurality of wirings extending from the external contacts 71 provided on the hand 69 shown in FIG. are placed. A plurality of electric contacts 73 are arranged outside the circumference of the substrate W so that the ends of the electric contacts 73 come into contact with the surface of the substrate W when the substrate W is placed on the holding surface 68 of the first holding member 65 . It is A conductive layer (seed layer) is formed on the surface of the substrate W, and when the substrate W is held by the substrate holder 60, the electrical contacts 73 come into contact with the conductive film on the surface of the substrate W, thereby A current can flow through W.

A seal member 70 is attached to the surface of the seal holder 62 facing the first holding member 65 (lower surface in the figure), and is pressed against the outer peripheral portion of the surface of the substrate W when the substrate W is held by the substrate holder 60 . there is When the substrate holder 60 holds the substrate W, the end of the seal holder 62 is pressed against the first holding member 65 as shown in FIG.

A plurality of electrical contacts 73 are arranged along the circumference of the substrate W inside sandwiched between the seal member 70 and the seal holder 62 . When the first holding member 65 and the second holding member 66 shown in FIG. 2 are locked, as shown in FIG. pressed against the surface. As a result, the edge portion of the substrate W and the electrical contact 73 are isolated from the surface to be plated of the substrate W, and when the substrate holder 60 holding the substrate W is immersed in the plating solution for plating, the electrical contact 73 and the substrate are separated from each other. The edge of the plate does not come into contact with the plating solution.

In order to achieve plating with good in-plane uniformity, it is necessary for the current to flow uniformly through the plurality of electrical contacts 73 of the substrate holder 60 . However, if the electrical resistance of a given electrical contact 73 is high, the current flowing through that electrical contact 73 will decrease and the current flowing through the surrounding electrical contacts 73 will increase, resulting in non-uniform plating. The electrical resistance of the electrical contact 73 may be affected by foreign matter or oxides adhering to the electrical contact 73, plating liquid adhering to the electrical contact 73 due to leakage of the plating liquid, deformation of the electrical contact 73, or improper installation. If the contact 73 does not contact the seed layer of the substrate W with a sufficient contact area or if the coating material of the electrical contact 73 is peeled off, the electrical resistance is often higher than normal.

Therefore, the plating apparatus according to the present disclosure has a resistance measurement module 200 for measuring the electrical resistance of the electrical contacts 73 of the substrate holder 60. FIG. FIG. 4 is a front view that schematically illustrates a resistance measurement module 200, according to one embodiment. FIG. 5 is a side view of resistance measurement module 200 shown in FIG. As shown in FIG. 4 , the resistance measurement module 200 comprises a measurement reservoir 202 for resistance measurement of the substrate holder 60 . A holder fixing portion 204 for fixing the substrate holder 60 is provided at the bottom of the measurement tank 202 . The holder fixing portion 204 can be a recess into which the substrate holder 60 is inserted. 4 shows a stage in the middle of placing the substrate holder 60 in the measurement tank 202, and FIG. The state shown is When the substrate holder 60 is installed in the measuring tank 202 , the external contact 71 provided on the hand 69 of the substrate holder 60 is connected to one end of the resistance measuring device 206 .

In order to measure the resistance value of the substrate holder 60 in the resistance measurement module 200, the substrate holder 60 is made to hold the testing substrate WT for resistance measurement. FIG. 6 is a diagram showing the test substrate WT. The test substrate WT has the same dimensions as the substrate W to be plated. In addition, a conductive layer (seed layer) is formed on the surface of the inspection substrate WT, or the inspection substrate WT is configured to have electrical conductivity. However, as shown in FIG. 6, the test substrate WT is electrically separated into a plurality of regions in the circumferential direction. The number of areas of the test substrate WT can be the same as the number of electrical contacts 73 of the substrate holder 60 . In the example of FIG. 6, the test substrate WT is divided into 12 regions. Since each region of the test substrate WT is electrically insulated from each other, an electric current can be applied independently to each region of the test substrate WT from each electrical contact 73 of the substrate holder 60 .

As shown in FIGS. 4 and 5 , the resistance measurement module 200 includes a resistance measurement device 206 . Resistance meter 206 can be a common digital multimeter. The resistance measurement module 200 also includes test probes 208 that can contact the test substrate WT held by the substrate holder 60 . Test probe 208 is connected to resistance meter 206 . As shown in FIG. 5, in a state in which the substrate holder 60 holding the substrate for inspection WT is arranged in the measurement tank 202, the electrical power of the substrate holder 60 is changed by bringing the inspection probes 208 into contact with each region of the substrate for inspection WT. Resistance can be measured. By bringing the inspection probes 208 into contact with each region of the inspection substrate WT, the electrical resistance of each electrical contact 73 of the substrate holder 60 and the wiring from each electrical contact 73 to each external contact 71 can be measured. By measuring the resistance value of each region of the test substrate WT in advance, the electrical resistance of the substrate holder 60 can be measured as a result. As described above, if the electrical contact 73 of the substrate holder 60 has an abnormality such as adhesion of foreign matter or deformation, the electrical resistance of the electrical contact 73 increases. Therefore, by measuring the electric resistance of the substrate holder 60, it is possible to inspect whether or not the substrate holder 60 is abnormal.

In one embodiment, the test probes 208 of the resistance measurement module 200 are configured to be movable in the in-plane direction of the test substrate WT, particularly in the circumferential direction of the test substrate WT. Also, the inspection probe 208 is configured to be movable in a direction perpendicular to the surface of the inspection substrate WT. FIG. 7 is a schematic diagram illustrating a movement mechanism for inspection probe 208 according to one embodiment. As shown in FIG. 7, inspection probe 208 is attached to a ring-shaped support member 210 . In the embodiment of FIG. 7, there is one test probe 208 . The inspection probe 208 is attached to the support member 210 so that the tip faces the substrate for inspection WT. Support member 210 is attached to central shaft 214 via spokes 212 . Shaft 214 is connected to and rotatable by motor 216 . Therefore, the inspection probes 208 are movable in the circumferential direction of the inspection substrate WT. Further, the motor 216 and shaft 214 are connected to a pneumatic or hydraulic moving mechanism 218, which can move the supporting member 210 and the inspection probes 208 in a direction perpendicular to the surface of the inspection substrate WT.

FIG. 8 is a schematic diagram illustrating test probe 208 according to one embodiment. As shown in FIG. 8, inspection probe 208 is attached to a ring-shaped support member 210 . In the embodiment of FIG. 8, 12 test probes 208 are provided at regular intervals, corresponding to the number of divided regions of the test substrate WT and the number of electrical contacts 73 of the substrate holder 60 . In the embodiment shown in FIG. 8, each of twelve test probes 208 is connected to resistance measuring device 206 via changeover switch 220 . Although not shown in FIG. 8, the embodiment of FIG. 8 also includes a moving mechanism 218 that moves the support member 210 in a direction perpendicular to the surface of the test substrate WT, as in the embodiment of FIG. In the resistance measurement module 200 according to the embodiment of FIG. 8, each of the 12 test probes 208 can be brought into contact with each region of the substrate under test WT at the same time. The changeover switch 220 can measure the electrical resistance of each electrical contact 73 of the substrate holder 60 while switching the wiring connection. 8, like the embodiment of FIG. 7, a mechanism for rotating the support member 210 holding the inspection probe 208 may be provided.

FIG. 9 is a cross-sectional view showing a state when measuring the electrical resistance of the substrate holder 60 holding the test substrate WT. As shown in FIG. 9, current can be passed from external contact 71 to electrical contact 73 and conductive plate 75 and the electrical resistance can be measured by resistance meter 206 through test probe 208 .

In one embodiment, the substrate holder 60 can be configured such that the electrical resistance of the electrical contacts 73 of the substrate holder 60 can be measured without using a test substrate WT, unlike the embodiments described above. . FIG. 10 is a schematic plan view of a substrate holder 60 according to one embodiment. FIG. 10 mainly shows the first holding member 65 of the substrate holder 60 and omits the second holding member 66 . FIG. 11 is a cross-sectional view showing the electrical contacts of the substrate holder 60 shown in FIG. FIG. 11 shows the second holding member 66 with the seal holder 62 open. FIG. 12 is a cross-sectional view showing a state in which the second holding member 66 is closed in the substrate holder 60 shown in FIG. 10 and electrical resistance is measured. FIG. 13 is a cross-sectional view showing a state in which the substrate holder 60 shown in FIG. 10 holds the substrate W, which is an object to be plated.

The substrate holder 60 shown in FIGS. 10-13 has basically the same structure as the substrate holder 60 shown in FIGS. However, unlike the substrate holder 60 shown in FIGS. 2 and 3, the substrate holder 60 shown in FIGS. As shown in FIG. 12, the conductive plate 75 is arranged at a position where the electrical contact 73 contacts the conductive plate 75 when the second holding member 66 including the seal holder 62 is closed without the substrate W. . Also, as shown in FIG. 10, 12 conductive plates 75 are provided and can electrically independently contact 12 electrical contacts 73, respectively. Although the substrate holder of this embodiment has 12 electrical contacts, the number of electrical contacts is limited to 12 as long as a plurality of contacts are arranged so that power can be substantially uniformly supplied to the entire surface of the substrate. not to be The number of electrical contacts and the number of conductive plates are made equal to each other. When measuring the electrical resistance of the substrate holder 60, the inspection probe 208 is brought into contact with the conductive plate 75 with the second holding member 66 closed without the substrate W as shown in FIG. In this state, current can be passed from the external contact 71 to the electrical contact 73 and the conductive plate 75 and the electrical resistance can be measured by the resistance meter 206 via the test probe 208 . The inspection probe 208 and its support structure and movement mechanism can be similar to the embodiment shown in FIGS. With the substrate holder 60 according to FIGS. 10-13, the electrical resistance of the substrate holder 60 can be measured without using the test substrate WT. It should be noted that the conductive plate may not be plural, and may be wholly or partially provided with a plurality of regions that are electrically insulated from each other on one conductive plate and equal in number to the number of electrical contacts. It may also be a conductive plate.

FIG. 14 illustrates a flow of a method for inspecting a substrate holder, according to one embodiment. FIG. 14 shows an inspection method for inspecting the substrate holder 60 before the substrate W is plated. The inspection method shown in FIG. 14 can be performed using the plating apparatus, substrate holder, substrate for inspection, and resistance measurement module according to the above-described embodiments.

First, the test substrate WT is placed on the aligner 40 before plating of the substrate W, which is an object to be plated, is started. Arrangement of the test substrate WT on the aligner 40 can be performed by the substrate transfer device 122 . The test substrate WT is aligned in a predetermined direction by the aligner 40 (S100). Next, in the fixing unit 120, the test substrate WT is held by the substrate holder 60 (S102). Next, the substrate holder 60 holding the test substrate WT is placed in the resistance measurement module 200 (S104). More specifically, the first transporter 142 arranges the substrate holder 60 in the measurement tank 202 so that it is fixed to the holder fixing portion 204 . Next, the electrical resistance of the substrate holder 60 is measured in the resistance measurement module 200 (S106). More specifically, the inspection probes 208 are brought into contact with the substrate for inspection WT, and the electric path from the external contact 71 of the substrate holder 60 to the substrate for inspection WT through the wiring inside the substrate holder 60 and the electrical contact 73 is established. Measure electrical resistance. An electrical resistance is measured for each electrical contact 73 of the substrate holder 60 . In other words, the electrical resistance of the substrate holder 60 is measured by bringing the inspection probes 208 into contact with each divided area of the inspection substrate WT. Resistance measurement module 200 may use one with one test probe 208, as shown in FIG. 7, or one with multiple test probes 208, as shown in FIG. may The measured electrical resistance is transmitted to control device 500 . Next, the controller 500 determines whether the measured electrical resistance of the substrate holder 60 is within a predetermined range (S108). In one embodiment, the predetermined range can be determined based on the measured normal electrical resistance value obtained by measuring the electrical resistance of the normal substrate holder 60 in advance. For example, the predetermined range can be within 20% of the average value of the resistance of each electrical contact 73 of normal substrate holders 60 . As an example of determination, it can be determined that the substrate holder 60 is normal when all the resistance values of the electrical contacts 73 are within a predetermined range. Furthermore, it may be determined that the substrate holder 60 is normal when the variation in the resistance value of each electrical contact 73 is within 10%. For example, variation can be determined from the difference between the maximum and minimum values and the maximum deviation from the average value. Further, it is preferable to reduce the variation in the resistance value of each electrical contact 73 as the plating is performed at a higher current density. Furthermore, when measuring the resistance value of each electrical contact 73 , the resistance value of the same electrical contact 73 may be measured a plurality of times, and the average value may be used as the resistance value of each electrical contact 73 . In S108, if the electric resistance of the substrate holder 60 is not within the predetermined range, the test substrate WT is removed from the substrate holder 60 (S110). Also, at this time, the control device 500 may inform the user that the substrate holder 60 has an abnormality by means of an alarm or warning display. A substrate holder 60 whose electric resistance is not within the predetermined range is an abnormal substrate holder and cannot be used for plating, so the substrate holder 60 is returned to the stocker 124 (S112). The rejected substrate holders 60 may be stored in the controller 500 so as not to be used for plating later. Off-line maintenance such as cleaning may be performed on the rejected substrate holder 60 . After S112, the test substrate WT is held by a new substrate holder 60 (S102), and the same test is performed. In S108, if the electrical resistance of the substrate holder 60 is within the predetermined range, the test substrate WT is removed from the substrate holder 60 (S114), and the substrate W to be plated is held by the substrate holder 60 (S116). Thereafter, the subsequent plating process is performed while holding the substrate W on the substrate holder 60 (S118).

In this manner, the substrate holder 60 to be used can be inspected before the substrate W is plated. Therefore, it is possible to prevent problems in the plating process due to a defect in the substrate holder 60 . In addition, since the failed substrate holder 60 can be maintained offline, the plating process itself can be continued.

FIG. 15 illustrates a flow of a method for inspecting a substrate holder, according to one embodiment. FIG. 15 shows the flow when the plating apparatus is switched to the maintenance mode without plating the substrate W, and only the substrate holder 60 is inspected. The inspection method shown in FIG. 15 can be performed using the plating apparatus, substrate holder, inspection substrate, and resistance measurement module according to the above-described embodiments.

First, the control device 500 switches the plating apparatus to a maintenance mode for inspecting the substrate holder 60 . The test substrate WT is placed on the aligner 40 and aligned with a predetermined orientation (S200). Next, in the fixing unit 120, the test substrate WT is held by the substrate holder 60 (S202). Next, the substrate holder 60 holding the test substrate WT is arranged in the resistance measurement module 200 (S204). More specifically, the first transporter 142 arranges the substrate holder 60 in the measurement tank 202 so that it is fixed to the holder fixing portion 204 . Next, the electrical resistance of the substrate holder 60 is measured in the resistance measurement module 200 (S206). More specifically, the inspection probes 208 are brought into contact with the substrate for inspection WT, and the electric path from the external contact 71 of the substrate holder 60 to the substrate for inspection WT through the wiring inside the substrate holder 60 and the electrical contact 73 is established. Measure electrical resistance. An electrical resistance is measured for each electrical contact 73 of the substrate holder 60 . In other words, the electrical resistance of the substrate holder 60 is measured by bringing the inspection probes 208 into contact with each divided area of the inspection substrate WT. Resistance measurement module 200 may use one with one test probe 208, as shown in FIG. 7, or one with multiple test probes 208, as shown in FIG. may The measured electrical resistance is transmitted to control device 500 . Next, the controller 500 determines whether the measured electrical resistance of the substrate holder 60 is within a predetermined range (S208). In one embodiment, the predetermined range can be determined based on the measured normal electrical resistance obtained by measuring the electrical resistance of the normal substrate holder 60 in advance. For example, the predetermined range can be within 20% of the average value of the resistance of each electrical contact 73 of normal substrate holders 60 . As an example of determination, it can be determined that the substrate holder 60 is normal when all the resistance values of the electrical contacts 73 are within a predetermined range. Furthermore, it may be determined that the substrate holder 60 is normal when the variation in the resistance value of each electrical contact 73 is within 10%. For example, variation can be determined from the difference between the maximum and minimum values and the maximum deviation from the average value. Further, it is preferable to reduce the variation in the resistance value of each electrical contact 73 as the plating is performed at a higher current density. Furthermore, when measuring the resistance value of each electrical contact 73 , the resistance value of the same electrical contact 73 may be measured multiple times, and the average value may be used as the resistance value of each electrical contact 73 . The control device 500 stores the inspection result of S208. In S208, if the electrical resistance of the substrate holder 60 is not within the predetermined range, the control device 500 may notify the user that the substrate holder 60 is abnormal by displaying an alarm or warning display. After the determination in S208 is completed, the substrate for inspection WT is removed from the substrate holder 60 (S210), and the inspected substrate holder 60 is arranged in the stocker 124 (S212). Thereafter, the inspection substrate WT is held by the next substrate holder 60, and the same inspection is repeated. When all substrate holders 60 have been inspected, the maintenance mode of the plating apparatus is ended.

In this inspection method, all substrate holders 60 in the plating apparatus can be inspected. Maintenance such as cleaning can be performed individually for the substrate holders 60 that are abnormal in the inspection. For example, it is possible to leave only the substrate holders 60 that have been found to have no abnormalities in the plating apparatus and carry out the plating process, while off-line maintenance can be performed for the substrate holders 60 that have been found to have abnormalities.

FIG. 16 illustrates a flow of a method for inspecting a substrate holder, according to one embodiment. FIG. 16 shows an inspection method for inspecting the substrate holder 60 before the substrate W is plated. Also, FIG. 16 shows a flow for inspecting, for example, the substrate holder 60 shown in FIGS. 10 to 13 without using the inspection substrate WT.

First, the substrate holder 60 is placed in the resistance measurement module 200 before starting the plating of the substrate W, which is the object to be plated (S300). More specifically, the first transporter 142 arranges the substrate holder 60 in the measurement tank 202 so that it is fixed to the holder fixing portion 204 . Next, the electrical resistance of the substrate holder 60 is measured in the resistance measurement module 200 (S302). More specifically, the test probe 208 is brought into contact with the conductive plate 75 of the substrate holder 60 , and the electrical connection from the external contact 71 of the substrate holder 60 through the wiring inside the substrate holder 60 and the electrical contact 73 to the conductive plate 75 . Measure the electrical resistance of the path. An electrical resistance is measured for each electrical contact 73 of the substrate holder 60 . Resistance measurement module 200 may use one with one test probe 208, as shown in FIG. 7, or one with multiple test probes 208, as shown in FIG. may The measured electrical resistance is transmitted to control device 500 . Next, the controller 500 determines whether the measured electrical resistance of the substrate holder 60 is within a predetermined range (S304). In one embodiment, the predetermined range can be determined based on the measured normal electrical resistance obtained by measuring the electrical resistance of the normal substrate holder 60 in advance. For example, the predetermined range can be within 20% of the average value of the resistance of each electrical contact 73 of normal substrate holders 60 . As an example of determination, it can be determined that the substrate holder 60 is normal when all the resistance values of the electrical contacts 73 are within a predetermined range. Furthermore, it may be determined that the substrate holder 60 is normal when the variation in the resistance value of each electrical contact 73 is within 10%. For example, variation can be determined from the difference between the maximum and minimum values and the maximum deviation from the average value. Further, it is preferable to reduce the variation in the resistance value of each electrical contact 73 as the plating is performed at a higher current density. Furthermore, when measuring the resistance value of each electrical contact 73 , the resistance value of the same electrical contact 73 may be measured multiple times, and the average value may be used as the resistance value of each electrical contact 73 . In S304, if the electrical resistance of the substrate holder 60 is not within the predetermined range, the substrate holder 60 is determined to be abnormal and cannot be used for plating, so the substrate holder 60 is returned to the stocker 124 (S306). Also, at this time, the control device 500 may notify the user that the substrate holder 60 has an abnormality by means of an alarm or warning display. The rejected substrate holders 60 may be stored in the controller 500 so as not to be used for plating later. Off-line maintenance such as cleaning may be performed on the rejected substrate holder 60 . After S306, a new substrate holder 60 is placed in the resistance measurement module 200 and similar inspections are performed. In S304, if the electric resistance of the substrate holder 60 is within the predetermined range, the substrate W to be plated is held by the substrate holder 60 (S308). Thereafter, the subsequent plating process is performed while holding the substrate W on the substrate holder 60 (S310).

In this manner, the substrate holder 60 to be used can be inspected before the substrate W is plated. Therefore, it is possible to prevent problems in the plating process due to a defect in the substrate holder 60 . In addition, since the failed substrate holder 60 can be maintained offline, the plating process itself can be continued. Also, since the test substrate WT is not used, no time is required for holding/releasing the test substrate WT.

FIG. 17 illustrates a flow of a method for inspecting a substrate holder, according to one embodiment. FIG. 17 shows the flow when the plating apparatus is switched to the maintenance mode without plating the substrate W, and only the substrate holder 60 is inspected. Also, FIG. 17 shows a flow for inspecting, for example, the substrate holder 60 shown in FIGS. 10 to 13 without using the inspection substrate WT.

First, the control device 500 switches the plating apparatus to a maintenance mode for inspecting the substrate holder 60 . First, the substrate holder 60 is placed on the resistance measurement module 200 (S400). More specifically, the first transporter 142 arranges the substrate holder 60 in the measurement tank 202 so that it is fixed to the holder fixing portion 204 . Next, the electrical resistance of the substrate holder 60 is measured in the resistance measurement module 200 (S402). More specifically, the test probe 208 is brought into contact with the conductive plate 75 of the substrate holder 60 , and the electrical connection from the external contact 71 of the substrate holder 60 through the wiring inside the substrate holder 60 and the electrical contact 73 to the conductive plate 75 . Measure the electrical resistance of the path. An electrical resistance is measured for each electrical contact 73 of the substrate holder 60 . Resistance measurement module 200 may use one with one test probe 208, as shown in FIG. 7, or one with multiple test probes 208, as shown in FIG. may The measured electrical resistance is transmitted to control device 500 . Next, the controller 500 determines whether the measured electrical resistance of the substrate holder 60 is within a predetermined range (S404). In one embodiment, the predetermined range can be determined based on the measured normal electrical resistance obtained by measuring the electrical resistance of the normal substrate holder 60 in advance. For example, the predetermined range can be within 20% of the average value of the resistance of each electrical contact 73 of normal substrate holders 60 . As an example of determination, it can be determined that the substrate holder 60 is normal when all the resistance values of the electrical contacts 73 are within a predetermined range. Further, it may be determined that the substrate holder 60 is normal when the variation in the resistance value of each electrical contact 73 is within 10%. For example, variation can be determined from the difference between the maximum and minimum values and the maximum deviation from the average value. Further, it is preferable to reduce the variation in the resistance value of each electrical contact 73 as the plating is performed at a higher current density. Furthermore, when measuring the resistance value of each electrical contact 73 , the resistance value of the same electrical contact 73 may be measured a plurality of times, and the average value may be used as the resistance value of each electrical contact 73 . The control device 500 stores the inspection result of S404. In S404, if the electrical resistance of the substrate holder 60 is not within the predetermined range, the control device 500 may notify the user that the substrate holder 60 is abnormal by displaying an alarm or warning. After the inspection in S404 is completed, the inspected substrate holder 60 is arranged in the stocker 124 (S406). After that, the same inspection is repeated for the next substrate holder 60 . When all substrate holders 60 have been inspected, the maintenance mode of the plating apparatus is terminated.

In this inspection method, all substrate holders 60 in the plating apparatus can be inspected. Maintenance such as cleaning can be performed individually for the substrate holders 60 that are abnormal in the inspection. For example, it is possible to leave only the substrate holders 60 that have been found to have no abnormalities in the plating apparatus and carry out the plating process, while off-line maintenance can be performed for the substrate holders 60 that have been found to have abnormalities. Also, since the test substrate WT is not used, no time is required for holding/releasing the test substrate WT.

Although the embodiments of the present invention have been described above based on several examples, the above-described embodiments of the present invention are intended to facilitate understanding of the present invention, and are not intended to limit the present invention. . The present invention can be modified and improved without departing from the spirit thereof, and the present invention naturally includes equivalents thereof. In addition, any combination or omission of each component described in the claims and the specification is possible within the range that at least part of the above problems can be solved or at least part of the effect is achieved. is.

DESCRIPTION OF SYMBOLS 40... Aligner 60... Substrate holder 71... External contact 73... Electric contact 75... Conductive plate 200... Resistance measurement module 202... Measuring tank 204... Holder fixing part 206... Resistance measuring instrument 208... Inspection probe 210... Supporting member 220... Changeover switch 500... Control device W... Substrate WT... Inspection substrate

Claims (4)

A substrate holder,
a substrate support for supporting the substrate, provided with a holding surface for holding the substrate;
electrical contacts contactable with the substrate for supplying current to the held substrate;
a conductive plate positioned on the holding surface of the substrate support;
wherein the electrical contact and the conductive plate are configured to be in contact with each other when the substrate holder does not hold the substrate;
board holder. A substrate holder according to claim 1, comprising:
a plurality of electrical contacts contactable with the substrate for supplying electrical current to the held substrate;
a plurality of conductive plates disposed on the holding surface of the substrate support;
each of the plurality of electrical contacts and each of the plurality of conductive plates are configured to be in contact with each other when the substrate holder does not hold the substrate;
board holder. A method of inspecting a substrate holder, comprising:
The substrate holder is
a substrate support for supporting the substrate, provided with a holding surface for holding the substrate;
electrical contacts contactable with the substrate for supplying current to the held substrate;
a conductive plate positioned on the holding surface of the substrate support;
the electrical contact and the conductive plate are configured to be in contact with each other in a state in which the substrate holder does not hold the substrate;
The method comprises contacting the electrical contact with the conductive plate;
contacting a test probe to the conductive plate;
measuring the resistance of current flowing between the electrical contact and the probe through the conductive plate;
Method. 4. The method of claim 3, wherein
determining whether the substrate holder is operational based on the measured resistance;
Method.

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