JP2018137444A - Heat radiation structure - Google Patents

Abstract

PROBLEM TO BE SOLVED: To effectively radiate heat generated from an electronic component installed on a substrate.SOLUTION: In a heat radiation structure, an electronic component 36 is disposed at one side in a front-rear direction of a substrate 39. The heat radiation structure includes: first heat transfer parts 51, 52 which transfer heat generated by the electronic component 36 to the other side of the substrate 39 in the front-rear direction; and a heat transfer part 53 which extends from the other side as seen in the front-rear direction to the one side of the substrate 39 and transfers the heat transferred to the other side of the substrate as seen in the front-rear direction at the first heat transfer parts 51, 52 to a heat radiation part 27 through a periphery of the substrate 39 to radiate the heat.SELECTED DRAWING: Figure 4

Description

  The present invention relates to a heat dissipation structure that transfers heat generated from an electronic component installed on a substrate to a heat dissipation portion to dissipate the heat.

  When the electronic component (component to be cooled) and the heat radiating part (heat sink) are provided on the same side in the front and back direction of the board as the above heat dissipation structure, heat transfer between the electronic component and the heat radiating part A member (heat transfer gap / pad) is arranged, and heat generated from the electronic component is transferred to the heat radiating portion through the heat transfer member to be dissipated (see, for example, Patent Document 1).

  In addition, in the heat dissipation structure described in Patent Document 1, the electronic component is provided on one side in the front and back direction of the substrate, the heat dissipation portion is provided on the other side in the front and back direction of the substrate, and the electronic component and the heat dissipation portion are in the front and back direction of the substrate. The electronic component includes a U-shaped heat transfer member (thermal jumper) extending from one side in the front and back direction of the substrate to the other side through the periphery of the substrate, even if provided on the opposite side. The heat generated from the heat is transferred to the heat radiating section through the U-shaped heat transfer member and radiated.

Japanese Patent No. 4361310

  In the heat dissipating structure described in Patent Document 1, the electronic component and the heat dissipating part are directly connected by a heat transfer member so that the distance of the heat path from the electronic component to the heat dissipating part is shortened. The thermal resistance at the time of transferring the heat generated from the components to the heat radiating part is reduced. Therefore, since the heat transferred to the heat radiating portion is increased, effective heat radiation cannot be performed unless the heat radiating capability of the heat radiating portion is increased. However, if the heat radiation capacity of the heat radiation part is increased, the cost is increased and the configuration is complicated.

  In view of this situation, a main problem of the present invention is to provide a heat dissipation structure that can effectively dissipate heat generated from an electronic component installed on a substrate.

The first characteristic configuration of the present invention is a heat dissipation structure that transfers heat generated from an electronic component installed on a substrate to a heat dissipation portion to dissipate heat.
The electronic component is arranged on one side of the front and back direction of the substrate,
A first heat transfer section that transfers heat generated from the electronic component to the other side in the front-back direction of the substrate;
The heat that is extended from the other side of the board in the front and back direction to the one side and transferred to the other side of the board in the front and back direction by the first heat transfer part passes through the periphery of the board to the heat dissipation part. It is in the point provided with the 2nd heat-transfer part which heat-transfers and radiates.

  According to this configuration, the first heat transfer unit once transfers heat generated from the electronic component from one side to the other side in the front and back direction of the substrate, and the second heat transfer unit is the first heat transfer unit. Conversely, heat is transferred from the other side in the front and back direction of the substrate to one side and radiated at the heat radiating portion. Therefore, the heat generated from the electronic component moves from one side to the other side in the front and back direction of the substrate, and then moves from the other side to the one side in the front and back direction of the substrate, and then is transferred to the heat radiating unit to dissipate heat. I am letting. Thereby, the moving distance until the heat which generate | occur | produces from an electronic component is transmitted to a thermal radiation part can be taken large. And in the process of moving heat, not only is heat dissipated along with the movement, but also, for example, heat energy is converted into kinetic energy. Can be made. Therefore, it is possible to effectively dissipate heat generated from the electronic components installed on the substrate without increasing the heat dissipating capacity of the heat dissipating part.

  According to a second characteristic configuration of the present invention, heat generated from the electronic component is transferred to the second heat transfer unit by bringing the electronic component and the second heat transfer unit into contact with each other on one side in the front and back direction of the substrate. It is in the point provided with the contact heat-transfer part which enables heat.

  According to this configuration, the contact heat transfer unit transfers the heat generated from the electronic component to the second heat transfer unit, so that the heat generated from the electronic component is the contact heat transfer unit and the second heat transfer unit. The heat is transferred to the heat dissipating part through the heat sink. As a result, the heat generated from the electronic component is not only transferred to the heat radiating section via the first heat transfer section and the second heat transfer section as described above, but also radiated. Even through the heat transfer part and the second heat transfer part, heat can be radiated more effectively because heat is transferred to the heat radiating part.

  In the third characteristic configuration of the present invention, the other side in the front and back direction of the substrate is extended to the side away from the substrate, and heat is transferred to the other side in the front and back direction of the substrate by the first heat transfer unit. A third heat transfer part is provided to transfer heat to the tip part in the extending direction.

  According to this configuration, the third heat transfer unit transfers the heat transferred from the first heat transfer unit to the side away from the substrate on the other side in the front and back direction of the substrate. Heat can be transferred to a heat dissipating part other than the heat dissipating part arranged on the other side to dissipate heat. As a result, heat can be radiated not only by the heat radiating part on one side in the front and back direction of the board, but also by another heat radiating part on the other side in the front and back direction of the board, effectively radiating heat generated from the electronic components. can do.

  The fourth characteristic configuration of the present invention is that the second heat transfer section and the third heat transfer section are integrally formed.

  According to this configuration, the configuration can be simplified by integrally forming the second heat transfer unit and the third heat transfer unit. Moreover, the heat transferred from the first heat transfer section is merely transferred to the integrated body of the second heat transfer section and the third heat transfer section, and the second heat transfer section and the third heat transfer section It is possible to transfer heat to both of them, and it is possible to simplify the configuration for transferring heat.

  According to a fifth characteristic configuration of the present invention, a distal end portion in the extending direction of the third heat transfer portion is provided with a cooling portion for cooling the heat transferred to the distal end portion.

  According to this configuration, since the cooling unit cools the heat transferred to the tip portion in the extending direction of the third heat transfer unit, the heat transferred to the third heat transfer unit can be effectively dissipated. it can. Therefore, also on the other side in the front and back direction of the substrate, the heat transferred to the third heat transfer section can be effectively radiated, and the heat generated from the electronic component can be radiated more efficiently.

  A sixth characteristic configuration of the present invention is provided with a casing that accommodates the substrate, and the casing includes the first heat transfer unit, the second heat transfer unit, and the third heat transfer unit, In the casing, a facing portion facing the tip end portion in the extending direction of the third heat transfer portion is provided with a communicating portion that communicates the inside and the outside of the casing.

  According to this structure, since the communication part is provided in the casing, the heat in the casing can be radiated to the outside through the communication part. And since the communicating part is provided in the opposing part which opposes the front-end | tip part of the extending direction of a 3rd heat-transfer part in a casing, the heat transmitted to the front-end | tip part of the extending direction of a 3rd heat-transfer part is carried out. The heat is radiated to the outside of the casing through the communication portion. Therefore, the heat transferred to the third heat transfer section can be effectively radiated on the other side in the front and back direction of the substrate, and the heat generated from the electronic component can be radiated more efficiently.

According to a seventh characteristic configuration of the present invention, the other side in the front-back direction of the substrate is provided on the other side in the front-back direction of the substrate, extending in a first width direction and a second width direction orthogonal to the front-back direction of the substrate. A surface-direction heat transfer section that transfers the heat transferred to the side along the surface direction of the substrate;
The surface heat transfer portion is formed with a notch portion cut out from one side in the first width direction, and heat in a high temperature region where heat in a high temperature region is transferred and heat in a low temperature region lower than the high temperature region is transferred. A low-temperature region portion,
The high temperature region portion is disposed at a position adjacent to the notch portion in the second width direction, and the low temperature region portion is disposed at a position adjacent to the notch portion in the first width direction.

  According to this configuration, the high temperature region portion is adjacent to the notch portion in the second width direction, and the low temperature region portion is adjacent to the notch portion in the first width direction, so that heat is transferred in the surface direction of the substrate. A notch can be present between the high temperature region portion and the low temperature region portion. As a result, the heat transfer area from the high temperature region to the low temperature region can be reduced, and the high temperature heat transferred to the high temperature region can be prevented from being directly transferred to the low temperature region. can do. Therefore, the heat of the high temperature region can be prevented from being transferred to the electronic component disposed in the region corresponding to the low temperature region on the substrate, and the failure of the electronic component can be prevented.

According to an eighth feature of the present invention, on the other side in the front and back direction of the substrate, the heat that is extended in the surface direction of the substrate and transferred to the other side in the front and back direction of the substrate is transferred to the other side of the substrate. A surface-direction heat transfer section that transfers heat along the surface direction is provided,
The surface direction heat transfer section has a high temperature region portion where heat in a high temperature region is transferred, and a low temperature region portion where heat in a low temperature region lower than the high temperature region is transferred,
The high temperature region portion and the low temperature region portion are arranged in different positions in the surface direction of the substrate in the surface direction heat transfer section,
The second heat transfer unit is configured to transfer heat transferred along the surface direction of the substrate in the surface direction heat transfer unit to the heat dissipation unit through the periphery of the substrate,
The second heat transfer part is a first extension part extending from the side where the high-temperature region part of the surface direction heat transfer part is located in the surface direction of the substrate to one side in the front and back direction of the substrate; A second extending portion extending from the side where the low temperature region portion of the surface heat transfer portion is located in the surface direction of the substrate to one side in the front and back direction of the substrate;
The first extending portion is in a point that a heat transfer area where heat is transferred is set smaller than that of the second extending portion.

  According to this configuration, since the heat transfer area of the second extension portion is larger than that of the first extension portion, the second extension portion transfers more heat than the first extension portion. be able to. Since the 1st extension part is extended from the side where a high temperature field part is located, it heat-transfers the heat of a high temperature field. On the other hand, since the 2nd extension part is extended from the side where a low-temperature area part is located, it transfers the heat of a low-temperature area. Therefore, in the first extension part and the second extension part, the first extension part transfers higher temperature heat than the second extension part, but the second extension part is first. More heat is transferred than in the extended portion. As a result, it is possible to equalize the heat amount of the heat transferred to the heat radiating portion at the first extending portion and the heat amount of the heat transferred to the heat radiating portion at the second extending portion. Can be efficiently radiated with good balance.

According to a ninth feature of the present invention, on the other side in the front and back direction of the substrate, the heat that is extended in the surface direction of the substrate and is transferred to the other side in the front and back direction of the substrate, A surface-direction heat transfer section that transfers heat along the surface direction is provided,
The surface direction heat transfer section has a high temperature region portion where heat in a high temperature region is transferred, and a low temperature region portion where heat in a low temperature region lower than the high temperature region is transferred,
The second heat transfer unit is configured to transfer heat transferred along the surface direction of the substrate in the surface direction heat transfer unit to the heat dissipation unit through the periphery of the substrate,
The second heat transfer part is located in a position adjacent to the high temperature region part in the surface direction of the substrate in the surface direction of the substrate rather than the low temperature region part.

  According to this structure, since the 2nd heat transfer part is arrange | positioned in the surface direction of a board | substrate at a location adjacent to a high temperature area | region part rather than a low temperature area | region part, the heat | fever of the high temperature area heat-transferred to a high temperature area | region part is While suppressing the heat transfer to the low temperature region, the second heat transfer section can be efficiently transferred. Therefore, the high-temperature heat transferred to the high-temperature region portion of the surface heat transfer section can be transferred to the heat dissipation section via the second heat transfer section, and efficiently radiated.

Front view showing information outlet installed Side view showing information outlet installed The disassembled perspective view of the information communication unit in 1st Embodiment. Cross-sectional view of the information communication unit in the first embodiment A perspective view showing a first plate-like body and a second plate-like body The disassembled perspective view of the information communication unit in 2nd Embodiment Cross-sectional view of the information communication unit in the second embodiment The disassembled perspective view of the information communication unit in 3rd Embodiment Front view of the fourth plate-like body in the third embodiment Side view on the right side of the fourth plate-like body in the third embodiment Left side view of the fourth plate-like body in the third embodiment

An embodiment of an information communication unit to which a heat dissipation structure according to the present invention is applied will be described with reference to the drawings.
[First Embodiment]
As shown in FIGS. 1 and 2, the information communication unit 2 is provided in an information outlet 1 installed at a site to be installed such as a wall W, for example. The information communication unit 2 is installed in a state where most of the information communication unit 2 is embedded in the wall W and in a state where only a part of the front side portion bulges forward from the wall W. Hereinafter, the front side in the front-back direction orthogonal to the wall W will be described as the front side in the front-rear direction, and the back side in the front-back direction will be described as the rear side in the front-rear direction.

  The information outlet 1 includes an outlet box 11 disposed on the rear side of a rectangular installation hole 10 (see FIG. 2) penetrating the wall W, and a decorative cover 12 disposed on the front side of the wall W. These are fixed via an attachment frame 13 that contacts the front surface of the wall W.

  The information outlet 1 is provided with a power outlet unit 3 in addition to the information communication unit 2. An information communication unit 2 is disposed on one side of the information outlet 1 in the left-right direction (right side in FIG. 1), and a power outlet unit 3 is disposed on the other side of the information outlet 1 in the left-right direction (left side in FIG. 1). Yes. On the front side of the information communication unit 2, a LAN modular adapter connection port 21 to which a LAN modular plug is detachably connected, and a telephone line modular adapter to which a telephone line modular plug is detachably connected. A connection port 22 is provided. On the front side of the power outlet unit 3, two insertion ports 4 are provided on the upper and lower sides.

  As shown in FIG. 2, a power cable 14, a telephone cable (not shown), a WAN-side communication cable 15, and the like wired in a space behind the wall W (back space) are provided above and below the outlet box 11. An insertion port 16 into which the end of each cable is inserted is formed.

  The communication cable 15 and the telephone cable are drawn into the outlet box 11 through the upper insertion port 16 and connected to the information communication unit 2. The power cable includes a power cable (not shown) for supplying commercial power to the power outlet unit 3 and a power cable 14 for supplying commercial power from the power outlet unit 3 to the information communication unit 2. . A power cable for supplying commercial power to the power outlet unit 3 is drawn into the outlet box 11 through the upper insertion port 16 and connected to the power outlet unit 3, and the commercial power is supplied from the power outlet unit 3 to the information communication unit 2. A power cable 14 for supplying the power to the information communication unit 2 is drawn into the outlet box 11 through the lower insertion port 16 and connected to the information communication unit 2.

  An attachment window 17 having a shape corresponding to each unit 2, 3 is formed on the decorative cover 12, and the front part of each unit 2, 3 is attached to the front surface of each unit 2, 3 through the attachment window 17.

(Information communication unit)
As shown in FIGS. 2 to 4, the information communication unit 2 includes an antenna unit 23 in which an antenna element 25 (see FIG. 3) is incorporated, and a main body in which components for information communication other than the antenna element 25 are accommodated. The antenna unit 23 is configured to be detachable from a front portion of the main unit 20.

  The antenna unit 23 is formed in a rectangular ring shape that surrounds the outer periphery of the front side portion of the main unit 20 and incorporates a plurality of antenna elements 25. The bottom surface of the antenna unit 23 is provided with a power switch 24 (see FIG. 2) that can switch the power of the information communication unit 2 between an ON state and an OFF state. The antenna unit 23 is configured to be electrically connected to the main unit 20 by being attached to a front portion of the main unit 20.

  The main unit 20 is configured to be divided into a front casing 26 and a rear casing 27. The front casing 26 is made of, for example, a synthetic resin, whereas the rear casing 27 is made of, for example, a metal such as aluminum or zinc steel and has good thermal conductivity. It is configured as follows. Although the illustration of the attachment / detachment between the front casing 26 and the rear casing 27 is omitted, for example, an engagement claw is formed on one side of the front casing 26 and the rear casing 27, and the front casing 26 and the rear casing 27 are rearward. An engagement hole for engaging the engagement claw is formed on the other side of the side casing 27, and the front casing 26 and the rear casing 27 are connected to each other by engaging or releasing the engagement claw with the engagement hole. It can be configured to be detachable. For example, the front casing 26 and the rear casing 27 are fixed in a engaged state by stopping the screws in the screw holes formed in the front casing 26 through the through holes formed in the rear casing 27. It is configured to be possible.

  The front casing 26 is formed in a box shape having an open rear side including a front surface portion 28 facing the front side and a peripheral side surface portion 29 extending rearward from the outer peripheral edge portion of the front surface portion 28. . The front casing 26 is provided with a flange portion 30 extending laterally from the rear end portion of the peripheral side surface portion 29, and the flange portion 30 is configured to be fixed to the mounting frame 13.

  A connection port 22 of a telephone line modular adapter to which a telephone line modular plug is detachably connected is disposed in an upper part of the front surface portion 28 of the front casing 26. As shown in FIG. 1, in addition to the connection port 22, a power indicator indicating a power-on state of the information communication unit 2 and a routing function (a wired LAN or a wireless LAN are used) A display indicator 31 such as a LAN indicator indicating an available state of the information communication function), an access indicator indicating a network access state, and a reset button 32 for performing a reset operation are disposed. A connection port 21 of a LAN modular adapter to which a LAN modular plug is detachably connected is disposed at a lower portion of the front surface portion 28 of the front casing 26.

  2 to 4, the rear casing 27 is opened at the front side having the rear surface portion 33 facing the rear side and the peripheral side surface portion 34 extending from the outer peripheral edge portion of the rear surface portion 33 to the front side. It is formed in a box shape. Although not shown, the rear surface portion 33 and the peripheral side surface portion 34 of the rear side casing 27 are provided with connection ports for cables such as the power cable 14, telephone cable (not shown), and the communication cable 15 on the WAN side. It has been.

  By assembling the front casing 26 and the rear casing 27, an accommodation space 35 that is closed front and rear, right and left, and top and bottom is formed. In the accommodation space 35, components for information communication other than the antenna element 25 are provided. Contained. As each component, for example, a power supply component 36 such as a converter, other electronic components, first to third substrates 37 to 39 on which the power supply component 36 and other electronic components are installed, and a connector portion 40 for connecting the substrates 37 to 39 to each other Etc. are provided. 3 and 4, only the power supply component 36, the first to third substrates 37 to 39, the connector portion 40, and the like are illustrated, and other electronic components and the like are not illustrated. Incidentally, the sizes of the front casing 26 and the rear casing 27 in the front-rear direction, the left-right direction, and the vertical direction can be appropriately changed according to the sizes of the substrates 37 to 39 and the like. .

  As shown in FIGS. 3 and 4, the substrates 37 to 39 have a stacked structure in which the first substrate 37, the second substrate 38, and the third substrate 39 are stacked in this order from the front side in the front-rear direction. Is arranged. The length in the left-right direction is the same length for the second substrate 38 and the third substrate 39, and the first substrate 37 is smaller than the second substrate 38 and the third substrate 39. A connection port 22 for a telephone line modular adapter and a connection port 21 for a modular adapter for LAN are installed on the front surface of the first substrate 37, and a power supply component 36 is mounted on the rear surface of the third substrate 39. is set up. The connector portion 40 is disposed on each of the rear surface portion of the first substrate 37, both the front surface portion and the rear surface portion of the second substrate 38, and the front surface portion of the third substrate 39. The first substrate 37 and the second substrate 38 are electrically connected, and the second substrate 38 and the third substrate 39 are electrically connected.

(Heat dissipation structure)
When the power supply of the information communication unit 2 is switched to the ON state, the power supply component 36 and other electronic components are activated, and various functions such as information communication are activated. At this time, a large amount of heat is generated from the power supply component 36 and heat is also generated from other electronic components. In this embodiment, a heat dissipation structure that mainly dissipates heat generated from the power supply component 36 and dissipates heat including heat generated from other electronic components is employed. This heat dissipation structure will be described below.

  In this heat dissipation structure, the metal rear casing 27 (corresponding to the heat dissipation portion) mainly includes heat generated from the power supply component 36 installed on the rear surface portion of the third substrate 39, including heat generated from other electronic components. It is configured to transfer heat to and dissipate heat.

  In the heat dissipation structure, the first thermal conductor 51 is disposed at the center of the front surface of the second substrate 38, and the second thermal conductor 52 is disposed at the center of the front surface of the third substrate 39. The first heat conductor 51 includes, for example, various electronic components installed on the front surface of the second substrate 38, heat conductive sheets provided in the electronic components, and the like. What is necessary is just to be able to transfer the heat on the rear side to the front side. The second thermal conductor 52 has thermal conductivity such as a thermal conductive sheet, for example, and may be anything that can transfer the heat on the rear surface side of the third substrate 39 to the front surface side. As a result, the heat generated from the power supply component 36 installed on the rear surface portion of the third substrate 39 (including heat generated from other electronic components) is transferred to the second heat conductor 52 to thereby transfer the third substrate. Heat can be transferred to the front side of 39. Since the second heat conductor 52 is in contact with the rear surface portion of the second substrate 38, the heat transferred to the front side of the third substrate 39 by the second heat conductor 52 is transferred to the second substrate 38. Heat is transferred to Further, the heat transferred to the second substrate 38 is transferred to the first heat conductor 51 so that the heat can be transferred to the front side of the second substrate 38. The first heat conductor 51 and the second heat conductor 52 transfer heat generated from the power supply component 36 (including heat generated from other electronic components) to the rear side of the third substrate 39 (corresponding to the substrate) ( The first heat transfer section is configured to transfer heat from one side) to the front side (the other side).

  Further, in the heat dissipation structure, as shown in FIGS. 3 to 5, a first plate shape extending in the left-right direction between the first substrate 37 and the second substrate 38 and extending rearward from both ends in the left-right direction. A body 53 is provided. The first plate-like body 53 receives the heat transferred to the front side of the second substrate 38 and the third substrate 39 by the first heat conductor 51, the second substrate 38, and the second heat conductor 52. A second heat transfer section that transfers heat to the rear casing 27 (corresponding to a heat dissipation section) on the rear side (one side) of the second substrate 38 and the third substrate 39 through the periphery of the substrate 38 and the third substrate 39 to dissipate heat. It is configured as.

  The first plate-like body 53 is configured to be elastically deformable, for example, by applying a heat conductive elastic material to a metal plate and having good heat conductivity. The first plate-like body 53 is a rear side from each of the first left and right extending portions 53a extending in the left and right direction between the first substrate 37 and the second substrate 38 and both end portions of the first left and right extending portions 53a. And a pair of first front and rear extending portions 53b extending in the shape of a U in a plan view.

  The first left and right extending portion 53 a is disposed so as to be in contact with the front surface portion of the first heat conductor 51 and to be able to transfer heat from the first heat conductor 51. Each of the pair of first front-rear extending portions 53b is between the first substrate 37 and the second substrate 38 and between the left and right end portions of the second substrate 38 and the inner walls of the casings 26 and 27 in the front-rear direction. (Around the second substrate 38) and between the third substrate 39 and the inner walls of the casings 26 and 27 (around the third substrate 39) and arranged to extend to the rear side of the third substrate 39. Yes. Each of the pair of first front-rear extending portions 53 b is in contact with a plate-like body contact portion 55 formed on the inner wall portion of the rear side casing 27 at the rear end portion.

  Here, the pair of first front-rear extension portions 53b can be formed in an outwardly spreading shape in which the rear end side of the first front-rear extension portion 53b is curved outward in the left-right direction, for example. Then, with the rear end portion side of the first front-rear extension portion 53 b elastically deformed inward in the left-right direction, the pair of first front-rear extension portions 53 b are inserted into the rear casing 27, The first front-rear extension part 53b is fixed by bringing the rear end of the first front-rear extension part 53b into contact with the plate-like body contact part 55 of the rear casing 27. Thereby, the elastic return force to the outside in the left-right direction acts on the rear end portion side of the first front-rear extension portion 53b, and the rear end portion of the first front-rear extension portion 53b is moved to the plate by the elastic return force. It is possible to suppress the middle portion of the first front-rear extension portion 53 b from contacting the inner wall portion of the front casing 26 while making contact with the state-of-material contact portion 55 while being pressed. As a result, while suppressing the heat transferred to the front side of the second substrate 38 and the third substrate 39 by the pair of first front and rear extending portions 53b from being transferred to the front casing 26, the rear side Heat can be appropriately transferred to the casing 27. Moreover, in order to suppress that the middle part of the 1st front-back extension part 53b contacts the inner wall part of the front side casing 26, for example, a notch part is provided in the right-and-left both ends of the 2nd board | substrate 38 or the 3rd board | substrate 39. It can also be realized by forming and arranging the first front-rear extension part 53b to extend rearward through the notch.

  When the rear end portions of the pair of first front and rear extending portions 53b are brought into contact with the plate-like body contact portion 55, for example, a groove portion is formed in the plate-like body contact portion 55 and the groove portion is filled with a filler such as a gel. By doing so, the rear end portion of the first front-rear extension portion 53b can be brought into surface contact with the plate-like body contact portion 55, and the plate-like body contact portion of the rear casing 27 from the first front-rear extension portion 53b. Heat transfer to 55 can be performed efficiently.

  Between the rear part of each of the pair of first front / rear extension portions 53b and the power supply component 36, contact transmission that connects and contacts the power supply component 36 with each of the pair of first front / rear extension portions 53b. A heat section 56 is provided. The contact heat transfer unit 56 is configured to be able to transfer heat generated from the power supply component 36 to a rear side portion of each of the pair of first front and rear extension portions 53b. The contact heat transfer unit 56 is configured to have good thermal conductivity by, for example, a thermal conductive pad or the like. Further, for example, the contact heat transfer section 56 can be configured by the first plate-like body 53 by bending the first plate-like body 53 and bringing it into contact with the power supply component 36, and various other configurations are applied. be able to.

  In this heat dissipation structure, in addition to the first plate-like body 53, the second plate-like body extends in the left-right direction between the first substrate 37 and the second substrate 38, and extends forward from both ends in the left-right direction. 54 is provided. The second plate-like body 54 extends the heat transferred to the front side of the second substrate 38 and the third substrate 39 by the first thermal conductor 51, the second substrate 38, and the second thermal conductor 52. It is comprised as a 3rd heat-transfer part made to transfer heat to the front-end | tip part (front-end part) of the installation direction.

  The second plate-like body 54 is configured to be elastically deformable, for example, by applying a heat conductive elastic material to a metal plate and having good heat conductivity. The second plate-like body 54 is located on the front side from each of the second left and right extending portions 54a extending in the left and right direction between the first substrate 37 and the second substrate 38 and both end portions of the second left and right extending portions 54a. And a pair of second front and rear extending portions 54b extending in the shape of a U in a plan view. Since the first substrate 37 is shorter in the left-right direction than the second substrate 38 and the third substrate 39, the second left-right extending portion 54 a is more left-right than the first left-right extending portion 53 a of the first plate 53. The length of the direction is small.

  The second left and right extending portion 54a is joined to the first left and right extending portion 53a, and the first plate-like body 53 and the second plate-like body 54 are integrally formed. Incidentally, although illustration of the support of the first plate-like body 53 and the second plate-like body 54 is omitted, for example, on the substrate side of the first substrate 37 and the second substrate 38, or on the front side casing 26 and the rear side. A support structure such as fixing to the casing side of the side casing 27 with a fixture can be provided. Each of the pair of second front-rear extending portions 54b is between the first substrate 37 and the second substrate 38 and between the left and right end portions of the first substrate 37 and the inner walls of the casings 26 and 27 in the front-rear direction. It is disposed so as to extend to the front side of the first substrate 37 (around the first substrate 37). Each of the pair of second front and rear extending portions 54 b is disposed in a state of being spaced from the inner wall portion of the peripheral side surface portion 29 of the front casing 26, and is transmitted to the front side of the second substrate 38 and the third substrate 39. The heated heat is transferred to the front end portion (front end portion) of the second front-rear extending portion 54b while preventing the heat from being transferred to the front casing 26.

  A cooling portion 57 that cools the heat transferred to the front end portion is provided at the front end portion of each of the pair of second front and rear extension portions 54b. The cooling unit 57 is configured, for example, by stacking a plurality of radiating fins at intervals in the vertical direction. A slit portion 58 (corresponding to a communication portion) that connects the inside and the outside of the front casing 26 to the front facing portion of each of the pair of second front and rear extending portions 54b in the front casing 26. Is provided.

  The flow of heat generated from the power supply component 36 (including heat generated from other electronic components, the same shall apply hereinafter) will be described with reference to FIG. Incidentally, in FIG. 4, in order to make the flow of heat easy to understand, illustration of a part of the front casing 26 and the rear casing 27 is omitted.

  The heat generated from the power supply component 36 is first transferred from the rear side to the front side of the third substrate 39 by the second heat conductor 52 as indicated by an arrow T1 in the drawing. Next, as indicated by an arrow T2 in the figure, heat is transferred from the second thermal conductor 52 to the second substrate 38 by contact between the second thermal conductor 52 and the second substrate 38, and further, Heat is transferred from the rear side of the second substrate 38 to the front side by the heat conductor 51. In this way, the heat generated from the power supply component 36 is transferred not only from the third substrate 39 but also from the second substrate 38 to the front side from the rear side, and the heat travel distance can be increased. it can. Therefore, in the heat transfer process, not only heat is dissipated along with the transfer, but also, for example, heat energy is converted into kinetic energy. Heat can be effectively dissipated.

  The heat transferred to the front side of the second substrate 38 by the first heat conductor 51 and the second heat conductor 52 is transmitted by the first plate-like body 53 as indicated by an arrow T3 in the figure. After the heat is transferred to both ends in the left-right direction, the heat is transferred from the front side of the second substrate 38 to the rear side of the third substrate 39 through the periphery of the second substrate 38 and the third substrate 39, and the metal back Heat is transferred to the side casing 27 to dissipate heat. As described above, the heat generated from the power supply component 36 is not only transferred from the rear side of the third substrate 39 to the front side of the second substrate 38, but also from the front side of the second substrate 38 to the third substrate 39. Therefore, the moving distance of the heat can be increased as much as possible, and the heat generated from the power supply component 36 can be radiated more effectively. In addition, the rear casing 27 is made of metal, and further, by forming a plurality of grooves in the rear surface portion 33 and the peripheral side surface portion 34 of the rear side casing 27, the surface area is enlarged, so heat was transferred. Heat can be efficiently radiated to the outside of the rear casing 27.

  Here, when the heat is transferred to the rear casing 27 by the first plate-like body 53 and radiated, the rearward casing 27 is disposed on the rear side, thereby increasing the heat transfer distance. The heat generated from the power supply component 36 can be radiated more efficiently. Therefore, for example, only the third substrate 39 is accommodated in the accommodating space 35 of the rear casing 27, the first substrate 37 and the second substrate 38 are accommodated in the accommodating space 35 of the front casing 26, and the rear of the third substrate 39 is accommodated. The rear casing 27 can be arranged on the side. Incidentally, how the first to third substrates 37 to 39 are accommodated in the front casing 26 and the rear casing 27 can be appropriately changed.

  Further, the heat transferred to the front side of the second substrate 38 by the first thermal conductor 51 and the second thermal conductor 52 is transmitted by the second plate-like body 54 as indicated by an arrow T4 in the figure. After the heat is transferred to both ends in the left-right direction, the front end portion of the second front-rear extension portion 54b located on the front side of the first substrate 37 from the front side of the second substrate 38 through the periphery of the first substrate 37 Heat is transferred to. The heat transferred to the front end portion of the second front-rear extension portion 54b is radiated and cooled by the cooling portion 57, and as shown by the arrow T5 in the figure, the slits 58 allow the casings 26 and 27 to be cooled. Heat is radiated from the inside to the outside. Incidentally, the air that flows out of the casings 26 and 27 from the slit portion 58 flows out of the information communication unit 2 through the opening of the antenna unit 23 and the like. Heat can be appropriately radiated to the outside of the information communication unit 2. Thus, not only the heat in the main unit 20 is radiated to the outside of the information communication unit 2 through the rear casing 27 embedded on the rear side of the wall W, but also the front side that bulges to the front side of the wall W. Heat can be radiated to the outside of the information communication unit 2 through the front portion of the casing 26 and the antenna unit 23. Therefore, in the information communication unit 2, not only the part embedded on the rear surface side of the wall W but also the part that bulges to the front side of the wall W can be used effectively to perform heat dissipation. It becomes a structure.

  Furthermore, the heat generated from the power supply component 36 is transferred to the metal rear casing 27 via the first thermal conductor 51, the second thermal conductor 52, and the first plate-like body 53 as described above. In addition to heating, as indicated by an arrow T6 in the figure, the contact heat transfer section 56 transfers heat to the metal rear casing 27 through the first plate 53 to dissipate heat.

[Second Embodiment]
This 2nd Embodiment shows another embodiment of the 1st plate-shaped body 53 in 1st Embodiment, The other structure is the same as that of 1st Embodiment. Therefore, only the configuration different from the first embodiment will be described, and description of other similar configurations will be omitted.

  In the second embodiment, instead of the first plate-like body 53, a third heat conductor 61 and a pair of third plate-like bodies 62 are provided, and the first heat conductor 51 and the second plate-like body are provided. The body 54 is not provided. The third heat conductor 61 is configured to have good heat conductivity by, for example, a metal plate or a heat conductive sheet, and the center of the front surface portion of the second substrate 38 by a support structure not shown. It arrange | positions in the state which contacts a part.

  Each of the pair of third plate-like bodies 62 has, for example, a good thermal conductivity by applying a heat conductive elastic material to a metal plate, and is configured to be elastically deformable. Each of the pair of third plate-like bodies 62 is joined to each of the left and right ends of the third heat conductor 61, and the third heat conductor 61 and the pair of third plate-like bodies 62 are integrally formed. Is formed. Each of the pair of third plate-like bodies 62 is formed in an L shape in plan view extending in the left-right direction and extending rearward from the left and right end portions. Each of the pair of third plate-like bodies 62 is between the first substrate 37 and the second substrate 38 and between the left and right end portions of the second substrate 38 and the inner walls of the casings 26 and 27 in the front-rear direction ( It is arranged so as to extend to the rear side of the third substrate 39 through the periphery of the second substrate 38 and between the third substrate 39 and the inner walls of the casings 26 and 27 (around the third substrate 39). . Each of the pair of third plate-like bodies 62 is in contact with a plate-like body contact portion 55 formed on the inner wall portion of the rear side casing 27 at the rear end portion.

The flow of heat generated from the power supply component 36 (including heat generated from other electronic components, the same shall apply hereinafter) will be described with reference to FIG.
The heat generated from the power supply component 36 is first transferred from the rear side to the front side of the third substrate 39 by the second heat conductor 52 as indicated by an arrow T11 in the figure. Next, as indicated by an arrow T12 in the figure, heat is transferred from the second thermal conductor 52 to the second substrate 38 by contact between the second thermal conductor 52 and the second substrate 38, and further, Heat is transferred from the rear side of the second substrate 38 to the front side by the heat conductor 61. In the second embodiment, the first heat transfer section is constituted by the second heat conductor 52 and the third heat conductor 61. Thus, the heat generated from the power supply component 36 is transferred not only from the third substrate 39 but also from the second substrate 38 to the front side, so that the heat travel distance can be increased. The heat generated from the power supply component 36 can be effectively dissipated.

  The heat transferred to the front side of the second substrate 38 by the second heat conductor 52 and the third heat conductor 61 is transmitted by the third plate-like body 62 as shown by the arrow T13 in the figure. After the heat is transferred to both ends in the left-right direction, the heat is transferred from the front side of the second substrate 38 to the rear side of the third substrate 39 through the periphery of the second substrate 38 and the third substrate 39, and finally the metal Heat is transferred to the made rear casing 27 to dissipate heat. As described above, the heat generated from the power supply component 36 is not only transferred from the rear side of the third substrate 39 to the front side of the second substrate 38 but also from the front side of the second substrate 38 to the rear side of the third substrate 39. Therefore, it is possible to make the heat travel distance as large as possible, and to dissipate the heat generated from the power supply component 36 more effectively.

  Furthermore, the heat generated from the power supply component 36 is transferred to the metal rear casing 27 through the second heat conductor 52, the third heat conductor 61, and the third plate-like body 62 as described above. In addition to heating, as indicated by an arrow T14 in the figure, the contact heat transfer portion 56 transfers heat to the metal rear casing 27 via the third plate-like body 62 to dissipate heat.

  Incidentally, also in the second embodiment, the heat on the rear side of the third substrate 39 is transferred to the front side of the second substrate 38 by the second heat conductor 52 and the third heat conductor 61. As in the first embodiment, in the information communication unit 2, heat is transferred not only to a portion embedded on the rear surface side of the wall W but also to a portion that bulges to the front side of the wall W opened indoors. Also, heat dissipation at the bulging part can be expected.

[Third Embodiment]
This third embodiment shows another embodiment such as the first plate-like body 53 in the first embodiment, and only the configuration different from the first embodiment will be described, and the same configuration as the first embodiment Description of is omitted.

  As shown in FIG. 8, the second substrate 38 has a first electronic component 64 a (for example, a chip component) that generates heat in a first temperature range (for example, about 98 ° C.) and a first electronic component 64 a. A second electronic component 64b (for example, a chip component) that generates heat in a low temperature second temperature range (for example, about 95 ° C.) and a third temperature range (for example, about 76 ° C.) that is cooler than the second electronic component 64b. ) To generate the third electronic component 64c (for example, a chip component). In FIG. 8, the first electronic component 64 a is disposed in the upper right portion of the second substrate 38 and the second electronic component 64 b is disposed in the upper left portion of the second substrate 38 in the front view. The electronic component 64 c is disposed on the lower left side portion of the second substrate 38.

  The first heat conductor 51 contacts the first electronic component 64a and contacts the first conductive region portion 51a that transfers the heat in the first temperature region to the front side of the second substrate 38, and the second electronic component 64b. Then, the heat in the second temperature region is transferred to the front side of the second substrate 38, and the second conductive region portion 51b is brought into contact with the third electronic component 64c so that the heat in the third temperature region is transferred to the front of the second substrate 38. And a third conductive region portion 51c that conducts heat to the side. The first heat conductor 51 is divided into a first conduction region portion 51a, a second conduction region portion 51b, and a third conduction region portion 51c, and is divided between the first to third conduction region portions 51a to 51c. Prevents heat transfer.

  A fourth plate 63 is provided between the first substrate 37 and the second substrate 38. The 4th plate-like body 63 is comprised so that it may have favorable heat conductivity, for example with metal plate bodies, a heat conductive sheet, etc. The fourth plate 63 is formed in a planar shape extending in the left-right width direction and the vertical width direction of the second substrate 38. The fourth plate 63 is configured to transfer the heat transferred to the front side of the second substrate 38 by the first to third conductive region portions 51 a to 51 c in the first heat conductor 51. It is configured to transfer heat along the direction. Thereby, the 4th plate-shaped body 63 is equivalent to a surface direction heat-transfer part.

  As shown in FIGS. 8 and 9, the fourth plate 63 has a second substrate 38 in the left-right direction of the second substrate 38 (corresponding to the first direction, hereinafter simply referred to as “left-right direction”). A wide portion 63d having a width larger than the entire width of the wide portion 63d, and a narrow portion 63e having a narrower width in the left-right direction than the wide portion 63d, and the wide portion 63d and the width in a state where the wide portion 63d is positioned on the upper side. The narrow portion 63e is formed so as to be aligned in the vertical direction of the second substrate 38 (corresponding to the second direction, hereinafter simply referred to as “vertical direction”). In the fourth plate-like body 63, a narrow portion 63e is formed by forming a cutout portion 65 cut out from the right side (one side) in the left-right direction. The width of the notch 65 in the left-right direction is set to, for example, approximately ½ of the width of the wide portion 63d or larger than that, and the narrow portion 63e is a position biased to the left side (the other side) in the left-right direction. Is formed.

  As shown in FIG. 9, the fourth plate 63 is a region where heat is transferred from the first conduction region 51 a of the first heat conductor 51 as a region where heat is transferred. The first temperature region portion 63 a, the second temperature region portion 63 b where the heat of the second temperature region is transferred in the second conduction region portion 51 b of the first heat conductor 51, and the third conduction of the first heat conductor 51. It has the 3rd temperature area | region part 63c in which the heat | fever of a 3rd temperature range is transmitted in the area | region part 51c.

  Here, in the second substrate 38, the position where the first to third electronic components 64a to 64c are arranged can be appropriately changed. Then, corresponding to the arrangement positions of the first to third electronic components 64a to 64c, the arrangement positions of the first to third conduction region portions 51a to 51c of the first thermal conductor 51 and the fourth plate-like body 63. The arrangement positions of the first to third temperature region parts 63a to 63c can be appropriately changed.

  In the fourth plate 63, as shown in FIG. 9, the first temperature region portion 63a is disposed at a position adjacent to the notch 65 in the vertical direction, and the third temperature region portion 63c is notched in the left and right direction. It is arranged at a position adjacent to 65. The second temperature region portion 63b is disposed at a position adjacent to the third temperature region portion 63c in the up-down direction and adjacent to the first temperature region portion 63a in the left-right direction. The first temperature region portion 63a and the second temperature region portion 63b are arranged in the wide portion 63d so as to be aligned in the left-right direction with the first temperature region portion 63a positioned on the right side, and the third temperature region portion 63c is It arrange | positions at the narrow site | part 63e.

  The third temperature region portion 63c is located at a position different from the first temperature region portion 63a in the vertical direction and is disposed on the left side opposite to the first temperature region portion 63a in the left and right direction. It arrange | positions in the position away from 63a. Comparing the first temperature region part 63a and the third temperature region part 63c, the first temperature region part 63a becomes a high temperature region part, and the third temperature region part 63c becomes a low temperature region part. The notch 65 is adjacent to the first temperature region portion 63a which is a high temperature region portion in the vertical direction and is adjacent to the third temperature region portion 63c which is a low temperature region portion in the left and right direction. In transferring heat in the surface direction of the second substrate 38 in the body 63, a notch 65 exists between the first temperature region portion 63a that is a high temperature region portion and the third temperature region portion 63c that is a low temperature region portion. Can be made. Therefore, the heat transfer area to the third temperature region portion 63c can be reduced, and direct heat transfer from the first temperature region portion 63a to the third temperature region portion 63c can be prevented. .

  Comparing the first temperature region part 63a, the second temperature region part 63b, and the third temperature region part 63c, the first temperature region part 63a becomes a high temperature region part, the second temperature region part 63b becomes a medium temperature region part, The three temperature region part 63c is a low temperature region part. Since the second temperature region portion 63b is adjacent to the first temperature region portion 63a in the left-right direction and is adjacent to the third temperature region portion 63c in the up-down direction, the second temperature region portion 63b has a lower temperature than the first temperature region portion 63a serving as the high-temperature region portion. Between the third temperature region portion 63c serving as the region portion, not only the notch 65 but also the second temperature region portion 63b serving as the intermediate temperature region portion can be present. Therefore, direct heat transfer from the first temperature region portion 63a to the third temperature region portion 63c can be more effectively prevented.

  In this way, the heat in the first temperature region transferred to the first temperature region portion 63a serving as the high temperature region portion is prevented from being directly transferred to the third temperature region portion 63c serving as the low temperature region portion. Therefore, the heat in the first temperature range is transferred to the third electronic component 64c via the third temperature region portion 63c of the fourth plate 63 and the third conduction region portion 51c of the first thermal conductor 51. It is possible to prevent heat transfer and prevent the third electronic component 64c from being damaged.

  In the fourth plate 63, in addition to the notch 65, a first notch 65a is formed on the right side and a second notch 65b is formed on the left side in the upper part of the third temperature region part 63c. Therefore, the heat transfer area of heat to the third temperature region part 63c can be further reduced. The 1st notch part 65a and the 2nd notch part 65b are arrange | positioned in the position which is different in the up-down direction in the state which the 1st notch part 65a is located in an upper side. Further, a third cutout portion 65c is formed in the upper portion of the first temperature region portion 63a, and a fourth cutout portion 65d is formed in the upper portion of the second temperature region portion 63b. As described above, by forming the plurality of notches 65a to 65d, the heat transfer area of the fourth plate 63 can be reduced in transferring heat along the surface direction of the second substrate 38. The heat transfer direction is regulated so that the heat transfer in the surface direction of the second substrate 38 is suitably performed.

  As shown in FIGS. 9 and 10, in the left-right direction, the fourth plate 63 has a first extending portion 66 extending from the side (right side) where the first temperature region portion 63 a is located to the rear side. 9 and FIG. 11, a second extending portion 67 extending from the side (left side) where the second temperature region portion 63b is located to the rear side is provided. The first extending portion 66 and the second extending portion 67 are formed by bending the end portion side portion in the left-right direction of the fourth plate-like body 63 to the rear side, and integrated with the fourth plate-like body 63. Is provided. As shown in FIG. 8, the rear part of each of the first extension part 66 and the second extension part 67 is in contact with the plate-like body contact part 55 of the rear-side casing 27, and the fourth plate-like body. The heat transferred to 63 is radiated by transferring heat to the rear casing 27 via the first extending portion 66 and the second extending portion 67. The first extending part 66 and the second extending part 67 correspond to the second heat transfer part.

  As shown in FIG. 9, the first extending portion 66 is arranged at a position corresponding to the arrangement position of the first temperature region portion 63a in the vertical direction and at a position adjacent to the first temperature region portion 63a in the left and right direction. Has been. In addition, since heat generated from the electronic components 64a to 64c or the like is not directly transferred to the first extending portion 66, the first extending portion 66 has a lower temperature than the first temperature region portion 63a. Yes. Thereby, the heat of the 1st temperature range transmitted to the 1st temperature range site | part 63a can be directly transferred to the 1st extending part 66. FIG. Therefore, the heat in the first temperature region transferred to the first temperature region portion 63a can be transferred to the rear casing 27 via the first extending portion 66 and efficiently radiated.

  As shown in FIG. 9, the second extending portion 67 is arranged at a position corresponding to the arrangement position of the second temperature region portion 63b in the up-down direction and at a location adjacent to the second temperature region portion 63b in the left-right direction. Has been. Comparing the second temperature region portion 63b and the third temperature region portion 63c, the second temperature region portion 63b becomes a high temperature region portion, and the third temperature region portion 63c becomes a low temperature region portion. Accordingly, the second extending portion 67 is disposed at a location adjacent to the second temperature region portion 63b that is a higher temperature region portion than the third temperature region portion 63c that is a low temperature region portion in the surface direction of the second substrate 38. ing. In addition, since heat generated from the electronic components 64a to 64c and the like is not directly transferred to the second extending portion 67, the second extending portion 67 has a lower temperature than the third temperature region portion 63c. Yes. Heat transfer to the second extending portion 67 is efficiently performed while suppressing the heat transferred to the second temperature region portion 63b serving as the high temperature region portion from being transferred to the third temperature region portion 63c serving as the low temperature region portion. Can be made. Therefore, the heat transferred to the second temperature region portion 63 b that is a high temperature region portion can be transferred to the rear casing 27 via the second extending portion 67 and efficiently radiated.

  Incidentally, as described above, the first extending portion 66 is arranged at a position corresponding to the arrangement position of the first temperature region portion 63a in the vertical direction and at a position adjacent to the first temperature region portion 63a in the horizontal direction. ing. Therefore, even if the first temperature region portion 63 a and the second temperature region portion 63 b are the high temperature region portions, the first extending portion 66 and the second extending portion 67 become low temperature region portions in the surface direction of the second substrate 38. It arrange | positions in the location adjacent to the 1st temperature area | region part 63a and the 2nd temperature area | region part 63b which become a high temperature area | region part from the 3rd temperature area | region part 63c.

  As shown in FIG. 10, the first extending portion 66 has a base end side portion 66a which is a front side portion thereof having a narrow shape with a narrow width in the vertical direction, and is rearward of the base end side portion 66a. The distal end side portion 66b, which is a portion, extends in the vertical direction below the base end side portion 66a, and has a shape having a width E1 in the vertical direction larger than that of the base end side portion 66a. On the other hand, as shown in FIG. 11, the second extending portion 67 has a width E2 having the same width in the vertical direction from the base end side portion serving as the front side portion to the distal end side portion serving as the rear side portion. It has a rectangular shape. As shown in FIGS. 10 and 11, the width E2 of the second extending portion 67 in the vertical direction is set to be larger than the width E1 of the first extending portion 66 in the vertical direction. The width in the vertical direction of the base end side portion 66a of the portion 66 is larger. As a result, the second extending portion 67 has a larger heat transfer area toward the rear side than the first extending portion 66, and the second extending portion 67 has a larger heat transfer area. It is configured to transfer more heat to the rear side. Since the first extending portion 66 is extended from the left side where the first temperature region portion 63a is positioned in the left-right direction, the heat of the first temperature region is transferred to the rear side. On the other hand, since the 2nd extension part 67 is extended from the right side where the 2nd temperature area | region part 63b is located in the left-right direction, it heat-transfers heat | fever lower than a 1st temperature area to back side. Therefore, in the first extending portion 66 and the second extending portion 67, the first extending portion 66 conducts heat at a higher temperature to the rear side than the second extending portion 67. The installation portion 67 transfers more heat to the rear side than the first extension portion 66. As a result, equalization is achieved between the amount of heat that the heat transferred to the rear casing 27 at the first extending portion 66 and the amount of heat that the heat transferred to the rear casing 27 at the second extending portion 67 has. Therefore, the heat radiation in the rear casing 27 can be efficiently performed with good balance.

  As shown in FIG. 10, the first extending portion 66 has a distal end side portion 66b having a larger vertical width E1 than the proximal end portion 66a. As shown in FIGS. 10 and 11, the first extending portion 66 is set to have a length D1 extending rearward from the fourth plate-like body 63, and the fourth extending portion 67 in the second extending portion 67. It has a length D1 larger than a length D2 extending rearward from the body 63. Thereby, in the 1st extension part 66, the area of the front end side site | part 66b can be enlarged more, and the area which can diffuse the heat transmitted to the front end side site | part 66b can be ensured. Therefore, even if high-temperature heat such as the first temperature range is continuously transmitted to the distal end side portion 66b of the first extending portion 66 and the portion of the rear casing 27 that contacts the distal end side portion 66b for a long time. The temperature can be lowered by diffusion of heat in the distal end side portion 66b, and the distal end side portion 66b of the first extending portion 66 and the portion of the rear casing 27 that contacts the distal end side portion 66b become too hot. Can be prevented.

  As shown in FIG. 10 and FIG. 11, the fourth plate 63 has a plurality of end portions in the left-right direction that are bent rearward in addition to the first extending portion 66 and the second extending portion 67. The rear side extending portion 68 is integrally provided. In the fourth plate 63, the rear side extending portion 68 is provided in a pair of left and right at a position corresponding to the upper end portion in the vertical direction, and is provided only on the left side at a position corresponding to the lower end portion in the vertical direction.

[Another embodiment]
(1) In the first embodiment, the first left and right extending portions 53 a of the first plate 53 and the second left and right extending portions 54 a of the second plate 54 are formed by the first substrate 37 and the second substrate 38. The first plate 53 and the second plate 54 are disposed so as to be positioned between the first and the second left and right extending portions 53a and 54a. For example, the first left and right extending portions 53a and the second left and right extending portions 54a may be located between the second substrate 38 and the third substrate 39, for example. The body 53 and the second plate-like body 54 can also be arranged.

(2) In the first to third embodiments, in addition to the third substrate 39 on which the power supply component 36 that generates a lot of heat is installed, the first substrate 37 and the second substrate 38 in total are three substrates. However, it is only necessary to include the third substrate 39 on which the power supply component 36 is installed, and the number of other substrates to be added can be appropriately changed. For example, one substrate may be provided separately from the third substrate 39, and two substrates may be provided.

  In the first to third embodiments, the first plate 53, the third heat conductor 61, and the fourth plate 64 are disposed between the first substrate 37 and the second substrate 38. However, for example, the first plate 53, the third heat conductor 61, and the fourth plate 64 may be disposed between the second substrate 38 and the third substrate 39. Accordingly, the arrangement position of the first plate-like body 53, the third heat conductor 61, and the fourth plate-like body 64 can be appropriately changed as long as it is on the front side (the other side) from the third substrate 39. It is. As described above, when one substrate is provided separately from the third substrate 39 and two substrates are provided, the first plate 53, the third heat, and the like are provided between the third substrate 39 and another substrate. The conductor 61 and the 4th plate-shaped body 64 can be arrange | positioned.

(3) The shape and length of the first plate-like body 53 and the second plate-like body 54 in the first embodiment can be appropriately changed. For the first plate 53, the heat transferred between the first substrate 37 and the second substrate 38 by the first thermal conductor 51 passes through the periphery of the second substrate 38 and the third substrate 39. Any material that can transfer heat to the rear casing 27 may be used. The second plate-like body 54 can transfer the heat transferred between the first substrate 37 and the second substrate 38 by the first heat conductor 51 to the front side of the first substrate 37. That's fine.
The first plate 53 and the second plate 54 are not limited to being integrally formed, and the first plate 53 and the second plate 54 can be formed separately. .

(4) The shape, length, and the like of the third plate-like body 62 in the second embodiment can be changed as appropriate. For the third plate-like body 62, the heat transferred between the first substrate 37 and the second substrate 38 by the third heat conductor 61 passes through the periphery of the second substrate 38 and the third substrate 39, Any material that can transfer heat to the rear casing 27 may be used.

(5) The first heat conductor 51, the second heat conductor 52, and the contact heat transfer unit 56 in the first embodiment, and the second heat conductor 52 and the third heat conduction in the second embodiment. About the body 61, the arrangement position, shape, thickness, its structure, etc. can be changed suitably.

(6) In the first to third embodiments, the example in which the heat dissipation structure according to the present invention is applied to the information communication unit 2 has been shown. However, heat generated from the electronic components installed on the substrate is transferred to the heat dissipation portion. And can be applied to various devices having a substrate, an electronic component, and a heat dissipation portion.

(7) In the third embodiment, the fourth plate 63 is provided with three temperature region portions including the first temperature region portion 63a, the second temperature region portion 63b, and the third temperature region portion 63c. Although shown, for example, it is possible to provide two region parts, a high temperature region part where heat in a high temperature region is transferred and a low temperature region part where heat in a low temperature region lower than the high temperature region is transferred. It can be appropriately changed whether the temperature region portion is provided.

36 Power supply component 39 Third substrate (substrate)
51 1st heat conductor (1st heat-transfer part)
52 2nd heat conductor (1st heat-transfer part)
53 1st plate-like body (2nd heat transfer part)
54 Second plate (third heat transfer section)
56 Contact heat transfer part 57 Cooling part 58 Slit part (communication part)
61 3rd heat conductor (1st heat-transfer part)
62 3rd plate-like body (2nd heat-transfer part)
64 4th plate-like body (surface heat transfer part)
66 1st extension part 67 2nd extension part

Claims (9)

A heat dissipation structure that transfers heat generated from electronic components installed on the board to the heat dissipation part to dissipate heat,
The electronic component is arranged on one side of the front and back direction of the substrate,
A first heat transfer section that transfers heat generated from the electronic component to the other side in the front-back direction of the substrate;
The heat that is extended from the other side of the board in the front and back direction to the one side and transferred to the other side of the board in the front and back direction by the first heat transfer part passes through the periphery of the board to the heat dissipation part. A heat dissipating structure provided with a second heat transfer part that conducts heat and dissipates heat.   A contact heat transfer section that allows the electronic component and the second heat transfer section to contact each other on one side of the front and back direction of the substrate, and allows heat generated from the electronic component to be transferred to the second heat transfer section. The heat dissipation structure according to claim 1, which is provided.   The tip of the extending direction of the heat that is extended to the side away from the substrate on the other side in the front and back direction of the substrate and transferred to the other side in the front and back direction of the substrate by the first heat transfer unit The heat radiating structure according to claim 1, further comprising a third heat transfer section that transfers heat to the section.   The heat dissipation structure according to claim 3, wherein the second heat transfer section and the third heat transfer section are integrally formed.   The heat dissipation structure according to claim 3 or 4, wherein a cooling portion that cools heat transferred to the tip portion is provided at a tip portion in the extending direction of the third heat transfer portion.   A casing for housing the substrate is provided, and the first heat transfer unit, the second heat transfer unit, and the third heat transfer unit are provided in the casing, and the third heat transfer unit is provided in the casing. The heat dissipating structure according to any one of claims 3 to 5, wherein a communication portion that communicates the inside and the outside of the casing is provided at a facing portion that opposes the tip portion in the extending direction. On the other side in the front and back direction of the substrate, the heat that is extended in the first width direction and the second width direction orthogonal to the front and back direction of the substrate and is transferred to the other side in the front and back direction of the substrate, A surface direction heat transfer section for transferring heat along the surface direction of the substrate is provided,
The surface heat transfer portion is formed with a notch portion cut out from one side in the first width direction, and heat in a high temperature region where heat in a high temperature region is transferred and heat in a low temperature region lower than the high temperature region is transferred. A low-temperature region portion,
The said high temperature area | region site | part is arrange | positioned in the position adjacent to the said notch part in a 2nd width direction, The said low temperature area | region site | part is arrange | positioned in the position adjacent to the notch part in a 1st width direction. Heat dissipation structure. A surface that extends in the surface direction of the substrate on the other side in the front and back direction of the substrate and transfers heat transferred to the other side in the front and back direction of the substrate along the surface direction of the substrate. A directional heat transfer section,
The surface direction heat transfer section has a high temperature region portion where heat in a high temperature region is transferred, and a low temperature region portion where heat in a low temperature region lower than the high temperature region is transferred,
The second heat transfer unit is configured to transfer heat transferred along the surface direction of the substrate in the surface direction heat transfer unit to the heat dissipation unit through the periphery of the substrate,
The second heat transfer part is a first extension part extending from the side where the high-temperature region part of the surface direction heat transfer part is located in the surface direction of the substrate to one side in the front and back direction of the substrate; A second extending portion extending from the side where the low temperature region portion of the surface heat transfer portion is located in the surface direction of the substrate to one side in the front and back direction of the substrate;
The heat dissipation structure according to claim 1 or 7, wherein the first extending portion is set to have a smaller heat transfer area to which heat is transferred than the second extending portion. A surface that extends in the surface direction of the substrate on the other side in the front and back direction of the substrate and transfers heat transferred to the other side in the front and back direction of the substrate along the surface direction of the substrate. A directional heat transfer section,
The surface direction heat transfer section has a high temperature region portion where heat in a high temperature region is transferred, and a low temperature region portion where heat in a low temperature region lower than the high temperature region is transferred,
The second heat transfer unit is configured to transfer heat transferred along the surface direction of the substrate in the surface direction heat transfer unit to the heat dissipation unit through the periphery of the substrate,
The said 2nd heat-transfer part is arrange | positioned in the said surface direction heat-transfer part in the location adjacent to the said high temperature area | region site | part rather than the said low temperature area | region area | region in the surface direction of the said board | substrate. Heat dissipation structure.

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