JP2018125640A - Crystal element and crystal device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a crystal element that can improve electrical characteristics while suppressing an increase in equivalent series resistance value.SOLUTION: A crystal element 120 comprises: a crystal piece 121 including a substantially rectangular parallelepiped vibration part 121a that has substantially a rectangular shape in plan view, and a peripheral part 121b that is provided along an outer edge of the vibration part 121a and has a smaller thickness in the vertical direction than that of the vibration part 121a; and a metal pattern 122 including excitation electrode parts 123 that are provided on both principal surfaces of the vibration part 121a, and a connection wiring part 124 that is extended from the excitation electrode parts 123 to an edge of the crystal piece 121. When an alternating voltage is applied to the metal pattern 122, portions to be nodes of flexural vibration generated in a direction parallel to the short sides of the crystal piece 121 are located on the long sides of the crystal piece 121.SELECTED DRAWING: Figure 6

Description

  The present invention relates to a crystal element and a crystal device having the crystal element. The crystal device is, for example, a crystal resonator or a crystal oscillator.

  For example, the crystal element includes a substantially rectangular crystal piece and a metal pattern provided on the crystal piece in plan view. The crystal piece includes, for example, a substantially rectangular parallelepiped-shaped vibrating portion and a peripheral portion that is provided along the outer edge of the vibrating portion and whose thickness in the vertical direction is smaller than that of the vibrating portion. The metal pattern includes an excitation electrode portion provided on both main surfaces of the vibration portion and a connection wiring portion extending from the excitation electrode portion to the end of the crystal piece. In such a crystal element, when an alternating voltage is applied to the metal pattern, a portion that becomes an antinode of bending vibration generated in a direction parallel to the short side of the crystal piece is located on the long side of the crystal piece (for example, Patent Document 1).

Patent No. 541486

In such a crystal element, when an alternating voltage is applied to the metal pattern, the portion that becomes the antinode of bending vibration generated in a direction parallel to the short side of the crystal piece is located on the long side of the crystal piece.
The state of the side surface including the long side of the crystal piece is continuously changed, and the side surface including the long side of the crystal piece is the thickness-shear vibration that is the main vibration generated in a part of the vibration part sandwiched between the excitation electrodes. When the light propagates and reflects up to the point of reflection, the state of reflection changes. For this reason, the vibration reflected by the side including the long side of the crystal piece is combined with the thickness shear vibration, which is the main vibration sandwiched between the excitation electrodes, and the equivalent series resistance value increases, resulting in an electrical characteristic May decrease. In particular, when the quartz element is downsized, for example, when the long side of the quartz piece is 920 μm or less, the order of flexural vibration, which is a secondary vibration, becomes low, and this is applied to the thickness shear vibration, which is the main vibration. There is a possibility that the influence becomes large and the electrical characteristics deteriorate.

  An object of the present invention is to provide a crystal element and a crystal device capable of improving electrical characteristics while reducing an increase in equivalent series resistance value.

  The quartz crystal element according to the present invention has a substantially rectangular shape in plan view, and has a substantially rectangular parallelepiped vibration part and a peripheral part whose thickness in the vertical direction is thinner than the vibration part provided along the outer edge of the vibration part. A crystal pattern, an excitation electrode portion provided on both main surfaces of the vibration portion, and a metal pattern including a connection wiring portion extending from the excitation electrode portion to the edge of the crystal piece. When the alternating voltage is applied to the metal pattern, the part that becomes the node of the bending vibration generated in the direction parallel to the short side of the crystal piece is located on the long side of the crystal piece. Features.

The quartz crystal element according to the present invention has a substantially rectangular shape in plan view, and has a substantially rectangular parallelepiped vibration part and a peripheral part whose thickness in the vertical direction is thinner than the vibration part provided along the outer edge of the vibration part. A crystal pattern, an excitation electrode portion provided on both main surfaces of the vibration portion, and a metal pattern including a connection wiring portion extending from the excitation electrode portion to the edge of the crystal piece. In this crystal element, when an alternating voltage is applied to the metal pattern, a portion that becomes a node of bending vibration generated in a direction parallel to the short side of the crystal piece is located on the long side of the crystal piece. By doing in this way, it becomes possible to reduce the influence that the bending vibration generated when an alternating voltage is applied to the metal pattern has on the thickness shear vibration which is the main vibration,
An increase in the equivalent series resistance value can be reduced, and electrical characteristics can be improved.

It is a perspective view of the quartz crystal device concerning this embodiment. It is sectional drawing in the AA cross section of FIG. In the crystal device concerning this embodiment, it is a top view in the state where a lid is not provided. It is the elements on larger scale of the B section of FIG. It is a perspective view of the crystal element concerning this embodiment. (A) is a top view of the upper surface of the crystal element which concerns on this embodiment, (b) is the top view which planarly seen from the upper surface side the lower surface of the crystal element which concerns on this embodiment. 5 is a comparison table showing a comparison between a crystal element in the present embodiment and a crystal element as a comparative example.

  Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. Note that the drawings used in the following description are schematic, and the dimensional ratios and the like on the drawings do not necessarily match the actual ones. For convenience, the surface of the layered portion (that is, a surface that is not a cross section) may be hatched.

  The crystal device and the crystal element of the present disclosure may be either upward or downward, but hereinafter, for convenience, terms such as an upper surface or a lower surface are used with the upper side of the paper of FIGS. 1 and 2 as an upper side. There is. In addition, in the case of simply a plan view or a plan perspective, unless otherwise specified, it refers to viewing in the vertical direction defined for convenience as described above.

  1 to 4 are diagrams relating to a crystal device according to the present embodiment. FIG. 1 is a perspective view of a quartz crystal device according to the present embodiment, and FIG. 2 is a cross-sectional view taken along a line AA in FIG. FIG. 3 is a plan view of the quartz crystal device according to this embodiment in a state where no lid is provided, and FIG. 4 is a partially enlarged view of a portion B in FIG. 5 and 6 are diagrams relating to the crystal element according to the present embodiment. FIG. 5 is a perspective view of the crystal element according to this embodiment, and FIG. 6 is a plan view of the crystal element according to this embodiment. FIG. 7 is a comparison table showing a comparison between the quartz crystal element according to the present embodiment and a quartz crystal element as a comparative example.

(Schematic configuration of crystal device)
A crystal device is an electronic component having a substantially rectangular parallelepiped shape as a whole, for example. The quartz device has, for example, a long side or short side length of 0.6 mm to 2.0 mm and a vertical thickness of 0.2 mm to 1.5 mm.

  The crystal device includes, for example, a base 110 in which a recess is formed, a crystal element 120 accommodated in the recess, a lid 130 that closes the recess, and a conductive adhesive for bonding and mounting the crystal element 120 on the base 110. 140.

  The crystal element 120 is a part that generates vibrations used for generating an oscillation signal. Base 110 and lid 130 form a space for accommodating crystal element 120. The concave portion of the base 110 is sealed with a lid 130, and the inside thereof is, for example, evacuated or filled with an appropriate gas (for example, nitrogen).

  The substrate 110 includes, for example, a substrate portion 110a that is the main body of the substrate 110, a pair of mounting pads 111 for mounting the crystal element 120, and a plurality of substrates (this embodiment) for mounting a crystal device on a circuit substrate (not shown). Then, for example, four external terminals 112 are provided.

  The base 110 is composed of a main substrate portion 110a and a frame-shaped frame portion 110b provided along the edge of the upper surface of the substrate portion 110a, and a recess is formed. The mounting pad 111 is composed of a conductive layer made of metal or the like, and is located on the bottom surface of the recess. The mounting pad 111 and the external terminal 112 are electrically connected to each other by a conductor (not shown) that can be arranged in the substrate portion 110a. The lid 130 is made of metal, for example, and is joined to the upper surface of the base 110 by seam welding or the like.

  The crystal element 120 includes, for example, a crystal piece 121 and a metal pattern 122 for applying an alternating voltage to the crystal piece 121. The metal pattern 122 includes a pair of excitation electrode portions 123 provided near the center of the crystal piece 121 and a connection wiring portion 124 extending from the excitation electrode portion 123 to the edge of the crystal piece 121.

  The crystal element 120 has a substantially plate shape and is accommodated in the recess so as to face the bottom surface of the recess, specifically, the upper surface of the substrate portion 110a. A part of the pair of connection wiring parts 124 (the connection part 124a of the connection wiring part 124) is bonded to the pair of mounting pads 111 by a pair of bumps (in this embodiment, the conductive adhesive 140). Thereby, the crystal element 120 is supported on the base 110 like a cantilever. Further, the pair of excitation electrode portions 123 is electrically connected to the mounting pad 111 via the pair of connection wiring portions 124 and the conductive adhesive 140, and as a result, electrically connected to any two of the plurality of external terminals 112. Connected. The bump is, for example, a conductive adhesive 140. The conductive adhesive 140 is configured, for example, by mixing a conductive filler into a thermosetting resin.

  The crystal device configured as described above is disposed, for example, with the lower surface of the base 110 facing a mounting surface of a circuit board (not shown), and the external terminals 112 are connected to pads (not shown) of the circuit board by soldering or the like. The circuit board is mounted by bonding. For example, an oscillation circuit is configured on the circuit board. The oscillation circuit applies an alternating voltage to the pair of excitation electrode portions 123 via the external terminal 112 and the mounting pad 111 to generate an oscillation signal. At this time, the oscillation circuit uses, for example, fundamental wave vibration among thickness shear vibrations of the crystal piece 121. Overtone vibration may be used.

(Schematic configuration of crystal element)
FIG. 5 is a perspective view of the crystal element according to the present embodiment. FIG. 6A is a plan view of the upper surface of the crystal element according to the present embodiment, and FIG. 6B is a plan view of the lower surface of the crystal element according to the present embodiment seen through from above. is there.

  In this embodiment, when the crystal element 120 is mounted on the base 110, the main surface is a surface substantially parallel to the upper surface of the substrate portion 110a of the base 110, and the direction from the crystal element 120 toward the substrate portion 110a is downward. The direction and the direction from the substrate part 110a toward the crystal element 120 will be described as the upward direction.

Further, the surface of the crystal element 120 that faces the substrate portion 110a and is substantially parallel to the upper surface of the substrate portion 110a is the lower surface of the crystal element 120, and the crystal element faces the opposite side of the lower surface of the crystal element 120. The surface 120 is the upper surface of the crystal element 120. Further, the surface of the vibration part 121a facing the substrate part 110a, which is substantially parallel to the upper surface of the substrate part 110a, is the lower surface of the vibration part 121a, and is opposite to the lower surface of the vibration part 121a. The surface of the vibration part 121a facing the side is defined as the upper surface of the vibration part 121a. Further, the surface of the flat plate portion (peripheral portion 121b) that faces the substrate portion 110a and is substantially parallel to the upper surface of the substrate portion 110a is the lower surface of the peripheral portion 121b, and is opposite to the lower surface of the peripheral portion 121b. The surface of the flat plate portion (of the peripheral portion 121b) facing the side is taken as the upper surface of the peripheral portion 121b. In the present embodiment, the upper surface of the crystal element 120 and the upper surface of the crystal piece 121 are used in the same meaning, and the lower surface of the crystal element 120 and the lower surface of the crystal piece 121 are used in the same meaning.

  The crystal element 120 includes a crystal piece 121 and a metal pattern 122.

  The crystal piece 121 is, for example, a so-called AT cut plate. That is, in a quartz crystal, an orthogonal coordinate system XYZ composed of an X axis (electric axis), a Y axis (mechanical axis), and a Z axis (optical axis) is 30 ° to 50 ° around the X axis (as an example, 35 ° 15 ′ ) When the orthogonal coordinate system XY′Z ′ is defined by being rotated, the main surface of the crystal piece 121 is parallel to the XZ ′ plane.

The crystal piece 121 includes a substantially rectangular parallelepiped-shaped vibrating portion 121a and a peripheral portion 121b that is provided along the outer edge of the vibrating portion 121a and is thinner in the vertical direction than the vibrating portion 121a. Although not shown, the peripheral part 121b is composed of a flat plate part and an intermediate part. The main surface of the flat plate portion is substantially parallel to the main surface of the vibrating portion 121a, and is thinner than the vertical thickness of the vibrating portion 121a. The intermediate portion is located between the vibrating portion 121a and the flat plate portion when the crystal piece 121 is viewed in plan, and the thickness in the vertical direction of the intermediate portion gradually decreases from the vibrating portion 121a to the flat plate portion. ing. That is, the crystal piece 121 is a mesa type. By making such a shape, energy confinement can be improved compared to the case of using a flat crystal piece,
As a result, the equivalent series resistance value can be reduced. The shape of the crystal piece 121 is a substantially rectangular shape in plan view, and its main surface is a rectangle having a long side parallel to the X axis and a short side parallel to the Z ′ axis. In such a crystal piece 121, the X-axis direction is the longitudinal direction, and the Y′-axis direction is the vertical thickness direction.

The vibration part 121a is, for example, a substantially thin rectangular parallelepiped having a pair of main surfaces parallel to the XZ ′ plane, and the main surface is a rectangle having a long side parallel to the X axis and a short side parallel to the Z ′ axis. is there. A part of the metal pattern 122, specifically, a pair of excitation electrode parts 123 is provided on the main surface of the vibration part 121 a. When an alternating voltage is applied to the metal pattern 122, a part of the vibration part 121a sandwiched between the excitation electrode parts 123 vibrates due to the reverse piezoelectric effect and the piezoelectric effect. At this time, in the quartz crystal element 120, the thickness-shear vibration that is the main vibration, the secondary bending vibration that occurs in the direction parallel to the short side of the crystal piece 121, and the secondary vibration that occurs in the direction parallel to the long side of the crystal piece 121. At least the next bending vibration has occurred. The total thickness vibration that is the main vibration is
Although the vibration is the most in the portion sandwiched between the excitation electrode portions 123, the thickness shear vibration, which is the main vibration, also occurs from the portion sandwiched between the excitation electrode portions 123 to the portion not sandwiched between the excitation electrode portions 123. It is in the state of leak propagation.

  The peripheral part 121b is provided along the outer edge of the vibration part 121a. In addition, the peripheral part 121b is composed of a flat plate part and an intermediate part, although not shown for distinction.

The flat plate portion of the peripheral portion 121b is annularly provided along the outer edge of the vibration portion 121a, and the thickness in the vertical direction is thinner than the thickness in the vertical direction of the vibration portion 121a. The flat plate portion of the peripheral portion 121b has a surface substantially parallel to the main surface of the vibration portion 121a. Therefore, the flat plate portion of the peripheral portion 121b has a surface substantially parallel to the upper surface of the substrate portion 110a when the crystal element 120 is mounted on the base 110. As described above, the surface of the flat plate portion of the peripheral portion 121b that is substantially parallel to the main surface of the vibrating portion 121a is defined as the main surface of the peripheral portion 121b. Further, the main surface of the peripheral portion 121b, which is the main surface of the peripheral portion 121b facing the substrate portion 110a when the crystal element 120 is mounted on the base 110, is the lower surface of the peripheral portion 121b.
The main surface of the peripheral portion 121b facing the opposite side of the lower surface of the peripheral portion 121b is defined as the upper surface of the peripheral portion 121b.

  The intermediate part of the peripheral part 121b is located between the vibration part 121a and the flat plate part, and is provided integrally with the vibration part 121a and the flat plate part. The thickness in the vertical direction of the intermediate portion of the peripheral portion 121b is gradually reduced from the vibrating portion 121a to the flat plate portion. Therefore, in this embodiment, although not shown in particular, when the crystal piece 121 is viewed in a cross-section in a plane parallel to the X axis and the Y ′ axis, a slope located between the vibrating portion 121a and the flat plate portion is formed. The included part corresponds to the middle part

When the outer shape of the crystal piece 121 is formed by etching, a relatively large error (such as a systematic error) occurs due to anisotropy of the crystal with respect to the etching. The error may be used intentionally. In the description of the present disclosure, the existence of such an error is ignored. For example, in the actual crystal piece 121, the side surface may be inclined without being orthogonal to the main surface, or the side surface may be shaped to bulge outward instead of being a flat surface. Or illustration and description of the bulge are omitted. Such an error may be ignored when determining whether a third-party product is related to the technology of the present disclosure. It goes without saying that accidental errors may be ignored.
This is also why the intermediate portion and the flat plate portion in the peripheral portion are not particularly distinguished and not shown.

  As shown in FIGS. 5 and 6, the shape of the crystal piece 121 in plan view is a rectangle. The rectangle is a rectangle (including a square in the present disclosure. In the case of a square, a predetermined one side is the one long side, and a predetermined other side connected to the predetermined one side is the one short side. The same applies to the excitation electrode portion 123.) and has a pair of long sides and a short side connecting both ends of the pair of long sides. In the present disclosure, a rectangle or a rectangle includes a shape whose corners are chamfered (the same applies to the excitation electrode portion 123). In the crystal piece 121, for example, the main surface is a surface substantially parallel to the XZ ′ plane, the long side is a side substantially parallel to the X axis, and the short side is a side parallel to the Z ′ axis.

  The thickness of the vibration part 121a in the crystal piece 121 is set based on a desired natural frequency for the thickness shear vibration. For example, when using the fundamental vibration of thickness shear vibration, when the natural frequency is F (MHz), the basic equation for obtaining the thickness t (μm) of the vibration part 121a corresponding to this natural frequency F is t = 1670 / F. Actually, the thickness of the vibration part 121a in the crystal piece 121 is a value finely adjusted from the value of the basic formula in consideration of the weight of the excitation electrode part 123 and the like.

  Further, such a crystal piece 121 has a predetermined shape of the crystal piece 121 when a side surface including a predetermined side of the crystal piece 121 provided with the connection portions 124a of the connection wiring portion 124 is viewed in plan (side view). A recess 125 is formed on the side surface including one side.

  The concave portion 125 formed on the side surface including a predetermined side of the crystal piece 121 includes, for example, a first concave portion 125a, a second concave portion 125b, and a third concave portion 125c. The first recess 125 a is formed, for example, on one end side of a predetermined side of the crystal piece 121 and continuous with the lower surface of the crystal piece 121. The second recess 125 b is formed, for example, on the other end side of a predetermined side of the crystal piece 121 and continuous with the lower surface of the crystal piece 121. The third recess 125 c is formed, for example, so as to continue to the upper surface of the crystal piece 121 and the lower surface of the crystal piece 121 while passing through the midpoint of a predetermined one side of the crystal piece 121.

As described above, when the crystal element 120 is used as a crystal device by forming the concave portion 125 on the side surface including a predetermined side of the crystal piece 121 provided with the connection portions 124a of the connection wiring portion 124, the connection portion Since 124 a is bonded by the conductive adhesive 140, both end portions of the side surface where the recess 125 is formed can be bonded by the conductive adhesive 140. From another viewpoint, it can be said that, by doing this, both ends of the side surface where the recess 125 is formed can be fixed by the conductive adhesive 140. For this reason, generation | occurrence | production of the bending vibration which is a secondary vibration is suppressed more compared with the case where the recessed part 125 is formed in the predetermined | prescribed other side of the crystal piece 121 where the connection part 124 is not provided side by side. Is possible.
As a result, the influence of bending vibration, which is a secondary vibration, on the thickness shear vibration, which is the main vibration, can be reduced, and electrical characteristics can be improved.

  Examples of various dimensions of the crystal piece 121 include, for example, a long side length of 550 μm to 1.1 mm, a short side length of 350 μm to 750 μm, and a thickness of 20 μm to 70 μm.

The metal pattern 122 provided on the crystal piece 121 is for applying an alternating voltage from the outside of the crystal element 120. The metal pattern 122 may be a single layer, or a plurality of metal layers may be stacked. Although not particularly illustrated, the metal pattern 122 includes, for example, a first metal layer and a second metal layer laminated on the first metal layer. The first metal layer is made of a metal that adheres to quartz, and for example, any one of nickel, chromium, nichrome, or titanium is used. By using a metal with good adhesion to the crystal for the first metal layer,
A metal that hardly adheres to the crystal can be used for the second metal layer. The second metal layer has a low electrical resistivity among metal materials, and a stable material is used. For example, any one of gold, an alloy containing gold as a main component, silver or an alloy containing silver as a main component is used. Used. By using a material having a low electrical resistivity, the resistivity of the metal pattern 122 itself can be reduced, and as a result, an increase in the equivalent series resistance value of the crystal element 120 can be reduced. Further, by using a stable metal material, the ambient air in which the crystal element 120 exists reacts with the metal pattern 122, the weight of the metal pattern 122 changes, the frequency of the crystal element 120 changes, and the electrical characteristics change. This can be reduced.

  The metal pattern 122 includes an excitation electrode portion 123 and a connection wiring portion 124. The connection wiring part 124 includes a connection part 124a and a wiring part 124b.

The excitation electrode unit 123 is for applying an alternating voltage to the crystal piece 121. The excitation electrode portion 123 is a pair, and is provided so as to face each other near the central portion of both main surfaces of the crystal piece 121, specifically, the central portion of the vibrating portion 121a. The excitation electrode portion 123 is substantially rectangular in plan view, and the center of the excitation electrode portion 123 (specifically, the intersection of the diagonal lines of the excitation electrode portion 123) is the center of the vibration portion 121a (specifically, Is coincident with the diagonal line of the vibration part 121a. At this time, the center of the excitation electrode portion 123 is compared with the center of the crystal piece 121 (specifically, the intersection of the diagonal lines of the crystal piece 121).
The connection wiring portion 124 is located on the other short side of the crystal piece 121 opposite to one short side of the crystal piece 121 provided with the connection portion 124a. Here, the one short side of the crystal piece 121 is the short side of the crystal piece 121 in which the connection portions 124a of the connection wiring portion 124 are arranged side by side, and the other short side of the crystal piece 121 is the connection This is the short side of the crystal piece 121 where the portion 124a is not provided. In this way, the distance from one short side of the crystal piece 121 to the center of the excitation electrode portion 123 (and the distance from the center of the vibrating portion 121 a) is set to the distance from one short side of the crystal piece 121 to the crystal piece 121. The distance to the center can be longer than the distance.
As a result, when the connection portion 124a of the connection wiring portion 124 is bonded while being electrically connected with the conductive adhesive 140, vibration of the portion sandwiched between the excitation electrode portions 123 is inhibited by the conductive adhesive 140. This can be reduced, and an increase in the equivalent series resistance value of the quartz crystal device can be reduced.

  The connection wiring part 124 includes a connection part 124 a and a wiring part 124 b, and is for applying an alternating voltage to the excitation electrode part 123 from the outside of the crystal element 120.

  When the crystal element 120 is used as a crystal device, the connection part 124 a is for mounting on the base 110, and is electrically connected by the mounting pad 111 and the conductive adhesive 140 provided on the upper surface of the substrate part 110 a of the base 110. Connected. The connection portions 124a are paired, and are provided side by side along the edge of one short side of the crystal piece 121 at a position facing the mounting pad 111 of the substrate portion 110a.

The wiring part 124 b is for electrically connecting the connection part 124 a and the excitation electrode part 123, and has one end connected to the connection part 124 a and the other end connected to the excitation electrode part 123. Moreover, it can be said that the wiring part 124b is extended from the excitation electrode part 123 to the connection part 124a from another viewpoint. In addition, the wiring part 124 a extends so as to be parallel to the long side of the crystal piece 121. By doing so, the distance between the connecting portion 124a and the excitation electrode portion 123 can be further shortened, and the resistance of the wiring portion 124b itself can be reduced. As a result, the equivalent series resistance value of the crystal element 120 is increased. It becomes possible to reduce becoming.
Further, by making the wiring portion 124b in this way, a signal (noise) that is not used outside the crystal element 120 as compared with the case where the wiring portion 124b is perpendicular or oblique to the long side of the crystal piece 121. ) Can be reduced, and as a result, deterioration of the electrical characteristics of the crystal device due to noise outside the crystal element 120 can be suppressed.

  As described above, when an alternating voltage is applied to the metal pattern 122, such a crystal element 120 has a thickness-shear vibration that is a main vibration and a secondary vibration that occurs in a direction parallel to the short side of the crystal piece 121. At least three vibrations of bending vibration and secondary vibration that occur in a direction parallel to the long side of the crystal piece 121 are generated. At this time, the thickness-shear vibration, which is the main vibration, basically occurs in the portion sandwiched by the excitation electrode portion 123, but is sandwiched by the excitation electrode portion 123 from the portion sandwiched by the excitation electrode portion 123. The leak is propagated to the part that is not.

  Here, the wavelength of the bending vibration that occurs in the direction parallel to the short side of the crystal piece 121 as a secondary vibration is λz, and the bending that occurs as a secondary vibration in the direction parallel to the long side of the crystal piece 121. Let λx be the wavelength of vibration. Note that λz and λx are calculated by simulation and experiment.

  Further, a part that becomes a node in bending vibration that is a secondary vibration and occurs in a direction parallel to the short side of the crystal piece 121 is a part that is within a range of ± λz / 8 with respect to the node (−λz). / 8 <part that becomes a node <+ λz / 8). Similarly, a part that becomes a node in bending vibration that is a secondary vibration and occurs in a direction parallel to the long side of the crystal piece 121 is a part that is within a range of ± λx / 8 with respect to the node (− λx / 8 <part that becomes a node <+ λx / 8).

  The crystal element 120 is a secondary vibration that occurs when an alternating voltage is applied to the metal pattern 122 in plan view, and a bending vibration node that occurs in a direction parallel to the short side of the crystal piece 121 has a crystal piece 121. It is located on the long side.

  The crystal element 120 is a secondary vibration generated when an alternating voltage is applied to the metal pattern 122 in a plan view, and a bending vibration node generated in a direction parallel to the short side of the crystal piece 121 is It is located on the side of the vibration part 121 a parallel to the long side of the piece 121.

  Further, the crystal element 120 is a secondary vibration generated when an alternating voltage is applied to the metal pattern 122 in a plan view, and a bending vibration node generated in a direction parallel to the long side of the crystal piece 121 is It is located on the short side of the piece 121.

  Further, the crystal element 120 is a secondary vibration generated when an alternating voltage is applied to the metal pattern 122 in a plan view, and a bending vibration node generated in a direction parallel to the long side of the crystal piece 121 is It is located on the side of the vibration part 121 a parallel to the short side of the piece 121.

  In addition, when the crystal element 120 is mounted on the base 110 with the conductive adhesive 140, an alternating voltage is applied to the metal pattern 122 at the bonded portion where the conductive adhesive 140 and the crystal element 120 are bonded. This is a secondary vibration that sometimes occurs and is a secondary vibration that occurs when an alternating voltage is applied to the metal pattern 122 while a portion serving as a node of bending vibration occurring in a direction parallel to the long side of the crystal piece 121 is located. A portion serving as a node of bending vibration generated in a direction parallel to the short side of the crystal piece 121 is located.

(Example)
The above-described quartz element 120 was actually fabricated with various dimensions, and an experiment was conducted to examine its equivalent series resistance value. As a result, a portion that becomes a secondary vibration generated when an alternating voltage is applied to the metal pattern 122 and that is a node of bending vibration generated in a direction parallel to the short side of the crystal piece 121 has a long side on the crystal piece 121. It turned out to be desirable to be on top. Furthermore, a portion that becomes a node of bending vibration that is a secondary vibration and occurs in a direction parallel to the short side of the crystal piece 121 is located on the side of the vibration part 121 a that is parallel to the long side of the crystal piece 121. It turned out to be more desirable.

  In this example, ten first samples and ten second samples were produced. In addition, as a comparative example, 10 samples were prepared for each of the third sample and the fourth sample.

  The crystal element of the first sample is an example of this embodiment, and a portion that becomes a node of bending vibration generated in a direction parallel to the short side of the crystal piece 121 is located on the long side of the crystal piece 121, and the crystal element A portion that becomes a node of bending vibration generated in a direction parallel to the short side of the piece 121 is located on the side of the vibration part 121 a parallel to the long side of the crystal piece 121.

  The crystal element of the second sample is another example of the present embodiment, and the portion that becomes the bending vibration node generated in the direction parallel to the short side of the crystal piece 121 is located on the long side of the crystal piece 121, and A portion serving as an antinode of bending vibration generated in a direction parallel to the short side of the crystal piece 121 is located on the side of the vibration part 121 a parallel to the long side of the crystal piece 121.

  The crystal element of the third sample is an example of a comparative example, and a portion serving as an antinode of bending vibration generated in a direction parallel to the short side of the crystal piece 121 is located on the long side of the crystal piece 121, and the crystal piece A portion serving as a node of bending vibration generated in a direction parallel to the short side of 121 is located on the side of the vibrating part 121 a parallel to the long side of the crystal piece 121.

  The crystal element of the fourth sample is another example of the comparative example, the portion serving as an antinode of bending vibration generated in a direction parallel to the short side of the crystal piece 121 is located on the long side of the crystal piece 121, and A portion serving as an antinode of bending vibration generated in a direction parallel to the short side of the crystal piece 121 is located on the side of the vibration part 121 a parallel to the long side of the crystal piece 121.

  Here, the first sample, the second sample, the third sample, and the fourth sample are only the length of the short side of the crystal piece 121 and the length of the side of the vibrating part 121a parallel to the short side of the crystal piece 121. The length of the long side of the crystal piece 121, the length of the side of the vibrating part 121a parallel to the long side of the crystal piece 121, the length of the side of the excitation electrode part 123 parallel to the long side of the crystal piece 121, The length of the side of the excitation electrode part 123 parallel to the short side of the crystal piece 121 and the thickness in the vertical direction of the vibration part 121a are set to a predetermined value which is an empirically preferred value considering the equivalent series resistance value. did.

The dimensions of the first sample, the second sample, the third sample, and the fourth sample are as follows. The long side of the crystal piece 121 is a predetermined value of 650 μm to 920 μm, and the length of the side of the vibrating part 121 a parallel to the long side of the crystal piece 121 is a predetermined value of 535 μm to 600 μm. The length of the side of the excitation electrode portion 123 parallel to the long side is a predetermined value of 450 μm to 570 μm,
The length of the side of the excitation electrode part 123 parallel to the short side of the crystal piece 121 is a predetermined value of 250 μm to 550 μm, and the thickness in the vertical direction of the vibrating part 121 a is a predetermined value of 59 μm to 62 μm.
It should be noted that each predetermined value is an empirically preferred value considering the equivalent series resistance value.

In the first sample, the second sample, the third sample, and the fourth sample, the length of the short side of the crystal piece 121 having different dimensions and the length of the vibrating part 121a parallel to the short side of the crystal piece 121 are: The length was obtained from simulation and experiment. In addition, the length of the short side of the crystal piece 121 is in the range of 550 μm to 690 μm, and the length of the vibration part 121a parallel to the short side of the crystal piece 121 is in the range of 350 μm to 580 μm. Yes.
The wavelength λz of the bending vibration that is a secondary vibration and occurs in the direction parallel to the short side of the crystal piece 121 depends greatly on the distance between the long sides of the crystal piece 121. The length of the short side of the piece 121 is used as a parameter.

  In this embodiment, the tolerance of the vibration frequency of the crystal element 120 is ± 0.5%. Further, the tolerance of the dimensions excluding the length of the short side of the crystal piece 121 and the length of the long side of the crystal piece 121 is ± 5 μm. The tolerance of the length of the short side of the crystal piece 121 is ± λz / 8 of the wavelength λz of the bending vibration generated in the direction parallel to the short side of the crystal piece 121, and the tolerance of the length of the long side of the crystal piece 121 is The wavelength λx of the bending vibration generated in the direction parallel to the long side of the crystal piece 121 is ± λx / 8.

  FIG. 7 is a comparison table showing a comparison between the quartz crystal element according to the present embodiment and the quartz crystal element as a comparative example. Specifically, when 10 crystal elements are produced in each of Sample 1 to Sample 4 and the equivalent series resistance value is measured, the determination is made based on the quantity whose equivalent series resistance value is 75Ω or less. Is.

  The judgment is “◎” when 75Ω or less is 100%, “◯” when 75Ω or less is 80% or more and less than 100%, and 75Ω or less is 50% or more and less than 80%. In this case, “Δ” was assigned, and when “75Ω or less” was less than 50%, “X” was assigned.

In the first sample, 10 out of 10 samples were 75Ω or less. Therefore, the first sample was 100%, and the determination was “◎”.
In the second sample, 9 out of 10 samples were 75Ω or less. Therefore, the second sample was 90%, and the determination was “◯”.
In the third sample, 6 out of 10 samples were 75Ω or less. Therefore, the third sample was 60%, and the determination was “Δ”.
In the third sample, one of the ten samples was 75Ω or less. Therefore, the fourth sample was 10%, and the determination was “x”.

In the present embodiment, the determination is based on the case where the equivalent series resistance value is 75Ω. When an oscillation circuit is formed using a crystal device on which a crystal element is mounted, the required equivalent series resistance value of the crystal element varies depending on the resonance frequency band and the size of the crystal device, but the resonance frequency is 27.12 MHz. In an electronic circuit mounted on a mobile communication device (for example, a communication terminal) if the equivalent series resistance value is 75Ω or less,
A practical oscillation circuit can be formed. Therefore, in this embodiment, the index is that the equivalent series resistance value is 75Ω or less.

From the example and the comparative example, when the part that becomes the node of the bending vibration generated in the direction parallel to the short side of the crystal piece 121 is located on the long side of the crystal piece 121, the equivalent series resistance value is more than 75Ω. It can be said that it is effective in reducing the decrease in the equivalent series resistance value. Further, the portion that becomes the node of the bending vibration generated in the parallel direction of the short side of the crystal piece 121 is located on the side of the vibration part 121a parallel to the long side of the crystal piece 121,
It can be said that it is effective for further reducing the increase in the equivalent series resistance value.

As described above, the quartz crystal element 120 according to the present embodiment has a substantially rectangular shape in plan view, and is substantially the same as the rectangular parallelepiped vibrating portion 121a and the vibrating portion 121a provided along the outer edge of the vibrating portion 121a. A crystal piece 121 having a peripheral portion 121b with a small vertical thickness, an excitation electrode portion 123 provided on both main surfaces of the vibration portion 121a, and an edge portion of the crystal piece 121 from the excitation electrode portion 123 A crystal pattern 120 including a metal pattern 124 including a connection wiring portion 124 extending to
When an alternating voltage is applied to the metal pattern 122, a portion that becomes a node of bending vibration generated in a direction parallel to the short side of the crystal piece 121 is located on the long side of the crystal piece 121.

As described above, when an alternating voltage is applied to the metal pattern 122, a thickness-shear vibration that is a main vibration, a bending vibration that occurs in a direction parallel to the short side of the crystal piece 121, and a secondary vibration. There are at least three vibrations of bending vibration that occur in a direction parallel to the long side of the crystal piece 121. At this time, the thickness shear vibration, which is the main vibration, vibrates most in the portion sandwiched between the excitation electrode parts,
The leakage is propagated from the portion sandwiched between the excitation electrode portions 123 to the portion not sandwiched between the excitation electrode portions 123. Then, the thickness shear vibration that is the main vibration of the portion sandwiched between the excitation electrode portions 123 leaks and propagates to a portion not sandwiched between the excitation electrode portions 123, propagates to the edge of the crystal piece 121, and the crystal piece 121 And propagates again from the edge of the crystal piece 121 toward the center of the crystal piece 121.

In the crystal element 120 according to the present embodiment, as described above, the portion that becomes the node of the bending vibration generated in the direction parallel to the short side of the crystal piece 121 is located on the long side of the crystal piece 121. When the piece 121 is viewed in cross-section along the Y′Z ′ plane, the displacement of the portion that becomes the long side of the crystal piece 121 can be almost eliminated. For this reason, the thickness shear vibration, which is the main vibration leaking from the portion sandwiched between the excitation electrode parts 123, is reflected in the same state when reaching the side surface (including the long side) of the crystal piece 121. be able to.
On the contrary, when the portion that becomes the antinode of the bending vibration generated in the direction parallel to the short side of the crystal piece 121 is located on the long side of the crystal piece 121, the portion sandwiched by the excitation electrode portion 123 is used. When the thickness shear vibration, which is the main vibration that has leaked, reaches the side surface (including the long side) of the crystal piece 121, the state of reflection is always different, and is sandwiched between the excitation electrode portions 123 depending on the state of reflection. There is a possibility that the equivalent series resistance value is increased and the electrical characteristics are deteriorated.
That is, by positioning a portion that becomes a node of flexural vibration generated in a direction parallel to the short side of the crystal piece 121 on the long side of the crystal piece 121, it is a secondary vibration and is on the short side of the crystal piece 121. It is possible to reduce the influence of bending vibration generated in a parallel direction on the thickness shear vibration, which is the main vibration, and as a result, it is possible to suppress an increase in equivalent series resistance value and deterioration of electrical characteristics. Become.

  Further, from another viewpoint, even if a portion serving as a node of bending vibration generated in a direction parallel to the short side of the crystal piece 121 is located on the side of the vibration part 121a parallel to the long side of the crystal piece 121, Even if an antinode is located, it can be said that the electrical characteristics can be improved while reducing the increase of the equivalent series resistance value. Therefore, when manufacturing the crystal element 120, the tolerance of the length of the vibration part 121a parallel to the short side of the crystal piece 121 can be increased, and the productivity can be improved.

  Further, in the crystal element 120 according to the present embodiment, the portion that becomes the node of the bending vibration generated in the direction parallel to the short side of the crystal piece 121 is on the two sides of the vibration part 121a parallel to the long side of the crystal piece 121. positioned.

By doing so, the thickness shear vibration, which is the main vibration leaking from the portion sandwiched between the excitation electrode portions 123, is reflected at the intermediate portion of the peripheral portion 121b when moving from the vibrating portion 121a to the peripheral portion 121b. The state when you do can be made constant. For this reason, the vibration reflected in the intermediate portion and the vibration of the portion sandwiched between the excitation electrode portions 123 can be always constant,
The state in which the reflected vibration and the vibration of the portion sandwiched between the excitation electrode portions 123 are combined can always be made constant. Therefore, it is possible to reduce the influence of the bending vibration generated in the direction parallel to the short side of the crystal piece 121 on the main vibration, which is a secondary vibration, and as a result, the equivalent series resistance value is large and the electrical characteristics are reduced. It becomes possible to be suppressed from deteriorating.

  Further, in the crystal element 120 according to the present embodiment, when an alternating voltage is applied to the metal pattern 122, a portion that becomes a node of bending vibration generated in a direction parallel to the long side of the crystal piece 121 is a short side of the crystal piece 121. Located on the top.

By doing in this way, when the crystal piece 121 is viewed in cross section along the XY ′ plane, it is possible to make a state in which there is almost no displacement of the portion that becomes the short side of the crystal piece 121. For this reason, the thickness-shear vibration, which is the main vibration leaking and propagating from the portion sandwiched between the excitation electrode portions 123, is reflected in the same state when reaching the side surface (including the short side) of the crystal piece 121. be able to. That is, by positioning a portion that becomes a node of flexural vibration generated in a direction parallel to the long side of the crystal piece 121 on the short side of the crystal piece 121, it is a secondary vibration and is on the long side of the crystal piece 121. Bending vibrations that occur in parallel directions
The influence on the thickness shear vibration, which is the main vibration, can be reduced, and as a result, it is possible to suppress the equivalent series resistance value from increasing and the electrical characteristics from deteriorating.

  In general, when the length of the long side of the crystal piece 121 is short, specifically, when the length of the long side of the crystal piece 121 is 920 μm or less, the order of flexural vibration becomes low, and thus the main vibration As a result, the thickness shear vibration as the main vibration and the bending vibration as the secondary vibration tend to be easily coupled. For this reason, by setting it as the structure of the crystal element 120 which concerns on this embodiment, the influence which the bending vibration which is a secondary vibration has on the thickness shear vibration which is a main vibration can be reduced more. That is, when the crystal element 120 is downsized, the effect becomes more remarkable.

  In addition, the crystal device according to the present embodiment includes a crystal element 120 and a base 110 having a substrate portion 110a provided with a mounting pad 111 that is electrically bonded to the connection wiring portion 124 with a conductive adhesive 140. And a lid 130 joined to the base 110.

  As described above, such a quartz crystal device uses the quartz crystal element 120 that can reduce the increase of the equivalent series resistance value and improve the electrical characteristics. The increase in value can be reduced, and the electrical characteristics can be improved.

  Further, in the crystal device according to the present embodiment, in plan view, when an alternating voltage is applied to the metal pattern 122 at a portion where the conductive adhesive 140 and the crystal piece 121 are bonded, the short circuit of the crystal piece 121 occurs. When an alternating voltage is applied to the metal pattern 122 at a portion where the node of the bending vibration generated in the direction parallel to the side is located and the conductive adhesive 140 and the crystal piece 121 are bonded to each other In addition, a portion serving as a node of bending vibration generated in a direction parallel to the long side of the crystal piece 121 is located.

  By doing this, bending vibration that is a secondary vibration by applying an alternating voltage (specifically, bending vibration that occurs in a direction parallel to the short side of the crystal piece 121 and the long side of the crystal piece 121) In the case of bending vibration that occurs in a direction parallel to the crystal), it is possible to further reduce the amount of distortion of the crystal piece 121 in the portion bonded by the conductive adhesive 140. For this reason, it is possible to reduce the occurrence of distortion in the portion bonded by the conductive adhesive 140, thereby inhibiting the thickness-shear vibration that is the main vibration and lowering the electrical characteristics.

  The present invention is not limited to the above embodiment, and may be implemented in various aspects.

  A device having a crystal element is not limited to a crystal resonator. For example, an oscillator having an integrated circuit element (IC) that generates an oscillation signal by applying a voltage to the crystal element in addition to the crystal element may be used. Further, for example, the crystal device may have an electronic element such as a thermistor in addition to the crystal element. For example, the quartz crystal device may be equipped with a thermostatic bath. In the crystal device, the structure of the substrate on which the crystal element is mounted may be appropriately configured. For example, the substrate may be of an H-shaped cross section having recesses on the upper surface and the lower surface.

  The crystal element has been described with respect to a case where a concave portion including a first concave portion, a second concave portion and a third concave portion is formed on a side surface including a predetermined side of a crystal piece. A recess may be formed. Moreover, the recessed part does not need to be formed in the side surface containing predetermined one side of a crystal piece.

DESCRIPTION OF SYMBOLS 110 ... Base 110a ... Board | substrate part 110b ... Frame part 111 ... Mounting pad 112 ... External terminal 120 ... Crystal element 121 ... Crystal piece 121a ... Vibrating part 121b ... -Peripheral part 122 ... Metal pattern 123 ... Excitation electrode part 124 ... Connection wiring part 124a ... Connection part 124b ... Wiring part 125 ... Concave part 125a ... First concave part 125b ...・ Second recess 125c ... third recess 130 ... lid body 140 ... conductive adhesive

Claims (5)

A crystal piece that is substantially rectangular in a plan view and has a substantially rectangular parallelepiped vibrating portion and a peripheral portion that is thinner along the vertical direction than the vibrating portion provided along the outer edge of the vibrating portion. When,
Excitation electrode portions provided on both main surfaces of the vibration portion, and a metal pattern including a connection wiring portion extending from the excitation electrode portion to an edge portion of the crystal piece,
A crystal element comprising:
When an alternating voltage is applied to the metal pattern,
A crystal element, wherein a portion that becomes a node of bending vibration generated in a direction parallel to a short side of the crystal piece is located on a long side of the crystal piece. The crystal element according to claim 1,
A crystal element, wherein a portion which becomes a bending vibration node generated in a direction parallel to a short side of the crystal piece is located on two sides of the vibration part parallel to a long side of the crystal piece. The crystal element according to claim 1 or 2,
When an alternating voltage is applied to the metal pattern, a portion that becomes a node of bending vibration generated in a direction parallel to the long side of the crystal piece is located on the short side of the crystal piece. Crystal element. The crystal element according to claim 1 to claim 4,
A substrate having a substrate portion provided with a mounting pad that is electrically bonded to the connection wiring portion with a conductive adhesive;
A lid joined to the substrate;
Crystal device equipped. The crystal device according to claim 4,
In plan view
The portion where the conductive adhesive and the crystal piece are bonded has a portion that becomes a node of bending vibration generated in a direction parallel to the short side of the crystal piece when an alternating voltage is applied to the metal pattern. Located
The portion where the conductive adhesive and the crystal piece are bonded has a portion that becomes a node of bending vibration generated in a direction parallel to the long side of the crystal piece when an alternating voltage is applied to the metal pattern. A crystal element characterized by being positioned.

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