JP2018122378A - Processing device - Google Patents

Processing device Download PDF

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Publication number
JP2018122378A
JP2018122378A JP2017015311A JP2017015311A JP2018122378A JP 2018122378 A JP2018122378 A JP 2018122378A JP 2017015311 A JP2017015311 A JP 2017015311A JP 2017015311 A JP2017015311 A JP 2017015311A JP 2018122378 A JP2018122378 A JP 2018122378A
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JP
Japan
Prior art keywords
blade
polishing
cutting tool
mill
base plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2017015311A
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Japanese (ja)
Inventor
安部 新一
Shinichi Abe
新一 安部
篤彦 高瀬
Atsuhiko Takase
篤彦 高瀬
幹広 小崎
Mikihiro Ozaki
幹広 小崎
声喜 佐藤
Seiki Sato
声喜 佐藤
Original Assignee
株式会社Kmc
Kmc:Kk
株式会社Kmc
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Priority to JP2017015311A priority Critical patent/JP2018122378A/en
Publication of JP2018122378A publication Critical patent/JP2018122378A/en
Pending legal-status Critical Current

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23BTURNING; BORING
    • B23B3/00General-purpose turning-machines or devices, e.g. centre lathes with feed rod and lead screw; Sets of turning-machines
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23CMILLING
    • B23C1/00Milling machines not designed for particular work or special operations
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23QDETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q17/00Arrangements for observing, indicating or measuring on machine tools
    • B23Q17/22Arrangements for observing, indicating or measuring on machine tools for indicating or measuring existing or desired position of tool or work
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B3/00Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools
    • B24B3/02Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools of milling cutters
    • B24B3/06Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools of milling cutters of face or end milling cutters or cutter heads, e.g. of shank type
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B3/00Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools
    • B24B3/34Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools of turning or planing tools or tool bits, e.g. gear cutters

Abstract

An object of the present invention is to provide a processing apparatus having a polishing mechanism for polishing a blade portion of a cutting tool, and to polish the blade portion by setting the positional relationship between the blade portion of the cutting tool and the polishing mechanism without requiring any manual operation. A processing apparatus includes a base plate that holds a mechanism described below, a work material holding mechanism that holds a work material, and a cutting tool that holds a cutting tool for cutting the work material. The holding mechanism 20, a polishing mechanism 40 for polishing the blade 3 a of the cutting tool 3, a moving mechanism 50 for moving the cutting tool holding mechanism 20, and a blade 3 a of the cutting tool 3 held by the cutting tool holding mechanism 20. A detection mechanism 60 for detecting a position on the base plate 10, the moving mechanism 50 is controlled based on the position of the blade 3 a detected by the detection mechanism 60, and the blade 3 a is polished by the polishing mechanism 40. . [Selection diagram] Fig. 1

Description

  The present invention relates to a processing apparatus such as a lathe.

  A cutting tool used in a lathe is worn out by its use, resulting in poor sharpness and surface roughness. Conventionally, when the cutting edge of the cutting tool is worn to some extent, the cutting tool is removed from the tool post and the cutting edge of the cutting tool is sharpened with a grinder (see Patent Document 1).

  The inventors of the present invention have developed a technique for incorporating a mechanism for polishing a blade portion of an end mill into a processing apparatus that processes a work material using an end mill (see Patent Document 2). With this technology, the blade portion can be polished while the end mill is mounted on the spindle of the processing apparatus. As a result, it is not necessary to remove the end mill from the main shaft for polishing, and then attach the end mill to the main shaft to center the shaft, thereby increasing the machining accuracy and improving the productivity.

JP 10-058378 A (paragraph [0012]) WO2016 / 039480A1

  After first attaching the cutting tool or end mill to the holding mechanism of the processing device, it is necessary to precisely set the positional relationship between the cutting edge of the cutting tool or the end mill and the center of rotation of the grindstone of the polishing mechanism for polishing the cutting edge. .

  Recently, along with the reduction in size and weight of products, there are strong demands to increase the strength of the material while the components become smaller and thinner, and difficult-to-cut materials have been used a lot. For this reason, in a processing apparatus using a cutting tool or an end mill, wear of the cutting edge of the cutting tool or the end end mill is increasing. In the processing apparatus developed by the present inventors, if the blade part of the cutting tool or end end mill is worn significantly by use, the positional relationship between the blade part and the rotation center of the grindstone is shifted, and the grinding of the blade part by the grindstone is accurately performed. A new problem arises that could not be done. Therefore, it is conceivable to manually reset the positional relationship between the blade portion and the rotation center of the grindstone, but this hinders improvement in productivity.

  In view of the circumstances as described above, an object of the present invention is a processing apparatus having a polishing mechanism for polishing a blade portion of a cutting tool, and the positional relationship between the blade portion of the cutting tool and the polishing mechanism without requiring manual labor. Is to provide a processing apparatus capable of polishing the blade portion.

  In order to achieve the above object, a base plate according to an aspect of the present invention, a work material holding mechanism that is disposed on the base plate and holds a work material, and a work material holding mechanism that is disposed on the base plate. A cutting tool holding mechanism that holds a cutting tool for cutting the work material held by the polishing tool, and a polishing mechanism that is disposed on the base plate and polishes a blade portion of the cutting tool held by the cutting tool holding mechanism. A moving mechanism for moving the cutting tool holding mechanism on the base plate, a detection mechanism for detecting a position on the base plate of a cutting tool blade held by the cutting tool holding mechanism, and the detection mechanism. And a controller that controls the moving mechanism based on the detected position of the blade portion and polishes the blade portion by the polishing mechanism.

  In the present invention, the detection mechanism detects the position of the blade portion of the cutting tool held by the cutting tool holding mechanism on the base plate. The control unit controls the moving mechanism based on this detection position, and polishes the blade portion by the polishing mechanism. Therefore, the blade portion can be polished by setting the positional relationship between the blade portion of the cutting tool and the polishing mechanism without requiring manual labor.

  In the processing apparatus according to an aspect of the present invention, the workpiece holding mechanism is a chuck that is driven to rotate by a drive unit and holds the workpiece, and the cutting tool held by the cutting tool holding mechanism is: A cutting tool holding mechanism for moving the cutting tool holding mechanism in the X and Y directions on the base plate, and the detection mechanism for the cutting edge of the cutting tool in the X and Y directions on the base plate. The position at is detected.

  In the processing apparatus according to an aspect of the present invention, the detection mechanism is disposed on the base plate, and detects the position of the blade portion of the cutting tool in the X and Y directions on the base plate by the contact of the blade portion. It has a sensor that can detect the cutting edge of a tool such as a touch sensor.

  The processing apparatus according to an aspect of the present invention includes a polishing mechanism / touch sensor mounting plate on which the polishing mechanism, the touch sensor, and the like are mounted. This eliminates the need for positioning between the polishing mechanism on the processing apparatus and a sensor such as a touch sensor.

  In the processing apparatus according to an aspect of the present invention, the work material holding mechanism is an XY table that holds the work material on an upper surface and moves the held work material in the X and Y directions. The tool is an end mill, the cutting tool holding mechanism is a main shaft that is rotationally driven by a drive unit and holds the end mill, and the moving mechanism moves the cutting tool holding mechanism in the X and Z directions on the base plate. The detection mechanism detects the position of the tip of the end mill blade in the Z direction on the base plate and the position of the rotation center of the end mill blade in the X direction on the base plate. Is.

  In the processing apparatus according to an aspect of the present invention, the detection mechanism includes a laser-type measuring device that detects the position by detecting the interruption of the laser beam by the end mill.

  According to the present invention, there is provided a processing apparatus having a polishing mechanism for polishing a blade part of a cutting tool, and polishing the blade part by setting a positional relationship between the blade part of the cutting tool and the polishing mechanism without requiring a manual operation. Can do.

It is a top view which shows the processing apparatus which concerns on the 1st Embodiment of this invention. It is a schematic side view of the processing apparatus shown in FIG. It is a schematic perspective view of the cutting tool holding mechanism in the processing apparatus shown in FIG. It is a block diagram of a control system in the processing apparatus according to the embodiment. It is a flowchart which shows operation | movement of the processing apparatus which concerns on the same embodiment. It is a block schematic diagram of the processing apparatus which concerns on the 2nd Embodiment of this invention. It is a partial side view for demonstrating the operation | movement which measures the position of the Z direction on the baseplate of the front-end | tip of the end mill in the same embodiment. It is a partial top view for demonstrating the operation | movement which measures the position of the X direction on the baseplate of the center axis | shaft of the end mill in the embodiment. It is an enlarged view of the blade part which concerns on the same embodiment. It is an enlarged view of the blade part which concerns on the same embodiment. It is an enlarged view of the blade part which concerns on the same embodiment. It is the schematic diagram which looked at the processing apparatus which concerns on the same embodiment from the upper surface side. It is a figure which shows the grinding | polishing method of the blade part which concerns on the same embodiment. It is a figure which shows operation | movement of the processing apparatus of the embodiment.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(First embodiment)
FIG. 1 is a top view showing a processing apparatus according to an embodiment of the present invention. FIG. 2 is a side view of the processing apparatus.

  As shown in these drawings, the machining apparatus 1 according to this embodiment is a lathe that performs machining such as outer rounding, boring, drilling, threading, and parting by cutting.

  The processing apparatus 1 is configured by mounting a work material holding mechanism 20, a cutting tool holding mechanism 30, a polishing mechanism 40, a moving mechanism 50, and a detection mechanism 60 on a base plate 10.

  The work material holding mechanism 20 is disposed on one side of the upper surface of the base plate 10, for example, and typically includes a chuck 21 that holds the work material 2 such as a metal rod-like member. The chuck 21 is rotationally driven by a motor 22. The shaft of the chuck 21 and the shaft of the motor 22 are spanned by, for example, an endless belt (not shown). In this embodiment, the endless belt (not shown) is covered with the cover member 23.

  As shown in FIG. 3, the cutting tool holding mechanism 30 typically has an upper table 31 that holds the cutting tool 3. In this embodiment, the upper table 31 holds three bytes 3. However, the cutting tool holding mechanism 30 may hold one cutting tool, or may hold two or two or more cutting tools. In this embodiment, the types of the three bytes 3 held by the upper table 31 are different, but may be the same type. As the type of the byte 3, there are a cut-off bit, a half-cut bit, a hail byte, a sword bit, a single-edged bit, etc. The machining size (blade edge size) of the cutting tool is typically about 20 mm × 20 mm at the maximum. The blade portions 3a of the three cutting tools 3 held by the upper table 31 typically face the same direction, specifically, the polishing mechanism 40 side. On the upper table 31, for example, as shown in FIG. 3, three U-shaped bite holding members 32 are fixed in parallel. The cutting tool 3 is inserted inside each cutting tool holding member 32. A plurality of bolts 33 fasten the cutting tool 3 inserted inside the cutting tool holding member 32 from the upper part of each cutting tool holding member 32.

  The polishing mechanism 40 includes a bracket plate 41 as a polishing mechanism / touch sensor mounting plate and a tool polishing spindle 42.

  The bracket plate 41 is attached to a predetermined position on the base plate 10. On the bracket plate 41, a tool polishing spindle 42, an X-direction touch sensor 61 and a Y-direction touch sensor 62 described later are mounted.

  In this embodiment, the X direction is a direction orthogonal to the rotation axis direction of the workpiece 2 held by the chuck 21, and the Y direction is the rotation axis direction of the workpiece 2 held by the chuck 21. .

  On the bracket plate 41, the relationship (XY direction) between the center position of the tool polishing spindle 42, the sensing position of the X-direction touch sensor 61, and the sensing position of the Y-direction touch sensor 62 is determined in advance. When the bracket plate 41 is attached to a predetermined position on the base plate 10, the center position of the tool polishing spindle 42 on the base plate 10 (XY direction), the sensing position of the X-direction touch sensor 61, and the sensing position of the Y-direction touch sensor 62 are known. It becomes.

  The tool polishing spindle 42 is rotationally driven by a motor (not shown). A cylindrical grindstone 43 for polishing the blade 3 a of the cutting tool 3 is attached to the tool polishing spindle 42.

  The moving mechanism 50 moves the cutting tool holding mechanism 30, that is, the cutting tool 3, in the X and Y directions on the base plate 10, and includes an X direction actuator 51, a lower table 52, a Y direction actuator 53, and a pair of linear guides. 54, 55.

  The upper table 31 is mounted on the X direction actuator 51, and the X direction actuator 51 moves the upper table 31 in the X direction.

  An X direction actuator 51 is attached on the lower table 52.

  A lower table 52 is mounted on the Y-direction actuator 53, and the Y-direction actuator 53 moves the lower table 52 in the Y direction.

  The pair of linear guides 54 and 55 guide the lower table 52 in the Y direction.

  The detection mechanism 60 is a mechanism for detecting the position (XY direction) of the blade 3 a of the cutting tool 3 held by the cutting tool holding mechanism 30 on the base plate 10, and includes an X-direction touch sensor 61 and a Y-direction touch sensor 62. Is provided. As described above, the X-direction touch sensor 61 and the Y-direction touch sensor 62 are mounted on the bracket plate 41 together with the tool polishing spindle 42. The bracket plate 41 is configured to be moved in the Y direction by the Y direction moving mechanism 44 in order to avoid interference with the cutting tool 3 during grinding.

  The X-direction touch sensor 61 is a sensor that detects the position of the blade 3 a of the cutting tool 3 in the X direction on the base plate 10. The X-direction touch sensor 61 detects the position by contact / non-contact of the blade 3a of the cutting tool 3 with the sensor.

  The Y-direction touch sensor 62 is a sensor that detects the position in the Y direction on the base plate 10 of the blade 3 a of the cutting tool 3. Similarly, the Y-direction touch sensor 62 detects a position by contact / non-contact of the blade 3a of the cutting tool 3 with the sensor.

  By adopting the touch sensor as the detection mechanism 60 in this way, it is possible to improve detection reliability and reduce costs. However, in the present invention, a non-contact high sensitivity detection laser type sensor, a shock monitor (motor power detection type sensor), or the like can be used as the detection mechanism.

  FIG. 4 is a block diagram of a control system in the processing apparatus 1.

  As shown in the figure, the control unit 70 comprehensively controls the entire processing apparatus 1.

  Typically, the control unit 70 controls the cutting operation of the work material 2 held by the work material holding mechanism 20. The control unit 70 controls the rotational drive of the motor 22 and controls the moving position of the cutting tool 3 based on the position of the blade 3 a of the cutting tool 3 detected by the detection mechanism 60, so that the workpiece held by the chuck 21 is controlled. The cutting material 2 is cut into a desired shape by the cutting tool 3.

  In this embodiment, the work material 2 is attached to and detached from the chuck 21 manually, but the work material 2 may be automatically attached to and detached from the chuck 21. For example, it has a conveyance mechanism that conveys the workpiece 2 to the chuck 21 and an opening / closing mechanism that opens and closes the chuck 21, and the control unit 70 controls these operations, thereby realizing automation. it can.

  In this embodiment, the control unit 70 controls the polishing mechanism 40 and the moving mechanism 50 based on the position of the blade part 3 a of the cutting tool 3 detected by the detection mechanism 60, and the polishing mechanism 40 moves the blade part 3 a of the cutting tool 3. Grind.

  FIG. 5 is a flowchart showing the operation of the machining apparatus 1 configured as described above. In the following description, the operation for one byte 3 out of three is described for easy understanding.

  When the workpiece 2 is attached to the chuck 21 and a predetermined command is input (step 501), the control unit 70 controls the moving mechanism 50 so as to point to the initially set position of the X-direction touch sensor 61. The blade 3a of the cutting tool 3 is moved (step 502). When the cutting portion 3a of the cutting tool 3 approaches the initially set position of the X-direction touch sensor 61 (step 503), the control unit 70 decelerates the moving speed (step 504). When the contact detection signal of the blade 3a is received (step 505), the movement of the blade 3a of the cutting tool 3 is stopped (step 506), and the position in the X direction is stored (step 507).

  Next, the control unit 70 controls the moving mechanism 50 to move the blade portion 3a of the cutting tool 3 toward the initially set position of the Y-direction touch sensor 62 (step 508). When the blade part 3a of the cutting tool 3 approaches the position of the Y-direction touch sensor 62 that has been initially set (step 509), the control unit 70 decelerates the moving speed (step 510). When the contact detection signal of the blade 3a is received (step 511), the movement of the blade 3a of the cutting tool 3 is stopped (step 512), and the position in the Y direction is stored (step 513).

  With the above operation, the positions of the blade 3a of the cutting tool 3 in the X direction and the Y direction on the base plate 10 are detected.

In the processing apparatus 1 according to this embodiment, the machine origin (0, 0) is set in advance on the base plate 10, and the positions of the blade 3 a of the cutting tool 3 on the base plate 10 in the X direction and the Y direction are This is the position (x 1 , y 1 ) corresponding to the machine origin (0, 0).

Here, the position (x 2 , y 2 ) of the chuck 21 with respect to the machine origin (0, 0) is set in advance, and the position of the bracket plate 41 with respect to the machine origin (0, 0), that is, the tool polishing spindle 42. The position (x 3 , y 3 ), the position (x 4 , y 4 ) of the X direction touch sensor 61 and the position (x 5 , y 5 ) of the Y direction touch sensor 62 are also set in advance.

Therefore, by detecting the position of the X and Y directions (x 1, y 1) on the base plate 10 of the blade portion 3a of byte 3, the position of the blade portion 3a of byte 3 and (x 1, y 1) Chuck The relationship between the position 21 (x 2 , y 2 ) and the position (x 1 , y 1 ) of the blade 3 a of the cutting tool 3 and the center position (x 3 , y 3 ) of the tool polishing spindle 42 is known. Become.

In the grinding process (step 514), the control unit 70 determines the position (x 2 , y 2 ) of the chuck 21 based on the positions (x 1 , y 1 ) in the X direction and the Y direction on the base plate 10 of the blade 3a of the cutting tool 3. ) Is calculated (step 515), and the moving mechanism 50 is controlled based on the calculation result to grind the workpiece 2 (step 516).

Thereafter, the control unit 70 detects the positions (x 1 , y 1 ) in the X direction and the Y direction on the base plate 10 of the blade 3a of the cutting tool 3 at a predetermined timing in the grinding process (step 517), and the polishing process. (Step 514). Here, the predetermined timing is typically when the grinding time of the work material 2 is measured and the grinding time reaches a predetermined time t.

  That is, the control unit 70 returns to step 502 and moves the blade 3a of the cutting tool 3 toward the initially set position of the X-direction touch sensor 61 (step 502). When the cutting portion 3a of the cutting tool 3 approaches the initially set position of the X-direction touch sensor 61 (step 503), the control unit 70 decelerates the moving speed (step 504). When the contact detection signal of the blade 3a is received (step 505), the movement of the blade 3a of the cutting tool 3 is stopped (step 506), and the position in the X direction is stored (step 507).

  Next, the control unit 70 controls the moving mechanism 50 to move the blade portion 3a of the cutting tool 3 toward the initially set position of the Y-direction touch sensor 62 (step 508). When the blade part 3a of the cutting tool 3 approaches the position of the Y-direction touch sensor 62 that has been initially set (step 509), the control unit 70 decelerates the moving speed (step 510). When the contact detection signal of the blade 3a is received (step 511), the movement of the blade 3a of the cutting tool 3 is stopped (step 512), and the position in the Y direction is stored (step 513).

  With the above operation, the positions of the blade portion 3a of the cutting tool 3 consumed by use on the base plate 10 in the X direction and the Y direction are detected.

The relationship between the detected position (x 1 , y 1 ) of the blade 3 of the cutting tool 3 and the center position (x 3 , y 3 ) of the tool polishing spindle 42, that is, the grindstone of the polishing mechanism 40 for polishing the blade 3 a. The positional relationship with the rotation center 43 becomes known. Since the diameter of the grindstone 43 is also known, the positional relationship between the position (x 1 , y 1 ) of the blade 3 a of the cutting tool 3 and the polishing surface of the grindstone 43 is also known.

The control unit 70 calculates the position of the polishing surface of the grindstone 43 based on the detected positions (x 1 , y 1 ) in the X direction and Y direction on the base plate 10 of the blade 3a of the cutting tool 3 (step 518). Based on the calculation result, the moving mechanism 50 is controlled to polish the blade portion 3a of the cutting tool 3 (step 519).

  In the processing apparatus 1 according to this embodiment, the above polishing process of the cutting tool 3 is performed a preset number of times, and the process is terminated. Therefore, in this processing apparatus 1, the setting operation of the positional relationship between the position of the blade portion 3a and the polishing mechanism 40 that polishes the blade portion 3a can be performed without requiring manpower.

  Here, in this embodiment, a polishing pattern is set according to the type of the bit 3.

  For example, when the cutting tool 3 is a parting tool, the polishing surface of the cutting tool 3 is polished by bringing the cutting tool 3 into contact with the grindstone 43 while moving the cutting tool 3 linearly in the Y-axis direction.

  When the cutting tool 3 is a thread cutting tool, the first polishing surface of the cutting tool 3 is brought into contact with the grindstone 43 while moving the cutting tool 3 linearly in a direction inclined 30 ° counterclockwise with respect to the X axis. Then, the second polishing surface of the cutting tool 3 is polished by bringing it into contact with the grindstone 43 while moving the cutting tool 3 linearly in a direction inclined by 30 ° clockwise with respect to the X axis.

  When the cutting tool 3 is a single-edged cutting tool, the cutting tool 3 is brought into contact with the grindstone 43 while moving the cutting tool 3 linearly in the direction inclined by 8 ° clockwise with respect to the X axis. The first polishing surface is polished, and then the second polishing surface of the cutting tool 3 is polished by contacting the grindstone 43 while moving the cutting tool 3 linearly with respect to the Y-axis direction.

  Thus, by setting the polishing pattern according to the type of the cutting tool 3, it is possible to perform optimum polishing according to the type of the cutting tool 3.

  In the processing apparatus 1 according to this embodiment, as described above, the X-direction touch sensor 61, the Y-direction touch sensor 62, and the tool polishing spindle 42 are mounted on the bracket plate 41. Positioning between the polishing mechanism 40 and the touch sensors 61 and 62 becomes unnecessary.

(Second Embodiment)
FIG. 6 is a schematic configuration diagram of a processing apparatus according to the second embodiment of the present invention. In the figure, an X axis, a Y axis, and a Z axis are three axes orthogonal to each other.

  As illustrated in FIG. 6, the processing apparatus 110 includes a base plate 101, a holding and moving unit 102, a main shaft moving unit 103, a main shaft 120, a measuring unit 130, a polishing unit 140, and a control unit 150.

  On the base plate 101, a holding and moving unit 102, a main shaft moving unit 103, a main shaft 120, a measuring unit 130, a polishing unit 140, and the like are arranged.

  The holding and moving unit 102 is configured by, for example, an XY table, holds the work material on the upper surface, and moves the work material in the X and Y directions. The holding and moving unit 102 may move the work material held in the Z direction in addition to the X and Y directions.

  The main shaft moving unit 103 holds the main shaft 120 and moves the main shaft 120 in the X direction and the Z direction, and includes a column 104, an X direction guide member 105, and a movable slider 106. Two columns 104 are arranged on the base plate 101, and an X-direction guide member 105 is held between the two columns 104. The X direction guiding member 105 holds the movable slider 106 so as to be movable in the X direction.

  The movable slider 106 moves on the X direction guide member 105 in the X direction while holding the main shaft 120, and moves the main shaft 120 in the Z direction. By moving the movable slider 106 in the X direction on the X direction guide member 105 while holding the main shaft 120, the main shaft 120 can be moved between the holding and moving unit 102, the measuring unit 130, and the polishing unit 140. .

  The main shaft 120 has a spindle 121 and a tool holder 122.

  The spindle 121 is held by the movable slider 106 and holds the tool holder 122 at its lower end. The tool holder 122 holds the end mill 123. The spindle 121 rotates a tool holder 122 that holds an end mill 123 such as a two-blade, three-blade, and four-blade.

  The measurement part 130 is comprised by the non-contact-type outer diameter measuring device which used the laser beam, for example. The measuring unit 130 measures the position in the Z direction on the base plate 101 at the tip of the end mill 123 and the position in the X direction on the base plate 101 of the central axis of the end mill 123 by the laser light L irradiated between the recesses 131. The wear state of the blade portion 124 of the end mill 123 is measured. As the measurement unit 130, a contact-type measuring device may be used.

  The polishing unit 140 polishes the blade portion 124 of the end mill 123 and is configured to rotate the cylindrical grindstone 141. The cylindrical grindstone 141 is configured to be rotatable about an axis parallel to the X direction, for example. The material of the grindstone 141 may be made of metal such as general steel, cast steel, stainless steel and carbon steel, or may be made of non-metal such as refractory and stone.

  The control unit 150 is configured by, for example, a PC (Personal Computer), and comprehensively controls the operation of the entire processing apparatus 110.

  FIG. 7 is a side view for explaining the operation of measuring the position in the Z direction on the base plate 101 at the tip of the end mill 123 under the control of the control unit 150. FIG. 8 is a top view for explaining an operation of measuring the position in the X direction on the base plate 101 of the central axis of the end mill 123.

  First, the end mill 123 held by the main shaft 120 is moved onto the measurement unit 130 by moving the movable slider 106 in the X direction.

  As shown in FIG. 7A, when the tip 123 e of the end mill 123 held at the lower end of the main shaft 120 is positioned above the laser beam L irradiated between the concave portions 131 of the measuring unit 130, the movement in the X direction is performed. Is stopped, and the main shaft 120 is moved downward in the Z direction.

  As shown in FIG. 7B, when the tip 123e of the end mill 123 touches the laser beam L, the movement is stopped, and the position is stored as the Z-direction position on the base plate 101 of the tip 123e of the end mill 123. .

  Next, by moving the movable slider 106 in the X direction and the Z direction, as shown in FIG. 8A, the end mill 123 held by the main shaft 120 is located on one side of the measuring unit 130 in the X direction and the end mill 123. The tip 123e of the laser beam is moved so as to be positioned below the laser beam L.

As shown in FIG. 8 (b), the end mill 123 which is held on the spindle 120 from one side of the X direction of the measurement unit 130 is moved to the other side, when the side surface 123s 1 of the end mill 123 is touched to the laser beam L The position of the central axis 123c of the end mill 123 at that time is stored as the first position (x 1 ).

  As shown in FIG. 8C, the end mill 123 held by the main shaft 120 is moved so that the other end in the X direction of the measuring unit 130 and the end 123e of the end mill 123 are positioned below the laser beam L.

As shown in FIG. 8 (d), the end mill 123 which is held on the spindle 120 from the other side in the X direction of the measurement unit 130 is moved to one side, when the side surface 123s 2 of the end mill 123 is touched to the laser beam L The position of the center axis 123c of the end mill 123 at that time is stored as the second position (x 2 ).

Based on the stored first position (x 1 ) and second position (x 2 ), the controller 150 determines the position (x 3 = (x 1 + x 2 ) in the X direction on the base plate 101 of the central axis 123c of the end mill 123. ) / 2) is calculated.

  The control unit 150 is the same as that of the first embodiment based on the position in the Z direction of the tip 123e of the end mill 123 thus obtained on the base plate 101 and the position of the central axis 123c of the end mill 123 on the base plate 101. Next, grinding of the work material and polishing of the blade portion 124 of the end mill 123 are performed.

  Therefore, also in this processing apparatus 110, the setting operation of the positional relationship between the position of the blade portion and the polishing mechanism for polishing the blade portion can be performed without requiring manpower.

  Next, the polishing of the blade portion 124 of the end mill 123 will be described in detail.

  9 to 11 are enlarged views of the blade portion 124 according to the present embodiment. 9 is a view of the blade portion 124 viewed from one direction, FIG. 10 is a view of the blade portion 124 viewed from another direction, and FIG. 11 is an enlarged view of the blade edge of the blade portion 124. FIG. 12 is a schematic view of the processing apparatus 110 as viewed from the upper surface side, and FIG. 13 is a diagram illustrating a method for polishing the blade portion 124 according to the present embodiment.

As shown in FIGS. 9 to 11, the blade portion 124 includes a rake face 125 (upward left slanted portion in FIG. 9), an outer peripheral blade 126 (upward right slanted portion in FIG. 9), a clearance surface 127, and a clearance angle θ 1 ( Outer peripheral first clearance angle). Since the blade portion 124 has the flank 127, the friction with the work material (not shown) is minimized, so that the blade edge can be freely fed into the work material. Therefore, the work material can be efficiently cut. Further, the user can regain the cutting force of the blade portion 124 worn by cutting the work material by polishing the rake face 125 or the outer peripheral blade 126.

As shown in FIG. 12, the polishing unit 140 according to this embodiment is attached such that its longitudinal direction is parallel to the X direction or the Y direction. Then, the polishing surface of the polishing unit 140 is controlled to contact the blade portion 124 of the end mill 123 at an arbitrary angle θ 2 with respect to the tangent to the outer periphery of the end mill 123 held by the main shaft 120. For example, the grinding surface of the grindstone 141 in the polishing unit 140 is disposed on the holding and moving unit 102 so as to be parallel to the flank 127 of the blade unit 124. Thereby, the polishing unit 140 performs polishing by controlling the angle of the main shaft 120 in accordance with the clearance angle θ 1 of the end mill 123. That is, in the polishing of the blade portion 124 according to the present embodiment, the grindstone 141 polishes the blade portion 124 along the flank 127 as shown in FIG. As shown in FIGS. 9 to 11, the flank 127 has a smaller area than the rake face 125 and the outer peripheral edge 126. Therefore, it is possible to form a new blade on the blade portion 124 of the end mill 123 while suppressing the grinding allowance of the worn blade portion 124 to a very small amount rather than polishing the rake face 125 or the outer peripheral blade 126. Therefore, the tool life can be extended.

  The shape of the blade portion 124 of the end mill 123 according to the present embodiment is not limited to the configuration shown in FIGS. For example, a scare end mill, a radius end mill, a ball end mill, or the like may be used.

  The number of blades of the blade portion 124 of the end mill 123 is not limited to four blades as shown in FIG. For example, it may be a two-blade, three-blade, six-blade or the like. What is necessary is just to select the number of the blades of the blade part 124 of the end mill 123 according to the hardness, cutting amount, etc. of a work material.

  Next, operation | movement of the processing apparatus 110 which concerns on this embodiment is demonstrated based on the flowchart shown in FIG.

  At a predetermined timing during operation of the NC operation (FIG. 14, St20), the wear amount of the blade portion 124 worn by cutting the work material is measured by the measurement unit 130 (FIG. 14, St11). The measurement unit 130 analyzes the characteristics of the worn blade portion 124 and extracts an optimum measurement point for measuring the wear amount. Then, a measurement value is set for each measurement point. Next, the end mill 123 including the blade portion 124 returns to the initial position (origin position).

  The measurement value obtained by measuring the wear amount by the measurement unit 130 is supplied to the control unit 150 (FIG. 14, St12). Based on the stored polishing program, the controller 150 calculates a polishing allowance from the supplied measurement value (FIG. 14, St13). Here, the calculated polishing allowance is a polishing allowance polished by the polishing unit 140 in accordance with the wear amount of the end mill 123.

  Next, the control unit 150 supplies a polishing command for polishing the calculated polishing allowance to the spindle 120 and the polishing unit 140 (FIG. 14, St14). The main shaft 120 automatically operates based on the supplied polishing command and moves to the polishing unit 140. At this time, the control unit 150 controls the main shaft 120 so that the polished surface of the end mill 123 becomes the flank 127. In the polishing unit 140, the rotational speed of the grindstone 141 is controlled by the control unit 150.

  Here, the blade portion 124 of the end mill 123 held by the main shaft 120 is automatically polished by the polishing portion 140 (FIG. 14, St15). At this time, the polishing allowance is the polishing allowance controlled by the control unit 150 in accordance with the wear amount of the blade portion 124 of the end mill 123.

  After the blade portion 124 is polished, the main shaft 120 automatically operates again and moves to the measuring unit 130. Here, the diameter of the blade 124 after polishing is automatically measured by the measuring unit 130 (FIG. 14, St16).

  The measurement value obtained by measuring the diameter of the blade portion 124 by the measurement unit 130 is supplied to the control unit 150 (FIG. 14, St17). Based on the stored automatic correction program, the controller 150 calculates a correction value for correcting the NC (Numerical Control) operation of the spindle 120 from the supplied measurement value (FIG. 14, St18). Here, the calculated correction value is calculated according to the polishing allowance of the blade portion 124 of the end mill 123.

  Next, the control unit 150 supplies the NC operation command corrected based on the calculated correction value to the spindle 120 (FIG. 14, St19). The main shaft 120 operates based on the supplied NC operation command (FIG. 14, St20). Then, the wear amount of the worn blade portion 124 is again measured by the measurement unit 130 by the NC operation.

  As described above, in the processing apparatus 110 according to the present embodiment, since the polishing of the blade portion 124 of the end mill 123 can be performed while being held on the main shaft 120, the step of attaching the end mill 123 to the main shaft 120 after the polishing and centering the shaft is performed. Is no longer necessary. In addition, since the measurement and polishing of the wear amount of the blade portion 124 of the end mill 123 can be performed without human intervention, the processing apparatus can be continuously connected even if the polishing step of the blade portion 124 of the end mill 123 is sandwiched during the processing step. Driving is possible. Therefore, according to the processing apparatus 110 according to the present embodiment, the processing accuracy can be increased and the productivity can be improved.

  Moreover, according to the processing apparatus 110 which concerns on the above-mentioned, NC operation | movement after grinding | polishing of the blade part 124 of the end mill 123 becomes an operation | movement corrected according to the diameter of the blade part 124 of the end mill 123 after grinding | polishing. That is, the NC operation after polishing is corrected so that the machining accuracy does not differ from the NC operation before polishing. Therefore, the processing accuracy before polishing in the blade portion 124 of the end mill 123 can be maintained even after polishing.

  In the processing apparatus 110 according to the present embodiment, the end mill 123 wears during the processing of the work material, but by re-polishing before the wear progresses, the sharpness can be maintained at any time, and the polishing amount is increased. It can be finished with less precision. Usually, since it will be used to the point where wear increases, re-polishing is about several times. However, according to the processing apparatus 110 of the present invention, re-polishing can be performed several hundred times, and the end mill 123 has a very long life.

  Here, in the processing apparatus 110 according to the present embodiment, the polishing unit 140 is configured such that the polishing surface of the polishing unit 140 has an arbitrary angle with respect to the tangent to the outer periphery of the end mill 123 held by the main shaft 120. Although it was comprised so that it might contact | abut to the blade part 124, in that case, it becomes the process shown below. Here, the target of the tool is a flat end mill, a radius end mill, a ball end mill, and the machining site is the side surface, R surface, and bottom surface of the end mill.

  That is, the measurement unit 130 first selects a tool (end mill), and then measures the tool. In tool selection, tools are selected by measuring flat end mills, radius end mills, ball end mills, number of blades, blade helix angle, and R. In the tool measurement, the tool diameter and the tool length are measured for a flat end mill, the tool diameter and the tool length are measured for a radius end mill, and the tool diameter and the tool length are measured for a ball end mill.

  Next, the control unit 150 substitutes variables into the tool polishing program based on the measured values, and outputs NC data in a fixed cycle. For example, the tool diameter (position variable), the tool polishing edge position (position variable), tool polishing (position variable), and the twist angle (rotation angle variable) are automatically substituted into the fixed cycle program.

  Next, the tool polishing program is operated. For example, in the polishing program, tool diameter polishing (polishing for the number of blades), tool corner R polishing and bottom surface polishing (in the case of a radius end mill), and tool R polishing (in the case of a ball end mill) are performed.

  Next, the tool is measured. That is, the dimension after polishing is checked. For example, the dimensions after performing tool diameter polishing (the number of blades), tool corner R polishing, bottom surface polishing (for radius end mill), and tool R polishing (for ball end mill) are checked.

  Next, for a flat end mill and a radius end mill, tool radius correction and machining data are output. The tool offset and machining NC data are output again.

  In the above embodiment, the above steps are taken for polishing the above tool (end mill), but the present invention is not limited to this, and the polishing surface of the polishing unit 140 is tangent to the outer periphery of the end mill 123 held by the main shaft 120. In this case, the polishing may be performed in contact with the blade portion 124 of the end mill 123, and in this case, the following process can be simplified. Here, the target of the tool is a flat end mill, a radius end mill, a ball end mill, the clearance angle is 0 °, and the machining site is the side surface, R surface, and bottom surface of the end mill.

  That is, the measurement unit 130 first selects a tool (end mill), and then measures the tool. In tool selection, tools are selected by measuring flat end mills, radius end mills, and ball end mills. That is, it is not necessary to measure the number of blades, the twist angle of the blades, and R. In the tool measurement, the tool diameter and the tool length are measured for a flat end mill, the tool diameter and the tool length are measured for a radius end mill, and the tool diameter and the tool length are measured for a ball end mill.

  Next, the control unit 150 substitutes variables into the tool polishing program based on the measured values, and outputs NC data in a fixed cycle. Here, the tool diameter (position variable), the tool polishing blade tip position (position variable), and tool polishing (position variable) may be automatically substituted into the fixed cycle program, and the torsion angle (rotation angle variable) is unnecessary.

  Next, the tool polishing program is operated. For example, in the polishing program, tool diameter polishing (polishing for the number of blades), tool corner R polishing and bottom polishing (for radius end mill), and tool R polishing (for ball end mill) are all performed in this case. The outer shape can be polished in a rotating state.

  Next, instead of measuring the tool diameter or the like, the tool diameter is automatically calculated based on the amount of follow-up after polishing. That is, the tool diameter automatically calculates the amount of external polishing. Automatic offset calculation of the grinding amount of the tool corner R in the Z direction (for radius end mill). Automatic offset calculation of the grinding amount of the tool R in the Z direction (for ball end mills).

  Next, for a flat end mill and a radius end mill, tool radius correction and machining data are output. Tool offset and machining NC data are output once again, but it is not necessary in the case of calculation or rough machining.

  As described above, the polishing is performed by contacting the blade portion 124 of the end mill 123 so that the polishing surface of the polishing portion 140 is parallel to the tangent to the outer periphery of the end mill 123 held by the main shaft 120. By doing so, all the machined parts of the tool can be ground while rotating the tool, the tool grinding amount is calculated using the total value of the end mill infeed amount, the tool diameter is calculated and the tool is measured. Can be processed only once at the beginning, and the first corner of the relief can be processed at 0 °.

  The embodiment of the present invention has been described above, but the present invention is not limited to the above-described embodiment, and it is needless to say that various modifications can be made without departing from the gist of the present invention.

1 Processing device 3 Bite (cutting tool)
3a Blade 10 Base plate 20 Workpiece material holding mechanism 30 Cutting tool holding mechanism 40 Polishing mechanism 41 Bracket plate (abrasion mechanism / touch sensor mounting plate)
50 moving mechanism 60 detecting mechanism 70 control unit 102 holding moving unit (workpiece holding mechanism)
103 Spindle moving part (moving mechanism)
110 Processing device 120 Spindle (Cutting tool holding mechanism)
123 End mill (cutting tool)
124 Blade part 130 Measuring part (detection mechanism)
140 Polishing part (polishing mechanism)
150 Control unit

Claims (6)

  1. A base plate;
    A workpiece holding mechanism that is disposed on the base plate and holds the workpiece;
    A cutting tool holding mechanism arranged on the base plate and holding a cutting tool for cutting the work material held by the work material holding mechanism;
    A polishing mechanism that is disposed on the base plate and polishes a blade portion of the cutting tool held by the cutting tool holding mechanism;
    A moving mechanism for moving the cutting tool holding mechanism on the base plate;
    A detection mechanism for detecting a position on the base plate of the blade portion of the cutting tool held by the cutting tool holding mechanism;
    A processing device comprising: a control unit that controls the moving mechanism based on the position of the blade portion detected by the detection mechanism and polishes the blade portion by the polishing mechanism.
  2. The processing apparatus according to claim 1,
    The work material holding mechanism is a chuck that is rotationally driven by a drive unit and holds the work material,
    The cutting tool held by the cutting tool holding mechanism is a cutting tool,
    The moving mechanism moves the cutting tool holding mechanism in the X and Y directions on the base plate,
    The said detection mechanism detects the position in the X and Y directions on the said base plate of the blade part of the said cutting tool.
  3. The processing apparatus according to claim 2,
    The said detection mechanism has a touch sensor which is arrange | positioned on the said base plate and detects the position in the X and Y direction on the said base plate of the blade part of the said cutting tool by contact | abutting of the said blade part.
  4. The processing apparatus according to claim 3,
    A processing apparatus having a polishing mechanism and a touch sensor mounting plate on which the polishing mechanism and the touch sensor are mounted.
  5. The processing apparatus according to claim 1,
    The work material holding mechanism is an XY table that holds the work material on an upper surface and moves the held work material in the X and Y directions.
    The cutting tool is an end mill,
    The cutting tool holding mechanism is a main shaft that is rotationally driven by a drive unit and holds the end mill,
    The moving mechanism moves the cutting tool holding mechanism in the X and Z directions on the base plate,
    The detection mechanism detects a position in a Z direction on the base plate of a tip of a blade part of the end mill and a position in a X direction on the base plate of a rotation center of the blade part of the end mill.
  6. The processing apparatus according to claim 5,
    The said detection mechanism has a laser type measuring device which detects the said position by the detection of interruption | blocking of the laser beam by the said end mill.
JP2017015311A 2017-01-31 2017-01-31 Processing device Pending JP2018122378A (en)

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JP2017015311A JP2018122378A (en) 2017-01-31 2017-01-31 Processing device
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JPH0117831B2 (en) * 1978-08-04 1989-04-03 Toshiaki Hosoi
US4292699A (en) * 1979-12-17 1981-10-06 Tibor Szabo Grinding machine for delimited groove machining on cutting tools
CN201338217Y (en) * 2009-01-09 2009-11-04 深圳盟星科技有限公司 Drill bit grinding unit
DE102009023275A1 (en) * 2009-05-29 2010-12-02 Liebherr-Verzahntechnik Gmbh gear cutting
JP5571331B2 (en) * 2009-07-07 2014-08-13 株式会社ディスコ Cutting equipment
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CN103934687A (en) * 2013-01-19 2014-07-23 鸿富锦精密工业(深圳)有限公司 Milling equipment and machining method thereof
WO2016039480A1 (en) * 2014-09-12 2016-03-17 株式会社Kmc Processing device
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CN106272079B (en) * 2016-08-24 2019-07-02 重庆大学 Grinding wheel can restoring on line screw rod grinding attachment
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