JP2018117091A - Cutting apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To properly collect an elastic wave occurring when cutting by cutting means.SOLUTION: A cutting apparatus comprises: cutting means (40) cutting a workpiece (W) held by a chuck table (3); a water storage tank (31) that stores the workpiece held by the chuck table in a submerged state; cutting water supply means (33) supplying cutting water (P) to the water tank; and an elastic wave detection sensor (64) that is arranged in a prescribed location in the cutting means (40) and detects an elastic wave occurring when cutting the workpiece by the cutting means. The workpiece held by the chuck table is cut by the cutting means in the submerged state where the cutting water is stored in the water tank. Thus, the cutting water is not required to inject to a cutting position from a nozzle, and a disturbance noise caused by a cutting water injection is eliminated. Therefore, the elastic wave can be properly collected.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a cutting apparatus that cuts a plate-like object such as a semiconductor wafer with a cutting blade.

  A plate-like workpiece typified by a semiconductor wafer is cut by, for example, a cutting device having an annular cutting blade and divided into a plurality of chips. If an abnormality such as chipping of the cutting blade, cutting performance deterioration, contact with foreign matter, or change in processing load occurs during the cutting of the workpiece, the cutting blade vibrates differently from the normal time. As a cutting device that detects vibrations when the cutting blade is abnormal, the one disclosed in Patent Document 1 is known.

Japanese Patent Laying-Open No. 2015-170743

  When cutting is performed as described above, cutting water is sprayed from a nozzle onto a cutting blade that rotates at a high speed during cutting, thereby cooling processing heat and washing away cutting waste generated by cutting from the workpiece. . However, in the vibration detection of the cutting blade, there is a problem that the injection of the cutting water becomes noise and causes disturbance, and the vibration of the cutting blade cannot be collected properly.

  This invention is made | formed in view of this point, and it is set as one of the objectives to provide the cutting device which can collect appropriately the elastic wave which generate | occur | produces when cutting with a cutting means.

  The cutting device of the present invention is a cutting device that includes at least a holding unit that holds a workpiece and a cutting unit that cuts the workpiece held by the holding unit, and the workpiece held by the chuck table of the holding unit. A water storage tank for storing the work in a submerged state, a cutting water supply means for supplying cutting water to the water storage tank, and an elastic wave that is disposed in the cutting means and is generated when the work is cut by the cutting means. An elastic wave detection sensor for detecting is provided, and the workpiece held on the holding means is cut by the cutting means in a submerged state in which cutting water is stored in the water storage tank.

  According to this configuration, since the workpiece is cut with the cutting blade while being submerged, cooling of the processing heat during cutting, washing of cutting waste, etc. can be performed without spraying cutting water from the nozzle to the cutting location. You can do it. Accordingly, it is not necessary to inject cutting water, and when detecting an elastic wave generated during cutting by an elastic wave detection sensor, it is possible to appropriately collect the elastic wave by eliminating disturbance noise caused by cutting water injection. Thereby, when the abnormality accompanied by the vibration of the cutting blade occurs, the abnormality can be accurately grasped.

  In the cutting device according to the present invention, the cutting means includes a cutting blade, a rotating spindle that rotates with the cutting blade mounted on the tip, and a housing that rotatably supports the rotating spindle, and the elastic wave detection sensor is provided on the cutting blade. It is good to be disposed in the housing so as to be positioned close to non-contact and submerged during cutting.

  According to the present invention, since the workpiece is cut in a submerged state, elastic waves generated when cutting can be appropriately collected.

It is a perspective view of the cutting device of this Embodiment. It is a cross-sectional schematic diagram around the chuck table of the present embodiment. It is a figure which shows typically the cross section etc. of the cutting means of this Embodiment. It is a disassembled perspective view of the cutting means of this Embodiment. FIG. 5A is a graph showing an example of an output waveform from the elastic wave detection sensor, FIG. 5B is a graph showing an example of a waveform after Fourier transform, and FIG. 5C is an example of a waveform before and after the occurrence of an abnormality. It is a graph to show. It is a cross-sectional schematic diagram around the cutting means and chuck table of a modification.

  Hereinafter, the cutting apparatus of the present embodiment will be described with reference to the accompanying drawings. FIG. 1 is a perspective view of the cutting apparatus of the present embodiment. In addition, the cutting apparatus should just be the structure provided with the structure which detects the elastic wave at the time of cutting like this Embodiment, and is not limited to the structure shown in FIG. In FIG. 1, for convenience of explanation, some members are omitted and described, but it is assumed that the configuration normally provided in the cutting apparatus is provided.

  As shown in FIG. 1, the cutting apparatus 1 according to the present embodiment cuts the workpiece W by relatively moving a cutting means 40 having a cutting blade 42 and a chuck table 3 holding the workpiece W. It is configured. The workpiece W is carried into the cutting apparatus 1 while being supported by the ring frame F via the dicing tape T. The workpiece W may be a semiconductor wafer in which a semiconductor device is formed on a semiconductor substrate such as silicon or gallium arsenide, or an optical device wafer in which an optical device is formed on a ceramic, glass, or sapphire-based inorganic material substrate. Good.

  The cutting apparatus 1 includes a chuck table 3 provided on a base 2 and constituting a holding means, and a cutting mechanism 4 for cutting a workpiece W held by the chuck table 3. A spinner cleaning mechanism 6 is provided at a position adjacent to the chuck table 3 on the base 2. In the spinner cleaning mechanism 6, the cleaning water is sprayed toward the rotating spinner table 6a to clean the workpiece W, and then the workpiece W is dried by blowing dry air instead of the cleaning water. .

  The chuck table 3 is formed with a holding surface 3a for sucking and holding the workpiece W by a porous ceramic material. The holding surface 3 a is connected to a suction source (not shown) through a flow path in the chuck table 3. Four clamp portions 3b are provided around the chuck table 3, and the ring frame F around the workpiece W is clamped and fixed from four directions by each clamp portion 3b. The chuck table 3 is supported on the upper surface of the movable plate 10 via a θ table (not shown). The moving plate 10 is disposed in a rectangular opening 11 formed on the upper surface side of the base 2 and extending in the X direction. The opening 11 is covered with a movable plate 10 and a bellows-shaped waterproof cover 12 provided on both sides of the movable plate 10 in the X direction. A cutting feed means (not shown) for driving the chuck table 3 in the X direction, which is the cutting direction, is provided below the waterproof cover 12. This cutting feed means is composed of, for example, a ball screw type moving mechanism.

  The cutting mechanism 4 includes a gate-shaped column 14 fixed on the base 2, a feeding unit 15 provided on the column 14, and a cutting supported by the feeding unit 15 so as to be movable in the Y direction and the Z direction. Means 40.

  The feeding means 15 has a pair of guide rails 21 parallel to the Y direction with respect to the front surface of the column portion 14 and a motor-driven Y-axis table 22 slidably installed on the pair of guide rails 21. . The feeding means 15 includes a pair of guide rails 23 arranged in front of the Y-axis table 22 and parallel to the Z direction, and a motor-driven Z-axis table 24 slidably installed on each guide rail 23. doing. A cutting means 40 is provided below the Z-axis table 24.

  Nut portions (not shown) are formed on the back side of the Y-axis table 22, and a ball screw 25 is screwed to these nut portions. Further, nut portions (not shown) are formed on the back side of each Z-axis table 24, and a ball screw 26 is screwed to these nut portions. A driving motor 28 (the driving motor for the ball screw 25 is not shown) is connected to one end of the ball screw 25 for the Y-axis table 22 and the ball screw 26 for the Z-axis table 24. The ball screws 25 and 26 are rotationally driven by the drive motor 28, and the cutting means 40 is moved along the guide rails 21 and 23 in the Y direction and the Z direction.

  The cutting means 40 is configured by rotatably mounting a cutting blade 42 on the tip of a spindle (not shown) protruding from a spindle housing (housing) 41. The cutting blade 42 is covered with a blade cover 43 that constitutes a part of the housing 41. The cutting means 40 cuts the workpiece W by relatively moving the workpiece W and the cutting blade 42 in the X direction while rotating the cutting blade 42 at a high speed.

  Here, the cutting device 1 further includes a cleaning mechanism 30 provided around the chuck table 3 for cleaning the workpiece W being cut. Hereinafter, the configuration of the cleaning mechanism 30 will be described with reference to FIG. FIG. 2 is a schematic longitudinal sectional view around the chuck table according to the present embodiment.

  As shown in FIGS. 1 and 2, the cleaning mechanism 30 includes a water storage tank 31 that receives the chuck table 3, and a cutting water supply unit 33 that fills the water storage tank 31 with cutting water P (not shown in FIG. 1). And. The water storage tank 31 includes a rectangular bottom wall 35 provided on the lower surface side of the chuck table 3 and a side wall 36 standing from the outer periphery of the bottom wall 35 and surrounding the chuck table 3 from four sides. 36 is open at the top and closed by the bottom wall 35 at the bottom. Further, the upper end position of the side wall 36 is formed higher than the upper surface of the chuck table 3 and higher than the upper surface of the workpiece W held on the chuck table 3. The water storage tank 31 has a bottomed container shape and can store (store) cutting water P inside the side wall 36. By storing this cutting water P, the chuck table 3 and the workpiece W held on the chuck table 3 are stored. Can be submerged.

  A cutting water supply source 38 is connected to the cutting water supply means 33 and supplies the cutting water P so that the water storage tank 31 is filled with the cutting water P. The cutting water supply means 33 is provided above the side wall 36 on the + X direction side of the water storage tank 31 and at the center in the Y direction of the side wall 36. The cutting water supply means 33 includes a nozzle or the like disposed at the above-described position via a support or the like (not shown) provided on the moving plate 10 (not shown in FIG. 2). When the cutting water P is discharged from the cutting water supply means 33, the cutting water P flows from the + X direction side to the -X direction in the water storage tank 31, as shown by a one-dot chain line in FIG. The discharge of the cutting water P from the cutting water supply means 33 is set to a discharge pressure that does not vibrate the cutting blade 42 by the discharge, although the flow of the cutting water P is formed.

  Here, on the bottom wall 35 of the water storage tank 31, drainage ports 39a and 39b (drainage port 39b not shown in FIG. 2) are provided at two positions for discharging the cutting water P in the water storage tank 31. One drainage port 39a is provided on the opposite side of the chuck table 3 in the X direction with the cutting water supply means 33. The other drainage port 39b is formed at a position that is the same as the position where the one discharge port 39a is disposed before rotation when the water storage tank 31 is rotated 90 degrees at the center position of the chuck table 3. Yes. The drain ports 39a and 39b are provided with a valve mechanism (not shown) such as an electromagnetic valve for controlling opening and closing thereof, and the drain port 39a located on the downstream side with the flow of the cutting water P in the X direction by the valve mechanism. Is opened and the non-positioned drain port 39b is closed.

  Subsequently, the cutting means of the present embodiment will be described with reference to FIGS. 3 and 4. FIG. 3 is a diagram schematically showing a cross section and the like of the cutting means of the present embodiment. FIG. 4 is an exploded perspective view of the cutting means of the present embodiment. In FIG. 3 and FIG. 4, the wheel cover is omitted for convenience of explanation. Moreover, the cutting means should just be a structure with which the elastic wave detection sensor mentioned later is mounted | worn, and is not limited to the structure shown in FIG.3 and FIG.4.

  As shown in FIGS. 3 and 4, the cutting means 40 includes a spindle housing (housing) 41 fixed to the lower part of the Z-axis table 24 (see FIG. 1). The spindle housing 41 includes a housing main body 44 and a cylindrical housing cover 45 attached to one end side of the housing main body 44.

  A spindle (rotating spindle) 46 that rotates around the Y axis is accommodated in the housing main body 44. The spindle 46 is, for example, an air spindle, and is supported so as to be rotatable in a floating state with respect to the housing body 44 via a compressed air layer. A tip end portion 46 a of the spindle 46 protrudes from the housing main body 44.

  A circular opening 45 a is formed at the center of the housing cover 45. Further, on the housing main body 44 side of the housing cover 45, a locking portion 45c having a hole 45b is provided. If one end of the spindle 46 is inserted into the opening 45a and a screw 48 (not shown in FIG. 4, refer to FIG. 3) is tightened into the screw hole 44a of the housing body 44 through the screw hole 45b of the locking portion 45c, the housing cover 45 Can be fixed to the housing main body 44.

  A screw hole 46 b is formed in the tip surface of the spindle 46. A fixed flange 50 is attached to the tip portion 46 a of the spindle 46. The fixed flange 50 includes a cylindrical boss portion 51 and a flange-shaped mounting portion 52 that spreads radially outward from the circumferential surface of the boss portion 51.

  In the center of the fixed flange 50, an opening 50a penetrating the boss portion 51 is formed. The front end portion 46a of the spindle 46 is fitted into the opening 50a from the back surface side (spindle housing 45 side). In this state, the washer 54 is positioned in the opening 50 a and the fixing bolt 55 is screwed into the screw hole 46 b through the washer 54, whereby the fixing flange member 50 is fixed to the spindle 46.

  The cutting blade 42 is a hub blade in which an annular cutting edge 58 is attached to the outer periphery of a substantially disc-shaped hub base 57, and is inserted into the boss portion 51 of the fixed flange 50 at the center of the hub base 57. An insertion hole 59 is formed. The cutting edge 58 is formed to a predetermined thickness by mixing abrasives such as diamond and CBN (Cubic Boron Nitride) with a bond material (bonding material) such as metal or resin. As the cutting blade 42, a washer blade composed only of a cutting edge may be used.

  When the insertion hole 59 of the hub base 57 is pushed into the boss portion 51, the boss portion 51 protrudes from the hub base 57. A male screw 51 a is formed on the outer peripheral surface of the protruding portion of the boss portion 51, and an annular fixing nut 61 is fastened to the male screw 51 a to fix the cutting blade 42 to the fixing flange 50. In this way, the fixed flange 50 is mounted on the tip of the spindle 46, and the cutting blade 42 is mounted on the fixed flange 50.

  When the workpiece W (see FIG. 1) is cut by the cutting blade 42 that rotates at high speed, an elastic wave is generated in the cutting blade 42, and the elastic wave detection sensor 64 that detects the generated elastic wave is the cutting means 40. It is arranged.

  The elastic wave detection sensor 64 is configured by, for example, an AE sensor (acoustic emission sensor) having a function of detecting elastic waves. The AE sensor detects acoustic waves emitted during cutting of the workpiece W by the rotating cutting blade 42 as acoustics, and the acoustics at that time are small deformations or microcracks before the solid breaks. Since it occurs with the occurrence and progress, it is possible to detect and predict defects and destruction of materials and structures.

The elastic wave detection sensor 64 includes an ultrasonic transducer 66 fixed inside the fixed flange 50. The ultrasonic vibrator 66 includes, for example, barium titanate (BaTiO ₃ ), lead zirconate titanate (Pb (Zi, Ti) O ₃ ), lithium niobate (LiNbO ₃ ), lithium tantalate (LiTaO ₃ ), and the like. The vibration of the cutting blade 42 is converted into a voltage (vibration signal). The ultrasonic transducer 66 may resonate with respect to vibration having a predetermined frequency, and the frequency of vibration that can be detected by the elastic wave detection sensor 64 may be determined according to the resonance frequency. In this case, ultrasonic transducers 66 having different resonance frequencies may be provided on the plurality of fixed flanges 50, and any one of these fixed flanges 50 may be appropriately selected and used according to processing conditions or the like.

  The elastic wave detection sensor 64 includes a first coil unit 67 provided on the fixed flange 50 and connected to the ultrasonic transducer 66, and a second coil unit provided on the housing cover 45 and facing the first coil unit 67. Coil means 68. As the first coil means 67 and the second coil means 68, an annular coil around which a conducting wire is wound can be exemplified.

  The first coil means 67 and the second coil means 68 are magnetically coupled, and the voltage generated by the ultrasonic vibrator 66 is the same between the first coil means 67 and the second coil means 68. It is transmitted to the second coil means 68 side by induction.

  As shown in FIG. 3, a control unit 80 is connected to the second coil unit 68 via a signal processing unit 81. The signal processing unit 81 includes an amplifier that converts an output signal detected by the elastic wave detection sensor 64 into an output voltage. Therefore, the output signal detected by the elastic wave detection sensor 64 is input to the control unit 80 as an output signal (output voltage or the like) converted by the signal processing unit 81.

  The control means 80 comprehensively controls each part of the apparatus including the feed means 15, the cutting feed means (not shown), and the cutting means 40 in accordance with the output signal from the elastic wave detection sensor 64. The control unit 80 includes a processor that executes various processes, a memory, and the like. The memory is composed of one or a plurality of storage media such as a ROM (Read Only Memory) and a RAM (Random Access Memory) depending on the application.

  Next, with reference to FIG. 2, the cutting method of the workpiece W by the said cutting device 1 is demonstrated. First, the workpiece W fixed to the ring frame F via the dicing tape T is conveyed to the chuck table 3 as a unit by the conveying means (not shown), and is sucked and held. Further, the ring frame F is fixed by the clamp portion 3 b around the chuck table 3. Next, after aligning the workpiece W, the chuck table 3 is moved in the X direction, and the workpiece W is positioned close to the lower side of the cutting blade 42 serving as a cutting region. Further, the cutting blade 42 is moved and positioned in the Y-axis direction in accordance with the planned division line of the workpiece W.

  After positioning as described above, the cutting water P is supplied from the cutting water supply source 38 to the water storage tank 31 through the cutting water supply means 33. The cutting water P is supplied so as to fill up to the opening that is the upper end of the side wall 36 of the water storage tank 31, and the workpiece W held on the chuck table 3 is submerged by the cutting water P. During the supply of the cutting water P from the cutting water supply means 33, the drainage port 39a discharges substantially the same amount or a smaller amount as the supplied cutting water P as drainage.

  Thereafter, the cutting blade 42 rotated at high speed is lowered and positioned in the Z direction according to the depth of cut of the workpiece W. After this positioning, the chuck table 3 is moved relative to the cutting blade 42 in the X direction, and the cutting groove is cut along the planned division line of the workpiece W in the submerged state where the cutting water P is stored in the water storage tank 31. To do. Then, every time one cutting groove is formed, the cutting blade 42 is moved in the Y direction by the pitch interval in the Y direction of the planned dividing line, and the same operation is repeated, so that the cutting grooves are sequentially formed.

  Although cutting waste is generated by cutting with the cutting blade 42, the workpiece W is submerged in the cutting water P, so that the cutting waste is floated from the upper surface of the workpiece W to prevent adhesion to the workpiece W. be able to. At this time, a water flow from the right to the left (X direction) in FIG. 2 can be formed in the water storage tank 31 by discharging the cutting water P from the cutting water supply means 33 and discharging from the drain port 39a. Accordingly, the cutting water P passes through the upper surface of the workpiece W, and the workpiece W is cut while flowing the upper surface of the workpiece W with the cutting water P.

  After forming the cutting grooves in all the division lines parallel to the X axis, the chuck table 3 and the water storage tank 31 are rotated by 90 ° via a θ table (not shown), and the same cutting as above is performed. Cutting grooves are formed in the planned line, and the workpiece W is cut vertically and horizontally. After the chuck table 3 and the water storage tank 31 have been rotated by 90 °, the drain port 39b (see FIG. 1) and the cutting water supply means 33 are positioned with the chuck table 3 interposed therebetween, and the flow of the cutting water P even after the rotation. Can be produced as described above.

  Here, when the workpiece W comes into contact with the cutting edge 58 of the rotating cutting blade 42 when the workpiece W is cut by the cutting means 40, an elastic wave is generated in the cutting blade 42. The elastic wave propagates to an elastic wave detection sensor 64 located in the vicinity of the cutting blade 42, and the elastic wave detection sensor 64 detects the propagated elastic wave and outputs an output signal to the control means 80. The control means 80, for example, performs spectrum analysis by Fourier transform (for example, fast Fourier transform) on a waveform (time domain waveform) corresponding to a time change of a voltage transmitted per arbitrary unit time, and obtains the obtained frequency. The state of the cutting blade 42 is determined based on the waveform of the region. The unit time is the time required for cutting one line (for each cut line), the time required for cutting one workpiece (for each workpiece), and the time required for cutting an arbitrary distance (cut) Various modes such as every distance) are conceivable.

  FIG. 5A is a graph showing an example of a waveform of a voltage (time domain waveform) transmitted to the control means, and FIG. 5B is a graph showing an example of a waveform (frequency domain waveform) after Fourier transform. 5A, the vertical axis represents voltage (V), the horizontal axis represents time (t), and in FIG. 5B, the vertical axis represents amplitude, and the horizontal axis represents frequency (f).

  In this way, if the waveform of the voltage (vibration signal) from the elastic wave detection sensor 64 is Fourier transformed by the control means 80, the vibration of the cutting blade 42 is divided into main frequency components as shown in FIG. Anomalies that occur can be easily analyzed. Thereby, the abnormality during cutting can be detected accurately in real time.

  FIG. 5C is a graph showing an example of a waveform (frequency domain waveform) before and after the occurrence of an abnormality. In FIG. 5C, the vertical axis represents amplitude and the horizontal axis represents frequency (f). In FIG. 5C, the waveform before the occurrence of the abnormality is indicated by a solid line, and the waveform after the occurrence of the abnormality is indicated by a broken line.

  As shown in FIG. 5C, the waveform after the occurrence of abnormality has a vibration mode (vibration component) on the high frequency side that is not found in the waveform before the occurrence of abnormality. For example, the control unit 80 compares the waveforms before and after the occurrence of the abnormality (the waveform in the frequency domain) and determines that an abnormality corresponding to the vibration mode seen only in the waveform after the occurrence of the abnormality has occurred.

  Here, conventionally, in order to determine whether or not there is an abnormality in the cutting blade, even when detecting vibration of the cutting blade during processing, cutting water is injected at a high pressure from the nozzle to the cutting position for the convenience of cooling and cleaning. However, cutting was carried out. Therefore, vibration is generated by the energy generated when the injected cutting water is sprayed on the workpiece or the cutting blade, and this vibration has to be detected by the elastic wave detection sensor. For this reason, in the detection of the elastic wave emitted from the cutting blade by the cutting process, the injection of the cutting water becomes noise, and it is difficult to appropriately collect the vibration of the cutting blade.

  On the other hand, in the cutting apparatus 1 according to the present embodiment, the workpiece W is cut while being submerged inside the water storage tank 31, so that it is not necessary to perform high-pressure injection of the cutting water P from the nozzle. Thereby, noise can be reduced in the detection of the elastic wave by the elastic wave detection sensor 64, and the elastic wave due to the cutting of the cutting blade 42 can be collected appropriately. As described above, since the influence of noise due to the cutting water P is reduced, the elastic wave detection sensor 64 including the AE sensor can accurately detect the change of the elastic wave and accurately determine the abnormality of the cutting blade 42. .

  The installation position of the elastic wave detection sensor 64 may be another position of the cutting means 40, and can be exemplified as being provided on a wheel cover 43 that covers the outer periphery of the cutting blade 42 as shown in FIG. FIG. 6 is a schematic cross-sectional view around a cutting means and a chuck table according to a modification. The wheel cover 43 of the cutting means 40 in FIG. 6 has a structure in which a support body 43a is provided on the + X direction side that is the cutting feed direction, and an elastic wave detection sensor 64 is supported on the lower end side of the support body 43a.

  The elastic wave detection sensor 64 is disposed close to the front (+ X direction) of the cutting blade 42 via the support 43a. Further, the position of the elastic wave detection sensor 64 in the Z direction is a position where the cutting water P in the water storage tank 31 is submerged at the time of cutting, and is positioned so as not to contact the workpiece W. . Thereby, the elastic wave at the time of the process by the cutting blade 42 can be appropriately detected through the cutting water P by the elastic wave detection sensor 64. Further, since the elastic wave detection sensor 64 is provided in front of the cutting blade 42, the elastic wave can be detected without being affected by the cutting water P scattered by the rotation of the cutting blade 42.

  Further, the control means 80 may perform analysis without performing Fourier transform. For example, an output range or output value of the output signal of the elastic wave detection sensor 64 immediately before the occurrence of abnormality is stored in advance as a threshold value, and contrasted with this threshold value. Then, the situation of the cutting blade 42 may be analyzed.

  Moreover, the structure of the washing | cleaning mechanism 30 can be variously changed as long as it can cut in the state which stored the cutting water P in the water storage tank 31, and was submerged like the said embodiment. For example, the shape of the water storage tank 31 in a plan view may be circular, or the side wall 36 may be movable so that the water can be drained.

  Further, in the present embodiment, the cutting device 1 for dividing the workpiece W is illustrated, but the cutting device 1 may be used not only for dividing but also for edge trimming of the workpiece W.

  The embodiments of the present invention are not limited to the above-described embodiments and modifications, and various changes, substitutions, and modifications may be made without departing from the spirit of the technical idea of the present invention. Furthermore, if the technical idea of the present invention can be realized in another way by technological advancement or another derived technique, the method may be used. Accordingly, the claims cover all embodiments that can be included within the scope of the technical idea of the present invention.

  As described above, the present invention has an effect that it is possible to appropriately collect elastic waves generated when cutting with a cutting means, and in particular, a cutting apparatus that cuts a workpiece with a rotating cutting blade. Useful for.

1 Cutting device 3 Chuck table (holding means)
31 Water storage tank 33 Cutting water supply means 40 Cutting means 41 Spindle housing (housing)
42 Cutting blade 43 Spindle (Rotating spindle)
64 Elastic wave detection sensor 80 Control means P Cutting water W Workpiece

Claims (2)

In a cutting apparatus including at least a holding means for holding a workpiece and a cutting means for cutting the workpiece held by the holding means,
A water storage tank for storing the workpiece held on the chuck table of the holding means in a submerged state, and a cutting water supply means for supplying cutting water to the water storage tank;
An elastic wave detection sensor that is disposed in the cutting means and detects an elastic wave generated when the workpiece is cut by the cutting means;
The workpiece held on the holding means is cut by the cutting means in a submerged state in which cutting water is stored in the water storage tank. The cutting means includes a cutting blade, a rotating spindle that rotates with the cutting blade mounted on a tip, and a housing that rotatably supports the rotating spindle,
The cutting apparatus according to claim 1, wherein the elastic wave detection sensor is disposed in the housing so as to be positioned in a position close to non-contact with the cutting blade and submerged during cutting.

Images