JP2018098462A - Manufacturing method of printed wiring board - Google Patents

Manufacturing method of printed wiring board Download PDF

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JP2018098462A
JP2018098462A JP2016244606A JP2016244606A JP2018098462A JP 2018098462 A JP2018098462 A JP 2018098462A JP 2016244606 A JP2016244606 A JP 2016244606A JP 2016244606 A JP2016244606 A JP 2016244606A JP 2018098462 A JP2018098462 A JP 2018098462A
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wiring board
printed wiring
hole
manufacturing
metal pin
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JP6794814B2 (en
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伊織 小林
Iori Kobayashi
伊織 小林
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Toyota Motor Corp
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Toyota Motor Corp
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Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing method of printed wiring board capable of preventing metal pins from protruding from the bottom face of a printed wiring board.SOLUTION: The manufacturing method of printed wiring board is a method for inserting columnar metal pins into through holes formed in a printed wiring board. In the manufacturing method of printed wiring board, metal pins are inserted into the through holes while supporting the printed wiring board to cover the openings in the lower face of the through hole on a support face which is followable to the lower face of the printed wiring board.SELECTED DRAWING: Figure 3

Description

本発明は、プリント配線基板の製造方法に関する。   The present invention relates to a method for manufacturing a printed wiring board.

例えば、特許文献１に、プリント配線基板に形成された貫通孔に金属ピンを実装するプリント配線基板の製造方法が開示されている。   For example, Patent Document 1 discloses a method for manufacturing a printed wiring board in which metal pins are mounted in through holes formed in the printed wiring board.

特開２００７−２０８０８３号公報JP 2007-208083 A

上述した製造方法では、プリント配線基板の貫通孔に挿入した金属ピンが、接着部材などで固定される前にプリント配線基板から落下することを防止するため、プリント配線基板の下面から貫通孔を塞いで金属ピンを支持する構造が必要である。   In the above-described manufacturing method, the metal pin inserted into the through hole of the printed wiring board is blocked from the lower surface of the printed wiring board in order to prevent the metal pin from dropping from the printed wiring board before being fixed with an adhesive member or the like. Therefore, a structure for supporting the metal pin is required.

しかしながら、プリント配線基板の下面から貫通孔を塞ぐための支持面が、プリント配線基板の反りなどに合っていなければ、反りによってプリント配線基板の下面と支持面との間に生じる隙間の分だけ金属ピンがプリント配線基板の下面から突出する虞がある。   However, if the support surface for closing the through-hole from the lower surface of the printed wiring board does not match the warp of the printed wiring board, the metal is formed by the gap generated between the lower surface of the printed wiring board and the support surface due to the warpage. There is a possibility that the pins protrude from the lower surface of the printed wiring board.

本発明は、上記課題を鑑みてなされたものであり、金属ピンがプリント配線基板の下面から突出することを防止できる、プリント配線基板の製造方法を提供することを目的とする。   The present invention has been made in view of the above problems, and an object of the present invention is to provide a method for manufacturing a printed wiring board that can prevent metal pins from protruding from the lower surface of the printed wiring board.

上記課題を解決するために、本発明の一態様は、プリント配線基板に形成された貫通孔に柱状の金属ピンを挿入するプリント配線基板の製造方法であって、プリント配線基板の下面に追従可能な支持面で貫通孔の下面開口部を塞ぐようにプリント配線基板を支持しながら、貫通孔に金属ピンを挿入して接着する、ことを特徴とする。   In order to solve the above problems, one aspect of the present invention is a method of manufacturing a printed wiring board in which columnar metal pins are inserted into through holes formed in the printed wiring board, and can follow the lower surface of the printed wiring board. A metal pin is inserted into and bonded to the through hole while supporting the printed wiring board so as to close the lower surface opening of the through hole with a simple support surface.

本態様のプリント配線基板の製造方法では、プリント配線基板の下面に追従可能な支持面で、貫通孔の下面開口部を塞ぐようにプリント配線基板を支持した状態で、プリント配線基板の貫通孔に金属ピンを挿入して接着することができる。   In the printed wiring board manufacturing method of this aspect, the supporting surface that can follow the lower surface of the printed wiring board is supported on the through hole of the printed wiring board while the printed wiring board is supported so as to close the lower surface opening of the through hole. Metal pins can be inserted and bonded.

これにより、貫通孔に挿入された金属ピンの先端がプリント配線基板の下面から突出することを防止できる。従って、プリント配線基板と金属ピンとの面出し、つまり平面精度の確保を容易に行うことができる。   Thereby, it can prevent that the front-end | tip of the metal pin inserted in the through-hole protrudes from the lower surface of a printed wiring board. Therefore, the printed circuit board and the metal pin can be easily faced, that is, the plane accuracy can be easily secured.

上記本発明のプリント配線基板の製造方法によれば、金属ピンがプリント配線基板の下面から突出することを防止できる。   According to the method for manufacturing a printed wiring board of the present invention, the metal pins can be prevented from protruding from the lower surface of the printed wiring board.

本発明の一実施形態に係るプリント配線基板の製造方法で製造されたプリント配線基板を説明する図The figure explaining the printed wiring board manufactured with the manufacturing method of the printed wiring board which concerns on one Embodiment of this invention. 本発明の一実施形態に係るプリント配線基板の製造方法で用いられる基板支持治具を説明する図The figure explaining the board | substrate support jig | tool used with the manufacturing method of the printed wiring board which concerns on one Embodiment of this invention. 本発明の一実施形態に係るプリント配線基板の製造方法を説明する図The figure explaining the manufacturing method of the printed wiring board which concerns on one Embodiment of this invention.

［概要］
本発明は、プリント配線基板に形成された貫通孔に柱状の金属ピンを挿入するプリント配線基板の製造方法である。このプリント配線基板の製造方法では、プリント配線基板の下面に追従可能な支持面で貫通孔の下面開口部を塞ぐようにプリント配線基板を支持しながら、貫通孔に金属ピンを挿入して接着する。これにより、貫通孔に挿入された金属ピンの先端がプリント配線基板の下面から突出することを防止できる。 [Overview]
The present invention is a method for manufacturing a printed wiring board, in which columnar metal pins are inserted into through holes formed in the printed wiring board. In this printed wiring board manufacturing method, a metal pin is inserted and bonded to the through hole while supporting the printed wiring board so as to block the lower surface opening of the through hole with a support surface capable of following the lower surface of the printed wiring board. . Thereby, it can prevent that the front-end | tip of the metal pin inserted in the through-hole protrudes from the lower surface of a printed wiring board.

［プリント配線基板］
図１を参照する。プリント配線基板１０は、少なくとも片側の表面に導体パターン（図示せず）が形成された、例えばガラスエポキシ基板である。このプリント配線基板１０には、一方の表面である上面１０ｕから他方の表面である下面１０ｄにかけて貫通した貫通孔１１が１つ以上設けられている。 [Printed wiring board]
Please refer to FIG. The printed wiring board 10 is, for example, a glass epoxy board in which a conductor pattern (not shown) is formed on at least one surface. The printed wiring board 10 is provided with one or more through-holes 11 penetrating from the upper surface 10u which is one surface to the lower surface 10d which is the other surface.

貫通孔１１は、円形、楕円形、または多角形などの形状を有した金属ピン２０が挿入される孔である。本実施形態では、円形の貫通孔１１としている。貫通孔１１の形状や大きさ（開口部）は、金属ピン２０の大きさなどに基づいて設定される。   The through hole 11 is a hole into which the metal pin 20 having a circular shape, an elliptical shape, a polygonal shape or the like is inserted. In the present embodiment, the circular through hole 11 is used. The shape and size (opening) of the through hole 11 are set based on the size of the metal pin 20 and the like.

金属ピン２０は、その水平断面が円形、楕円形、または多角形などを有した柱状体の部材である。金属ピン２０は、貫通孔１１に挿入されることで、プリント配線基板１０の熱抵抗を低くして放熱性能を向上させる機能を果たす。本実施形態では、円柱状の金属ピン２０としている。金属ピン２０には、例えば熱伝導率が高い銅などが使用される。この金属ピン２０は、プリント配線基板１０の貫通孔１１に応力を印加することなく挿入できる寸法を有している。典型的には、金属ピン２０の外径は、貫通孔１１の内径よりも小さい。   The metal pin 20 is a columnar member whose horizontal cross section has a circular, elliptical, or polygonal shape. The metal pin 20 is inserted into the through-hole 11 to achieve a function of reducing the thermal resistance of the printed wiring board 10 and improving the heat dissipation performance. In the present embodiment, a cylindrical metal pin 20 is used. For example, copper having high thermal conductivity is used for the metal pin 20. The metal pin 20 has a dimension that can be inserted into the through hole 11 of the printed wiring board 10 without applying stress. Typically, the outer diameter of the metal pin 20 is smaller than the inner diameter of the through hole 11.

例えば、円形の貫通孔１１に円柱状の金属ピン２０が挿入される場合、貫通孔１１の内径が直径６ｍｍであれば、金属ピン２０の外径は、それよりも０．１ｍｍ小さい５．９ｍｍとすることができる。   For example, when the cylindrical metal pin 20 is inserted into the circular through hole 11, if the inner diameter of the through hole 11 is 6 mm, the outer diameter of the metal pin 20 is 5.9 mm, which is 0.1 mm smaller than that. It can be.

金属ピン２０は、接着部材４０によってプリント配線基板１０の貫通孔１１に固定される。例えば、低粘度の接着剤を接着部材４０として用いることができる。貫通孔１１の上面１０ｕと下面１０ｄとを電気的に接続させる目的で、はんだを接着部材４０として用いることもできる。この接着部材４０は、貫通孔１１に挿入された金属ピン２０の側面と貫通孔１１の壁面との隙間ｇに充填される。   The metal pin 20 is fixed to the through hole 11 of the printed wiring board 10 by the adhesive member 40. For example, a low-viscosity adhesive can be used as the adhesive member 40. For the purpose of electrically connecting the upper surface 10 u and the lower surface 10 d of the through hole 11, solder can also be used as the adhesive member 40. The adhesive member 40 is filled in a gap g between the side surface of the metal pin 20 inserted into the through hole 11 and the wall surface of the through hole 11.

なお、接着部材４０を低粘度とすることで、例えば、金属ピン２０の位置がずれて金属ピン２０の側面と貫通孔１１の壁面とが接触したとしても、毛細管現象でこの接触した部分の近傍に接着部材４０が浸透するので、固定強度は十分に確保することができる。   In addition, by making the adhesive member 40 have a low viscosity, for example, even if the position of the metal pin 20 is shifted and the side surface of the metal pin 20 and the wall surface of the through hole 11 are in contact with each other, the vicinity of the contacted portion due to capillary action Since the adhesive member 40 permeates into, the fixing strength can be sufficiently secured.

［基板支持治具］
図２を参照する。基板支持治具３０は、貫通孔１１に金属ピン２０を挿入する際に、プリント配線基板１０を支持するための治具である。この基板支持治具３０は、治具底面部３１と、治具側面部３２と、ばね部３３と、支持板部３４とを備える。 [Substrate support jig]
Please refer to FIG. The board support jig 30 is a jig for supporting the printed wiring board 10 when the metal pins 20 are inserted into the through holes 11. The substrate support jig 30 includes a jig bottom surface portion 31, a jig side surface portion 32, a spring portion 33, and a support plate portion 34.

治具底面部３１は、基板支持治具３０の基盤部分であり、例えば方形の平板である。治具側面部３２は、治具底面部３１の少なくとも対向する一対の端部から、治具底面部３１の平面に対して垂直方向に立設されている。この治具側面部３２には、製造工程においてプリント配線基板１０が載置される。   The jig bottom surface portion 31 is a base portion of the substrate support jig 30 and is, for example, a rectangular flat plate. The jig side surface portion 32 is erected in a direction perpendicular to the plane of the jig bottom surface portion 31 from at least a pair of opposed end portions of the jig bottom surface portion 31. The printed wiring board 10 is placed on the jig side surface portion 32 in the manufacturing process.

ばね部３３は、その一端側が治具底面部３１に接続され、治具底面部３１から垂直方向に立設されている弾性部材である。支持板部３４は、少なくとも１つの貫通孔１１の開口部を覆うことができるサイズを有した平板である。この支持板部３４は、一方面（下面）がばね部３３の他端側の先端に接続されており、他方面（上面）となる支持面３４ｆには、製造工程において治具側面部３２に載置されたプリント配線基板１０の下面１０ｄが当接する。また、支持板部３４は、治具側面部３２の上端より高い位置にある。   The spring portion 33 is an elastic member whose one end is connected to the jig bottom surface portion 31 and is erected in the vertical direction from the jig bottom surface portion 31. The support plate portion 34 is a flat plate having a size that can cover the opening of at least one through hole 11. The support plate portion 34 has one surface (lower surface) connected to the tip on the other end side of the spring portion 33, and the support surface 34 f serving as the other surface (upper surface) is connected to the jig side surface portion 32 in the manufacturing process. The lower surface 10d of the printed wiring board 10 placed is in contact. Further, the support plate portion 34 is located at a position higher than the upper end of the jig side surface portion 32.

この支持板部３４は、治具側面部３２に載置されるプリント配線基板１０の反りや変形などに合わせて支持面３４ｆが変位および傾倒を行い、貫通孔１１の下面開口部１１ｄを常に当接して塞ぐことが可能なように、ばね部３３を介して治具底面部３１からフローティングした状態で取り付けられている。すなわち、ばね部３３および支持板部３４は、プリント配線基板１０の下面１０ｄに追従可能な支持面３４ｆで、貫通孔１１の下面開口部１１ｄを塞ぐようにプリント配線基板１０を支持するように機能する。   The support plate portion 34 is displaced and tilted in accordance with warping or deformation of the printed wiring board 10 placed on the jig side surface portion 32, so that the lower surface opening portion 11d of the through hole 11 is always applied. It is attached in a floating state from the jig bottom surface part 31 via the spring part 33 so as to be able to contact and close. That is, the spring portion 33 and the support plate portion 34 function to support the printed wiring board 10 so as to close the lower surface opening portion 11d of the through hole 11 with a support surface 34f that can follow the lower surface 10d of the printed wiring board 10. To do.

なお、本実施形態では、複数の貫通孔１１のそれぞれに対してばね部３３および支持板部３４を設ける構成を示したが、本発明の基板支持治具３０はこの構成に限られるものではない。例えば、複数の貫通孔１１に対して一組のばね部３３および支持板部３４を設ける構成でもよい。   In addition, in this embodiment, although the structure which provides the spring part 33 and the support plate part 34 with respect to each of the several through-hole 11 was shown, the board | substrate support jig | tool 30 of this invention is not restricted to this structure. . For example, the structure which provides one set of the spring part 33 and the support plate part 34 with respect to the some through-hole 11 may be sufficient.

［プリント配線基板の製造方法］
図３を参照して、本発明の一実施形態に係るプリント配線基板の製造方法を説明する。以下の説明では、図３（ａ）に示すように、プリント配線基板１０が下面１０ｄの方向に凸状態で反っているものとする。 [Printed wiring board manufacturing method]
With reference to FIG. 3, the manufacturing method of the printed wiring board based on one Embodiment of this invention is demonstrated. In the following description, as shown in FIG. 3A, the printed wiring board 10 is warped in a convex state in the direction of the lower surface 10d.

プリント配線基板１０が、治具側面部３２に載置される（図３（ｂ））。この際、支持板部３４の支持面３４ｆが、プリント配線基板１０の下面１０ｄに追従して貫通孔１１の下面開口部１１ｄを塞ぐようにプリント配線基板１０を支持する。   The printed wiring board 10 is placed on the jig side surface portion 32 (FIG. 3B). At this time, the support surface 34 f of the support plate portion 34 supports the printed wiring board 10 so as to follow the lower surface 10 d of the printed wiring board 10 and close the lower surface opening 11 d of the through hole 11.

そして、支持板部３４の支持面３４ｆによって全ての貫通孔１１の下面開口部１１ｄが塞がれた状態で、貫通孔１１の上面開口部１１ｕから金属ピン２０がそれぞれ挿入される（図３（ｃ））。   Then, the metal pins 20 are respectively inserted from the upper surface openings 11u of the through holes 11 in a state where the lower surface openings 11d of all the through holes 11 are closed by the support surface 34f of the support plate portion 34 (FIG. 3 ( c)).

その後、貫通孔１１に挿入された金属ピン２０の側面と貫通孔１１の壁面との隙間ｇに接着部材４０が充填される（図示せず）。これにより、プリント配線基板の製造方法における、プリント配線基板１０に形成された貫通孔１１に柱状の金属ピン２０を挿入する工程が完了する。   Thereafter, the adhesive member 40 is filled in the gap g between the side surface of the metal pin 20 inserted into the through hole 11 and the wall surface of the through hole 11 (not shown). Thereby, the process of inserting the columnar metal pin 20 into the through hole 11 formed in the printed wiring board 10 in the method for manufacturing the printed wiring board is completed.

［本実施形態による作用および効果］
上述したように、本発明の一実施形態に係るプリント配線基板の製造方法は、プリント配線基板１０の下面１０ｄに追従可能な支持面３４ｆで貫通孔１１の下面開口部１１ｄを塞ぐようにプリント配線基板１０を支持した状態で、上面開口部１１ｕから貫通孔１１に金属ピン２０を挿入する。 [Operations and effects of this embodiment]
As described above, in the method for manufacturing a printed wiring board according to the embodiment of the present invention, the printed wiring board is closed so that the lower surface opening 11d of the through hole 11 is closed by the support surface 34f that can follow the lower surface 10d of the printed wiring board 10. With the substrate 10 supported, the metal pins 20 are inserted into the through holes 11 from the upper surface opening 11u.

この方法により、貫通孔１１に挿入された金属ピン２０の先端がプリント配線基板１０の下面１０ｄから突出することを防止できる。従って、プリント配線基板１０と金属ピン２０との面出し、つまり平面精度の確保を容易に行うことができる。   By this method, it is possible to prevent the tip of the metal pin 20 inserted into the through hole 11 from protruding from the lower surface 10 d of the printed wiring board 10. Therefore, the printed wiring board 10 and the metal pin 20 can be easily faced, that is, the plane accuracy can be ensured easily.

また、プリント配線基板１０から金属ピン２０が落下することを防止できる。従って、頭付きの金属ピンなどを使用しなくて済むため、金属ピン２０のコストを低減することができる。   Further, the metal pin 20 can be prevented from dropping from the printed wiring board 10. Therefore, since it is not necessary to use a metal pin with a head, the cost of the metal pin 20 can be reduced.

また、この方法により、本プリント配線基板の製造方法は、プリント配線基板１０の下面１０ｄに追従可能な支持面３４ｆで貫通孔１１の下面開口部１１ｄを塞ぐようにプリント配線基板１０を支持した状態で上面開口部１１ｕから貫通孔１１に金属ピン２０を挿入した後、貫通孔１１に挿入された金属ピン２０の側面と貫通孔１１の壁面との隙間に接着部材４０を充填してプリント配線基板１０に固定することができる。   In addition, according to this method, the printed wiring board manufacturing method supports the printed wiring board 10 so that the lower surface opening 11d of the through hole 11 is closed by the support surface 34f that can follow the lower surface 10d of the printed wiring board 10. After inserting the metal pin 20 into the through-hole 11 from the upper surface opening 11u, the adhesive member 40 is filled in the gap between the side surface of the metal pin 20 inserted into the through-hole 11 and the wall surface of the through-hole 11 to print the printed circuit board. 10 can be fixed.

これにより、接着部材４０がプリント配線基板１０の下面１０ｄから流出することを防止できる。従って、熱抵抗となる接着部材４０が金属ピン２０の底面に付着することを抑えることができるため、金属ピン２０の放熱性を確保することができる。   Thereby, it is possible to prevent the adhesive member 40 from flowing out from the lower surface 10 d of the printed wiring board 10. Therefore, since it can suppress that the adhesive member 40 used as thermal resistance adheres to the bottom face of the metal pin 20, the heat dissipation of the metal pin 20 can be ensured.

［応用例］
基板支持治具３０におけるばね部３３および支持板部３４の構成に代えて、支持面３４ｆとしての機能を有する弾力がある一枚の弾性板や弾性膜などを用いてもよい。この場合には、プリント配線基板１０の下面１０ｄの全体に亘って一枚の弾性板や弾性膜などが当接することとなる。 [Application example]
Instead of the configuration of the spring part 33 and the support plate part 34 in the substrate support jig 30, a single elastic plate or elastic film having a function as the support surface 34f may be used. In this case, a single elastic plate, elastic film, or the like abuts over the entire lower surface 10d of the printed wiring board 10.

本発明のプリント配線基板の製造方法は、プリント配線基板に形成された貫通孔に柱状金属ピンを挿入する場合に利用可能であり、特に金属ピンがプリント配線基板の下面から突出することを防止したい場合などに有用である。   The method for manufacturing a printed wiring board of the present invention can be used when a columnar metal pin is inserted into a through-hole formed in the printed wiring board, and in particular, it is desired to prevent the metal pin from protruding from the lower surface of the printed wiring board. This is useful in some cases.

１０ プリント配線基板
１０ｕ 上面
１０ｄ 下面
１１ 貫通孔
１１ｕ 上面開口部
１１ｄ 下面開口部
２０ 金属ピン
３０ 基板支持治具
３１ 治具底面部
３２ 治具側面部
３３ ばね部
３４ 支持板部
３４ｆ 支持面
４０ 接着部材 DESCRIPTION OF SYMBOLS 10 Printed wiring board 10u Upper surface 10d Lower surface 11 Through-hole 11u Upper surface opening part 11d Lower surface opening part 20 Metal pin 30 Board | substrate support jig 31 Jig bottom face part 32 Jig side face part 33 Spring part 34 Support plate part 34f Support surface 40 Adhesive member

Claims (1)

プリント配線基板に形成された貫通孔に柱状の金属ピンを挿入するプリント配線基板の製造方法であって、
前記プリント配線基板の下面に追従可能な支持面で前記貫通孔の下面開口部を塞ぐように前記プリント配線基板を支持しながら、前記貫通孔に前記金属ピンを挿入して接着する、
ことを特徴とする、プリント配線基板の製造方法。 A method of manufacturing a printed wiring board, in which columnar metal pins are inserted into through holes formed in the printed wiring board,
While supporting the printed wiring board so as to block the lower surface opening of the through hole with a support surface that can follow the lower surface of the printed wiring board, the metal pin is inserted into the through hole and bonded.
A method for producing a printed wiring board, wherein
JP2016244606A 2016-12-16 2016-12-16 Manufacturing method of printed wiring board Active JP6794814B2 (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112996270A (en) * 2021-04-30 2021-06-18 四川英创力电子科技股份有限公司 Double-sided circuit board moves and carries device

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Publication number Priority date Publication date Assignee Title
JPS56165398A (en) * 1980-05-26 1981-12-18 Fujitsu Ltd Method of arraying conductive balls
JP2004179309A (en) * 2002-11-26 2004-06-24 New Japan Radio Co Ltd Heat dissipating structure for printed circuit board and method for manufacturing the same
CN102006733A (en) * 2009-09-02 2011-04-06 富葵精密组件(深圳)有限公司 Manufacturing method for circuit board
JP2016062916A (en) * 2014-09-12 2016-04-25 イビデン株式会社 Electronic component mounting substrate and manufacturing method of electronic component mounting substrate

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56165398A (en) * 1980-05-26 1981-12-18 Fujitsu Ltd Method of arraying conductive balls
JP2004179309A (en) * 2002-11-26 2004-06-24 New Japan Radio Co Ltd Heat dissipating structure for printed circuit board and method for manufacturing the same
CN102006733A (en) * 2009-09-02 2011-04-06 富葵精密组件(深圳)有限公司 Manufacturing method for circuit board
JP2016062916A (en) * 2014-09-12 2016-04-25 イビデン株式会社 Electronic component mounting substrate and manufacturing method of electronic component mounting substrate

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112996270A (en) * 2021-04-30 2021-06-18 四川英创力电子科技股份有限公司 Double-sided circuit board moves and carries device
CN112996270B (en) * 2021-04-30 2021-07-20 四川英创力电子科技股份有限公司 Double-sided circuit board moves and carries device

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