JP2008292447A - Electronic component testing tool - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic component testing tool for improving working efficiency for operating test of an electronic component. <P>SOLUTION: The electronic component testing tool comprises a base having a terminal connection portion on the upper face, a means for applying voltage to the terminal connection portion, and an elastic member for thrusting the terminal member of an electronic component against the terminal connection portion in no contact with the electronic component body while expanding itself in the thrusting direction. An insulator plate which has a lead terminal guide groove ranging over both the surface and the reverse on one side to expose the terminal connection portion is arranged between the base and the elastic member. It is preferably mounted on the base. A retaining member preferably supports the elastic member. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a jig for testing an electronic component in which an electronic component can be easily attached and detached and an operation test of the electronic component can be easily performed.

  As a conventional electronic component test jig for testing the operation of an electronic component having a lead terminal, for example, an insulating base made of polyimide resin, a wiring provided at a position connecting to the lead terminal on the base surface, on the wiring A holding tool composed of a coil-shaped spring that elastically presses the lead terminal through an insulating portion and a resin pressing bar, a holding block that is made of an aluminum block that has a shape corresponding to the electronic component that holds the pressing tool, and a holding section. It includes fixing means such as screws that are attached to and detached from the substrate (see Patent Document 1 below).

The electronic component operation measurement method is as follows. First, the main body of the electronic component is placed in the recess of the base, and the lead terminals extending in four directions from the main body are aligned on each wiring, and then held. The block, which is a part, is placed on the electronic component, and the block is fixed to the base with screws. The lead terminal is pressed onto the wiring from above by a coiled spring biased through a resin presser bar, and is connected to the wiring from the upper side. Is not added.
JP-A-5-183027

  However, the above-mentioned conventional electronic component testing jig is one in which an electronic component to be tested is installed between a base and a block holding a pressing tool, and the holding portion is fixed to the base with a plurality of screws. However, there is a problem that it takes time to replace electronic components.

  Further, in the conventional electronic component testing jig, it is sometimes difficult to align the lead terminals on the wiring when the width of the wiring is narrowed.

  In addition, the conventional electronic component testing jig has a problem that it can be tested only when all of the plurality of lead terminals are arranged in a planar shape. That is, there is a problem that the test cannot be performed when a plurality of lead terminals are arranged in two rows in parallel in the same direction.

  Accordingly, the present invention has been completed in view of the above-mentioned conventional problems, and the object thereof is to easily remove and attach even if the electronic component has a thin lead terminal, and to improve the workability of the electronic component replacement. It is to provide an electronic component testing jig that can often test electronic components.

  The electronic component testing jig according to the present invention includes a base having a terminal connection portion on an upper surface, means for applying a voltage to the terminal connection portion, and an electronic device so as not to contact the electronic component main body with respect to the terminal connection portion. An elastic member that presses the terminal member of the component and expands and contracts in the pressing direction is provided.

  The electronic component testing jig according to the present invention preferably has a lead terminal guide groove that is disposed between the base and the elastic member so as to expose both the front and back sides of the one side so that the terminal connection portion is exposed. An insulating plate is attached to the base member so as to overlap.

  The electronic component testing jig according to the present invention preferably includes a pressing member that supports the elastic member.

  In the electronic component testing jig according to the present invention, preferably, the insulator plate, the elastic member, and the pressing member are also attached to the back side of the base so that the electronic component can be tested on both sides of the base. It is characterized by that.

  In the electronic component testing jig of the present invention, preferably, the elastic member is attached to the pressing member.

  In the electronic component testing jig of the present invention, preferably, the elastic member is attached to the insulator plate.

  In the electronic component testing jig of the present invention, preferably, the electronic device testing jig is disposed between the insulator plate and the pressing member, and the lead terminal guide groove opening and the periphery of the insulator plate are exposed and the elastic member is exposed. A support member having a concave groove provided so that the member can be inserted is provided.

  In the electronic component test jig of the present invention, preferably, the terminal member is a flexible substrate connected to the electronic component.

  In the electronic component testing jig according to the present invention, preferably, pins are provided upright on both sides of the terminal connecting portion in a direction intersecting the line direction, and the guide holes provided on both sides of the wiring conductor of the flexible substrate and the pins are provided. The flexible board can be positioned by fitting.

  The jig for testing an electronic component according to the present invention preferably further includes a support plate provided so as to surround the outer periphery of the substrate in plan view, and the support plate has the electronic component on an upper surface thereof. It has an electronic component holding part which holds.

  The electronic component testing jig according to the present invention includes a base having a terminal connection portion on an upper surface, means for applying a voltage to the terminal connection portion, and an electronic device so as not to contact the electronic component main body with respect to the terminal connection portion. In addition to pressing the terminal member of the component and an elastic member that expands and contracts in the pressing direction, the electronic component can be easily replaced in a short time, and the workability of the operation test of the electronic component is improved. An improved electronic component testing jig can be provided.

  The electronic component testing jig according to the present invention preferably has a lead terminal guide groove that is disposed between the base and the elastic member so as to expose both the front and back sides of the one side so that the terminal connection portion is exposed. When the insulator plate is attached to the base body, even if the lead terminal of the electronic component is thin, by inserting the lead terminal portion of the electronic component along the lead terminal guide groove, Positioning with the terminal connection part is easy.

  In the electronic component testing jig according to the present invention, preferably, when the pressing member that supports the elastic member is provided, the elastic member can be made movable by the pressing member in a stable state.

  In the electronic component testing jig according to the present invention, preferably, an insulator plate, an elastic member, and a pressing member are also attached to the back side of the base so that the electronic component can be tested on both sides of the base. Even when the lead terminals are arranged in parallel in the same direction, the lead terminals of each row are mounted across the base, and are connected to the terminal connection portions provided on the front and back surfaces of the base and tested at a time. become able to.

  In the electronic component testing jig according to the present invention, preferably, when the elastic member is attached to the pressing member, the elastic member moves together with the pressing member, so that the lead terminal is attached to the terminal connecting portion or from the terminal connecting portion. When the lead terminal is removed, the elastic member does not become an obstacle to detachment, and the electronic component can be easily attached to and detached from the electronic component test jig.

  In the electronic component test jig of the present invention, preferably, when the elastic member is attached to the insulator plate, the elastic member is always located at a predetermined position in the electronic component test jig, The lead terminal pressed by the elastic member can be pressed at a predetermined position of the lead terminal.

  In the electronic component testing jig according to the present invention, preferably, the electronic device testing jig is disposed between the insulator plate and the pressing member so that the lead terminal guide groove opening and the periphery of the insulator plate are exposed and an elastic member can be inserted. When a support member having a recessed groove is provided, the support member becomes a spacer between the insulator plate and the pressing member, and the thickness of the elastic member can be increased. It becomes easy to adjust the elasticity. For this reason, the selection range of the material used for an elastic member becomes wide. Further, it becomes easy to position the elastic member at a predetermined position by the concave groove.

  In the electronic component testing jig according to the present invention, preferably, when the terminal member is a flexible substrate connected to the electronic component, the operation test of the electronic component can be easily performed even if it is a multi-terminal electronic component. .

  In the electronic component testing jig of the present invention, preferably, pins are provided upright on both sides of the terminal connecting portion in the direction intersecting the line direction, and the guide holes provided on both sides of the wiring conductor of the flexible board are fitted to the pins. When the flexible substrate can be positioned, the positioning between the flexible substrate and the terminal connection portion is facilitated, so that the operation test can be easily performed even when a narrow-pitch flexible substrate is used.

  The jig for testing an electronic component according to the present invention preferably further includes a support plate provided so as to surround the outer periphery of the substrate in plan view, and the support plate has the electronic component on an upper surface thereof. When the electronic component holding part is held, the electronic component is held in a predetermined position, and the position of the terminal member including the lead terminal, the flexible substrate, the flip chip terminal, etc. electrically connected to the electronic component is also included. The electronic component test can be performed accurately and easily by holding an electric signal between the terminal connecting portion and the terminal member, and the workability of the operation test of the electronic component is further improved. It can be set as a jig for testing electronic parts.

  The electronic component testing jig of the present invention will be described in detail below. FIG. 1 is a cross-sectional view showing an example of an embodiment of an electronic component test jig of the present invention, and FIG. 2 is a top view of the substrate 1 and the insulator plate 3 in the electronic component test jig of FIG. It is a perspective plan view. In FIG. 2, the insulator plate 3 and the line conductor 2 are hatched for easy understanding. FIG. 1 is a longitudinal sectional view taken along the line X-X ′ of FIG. 2. FIG. 3 is a perspective view showing another example of the embodiment of the electronic component testing jig of the present invention, and FIG. 4 is a longitudinal sectional view of the electronic component testing jig shown in FIG. It is. In FIG. 3, the line conductor 2 is hatched for easy understanding. FIG. 5 is a cross-sectional view showing another example of the embodiment of the electronic component testing jig of the present invention. 6A is a plan view showing still another example of the embodiment of the electronic component testing jig of the present invention, and FIG. 6B is a sectional view taken along the line ZZ ′ of FIG. 6A. is there. In FIG. 6A, the line conductor 2 and the wiring conductor C1 are hatched for easy understanding. 7, 8, and 9 are perspective views showing still another example of the embodiment of the electronic component testing jig of the present invention, and FIG. 10 is the implementation of the electronic component testing jig of the present invention. It is sectional drawing which shows the further another example of this form.

  In these drawings, 1 is a base, 2 is a line conductor, 2a is a terminal connection portion of the line conductor 2, 3 is an insulator plate, 3a is a lead terminal guide groove, 4 is a pressing member, 5 is a support member, and 5a is a concave shape. A groove, 6 is an elastic member, 7 is a support plate, and 1b and 7a are electronic component holding portions.

  The electronic component testing jig of the present invention is such that the base 1 having the terminal connection portion 2a on the upper surface, means for applying a voltage to the terminal connection portion 2a, and the terminal connection portion 2a are not in contact with the electronic component main body. Are provided with an elastic member 6 that presses the terminal members B, C, and D of the electronic component and expands and contracts in the pressing direction, and the operation of the electronic component can be inspected by the following procedure.

  That is, after the terminal member (lead terminal B, flexible substrate C, or flip chip terminal D) for connecting to the electronic component A is placed in contact with the terminal connection portion 2a, the terminal members B, C are moved by the elastic member 6. The terminal member 2 is pressed against the terminal connecting portion 2a of the base 1, the terminal members B, C, D are brought into contact with the terminal connecting portion 2a, and an electric signal is transmitted between the terminal connecting portion 2a of the line conductor 2 and the terminal members B, C, D. The electronic component A is tested for operation. Therefore, the electronic component A can be easily replaced in a short time, and an electronic component test jig with improved workability of the operation test of the electronic component A can be provided.

  If a minute voltage is passed through the terminal connecting portion 2a in advance, the operation test of the electronic component can be performed efficiently in a short time. In addition, if a current is passed through the terminal connection portion 2a after contacting the terminal members B, C, and D with the terminal connection portion 2a, an electronic component test jig that suppresses wasteful power consumption can be obtained.

  Further, in a preferred embodiment of the electronic component testing jig of the present invention, as shown in FIGS. 1 and 2, the terminal connection portion 2a is provided at a position intersecting one side 1a of the base 1, and the terminal connection portion 2a. An insulating plate 3 having a lead terminal guide groove 3a provided by cutting out one side 1a in a groove shape over both the front and back surfaces of the one side 1a is attached to the base 1 so as to be exposed. After the lead terminal B of the electronic component A is inserted into 3a, the lead terminal B is pressed against the terminal connecting portion 2a by the elastic member 6 to bring the terminal connecting portion 2a and the lead terminal B into contact with each other, and the line conductor 2 and the lead terminal B An electric signal is sent between the two and an operation test of the electronic component A is performed. In FIG. 1, in order to reinforce the base body 1, a support plate 7 may be attached to the base body 1 so as to overlap the surface of the base body 1 on which the insulator plate 3 is attached.

  In addition, as shown in FIGS. 3 and 4, the electronic component testing jig of the present invention has an insulator plate 3, an elastic member 6, and a pressing member 4 attached to the back side of the base 1. Thus, the operation test of the electronic component A can be performed.

  In the electronic component testing jig of the present invention, preferably, the elastic member 6 is attached to the pressing member 4 as shown in FIGS.

  In the electronic component testing jig of the present invention, as shown in FIG. 5, the elastic member 6 may be attached to the insulator plate 3 around the lead terminal guide groove 3a via the support member 5. Of course, one surface of the elastic member 6 may be directly attached to the insulator plate 3.

  In the electronic component test jig, a support member 5 is more preferably disposed between the insulator plate 3 and the pressing member 4. As shown in FIGS. 3 to 5, the support member 5 has an opening on the lead terminal guide groove 3 a of the insulator plate 3 and the periphery thereof, and the one side 1 a is cut out in a groove shape so that the elastic member 6 can be inserted. The concave groove 5a is provided. 1 and 2 show an example in which the support member 5 is not used.

  Alternatively, in the electronic component testing jig of the present invention, as shown in FIG. 6, the elastic member 6 is attached to the pressing member 4, and the wiring conductor C1 of the flexible substrate C connected to the electronic component A at the terminal connection portion 2a. After the connection, the flexible substrate C is pressed by the elastic member 6 to bring the terminal connection portion 2a into contact with the wiring conductor C1, and an electric signal is passed between the line conductor 2 and the wiring conductor C1 to operate the electronic component A. The test can be performed.

  Alternatively, in the electronic component testing jig of the present invention, as shown in FIGS. 7, 8, and 9, the elastic member 6 is attached to the pressing member 4, and the lead connected to the electronic component A at the terminal connection portion 2a. After the terminal B is connected, the lead terminal B is pressed by the elastic member 6 so that the terminal connecting portion 2a and the lead terminal B are brought into contact with each other, and an electric signal is passed between the line conductor 2 and the lead terminal B to make the electronic component A The operation test can be performed. 7 and 8 show an embodiment in which the electronic component A is held by the groove-shaped electronic component holding portion 7a provided on the support plate 7 and the electronic component A is aligned. 8 and 9 show the case where the lead terminal B is arranged in a plurality of directions from the electronic component A. In this case, the pressing member 4 is provided with a notch 4a so as to avoid the electronic component A. It has been.

  Alternatively, as shown in FIG. 10, the electronic component testing jig of the present invention is an electronic component holding portion in which the elastic member 6 is attached to the pressing member 4, the base 1 is concave and the terminal connection portion 2a is provided on the bottom surface. 1b is provided, and the electronic component A having the flip chip terminal D is placed on the electronic component holding portion 1b so that the flip chip terminal D is in contact with the terminal connection portion 2a. Pressing from above, the terminal connection portion 2a and the flip chip terminal D are brought into contact with each other, and an electric signal is passed between the line conductor 2 and the flip chip terminal D so that an operation test of the electronic component A can be performed. is there.

  The substrate 1 in the present invention is made of a resin such as an epoxy resin, a ceramic such as an aluminum oxide sintered body (alumina ceramic), or a glass ceramic. Further, for example, when an aluminum nitride sintered body or silicon nitride aluminum is used as the base 1, even when the terminal connection portion 2a generates heat due to an applied voltage, it is used for testing an electronic component having higher heat dissipation than before. This is preferable because it can be used as a jig, and the operation test of the electronic component A can be further improved. The base body 1 has a line conductor 2 for conducting an electrical signal between the electronic component A and at least one of the upper main surface and the lower main surface. The line conductor 2 is made of copper (Cu) or the like, and is molded by bonding a metal foil to the surface of the resin to be the base 1, or by plating the surface of the resin, or integrally with the metal plate. It is formed by. Alternatively, it is formed on the surface of the substrate 1 made of ceramic by a metallized layer mainly composed of a metal made of tungsten (W), molybdenum (Mo) -manganese (Mn), Cu, Ag or the like.

  The line conductor 2 has a terminal connection portion 2a formed at one end. This terminal connection portion 2a is one end portion of the line conductor 2 to which the terminal member (lead terminal B or flexible substrate C) of the electronic component A to be tested is connected, and the lead terminal B is connected to the terminal connection portion 2a. In this case, it is provided on the side 1a side of the base 1 so as to intersect the side 1a at a substantially right angle. With this configuration, the lead terminal B can be connected to the terminal connection portion 2a without being bent. The terminal connection portion 2a is set at an appropriate angle with respect to the side 1a in accordance with the extending direction of the lead terminal B in the electronic component A.

  When the lead terminal B is connected to the terminal connection portion 2a, the insulator plate 3 is attached so as to overlap the surface of the base 1. The insulator plate 3 is made of an epoxy resin, polyphenylene sulfite (PPS) resin, or the like, and has a plate-like shape having a thickness (slightly thinner) that is substantially the same as the thickness of the lead terminal B of the electronic component A. In addition, you may make it adhere to the surface of the base | substrate 1 by making it harden | cure after apply | coating these resin before hardening to the surface of the base | substrate 1. FIG. The insulator plate 3 has a groove shape slightly wider than the thickness of the lead terminal B in accordance with the thickness of the lead terminal B on both sides of the one side 1a portion that overlaps the terminal connection portion 2a when the insulator plate 3 is overlapped. A lead terminal guide groove 3a is formed by cutting into the groove. Therefore, the upper end opening of the lead terminal guide groove 3a is opened on the surface of the insulator plate 3, and the terminal connection portion 2a of the base body 1 is overlapped with the lower end of the lead terminal guide groove 3a on the lower side of the insulator plate 3. Is exposed.

  By forming the lead terminal guide groove 3a, the lead terminal B of the electronic component A can be inserted into the lead terminal guide groove 3a, and the lead terminal B is brought into contact with the terminal connection portion 2a to be electrically connected. can do. Further, since the side wall of the lead terminal guide groove 3a is disposed so as to surround the terminal connection portion 2a, the side wall of the lead terminal guide groove 3a can be used as a guide for aligning the lead terminal B. Therefore, even if the lead terminal B is thin, it is easy to align the lead terminal B on the terminal connection portion 2a. The opening portion of the lead terminal guide groove 3 into which the lead terminal B is inserted is preferably chamfered so that the lead terminal B can be easily inserted.

  The insulator plate 3 is preferably made of a material having a low dielectric constant. Even if the lead terminal B is inserted into the lead terminal guide groove 3a and a high-frequency electric signal input / output test is performed with the terminal connection portion 2a, The influence on the impedance value of the high frequency signal can be reduced. For this reason, it is preferable to select the insulator plate 3 having a relative dielectric constant of 5.0 or less. Suitable materials for the insulator plate 3 having a relative dielectric constant of 5.0 or less include epoxy resin, PPS resin, polyester resin, and the like. In addition, when the resin is used by foaming, the dielectric constant can be lowered.

  The pressing member 4 is made of an insulator such as polyester resin or a metal, and is provided in a movable state so as to cover the base 1. Further, the support plate 7 and the support member 5 are made of an insulating material such as polyester resin or metal similar to the pressing member 4. The pressing member 4 and the supporting plate 7 or the pressing member 4 and the supporting member 5 are fixed by, for example, a hinge 10 on each side surface. Then, on the side surface opposite to the one side surface, a hooking portion 8 is provided on the pressing member 4, a locking portion 9 is provided on the support plate 7 or the supporting member 5, and the hooking portion 8 and the locking portion 9 are hooked. By doing so, the opposite side surface can be fixed. In the example of FIGS. 1 and 3, the hinge 10 is attached to the side adjacent to the one side 1a of the base 1, and the locking part 9 and the hooking part 8 are provided on the side opposite to the hinge 10. ing. As a result, the lead terminal B of the electronic component A is arranged on the terminal connection portion 2a, and then the pressing member 4 on the opposite side is closed toward the base 1 with the hinge 10 as a fulcrum, and the hook portion 8 and the locking portion 9 are closed. Are fixed, the operation test of the electronic component A can be performed. Since only the opposite side surface of the pressing member 4 is closed, the operation test of the electronic component A can be easily performed in a short time.

  Further, an elastic member 6 made of silicone rubber, ethylene propylene rubber, fluorine rubber or the like is attached to the base 1 on the line conductor 2 side so as to be able to press contact with the periphery of the terminal connecting portion 2a.

  For example, as shown in FIGS. 1, 3, and 4, the elastic member 6 is attached to the lower main surface (or upper main surface) of the pressing member 4. With this configuration, when attaching the lead terminal B to the terminal connection portion 2a or removing the lead terminal B from the terminal connection portion 2a, the elastic member 6 can be moved upward together with the pressing member 4, and the electronic component A is removed. Sometimes, it is possible to prevent the electronic component A from becoming an obstacle to detachment, and the electronic component A can be easily attached to and detached from the electronic component test jig. When the elastic member 6 is pressed against the supporting member 5 with the hinge 10 on one side of the pressing member 4 as a fulcrum, the lead terminal B of the electronic component A inserted into the lead terminal guide groove 3a is The thickness is such that the terminal connection portion 2a is pressed by an appropriate force. Thus, when the pressing member 4 is pressed toward the support member 5 and closed, the lead terminal B and the terminal connection portion 2a can be reliably electrically connected.

  For example, the elastic member 6 may be attached to the insulator plate 3 around the lead terminal guide groove 3a. The elastic member 6 may be configured to be affixed on the insulator plate 3 so as to be positioned above the lead terminal guide groove 3a, or as shown in FIG. 5, a concave shape of the support member 5 described later. It may be movably attached so as to be fitted in the groove 5a. When the elastic member 6 is thus provided on the insulator plate layer 3 so as to be positioned above the lead terminal guide groove 3a, the upper side of the lead terminal guide groove 3a is blocked by the elastic member 6, The lead terminal guide groove 3a can be a hole through which the lead terminal can be inserted.

  As shown in FIG. 5, when the elastic member 6 is attached so as to be fitted in the concave groove 5 a of the support member 5, the opposite side surface is supported by the hinge 10 on one side surface of the pressing member 4. In order to press the elastic member 6 from the upper surface when pressed toward the upper surface 5, the convex portion 4 a is provided on the pressing member 4, or the elastic member 6 is made thicker than the support member 5 and the upper surface of the elastic member 6 is pressed. May protrude from the upper surface of the support member 5, or the pressing member 4 may be in contact with the elastic member 6 with certainty, and the elastic member 6 is pressed against the terminal connection portion 2a with an appropriate force. Since the elastic member 6 is fixed to the insulator plate 3 via the support member 5, the elastic member 6 is always positioned at a predetermined position in the surface direction in the electronic component test jig, and the terminal connection portion 2a. The positional relationship of the elastic member 6 with respect to can be made constant. As a result, if the lead terminal B is inserted along the lead terminal guide groove 3a to the base of the lead terminal B, the lead terminal B is appropriately placed at a predetermined position of the lead terminal B by the terminal connecting portion 2a and the elastic member 6 at a fixed position. It can be pressed with great force.

  3, 4, and 5, the opening of the lead terminal guide groove 3 a of the insulator plate 3 and its periphery are exposed between the insulator plate 3 and the pressing member 4, and the elastic member 6. The support member 5 which has the concave groove 5a provided so that the elastic member 6 may be accommodated according to the magnitude | size of the elastic member 6 so that insertion is possible may be sufficient. In this case, the elastic member 6 is affixed to the pressing member 4 and is movably installed in the vertical direction in the concave groove 5a along the concave groove 5a.

  With this configuration, the elastic member 6 is positioned so as to be in contact with the lead terminal B at a predetermined position in the surface direction, with the positional deviation in the surface direction being restricted by the concave groove 5a. With this configuration, the elastic member 6 is always positioned at a predetermined position in the surface direction in the electronic component testing jig, and the positional relationship of the elastic member 6 with respect to the terminal connection portion 2a can be made constant. As a result, the lead terminal B can be pressed with a suitable force at a predetermined position of the lead terminal B. 1 and 2, the support member 5 is omitted, but it goes without saying that the support member 5 may be provided between the pressing member 4 and the insulator plate 3 in the same manner.

  By providing the support member 5, the thickness of the elastic member 6 can be made moderate, and when the base 1 is sandwiched by the pressing member 4, the lead terminal B is brought into contact with the terminal connection portion 2 a with an appropriate pressure. be able to.

  As described above, according to the electronic component testing jig of the present invention, only the lead terminal B portion of the electronic component A to be tested needs to be inserted into the lead terminal guide groove 3a, and the lead terminal B can be easily inserted. The electronic component replacement work can be easily performed in a short time, and the workability of the electronic component operation test is improved.

  3 and 4, the line conductor 2 is provided on both the upper main surface and the lower main surface of the base 1, and the insulating plate 3, the elastic member 6 and the pressing member 4, or in addition to these. Even if the support members 5 are provided symmetrically in the vertical direction, a plurality of lead terminals B having a quadrangular prism shape or a cylindrical shape are provided from the main body case of the electronic component A so as to extend from the electronic component A in parallel in the same direction. The electronic component A can be easily tested by inserting two rows of lead terminals B on the upper main surface and the lower main surface of the base body 1 respectively.

  When the line conductors 2 are provided on both the upper main surface and the lower main surface of the base 1, as shown in FIGS. 3 and 4, they intersect one side 1 a of both the upper main surface and the lower main surface of the base 1. The terminal connection portions 2a of the line conductors 2 are provided at the respective positions, the insulator plates 3 having the lead terminal guide grooves 3a are attached to both surfaces of the base 1, and the support member 5 is attached to the surface of the insulator plate 3. Then, the pressing member 4 to which the elastic member 6 that can be pressed against the periphery of the opening of the lead terminal guide groove 3a of the insulating plate 3 is attached to both the upper main surface and the lower main surface of the base 1 via hinges 10 respectively. By attaching, the electronic component test jig of the present invention is assembled.

  The material constituting the pressing member 4, the supporting member 5, the elastic member 6, and the supporting plate 7 may be made of a material having a low dielectric constant like the insulator plate 3, and transmits the line conductor 2 and the lead terminal B. The influence on the impedance value of the high-frequency signal can be reduced. And it can prevent that the transmission loss generate | occur | produces in the high frequency signal which transmits the line conductor 2. FIG.

  Moreover, the electronic component testing jig of the present invention is a flexible substrate C in which the terminal member C is connected to the electronic component A, and the flexible substrate C is sandwiched between the wiring conductor C1 and the terminal connection portion 2a of the flexible substrate C. Can be connected to perform an operation test of the electronic component A. When a flexible substrate is used, the terminal connection portion 2a may not be provided so as to be in contact with one side of the base.

  An example of the electronic component test jig used in this case is shown in FIG. In the electronic component testing jig of FIG. 6, the elastic member 6 is attached to the pressing member 4, and after the wiring conductor C1 of the flexible substrate C is connected to the terminal connection portion 2a, the flexible substrate C is pressed from the upper surface by the elastic member 6. The terminal connection portion 2a and the wiring conductor C1 are brought into contact with each other, and an electric signal is passed between the line conductor 2 and the wiring conductor C1 so that an operation test of the electronic component A can be performed. In FIG. 6, in order to reinforce the base body 1, a support plate 7 is attached to the base body 1 so as to overlap the surface of the base body 1 on which the pressing member 4 is attached.

  The flexible substrate C has a surface of an insulating base material made of a resin such as polyimide or polyester, or one or more wiring conductors C1 made of a conductor such as Cu foil on the surface and inside thereof, and polyimide or polyester or the like is formed on the surface. An insulating cover made of the above resin is provided. The insulating cover is not applied to the end of the wiring conductor C1 that is in contact with the terminal connection portion 2a, and the wiring conductor C1 is exposed. One end of the wiring conductor C1 exposed is connected to the terminal connection portion 2a.

  With this configuration, the flexible substrate C is thinner than the lead terminal B, but can be easily tested by being sandwiched between the elastic members 6 when the electronic component A is tested. Since the plurality of wiring conductors C1 can be arranged at a narrow interval by using the flexible substrate C, even when the electronic component A is composed of multiple terminals, the operation test of the electronic component can be easily performed.

  Here, the insulating board 3 is not provided, and the flexible substrate C is placed directly on the base 1. This is because the formation part of the wiring conductor C1 of the flexible substrate C is a thin plane.

  Further, as shown in FIG. 6, the pressing member 4 is configured to move along the support column 7a while being positioned at a predetermined position in the surface direction. With this configuration, the elastic member 6 is always located at a predetermined position in the surface direction in the electronic component test jig, and the position of the elastic member 6 with respect to the terminal connection portion 2a can be made constant.

  The same effect can be obtained even if the insulator plate 3 having a concave groove is provided in place of the column 7a and the elastic member 6 is positioned in a predetermined position in the surface direction by the concave groove. be able to.

  Further, pins 7b are provided so as to protrude from both sides of the terminal connection portion 2a, and the flexible substrate C is fitted with through holes or pins 7b that pass through the alignment pins 7b on both sides of the wiring conductor C1. It is preferable to provide a guide hole C2 by a groove-shaped cut or the like provided on the side of the flexible substrate C, and to provide a recess for inserting the pin 7b in the support plate 7 or the like. The elastic member 6 is in contact with the distal end side of the guide hole C2 of the flexible substrate C, and the wiring conductor C1 on the distal end side is connected to the connection terminal portion 2a. Thereby, the wiring conductor C1 of the flexible substrate C can be positioned at a predetermined position of the terminal connection portion 2a, and even if the wiring conductor C1 of the flexible substrate C has a high density with a narrow pitch, the terminal connection portion 2a. And the operation test of the electronic component A can be easily performed. The guide hole C2 may be provided in a cutout shape such as a semicircular shape at a position intersecting one side of the wiring conductor C1 of the flexible substrate C, and the pin 7b may be hooked in this cutout.

  Hereinafter, other embodiments according to the present invention will be described in detail.

  7 to 10 are views showing an example of another embodiment according to the present invention, which is an electronic component test jig having an electronic component holding portion.

  In other words, the base plate 1 is further provided with a support plate 7 provided so as to surround the outer periphery of the base plate 1 in plan view, and the support plate 7 has an electronic component holding portion 7a for holding the electronic component A on the upper surface thereof. Preferably, the electronic component A is accommodated in the electronic component holding portion 7a, so that the terminal connection portion 2a provided on the base 1 and the lead terminal B extended from the electronic component A can be easily aligned. Can do. Thereafter, the lead terminal B is pressed by the elastic member 6, the terminal connection portion 2a and the lead terminal B are brought into contact with each other, and an electric signal is caused to flow between the line conductor 2 and the lead terminal B. Since the component A can be prevented from being displaced due to the pressing of the elastic member 6, an electronic component test jig capable of performing an electronic component test accurately and easily, and further improving the workability of the operation test of the electronic component, can do.

  That is, as shown in FIG. 7, the electronic component holding portion 7 a can be configured by a level difference obtained by a height difference between the upper surface of the base 1 and a groove provided in the support plate 7. By pressing the electronic component A against this step, it is possible to easily align the terminal connection portion 2a provided on the base 1 and the lead terminal B extended from the electronic component A.

  Moreover, the electronic component holding | maintenance part 7a can be comprised by the level | step difference obtained by the notch part 1c provided in the base | substrate 1, as shown in FIG. By pressing the electronic component A against this step, it is possible to easily align the terminal connection portion 2a provided on the base 1 and the lead terminal B extended from the electronic component A. Further, the electronic component A is not limited to the one in which the lead terminal B extends, and as shown in FIG. 10, the electronic component A is provided with a flip chip terminal D made of a spherical metal, a solder bump or the like. But it doesn't matter.

  Furthermore, although not shown in FIGS. 7 to 10, the insulator plate 3 and the lead terminal guide groove 3a may be provided on the surface of the base 1 on which the terminal connection portion 2a is formed. With this configuration, the terminal connecting portion 2a and the lead terminal B can be more accurately aligned.

  In addition, this invention is not limited to the example of the above embodiment, If it is in the range which does not deviate from the summary of this invention, it will not interfere at all.

  For example, when the lead terminal B is pressed against the pressing member 4 by the elastic member 6 and the terminal connecting portion 2 a and the lead terminal B are brought into contact with each other, the cutout portion 4 a is prevented so that the elastic member 6 does not contact the electronic component 4. Is preferably provided, and the elastic member 6 can be prevented from being lifted by the electronic component A. Moreover, according to this structure, as shown, for example in FIG. 9, since the notch part 4a functions also as an electronic component holding part 7a, it is more preferable.

  For example, the insulator plate 3 and the support member 5 may be integrally formed.

  Further, in the description of the above embodiment, the terms “upper, lower, left and right” are merely used to describe the positional relationship on the drawings, and do not mean the positional relationship during actual use.

It is sectional drawing which shows an example of embodiment of the electronic component test jig | tool of this invention. It is the top view which looked at the base | substrate and insulator board of the electronic component test jig | tool of FIG. 1 from the upper surface. It is a perspective view which shows the other example of embodiment of the electronic component test jig | tool of this invention. It is a longitudinal cross-sectional view in Y-Y 'of the electronic component test jig shown in FIG. It is a longitudinal cross-sectional view which shows the other example of embodiment of the jig | tool for electronic component test of this invention. (A) is a top view which shows the further another example of embodiment of the electronic component test jig | tool of this invention, (b) is Z-Z 'sectional drawing of (a). It is a perspective view which shows the further another example of embodiment of the electronic component test jig | tool of this invention. It is a perspective view which shows the further another example of embodiment of the electronic component test jig | tool of this invention. It is a perspective view which shows the further another example of embodiment of the electronic component test jig | tool of this invention. It is sectional drawing which shows the further another example of embodiment of the jig | tool for an electronic component test of this invention.

Explanation of symbols

1: Base 1a: One side 1b (7a): Electronic component holding part 1c: Notch part 2: Line conductor 2a: Terminal connection part 3: Insulator plate 3a: Lead terminal guide groove 4: Holding member 5: Support member 5a: Concave groove 6: Elastic member 7: Support plate A: Electronic component B: Lead terminal

Claims (10)

A base body having a terminal connection portion on the upper surface;
Means for applying a voltage to the terminal connection;
An electronic component test jig comprising: an elastic member that presses a terminal member of the electronic component so as to be in non-contact with the electronic component main body with respect to the terminal connection portion, and expands and contracts in the pressing direction.   An insulator plate disposed between the base body and the elastic member and having lead terminal guide grooves is attached to the base body so as to cover both the front and back surfaces of the one side so that the terminal connection portion is exposed. The electronic component testing jig according to claim 1, wherein:   The electronic component testing jig according to claim 1, further comprising a pressing member that supports the elastic member.   4. The electronic component according to claim 3, wherein the insulator plate, the elastic member, and the pressing member are also attached to the back surface side of the base so that the electronic component can be tested on both sides of the base. Test jig.   5. The electronic component testing jig according to claim 3, wherein the elastic member is attached to the pressing member.   The electronic component testing jig according to claim 2, wherein the elastic member is attached to the insulator plate.   A support member, which is disposed between the insulator plate and the pressing member, has a concave groove in which the opening and the periphery of the lead terminal guide groove of the insulator plate are exposed and the elastic member can be inserted. The electronic component testing jig according to claim 3, wherein the electronic component testing jig is provided.   The electronic component testing jig according to claim 1, wherein the terminal member is a flexible substrate connected to the electronic component.   Pins are erected on both sides of the terminal connecting portion in the direction intersecting the line direction, and the flexible substrate can be positioned by fitting the guide holes provided on both sides of the wiring conductor of the flexible substrate with the pins. The electronic component testing jig according to claim 8, wherein the electronic component testing jig is a jig. The substrate further includes a support plate provided so as to surround the outer periphery of the substrate in plan view.
The electronic component test jig according to claim 1, wherein the support plate has an electronic component holding portion for holding the electronic component on an upper surface thereof.

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