JP2018096812A - Semiconductor package and method for inspecting the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a semiconductor package and a method for inspecting the semiconductor package, which can reduce the cost and the time required for an inspection.SOLUTION: A sealed body 6 of a semiconductor package 1 is formed so that a substrate 4 equipped with an electronic component 50 and a lead frame 2 are exposed to at least one end surface. The sealed body 6 according to the embodiment is formed so that the lead frame 2 and the substrate 4 are exposed on an end surface 62. Because the semiconductor package 1 can be inspected before it is separated from a matrix frame 7, there is no need to separate the semiconductor package 1 to be inspected and the semiconductor package 9 to become a product. This allows reduction of the time and the cost required for the inspection more than when the above structure is not employed.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a semiconductor package and an inspection method thereof.

  As a conventional technique, an ultrasonic wave is transmitted from an ultrasonic probe toward a semiconductor package, and an ultrasonic wave reflected inside the semiconductor package is received by the ultrasonic probe to inspect the inside of the semiconductor package. An acoustic flaw detection method is known (for example, see Patent Document 1).

  In this ultrasonic flaw detection method, ultrasonic waves are transmitted from an ultrasonic probe to a semiconductor package submerged in water, and the ultrasonic waves reflected at the inspection target position inside the semiconductor package are received by the ultrasonic probe. Perform internal inspection.

JP 2007-178131 A

  However, the conventional ultrasonic flaw detection method has a problem that it takes an inspection time as well as cost because an inspection is performed on a finished product cut out from a matrix frame in which a plurality of semiconductor packages are formed.

  Accordingly, it is an object of the present invention to provide a semiconductor package and an inspection method thereof that can suppress the cost and inspection time required for inspection.

  One embodiment of the present invention provides a semiconductor package including a sealing body in which a substrate on which an electronic component is mounted is exposed to at least one end face together with a lead frame.

  According to the present invention, it is possible to reduce the cost and inspection time required for inspection.

FIG. 1A is a schematic view showing an example of a semiconductor package according to the embodiment, FIG. 1B is a top view showing an example of the semiconductor package, and FIG. 1C is a lead frame. It is the schematic which shows an example of the end surface which a board | substrate exposes. FIG. 2A is a schematic view showing an example of a part of a matrix frame before the sealing body of the semiconductor package according to the embodiment is formed, and FIG. FIG. 2C is a schematic diagram illustrating an example of a part of the matrix frame after being processed, and FIG. 2C is a schematic diagram illustrating an example of a semiconductor package that is a product.

(Summary of embodiment)
The semiconductor package according to the embodiment is roughly configured to include a sealing body in which a substrate on which an electronic component is mounted is exposed on at least one end face together with a lead frame.

  In this semiconductor package, since the substrate and the lead frame are exposed at the end face of the sealing body, it is possible to check whether the sealing body has been peeled off from the substrate or the lead frame by visual inspection. Therefore, the semiconductor package can reduce the cost and the inspection time required for the inspection as compared with the case where this configuration is not adopted.

[Embodiment]
(Outline of semiconductor package 1)
FIG. 1A is a schematic view showing an example of a semiconductor package according to the embodiment, FIG. 1B is a top view showing an example of the semiconductor package, and FIG. 1C is a lead frame. It is the schematic which shows an example of the end surface which a board | substrate exposes. FIG. 2A is a schematic view showing an example of a part of a matrix frame before the sealing body of the semiconductor package according to the embodiment is formed, and FIG. FIG. 2C is a schematic diagram illustrating an example of a part of the matrix frame after being processed, and FIG. 2C is a schematic diagram illustrating an example of a semiconductor package that is a product. In FIG. 1A, FIG. 1B, and FIG. 2C, the sealing body 6 is indicated by a dotted line in order to illustrate the internal structure. 2A and 2B, a part of the matrix frame 7 is illustrated. Note that, in each drawing according to the embodiment described below, the ratio between figures may be different from the actual ratio.

  The semiconductor package 1 is an example of an inspection package. For example, as shown in FIGS. 1A to 1C, the semiconductor package 1 includes a lead frame 2 and a lead frame 3, a substrate 4, an electronic circuit unit 5, and a sealing body 6. In general, it is structured.

  For example, the sealing body 6 is configured such that the substrate 4 on which the electronic component 50 is mounted is exposed to at least one end face together with the lead frame 2. The sealing body 6 of the semiconductor package 1 of the present embodiment is configured such that the lead frame 2 and the substrate 4 are exposed at the end face 62.

  As a modification, the end face from which the lead frame 2 and the substrate 4 are exposed is not limited to the end face 62 on the lead frame 2 side, but may be the end face 60 on the lead frame 3 side, or both the end face 60 and the end face 62. It may be an end face.

  The sealing body 6 is configured to seal a part (end portion 26) of the lead frame 2 and the substrate 4 disposed on a part of the lead frame 2.

(Configuration of lead frame 2 and lead frame 3)
The lead frame 2 and the lead frame 3 are formed in an elongated plate shape, for example. The semiconductor package 1 of the present embodiment has, for example, three lead frames 2 and a lead frame 3. The lead frame 2 and the lead frame 3 are formed using, for example, a metal material such as aluminum or copper, or an alloy material such as brass. The number and shape of the lead frame 2 and the lead frame 3 are arbitrary.

  The lead frame 2 has a terminal portion 25 and an end portion 26. The terminal portion 25 is a portion that becomes a terminal of the semiconductor package 1. The terminal portion 25 is exposed from the sealing body 6. For example, as shown in FIG. 1B, the end portion 26 is wider than the terminal portion 25 and is sealed by the sealing body 6.

  As an example, the end portion 26 is bonded to the back surface 41 side of the substrate 4 with an adhesive. As an example, this adhesive is a conductive adhesive such as a silver paste. As an example, the semiconductor package 1 is provided with a through-hole penetrating from the front surface 40 to the back surface 41 in the substrate 4 so that the electronic circuit unit 5 and the lead frame 2 are electrically connected via the adhesive and the through-hole. It is configured.

  As a modification, the lead frame 2 may be electrically connected to the electronic circuit unit 5 through a bonding wire formed of gold or the like.

  The lead frame 3 is disposed on the back surface 41 of the substrate 4 opposite to the lead frame 2. The lead frame 3 is sealed with a sealing body 6. The substrate 4 is supported by the lead frame 2 and the lead frame 3.

  The lead frame 2 and the lead frame 3 are formed by punching a thin plate or etching, for example. For example, as shown in FIGS. 2A and 2B, the lead frame 2 and the lead frame 3 are connected by an outer frame 71 of the matrix frame 7 and a tie bar 72 before being cut out from the matrix frame 7. It is supported by the matrix frame 7.

  The lead frame 2 is cut from the matrix frame 7 at the tip and the portion connected by the tie bar. The lead frame 3 is cut along the end surface 60 of the sealing body 6.

(Configuration of substrate 4 and electronic circuit unit 5)
The substrate 4 is, for example, a printed wiring board. The substrate 4 has a surface 40 formed with an electronic circuit portion 5 having a plurality of electronic components including the electronic components 50 and wiring. As an example, the electronic component 50 is a sensor IC (Integrated Circuit) in which a sensor unit, an amplification unit, a control unit, and the like are integrated. The electronic circuit unit 5 inputs and outputs signals and the like via the lead frame 2.

(Configuration of sealing body 6)
The sealing body 6 is formed, for example, by curing a thermosetting molding material in which an epoxy resin is a main component and a silica filler is added. For example, the sealing body 6 is formed for the purpose of protecting the electronic circuit unit 5 from an environment such as light, heat, and humidity.

  The sealing body 6 is formed for each unit frame 70 formed on the matrix frame 7, for example, as shown in FIGS. 2 (a) and 2 (b). For example, as shown in FIG. 2B, the sealing body 6 has an end surface 62 where the substrate 4 is exposed and an end surface 61 where the substrate 4 is not exposed.

  For example, a semiconductor package 9 shown in FIG. 2C has an end face 61 where the substrate 4 is not exposed. The semiconductor package 9 is distributed as a product when the semiconductor package 1 for inspection has no defect such as peeling.

  The semiconductor package 1 of the present embodiment has an end face 62 from which the substrate 4 is exposed. This is, for example, cut out from the inspection frame 75 shown in FIG. The inspection frame 75 is different from the other unit frames 70 in the length of the sealing body 6 so that not only the lead frame 2 but also the substrate 4 is exposed from the end face 62.

  Accordingly, by inspecting the end face 62 of the inspection frame 75, for example, as shown in FIG. 1C, the sealing body 6 and the front surface 40 and both side surfaces 42 of the substrate 4, the back surface 41 of the substrate 4 and the lead frame 2 The adhesion between the front surface 20 of the substrate 4, the adhesion between the back surface 41 of the substrate 4 and the sealing body 6, the adhesion between the sealing body 6 and both side surfaces 22 of the lead frame 2 and the back surface 21, that is, the sealing body 6 and the substrate 4. In addition, the presence or absence of peeling from the lead frame 2 can be inspected.

  The inspection frame 75 is inspected before being cut out from the matrix frame 7. Further, it is preferable that at least one inspection frame 75 is created for each shot, for example. That is, the substrate 4 is exposed from the end face 62 of at least one sealing body 6 among the plurality of sealing bodies 6 formed at one time, and is used as an inspection target.

  This one shot is a unit in which the sealing body 6 is formed at a time. In other words, one shot is a unit set in a mold when the sealing body 6 is formed. When peeling occurs in the inspection frame 75 included in this one shot, the plurality of semiconductor packages 9 included in this one shot are discarded as defective.

  The inspection frame 75 is formed at an arbitrary location on the matrix frame 7. The inspection frame 75 is preferably formed, for example, in a place where a defect of the sealing body 6 is likely to occur.

(Configuration of semiconductor package 9)
For example, as shown in FIG. 2C, the semiconductor package 9 does not expose the substrate 4 on the end face 61 unlike the semiconductor package 1 for inspection. That is, the substrate 4 is sealed with the sealing body 6.

  Hereinafter, a method for inspecting the semiconductor package 1 will be described.

(Inspection method of semiconductor package 1)
As shown in FIG. 2A, the matrix frame 7 is formed, and the substrate 4 and the electronic circuit unit 5 are arranged on the unit frame 70 and the inspection frame 75.

  Next, as shown in FIG. 2B, the sealing body 6 is formed on the unit frame 70 and the inspection frame 75. At this time, the sealing body 6 is formed on the inspection frame 75 so that the substrate 4 on which the electronic circuit portion 5 is formed is exposed to the end face 62 together with the lead frame 2.

  Next, the substrate 4 exposed to the sealing body 6 of the inspection frame 75 and the lead frame 2 are monitored to inspect for the presence of peeling. When there is no peeling by this inspection, the semiconductor package 9 is cut out from the unit frame 70. When peeling is confirmed by inspection, the one-shot semiconductor package 9 including the inspection frame 75 is discarded.

(Effect of embodiment)
The semiconductor package 1 and the inspection method of the semiconductor package 1 according to the present embodiment can reduce the cost and inspection time required for the inspection. In the semiconductor package 1, the lead frame 2 and the substrate 4 are exposed from the end face 62 of the sealing body 6. When the sealing resin is cured, internal stress may be generated due to differences in the linear expansion coefficients of the sealing resin, the lead frame 2, and the substrate 4, and peeling may occur. In this semiconductor package 1 and the inspection method, since the inspection by the appearance can be performed before cutting out from the matrix frame 7, that is, in-line, the product is produced together with the semiconductor package 1 for inspection as compared with the case where this configuration is not adopted. A simple inspection can be performed without cutting out the semiconductor package 9, and the cost and inspection time required for the inspection can be suppressed.

  Since the semiconductor package 1 is formed for each shot, all shots can be in-line inspected and the reliability of the product is improved. Similarly, in the inspection method of the semiconductor package 1, since the semiconductor package 1 is formed for each shot, all shots can be in-line inspected, and the reliability of the product is improved.

  The inspection method of the semiconductor package 1 and the semiconductor package 1 can improve the inspection accuracy of peeling by exposing the substrate 4 not only from the end face 62 but also from the end face 60 side.

  The embodiment and the modification of the present invention have been described above. However, the embodiment and the modification are merely examples, and do not limit the invention according to the claims. The novel embodiments and modifications can be implemented in various other forms, and various omissions, replacements, changes, and the like can be made without departing from the spirit of the present invention. In addition, not all the combinations of features described in the embodiments and the modifications are essential to the means for solving the problems of the invention. Furthermore, this embodiment and modification are included in the scope and gist of the invention, and are included in the invention described in the claims and the equivalents thereof.

  DESCRIPTION OF SYMBOLS 1 ... Semiconductor package, 2 ... Lead frame, 3 ... Lead frame, 4 ... Board | substrate, 5 ... Electronic circuit part, 6 ... Sealing body, 7 ... Matrix frame, 9 ... Semiconductor package, 20 ... Front surface, 21 ... Back surface, 22 ... side face, 25 ... terminal part, 26 ... end part, 40 ... front face, 41 ... back face, 42 ... side face, 50 ... electronic component, 60 ... end face, 61 ... end face, 62 ... end face, 70 ... unit frame, 71 ... outside Frame, 72 ... Tie bar, 75 ... Inspection frame

Claims (4)

  A semiconductor package comprising a sealing body in which a substrate on which an electronic component is mounted is exposed to at least one end face together with a lead frame. The sealing body seals a part of the lead frame and the substrate disposed on a part of the lead frame;
The semiconductor package according to claim 1. A sealing body is formed so that the substrate on which the electronic component is mounted is exposed to at least one end face together with the lead frame,
Monitoring the substrate and the lead frame exposed to the sealing body to inspect for peeling;
Inspection method for semiconductor packages. Of the plurality of sealing bodies formed at a time, the substrate is exposed from an end face of at least one sealing body, and is an inspection target.
The method for inspecting a semiconductor package according to claim 3.

Images