JP2018093006A - Ceramic wiring board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a ceramic wiring board excellent in bond strength with other member, by eliminating crack generation factors.SOLUTION: A pair of metallic members 1a, 1b having flanges 7a, 7b are inserted into a through hole 5, provided in a wiring board 10, from both upper and lower sides and joined by solder, or the like, to form a through member 1, and the wiring board 10 is clamped from both sides by the flanges, and a through hole 3 penetrating the center of the through member 1, in the axial direction, is provided. A screw member 30 is inserted into the through hole 3 and screwed to a fixing member 15, thus fixing a ceramic circuit board easily to the fixing member 15 by fastening the screw.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a ceramic wiring board that is used for mounting electronic components, integrated circuit (IC) chips and the like and is configured to be fixable to other members.

  As a circuit board for mounting electronic components, a resin substrate made of epoxy resin or the like has been mainstream. However, in order to cope with an increase in heat generation due to an increase in the speed of LSI elements to be mounted and a large integration, a high frequency module, an IC A ceramic substrate is used as a package substrate. This is because the ceramic substrate has low thermal expansion and excellent heat resistance compared to the resin substrate, and also has a low dielectric loss tangent (tan δ), so that loss of electrical signals and the like can be suppressed when used as a high frequency substrate. This is because it has the feature of being able to.

  Paying attention to the perforation in the substrate, it is easy to make a hole directly in the substrate, such as a resin substrate, and the substrate by drilling through holes for screwing to connect with other members There is no damage. On the other hand, the ceramic circuit board is made of a sintered body obtained by firing a punched ceramic green sheet and has high hardness. However, when a through hole for screwing is formed, the mechanical strength around the through hole is weakened, and cracks and the like are generated. There is a problem that occurs. In other words, the ceramic substrate is a hard and brittle substrate, and directly forming holes or thread grooves may cause cracks, cracks, or breakage in the substrate. It has been.

  For example, in Patent Document 1, the mechanical strength in the periphery of the through hole is increased by increasing the thickness of the ceramic substrate at a predetermined ratio as the formation position of the screwing through hole is closer to the outer peripheral end of the ceramic substrate. Yes. Thereby, when the ceramic circuit board is fixed with screws, even if a strong force is applied, the occurrence of cracks, cracks and the like around the through holes for screwing is prevented.

  Further, Patent Document 2 discloses that when a ceramic substrate is screwed, an edge portion is continuously formed around a contact portion between the ceramic substrate and the screw, for example, around the through hole, in order to prevent cracks from occurring in the peripheral portion of the through hole. A configuration is disclosed in which a reinforcing member is formed from a predetermined range to a predetermined range, and the reinforcing member is disposed at at least one end of the through hole. This improves the strength of the periphery of the through hole, prevents direct contact between the screw head and the ceramic substrate, and suppresses the occurrence of cracks.

JP 2001-237502 A JP 2003-197824 A

  Although the above-mentioned conventional technology has a certain reduction effect against damage to the substrate when it is drilled and screwed into a substrate made of a brittle material such as ceramics, there is still a risk of occurrence of cracks, etc. The factor has not been avoided. In addition, since it is difficult to form a screw groove in a through hole of a board made of a brittle material such as ceramics at present, it is possible to join with other members and mount components that are possible with a resin board. There is a problem that the degree cannot be obtained.

  The present invention has been made in view of the above-mentioned problems, and the object of the present invention is to eliminate the cause of cracks when fixing to other members, and to provide excellent ceramic wiring strength with other members. It is to provide a substrate.

  The following configuration is provided as means for achieving the above object and solving the above-described problems. That is, the ceramic wiring board of the present invention includes a first through hole penetrating in the thickness direction in the ceramic substrate, and a penetrating member inserted into the first through hole, and the penetrating member has flanges at both ends. And a second through-hole penetrating the center in the axial direction is formed.

  For example, the penetrating member is formed by abutting the other end of each of a pair of metal members, each having a flange portion at one end, in the first through hole. Further, for example, the ceramic wiring substrate is fixed to the support member by a screw member that is inserted through the second through hole. Further, for example, the plurality of ceramic wiring boards are fixed to one side or both sides of the support member with a predetermined distance therebetween. Further, for example, a plurality of the ceramic wiring boards are adhered to each other and fixed to one side or both sides of the support member.

  For example, the ceramic wiring boards are connected to each other through a screw member that connects the penetrating members with a predetermined distance therebetween. In addition, for example, the ceramic wiring boards are connected to each other through a screw member that brings the through members into close contact with each other. For example, a screw groove is formed on the inner wall of the second through hole. Further, for example, a gap is provided between the penetrating member and the inner wall of the first through hole. Further, for example, a bonding agent is not interposed between the penetrating member and the inner wall of the first through hole.

  According to the present invention, it is possible to bond and fix to other members similarly to a resin substrate or the like without causing damage such as generation of cracks on a brittle material substrate such as a ceramic substrate.

1 is an exploded structural view of a ceramic wiring board according to a first embodiment of the present invention. It is sectional drawing when the ceramic wiring board concerning a 1st embodiment is fixed to a fixing member. It is a flowchart which shows the process of arrange | positioning (attaching) a penetration member to the ceramic wiring board which concerns on the example of 1st Embodiment in time series. It is a figure which shows the cross-sectional structure etc. of the ceramic wiring board corresponding to the process of FIG. It is sectional drawing of the ceramic wiring board which concerns on the 2nd Example of this invention. It is a figure which shows the example which fixed the ceramic wiring board which concerns on the example of 2nd Embodiment to the fixing member. It is a figure which shows the example which fixed the some ceramic wiring board to the one side of a fixing member as the modification 1. FIG. It is a figure which shows the example which fixed the some ceramic wiring board to the both sides of a fixing member as the modification 2. FIG. It is a figure which shows the structure which connected the ceramic wiring board mutually as the modification 4. FIG. It is a figure which shows the modification of the penetration member which made the collar part protrude from the wiring board. It is a modification of a penetration member, and is a figure showing the example which changed the shape of a collar part and a body part.

Embodiments according to the present invention will be described below in detail with reference to the accompanying drawings.
<First Embodiment>
FIG. 1 is an exploded structural view of a ceramic wiring board (hereinafter also simply referred to as a wiring board) according to a first embodiment of the present invention, and FIG. 2 is a sectional view thereof. A wiring board 10 according to the present embodiment shown in FIG. 1 is formed by laminating ceramic green sheets in which through holes 5 that are through holes into which the penetrating member 1 is inserted are formed by a punching die or the like as will be described later. This is a laminated substrate produced by pressure bonding and the like and then firing. In addition, the shape of the through hole 5 is not limited to the rectangle (rectangle) shown in FIG.

  As shown in FIG. 1 (a), the penetrating member 1 is composed of metal members 1a and 1b having the same shape, and is inserted from the up and down direction (penetrating direction) that is both end portions of the through hole 5 to each other. 4 a and 4 b are butted in the through hole 5. Then, the penetrating member 1 is formed by joining the metal members 1a and 1b to each other with a bonding agent (for example, a solder material) supplied between the butted surfaces 4a and 4b.

  The metal members 1a and 1b have trunk portions 9a and 9b and flanges (flanges) 7a and 7b formed at one end thereof, and are entirely rivet-shaped members. Here, the end portions (the lower surface) of the metal members 1a and 1b that are not provided with the flange portions 7a and 7b are opposed to each other and inserted into the through hole 5, and they are abutted and joined to each other to penetrate the two-part structure. Member 1 is formed. The metal members 1a and 1b are appropriately selected from, for example, copper alloy, aluminum alloy, iron, stainless steel, nickel alloy and the like in consideration of thermal conductivity, electrical resistance, corrosion resistance, heat resistance, ease of cutting, and the like. . Further, the penetrating member 1 may be made of a high hardness resin member.

  For example, the wiring board 10 has a thickness of 0.5 to 3.0 mm, and the size of the through hole 5 is 0.2 × 0.2 mm to 20 × 20 mm when the shape is a square, The diameter is 0.2 to 20 mm. Further, the thickness of the inner wall surfaces 27a and 27b of the through hole 5 (indicated by reference numeral T2 in FIG. 2) is, for example, 0.1 to 1 mm.

  On the other hand, the outer dimensions (size) of the penetrating member 1 made of the metal members 1a and 1b are, for example, a diameter D1 of the flange portions 7a and 7b of 0.3 to 22 mm, a thickness T1 of 0.1 to 2.0 mm, and a body portion. The diameter D2 of 9a, 9b is set to 0.2 to 20 mm or less so as to be smaller than the size of the through hole 5. The length L of the body portions 9a and 9b of the penetrating member 1 and the thickness T1 of the flange portions 7a and 7b are designed to be substantially equal to the thickness of the wiring board 10 when they are abutted. In addition, the depths of recesses (cavities) 5a and 5b (indicated by reference numeral T3 in FIG. 2) formed in the peripheral part of the through hole 5 are dimensions that can accommodate the thickness of the flange of the penetrating member 1.

  FIG. 1B shows a state in which the wiring board 10 to which the penetrating member 1 formed by joining the metal members 1a and 1b is attached is supported and fixed to a fixing member (also referred to as a supporting member) 15. Yes. Examples of the fixing member 15 include a support substrate, a housing, and a metal heat dissipation substrate (heat sink). As will be described later, a through hole 3 is provided in the axial center of the penetrating member 1. A screw member 30 is inserted into the through hole 3, and a male screw portion 30 a provided at the tip of the screw member 30. The wiring board 10 is fixed to the fixing member 15 by screwing the female screw portion 15 a provided on the fixing member 15.

  FIG. 2 is a cross-sectional structural view of the wiring board 10 according to the present embodiment fixed to the fixing member 15, and is a cross-sectional view taken along the line XX 'in FIG. It is. As described above, the penetrating member 1 is formed by abutting and joining the metal members 1a and 1b inserted into the through-hole 5 provided in the wiring board 10 from above and below. The flange 7 a of the metal member 1 a is accommodated in a recess 5 a formed around the through hole 5 on the upper surface (front surface) side of the wiring substrate 10. Similarly, the flange portion 7b of the metal member 1b is accommodated in a recess 5b formed around the through hole 5 on the lower surface (back surface) side of the wiring substrate 10. Then, the penetrating member 1 is positioned so that gaps 25 a and 25 b are formed between the side surfaces 23 a and 23 b of the penetrating member 1 and the inner wall surfaces 27 a and 27 b of the through hole 5.

  In the wiring board 10 on which the penetrating member 1 positioned as described above is disposed, the screw member 30 is inserted into the through hole 3 provided in the central portion of the penetrating member 1 in the axial direction by a method described later. The wiring board 10 is fixed to the fixing member 15 by screwing the screw portion (male screw portion) 30 a at the tip of the screw member 30 and the female screw portion 15 a of the fixing member 15.

  In addition, since the upper surface part (upper surface of the collar part 7a) and lower surface part (upper surface of the collar part 7b) of the penetration member 1 can ensure a comparatively wide contact surface, maintaining smoothness, for example, as shown in FIG. A mounting form in which the heat generating component 41 is mounted on the upper surface portion of the penetrating member 1 and the heat generating component 41 and the wiring 6 of the wiring board 10 are connected by the wire bonding 45 is also possible. In this case, if the fixing member 15 to which the wiring substrate 10 is fixed is a highly heat conductive member, for example, a metal housing such as aluminum, copper, or iron used for a heat sink, heat generated from the heat generating component 41 is generated. Is immediately conducted to the fixing member 15 through the penetrating member 1, so that efficient heat dissipation is possible.

  Next, a method for manufacturing a wiring board according to the present embodiment will be described. FIG. 3 is a flowchart showing, in chronological order, the steps of manufacturing the wiring board and arranging (mounting) the penetrating member according to the present embodiment. FIG. 4 is a diagram showing a cross-sectional configuration of the wiring board corresponding to each step of FIG.

  In step S11 of FIG. 3, for example, a ceramic green sheet having a predetermined shape and a predetermined dimension of a through hole formed by a punching die or the like is laminated, pressure-bonded by a press or the like, and fired to obtain the lamination shown in FIG. A substrate (wiring substrate 10) is produced. Further, as shown in FIG. 4A, the wiring board 10 has through holes 5 penetrating in the thickness direction, and the metal member described above is formed around the upper surface side and the lower surface side of the through hole 5. Concave portions 5a and 5b are formed to accommodate the collar portions.

  The wiring board 10 is, for example, a low temperature co-fired ceramics (LTCC) multilayer circuit board obtained by firing at a low temperature. When the ceramic green sheets are laminated, for example, silver ( A wiring made of Ag) is also formed at the same time. Since LTCC facilitates multilayering, bare chip mounting, etc., it is possible to realize a high-density mounting substrate, miniaturize a module, and the like.

  In step S13, as shown in FIG. 4A, after placing the metal member 1b on the hot plate 51 heated to, for example, 250 ° C. so that the flange portion 7b is on the hot plate 51 side, The wiring board 10 is covered from above the metal member 1b while bringing the body portion 9b of the metal member 1b closer to the inner wall surfaces 27a, 27b of the through hole 5. And as shown in FIG.4 (b), the collar part 7b of the metal member 1b is made to contact | abut to the bottom face part 5b 'of the recessed part 5b formed in the circumference | surroundings of the through-hole 5. FIG.

  In step S15, as shown in FIG. 4 (b), an appropriate amount of a bonding agent 31 (for example, made of lead-free solder and flux) is placed on the upper surface of the body 9b of the metal member 1b, and then the body 9a is moved downward. The metal member 1a facing toward is placed on the metal member 1b. At this time, the front end surface of the body portion 9a of the metal member 1a and the front end surface of the body portion 9b of the metal member 1b are abutted in the through hole 5, and further, the bottom surface portion 5a of the recess 5a formed around the through hole 5 The flange portion 7a of the metal member 1a is brought into contact with ′. As described above, the bonding agent 31 secures and maintains a gap between the penetrating member 1 and the inner wall of the through hole 5, and supplies an amount that does not overflow into these gaps.

  In step S17, the metal member 1a is lightly pressed toward the metal member 1b as shown by an arrow in FIG. 4C so that the metal members 1a and 1b are in close contact with each other via the bonding agent 31. Thereafter, in step S19, the entire wiring board 10 is removed from the hot plate 51, left at room temperature (air cooled) to lower the temperature, thereby solidifying the bonding agent 31 and bonding the metal members 1a and 1b. In addition, although the example which uses a hot plate was given, the adhesion | attachment by reflow is also possible.

  In subsequent step S21, after the temperature of the wiring board 10 on which the penetrating member 1 composed of the metal members 1a and 1b joined by the bonding agent 31 is lowered, as shown in FIG. The tip of a drill blade 35 having a predetermined diameter is positioned toward the center in the axial direction of the penetrating member 1 (indicated by reference symbol CL). And as shown in FIG.4 (e), it drills with the drill blade 35 and the through-hole 3 extended in the axial direction in the penetration member 1 is formed. As described above, when the diameter D2 of the body portions 9a and 9b of the penetrating member 1 is 4 mm, for example, the through hole 3 having a diameter of 1.6 mm is formed.

  In step S23, a plating process is performed. Although not shown here, for example, electroless nickel-gold (Ni / Au) plating is applied to the upper surface portion (upper surface of the flange portion 7a) and the lower surface portion (upper surface of the flange portion 7b) of the penetrating member 1 made of copper. Similarly, the surfaces of the wirings 6 and 8 which are Ag electrodes are also plated. Alternatively, if the electroless nickel-gold plating is applied to the wiring surface after the step S11 and a penetrating member subjected to a surface treatment (nickel, tin plating) for preventing rust in advance is inserted, the step S23 becomes unnecessary. Through the above steps, the ceramic wiring substrate 10 in which the penetrating member 1 is disposed on the ceramic substrate and the through hole 3 is formed in the penetrating member 1 is obtained.

  In the process shown in FIG. 3, after the through member 1 is attached to the wiring board 10, the through hole 3 extending to the center in the axial direction of the through member 1 is formed by a drill or the like, but the present invention is not limited to this. For example, a through hole 3 extending in the center in the axial direction is formed on the penetrating member 1 before being attached to the wiring board 10, and the penetrating member 1 thus formed with the through hole 3 is formed on the wiring board 10. It may be attached.

  On the other hand, as described above, when the through hole 3 is formed in the penetrating member 1 in advance before being attached to the wiring board, if the through holes are individually formed in the metal members 1a and 1b constituting the penetrating member 1, the central axis When the metal members 1a and 1b are brought into contact with each other in the through hole 5 of the wiring board 10, the through holes are displaced from each other, and the through hole is bent in the middle of the through member 1. It is also assumed that it will be in a state. Therefore, a through hole is formed in only one of the metal members 1a and 1b in the central axis direction, and a metal member in which the through hole is formed and a metal member in which the through hole is not formed are formed in the through hole of the wiring board 10. After abutting within 5, a through hole is formed in a metal member in which a through hole is not formed along the already formed through hole, thereby avoiding the above-described problem due to the shift of the central axis.

  As described above, in the ceramic wiring board according to the present embodiment, each of the pair of metal members having a flange portion (flange) at one end and having a rivet shape as a whole and having good thermal conductivity is provided on the wiring board. Insert it into the through hole provided on the top and bottom sides. And these metal members are joined with solder etc., a penetration member is formed, and the penetration hole which penetrates the central part of the axial direction of the penetration member is provided.

  With such a configuration, the wiring board made of a brittle material such as ceramics is sandwiched from the thickness direction at the flange portion of the penetrating member, and a screw is inserted into the through hole formed in the penetrating member disposed in the through hole. Then, the ceramic wiring board can be easily fixed and supported on the other member by screwing on the other member and tightening the screw. At this time, by providing the penetrating member, contact stress around the through hole of the ceramic wiring substrate can be avoided by the collar portion. In addition, since the head of the screw is only in contact with the penetrating member, the stress load when screwing is applied only to the penetrating member and no load is applied to the wiring board. Can be avoided reliably.

  And a structure in which a gap is provided between a side surface of the penetrating member disposed on the wiring board and an inner wall surface of the through hole of the wiring board, and the wiring board is screwed to another member through the through hole formed in the penetrating member. Therefore, the wiring board and the penetrating member are not fixed, and there is a degree of freedom, and it is not necessary to consider the thermal expansion difference between the penetrating member and the wiring board, and further, the thermal expansion difference of the screw. Generation of cracks can be avoided. In addition, the penetrating member functions as a buffering means (vibration absorbing means) against mechanical vibration from the outside to the wiring board, and such vibration directly damages the through hole provided in the ceramic substrate. Can be prevented.

  Furthermore, the heat dissipation effect by the penetrating member can be improved by using a metal having high thermal conductivity (for example, copper) for the penetrating member to lower the thermal resistance. That is, since the lower surface side of the penetrating member provided on the wiring board is in contact with the fixing member together with the wiring board, for example, by mounting a heat generating component on the upper surface of the collar portion of the penetrating member, the lower surface side of the penetrating member and the fixing member It is possible to efficiently dissipate heat through the penetrating member while ensuring a wide contact surface.

<Second Embodiment>
The ceramic wiring board according to the second embodiment of the present invention will be described below. The wiring board according to the second embodiment is manufactured by the same process as the wiring board according to the first embodiment described above, that is, the processes shown in FIGS. And the screw groove was provided in the inner wall of the through-hole of the penetration member arrange | positioned at the wiring board, It is characterized by the above-mentioned.

  FIG. 5 is a cross-sectional view of a wiring board according to the second embodiment. Here, a screw groove is formed in the inner wall of the through hole by raising a tap in the through hole. Specifically, as shown in FIG. 5A, a through member 61 is disposed in the through hole 65 of the wiring board 20, and the tap 66 is formed vertically with the through hole 53 formed in the through member 61 as a lower hole. After being positioned, the tap 66 is rotated in a predetermined direction to cut the side surface (inner wall) 63 of the through hole 53. FIG. 5B shows a cross-sectional structure of the wiring board 20 in which a screw groove (female screw) 57 is formed on the inner wall of the through hole 53.

  Here, the inner diameter of the through hole 53 as the pilot hole, the inner diameter of the screw thread, and the like are selected in accordance with the outer diameter of the screw (male screw) used for fixing the wiring board. For example, when using an M2.0 (metric screw) screw, the inner diameter of the through hole 53 shown in FIG. 5A is set to φ1.6 mm, and threading is performed with an M2.0 tap. As a result, the thread groove 57 formed in the through hole 53 has a thread inner diameter of φ1.6 mm, a thread pitch of 0.4 mm, and a thread height of 0.2 mm. FIG. 5C is a cross-sectional view showing a state in which the screw 70 is inserted into the through hole 53 in which the screw groove 57 is formed.

  Note that, in the wiring board 20 according to the second embodiment as well, as in the first embodiment described above, the side surfaces 63a and 63b of the penetrating member 61 and the penetrating holes as shown in FIG. Gaps 65 a and 65 b are formed between the inner wall surfaces 67 a and 67 b of the hole 65.

  FIG. 6 is a cross-sectional view showing an example in which the wiring board 20 according to the present embodiment is fixed to the fixing member 75. Here, screw members 70a and 70b are screwed and inserted into through holes 73a and 73b formed in the through members 71a and 71b provided on the wiring board 20, respectively, and the tip portions of the screw members 70a and 70b and the fixing member 75 are inserted. The wiring board 20 is fixed to the fixing member 75 by screwing the female screw portions 77 a and 77 b provided on the fixing member 75.

  In the wiring board 20, since screw grooves (female screws) are formed in the inner walls of the through holes 73 a and 73 b, the screw members 70 a and 70 b whose entire bottom portion is a screw portion are rotated by a predetermined amount. Thus, the length of the screw portion protruding from the wiring board 20 can be adjusted. As a result, as shown in FIG. 6, the penetrating members 71a and 71b can be screwed into desired positions of the screw portions of the screw members 70a and 70b. Accordingly, a gap is provided between the wiring board 20 and the fixing member 75, and the height H1 of the gap can be arbitrarily adjusted. Therefore, the wiring board having the components 78a to 78d mounted on both the front side and the back side of the board. 20 can be fixed to the fixing member 75 in accordance with the height of the mounted component.

  In particular, when the parts 78c and 78d mounted on the wiring board 20 are heat generating parts and need to be radiated, the height H1 of the gap between the wiring board 20 and the fixing member 75 so that the upper surface portion of these parts contacts the fixing member 75. By adjusting the above, heat radiation of the parts 78c and 78d can be efficiently performed with a simple configuration.

  As described above, in the wiring board according to the second embodiment, penetrating members made of a metal having good thermal conductivity and having flanges (flanges) at both ends are provided in the through holes provided in the wiring board. A screw groove (female screw) is formed in the inner wall of the through hole that is disposed and provided in the axial center of the penetrating member. As a result, the wiring board can be sandwiched between the flanges, and a screw member (male screw) matched to the screw groove can be inserted into the penetrating member and fixed to the fixing member. At that time, the wiring amount can be adjusted by adjusting the rotation amount of the screw member. Since a gap of any height can be provided between the board and the fixing member, the wiring board can be fixed in a floating state from the fixing member, and the wiring board having components mounted on both sides is fixed to the fixing member. It becomes possible.

  In addition, the stress load caused by fixing and supporting the wiring board to the fixing member by the screw member is distributed to each thread of the screw groove formed on the inner wall of the through hole of the penetrating member. While preventing, the wiring board can be fixed to the fixing member by a strong tightening force.

  Furthermore, a gap is formed between the side surface of the penetrating member disposed on the wiring board and the inner wall surface of the through hole of the wiring board, and the side surface of the penetrating member is configured not to be in close contact with the substrate. There is no mechanical damage to the wiring board due to the screw drilling of the through holes. In addition, since there is no need to consider the thermal expansion difference between the penetrating member and the wiring board and the thermal expansion difference between the screws due to the gap provided around the penetrating member, the occurrence of cracks due to the heat cycle can be avoided.

The present invention is not limited to the above embodiment, and various modifications can be made. Hereinafter, modified examples will be described.
<Modification 1>
In the second embodiment, as shown in FIG. 6, the single wiring board 20 is fixed to the fixing member 75 by the screw members 60a and 60b that pass through the through holes formed in the through member. The plurality of wiring boards may be fixed to the fixing member. For example, in the example shown in FIG. 7, after the through holes 83a to 83d are formed in the through members 71a to 71d disposed on the wiring boards 40a and 40b, screw grooves are formed in each of the through holes 83a to 83d, and the common to the through holes 83a and 83c. The screw member 60a to be inserted is inserted, and the common screw member 60b is inserted into the through holes 83b and 83d. Then, the two wiring boards 40 a and 40 b are fixed to the single fixing member 75 by screwing the tip portions of the screw members 60 a and 60 b and the female screw portions 77 a and 77 b provided on the fixing member 75. it can.

<Modification 2>
As a second modification, as shown in FIG. 8, female screw portions 77a and 77b are formed on one surface side of the fixing member 85, and female screw portions 77c and 77d are formed on the other surface side. And the front-end | tip part of the screw members 70a and 70b which penetrate each of the through-holes 93a and 93b of the wiring board 40c and the female screw parts 77a and 77b of the fixing member 85 are screwed together. Similarly, the tip portions of the screw members 70c and 70d that are inserted through the through holes 93c and 93d of the wiring board 40d and the female screw portions 77c and 77d of the fixing member 85 are screwed together. As a result, the two wiring boards 40 c and 40 d can be fixed to the single fixing member 85.

<Modification 3>
As a third modification example, in the first modification example shown in FIG. 7, two screw members 60a and 60b through which the penetrating members 71a to 71d are inserted are used instead of the screw members having a longer thread portion. It is possible to make a multi-layered structure in which a large number of wiring boards exceeding the above are connected and fixed. A large number of wiring boards can be fixed in a state where a plurality of wiring boards are brought into close contact with each other as well as being fixed at a fixed distance so that both-side parts can be mounted as shown in the figure. Similarly, in the second modification shown in FIG. 8, by using a screw member having a long screw part, that is, the configuration shown in FIG. 7 is changed to the surface side of the fixing member 85 shown in FIG. 8. By applying to the fixing configuration of the wiring board on each of the back surfaces, a multi-layer structure in which a large number of wiring boards are fixed to the fixing member 85 can be realized.

<Modification 4>
FIG. 9 shows a wiring board according to the fourth modification, in which a ceramic circuit board provided with a penetrating member is connected to each other. In the example shown in FIG. 9A, screw grooves (female screws) are formed in the inner walls of the through holes 103a and 103b of the through members disposed in the ceramic wiring board 90a, and the screw members 80a and 80b are formed in these through holes. Insert. On the other hand, female thread portions 91a and 91b having a predetermined depth are formed in the penetrating members 101a and 101b disposed on the ceramic wiring board 100, respectively. Therefore, the ceramic wiring boards 90a and 100 can be connected to each other by screwing the tip portions of the screw members 80a and 80b inserted through the through holes 103a and 103b to the female screw portions 91a and 91b.

  FIG. 9B is an example in which the configuration shown in FIG. 9A is also applied to the other surface side of the ceramic wiring substrate 100. Specifically, female screw portions 91c and 91d having a predetermined depth are formed on the other end side of the penetration members 101a and 101b of the ceramic wiring board 100, and the tip portions of the screw members 80a and 80b are connected to the female screw. While screwing to the parts 91a and 91b, the front-end | tip part of the screw members 80c and 80d is screwed to the female screw parts 91c and 91d. As a result, the multi-level coupling between the ceramic circuit boards in which the ceramic wiring boards 90a and 90b are connected to the both surface sides of the ceramic wiring board 100 is possible.

  In any of the examples shown in FIGS. 9A and 9B, by adjusting the depth at which the tip portions of the screw members 80a to 80d are screwed to the female screw portions 91a to 91d, Distance H2 and the distance H3 between the wiring boards 90b and 100 can be arbitrarily adjusted. Further, since the female screw portions 91a to 91d of the wiring board 100 do not need to penetrate the penetrating members 101a and 101b, even if the wiring board 100 is thick and the penetrating members 101a and 101b are long in the axial direction, The screw portions 91a to 91d can be easily formed.

<Modification 5>
In the example shown in FIG. 7 to FIG. 9, screw grooves are formed on the inner wall of the through hole of the through member, and screw members 70a to 70d and 80a to 80d through which the through hole is inserted, the entire lower part from the neck of the screw is a screw part. The multi-layered structure in which a plurality of wiring boards are fixed using the above-described screw members is not limited to this. For example, without using a screw groove on the inner wall of the through hole of the penetrating member, a screw member provided with a male screw portion at the tip portion like the screw member 30 shown in FIG. By inserting a spacer or the like coaxially with the screw member between the wiring board and the fixing member to maintain the distance between the ceramic wiring boards and the distance between the wiring board and the fixing member, A hierarchical structure may be realized. Also, it is possible to fix a plurality of ceramic substrates by overlapping the distances H2 and H3 between the wiring substrates shown in FIG. 9 or using one wiring substrate like a lid.

<Modification 6>
In the first and second embodiments, the example in which the upper surface and the lower surface of the penetrating member disposed on the wiring board are on the same plane as the front surface and the back surface of the wiring board is shown. As described above, the flanges 117 a and 117 b of the penetrating member 111 may have a shape that protrudes more convexly than the front surface 113 and the back surface 115 of the wiring substrate 110. By doing so, it is not necessary to form recesses in the upper and lower peripheral portions of the through hole 125 of the wiring board 110, so that the ceramic green sheet processing process can be simplified.

  In addition, the axial distance between the flanges 117a and 117b of the penetrating member 111 disposed on the wiring board 110 is the same as the thickness of the wiring board 110, and the axial distance of the through hole 123 formed in the penetrating member 111 is also the same. become longer. From this, for example, a screw groove is formed in the inner wall of the through hole 123, and the wiring board 110 is fixed to a fixing member (not shown) by a screw member (not shown in FIG. 10) inserted through the through hole 123. In this case, the distance between the male screw portion of the screw member and the female screw portion of the screw groove on the inner wall of the through hole is increased, so that the joining force and the coupling force between the metal members 111a and 111b constituting the penetrating member 111 are increased. In addition, there is an effect of reinforcing the flanges 117a and 117b that sandwich the wiring board 110.

  Since the through member 111 shown in FIG. 10 does not have a recess (cavity) for accommodating the flanges 117a and 117b around the through hole 125, when the through member is provided on the wiring board, the through hole is to be drilled. Further, it is assumed that the penetrating member is rotated and the like, so that smooth perforation becomes difficult. Therefore, a through hole may be drilled in the penetrating member before the penetrating member is incorporated into the wiring board.

<Modification 7>
In the first and second embodiments, a pair of rivet-shaped metal members each having a flange (flange) formed at one end thereof are joined to each other to form a penetrating member. Is not limited to this. For example, although not shown in the figure, a metal body (for example, made of copper) having a flange (flange) at one end and having a vertical cross section is formed from below the through hole of the wiring board. A negative potential is applied to the metal body as a plating target, and an anode plate is installed in the vicinity of the end surface of the metal body opposite to the end portion where the collar portion is formed. Then, the wiring board into which the metal body is inserted is immersed in a plating tank filled with the same metal plating solution as the metal body, and the plating is deposited on the opposite end surface of the metal body to It may be formed. Here, the wiring board is sandwiched between the upper surface and the lower surface by the flange portion provided at one end portion of the metal body and the flange portion formed by plating as described above.

<Modification 8>
The shape of the penetrating member attached to the wiring board is not limited to the example shown in FIG. FIG. 11A is the penetrating member 1 shown in FIG. 1 used in the wiring boards according to the first and second embodiments, and FIGS. 11B to 11D are deformations of the penetrating member. An example is shown, the upper part of each figure is an external perspective view, and the lower part is a plan view when the penetrating member is viewed from the direction of the arrow. In the penetrating member 1 in FIG. 11 (a), the shape of the flanges (flanges) 7a, 7b formed at both ends thereof is circular. For this reason, when the through-hole 3 is drilled in the axial center of the penetrating member 1 with a drill or the like only by the vertical clamping force with respect to the wiring board by the flange portions 7a and 7b, the through-hole 3 is further drilled by using the through-hole 3 as a lower hole. When a screw groove is formed on the inner wall of the hole 3, the penetrating member 1 rotates and becomes unstable as indicated by an arrow in a recess (cavity) 5a formed around the through hole of the wiring board, and workability such as drilling is improved. May be affected.

  Therefore, the side portion of the collar portion may be caught in the concave portion (cavity) 5a to prevent the penetrating member from rotating together with the drill during drilling or the like. For example, FIG. 11B is an example in which the shape of the flanges 127a and 127b of the penetrating member 131 is a shape in which four corners of a rectangle (square) are cut out, and FIG. In this example, the shapes of 137a and 137b are rectangular (square). 11B and 11C, the lengths A and B of the side of the flange are set slightly shorter than the vertical and horizontal lengths of the recesses (cavities) 5a of the wiring board.

  11A to 11C, the trunk portions 9a, 9b, 129a, 129b, 139a, and 139b have a circular cross-sectional shape, but FIG. 11D illustrates the trunk of the penetrating member 151. In this example, the cross-sectional shapes of the portions 149a and 149b are rectangular according to the shape of the through hole formed in the wiring board. By making the cross-sectional shape of the trunk part rectangular, rotation of the penetrating member at the time of drilling the penetrating member can be prevented.

1, 61, 71a to 71d, 111, 131 Through member 1a, 1b, 111a, 111b Metal member 3, 53, 73a, 73b, 83a to 83d, 93a to 93d, 103a to 103d, 123 Through hole 4a, 4b Surface 5, 125 Through hole 5a, 5b Recess (cavity)
5a ', 5b' Recessed bottom surface portion 6, 8 Wiring 7a, 7b, 117a, 117b, 127a, 127b, 137a, 137b, 147a, 147b ridge (flange)
9a, 9b, 129a, 129b, 139a, 139b, 149b, 149b Body 10, 20, 40a to 40d, 90a, 90b, 110 Ceramic wiring boards 15, 75, 85 Fixing members 15a, 77a to 77d, 91a to 91d Female Screw parts 23a, 23b, 63a, 63b Side surfaces 27a, 27b of penetrating members Inner wall surfaces 30, 60a, 60b, 70a-70d, 80a-80d of through holes Screw members 30a Screw parts (male screw parts)
31 Bonding agent 35 Drill blade 41 Heat generating component 45 Wire bonding 51 Hot plate 57 Thread groove (Female thread)
65a, 65b Gap 66 Tap 78a-78d Mounted parts

Claims (10)

A ceramic wiring board comprising a first through hole penetrating in a thickness direction in the ceramic substrate, and a penetrating member inserted into the first through hole,
The ceramic wiring board, wherein the penetrating member has flanges at both ends and a second through hole penetrating the center in the axial direction. 2. The ceramic wiring according to claim 1, wherein the penetrating member is formed by abutting the other end of each of a pair of metal members each having a flange portion at one end within the first through hole. substrate. The ceramic wiring board according to claim 1, wherein the ceramic wiring board is fixed to the support member by a screw member inserted through the second through hole. The ceramic wiring board according to claim 3, wherein the plurality of ceramic wiring boards are fixed to one side or both sides of the support member with a predetermined distance therebetween. The ceramic wiring board according to claim 3, wherein a plurality of the ceramic wiring boards are adhered to each other and fixed to one side or both sides of the support member. The ceramic wiring board according to claim 1, wherein the ceramic wiring boards are connected to each other with a predetermined distance therebetween via a screw member that couples the penetrating members to each other. 2. The ceramic wiring board according to claim 1, wherein the ceramic wiring boards are closely connected to each other through a screw member that couples the through members to each other. The ceramic wiring board according to claim 1, wherein a screw groove is formed on an inner wall of the second through hole. The ceramic wiring board according to claim 1, wherein a gap is provided between the penetrating member and an inner wall of the first through hole. 9. The ceramic wiring substrate according to claim 1, wherein no bonding agent is interposed between the penetrating member and an inner wall of the first through hole.