JP2018092465A - Non-contact ic card and method of manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a noncontact IC card which has high performance of buffering external physical impact onto an IC chip part and is less liable to be damaged by cracks or the like occurring in the IC chip part due to curving or the like originated from use of the card.SOLUTION: The non-contact IC card has a lamination structure in which an inlet 12 on which an IC chip 13 is mounted and an intermediate layer substrate 14 laminated on the IC-chip-mounting surface side of the inlet are sandwiched between first and second exterior substrates 11 and 16, and are adhered together. The thickness of the intermediate layer member is larger than the thickness of the IC chip and a through hole 15 having such a size as to surround the IC chip is provided at a portion of the intermediate layer member which faces the IC chip, and the through hole is filled with an adhesive.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a non-contact IC card in which an IC chip or the like is incorporated in a material such as plastic and a manufacturing method thereof, and more particularly, to a non-contact IC card that is not easily affected by an external physical impact and a manufacturing method thereof.

  In recent years, IC cards have been widely used as a recording medium in society. In particular, contactless IC cards are not only public transportation commuter passes, prepaid cards, point cards, but also driver's licenses and student ID cards. It is used in a wide range of fields such as ID cards and employee ID cards.

  These applications are expected to increase further, but with the expansion of applications, there is an increasing demand for less expensive non-contact IC cards depending on the field.

  However, on the other hand, since many non-contact IC cards are packed and transported in a box or the like at the time of transportation such as transportation, the IC chip mounting part breaks down due to physical shock or pressure applied to the IC chip part. There was also a risk of breakage.

  The risk of failure or breakage of the IC chip mounting part can be a major obstacle to the convenience of non-contact IC cards.

  Various countermeasures against such risks have been proposed in the past. For example, Patent Document 1 discloses that an antenna and an IC chip are arranged so that pressure is not concentrated on an IC chip mounting portion and because of problems in appearance as a card. A non-contact IC card in which a mounted inlet is enclosed in a hollow portion provided in a center core and a method for manufacturing the same have been proposed.

  Further, Patent Document 2 proposes a non-contact IC card in which a stainless plate is inserted as a reinforcing material on the front side and back side of a part of an IC chip to prevent damage to the IC chip and a method for manufacturing the same.

  Patent Document 3 discloses a non-contact IC card in which a core sheet subjected to counterbore processing is arranged on both sides so that an IC chip can be fitted, and an exterior sheet is provided thereon, and a manufacturing method thereof. Proposed.

JP 2001-319210 A JP 2003-141486 A JP2015-103165A

  However, the non-contact IC card having the configuration disclosed in Patent Document 1 has a hollow inside the card, so that the portion has low strength, and is easily deformed by being depressed when pressed from the outside. In the meantime, there was a risk that a crack would occur at the boundary between the part that was hollow inside and the part that was not inside, leading to breakage.

In addition, the non-contact IC card having the configuration disclosed in Patent Document 2 requires not only the trouble of embedding a stainless steel plate in the inner layer of the card, but also the plastic and stainless steel plates, which are the main constituent materials of the card, have physical strength. For example, when the card is bent, bending stress tends to concentrate on the edge of the stainless steel plate, and the crack tends to occur in the part during use. was there.

  In addition, the non-contact IC card having the configuration disclosed in Patent Document 3 has many members constituting the card, and the number of steps such as counterboring increases in the processing process, so that it takes time to manufacture the non-contact IC card. There is a problem that the cost is increased.

  The present invention has been made to solve the above-described problems of the prior art, and has a high performance for buffering a physical impact from the outside to the IC chip portion without requiring any special material or process. Another object of the present invention is to provide a non-contact IC card that is less likely to be damaged due to the occurrence of cracks in the IC chip portion even when the card is bent due to use of the card.

In order to solve the above problems, the invention according to claim 1 of the present invention provides:
A laminate in which an IC chip is mounted between the first and second exterior base materials and an intermediate layer base material that is stacked on the IC chip mounting surface side of the inlet is sandwiched and bonded with an adhesive. A non-contact IC card having a structure, wherein the thickness of the intermediate layer member is larger than the thickness of the IC chip, and a through-hole having a size surrounding the IC chip is provided in a portion of the intermediate layer member facing the IC chip. The contact hole is filled with the adhesive, and is a non-contact IC card.

The invention according to claim 2 of the present invention is
2. The non-contact IC card according to claim 1, wherein the thickness of the intermediate layer member is at least 60 [mu] m thicker than the thickness of the IC chip.

The invention according to claim 3 of the present invention is
3. The non-contact according to claim 1, wherein a member equivalent to the intermediate layer member is laminated on the IC chip non-mounting surface of the inlet with a through-hole filled with an adhesive. 4. IC card.

The invention according to claim 4 of the present invention is
At least the first exterior base material, the inlet having the IC chip mounted thereon, the intermediate layer base material, and the second exterior base material are sequentially laminated with the adhesive layer interposed therebetween, bonded, and then die-cut to form a card shape. A method of manufacturing a non-contact IC card, wherein a through-hole having a size surrounding the IC chip is provided at a portion facing the IC chip mounted on the inlet of the intermediate layer base material, and the IC chip enters the through-hole. The intermediate layer base material and the inlet are laminated, and the second exterior base material is coated on the second exterior base material with a larger amount of adhesive than necessary for adhesion to the intermediate layer member. When the intermediate layer member is laminated, a non-contact IC card is manufactured by extruding an excess part of the adhesive to the through-portion portion and filling the gap in the through-portion with the adhesive, and then adhering.

  According to the first aspect of the present invention, the IC chip is housed in the through hole provided in the intermediate layer member having a thickness larger than that of the IC chip, and each substrate is placed in the gap in the through hole. Because it is covered with the adhesive used to bond the IC chip, it is possible to protect the IC chip from external impacts without using special members or materials such as stainless steel plates. A non-contact IC card that can be reduced is obtained.

According to the invention of claim 2 of the present invention, the thickness of the intermediate layer member is at least 60 μm thicker than the thickness of the IC chip, so that the thickness of the adhesive to cover the IC chip becomes about 60 μm, A contactless IC card with more reliable protection against impact can be obtained.

  According to the invention of claim 3 of the present invention, it is possible to enhance the protection function against the impact from the IC chip non-mounting surface side without requiring a different kind of member, and the non-contact function is higher in preventing the IC chip from being damaged. An IC card is obtained.

  According to the invention of claim 4 of the present invention, only an extra adhesive is applied to fill the gap, and no special process is required. A non-contact IC card having a chip protection function can be manufactured.

It is a schematic diagram which shows the layer structure of the non-contact IC card of this invention. It is a schematic diagram which shows the process of laminating | stacking each layer of the non-contact IC card of this invention. It is a cross-sectional schematic diagram of the non-contact IC card of the present invention. It is a schematic diagram which shows schematic structure of the manufacturing apparatus of the non-contact IC card of this invention. It is a schematic diagram which shows another process of laminating | stacking each layer of the non-contact IC card of this invention. It is a schematic diagram which shows another schematic structure of the manufacturing apparatus of the non-contact IC card of this invention. It is a schematic diagram which shows the other layer structure of the non-contact IC card of this invention.

  Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings. The present invention is not limited to the following embodiment.

FIG. 1 is a schematic diagram for explaining an example of a layer structure of a non-contact IC card 1 according to the present invention.
The non-contact IC card includes a first exterior base material 11, an inlet 12 on which the IC chip 13 is mounted, an intermediate layer member 14 provided with a through-hole 15 having a size capable of accommodating the IC chip 13 in a portion of the IC chip 13, A second exterior substrate 16 is formed from the laminate 10 that is laminated via the adhesive layers 17, 18, and 19. The adhesive layer 19 on the second exterior base material is laminated so as to be thicker than necessary for adhesion between the layers. Further, the IC chip 13 may be not only a bare chip but also a chip in which a bare chip is sealed in a resin mold. In addition to the IC chip 13, the inlet 12 can be provided with a wiring pattern and an antenna coil (not shown).

  FIG. 2 is a diagram for explaining a procedure for creating the laminated body 10 forming the non-contact IC card 1 having the configuration shown in FIG. First, as shown in FIG. 2A, an adhesive layer 17 is provided on the first exterior base material 11, and the adhesive layer 17 is adhered to the intermediate layer base material 14 together with the inlet 12 by passing through a pressure roller (not shown). An agent layer 18 is provided and adhered to the inlet 12 in the same manner. Although the IC chip 13 is fitted in the part of the through hole 15, the thickness of the intermediate layer base material 14 is larger than the thickness of the IC chip 13, so that the void part 15 b remains in the through hole 15. The thickness of the IC chip 13 refers to the height value at which the IC chip 13 protrudes from the inlet 12.

  Next, as shown in FIG. 2B, the second exterior base material 16 provided with the adhesive layer 19 is laminated on the intermediate layer member 14, conveyed while being pressure-bonded by the pressure rollers 20, 20, and bonded. At this time, the second exterior base material 16 is coated with more adhesive than is necessary for adhesion to the intermediate layer member 14, and is transported while being crimped by the pressure rollers 20, 20. The excess adhesive 19b out of the adhesive of the adhesive layer 19 is extruded as shown by the arrow, reaches the through hole 15 and fills the gap 15b. Even if the adhesive in the part that has passed through the through-hole 15 protrudes from the edge, after bonding each layer, it is finally cut into a card shape by die-cutting and the edge part is removed, so there is no particular problem. . In FIG. 2, only one side of the card is shown, but when the card is actually manufactured, the card is manufactured in a multi-faceted form on the sheet or in a state where a plurality of continuous web-shaped take-up sheets are continuous. In this case, however, the portion of the adhesive that has passed through the through-hole 15 is pushed out to the card imposition portion at the subsequent stage.

  FIG. 3 is a schematic cross-sectional view of the non-contact IC card 1 of the present invention in which the laminate 10 formed as described above is die-cut into a card shape, and the gap 15b is filled with an adhesive 19b. It has become. For this reason, even when an impact with a point pressure is applied to the part of the IC chip 13 from the outside, the sheet of the inlet 12 is covered on the first exterior base material 11 side, and the adhesive 19b is on the second exterior base material 16 side. Therefore, the possibility that the IC chip 13 is destroyed can be reduced. At this time, if the thickness of the intermediate layer member 14 is at least 60 μm thicker than the thickness of the IC chip 13, the thickness d1 of the adhesive 19b covering the IC chip is also 60 μm or more, and the function of buffering the impact and protecting the IC chip is more reliable. This is preferable. The thicknesses of the other adhesive layers 17, 18, and 19d are approximately 10 μm, although depending on the material of each layer and the type of adhesive.

  The thickness d2 of the IC chip 13 is about 125 μm if it is a small type chip. In that case, the thickness of the intermediate layer member 14 should be at least about 185 μm, and when a plastic sheet is used, a thickness of 188 μm is often used because a 188 μm thickness is readily available as a standard one.

  The first exterior substrate 11, the second exterior substrate 16 and the intermediate layer member 14 are not particularly limited, but include, for example, paper and synthetic paper, polyethylene terephthalate (PET), polyethylene naphthalate (PEN), Polyvinyl chloride, polyester, polycarbonate, polymethyl methacrylate, polystyrene, polylactic acid, polycaprolactam, poly (3hydroxybutyrate-3hydroxyvalerate), polyvinyl alcohol, triacetylcellulose, acrylonitrile-butadiene-styrene (ABS), etc. These composite resins, natural resins, or composites, alloy bodies, blend bodies, and the like of these resins alone or in combination can be used.

  Furthermore, additives such as organic pigments, inorganic pigments and stabilizers may be added to these resins, and various treatments such as foaming treatments, antistatic treatments, easy adhesion treatments, coating of concealing layers, etc. It may be given.

  Moreover, as a base material sheet of the inlet 12, PET, PEN, polyimide (PI), paper, synthetic paper, or the like can be used. When an antenna coil is provided, a metal foil such as aluminum or copper is etched or patterned. Any of those that have been punched, those that are provided with a conductive ink in a pattern, or those that are formed by winding welding may be used.

  Further, the material used for the adhesive layers 17, 18, and 19 is not particularly limited, but it can be said that it is desirable to use a hot melt adhesive or a thermoplastic resin. Examples of the hot melt agent include ethylene / vinyl acetate copolymer (EVA), polyester, polyamide, thermoplastic elastomer, and polyolefin. Moreover, a reactive hot melt adhesive such as a moisture curable adhesive, a photocurable adhesive, and the like can be given.

  These adhesives may be added with various additives. For example, an organic pigment, an inorganic pigment, or a resin material such as phenol resin, xylene resin, epoxy resin, melamine resin, urea resin, or polycarbonate is added. May be.

FIG. 4 is a schematic diagram showing a schematic configuration of an example of a manufacturing apparatus for producing the above-described non-contact IC card 1. The manufacturing apparatus 100 is supplied with a first exterior base material, an inlet on which an IC chip is mounted, an intermediate layer base material, and a second exterior base material in a long roll shape. The first exterior substrate 11 is unwound from the roll 110, and a hot melt adhesive is applied at the coating portion 190a. The inlet 12 on which the IC chip is mounted is unwound from the roll 120, cut into small pieces by the cutter 125 on the platen roller 130, and then laminated with the first exterior substrate 11 and thermally bonded by the heat roller 135. .

  The intermediate layer member 14 is unwound from a roll 140, punched out by a punch 170, provided with a through hole, and a hot melt adhesive is applied at a coating portion 190b. Subsequently, the first exterior base material and the inlet that have been bonded together are aligned and overlapped, and are bonded by the heat roller 145.

  The second exterior base material 16 is unwound from the roll 160, and the hot melt adhesive is more than the amount necessary for adhesion at the coating part 190c. For example, about 10 μm is sufficient as the adhesive layer, and about 20 μm is applied. Subsequently, the first exterior base material 11, the inlet 12, and the intermediate layer member 14 are laminated and bonded by a heat roller 165. At that time, the surplus adhesive is melted and extruded by the heat roller 165, flows into the portion of the through-hole 15, and fills the gap. Thereafter, it is punched into a card shape by the die-cutting part 180 to become a card 115. The escape shell from which the card 115 has been punched is taken up by the take-up roller 150.

FIG. 5 is a diagram for explaining another procedure for creating the non-contact IC card 1 having the configuration shown in FIG. Although the procedure is different, the overall configuration and the completed form are the same.
First, as shown in FIG. 5A, an adhesive layer 17 is provided on the first exterior base material 11 and bonded together with the inlet 12 by passing between pressure rollers (not shown).

  Next, as shown in FIG. 5B, the second exterior base material 16 provided with the adhesive layer 19 is laminated on the intermediate layer member 14, conveyed while being pressure-bonded by the pressure rollers 30 and 30, and bonded. At this time, the second exterior substrate 16 is coated with an adhesive that is larger than the amount necessary for adhesion to the intermediate layer member 14, for example, about 20 μm, whereas the amount necessary for adhesion is about 10 μm. The excess adhesive 19d out of the adhesive of the adhesive layer 19 is pushed out as shown by the arrow as it is conveyed while being compressed by the pressure-bonding rollers 30 and 30, and the portion of the through hole 15 is partially Fill in.

  FIG. 5C shows a state in which the adhesive layer 18 is provided on the intermediate layer member 14 after the second exterior base material 16 and the intermediate layer member 14 are laminated. The through-hole 15 is partially filled with the extruded excess adhesive 19d. Thereafter, the IC chips 13 are stacked and bonded so as to be fitted into the through-holes 15, and punched into a card shape to obtain a non-contact IC card similar to that shown in FIG.

FIG. 6 is a schematic diagram showing a schematic configuration of an example of a manufacturing apparatus that creates the non-contact IC card 1 by the procedure described with reference to FIG. Description of parts common to FIG. 4 is omitted.
The intermediate layer member 14 is unwound from the roll 240 and punched out with a punch 270 to provide a through hole. The second exterior substrate 16 is unwound from the roll 260, and the coating portion 290c has more hot melt adhesive than is necessary for adhesion. For example, about 10 μm is sufficient as the adhesive layer, and about 20 μm is applied. Next, the intermediate layer member 14 is laminated and bonded by a heat roller 265. At that time, the excess adhesive is melted and extruded by the heat roller 265, flows into the portion of the through-hole 15, and is partially filled.

  Next, a hot melt adhesive is applied on the intermediate layer member 14 at the coating portion 290b. Subsequently, the first exterior base material 11 and the inlet 12 that have been bonded together are aligned and overlapped, and are bonded by the heat roller 245. Thereafter, it is punched into a card shape by a die cutting part 280 to form a card 215. The shell that has been punched out of the card 215 is taken up by the take-up roller 250.

  FIG. 7 is a schematic cross-sectional view of another layer configuration example of the non-contact IC card of the present invention. In the non-contact IC card 2, a member equivalent to the intermediate layer member 14 is laminated as a second intermediate layer member 24 between the first exterior base material 11 and the inlet 12, and bonded with adhesive layers 27 and 28. The second intermediate layer member 24 is also provided with a through hole 25 at a portion facing the IC chip 13 and filled with an adhesive. Therefore, even when a strong impact is applied from the IC chip non-mounting surface side of the inlet 12, the impact can be satisfactorily buffered and the IC chip 13 can be well protected.

  When the second intermediate layer member 24 is laminated, the entire thickness increases accordingly. For example, when a sheet having a thickness of 188 μm is used for each of the intermediate layer members, the first and second exterior substrates are formed as a sheet having a thickness of 125 μm. By doing so, a card that conforms to the ISO standard thickness of 760 μm can be obtained. Alternatively, the adhesive layer can be made thicker to increase the protection performance of the IC chip. For example, when the first and second exterior substrates are made of relatively high strength PET sheets, The thickness only needs to be 100 μm or more. If the thickness of the sheet of the intermediate layer member is increased accordingly, it can be 200 μm or more, and the thickness of the adhesive layer can be increased accordingly.

  As described above, according to the present invention, a special member such as a stainless steel plate is not required, and the IC chip is protected from an external impact by a material constituting a normal plastic card, and has a high function of preventing breakage. A contactless IC card can be provided.

1, 2... Non-contact IC card 10... Laminated body 11... First exterior base material 12. Intermediate layer members 15, 25... Through-hole 15 b... Gap 16... Second exterior base material 17, 18, 19, 27, 28. ... Excess adhesive 20, 30 ... Pressing roller 24 ... Second intermediate layer member 100, 200 ... Production device

Claims (4)

  A laminate in which an IC chip is mounted between the first and second exterior base materials and an intermediate layer base material that is stacked on the IC chip mounting surface side of the inlet is sandwiched and bonded with an adhesive. A non-contact IC card having a structure, wherein the thickness of the intermediate layer member is larger than the thickness of the IC chip, and a through-hole having a size surrounding the IC chip is provided in a portion of the intermediate layer member facing the IC chip. A non-contact IC card, wherein the through-hole is filled with an adhesive.   The contactless IC card according to claim 1, wherein the thickness of the intermediate layer member is at least 60 μm thicker than the thickness of the IC chip.   The member equivalent to the intermediate layer member is laminated and adhered to an IC chip non-mounting surface of the inlet with an adhesive filled in a through hole. Non-contact IC card.   At least the first exterior base material, the inlet having the IC chip mounted thereon, the intermediate layer base material, and the second exterior base material are sequentially laminated with the adhesive layer interposed therebetween, bonded, and then die-cut to form a card shape. A method of manufacturing a non-contact IC card, wherein a through-hole having a size surrounding the IC chip is provided at a portion facing the IC chip mounted on the inlet of the intermediate layer base material, and the IC chip enters the through-hole. The intermediate layer base material and the inlet are laminated, and the second exterior base material is coated on the second exterior base material with a larger amount of adhesive than necessary for adhesion to the intermediate layer member. When the intermediate layer member is laminated, a method for manufacturing a non-contact IC card in which an excess of the adhesive is extruded into the through-portion portion and the gap in the through-portion is filled with the adhesive and then bonded.

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