JP2018089706A - Shot blast device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a shot blast device capable of suppressing increase of a space of the device and equipment cost.SOLUTION: A shot blast device 1 includes a plurality of compartments 11b-11f formed by a partition wall 11A, a first projector 13A provided so as to be able to project a first grinding material, and a second projector 13B provided so as to be able to project a second grinding material which is different from the first grinding material, and is constituted so that the first projector 13A projects the first grinding material to a compartment facing the first projector, and the second projector 13B projects the second grinding material to a compartment facing the second projector.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a shot blasting apparatus for cleaning an object to be polished (hereinafter referred to as “work”) with a polishing material.

  A conventional shot blasting apparatus is configured to project a polishing material from a projector in a polishing area to a workpiece conveyed by a belt conveyor, thereby cleaning the workpiece.

Japanese Patent Laid-Open No. 2015-44254

  However, since a conventional shot blasting apparatus can project only one type of blast material, it is necessary to prepare another shot blasting apparatus when it is desired to perform blasting with another blast material. For this reason, the installation space and equipment cost of an apparatus will increase.

  Therefore, an object of the present invention is to provide a shot blasting device that can suppress an increase in space and equipment cost of the device.

  In order to solve the above-described problem, a shot blasting apparatus according to an embodiment of the present invention includes a plurality of compartments formed by compartment walls, a first projector provided so as to be able to project a first abrasive, A second projector provided so as to be able to project a second polishing material different from the first polishing material, and the first projector is configured to perform the first cleaning with respect to a compartment facing the second projector. The material is projected, and the second projector is configured to project the second abrasive to the compartment facing the material.

  The plurality of compartments have a first scavenging chamber and a second scavenging chamber located next to the first scavenging chamber, and are located between the first scavenging chamber and the second scavenging chamber. The partition wall located at is formed with an opening for conveying the object to be polished from the first cleaning chamber to the second cleaning chamber, and the first projector is disposed in the first cleaning chamber. The first scouring material can be projected toward the second scouring material, and the second projector is configured to project the second scouring material toward the second scouring chamber and opens and closes the opening. An opening / closing member may be further provided.

  The opening / closing member includes a feeding portion and a sealing portion, and is provided rotatably in a feeding posture and a sealing posture.When the opening / closing member is in the sealing posture, the sealing portion closes the opening, When in the feeding posture, the feeding section may be configured to transport the member to be polished from the first cleaning chamber to the second cleaning chamber.

  The partition wall further includes a cabinet, a rotating shaft, and the partition wall includes a side wall of the cabinet, an upper plate provided in the cabinet, a lower plate provided in the cabinet, the upper plate, and the It has a plurality of partition plates located between lower plates and extending radially about the axis of the rotating shaft to form the plurality of compartments, and the partition plates are rotatable about the axis of the rotating shaft The first projector and the second projector may be provided at different positions along the rotation direction of the partition plate.

  Moreover, the flexible member which contact | abuts to the said side wall, the said upper board, and the said lower board may be attached to the outer edge of each partition plate.

  ADVANTAGE OF THE INVENTION According to this invention, the shot blasting apparatus which can suppress the increase in the space of an apparatus and equipment cost can be provided.

1 is an overall configuration diagram of a shot blasting apparatus according to a first embodiment. The internal block diagram of the upper part of the blasting part of the shot blasting apparatus which concerns on 1st Embodiment is shown. The whole block diagram of the shot blasting device concerning a 2nd embodiment is shown. The top view of the shot blasting apparatus concerning a 2nd embodiment is shown.

  A shot blasting apparatus 1 according to a first embodiment of the present invention will be described with reference to the drawings.

<Overall configuration>
First, the overall configuration of the shot blasting apparatus 1 according to the present embodiment will be described. The shot blasting apparatus 1 of the present embodiment is an apparatus that performs a polishing process on a pipe-shaped workpiece W.

  FIG. 1 shows an overall configuration diagram of the shot blasting apparatus 1. FIG. 2 shows an internal configuration diagram of the upper part of the polishing unit 10 of the shot blasting apparatus 1.

  As shown in FIG. 1, the shot blasting apparatus 1 includes a pre-cleaning placement unit 2, a scouring unit 10, a post-scouring placement unit 3, a first scouring material circulating unit 4, and a second scouring unit. The material circulation part 5 is provided.

  A plurality of pre-cleaning workpieces W are placed on the pre-cleaning placement unit 2, and the workpieces W are transported to the cleaning unit 10 one by one by the transport mechanism 2A.

  A plurality of workpieces W after the cleaning are placed on the post-cleaning placement unit 3.

  The polishing unit 10 includes a cabinet 11, a transport unit 12, a projection unit 13, and a collection unit 14.

  As shown in FIG. 2, the cabinet 11 has a partition wall 11A, and the partition wall 11A allows a carry-in chamber 11b, a spare chamber 11c, a first cleaning chamber 11d, a second cleaning chamber 11e, and a rear A processing chamber 11f is formed, and each corresponds to a compartment. Each partition wall 11A has an opening 11g. An upper sealing member 11H is provided on the partition wall 11A so as to close the upper side of the opening 11g.

  The transport unit 12 includes a plurality of opening / closing members 12A, a plurality of holding rollers 12B, and a plurality of push-up mechanisms 12C.

  Each opening / closing member 12A includes a feeding portion and a lower sealing portion 12E, and a sealing posture (solid line state in FIG. 2) for sealing each of the chambers 11b to 11f, and the workpiece W from one chamber to the other It is provided so as to be able to rotate around the shaft portion 12F in a feeding posture (a state of a broken line in FIG. 2) for feeding to the chamber. The feed portion 12D has a recess, and is configured to be able to hold the workpiece W in the recess. The lower sealing portion 12E is configured to contact the upper sealing member 11H and seal the opening 11g together with the upper sealing member 11H when in the sealing posture.

  The holding roller 12B is provided in the first cleaning chamber 11d and the second cleaning chamber 11e, and the work W is held between the pair of holding rollers 12B. The work W held by the pair of holding rollers 12B is pushed up and conveyed by the rotation of the push-up mechanism 12C.

  The projection unit 13 includes a first projector 13A and a second projector 13B. 13 A of 1st projectors consist of a rotor etc., for example, it is comprised so that the polishing material (1st cleaning material) which consists of a 0.3 mm steel shot may be projected with respect to the workpiece | work W, and 1st polishing chamber 11d Are provided along the longitudinal direction of the workpiece W. The 2nd projector 13B consists of an injection nozzle etc., for example, it is comprised so that the blasting material (2nd blasting material) which consists of 0.1 mm zirconia may be air-blasted with respect to the workpiece | work W, and 2nd blasting chamber A plurality are provided along the longitudinal direction of the workpiece W corresponding to 11e. A large portion is machined with the first abrasive, and a fine portion is machined with the second abrasive.

  The collection unit 14 includes a first collection unit 14A and a second collection unit 14B. The first recovery unit 14A includes a screw (not shown) extending in a direction perpendicular to the paper surface of FIG. 1, and the first scavenging material circulating unit removes the scavenging material falling from the preliminary chamber 11c and the first scavenging chamber 11d. It is configured to convey up to four. The second recovery unit 14B includes a screw (not shown) extending in a direction perpendicular to the paper surface of FIG. 1, and the second polishing material circulating the polishing material falling from the second cleaning chamber 11e and the post-processing chamber 11f. It is configured to convey to the section 5.

  The first scouring material circulation unit 4 transports the scouring material and the like collected by the first collecting unit 14A upward by an elevator (not shown), and scours by a separator such as a magnetic separator, a sieve, and a wind sieving machine. The material (steel shot) is separated, and the polishing material is returned to the polishing material tank (not shown). The second scouring material circulating unit 5 conveys the scouring material collected by the second collecting unit 14B upward by an elevator (not shown), and scoured by a separator such as a magnetic separator, a sieve, or a wind sieving machine. The material (alumina) is separated, and the abrasive is returned to the abrasive material tank (not shown).

  The shot blasting apparatus 1 includes a dust collector (not shown) that collects dust and the like generated by the polishing process.

<Cleaning action>
Next, the polishing operation in the shot blasting apparatus 1 will be described with reference to the drawings.

  The work W placed on the pre-cleaning placement unit 2 is placed on the opening / closing member 12A of the carry-in chamber 11b by the transport mechanism 2A. By rotating the opening / closing member 12A of the transfer chamber 11b from the sealed position to the sending position, the work W is rolled, and the work W is transferred to the opening / closing member 12A of the spare chamber 11c via the opening 11g. The opening / closing member 12A of 11b is returned to the sealing posture and the opening 11g is closed. Next, the work W is rolled by rotating the opening / closing member 12A of the preliminary chamber 11c from the sealed posture to the feed posture, and the work W is transferred to the roller 12B of the first cleaning chamber 11d through the opening 11g. Then, the opening / closing member 12A of the auxiliary chamber 11c is returned to the sealing posture and the opening 11g is closed.

  In the state where the opening 11g facing the first polishing chamber 11d is sealed by the opening / closing member 12A, the polishing material is projected from the first projector 13A, and the workpiece W is cleaned. After the scouring, the opening / closing member 12A of the second scouring chamber 11e is rotated to change from the sealed posture to the feeding posture, the push-up mechanism 12C of the first scouring chamber 11d is driven, the workpiece W is pushed up, and the second scouring It mounts on the opening / closing member 12A of the chamber 11e. The opening / closing member 12A of the second scouring chamber 11e is rotated to return to the sealed posture, and the work W is sent to the roller 12B of the second scouring chamber 11e.

  In a state where the opening 11g facing the second blast chamber 11e is sealed by the opening / closing member 12A, the blast material is projected from the second projector 13B and the workpiece W is blasted. One of the opening / closing members 12A is rotated to change from the sealed position to the feeding position, the push-up mechanism 12C of the second scouring chamber 11e is driven, the work W is pushed up, and placed on the opening / closing member 12A of the post-processing chamber 11f. One opening / closing member 12A of the second scouring chamber 11e is rotated to return to the sealed posture, and the workpiece W is sent to the other opening / closing member 12A of the second scouring chamber 11e.

  In the post-processing chamber 11f, the abrasive or the like adhering to the workpiece W is removed by air blow or the like, and after the processing, the other opening / closing member 12A of the second polishing chamber 11e is turned to a feeding posture to change the workpiece W. It is sent to the placement unit 3 after cleaning.

<Effect>
According to the shot blasting apparatus 1 as described above, the first projector 13A provided so as to be able to project the abrasive material (first abrasive material) made of steel shot is different from the first abrasive material. A second projector 13B provided so as to be capable of projecting (second abrasive), and the first projector 13A projects the first abrasive to the first abrasive chamber 11d facing it. The second projector 13B is configured to project the second polishing material onto the second polishing chamber 11e facing the second projector 13B. Therefore, since a plurality of abrasives can be projected onto the workpiece W in one shot blasting apparatus 1, it is necessary to prepare an apparatus for each type (material, size, etc.) of the abrasive. Absent. Therefore, the space for installing the apparatus can be greatly reduced, and the cost required for the shot blasting apparatus can be greatly reduced.

  Further, the partition wall 11A located between the first cleaning chamber 11d and the second cleaning chamber 11e has an opening 11g for transferring the workpiece W from the first cleaning chamber 11d to the second cleaning chamber 11e. Thus, the first projector 13A is configured to be capable of projecting the first cleaning material into the first scouring chamber 11d, and the second projector 13B is configured to project the first scouring material into the second scouring chamber 11e. An opening / closing member 12A configured to project two abrasives and opening / closing the opening 11g is further provided. With this configuration, it is possible to suppress mixing of the first abrasive and the second abrasive, and it is possible to efficiently perform the polishing process using a plurality of abrasives.

  The opening / closing member 12A includes a feeding portion 12D and a lower sealing portion 12E. The opening / closing member 12A is rotatably provided between a feeding posture and a sealing posture. When the opening / closing member 12A is in the sealing posture, the lower sealing portion 12E has an opening 11g. The feed section 12D is configured to transport the workpiece W from the first cleaning chamber 11d to the second cleaning chamber 11e when in the feeding posture. According to such a configuration, the opening / closing member 12A has both the function of feeding the workpiece W and the function of opening / closing the opening 11g, so that the structure of the shot blasting apparatus 1 can be greatly simplified.

  Next, a shot blasting apparatus 21 according to a second embodiment of the present invention will be described with reference to the drawings.

<Overall configuration>
First, the overall configuration of the shot blasting device 21 according to the present embodiment will be described. The shot blasting device 21 of the present embodiment is a device that performs a polishing process on a cylindrical workpiece W.

  FIG. 3 shows an overall configuration diagram of the shot blasting device 21. FIG. 4 shows a plan view of the shot blasting device 21.

  As shown in FIG. 3, the shot blasting device 21 includes a pre-polishing transport unit 22, a post-polishing transport unit 23, an input / discharge unit 24, a scouring unit 30, and a first scouring material circulation unit 25. And a second polishing material circulation part 26.

  The pre-cleaning conveyance unit 22 is configured by a conveyor or the like, and conveys the workpiece W before the polishing to the input / discharge port of the polishing unit 30. The post-cleaning transport unit 23 is configured by a conveyor or the like, and transports the post-cleaning work W discharged from the input / discharge port of the cleaning unit 30. The charging / discharging unit 24 inputs the uncleaned workpiece W on the pre-cleaning transport unit 22 to the cleaning unit 30, and discharges the cleaned work W from the cleaning unit 30 to the post-cleaning transport unit 23. Is configured to do.

  The polishing unit 30 includes a cabinet 31, a rotary conveyance unit 32, a projection unit 33, and a collection unit 34.

  As shown in FIG. 4, the cabinet 31 has a shape in which a rectangular portion 31A (located on the upper side in FIG. 4) and a semicircular portion 31B (located on the lower side in FIG. 4) are combined in a plan view. 4, the inner dimension in the left-right direction is equal to the inner dimension in the vertical direction. As shown in FIG. 3, a circular upper plate 31 </ b> C and a lower plate 31 </ b> D are fixed to the cabinet 31 so as not to rotate. The upper plate 31C and the lower plate 31D are configured to cover the entire partition plate 32C in the horizontal direction on the upper side and the lower side of the later-described partition plate 32C, respectively. In the lower plate 31D, a recovery hole (not shown) is formed in a portion facing the recovery part 34.

  The rotation conveyance unit 32 includes a rotation shaft 32A, a drive unit 32B, a partition plate 32C, a holding member 32D, a protection plate 32E, and a pressing jig 32F.

  The rotation shaft 32A extends in the vertical direction and is rotatably provided. The drive unit 32B rotates the rotary shaft 32A intermittently by a predetermined angle.

  The five partition plates 32C are provided at equal intervals around the rotation shaft 32A, are fixed to the rotation shaft 32A, and extend radially. Each partition plate 32C has a shape in which the outer edge is adjacent to the side plate 31E forming the upper plate 31C, the lower plate 31D, and the semicircular portion 31B. A sheet-like rubber (flexible member) (not shown) is attached to the outer edge of each partition plate 32C, and abuts against the side wall 31E that forms the upper plate 31C, the lower plate 31D, and the semicircular portion 31B. The gap formed between them is closed. Further, the sheet-like rubber attached to each partition plate 32C is configured to be able to contact the central portion in the left-right direction in FIG. 4 of the side wall 31F forming the rectangular portion 31A. Thus, the plurality of compartments 35 are formed by the side walls 31E, 31F, the partition plate 32C, the upper plate 31C, and the lower plate 31D.

  Each partition plate 32C is intermittently rotated by a predetermined angle in the rotation direction R by the driving force of the drive unit 32B, and thereby each compartment 35 is also rotated by a predetermined angle. Each compartment 35 is located at the lowermost compartment 35 in FIG. 4 corresponding to the input / exit region, and in the order of the rotation direction R, the preparation region, the first scouring region, the second scouring region, It corresponds to a processing area.

  The holding member 32D is provided in each compartment 35, and is configured to rotate (revolve) around its axis along with the rotation of the rotation shaft 32A and to be rotated by a motor (not shown).

  The protection plate 32E is provided in each compartment 35 and suppresses the abrasive from colliding with the partition plate 32C.

  The holding jig 32F is provided in each compartment 35 and holds the workpiece W from the upper side to prevent the workpiece W from falling down.

  The projection unit 33 includes a first projector 33A and a second projector 33B, and is provided on the rectangular portion 31A side of the cabinet 31. The first projector 33A is provided to face the first scouring region, and the second projector 33B is provided to face the second scouring region. The first projector 33A is composed of a rotor or the like, and is configured to project a polishing material (first cleaning material) made of, for example, a 0.3 mm steel shot onto the workpiece W, and a plurality of the first projectors 33A are provided. The 2nd projector 13B consists of an injection nozzle etc., for example, is comprised so that the abrasives (2nd abrasive) which consists of 0.1 mm zirconia may be air-blasted with respect to the workpiece | work W, and an injection nozzle is an up-down direction. A plurality are provided along.

  The collection unit 34 includes a first collection unit 34A and a second collection unit (not shown). The first recovery unit 34A includes a screw (not shown) extending in a direction perpendicular to the paper surface of FIG. 1, and is polished from a recovery hole (not shown) formed on the lower plate 31D projected from the first projector 33A. A material or the like is configured to be conveyed to the first polishing material circulation unit 25. The second recovery unit 34B includes a screw (not shown) extending in a direction perpendicular to the paper surface of FIG. 1, and is polished from a recovery hole (not shown) formed on the lower plate 31D projected from the second projector 33B. A material or the like is transported to the second polishing material circulation unit 26.

  The first scouring material circulating unit 25 conveys the scouring material collected by the first collecting unit 34A upward by an elevator (not shown), and scoured by a separator such as a magnetic separator, a sieve, and a wind sieving machine. The material (steel shot) is separated and the abrasive is returned to the abrasive material tank. The second scouring material circulating unit 5 conveys the scouring material collected by the second collecting unit 34B upward by an elevator (not shown), and scoured by a separator such as a magnetic separator, a sieve, or a wind synthesizer. The material (alumina) is separated, and the abrasive is returned to the abrasive tank.

  The shot blasting device 21 includes a dust collector (not shown) that collects dust and the like generated by the polishing process.

<Cleaning action>
Next, the polishing operation in the shot blasting device 21 will be described with reference to the drawings.

  The workpiece W transported by the pre-cleaning transport unit 22 is placed on the holding member 32D located in the input / discharge region from the input / discharge port of the cabinet 31 by the input / discharge unit 24. The input / discharge unit 24 sequentially inputs the workpiece W to the holding member 32D located in the input / discharge area. When the workpiece W after the blasting process is placed on the holding member 32D, the unprocessed workpiece W is loaded after the workpiece W is discharged. The drive part 32B intermittently rotates (revolves) the partition plate 32C and the holding member 32D, and moves the workpiece W on the holding member 32D to the first scouring region through the preparation region. In the first polishing region, the abrasive W is projected from the first projector 33A while the workpiece W is rotated by the holding member 32D, and the workpiece W is cleaned. In the first scouring region, the first projector 33A projects the scouring material onto the workpieces W that are sequentially conveyed.

  After the scouring, the partition 32C and the holding member 32D are intermittently rotated (revolved) by the drive unit 32B, and the work W on the holding member 32D is moved to the second scouring region. In the second scouring region, while the work W is rotated by the holding member 32D, the scouring material is projected from the second projector 33B and the work W is scoured. In the second blasting region, the second projector 33B projects the blast material onto the workpieces W that are sequentially conveyed.

  After the sharpening, the partition plate 32C and the holding member 32D are intermittently rotated (revolved) by the driving unit 32B, and the workpiece W on the holding member 32D is moved to the input / discharge region through the post-processing region. In the charging / discharging area, the workpiece W after the scouring is ejected by the squeezing / discharging unit 24, placed on the transporting unit 23 after the scouring, and the workpiece W conveyed by the transporting unit 22 before the scouring is placed on the holding member 32D. Put it on.

<Effect>
According to the shot blasting device 21 as described above, a plurality of abrasives are projected onto the workpiece W in one shot blasting device 21 as in the shot blasting device 1 of the first embodiment. Therefore, it is not necessary to prepare a device for each type of polishing material (material, size, etc.). Therefore, the space for installing the apparatus can be greatly reduced, and the cost required for the shot blasting apparatus can be greatly reduced.

  A plurality of compartments 35 are formed by the side walls 31E, 31F, the partition plate 32C, the upper plate 31C, and the lower plate 31D, and the upper plate 31C, the lower plate 31D, and the semicircle are formed on the outer edge of each partition plate 32C. A sheet-like rubber (flexible member) (not shown) that comes into contact with the side walls 31E and 31F forming the portion 31B is attached. With this configuration, it is possible to suppress mixing of the first abrasive and the second abrasive, and it is possible to efficiently perform the polishing process using a plurality of abrasives.

  In addition, this invention is not limited to said embodiment, Many deformation | transformation are possible within the range of the summary.

  In the above embodiment, the first and second abrasives are different in both material and particle size, but the same material and only the particle size is different. May be. The shot blasting devices 1 and 21 are configured to use two types of abrasives with two projectors, but are configured to use three or more types of abrasives with three or more projectors. Also good.

  In addition, the number of compartments is not limited to the number of the above embodiments, and may be increased or decreased as necessary. Moreover, in said embodiment, although the flexible member was sheet-like rubber, it is not restricted to this. In the first embodiment, the opening / closing member 12A is a single member and has two functions, ie, a function of sealing the opening 11g and a function of conveying the workpiece W, but has a function of sealing the opening 11g. You may make it the structure which each provides a member and the member provided with the function to convey the workpiece | work W.

1, 21: Shot blasting apparatus, 11b to 11f, 35: Compartment, 11g: Opening, 12A: Opening / closing member, 12D: Feeding part, 12E: Lower sealing part, 13A, 33A: First projector, 13B, 33B: 2nd projector, 31: Cabinet, 31C: Upper plate, 31D: Lower plate, 31E, 31F: Side wall, 32A: Rotating shaft, 32C: Partition plate

Claims (5)

A plurality of compartments formed by compartment walls;
A first projector provided to project the first abrasive,
A second projector provided to project a second abrasive different from the first abrasive,
The first projector projects the first abrasive to the compartment facing the first projector, and the second projector projects the second abrasive to the compartment opposed to the first projector. This is a shot blasting device. The plurality of compartments have a first scavenging chamber and a second scavenging chamber located next to the first scavenging chamber,
An opening for transporting an object to be cleaned from the first cleaning chamber to the second cleaning chamber is formed in a partition wall located between the first cleaning chamber and the second cleaning chamber. ,
The first projector is configured to project the first cleaning material toward the first cleaning chamber, and the second projector is configured to project the second polishing chamber toward the second cleaning chamber. It is configured to be able to project the abrasive,
The shot blasting apparatus according to claim 1, further comprising an opening / closing member that opens and closes the opening. The opening / closing member includes a feeding portion and a sealing portion, and is provided rotatably in a feeding posture and a sealing posture,
When the opening / closing member is in the sealing position, the sealing portion closes the opening, and when the opening / closing member is in the feeding position, the feeding portion conveys the member to be cleaned from the first cleaning chamber to the second cleaning chamber. The shot blasting device according to claim 2, wherein the shot blasting device is configured to do so. A cabinet and a rotating shaft;
The partition wall is located between a side wall of the cabinet, an upper plate provided in the cabinet, a lower plate provided in the cabinet, and the upper plate and the lower plate, and is centered on an axis of the rotating shaft. A plurality of partition plates extending radially to form the plurality of compartments,
The partition plate is provided to be rotatable around an axis of the rotating shaft,
The shot blasting device according to claim 1, wherein the first projector and the second projector are provided at different positions along a rotation direction of the partition plate. The shot blasting device according to claim 4, wherein a flexible member that contacts the side wall, the upper plate, and the lower plate is attached to an outer edge of each partition plate.

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