JP2018088621A - Ultrasonic device, ultrasonic probe, ultrasonic apparatus, and manufacturing method for ultrasonic device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an ultrasonic device capable of accurately identifying a position in a depth direction of a place where an ultrasonic wave is reflected from a reflection wave of the ultrasonic wave.SOLUTION: An ultrasonic device 1 includes: a substrate 3 having a plurality of ultrasonic wave elements: a housing part 2 which houses the substrate 3 therein and has a side wall 2a along at least a part of a side of the substrate 3; and an acoustic matching layer 5 provided on the substrate 3. On the side wall 2a, A height protruding from the substrate 3 is the same as a thickness of an acoustic matching layer 5 and the thickness of the acoustic matching layer 5 is uniform.SELECTED DRAWING: Figure 5

Description

  The present invention relates to an ultrasonic device, an ultrasonic probe, an ultrasonic apparatus, and an ultrasonic device manufacturing method.

  2. Description of the Related Art Ultrasonic apparatuses that transmit ultrasonic waves toward the inside of a subject and generate an ultrasonic image using the ultrasonic waves reflected inside the subject are widely used. The reflected ultrasonic waves are converted into electrical signals by an ultrasonic transducer device. Many ultrasonic transducer elements are installed in the ultrasonic transducer device. The electric signal output from the ultrasonic transducer element is a weak signal that is amplified by an amplifier circuit. Hereinafter, the ultrasonic transducer device is referred to as an ultrasonic device. Ultrasonic devices convert electrical signals into ultrasonic waves and transmit them. Furthermore, the ultrasonic device receives ultrasonic waves and converts them into electrical signals.

  The ultrasonic device includes a substrate on which ultrasonic transducer elements are arranged. The ultrasonic device controls the traveling direction of the ultrasonic wave by controlling the phase of the ultrasonic wave transmitted by each ultrasonic transducer element. An acoustic matching layer and an acoustic lens are installed in the direction in which the ultrasonic waves travel from the substrate.

  In order to improve the resolution of the ultrasonic image, it is effective to accurately control the traveling direction of the ultrasonic wave. At this time, the traveling direction of the ultrasonic wave can be accurately controlled by making the thickness of the acoustic matching layer uniform. In addition, by making the thickness of the acoustic matching layer uniform, the position in the depth direction where the ultrasonic wave is reflected from the reflected wave of the ultrasonic wave can be specified with high accuracy.

  An ultrasonic device including an acoustic matching layer is disclosed in Patent Document 1. According to this, a frame-like member is installed on the substrate, and the material of the acoustic matching layer is put on the substrate. The material of the acoustic matching layer is liquid and functions as an adhesive that bonds the substrate and the acoustic lens when solidified. And the acoustic lens was installed on the frame-shaped member, and the material of the acoustic matching layer was solidified.

  At this time, since the thickness of the acoustic matching layer is regulated by the frame member, the thickness of the acoustic matching layer can be formed with high accuracy. As a result, the position in the depth direction where the ultrasonic wave is reflected from the reflected wave of the ultrasonic wave can be specified with high accuracy. Accordingly, it is possible to improve the accuracy of the resolution in the depth direction of the ultrasonic image calculated using the reflected wave of the ultrasonic wave.

  Furthermore, Patent Document 2 discloses an ultrasonic device including an acoustic matching layer. According to this, a rod-shaped member is installed on the substrate, and the material of the acoustic matching layer is put on the substrate. And it covered with the plate-shaped member and the material of the acoustic matching layer was solidified. After solidifying, the plate-like member was removed to form an acoustic matching layer.

JP 2014-146885 A JP 2000-115893 A

  When the material of the acoustic matching layer is solidified, the volume of the material of the acoustic matching layer changes. In the ultrasonic device of Patent Document 1, stress is applied to the acoustic lens and the acoustic lens changes. Thereby, the uniformity of the thickness of an acoustic matching layer falls. When the thickness of the acoustic matching layer is not uniform, the position accuracy in the depth direction of the place where the ultrasonic wave specified from the reflected wave of the ultrasonic wave is reflected is lowered. Moreover, in the ultrasonic device of patent document 2, it is necessary to provide the place which arrange | positions a rod-shaped member on a board | substrate. Therefore, the ratio of the region where the ultrasonic element is arranged in the entire area of the substrate is reduced. At this time, the area of the substrate cannot be effectively utilized. Therefore, there has been a demand for an ultrasonic device that can widen the area ratio in which the ultrasonic elements are arranged and can specify the position in the depth direction where the ultrasonic waves are reflected from the reflected ultrasonic waves with higher accuracy.

  The present invention has been made to solve the above-described problems, and can be realized as the following forms or application examples.

[Application Example 1]
An ultrasonic device according to this application example, comprising: a substrate having a plurality of ultrasonic elements; an accommodating portion that accommodates the substrate and has a sidewall along at least a part of a side of the substrate; and the sidewall from the substrate And an acoustic matching layer provided to a thickness up to a height of the substrate, wherein the side wall does not overlap the substrate in a plan view from the thickness direction of the substrate.

  According to this application example, the ultrasonic device includes a substrate, a housing portion, and an acoustic matching layer. An ultrasonic element is installed on the substrate. The accommodating portion accommodates the substrate and has a side wall along at least a part of the side of the substrate. The acoustic matching layer is provided on the substrate. The height at which the side wall protrudes from the substrate is the same as the thickness of the acoustic matching layer. In addition, the side walls do not overlap the substrate in a plan view from the thickness direction of the substrate.

  The acoustic matching layer is formed by applying a liquid material on a substrate and solidifying it. At this time, a plate-like member is placed on the side wall, and the liquid material of the acoustic matching layer is sandwiched between the substrate and the plate-like member. Then, the acoustic matching layer is formed by solidifying the liquid material. Thereby, the thickness of the acoustic matching layer is the same as the height at which the side wall protrudes from the substrate. In addition, the side wall does not overlap the substrate in plan view from the thickness direction of the substrate.

  Since the liquid material of the acoustic matching layer is sandwiched between the substrate and the plate-like member, the thickness of the acoustic matching layer can be set to the distance from the substrate to the plate-like member. The distance from the substrate to the plate-like member is a distance obtained by subtracting the thickness of the substrate from the height at which the side wall protrudes from the bottom of the housing portion. Since the height of the side wall protruding from the bottom of the housing portion and the thickness of the substrate can be adjusted with high accuracy, the thickness of the acoustic matching layer can be adjusted with high accuracy. Moreover, the thickness of the acoustic matching layer can be made uniform by installing the substrate and the plate-like member placed on the side wall in parallel. By increasing the rigidity of the plate-like member, it is possible to suppress a change in the thickness of the acoustic matching layer when the liquid material of the acoustic matching layer is solidified.

  Thereby, the distance which the ultrasonic wave transmitted from each ultrasonic element passes through the acoustic matching layer becomes the same. And the phase of the ultrasonic wave transmitted from each ultrasonic element can be controlled with high accuracy. By controlling the phase of ultrasonic waves traveling from a plurality of ultrasonic elements with high accuracy, the depth at which the ultrasonic waves concentrate can be controlled with high accuracy. Therefore, the ultrasonic device can accurately specify the position in the depth direction where the ultrasonic wave is reflected from the reflected wave of the ultrasonic wave.

  And the side wall is installed in the place which does not overlap with a board | substrate by planar view seen from the thickness direction of the board | substrate. Therefore, it is not necessary to arrange a member having a side wall function on the substrate. Therefore, the area ratio of the place where the ultrasonic element is arranged on the substrate can be widened.

[Application Example 2]
In the ultrasonic device according to the application example, an acoustic lens provided on the acoustic matching layer via a first adhesive film is provided, and a region surface of the acoustic matching layer that adheres to the acoustic lens is formed on the side wall. It is characterized by being uniform along the upper end surface.

  According to this application example, the acoustic lens is disposed on the acoustic matching layer via the first adhesive film. The acoustic lens can concentrate ultrasonic waves at a predetermined depth. The area surface of the acoustic matching layer that adheres to the acoustic lens is uniform along the upper end surface of the side wall. A first adhesive film is disposed between the acoustic matching layer and the acoustic lens. The first adhesive film is a film in which an adhesive that bonds the acoustic matching layer and the acoustic lens is solidified. The first adhesive film can suppress air from interposing between the acoustic matching layer and the acoustic lens. As a result, it can suppress that an ultrasonic wave reflects with air between an acoustic matching layer and an acoustic lens.

[Application Example 3]
In the ultrasonic device according to the application example, the side wall is installed along two opposing sides of the substrate.

  According to this application example, the side wall is installed along two opposing sides of the substrate. At this time, two side walls are installed. Since the two opposite sides of the substrate are separated, the two sidewalls are placed apart. When installing a plate-shaped member on a side wall, a plate-shaped member can be stably installed, so that the side wall is separated. Therefore, the acoustic matching layer can be easily manufactured.

[Application Example 4]
The ultrasonic device according to the application example described above is characterized in that a convex portion is provided along the side of the substrate that is connected to the side wall and extends in a direction intersecting with a direction in which the side wall extends.

  According to this application example, the convex portion is connected to the side wall. The convex portion is disposed along the side of the substrate extending in a direction intersecting with the direction in which the side wall extends. Since a convex part can support a plate-shaped member in addition to a side wall, a plate-shaped member can be installed stably. Therefore, the acoustic matching layer can be easily manufactured.

[Application Example 5]
In the ultrasonic device according to the application example described above, a groove is provided on the side wall, and a part of the acoustic matching layer protrudes from the groove.

  According to this application example, the groove is provided on the side wall. And a part of acoustic matching layer protrudes in a groove part. In the step of forming the acoustic matching layer, a liquid material of the acoustic matching layer is applied on the substrate. Then, a plate-like member is placed on the side wall, and the liquid material of the acoustic matching layer is sandwiched between the substrate and the plate-like member. At this time, the liquid material of the acoustic matching layer flows out beyond the side wall. At this time, if the liquid material of the acoustic matching layer enters between the side wall and the plate-like member, the thickness of the acoustic matching layer increases. A groove is provided on the side wall, and the liquid material of the acoustic matching layer flows out of the groove. Accordingly, the liquid material of the acoustic matching layer is suppressed from entering between the side wall and the plate-like member. As a result, the thickness of the acoustic matching layer can be formed with high accuracy.

[Application Example 6]
In the ultrasonic device according to the application example, a cable is installed on the substrate, the acoustic matching layer includes an acoustic matching sheet, and the acoustic matching sheet and the cable do not overlap in a plan view of the substrate. And

  According to this application example, the cable is installed on the substrate. An ultrasonic element is installed on the substrate, and a signal for driving the ultrasonic element is transmitted via a cable. After the acoustic matching layer is formed in advance, the substrate and the acoustic matching sheet are disposed so as to overlap each other inside the housing portion. The acoustic matching sheet and the cable are arranged so as not to overlap in a plan view of the substrate. At this time, since the cable and the acoustic matching sheet do not overlap, it is possible to suppress the acoustic matching sheet from being pressed and deformed by the cable. As a result, an acoustic matching layer with good thickness accuracy can be formed.

[Application Example 7]
The ultrasonic device according to the application example described above is characterized in that a second adhesive film is disposed between the substrate and the acoustic matching sheet.

  According to this application example, the second adhesive film is disposed between the substrate and the acoustic matching sheet. The second adhesive film is a film in which an adhesive that bonds the substrate and the acoustic matching sheet is solidified. The second adhesive film can suppress air from interposing between the substrate and the acoustic matching sheet. As a result, it can suppress that an ultrasonic wave reflects with air between a board | substrate and an acoustic matching sheet.

[Application Example 8]
An ultrasonic probe according to this application example, comprising an ultrasonic device that receives an ultrasonic wave and outputs an electrical signal, wherein the ultrasonic device is the ultrasonic device according to any one of the above. To do.

  According to this application example, the ultrasonic probe includes an ultrasonic device that receives an ultrasonic wave and outputs an electrical signal. The ultrasonic device is the ultrasonic device described above. The ultrasonic device described above can improve the resolution accuracy in the depth direction of the ultrasonic image calculated using the reflected wave of the ultrasonic wave. Therefore, the ultrasonic probe can be an apparatus including an ultrasonic device that can improve the accuracy of the resolution in the depth direction of the ultrasonic image calculated using the reflected wave of the ultrasonic wave.

[Application Example 9]
An ultrasonic apparatus according to this application example, wherein an ultrasonic device that receives an ultrasonic wave and outputs an electric signal, a conversion unit that converts an electric signal output from the ultrasonic device into a data signal, and the data signal A display unit for displaying, wherein the ultrasonic device is the ultrasonic device according to any one of the above.

  According to this application example, the ultrasonic apparatus includes an ultrasonic device, a conversion unit, and a display unit. An ultrasonic device detects an ultrasonic wave and outputs an electrical signal. The conversion unit converts the electrical signal into a data signal. Then, the display unit displays the data signal. The above-described ultrasonic device is used as the ultrasonic device. The ultrasonic device described above can improve the accuracy of resolution in the depth direction of an ultrasonic image calculated using an ultrasonic reflected wave. Therefore, the ultrasonic apparatus can be an apparatus including an ultrasonic device that can improve the accuracy of the resolution in the depth direction of the ultrasonic image calculated using the reflected wave of the ultrasonic wave.

[Application Example 10]
A method of manufacturing an ultrasonic device according to this application example, wherein a substrate having a plurality of ultrasonic elements is installed in a housing portion having a side wall, and a liquid material of an acoustic matching layer is applied onto the substrate, A plate-like member is placed on the side wall, the liquid material of the acoustic matching layer is pressed, the liquid material of the acoustic matching layer is solidified to form the acoustic matching layer, and the plate-like member is removed from on the side wall. An acoustic lens is adhered on the acoustic matching layer.

  According to this application example, the accommodating portion has the side wall, and the substrate is installed in the accommodating portion. A plurality of ultrasonic elements are installed on the substrate. Next, a liquid material for the acoustic matching layer is applied onto the substrate. Then, a plate-like member is placed on the side wall and the liquid material of the acoustic matching layer is pressed. Next, the acoustic matching layer is formed by solidifying the liquid material of the acoustic matching layer. Next, the plate-like member is removed from the side wall. Subsequently, an acoustic lens is bonded onto the acoustic matching layer.

  When the liquid material of the acoustic matching layer is solidified, a plate-like member is placed on the side wall, and the liquid material of the acoustic matching layer is sandwiched and pressed between the substrate and the plate-like member. At this time, a part of the liquid material of the acoustic matching layer flows out from the side wall, and the space between the substrate and the plate member is filled with the liquid material of the acoustic matching layer. Next, by solidifying the liquid material, the thickness of the acoustic matching layer can be made the distance from the substrate to the plate member. The distance from the substrate to the plate-like member is a distance obtained by subtracting the thickness of the substrate from the height at which the side wall protrudes from the bottom of the housing portion. Since the height of the side wall protruding from the bottom of the housing portion and the thickness of the substrate can be adjusted with high accuracy, the thickness of the acoustic matching layer can be adjusted with high accuracy. Moreover, the thickness of the acoustic matching layer can be made uniform by installing the substrate and the plate-like member placed on the side wall in parallel. Further, by increasing the rigidity of the plate-like member, it is possible to suppress a change in the thickness of the acoustic matching layer when the liquid material of the acoustic matching layer is solidified.

  Thereby, the distance which the ultrasonic wave transmitted from each ultrasonic element passes through the acoustic matching layer becomes the same. And the phase of the ultrasonic wave transmitted from each ultrasonic element can be controlled with high accuracy. By controlling the phase of ultrasonic waves traveling from a plurality of ultrasonic elements with high accuracy, the depth at which the ultrasonic waves concentrate can be controlled with high accuracy. Therefore, the ultrasonic device can improve the resolution accuracy in the depth direction of the ultrasonic image calculated using the reflected wave of the ultrasonic wave.

1 is a schematic plan view showing a configuration of an ultrasonic device according to a first embodiment. The schematic side sectional view which shows the structure of an ultrasonic device. The schematic side sectional view which shows the structure of an ultrasonic device. The principal part schematic side sectional view which shows the structure of an ultrasonic device. The principal part schematic side sectional view which shows the structure of a side wall. The schematic plan view which shows the structure of a side wall and an acoustic matching layer. The side view which shows the structure of an accommodating part. The principal part schematic top view which shows the structure of a side wall. The flowchart of the manufacturing method of an ultrasonic device. The schematic diagram for demonstrating the manufacturing method of an ultrasonic device. The schematic diagram for demonstrating the manufacturing method of an ultrasonic device. The schematic diagram for demonstrating the manufacturing method of an ultrasonic device. The schematic diagram for demonstrating the manufacturing method of an ultrasonic device. The schematic diagram for demonstrating the manufacturing method of an ultrasonic device. The schematic diagram for demonstrating the manufacturing method of an ultrasonic device. The schematic diagram for demonstrating the manufacturing method of an ultrasonic device. The schematic top view which shows the structure of the side wall and acoustic matching layer in connection with 2nd Embodiment. The principal part schematic side sectional view which shows the structure of a side wall and an acoustic matching layer. The schematic diagram for demonstrating the manufacturing method of an ultrasonic device. The schematic diagram for demonstrating the manufacturing method of an ultrasonic device. The schematic perspective view which shows the structure of the ultrasonic device concerning 3rd Embodiment.

  Hereinafter, embodiments will be described with reference to the drawings. In addition, each member in each drawing is illustrated with a different scale for each member in order to make the size recognizable on each drawing.

(First embodiment)
In the present embodiment, characteristic examples of an ultrasonic device and a method for manufacturing the ultrasonic device will be described with reference to the drawings. The ultrasonic device according to the first embodiment will be described with reference to FIGS. FIG. 1 is a schematic plan view showing the configuration of an ultrasonic device. 2 and 3 are schematic cross-sectional side views showing the configuration of the ultrasonic device. FIG. 2 is a view as seen from the cross-sectional side along the line AA in FIG. 3 is a view as seen from the cross-sectional side along the line BB in FIG.

  As shown in FIGS. 1 to 3, the ultrasonic device 1 has a rectangular plate shape. The longitudinal direction of the quadrangle is the X direction, and the direction orthogonal to the X direction on the plate-like plane is the Y direction. The thickness direction of the ultrasonic device 1 is taken as the Z direction. The ultrasonic device 1 transmits ultrasonic waves in the + Z direction.

  The ultrasonic device 1 includes a housing 2. A substrate 3 is installed on the accommodating portion 2, and the accommodating portion 2 accommodates the substrate 3. The substrate 3 has a plurality of ultrasonic elements 3a, and the ultrasonic elements 3a are arranged in a matrix. Each ultrasonic element 3a transmits an ultrasonic wave in the + Z direction.

  The accommodating part 2 has a side wall 2 a along at least a part of the side of the substrate 3. In this embodiment, the two side walls 2a are installed on the + X direction side and the −X direction side. The side wall 2 a is installed along two opposing sides of the substrate 3.

  The two side walls 2a are installed extending in the Y direction. On the side wall 2a located on the + X direction side, convex portions 2b are provided on the + Y direction side and the −Y direction side. The convex portion 2b is installed along the side of the substrate 3 that is connected to the side wall 2a and extends in the X direction orthogonal to the Y direction in which the side wall 2a extends. The convex portion 2b extends on the −X direction side with respect to the side wall 2a.

  Similarly, convex portions 2b are provided on the + Y direction side and the −Y direction side also on the side wall 2a located on the −X direction side. The convex portion 2b is also installed along the side of the substrate 3 that is connected to the side wall 2a and extends in the X direction orthogonal to the Y direction in which the side wall 2a extends. The convex portion 2b extends to the + X direction side with respect to the side wall 2a. The side wall 2a and the convex part 2b are part of the accommodating part 2. The side wall 2a and the convex portion 2b may be formed integrally with the accommodating portion 2.

  Two flat cables 4 as cables of the first flat cable 4 a and the second flat cable 4 b are installed on the surface on the + Z direction side of the substrate 3. The first flat cable 4a is installed on the + Y direction side of the substrate 3 and extends from the substrate 3 to the + Y direction side. The second flat cable 4b is installed on the −Y direction side of the substrate 3 and extends from the substrate 3 to the −Y direction side. The flat cable 4 is electrically connected to each ultrasonic element 3a. And the waveform which drives each ultrasonic element 3a through the flat cable 4 is supplied.

  An acoustic matching layer 5 is provided on the substrate 3. Further, an acoustic lens 6 is installed on the acoustic matching layer 5. The acoustic matching layer 5 is a layer that adjusts the acoustic impedance so that the ultrasonic wave travels efficiently. When the difference in acoustic impedance between the ultrasonic element 3 a and the acoustic lens 6 is large, ultrasonic waves are reflected by the acoustic lens 6. By disposing the acoustic matching layer 5 between the ultrasonic element 3 a and the acoustic lens 6, the acoustic matching layer 5 suppresses the reflection of ultrasonic waves by the acoustic lens 6.

  The acoustic lens 6 is a columnar lens whose X direction is the axial direction. The acoustic lens 6 is thicker at the center in the Y direction than on the + Y direction side and the −Y direction side. Therefore, the acoustic lens 6 is a convex lens, and the ultrasonic wave transmitted from each ultrasonic element 3 a travels so as to concentrate in the center of the ultrasonic device 1 in the Y direction. Then, by controlling the phase of the ultrasonic wave transmitted from each ultrasonic element 3a, the ultrasonic device 1 moves in the X direction where the ultrasonic wave is concentrated.

  The material of the housing part 2 is not particularly limited as long as it is rigid and has structural strength. In the present embodiment, for example, 42 alloy, which is a nickel iron alloy, is used as the material of the housing portion 2. The substrate 3 is preferably made of a material that can easily form the ultrasonic element 3a with high accuracy. In the present embodiment, for example, a silicon substrate is used as the material of the substrate 3. The 42 alloy which is the material of the housing part 2 has a low coefficient of thermal expansion among metals, and the silicon substrate is difficult to peel from the housing part 2. The acoustic matching layer 5 and the acoustic lens 6 are not particularly limited as long as they are materials that efficiently propagate ultrasonic waves. In the present embodiment, for example, silicon resin is used as the material of the acoustic matching layer 5 and the acoustic lens 6. The acoustic impedance is adjusted by mixing whiskers or the like as fillers in the silicon resin.

  FIG. 4 is a schematic side cross-sectional view showing a main part of the structure of the ultrasonic device, and shows a cross section including the ultrasonic element 3a. As shown in FIG. 4, piezoelectric elements 7 are arranged on the substrate 3. A recess 3 b is formed in the substrate 3 at a location facing the piezoelectric element 7. Since the substrate 3 is thin at the place where the recess 3b is formed, it is easy to vibrate. This place where vibration easily occurs is referred to as a diaphragm 8 or a membrane. The piezoelectric element 7 is installed on the surface of the vibration plate 8 on the + Z direction side. The piezoelectric element 7 and the diaphragm 8 constitute an ultrasonic element 3a.

  The piezoelectric element 7 is provided with a wiring (not shown) connected to the flat cable 4. Then, a drive waveform is supplied to the piezoelectric element 7 through the wiring. The piezoelectric element 7 is deformed by the driving waveform. The diaphragm 8 is also deformed by the deformation of the piezoelectric element 7. When the diaphragm 8 vibrates, the ultrasonic wave 9 advances in the Z direction.

  An acoustic matching layer 5 is provided on the substrate 3 so as to cover the ultrasonic element 3a. On the acoustic matching layer 5, the acoustic lens 6 is installed via the first adhesive film 10. The acoustic lens 6 can concentrate the ultrasonic wave 9 at a predetermined depth. The area surface of the acoustic matching layer 5 that adheres to the acoustic lens 6 is uniform along the upper end surface of the side wall 2a. A first adhesive film 10 is disposed between the acoustic matching layer 5 and the acoustic lens 6. The first adhesive film 10 is a film in which an adhesive that bonds the acoustic matching layer 5 and the acoustic lens 6 is solidified. The first adhesive film 10 can suppress air from interposing between the acoustic matching layer 5 and the acoustic lens 6. As a result, it is possible to suppress the ultrasonic waves 9 from being reflected by the air between the acoustic matching layer 5 and the acoustic lens 6.

  The type of the piezoelectric element 7 is not particularly limited, but a PZT (lead zirconate titanate) element, a PDVF (polyvinylidene fluoride) element, or the like can be used. In this embodiment, a PZT element is used for the piezoelectric element 7. The piezoelectric element can be driven with good responsiveness. Therefore, the ultrasonic element 3a can be driven with good responsiveness.

  The material of the diaphragm 8 is not particularly limited as long as the material has good vibration characteristics. The diaphragm 8 is preferably insulative. In the present embodiment, for example, silicon dioxide or zirconium dioxide is used as the material of the diaphragm 8. The diaphragm 8 is exposed in the recess 3b. Thereby, the diaphragm 8 is easy to vibrate. In the step of forming the recess 3b, the recess 3b is formed by wet etching. At this time, the diaphragm 8 functions as an etch stop layer for stopping the progress of etching.

  A substrate 3 is placed on the accommodating portion 2 via a third adhesive film 11. The third adhesive film 11 is a film obtained by solidifying an adhesive that bonds the housing portion 2 and the substrate 3. For the third adhesive film 11, an organic adhesive mainly composed of an organic resin material is used. The organic adhesive is not particularly limited, and an epoxy resin, phenol resin, or acrylic resin adhesive can be used. In addition, silicon resin may be used as an adhesive.

  FIG. 5 is a schematic side cross-sectional view of the main part showing the structure of the side wall. In FIG. 5, a height at which the side wall 2 a protrudes from the substrate 3 is a first length 12, and a thickness of the acoustic matching layer 5 at a location facing the substrate 3 is a second length 13. At this time, the first length 12 and the second length 13 are the same length. And the thickness of the acoustic matching layer 5 is uniform. That is, the acoustic matching layer 5 is provided with a thickness from the substrate 3 to the height of the side wall. The area surface of the acoustic matching layer 5 to be bonded to the acoustic lens 6 is continuous along the upper end surface on the protruding side of the side wall 2a and is a uniform surface.

  In detail, it is preferable that the thickness of the acoustic matching layer 5 be uniform within 10 μm. Furthermore, it is preferable that the thickness variation of the acoustic matching layer 5 is within 6 μm. Furthermore, it is preferable that the thickness variation of the acoustic matching layer 5 is within 4 μm. At this time, the influence of the phase of the ultrasonic wave transmitted from each ultrasonic element 3a can be reduced.

  The acoustic matching layer 5 is formed by applying a liquid material on the substrate 3 and solidifying it. At this time, a plate-like member is placed on the side wall 2a, and the liquid material of the acoustic matching layer 5 is sandwiched between the substrate 3 and the plate-like member. Then, by solidifying the liquid material, the acoustic matching layer 5 is formed to a height at which the side wall 2 a protrudes from the substrate 3. As a result, the height at which the side wall 2 a protrudes from the substrate 3 is the same as the thickness of the acoustic matching layer 5.

  Since the liquid material of the acoustic matching layer 5 is sandwiched between the substrate 3 and the plate member, the thickness of the acoustic matching layer 5 can be set to the distance from the substrate 3 to the plate member. A bottom surface facing the + Z direction in the housing portion 2 is defined as a bottom portion 2c. The second length 13, which is the distance from the substrate 3 to the plate-like member, is a distance obtained by subtracting the thickness of the substrate 3 and the third adhesive film 11 from the height at which the side wall 2 a protrudes from the bottom 2 c of the housing portion 2. . Since the height at which the side wall 2a protrudes from the bottom 2c, the thickness of the third adhesive film 11 and the thickness of the substrate 3 can be adjusted with high accuracy, the thickness of the acoustic matching layer can be adjusted with high accuracy. Since the thickness of the third adhesive film 11 is smaller than the thickness of the substrate 3, the influence is small. Moreover, the thickness of the acoustic matching layer 5 can be made uniform by installing the board | substrate 3 and the plate-shaped member mounted on the side wall 2a in parallel.

  Thereby, the distance that the ultrasonic wave 9 transmitted from each ultrasonic element passes through the acoustic matching layer is the same. And the phase of the ultrasonic wave 9 transmitted from each ultrasonic element 3a can be controlled with high accuracy. By controlling the phase of the ultrasonic waves 9 traveling from the plurality of ultrasonic elements 3a with high accuracy, the depth at which the ultrasonic waves 9 are concentrated can be controlled with high accuracy. Therefore, the position in the depth direction of the location where the ultrasonic wave 9 is reflected from the reflected wave of the ultrasonic wave 9 can be specified with high accuracy.

  The side wall 2 a is installed at a location that does not overlap the substrate 3 in a plan view as viewed from the thickness direction of the substrate 3. Therefore, it is not necessary to arrange a member having the function of the side wall 2a on the substrate 3. Therefore, the area ratio of the place where the ultrasonic element 3a is arranged on the substrate 3 can be increased.

  FIG. 6 is a schematic plan view showing the structure of the side wall and the acoustic matching layer, and is a view in which the acoustic lens 6 is removed from the ultrasonic device 1 of FIG. FIG. 7 is a side view showing the structure of the housing portion, and is a view of the housing portion 2 of FIG. 6 as viewed from the + X direction side. FIG. 8 is a schematic plan view of the main part showing the structure of the side wall, and is a view of the side wall 2a of FIG. 6 as viewed from the + Z direction side.

  As shown in FIGS. 6-8, the groove part 14 is installed in the side wall 2a, and a part of acoustic matching layer 5 protrudes in the groove part 14. As shown in FIG. The side wall 2 a does not overlap the substrate 3 in plan view from the thickness direction of the substrate 3. In the step of forming the acoustic matching layer 5, a liquid material for the acoustic matching layer 5 is applied onto the substrate 3. Then, a plate-like member is placed on the side wall 2a, and the liquid material of the acoustic matching layer 5 is sandwiched between the substrate 3 and the plate-like member. At this time, the liquid material of the acoustic matching layer 5 flows out beyond the side wall 2a. At this time, if the liquid material of the acoustic matching layer 5 enters between the side wall 2a and the plate-like member, the thickness of the acoustic matching layer 5 increases. A groove 14 is provided on the side wall, and the liquid material of the acoustic matching layer 5 flows out of the groove 14. For this reason, it is suppressed that the liquid material of the acoustic matching layer 5 enters between the side wall 2a and the plate-like member. As a result, the thickness of the acoustic matching layer 5 can be formed with high accuracy.

  There is a gap between the flat cable 4 and the plate member on the + Y direction side and the −Y direction side. Since the liquid material of the acoustic matching layer 5 enters this gap, the thickness of the acoustic matching layer 5 can be set to the second length 13 even when the material of the acoustic matching layer 5 is large. Further, the acoustic matching layer 5 can cover the connection portion between the flat cable 4 and the substrate 3.

  Next, a method for manufacturing the above-described ultrasonic device 1 will be described with reference to FIGS. FIG. 9 is a flowchart of an ultrasonic device manufacturing method, and FIGS. 10 to 16 are schematic diagrams for explaining the ultrasonic device manufacturing method. In the flowchart of FIG. 9, step S <b> 1 corresponds to a substrate installation process, and is a process of installing the substrate 3 on the housing portion 2. Next, the process proceeds to step S2. Step S2 is an acoustic matching layer material installation step. This step is a step of installing the liquid material of the acoustic matching layer 5 so as to cover the substrate 3 in the housing portion 2. Next, the process proceeds to step S3.

  Step S3 is an acoustic matching layer material pressing step. This step is a step of pressing the liquid material of the acoustic matching layer 5 installed in the accommodating portion 2 to make the thickness uniform. Next, the process proceeds to step S4. Step S4 is an acoustic matching layer forming step. This step is a step of solidifying the liquid material of the acoustic matching layer 5. Next, the process proceeds to step S5. Step S5 is an acoustic lens installation step. This step is a step of installing the acoustic lens 6 so as to overlap the acoustic matching layer 5. The ultrasonic device 1 is completed through the above steps.

  Next, the manufacturing method will be described in detail with reference to FIGS. 10 to 16 in association with the steps shown in FIG. 10 and 11 are diagrams corresponding to the substrate installation step of step S1. As shown in FIG. 10, the accommodating part 2 is prepared. Side walls 2 a and convex portions 2 b are installed at both ends of the accommodating portion 2. The side walls 2a and the convex portions 2b may be formed by a forging method using a press device, or may be formed by a cutting method or a grinding method. Then, the liquid material of the third adhesive film 11 is applied to the bottom 2c between the side walls 2a of the housing part 2.

  As shown in FIG. 11, the substrate 3 is placed over the liquid material of the third adhesive film 11. Next, the housing portion 2 is heated and dried to solidify the liquid material of the third adhesive film 11, and the substrate 3 is bonded and fixed to the housing portion 2. The substrate 3 is provided with a piezoelectric element 7 and a recess 3b in advance. The installation method of the piezoelectric element 7 is well known, and the description thereof is omitted. A substrate 3 having a plurality of ultrasonic elements 3a is placed in the accommodating portion 2 having the side walls 2a and the convex portions 2b. Since the substrate 3 is installed using the side wall 2a and the convex portion 2b as a guide, the accommodating portion 2 has a structure in which the substrate 3 can be easily installed.

  FIG. 12 is a diagram corresponding to the acoustic matching layer material installation step in step S2. As shown in FIG. 12, in step S <b> 2, the operator applies a matching layer material 15 that is a liquid material of the acoustic matching layer 5. The matching layer material 15 is applied on the bottom 2 c between the side walls 2 a of the housing part 2 and the substrate 3. The method for applying the matching layer material 15 is not particularly limited, and various printing methods can be used. In this embodiment, for example, an offset printing method is used.

  FIG. 13 is a diagram corresponding to the acoustic matching layer material pressing step in step S3. As shown in FIG. 13, in step S <b> 3, the plate-like member 16 is installed so as to overlap the housing portion 2. Let the surface which faces the accommodating part 2 in the plate-shaped member 16 be the 1st surface 16a. The first surface 16a is a flat surface with high flatness and is a mirror surface. The matching layer material 15 is pressed by placing the first surface 16a of the plate-like member 16 on the side wall 2a.

  The side wall 2 a is installed along two opposing sides of the substrate 3. At this time, two side walls 2a are installed. Since the two opposite sides of the substrate 3 are separated from each other, the two side walls 2a are disposed apart from each other. When installing the plate-like member 16 on the side wall 2a, the plate-like member 16 can be installed more stably as the side wall 2a is separated. Therefore, the acoustic matching layer 5 can be easily manufactured.

  The accommodating part 2 is provided with a convex part 2b connected to the side wall 2a. The convex portion 2 b extends in a direction orthogonal to the direction in which the side wall 2 a extends, and is disposed along the side of the substrate 3. Since the convex part 2b can support the plate-shaped member 16 in addition to the side wall 2a, the plate-shaped member 16 can be installed stably. Therefore, the acoustic matching layer 5 can be easily manufactured.

  A groove 14 is provided on the side wall 2a, and a part of the acoustic matching layer 5 protrudes from the groove 14. A plate-like member 16 is placed on the side wall 2 a and the matching layer material 15 is sandwiched between the substrate 3 and the plate-like member 16. At this time, the matching layer material 15 flows out beyond the side wall 2a. At this time, if the matching layer material 15 enters between the side wall 2a and the plate-like member 16, the thickness of the acoustic matching layer 5 increases. A groove portion 14 is provided on the side wall 2 a, and the matching layer material 15 flows out of the groove portion 14. Accordingly, the matching layer material 15 is suppressed from entering between the side wall 2a and the plate-like member 16. As a result, the thickness of the acoustic matching layer 5 can be formed with high accuracy.

  The accommodating portion 2 on which the plate-like members 16 are stacked is installed on the fixing jig 17. The fixing jig 17 is a cylinder having a rectangular cross section, and the inside is a cavity 17a. The accommodating portion 2 in which the plate-like member 16 is overlapped is inserted into the cavity 17a. The accommodating portion 2 is arranged so that the outer wall of the accommodating portion 2 is in contact with the inner wall of the fixing jig 17. The fixing jig 17 is provided with a plurality of screw portions 17b at positions facing the side wall 2a. The operator rotates the screw portion 17 b to advance the screw portion 17 b toward the inside of the fixing jig 17. Even after the screw portion 17 b comes into contact with the plate-like member 16, the screw portion 17 b is further rotated to apply a load to the plate-like member 16. Thereby, the plate-shaped member 16 is pressed by the side wall 2a. And the plate-shaped member 16 maintains the state pressed by the side wall 2a.

  14 and 15 are diagrams corresponding to the acoustic matching layer forming step of step S4. As shown in FIG. 14, in step S <b> 4, the fixing jig 17 in which the accommodating portion 2, the plate-like member 16, and the like are installed is placed on the tray 18 and arranged inside the drying device 21. The drying device 21 includes a drying chamber 22. The drying chamber 22 includes a mounting table 23, and a tray 18 on which the fixing jig 17 is mounted is installed on the mounting table 23. The drying chamber 22 is connected to a dry gas supply unit 26 via an upper supply pipe 24 and a supply valve 25 in the drawing. Further, the drying chamber 22 is connected to an exhaust unit 29 via an exhaust pipe 27 and an exhaust valve 28 on the lower side in the drawing.

  The dry gas supply unit 26 supplies hot air that heats the dry gas 30. The dry gas supply unit 26 has a temperature adjustment function, and controls the temperature of the dry gas 30 so that the temperature in the drying chamber 22 becomes a predetermined temperature. The dry gas 30 supplied from the dry gas supply unit 26 is supplied to the drying chamber 22 via the supply valve 25 and the supply pipe 24. Next, the dry gas 30 flows along the fixing jig 17. At this time, the drying gas 21 heats the fixing jig 17 to evaporate and remove the solvent and the dispersion medium contained in the matching layer material 15, whereby the drying device 21 dries the matching layer material 15. The drying device 21 heats and solidifies the matching layer material 15 to form the acoustic matching layer 5. Next, the dry gas 30 containing the solvent and the dispersion medium passes through the exhaust pipe 27 and the exhaust valve 28 and is exhausted by an exhaust unit 29 to an exhaust processing device (not shown).

  After the matching layer material 15 is heated and dried for a predetermined time, the operator takes out the fixing jig 17 from the drying device 21. Then, the fixing jig 17 is left for a predetermined time and gradually cooled. Next, the operator loosens the screw portion 17 b and takes out the accommodating portion 2 in which the plate-like member 16 is installed from the fixing jig 17. Subsequently, the operator removes the plate-like member 16 from the side wall 2a. As a result, the solidified acoustic matching layer 5 is placed on the substrate 3 as shown in FIG.

  The surface of the side wall 2a and the surface of the acoustic matching layer 5 are the same surface. Accordingly, the first length 12 and the second length 13 are the same length. The surface of the plate-like member 16 is a flat mirror surface, and the surface of the plate-like member 16 is transferred to the surface of the acoustic matching layer 5, so that the surface of the acoustic matching layer 5 is a flat mirror surface. That is, the surface of the acoustic matching layer 5 is a surface with small unevenness.

  FIG. 16 is a diagram corresponding to the acoustic lens installation step of step S5. As shown in FIG. 16, in step S <b> 5, the acoustic lens 6 is bonded onto the acoustic matching layer 5. First, a first adhesive material that is a liquid material of the first adhesive film 10 is applied on the acoustic matching layer 5 and the side wall 2a. The application method of the first adhesive material is not particularly limited, and various printing methods can be used. In this embodiment, for example, an offset printing method is used.

  Next, the acoustic lens 6 is placed on the acoustic matching layer 5 and the side wall 2a. Next, the housing portion 2 in which the acoustic lens 6 is installed is heated and dried, and the acoustic lens 6 is bonded to the acoustic matching layer 5 and the side wall 2a. The ultrasonic device 1 is completed through the above steps.

As described above, this embodiment has the following effects.
(1) According to the present embodiment, the ultrasonic device 1 includes the substrate 3, the accommodating portion 2, and the acoustic matching layer 5. An ultrasonic element 3 a is installed on the substrate 3. The accommodating portion 2 accommodates the substrate 3 and has a side wall 2 a along at least a part of the side of the substrate 3. The acoustic matching layer 5 is provided on the substrate 3. The first length 12, which is the height at which the side wall 2 a protrudes from the substrate 3, is the same as the second length 13 that is the thickness of the acoustic matching layer 5. The side walls do not overlap the substrate in plan view from the thickness direction of the substrate.

  The acoustic matching layer 5 is formed by applying a liquid matching layer material 15 on the substrate 3 and solidifying it. At this time, the plate-like member 16 is placed on the side wall 2a, and the matching layer material 15 is sandwiched between the substrate 3 and the plate-like member. Then, the acoustic matching layer 5 is formed by solidifying the matching layer material 15. Thereby, the thickness of the acoustic matching layer 5 becomes the same as the height at which the side wall 2 a protrudes from the substrate 3. The side wall 2 a does not overlap the substrate 3 in plan view from the thickness direction of the substrate 3.

  Since the liquid matching layer material 15 is sandwiched between the substrate 3 and the plate-like member 16, the second length 13 that is the thickness of the acoustic matching layer 5 is the first length 12 that is the distance from the substrate 3 to the plate-like member 16. Can be. The first length 12 is a distance obtained by subtracting the thicknesses of the substrate 3 and the third adhesive film 11 from the height at which the side wall 2 a protrudes from the bottom of the housing portion 2. Since the height of the side wall 2a protruding from the bottom 2c, the thickness of the third adhesive film 11 and the thickness of the substrate 3 can be adjusted with high accuracy, the thickness of the acoustic matching layer 5 can be adjusted with high accuracy. Since the thickness of the third adhesive film 11 is smaller than the thickness of the substrate 3, the influence is small. Moreover, the thickness of the acoustic matching layer 5 can be made uniform by installing the board | substrate 3 and the plate-shaped member 16 mounted on the side wall 2a in parallel. Furthermore, by increasing the rigidity of the plate-like member 16, it is possible to suppress the thickness of the acoustic matching layer 5 from changing when the matching layer material 15 is solidified.

  Thereby, the distance that the ultrasonic wave 9 transmitted from each ultrasonic element 3a passes through the acoustic matching layer 5 is the same. And the phase of the ultrasonic wave 9 transmitted from each ultrasonic element 3a can be controlled with high accuracy. By controlling the phase of the ultrasonic waves 9 traveling from the plurality of ultrasonic elements 3a with high accuracy, the depth at which the ultrasonic waves 9 are concentrated can be controlled with high accuracy. Therefore, the position in the depth direction of the location where the ultrasonic wave 9 is reflected from the reflected wave of the ultrasonic wave 9 can be specified with high accuracy.

  And the side wall 2a is installed in the place which does not overlap with a board | substrate by planar view seeing from the thickness direction of the board | substrate 3. FIG. Therefore, it is not necessary to arrange a member having the function of the side wall 2a on the substrate 3. Therefore, the area ratio of the place where the ultrasonic element 3a is arranged on the substrate 3 can be increased.

  (2) According to this embodiment, the acoustic lens 6 is installed on the acoustic matching layer 5 via the first adhesive film 10. The acoustic lens 6 can concentrate the ultrasonic wave 9 at a predetermined depth. The area surface of the acoustic matching layer 5 that adheres to the acoustic lens 6 is uniform along the upper end surface of the side wall 2a. A first adhesive film 10 is disposed between the acoustic matching layer 5 and the acoustic lens 6. The first adhesive film 10 is a film in which an adhesive that bonds the acoustic matching layer 5 and the acoustic lens 6 is solidified. The first adhesive film 10 can suppress air from interposing between the acoustic matching layer 5 and the acoustic lens 6. As a result, reflection of the ultrasonic wave 9 between the acoustic matching layer 5 and the acoustic lens 6 can be suppressed.

  (3) According to the present embodiment, the side wall 2 a is installed along two opposing sides of the substrate 3. At this time, two side walls 2a are installed. Since the two opposite sides of the substrate 3 are separated from each other, the two side walls 2a are disposed apart from each other. When installing the plate-like member 16 on the side wall 2a, the plate-like member 16 can be installed more stably as the side wall 2a is separated. Therefore, the acoustic matching layer 5 can be easily manufactured.

  (4) According to this embodiment, the convex part 2b is installed in the accommodating part 2 in connection with the side wall 2a. The convex portion 2 b extends in a direction orthogonal to the direction in which the side wall 2 a extends, and is disposed along the side of the substrate 3. Since the convex part 2b can support the plate-shaped member 16 in addition to the side wall 2a, the plate-shaped member 16 can be installed stably. Therefore, the acoustic matching layer 5 can be easily manufactured.

  (5) According to this embodiment, the groove part 14 is installed in the side wall 2 a, and a part of the acoustic matching layer 5 protrudes from the groove part 14. In the acoustic matching layer material installation step in step S <b> 2, the matching layer material 15 is applied on the substrate 3. Then, the plate member 16 is placed on the side wall 2 a and the matching layer material 15 is sandwiched between the substrate 3 and the plate member 16. At this time, the matching layer material 15 flows out beyond the side wall 2a. At this time, if the matching layer material 15 enters between the side wall 2a and the plate-like member 16, the thickness of the acoustic matching layer 5 increases. A groove portion 14 is provided on the side wall 2 a, and the matching layer material 15 flows out of the groove portion 14. Accordingly, the matching layer material 15 is suppressed from entering between the side wall 2a and the plate-like member 16. As a result, the thickness of the acoustic matching layer 5 can be formed with high accuracy.

  (6) According to the manufacturing method of the present embodiment, the accommodating portion 2 has the side wall 2 a, and the substrate 3 is installed in the accommodating portion 2. A plurality of ultrasonic elements 3 a are installed on the substrate 3. Next, the matching layer material 15 is applied onto the substrate. Then, the operator puts the plate-like member 16 on the side wall 2 a and presses the matching layer material 15. Next, the operator solidifies the matching layer material 15 to form the acoustic matching layer 5. Next, the operator removes the plate-like member 16 from the side wall 2a. Subsequently, the acoustic lens 6 is bonded onto the acoustic matching layer 5.

  When the matching layer material 15 is solidified, the plate-like member 16 is placed on the side wall 2 a and the matching layer material 15 is sandwiched and pressed between the substrate 3 and the plate-like member 16. At this time, a part of the matching layer material 15 flows out from the side wall 2 a, and the space between the substrate 3 and the plate-like member 16 is filled with the matching layer material 15. Next, by solidifying the matching layer material 15, the thickness of the acoustic matching layer 5 can be made the distance from the substrate 3 to the plate-like member 16. The first length 12, which is the distance from the substrate 3 to the plate member 16, is a distance obtained by subtracting the thickness of the substrate 3 from the height at which the side wall 2 a protrudes from the bottom 2 c of the housing portion 2. Since the height at which the side wall 2a protrudes from the bottom 2c of the housing portion 2 and the thickness of the substrate 3 can be adjusted with high accuracy, the thickness of the acoustic matching layer 5 can be adjusted with high accuracy. Moreover, the thickness of the acoustic matching layer 5 can be made uniform by installing the board | substrate 3 and the plate-shaped member 16 mounted on the side wall 2a in parallel. Furthermore, by increasing the rigidity of the plate-like member 16, it is possible to suppress the thickness of the acoustic matching layer from changing when the matching layer material 15 is solidified.

  Thereby, the distance that the ultrasonic wave 9 transmitted from each ultrasonic element 3a passes through the acoustic matching layer 5 is the same. And the phase of the ultrasonic wave 9 transmitted from each ultrasonic element 3a can be controlled with high accuracy. By controlling the phase of the ultrasonic waves 9 traveling from the plurality of ultrasonic elements 3a with high accuracy, the depth at which the ultrasonic waves 9 are concentrated can be controlled with high accuracy. Therefore, it is possible to improve the accuracy of resolution in the depth direction of the ultrasonic image calculated using the reflected wave of the ultrasonic wave 9.

  And the side wall 2a is installed in the place which does not overlap with a board | substrate by planar view seeing from the thickness direction of the board | substrate 3. FIG. Therefore, it is not necessary to arrange a member having the function of the side wall 2a on the substrate 3. Therefore, the area ratio of the place where the ultrasonic element 3a is arranged on the substrate 3 can be increased.

(Second Embodiment)
Next, an embodiment of an ultrasonic device will be described with reference to FIGS. This embodiment is different from the first embodiment in that the acoustic matching layer 5 has a different form. Note that description of the same points as in the first embodiment is omitted.

  FIG. 17 is a schematic plan view showing the structure of the side wall and the acoustic matching layer, and is a view in which the acoustic lens 6 is removed from the ultrasonic device 33. FIG. 18 is a schematic cross-sectional side view of the relevant part showing the structure of the side wall and the acoustic matching layer. That is, in this embodiment, as shown in FIGS. 17 and 18, the acoustic matching sheet 35 is installed on the substrate 3 via the second adhesive film 34. In other words, the second adhesive film 34 is disposed between the substrate 3 and the acoustic matching sheet 35. The acoustic matching sheet 35 is a sheet-like film, and the second adhesive film 34 bonds the acoustic matching sheet 35 to the substrate 3. The second adhesive film 34 is a film obtained by solidifying an adhesive that bonds the substrate 3 and the acoustic matching sheet 35. The second adhesive film can suppress air from interposing between the acoustic matching sheet 35 and the substrate 3. As a result, it is possible to suppress the reflection of ultrasonic waves by the air between the substrate 3 and the acoustic matching sheet 35.

  The acoustic matching sheet 35 and the second adhesive film 34 constitute an acoustic matching layer 36. When the thickness of the acoustic matching layer 36 is the second length 37, the second length 37 is the same length as the first length 12. Although the thickness of the acoustic matching sheet 35 and the second adhesive film 34 is not particularly limited, in the present embodiment, for example, the acoustic matching sheet 35 is 100 μm, and the thickness of the second adhesive film 34 is 25 μm. Therefore, the acoustic matching layer 36 is 125 μm.

  As shown in FIG. 17, the acoustic matching sheet 35 and the flat cable 4 are arranged so that the acoustic matching sheet 35 and the flat cable 4 do not overlap in a plan view of the substrate 3. In the plan view of the substrate 3, the acoustic matching sheet 35 and the flat cable 4 are arranged so as not to overlap each other. The acoustic matching layer 36 includes an acoustic matching sheet 35 and a second adhesive film 34. Since the flat cable 4 and the acoustic matching sheet 35 do not overlap, it is possible to suppress the acoustic matching sheet 35 from being pressed and deformed by the flat cable 4. As a result, the thickness of the acoustic matching layer 36 can be formed with high accuracy.

  The end on the + X direction side and the end on the −X direction side of the acoustic matching layer 36 are disposed in contact with the side wall 2a and the convex portion 2b. And the contacted part has the same shape. Therefore, in the process of installing the acoustic matching sheet 35, the side wall 2a and the convex portion 2b serve as a guide for arranging the acoustic matching sheet 35. And the operator can arrange | position the acoustic matching layer 36 with sufficient position accuracy by installing the acoustic matching sheet 35 with the side wall 2a and the convex part 2b as a guide.

  Next, the manufacturing method will be described in detail with reference to FIGS. 19 and 20 in association with the steps shown in FIG. 19 and 20 are schematic diagrams for explaining a method of manufacturing an ultrasonic device. The substrate installation process in step S1 is the same as that in the first embodiment, and a description thereof will be omitted. FIG. 19 is a diagram corresponding to the acoustic matching layer material installation step of step S2. As shown in FIG. 19, in step S <b> 2, a second adhesive liquid 38 that is a liquid material of the second adhesive film 34 is applied on the substrate 3. The thickness for applying the second adhesive liquid 38 is set to be greater than the thickness of the second adhesive film 34. The application method of the second adhesive liquid 38 is not particularly limited, and various printing methods can be used. In this embodiment, for example, an offset printing method is used.

  Next, the acoustic matching sheet 35 is placed over the second adhesive liquid 38. The acoustic matching sheet 35 can be installed with high positional accuracy by being installed following the side wall 2a and the convex portion 2b.

  FIG. 20 is a diagram corresponding to the acoustic matching layer material pressing step in step S3. As shown in FIG. 20, in step S <b> 3, the plate-like member 16 is installed so as to overlap the housing portion 2. Let the surface which faces the accommodating part 2 in the plate-shaped member 16 be the 1st surface 16a. The first surface 16a is a flat surface with high flatness and is a mirror surface. The first surface 16a of the plate-like member 16 is placed on the side wall 2a and the acoustic matching sheet 35 and the second adhesive liquid 38 are pressed. The second adhesive liquid 38 is a liquid material for the acoustic matching layer 36.

  The second adhesive liquid 38 is applied thicker than the second adhesive film 34. And since the groove part 14 is installed in the side wall 2a, a part of 2nd adhesive liquid 38 flows out into the groove part 14. FIG. A part of the second adhesive liquid 38 flows out to the place where the flat cable 4 is installed. Accordingly, the second adhesive liquid 38 is prevented from entering between the side wall 2a and the plate-like member 16. As a result, the acoustic matching layer 36 with good thickness accuracy can be formed.

  The accommodating portion 2 on which the plate-like members 16 are stacked is installed on the fixing jig 17. The operator rotates the screw portion 17 b to advance the screw portion 17 b toward the inside of the fixing jig 17. Thereby, the plate-shaped member 16 is pressed by the side wall 2a. And the plate-shaped member 16 maintains the state pressed by the side wall 2a. By increasing the rigidity of the plate-like member 16, it is possible to prevent the thickness of the second adhesive film 34 from changing when the second adhesive liquid 38 is solidified.

  The acoustic matching layer forming process in step S4 and the acoustic lens installing process in step S5 are the same as those in the first embodiment, and a description thereof will be omitted. Then, the ultrasonic device 33 is completed.

As described above, this embodiment has the following effects.
(1) According to this embodiment, the flat cable 4 is installed on the board 3. An ultrasonic element 3 a is installed on the substrate 3, and a signal for driving the ultrasonic element 3 a is transmitted via the flat cable 4. The substrate 3 and the acoustic matching sheet 35 are stacked inside the housing part 2. In the plan view of the substrate 3, the acoustic matching sheet 35 and the flat cable 4 are arranged so as not to overlap each other. At this time, since the flat cable 4 and the acoustic matching sheet 35 do not overlap, it is possible to suppress the acoustic matching sheet 35 from being pressed and deformed by the flat cable 4. As a result, the acoustic matching layer 36 with good thickness accuracy can be formed.

  (2) According to this embodiment, the second adhesive film 34 is disposed between the substrate 3 and the acoustic matching sheet 35. The second adhesive film 34 is a film in which the second adhesive liquid 38 that bonds the substrate 3 and the acoustic matching sheet 35 is solidified. The second adhesive film 34 can suppress air from interposing between the substrate 3 and the acoustic matching sheet 35. As a result, it is possible to suppress the ultrasonic waves 9 from being reflected by the air between the substrate 3 and the acoustic matching sheet 35.

(Third embodiment)
Next, an embodiment of an ultrasonic apparatus including an ultrasonic probe on which an ultrasonic device is mounted will be described with reference to a schematic perspective view illustrating a configuration of the ultrasonic apparatus in FIG. The ultrasonic device mounted on the ultrasonic probe and the ultrasonic apparatus in the present embodiment is the ultrasonic device described in the first to second embodiments. In addition, description is abbreviate | omitted about the same point as 1st Embodiment-2nd Embodiment.

  FIG. 21 is a schematic perspective view showing the configuration of the ultrasonic apparatus. As shown in FIG. 21, the ultrasonic device 41 includes an ultrasonic probe 42. The ultrasonic probe 42 has a substantially rectangular parallelepiped shape that is long in one direction, and is easy to be gripped by the operator. The longitudinal direction of the ultrasonic probe 42 is taken as the Z direction. The surface in the −Z direction of the ultrasonic probe 42 is a substantially flat surface, and the planar shape is a rectangle. The directions in which two orthogonal sides of the planar shape extend are defined as an X direction and a Y direction.

  An ultrasonic device 43 is installed on the −Z direction side of the ultrasonic probe 42. The ultrasonic device 43 receives an ultrasonic wave and outputs an electric signal. As the ultrasonic device 43, either the ultrasonic device 1 or the ultrasonic device 33 described above is used.

  On the surface on the −Z direction side of the ultrasonic probe 42, the ultrasonic device 43 is exposed from the housing. A control unit 44 that controls the ultrasonic device 43 is installed inside the ultrasonic probe 42, and the ultrasonic device 43 and the control unit 44 are connected by a cable 45. The control unit 44 includes a CPU (Central Processing Unit) and a storage device. The storage device stores drive waveform data for driving the ultrasonic device 43 and a program indicating a procedure for driving the ultrasonic device 43. Then, the CPU drives the ultrasonic device 43 by outputting a drive waveform to the ultrasonic device 43 according to the program. The control unit 44 may be installed in the ultrasonic probe 42 or may be installed in a device different from the ultrasonic probe 42.

  The ultrasonic probe 42 is connected to a control device 47 via a cable 46. The control device 47 is a device that receives a data signal output from the ultrasonic probe 42 and analyzes and displays the data signal. The control device 47 also includes a CPU and a storage device. The CPU performs various calculations and controls according to the program. The control device 47 is provided with an input unit 48 and a display unit 49. The input unit 48 is a device such as a keyboard, a mouse pad, a dedicated switch, a pointer such as a trackball, and the like, and is a device for inputting contents instructed to the control device 47 by the operator. The display unit 49 is not particularly limited as long as the data signal can be displayed as an image, and a liquid crystal display device or an OLED (Organic light-emitting diodes) display device can be used. In the present embodiment, for example, an OLED is used for the display unit 49.

  The ultrasonic probe 42 is used by being pressed against the surface of the subject 50. The ultrasonic probe 42 transmits ultrasonic waves from the ultrasonic device 43 toward the subject 50. Then, the ultrasonic device 43 receives ultrasonic waves transmitted to the subject 50 and reflected from the inside of the subject 50. The ultrasonic device 43 detects an ultrasonic wave and outputs an electric signal. Since the reflected wave is reflected and returned in different times depending on the reflected surface, the internal structure of the subject 50 can be inspected nondestructively by analyzing the reflected wave returning time. The reflected wave signal received by the ultrasonic device 43 is output to the control unit 44. The control unit 44 includes a conversion unit 44a that performs A / D conversion (Analog-to-digital), and the conversion unit 44a converts an electrical signal output from the ultrasonic device 43 into a digital data signal. The data signal converted into the digital data signal is transmitted from the control unit 44 to the control device 47 via the cable 46. The control device 47 receives and analyzes the data signal of the reflected wave. The control device 47 converts the reflected wave data signal into an image showing the internal structure of the subject 50 and displays the image on the display unit 49.

As described above, this embodiment has the following effects.
(1) According to this embodiment, the ultrasonic probe 42 includes the ultrasonic device 43 that receives an ultrasonic wave and outputs an electrical signal. The ultrasonic device 43 is either the ultrasonic device 1 or the ultrasonic device 33 described above. The ultrasonic device 1 or the ultrasonic device 33 described above can accurately specify the position in the depth direction where the ultrasonic wave 9 is reflected from the reflected wave of the ultrasonic wave 9. Therefore, the ultrasonic probe 42 can be an apparatus including the ultrasonic device 43 that can accurately specify the position in the depth direction of the location where the ultrasonic wave 9 is reflected from the reflected wave of the ultrasonic wave 9.

  (2) According to the present embodiment, the ultrasonic device 41 includes the ultrasonic device 43, the conversion unit 44 a, and the display unit 49. The ultrasonic device 43 detects the ultrasonic wave 9 and outputs an electric signal. The converter 44a converts the electrical signal into a data signal. The display unit 49 displays the data signal. As the ultrasonic device 43, either the ultrasonic device 1 or the ultrasonic device 33 described above is used. The ultrasonic device 1 or the ultrasonic device 33 can accurately specify the position in the depth direction where the ultrasonic wave 9 is reflected from the reflected wave of the ultrasonic wave 9. Therefore, the ultrasonic device 41 can be an apparatus including the ultrasonic device 43 that can accurately specify the position in the depth direction of the location where the ultrasonic wave 9 is reflected from the reflected wave of the ultrasonic wave 9.

  Note that the present embodiment is not limited to the above-described embodiment, and various changes and improvements can be added by those having ordinary knowledge in the art within the technical idea of the present invention. A modification will be described below.

(Modification 1)
In the first embodiment, the acoustic lens 6 is installed over the acoustic matching layer 5 and the side wall 2a. The acoustic lens 6 may be installed only on the acoustic matching layer 5 without being connected to the side wall 2a. Also at this time, since the acoustic matching layer 5 is formed to have a uniform thickness, the phase of the ultrasonic wave can be controlled with high accuracy.

  DESCRIPTION OF SYMBOLS 1,33,43 ... Ultrasonic device, 2 ... Accommodating part, 2a ... Side wall, 2b ... Convex part, 3 ... Board | substrate, 3a ... Ultrasonic element, 4 ... Flat cable as a cable, 5,36 ... Acoustic matching layer, DESCRIPTION OF SYMBOLS 6 ... Acoustic lens, 10 ... 1st adhesive film, 14 ... Groove part, 15 ... Matching layer material as liquid material, 16 ... Plate-shaped member, 34 ... 2nd adhesive film, 44a ... Conversion part, 49 ... Display part.

Claims (10)

A substrate having a plurality of ultrasonic elements;
An accommodating portion that accommodates the substrate and has a sidewall along at least a portion of a side of the substrate;
An acoustic matching layer provided at a thickness from the substrate to the height of the side wall,
The ultrasonic device according to claim 1, wherein the side wall does not overlap the substrate in a plan view from the thickness direction of the substrate. The ultrasonic device according to claim 1,
An acoustic lens provided on the acoustic matching layer via a first adhesive film,
The ultrasonic device according to claim 1, wherein a region surface of the acoustic matching layer that adheres to the acoustic lens is uniform along an upper end surface of the side wall. The ultrasonic device according to claim 2,
The ultrasonic device according to claim 1, wherein the side wall is disposed along two opposing sides of the substrate. The ultrasonic device according to claim 3,
An ultrasonic device comprising a convex portion connected along the side of the substrate connected to the side wall and extending in a direction intersecting with a direction in which the side wall extends. The ultrasonic device according to any one of claims 1 to 4,
The ultrasonic device according to claim 1, wherein a groove is provided on the side wall, and a part of the acoustic matching layer protrudes from the groove. The ultrasonic device according to any one of claims 1 to 4,
A cable is installed on the board,
The acoustic matching layer includes an acoustic matching sheet, wherein the acoustic matching sheet and the cable do not overlap in a plan view of the substrate. The ultrasonic device according to claim 6, comprising:
An ultrasonic device, wherein a second adhesive film is disposed between the substrate and the acoustic matching sheet. It has an ultrasonic device that receives ultrasonic waves and outputs electrical signals,
The ultrasonic probe according to claim 1, wherein the ultrasonic device is the ultrasonic device according to claim 1. An ultrasonic device that receives ultrasonic waves and outputs electrical signals;
A conversion unit that converts an electrical signal output from the ultrasonic device into a data signal;
A display unit for displaying the data signal,
The ultrasonic device according to claim 1, wherein the ultrasonic device is the ultrasonic device according to claim 1. Installing a substrate having a plurality of ultrasonic elements in a housing part having a side wall;
Applying the liquid material of the acoustic matching layer on the substrate,
Placing a plate-like member on the side wall and pressing the liquid material of the acoustic matching layer,
Solidifying the liquid material of the acoustic matching layer to form the acoustic matching layer;
Removing the plate-like member from the side wall;
A method of manufacturing an ultrasonic device, wherein an acoustic lens is adhered on the acoustic matching layer.

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