JP6175779B2 - Ultrasonic device, ultrasonic probe, electronic device and ultrasonic imaging apparatus - Google Patents

Description

  The present invention relates to an ultrasonic device, an ultrasonic probe, an electronic apparatus, and an ultrasonic imaging apparatus.

Conventionally, an ultrasonic element that receives and transmits ultrasonic waves is known, and an ultrasonic device using the ultrasonic element is used in various applications.
For example, Patent Document 1 discloses an ultrasonic probe that receives and transmits ultrasonic waves, an acoustic lens that converges ultrasonic waves, and an ultrasonic probe that includes an acoustic matching layer between the ultrasonic element and the acoustic lens. The ultrasonic device used is disclosed.

JP2012-100994A

  In the ultrasonic device having such a structure, the acoustic matching layer is formed with a predetermined thickness in order to prevent reflection at the interface through which the ultrasonic wave passes. The thickness of the acoustic matching layer is required to be highly accurate in order to efficiently receive and transmit ultrasonic waves. However, when this acoustic matching layer is formed using a resin, the acoustic matching layer is formed to a desired thickness. It is difficult.

  The present invention has been made to solve the above-described problems, and can be realized as the following forms or application examples.

  Application Example 1 An ultrasonic device according to this application example includes an ultrasonic element array substrate including a plurality of ultrasonic elements that include a piezoelectric body and perform at least one of transmission and reception of ultrasonic waves, and the ultrasonic element array. An acoustic lens having a lens portion that is fixed to a surface of the substrate on which the ultrasonic element is formed and focuses ultrasonic waves; and disposed between the ultrasonic element array substrate and the acoustic lens, and the ultrasonic element array substrate; An acoustic matching layer formed of a resin for fixing the acoustic lens, and the acoustic lens has a surface facing the ultrasonic element on the surface of the ultrasonic element array substrate of the acoustic lens. A plurality of convex portions projecting in the thickness direction are formed, and at least two of the plurality of convex portions are the ultrasonic elements in a plan view in the thickness direction of the ultrasonic element array substrate. Wherein the array substrate in contact with the two opposing sides of the outer peripheral portion not formed with the ultrasonic element, the thickness of the acoustic matching layer, characterized in that it is kept constant.

According to this configuration, the convex portions protruding in the thickness direction of the acoustic lens are formed on at least two opposing sides of the outer edge portion of the acoustic lens, and are in contact with the surface of the ultrasonic element array substrate.
Accordingly, since the distance between the surface of the ultrasonic element array substrate and the lens portion of the acoustic lens can be defined, the thickness of the acoustic matching layer formed between the ultrasonic element array substrate and the acoustic lens is kept constant. be able to. And since the thickness of an acoustic matching layer can be formed accurately, an ultrasonic wave can be received and transmitted efficiently.

  Application Example 2 In the ultrasonic device according to the application example, the acoustic matching layer is filled between the ultrasonic element array substrate and the acoustic lens, and is fixed to the ultrasonic element array substrate and the acoustic lens. It is preferable that it is resin.

According to this configuration, the acoustic matching layer is made of resin, and the ultrasonic element array substrate and the acoustic lens can be fixed using the adhesive.
Therefore, the ultrasonic element array substrate and the acoustic lens can be bonded, and the cured resin (adhesive) can function as an acoustic matching layer.

  Application Example 3 In the ultrasonic device according to the application example described above, it is preferable that a part of the plurality of convex portions has a portion with a different size protruding in the thickness direction of the acoustic lens.

  According to this configuration, a portion having a different size protruding from a part of the convex portion is formed, and excess adhesive (resin) used as an acoustic matching layer can be released from this portion, and the acoustic lens floats. And the acoustic matching layer can be formed with accurate dimensions.

  Application Example 4 In the ultrasonic device according to the application example described above, the ultrasonic device includes a flexible printed wiring board that is connected to a surface of the ultrasonic element array substrate on which the ultrasonic element is formed. It is preferable that the acoustic lens array substrate is electrically connected, and a part of the plurality of convex portions of the acoustic lens is in contact with the flexible printed wiring board.

  According to this configuration, a part of the convex portion of the acoustic lens is in contact with the flexible printed wiring board. For this reason, the flexible printed wiring board can be pressed by the convex portion, and the floating of the flexible printed wiring board in the ultrasonic element array substrate, the flexible printed wiring board, and the connection portion can be prevented.

  Application Example 5 In the ultrasonic device according to the application example, the ultrasonic element array substrate is formed so as to cover a base substrate in which a plurality of openings are arranged in an array, and to cover the openings. And a piezoelectric body portion provided on the vibration film. The piezoelectric body portion includes a first electrode provided on the vibration film, and at least a part of the first electrode. And a second electrode provided to cover at least a part of the piezoelectric layer.

According to this configuration, the ultrasonic element array substrate includes a base substrate having a plurality of openings arranged in an array, a vibration film that covers the openings and is displaceable in the film thickness direction, and the vibration film. The piezoelectric body portion is configured by laminating a first electrode, a piezoelectric layer, and a second electrode on a vibration film.
The ultrasonic element array substrate of the ultrasonic device having such a configuration can be miniaturized, and the ultrasonic device can be miniaturized.

  Application Example 6 An ultrasonic probe according to this application example includes the above-described ultrasonic device and a housing that supports the ultrasonic device.

According to this configuration, the ultrasonic device described above and a housing that supports the ultrasonic device are provided.
The ultrasonic probe of this application example includes an ultrasonic device that efficiently receives and transmits ultrasonic waves, and can provide a highly accurate ultrasonic probe.

  Application Example 7 An electronic apparatus according to this application example includes the above-described ultrasonic device and a processing circuit that is connected to the ultrasonic device and processes an output of the ultrasonic device.

According to this configuration, the ultrasonic device described above and a processing circuit that processes the output of the ultrasonic device are provided.
The electronic apparatus according to this application example includes an ultrasonic device that efficiently receives and transmits ultrasonic waves, and can provide a highly accurate electronic apparatus.

  Application Example 8 An ultrasonic imaging apparatus according to this application example includes the above-described ultrasonic device, a processing circuit connected to the ultrasonic device, processing an output of the ultrasonic device, and generating an image, and the image And a display unit for displaying.

According to this configuration, the ultrasonic device, the processing circuit that processes the output of the ultrasonic device to generate an image, and the display unit that displays the image are provided.
The ultrasonic imaging apparatus of this application example includes an ultrasonic device that efficiently transmits and receives ultrasonic waves, and can provide a highly accurate ultrasonic imaging apparatus.

  Application Example 9 An ultrasonic device according to this application example includes an ultrasonic element array substrate that includes a piezoelectric body and includes a plurality of ultrasonic elements that perform at least one of transmission and reception of ultrasonic waves, and the ultrasonic element array. An acoustic lens having a fixed frame having a flat part to which a substrate is fixed and a frame part standing around the flat part, and a lens part that is fixed to the upper surface of the frame part of the fixed frame and converges ultrasonic waves And the acoustic lens and at least two opposing upper surfaces of the frame portion of the fixed frame are in contact with each other, and a distance between the ultrasonic element array substrate and the acoustic lens is defined. It is characterized by.

According to this configuration, the acoustic lens and the upper surfaces of at least two opposing sides of the frame portion of the fixed frame that accommodates the ultrasonic element array substrate are in contact with each other.
Therefore, the distance between the surface of the ultrasonic element array substrate and the lens portion of the acoustic lens can be defined, and the thickness of the acoustic matching layer formed between the ultrasonic element array substrate and the acoustic lens can be set appropriately. Is easy. And since the thickness of an acoustic matching layer can be formed accurately, an ultrasonic wave can be received and transmitted efficiently.

  Application Example 10 In the ultrasonic device according to the application example described above, the ultrasonic device includes an acoustic matching layer provided between the ultrasonic element array substrate and the acoustic lens, and the acoustic matching layer includes the ultrasonic element array substrate and the ultrasonic element array substrate. It is preferable to be formed of a resin that is fixed to the acoustic lens.

According to this configuration, the acoustic matching layer is made of resin, and the ultrasonic element array substrate and the acoustic lens can be fixed using the adhesive.
For this reason, while adhering an ultrasonic element array substrate and an acoustic lens, the hardened | cured adhesive agent can fulfill | perform the function as an acoustic matching layer.

  Application Example 11 In the ultrasonic device according to the application example described above, a plurality of protrusions projecting in the thickness direction of the acoustic lens on an outer edge portion of the acoustic lens on a surface of the acoustic lens facing the ultrasonic element array substrate. It is preferable that a convex portion is formed.

According to this structure, the convex part which protrudes in the thickness direction of an acoustic lens is formed.
For this reason, the thickness of the acoustic matching layer can be changed by changing the projecting dimension of the convex portion, and it is easy to set the thickness of the acoustic matching layer corresponding to the wavelength of the ultrasonic wave to be used.

  Application Example 12 In the ultrasonic device according to the application example described above, it is preferable that a part of the plurality of convex portions has a portion with a different size protruding in the thickness direction of the acoustic lens.

  According to this configuration, a portion having a different size protruding from a part of the convex portion is formed, and excess adhesive (resin) used as an acoustic matching layer can be released from this portion, and the acoustic lens floats. And the acoustic matching layer can be formed with accurate dimensions.

  Application Example 13 In the ultrasonic device according to the application example described above, a flexible printed wiring board that is electrically connected to the ultrasonic element array substrate on the surface on which the ultrasonic element is formed of the ultrasonic element array substrate is provided. The flexible printed circuit board has a hole formed in a portion corresponding to the upper surface of the frame portion of the fixed frame, and a thickness of the flexible printed circuit board is formed in a part of the plurality of convex portions of the acoustic lens. Concave portions that are recessed with the same dimensions are formed, a part of the plurality of convex portions of the acoustic lens is inserted into the hole portion of the flexible printed wiring board, and the upper surface of the frame portion of the fixed frame is in contact with the concave portion, It is preferable that the concave portion is in contact with the flexible printed wiring board.

According to this configuration, the hole is formed in the flexible printed wiring board, and the concave portion that is recessed in the same dimension as the thickness of the flexible printed wiring board is formed in a part of the convex portion of the acoustic lens. And a part of convex part of an acoustic lens is inserted in the hole part of a flexible printed wiring board, the upper surface of the frame part of a fixed frame contacts, and a recessed part is contacting the flexible printed wiring board.
For this reason, a flexible printed wiring board can be positioned by a convex part and a hole part, and can be fixed on both sides of a flexible printed wiring board by a convex part and a frame part.

  Application Example 14 In the ultrasonic device according to the application example, the ultrasonic element array substrate is formed so as to cover a base substrate having a plurality of openings arranged in an array and the individual openings. A vibration film displaceable in a direction and a piezoelectric part provided on each of the vibration films, wherein the piezoelectric part includes a first electrode provided on the vibration film, and the first electrode. It is preferable to have a piezoelectric layer provided so as to cover at least a part of the first electrode and a second electrode provided so as to cover at least a part of the piezoelectric layer.

According to this configuration, the ultrasonic element array substrate includes a base substrate having a plurality of openings arranged in an array, a vibration film that covers the openings and is displaceable in the film thickness direction, and the vibration film. The piezoelectric body portion is configured by laminating a first electrode, a piezoelectric layer, and a second electrode on a vibration film.
The ultrasonic element array substrate of the ultrasonic device having such a configuration can be miniaturized, and the ultrasonic device can be miniaturized.

  Application Example 15 An ultrasonic probe according to this application example includes the above-described ultrasonic device and a housing that supports the ultrasonic device.

According to this configuration, the ultrasonic device described above and a housing that supports the ultrasonic device are provided.
The ultrasonic probe of this application example includes an ultrasonic device that efficiently receives and transmits ultrasonic waves, and can provide a highly accurate ultrasonic probe.

  Application Example 16 An electronic apparatus according to this application example includes the above-described ultrasonic device and a processing circuit that is connected to the ultrasonic device and processes an output of the ultrasonic device.

According to this configuration, the ultrasonic device described above and a processing circuit that processes the output of the ultrasonic device are provided.
The electronic apparatus according to this application example includes an ultrasonic device that efficiently receives and transmits ultrasonic waves, and can provide a highly accurate electronic apparatus.

  Application Example 17 An ultrasonic imaging apparatus according to this application example includes the above-described ultrasonic device, a processing circuit connected to the ultrasonic device, processing an output of the ultrasonic device, and generating an image, and the image And a display unit for displaying.

According to this configuration, the ultrasonic device, the processing circuit that processes the output of the ultrasonic device to generate an image, and the display unit that displays the image are provided.
The ultrasonic imaging apparatus of this application example includes an ultrasonic device that efficiently transmits and receives ultrasonic waves, and can provide a highly accurate ultrasonic imaging apparatus.

1 is a schematic external view illustrating a configuration of an ultrasonic imaging apparatus according to a first embodiment. The fragmentary sectional view of the ultrasonic probe concerning a 1st embodiment. The expanded sectional view of the head part of the ultrasonic probe concerning a 1st embodiment. FIG. 3 is a control block diagram of the ultrasonic imaging apparatus according to the first embodiment. 1 is a plan view of an ultrasonic device according to a first embodiment. 1 is a cross-sectional view of an ultrasonic device according to a first embodiment. 1 is a cross-sectional view of an ultrasonic device according to a first embodiment. Explanatory drawing which shows the structure of the acoustic lens of the ultrasonic device which concerns on 1st Embodiment. FIG. 2 is a plan view showing a schematic configuration of the ultrasonic element according to the first embodiment. 1 is a cross-sectional view showing a schematic configuration of an ultrasonic element according to a first embodiment. 1 is a conceptual diagram showing a schematic configuration of an ultrasonic element array substrate according to a first embodiment. The top view of the ultrasonic device concerning a 2nd embodiment. The top view which removed the acoustic lens of the ultrasonic device which concerns on 2nd Embodiment. Sectional drawing of the ultrasonic device which concerns on 2nd Embodiment. Sectional drawing of the ultrasonic device which concerns on 2nd Embodiment. Explanatory drawing which shows the structure of the acoustic lens of the ultrasonic device which concerns on 2nd Embodiment. Sectional drawing which shows the structure of the modification of the ultrasonic device which concerns on 2nd Embodiment. FIG. 3 is a schematic external view showing a configuration of another ultrasonic imaging apparatus.

DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, embodiments of the invention will be described with reference to the drawings. In the drawings used for the following description, the ratio of dimensions of each member is appropriately changed so that each member has a recognizable size.
(First embodiment)

In this embodiment, as an example of an electronic apparatus, for example, an ultrasonic imaging apparatus that inspects the inside of a human body will be described.
(1) Overall Configuration of Ultrasonic Image Apparatus FIG. 1 is a schematic external view of an ultrasonic image apparatus according to this embodiment. FIG. 2 is a partial cross-sectional view of the ultrasonic probe, and FIG. 3 is an enlarged cross-sectional view of the head portion of the ultrasonic probe.

As shown in FIG. 1, the ultrasonic imaging apparatus 100 includes an apparatus main body 110 and an ultrasonic probe 130. The apparatus main body 110 and the ultrasonic probe 130 are connected by a cable 120, and electrical signals can be exchanged between the apparatus main body 110 and the ultrasonic probe 130 through the cable 120.
The apparatus main body 110 incorporates a display panel or the like as the display unit 112. In the present embodiment, the display unit 112 is a touch panel type display and also serves as a user interface unit (UI unit).
In the apparatus main body 110, an image is generated based on the ultrasonic wave detected by the ultrasonic probe 130, and the imaged detection result is displayed on the screen of the display unit 112.
The ultrasonic probe 130 includes a rectangular parallelepiped casing 132, and the cable 120 is connected to one end of the casing 132 in the longitudinal direction. And on the opposite side, it has the head part 134 which performs transmission / reception of an ultrasonic wave.
In addition, although the ultrasonic imaging apparatus 100 of this embodiment is a form which connects the apparatus main body 110 and the ultrasonic probe 130 with the cable 120, the apparatus main body 110 and the ultrasonic probe 130 are wirelessly connected without using the cable 120. It is also possible to exchange signals between the two.

  As shown in FIGS. 2 and 3, the ultrasonic probe 130 includes the ultrasonic device 1 fixed to the support member 30 and housed in a housing 132. The surface of the ultrasonic device 1 is exposed on the surface of the head part 134 of the housing 132, and an ultrasonic wave is output from the surface of the head part 134 to the object, and an ultrasonic reflected wave (echo wave) from the object. ) Can be received.

As shown in FIG. 3, there is a gap between the ultrasonic device 1 and the head part 134 of the housing 132, and a seal part 136 filled with a silicone-based sealant is provided in the gap. The seal portion 136 prevents moisture and the like from entering the ultrasonic device 1 of the casing 132 of the ultrasonic probe 130.
Furthermore, it has a sealing structure for sealing with the support member 30 of the ultrasonic device 1. Here, the sealing structure includes an adhesive member 35 such as an elastic double-sided tape attached to the outer peripheral portion of the support member 30 of the ultrasonic device 1, and an elastic double-sided tape attached to the housing 132. The adhesive member 135 is held in a pressed state.

In addition, a flexible printed wiring board (hereinafter also referred to as FPC (Flexible Printed Circuits)) 60 that connects the ultrasonic device 1 and the processing circuit is interposed in a part of the seal portion. In this part, the FPC 60 Is pressed between the adhesive members 35 and 135.
In addition, as the adhesive members 35 and 135, a double-sided tape in which an acrylic adhesive is applied to a single foam such as polyethylene or urethane is used.
As described above, the ultrasonic probe 130 according to the present embodiment employs a double seal structure to prevent moisture and the like from entering the housing 132.

FIG. 4 is a control block diagram of the ultrasonic imaging apparatus 100.
As described above, the ultrasound imaging apparatus 100 includes the apparatus main body 110 and the ultrasound probe 130.
The ultrasonic probe 130 includes the ultrasonic device 1 and a processing circuit 150.
The processing circuit 150 includes a selection circuit 152, a transmission circuit 153, a reception circuit 154, and a control unit 155. The processing circuit 150 performs transmission processing and reception processing of the ultrasonic device 1.
The transmission circuit 153 outputs a transmission signal VT to the ultrasonic device 1 via the selection circuit 152 during the transmission period. Specifically, the transmission circuit 153 generates a transmission signal VT based on the control of the control unit 155 and outputs the transmission signal VT to the selection circuit 152. The selection circuit 152 outputs the transmission signal VT from the transmission circuit 153 based on the control of the control unit 155. The frequency and amplitude voltage of the transmission signal VT can be set by the control unit 155.

The reception circuit 154 performs reception processing of the reception signal VR from the ultrasonic device 1. Specifically, the reception circuit 154 receives the reception signal VR from the ultrasonic device 1 via the selection circuit 152 in the reception period, and amplifies the reception signal, sets the gain, sets the frequency, and performs A / D conversion (analog / digital). Conversion). The result of the reception process is output to the processing unit 116 of the apparatus main body 110 as detection data (detection information). The reception circuit 154 can be configured by, for example, a low noise amplifier, a voltage control attenuator, a programmable gain amplifier, a low pass filter, an A / D converter, and the like.
The control unit 155 controls the transmission circuit 153 and the reception circuit 154. Specifically, the control unit 155 controls the transmission circuit 153 to generate and output the transmission signal VT, and controls the reception circuit 154 to set the frequency and gain of the reception signal VR.
The selection circuit 152 outputs the selected transmission signal VT based on the control of the control unit 155.

The apparatus main body 110 includes a display unit 112, a main control unit 115, a processing unit 116, and a UI unit (user interface unit) 117.
The main control unit 115 performs ultrasonic transmission / reception control on the ultrasonic probe 130 and controls the processing unit 116 such as image processing of detection data.
The processing unit 116 receives the detection data from the receiving circuit 154 and performs necessary image processing, generation of display image data, and the like.
The UI unit 117 outputs a command (command) necessary for the main control unit 115 based on an operation (for example, a touch panel operation) performed by the user.
The display unit 112 is a liquid crystal display, for example, and displays the display image data from the processing unit 116.
Note that a part of the control performed by the main control unit 115 may be performed by the control unit 155 of the processing circuit 150, or a part of the control performed by the control unit 155 may be performed by the main control unit 115.

(2) Configuration of Ultrasonic Device Next, the configuration of the ultrasonic device incorporated in the ultrasonic probe will be described.
FIG. 5 is a plan view showing the configuration of the ultrasonic device, and corresponds to a view of the ultrasonic probe seen from the direction of arrow H in FIG. 6 is a cross-sectional view taken along the line AA in FIG. 5, and FIG. 7 is a cross-sectional view taken along the line BB in FIG.
As shown in FIGS. 5, 6, and 7, the ultrasonic device 1 includes an ultrasonic element array substrate 20, an acoustic matching layer 40, an acoustic lens 50, and a flexible wiring substrate (FPC) 60.

The ultrasonic element array substrate 20 includes an element substrate 21 and a back plate 22.
The element substrate 21 is a substrate on which a plurality of ultrasonic elements are arranged in an array, and has a rectangular shape in plan view. The element substrate 21 is formed using a silicon substrate and has a thickness of about 150 μm to 200 μm. A back plate 22 formed in the same planar shape as the element substrate 21 is bonded to a surface opposite to the element formation surface of the element substrate 21. The back plate 22 serves to suppress excessive vibration of the element substrate 21, and a silicon substrate having a thickness of about 500 μm to 600 μm is used. The back plate 22 may be a metal plate in addition to the silicon substrate.
In some cases, the ultrasonic device 1 may be configured without using the back plate 22.
Details of the ultrasonic element array substrate 20 will be described later.

  A plurality of terminals (not shown) connected to the plurality of ultrasonic elements are exposed along the long sides facing each other in plan view on the surface of the ultrasonic element array substrate 20 where the ultrasonic elements are formed. Yes. This terminal and a terminal (not shown) of the FPC 60 are connected to achieve electrical connection.

  On the surface of the ultrasonic element array substrate 20 on which the ultrasonic elements are formed, an acoustic lens 50 having the same planar shape as that of the ultrasonic element array substrate 20 is disposed. The acoustic lens 50 is made of a resin such as a silicone resin. The acoustic impedance can be adjusted by adding silica or the like to the silicone resin to change the specific gravity.

  An acoustic matching layer 40 is formed between the ultrasonic element array substrate 20 and the acoustic lens 50. For the acoustic matching layer 40, a silicone-based adhesive is used, and the ultrasonic element array substrate 20 and the acoustic lens 50 are fixed (adhered) by curing the adhesive, and the cured adhesive (resin) is used as the acoustic matching layer. Function as.

The acoustic lens 50 efficiently guides ultrasonic waves transmitted from the ultrasonic elements of the ultrasonic element array substrate 20 to the target object, and efficiently guides echo waves reflected and returned from the target object to the ultrasonic element. Play a role.
The acoustic matching layer 40 plays a role of mitigating acoustic impedance mismatch between the ultrasonic element and the acoustic lens 50.

  Here, the configuration of the acoustic lens 50 is shown in FIG. FIG. 8A is a plan view from the top surface of the acoustic lens 50, and FIG. 8B is a back plan view thereof. FIG. 8C is a partial cross-sectional view taken along the line CC in FIG. 8A, and FIG. 8D is a partial cross-sectional view taken along the line DD in FIG.

On one surface of the acoustic lens 50, a lens portion 51 that is convex in the thickness direction with a predetermined curvature is provided. The opposite surface is provided with a wall portion 52 as a convex portion protruding in the thickness direction formed on the outer edge portion of the acoustic lens 50.
As shown in FIG. 8B, the wall 52 formed on the back surface of the acoustic lens 50 is provided on the wall 52 a provided on the outer edge of the short side of the acoustic lens 50 and on the outer edge of the long side. A wall 52b is provided. In addition, no walls are formed at the four corners of the acoustic lens 50.
As shown in FIG.8 (c), the wall part 52a and the wall part 52b stand | start up from the base material of the same thickness, and are comprised so that the height dimension of a wall may differ. Here, the height of the wall of the wall 52a is longer than that of the wall 52b. And the J dimension which is the difference of the height dimension of this wall part is the same dimension as the thickness of FPC60. In this manner, the opposing short-side wall portions 52a are formed with the same height dimension, and the opposing long-side wall portions 52b are formed with the same height dimension.
Further, as shown in FIG. 8D, the K dimension, which is the height dimension of the wall 52 a from the base material, is set to the same dimension as the thickness of the acoustic matching layer 40. The thickness of the acoustic matching layer 40 is set to, for example, 1 / 4λ as the wavelength λ of the ultrasonic wave to be used.
In the present embodiment, no wall portion is formed at the four corners of the acoustic lens 50, but a wall portion having a height lower than the height of the wall portion 52a may be provided.
Further, a structure in which polyimide for improving moisture resistance is thermocompression bonded to the side of the acoustic lens 50 facing the ultrasonic element may be used.
Furthermore, the structure which provided the 2nd acoustic matching layer in the side facing the ultrasonic element of the acoustic lens 50 may be sufficient.

5-7, in a state where the acoustic lens 50 is fixed to the ultrasonic element array substrate 20, the wall 52a contacts the surface of the ultrasonic element array substrate 20 (see FIG. 6), and the wall 52b is the FPC 60. (Refer to FIG. 7).
In this manner, the FPC 60 can be held by the wall portion 52b, and the FPC 60 can be prevented from floating at the connecting portion between the ultrasonic element array substrate 20, the FPC 60, and the like.
Moreover, the distance between the surface of the ultrasonic element array substrate 20 and the lens unit 51 can be easily set by setting the height dimension of the wall 52a, and the thickness of the acoustic matching layer 40 formed therebetween can be set. It is possible to set accurately.
Further, wall portions 52 a and 52 b are provided on the outer edge portion of the acoustic lens 50, and the connection position of the FPC 60 with the ultrasonic element array substrate 20 is disposed on the inner side of the outer periphery of the acoustic lens 50. For this reason, the acoustic lens 50 can be stably placed on the ultrasonic element array substrate 20, and the excess adhesive forming the acoustic matching layer 40 has a gap (acoustics between the walls 52 a and 52 b. It is possible to prevent the acoustic lens 50 from floating, and bubbles from remaining in the acoustic matching layer 40 from flowing out from the four corner portions of the lens 50. In the present embodiment, the wall portions are not formed at the four corner portions of the acoustic lens 50. However, even if this portion is not this portion, the wall portion is not formed at other portions, or the height dimension of the wall portion 52a. You may form the part which flows an adhesive agent by setting it as the wall part of a lower height. Moreover, although the wall part was formed in this embodiment as a convex part, you may form a convex part in pillar parts, such as a some cylinder.
Further, since the connection position of the FPC 60 with the ultrasonic element array substrate 20 is arranged on the inner side of the outer edge of the acoustic lens 50, the connection portion is not exposed, and the acoustic matching layer 40 can protect this connection portion. it can.

As described above, in the ultrasonic device 1, the wall portion 52 as the convex portion protruding in the thickness direction of the acoustic lens 50 is formed on at least two opposing sides of the outer edge portion of the acoustic lens 50, and the wall portion 52 and the ultrasonic element are formed. It is in contact with the surface of the array substrate 20.
From this, the distance between the surface of the ultrasonic element array substrate 20 and the lens portion 51 of the acoustic lens 50 can be defined, and the thickness of the acoustic matching layer 40 formed between the ultrasonic element array substrate 20 and the acoustic lens 50. Can be set appropriately. And since the thickness of the acoustic matching layer 40 can be formed with sufficient precision, an ultrasonic wave can be received and transmitted efficiently.

(3) Ultrasonic Element and Ultrasonic Element Array Substrate Next, the ultrasonic element and the ultrasonic element array substrate (element substrate) of the present embodiment are examples of an ultrasonic element constituted by a thin film element that can be miniaturized. I will explain to you.
FIG. 9 is a schematic plan view of the ultrasonic element of the present embodiment. FIG. 10 is a schematic cross-sectional view showing a cross section taken along the line EE in FIG. FIG. 11 is an explanatory diagram showing a schematic configuration of the ultrasonic element array substrate 20 of the present embodiment.

  As shown in FIGS. 9 and 10, the ultrasonic element 10 includes a base substrate 11, a vibration film (membrane) 13 formed on the base substrate 11, a piezoelectric body portion 18 provided on the vibration film 13, Have The piezoelectric body portion 18 includes a first electrode 14, a piezoelectric layer 15, and a second electrode 16.

The ultrasonic element 10 includes an opening 12 in a base substrate 11 such as silicon, and includes a vibration film 13 that covers and closes the opening 12.
The opening 12 is formed by etching by reactive ion etching (RIE) or the like from the back surface (surface on which no element is formed) side of the base substrate 11.
The vibration film 13 has a two-layer structure of, for example, an SiO ₂ layer and a ZrO ₂ layer. Here, when the base substrate 11 is a Si substrate, the SiO ₂ layer can be formed by thermally oxidizing the substrate surface. The ZrO ₂ layer is formed on the SiO ₂ layer by a technique such as sputtering. Here, the ZrO ₂ layer is a layer for preventing Pb constituting PZT from diffusing into the SiO ₂ layer when, for example, PZT is used as the piezoelectric layer 15 described later. The ZrO ₂ layer also has an effect of improving the bending efficiency with respect to the distortion of the piezoelectric layer.

A first electrode 14 is formed on the vibration film 13, a piezoelectric layer 15 is formed on the first electrode 14, and a second electrode 16 is formed on the piezoelectric layer 15.
That is, the piezoelectric body layer 15 is sandwiched between the first electrode 14 and the second electrode 16, and the piezoelectric body portion 18 is configured.

When the first electrode 14 is formed of a metal thin film and includes a plurality of ultrasonic elements, the first electrode 14 may be a wiring that extends to the outside of the element formation region and is connected to an adjacent ultrasonic element as shown in FIG. .
The piezoelectric layer 15 is formed of, for example, a PZT (lead zirconate titanate) thin film, and is provided so as to cover at least a part of the first electrode 14. The material of the piezoelectric layer 15 is not limited to PZT, for example, lead titanate (PbTiO _3), lead zirconate (PbZrO _3), lead lanthanum titanate _{((Pb, La) TiO 3} ) , etc. May be used.
The second electrode 16 is formed of a metal thin film and is provided so as to cover at least a part of the piezoelectric layer 15. When the second electrode 16 includes a plurality of ultrasonic elements, the second electrode 16 may be a wiring that extends to the outside of the element formation region and is connected to an adjacent ultrasonic element as shown in FIG.
Moreover, as shown in FIG. 10, the moisture-proof layer 19 which covers the ultrasonic element 10 and prevents moisture from the outside is provided. The moisture-proof layer 19 is formed of a material such as alumina and is provided on the entire surface or a part of the ultrasonic element 10. The moisture-proof layer 19 may be appropriately provided depending on the state of use and the environment, and may have a structure in which the moisture-proof layer 19 is not provided.

  The piezoelectric layer 15 expands and contracts in the in-plane direction when a voltage is applied between the first electrode 14 and the second electrode 16, that is, between the first electrode 14 and the second electrode 16. Therefore, when a voltage is applied to the piezoelectric layer 15, a convex bend is generated on the opening 12 side, and the vibration film 13 is bent. By applying an AC voltage to the piezoelectric layer 15, the vibration film 13 vibrates in the film thickness direction, and ultrasonic waves are radiated from the opening 12 by the vibration of the vibration film 13. The voltage (drive voltage) applied to the piezoelectric layer 15 is, for example, 10 to 30 V from the peak to the peak, and the frequency is, for example, 1 to 10 MHz.

  The ultrasonic element 10 also operates as a receiving element that receives an ultrasonic echo that is returned when the emitted ultrasonic wave is reflected by an object. The vibration film 13 is vibrated by the ultrasonic echo, and stress is applied to the piezoelectric layer 15 by this vibration, and a voltage is generated between the first electrode 14 and the second electrode 16. This voltage can be taken out as a received signal.

An ultrasonic element array substrate in which the ultrasonic elements 10 are arranged in an array will be described.
FIG. 11 shows the configuration of the ultrasonic element array substrate of the present embodiment.
The ultrasonic element array substrate 20 includes a plurality of ultrasonic elements 10, drive electrode lines DL, and common electrode lines CL arranged in an array.
The plurality of ultrasonic elements 10 are arranged in a matrix of m rows and n columns. In the present embodiment, they are arranged in 8 rows along the first direction D1, and 12 columns along the second direction D2 intersecting the first direction D1.
The drive electrode lines DL1 to DL12 are wired along the first direction D1.

In the transmission period in which the ultrasonic waves are emitted, the transmission signals VT1 to VT12 output from the processing circuit 150 described above are supplied to the ultrasonic elements 10 via the drive electrode lines DL1 to DL12. In the reception period for receiving the ultrasonic echo signal, the reception signals VR1 to VR12 from the ultrasonic element 10 are output to the processing circuit 150 via the drive electrode lines DL1 to DL12.
The common electrode lines CL1 to CL8 are wired along the second direction D2.
A common voltage VCOM is supplied to the common electrode lines CL1 to CL8. The common voltage may be a constant DC voltage, and may not be 0 V, that is, the ground potential (ground potential).

The arrangement of the ultrasonic elements 10 is not limited to the matrix arrangement of m rows and n columns shown in FIG.
In the transmission period, a difference voltage between the transmission signal voltage and the common voltage is applied to each ultrasonic element 10, and ultrasonic waves with a predetermined frequency are emitted.

As described above, the ultrasonic imaging apparatus and the ultrasonic probe of the present embodiment include the ultrasonic device 1 that efficiently receives and transmits ultrasonic waves, and the ultrasonic imaging apparatus 100 and the ultrasonic probe 130 with high accuracy. Can provide.
(Second Embodiment)

Next, another embodiment of the ultrasonic device will be described as a second embodiment. The ultrasonic device of this embodiment is different from the ultrasonic device shown in the first embodiment in that it includes a fixed frame that accommodates an ultrasonic element array substrate. In addition, about the structure similar to 1st Embodiment, the same code | symbol is attached | subjected and description is abbreviate | omitted or simplified.
FIG. 12 is a plan view showing the configuration of the ultrasonic device, and FIG. 13 is a plan view showing a state where the acoustic lens and the acoustic matching layer of the ultrasonic device are removed. 14 is a sectional view taken along the line EE in FIG. 12, FIG. 15A is a sectional view taken along the line FF in FIG. 12, and FIG. 15B is a broken line GG in FIG. FIG.
As shown in FIGS. 12, 13, 14, and 15, the ultrasonic device 2 includes an ultrasonic element array substrate 20, a fixed frame 70, an acoustic matching layer 40, an acoustic lens 80, and a flexible wiring substrate (FPC) 60. .

The ultrasonic element array substrate 20 has the same configuration as that of the first embodiment, and includes an element substrate 21 and a back plate 22. The ultrasonic element array substrate 20 is accommodated in the fixed frame 70.
The fixed frame 70 includes a flat portion 72 and a frame portion 74 that rises along the outer periphery of the flat portion 72. The ultrasonic element array substrate 20 is fixed to the flat portion 72 by an adhesive layer 76 such as an adhesive. The upper surface of the frame part 74 rising from the outer periphery of the flat part 72 is set to be the same height as the surface of the bonded ultrasonic element array substrate 20. The fixed frame 70 is formed of a resin such as acrylic or a metal. Alternatively, the element substrate 21 may be directly bonded to the fixed frame 70 without using the back plate 22.

A plurality of terminals (not shown) connected to the plurality of ultrasonic elements are exposed along the long sides facing each other in plan view on the surface of the ultrasonic element array substrate 20 where the ultrasonic elements are formed. Yes. This terminal and a terminal (not shown) of the FPC 60 are connected to achieve electrical connection.
In a state where the ultrasonic element array substrate 20 and the FPC 60 are connected, a hole portion 62 penetrating the FPC 60 is formed in a portion corresponding to the upper surface of the frame portion 74 of the fixed frame 70 of the FPC 60 (see FIG. 13). .

  On the surface of the ultrasonic element array substrate 20 where the ultrasonic elements are formed, an acoustic lens 80 having the same planar shape as the fixed frame 70 is disposed. The acoustic lens 80 is formed of a resin such as a silicone resin. The acoustic impedance can be adjusted by adding silica or the like to the silicone resin to change the specific gravity.

  An acoustic matching layer 40 is formed between the ultrasonic element array substrate 20 and the acoustic lens 80. The acoustic matching layer 40 uses a silicone-based adhesive, and the ultrasonic element array substrate 20 and the acoustic lens 80 are fixed (adhered) by curing the adhesive, and the cured adhesive (resin) is used as the acoustic matching layer. Function as.

  Here, the configuration of the acoustic lens 80 is shown in FIG. 16A is a plan view from the top surface of the acoustic lens 80, and FIG. 16B is a back plan view thereof. FIG.16 (c) is a fragmentary sectional view which follows the PP disconnection of the figure (a).

On one surface of the acoustic lens 80, a lens portion 81 that is convex in the thickness direction with a predetermined curvature is provided. On the opposite surface, wall portions 82 and 83 are provided as convex portions protruding in the thickness direction formed on the outer edge portion of the acoustic lens 80.
As shown in FIG. 16B, the wall portion 82 formed on the back surface of the acoustic lens 80 is provided on the outer edge portion on the short side of the acoustic lens 80, and the wall portion 83 is provided on the outer edge portion on the long side. ing. In addition, a wall portion is not formed on a part of the long side of the acoustic lens 80.

As shown in FIG.16 (c), the wall part 82 and the wall part 83 stand | start up from the base material of the same thickness, and are comprised so that the height dimension of a wall may become the same. The wall 83 is formed with a recess 84 that is recessed by a dimension L and has a flat bottom surface. This dimension L is a dimension corresponding to the thickness of the FPC 60 described above. By forming the concave portion 84 in the wall portion 83, a part of the wall portion 83 has a protruding shape, and this portion is inserted into the hole portion 62 of the FPC 60. The planar shape of the protruding portion of the wall 83 is formed to be slightly smaller than the hole 62 of the FPC 60 so that the FPC 60 can be positioned.
Further, the height dimension M of the wall portions 82 and 83 is set to the same dimension as the thickness of the acoustic matching layer 40. The thickness of the acoustic matching layer 40 is set to, for example, 1 / 4λ as the wavelength λ of the ultrasonic wave to be used.

12 to 15, in the state where the acoustic lens 80 is fixed to the ultrasonic element array substrate 20, the upper surfaces of the wall portions 82 and 83 are in contact with the upper surface of the frame portion 74 of the fixed frame 70 (FIGS. 14 and 15 ( a)), the concave portion 84 contacts the FPC 60 (see FIG. 15B).
Thus, the FPC 60 can be positioned by inserting the wall portion 83 into the hole portion 62 of the FPC 60, and the concave portion 84 is recessed with the same dimension as the thickness of the FPC 60, so the FPC 60 is attached to the frame portion of the fixed frame 70. 74 and can be fixed.
Moreover, the distance between the surface of the ultrasonic element array substrate 20 and the lens unit 81 can be easily set by setting the height dimension of the walls 82 and 83, and the acoustic matching layer 40 formed between them can be easily set. It is possible to set the thickness accurately.
Further, the excess adhesive forming the acoustic matching layer 40 flows out from the portion where the wall portion is not formed, so that the acoustic lens 80 can be prevented from floating and bubbles can be prevented from remaining in the acoustic matching layer 40. .
Further, since the connection position of the FPC 60 with the ultrasonic element array substrate 20 is arranged on the inner side of the outer edge of the acoustic lens 80, the connection portion is not exposed, and this connection portion can be protected by the acoustic matching layer 40. it can.

  In the present embodiment, a part of the wall 83 of the acoustic lens 80 is configured to penetrate the FPC 60 and contact the wall 83 and the upper surface of the frame 74 of the fixed frame 70. However, the wall 83 contacts the FPC 60. Alternatively, only the wall portion 82 formed on the opposing short side may be configured to contact the upper surface of the frame portion 74 of the fixed frame 70.

As described above, in the ultrasonic device 2, the wall portions 82 and 83 projecting in the thickness direction are formed on the outer edge portion of the acoustic lens 80, and the wall portions 82 and 83 and the upper surface of the frame portion 74 of the fixed frame 70 are in contact with each other. Yes.
Thus, the dimensions of the surface of the ultrasonic element array substrate 20 and the lens portion 81 of the acoustic lens 80 can be defined, and the thickness of the acoustic matching layer 40 formed between the ultrasonic element array substrate 20 and the acoustic lens 80. Can be set appropriately. And since the thickness of the acoustic matching layer 40 can be formed with sufficient precision, an ultrasonic wave can be received and transmitted efficiently.
In the present embodiment, the acoustic lens 80 is in contact with the fixed frame 70 and is not in contact with the element substrate 21. For this reason, an unnecessary force is not applied to the element substrate 21 formed of a brittle material. For this reason, when an ultrasonic probe is configured by incorporating the ultrasonic device 2 into a housing or the like, the element substrate is not damaged when the ultrasonic probe is dropped, and the drop resistance can be improved.

(Modification of the second embodiment)
Next, a modification of the ultrasonic device in the second embodiment will be described. In this modification, the configurations of the fixed frame and the acoustic lens are different from those of the second embodiment.
FIG. 17 is a cross-sectional view showing a configuration of a modification of the ultrasonic device. Constituent elements similar to those of the second embodiment are denoted by the same reference numerals and description thereof is omitted.

  As shown in FIG. 17A, the ultrasonic element array substrate 20 is accommodated in the fixed frame 70a, and the upper surface of the frame portion 74a of the fixed frame 70a is arranged at a position higher than the surface of the ultrasonic element array substrate 20. Yes. The upper surface of the frame portion 74 a is set at a position higher than the surface of the ultrasonic element array substrate 20 by the thickness dimension of the acoustic matching layer 40.

One surface of the acoustic lens 80a includes a lens portion 81a, and the opposite surface (the surface facing the frame portion 74a) is formed as a flat surface.
Then, when the upper surface of the frame portion 74a of the fixed frame 70a and the acoustic lens 80a are in contact with each other, the dimension between the surface of the ultrasonic element array substrate 20 and the lens portion 81a can be defined. It is easy to appropriately set the thickness of the acoustic matching layer 40 formed between the lens 80a.

As illustrated in FIG. 17B, the ultrasonic element array substrate 20 is accommodated in the fixed frame 70 b, and the upper surface of the frame portion 74 b of the fixed frame 70 b is disposed at a position lower than the surface of the ultrasonic element array substrate 20. Yes.
One surface of the acoustic lens 80b includes a lens portion 81b, and a wall portion 82b is formed on the outer peripheral edge of the opposite surface (the surface facing the frame portion 74b). The height of the wall portion 82b is such that when the upper surface of the frame portion 74b of the fixed frame 70b and the wall portion 82b of the acoustic lens 80b are in contact, the dimensions of the ultrasonic element array substrate 20 and the lens portion 81b are the acoustic matching layer 40. The thickness is set to be.
In this way, the dimension between the surface of the ultrasonic element array substrate 20 and the lens portion 81b can be defined, and the thickness of the acoustic matching layer 40 formed between the ultrasonic element array substrate 20 and the acoustic lens 80b. Can be set appropriately.

  As described above, the ultrasonic devices 2, 3, and 4 described above may be mounted to constitute an ultrasonic probe, and an electronic device such as an ultrasonic imaging apparatus may be further configured.

Next, although the portable ultrasonic imaging apparatus is shown in the first embodiment, FIG. 18 shows a specific configuration example of the ultrasonic imaging apparatus according to another embodiment.
The ultrasonic imaging apparatus 101 is a stationary ultrasonic imaging apparatus and includes an ultrasonic probe 130.
The ultrasonic imaging apparatus 101 includes an apparatus main body (electronic device main body) 111, a display unit 113 that displays display image data, a user interface unit (UI unit) 117, an ultrasonic probe 130, and a cable 120.
Even with such a stationary ultrasonic imaging apparatus, the effects of the present invention can be achieved.
Moreover, the ultrasonic imaging apparatus of this embodiment can be used for measurement of fat thickness, muscle thickness, blood flow, bone density, and the like of a living body.

  The present invention is not limited to the embodiment described above, and the specific structure and procedure for carrying out the present invention can be appropriately changed to other structures and the like as long as the object of the present invention can be achieved. it can. Many modifications can be made by those skilled in the art within the technical idea of the present invention.

  DESCRIPTION OF SYMBOLS 1, 2, 3, 4 ... Ultrasonic device, 10 ... Ultrasonic element, 11 ... Base substrate, 12 ... Opening part, 13 ... Vibration film, 14 ... 1st electrode, 15 ... Piezoelectric layer, 16 ... 2nd electrode DESCRIPTION OF SYMBOLS 18 ... Piezoelectric part, 19 ... Moisture proof layer, 20 ... Ultrasonic element array substrate, 21 ... Element substrate, 22 ... Back plate, 30 ... Support member, 35 ... Adhesive member, 40 ... Acoustic matching layer, 50 ... Acoustic lens , 51 ... Lens part, 52, 52a, 52b ... Wall part (convex part), 60 ... Flexible printed circuit board (FPC), 62 ... Hole part, 65 ... Adhesive part, 70 ... Fixed frame, 72 ... Plane part, 74 ... frame part, 76 ... adhesive layer, 70a and 70b ... fixed frame, 74a and 74b ... frame part, 80 ... acoustic lens, 81 ... lens part, 82 and 83 ... wall part (convex part), 84 ... concave part, 80a, 80b ... acoustic lens, 81a, 81b ... lens part, 82b ... wall part DESCRIPTION OF SYMBOLS 100,101 ... Ultrasound image apparatus, 110 ... Apparatus main body, 112, 113 ... Display part, 115 ... Main control part, 116 ... Processing part, 117 ... User interface part (UI part), 120 ... Cable, 130 ... Ultrasound Probe, 132, housing, 134, head portion, 135, adhesive member, 136, seal portion, 150, processing circuit, 152, selection circuit, 153, transmission circuit, 154, reception circuit, 155, control unit.

Claims (17)

An ultrasonic element substrate having an ultrasonic element that includes a piezoelectric body and performs at least one of transmission and reception of ultrasonic waves;
An acoustic lens having a lens portion that is fixed to the surface of the ultrasonic element substrate on which the ultrasonic element is formed and focuses the ultrasonic wave;
An acoustic matching layer that is disposed between the ultrasonic element substrate and the acoustic lens and formed of a resin that fixes the ultrasonic element substrate and the acoustic lens; and
In the surface facing the ultrasonic element of the ultrasonic element substrate of the acoustic lens,
A plurality of convex portions protruding in the thickness direction of the acoustic lens are formed on the acoustic lens,
Wherein the plurality of at least two of the convex portion, the in plan view in the thickness direction of the ultrasonic element substrate, in contact with the ultrasonic element board,
The ultrasonic device, wherein the plurality of convex portions and the ultrasonic element substrate are in contact with each other on two opposing sides of the outer peripheral portion where the ultrasonic element is not formed . The ultrasonic device according to claim 1,
The ultrasonic device, wherein the acoustic matching layer is a resin that is filled between the ultrasonic element substrate and the acoustic lens and is fixed to the ultrasonic element substrate and the acoustic lens. The ultrasonic device according to claim 2,
The ultrasonic device according to claim 1, wherein a part of the plurality of convex portions includes a portion having a different size protruding in a thickness direction of the acoustic lens. The ultrasonic device according to any one of claims 1 to 3,
A flexible printed wiring board connected on the surface of the ultrasonic element substrate on which the ultrasonic element is formed;
The flexible printed wiring board is electrically connected to the ultrasonic element substrate,
The ultrasonic device, wherein a part of the plurality of convex portions of the acoustic lens is in contact with the flexible printed wiring board. In the ultrasonic device according to any one of claims 1 to 4,
The ultrasonic element substrate is
A base substrate having an opening formed thereon;
A vibrating membrane formed over the opening and displaceable in the film thickness direction;
A piezoelectric body portion provided on the vibration film,
The piezoelectric part is
A first electrode provided on the vibrating membrane;
A piezoelectric layer provided to cover at least a part of the first electrode;
An ultrasonic device comprising: a second electrode provided to cover at least a part of the piezoelectric layer. The ultrasonic device according to any one of claims 1 to 5,
An ultrasonic probe comprising: a housing that supports the ultrasonic device. The ultrasonic device according to any one of claims 1 to 5,
A processing circuit connected to the ultrasonic device and processing an output of the ultrasonic device;
An electronic device comprising: The ultrasonic device according to any one of claims 1 to 5,
A processing circuit connected to the ultrasonic device and processing the output of the ultrasonic device to generate an image;
A display unit for displaying the image;
An ultrasonic imaging apparatus comprising: An ultrasonic element substrate having an ultrasonic element that includes a piezoelectric body and performs at least one of transmission and reception of ultrasonic waves;
A fixed frame having a flat part to which the ultrasonic element substrate is fixed and a frame part standing around the flat part;
An acoustic lens having a lens portion that is fixed to the upper surface of the frame portion of the fixed frame and converges ultrasonic waves, and
Ultrasonic devices and the upper surface of the two sides at least facing the frame portion of the fixed frame and the acoustic lens is characterized in that you contact. The ultrasonic device according to claim 9.
An acoustic matching layer provided between the ultrasonic element substrate and the acoustic lens;
The acoustic device is characterized in that the acoustic matching layer is formed of a resin fixed to the ultrasonic element substrate and the acoustic lens. The ultrasonic device according to claim 9 or 10,
On the surface of the acoustic lens facing the ultrasonic element substrate,
A plurality of convex portions protruding in a thickness direction of the acoustic lens are formed on an outer edge portion of the acoustic lens. The ultrasonic device according to claim 11.
The ultrasonic device according to claim 1, wherein a part of the plurality of convex portions includes a portion having a different size protruding in a thickness direction of the acoustic lens. The ultrasonic device according to claim 11 or 12,
A flexible printed wiring board electrically connected to the ultrasonic element substrate at a surface of the ultrasonic element substrate on which the ultrasonic element is formed;
The flexible printed wiring board has a hole formed in a portion corresponding to the upper surface of the frame portion of the fixed frame,
Recesses that are recessed with the same dimensions as the thickness of the flexible printed wiring board are formed in some of the plurality of convex portions of the acoustic lens,
A part of the plurality of convex portions of the acoustic lens is inserted into the hole portion of the flexible printed wiring board, the upper surface of the frame portion of the fixed frame is in contact, and the concave portion is in contact with the flexible printed wiring board. An ultrasonic device characterized by that. The ultrasonic device according to any one of claims 9 to 13,
The ultrasonic element substrate is
A base substrate having an opening formed thereon;
A vibrating membrane formed to cover each of the openings and displaceable in the film thickness direction;
A piezoelectric body portion provided on each of the vibrating membranes,
The piezoelectric part is
A first electrode provided on the vibrating membrane;
A piezoelectric layer provided to cover at least a part of the first electrode;
An ultrasonic device comprising: a second electrode provided to cover at least a part of the piezoelectric layer. The ultrasonic device according to any one of claims 9 to 14,
An ultrasonic probe comprising: a housing that supports the ultrasonic device. The ultrasonic device according to any one of claims 9 to 14,
A processing circuit connected to the ultrasonic device and processing an output of the ultrasonic device;
An electronic device comprising: The ultrasonic device according to any one of claims 9 to 14,
A processing circuit connected to the ultrasonic device and processing the output of the ultrasonic device to generate an image;
A display unit for displaying the image;
An ultrasonic imaging apparatus comprising:

Images