JP2018082125A - Retainer - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a retainer capable of restraining uneven heating of an object by performing adequate thermal insulation between a base material and a support material, thereby suppressing temperature gradient in the base material.SOLUTION: A retainer 10 includes a tabular base material 11 composed of a ceramic sintered compact, and having an upper surface 11A and a lower surface 11B located on the opposite side of the upper surface 11A, a cylindrical support member 12 composed of a ceramic sintered compact, and having an upper end face 12A connected to the lower surface 11B of the base material 11, and a heating resistor 13 embedded in the base material 11. Between the base material 11 and the support member 12, the retainer 10 has a space 14 at least a part of which is provided in the circumferential direction of the support member 12. The space 14 is interconnected with the inner space S1 of the support member 12 via an inside opening A1 formed in the inside surface 12B of the support member 12.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a holding device that holds an object such as a semiconductor substrate on a base material.

  Conventionally, a holding device including a base material made of ceramics having an upper surface for supporting a substrate and a hollow support member made of ceramics is known. For example, the base material has a plate shape, and the lower surface thereof constitutes a joint surface joined to the upper end surface of the support member.

  For example, Patent Document 1 includes a ceramic substrate and a ceramic support member that is bonded to the ceramic substrate, and the bonding interface between the ceramic substrate and the ceramic support member includes a plurality of bonded interfaces that are discretely arranged. A ceramic heater is disclosed.

Japanese Patent No. 5882614

  For example, the holding device as described above has a heating element embedded in a base material, and heats the object, for example, a semiconductor wafer, held on the upper surface of the base material by generating heat. The holding device is mounted in various processing chambers of the semiconductor manufacturing apparatus.

  Here, the semiconductor wafer being processed is preferably heated so as to have a uniform temperature. However, the heat generated in the base material may be transferred to the outside (for example, a housing of the process chamber) through a support member bonded to the base material. For example, there is a case where a heat flow is generated in which the heat in the base material is directed toward the joining region with the support member, and a temperature gradient is generated in the base material. Therefore, the entire semiconductor wafer may not be heated to a uniform temperature.

  It is an object of the present invention to provide a holding device capable of suppressing uneven heating of an object by performing appropriate heat insulation between a base material and a support member and suppressing a temperature gradient in the base material. And

  The holding device of the present invention comprises a ceramic substrate, a plate-like substrate having an upper surface and a lower surface located on the opposite side of the upper surface, and a ceramic substrate, which is connected to the lower surface of the substrate. A holding device having a cylindrical support member having an end surface and a heating resistor embedded in the substrate, and holding an object on the upper surface of the substrate, the substrate and the support member In the meantime, at least a portion has a space provided along the circumferential direction of the support member, and the space is formed via an inner opening formed in at least one of the lower surface of the base material and the inner side surface of the support member. A first space communicating with the inner space of the support member and a first space communicating with the outer space of the support member via an outer opening formed in at least one of the lower surface of the base member and the outer surface of the support member. Including at least one of two spaces That.

  According to the holding device of the present invention, a space communicating with the inner space or the outer space of the support member is provided between the base material and the support member. The said space functions as a heat insulation part which suppresses the heat transfer to the supporting member of the heat which generate | occur | produced in the base material. Further, the space has the same atmosphere as the inner space or the outer space of the support member. For example, the atmosphere in the space can be easily adjusted without providing a special mechanism. Therefore, it is possible to suppress uneven heating of the object by performing good heat insulation between the base material and the support member and suppressing the temperature gradient in the base material.

  In addition, at least one of the first space and the second space includes an annular space provided over the entire circumference of the support member. Therefore, the heat transfer path between the base member and the support member in the radial direction of the support member is limited. Therefore, good heat insulation performance can be obtained at the joint surface between the base material and the support member.

  In addition, at least one of the first space and the second space includes a plurality of annular spaces and a communication space that communicates the plurality of annular spaces with each other. Therefore, it is possible to obtain a uniform and good heat insulating performance over the entire upper end surface of the support member in the atmosphere in the space.

  The space includes the first space and the second space, and the first space and the second space are independent of each other. Therefore, it is possible to suppress uneven heating of the object by adjusting the temperature distribution of the upper end surface of the support member to suppress the temperature gradient in the base material.

The perspective view of the holding | maintenance apparatus which concerns on the 1st Embodiment of this invention. 1 is a schematic top view of a holding device according to a first embodiment of the present invention. The schematic cross section of the holding | maintenance apparatus which concerns on the 1st Embodiment of this invention. The schematic top view of the supporting member of the holding | maintenance apparatus which concerns on the 1st Embodiment of this invention. The figure which shows the measurement result of the temperature distribution in the holding | maintenance apparatus which concerns on the 1st Embodiment of this invention. The schematic cross section of the holding | maintenance apparatus which concerns on the modification of the 1st Embodiment of this invention. The schematic cross section of the holding | maintenance apparatus which concerns on the 2nd Embodiment of this invention. The schematic top view of the supporting member of the holding | maintenance apparatus which concerns on the 2nd Embodiment of this invention. The schematic cross section of the holding | maintenance apparatus which concerns on the 3rd Embodiment of this invention. The schematic top view of the supporting member of the holding | maintenance apparatus which concerns on the 3rd Embodiment of this invention.

  Hereinafter, various embodiments of the present invention will be described.

(First embodiment)
FIG. 1 is a perspective view of a holding device 10 according to the first embodiment. FIG. 2 is a schematic top view of the holding device 10. The holding device 10 includes a base material 11 that holds an object to be held and a cylindrical support member 12 that supports the base material 11.

  The base material 11 is a plate-like member having an upper surface 11A having a holding surface for holding an object and a lower surface 11B that is a surface opposite to the upper surface 11A. The substrate 11 is made of a ceramic sintered body. That is, the substrate 11 is a ceramic plate made of a ceramic sintered body having a plate shape having an upper surface 11A and a lower surface 11B located on the opposite side of the upper surface 11A. In this embodiment, the base material 11 is a disk-shaped ceramic plate, and the upper surface 11A and the lower surface 11B are the main surfaces of the base material 11 facing each other. In addition, the external shape of the base material 11 is not limited to disk shape.

The ceramic sintered body that becomes the material of the substrate 11, for example, alumina _{(Al 2 O} 3), ceramics sintered body such as aluminum nitride (AlN) or silicon nitride _(Si 3 _{N 4)} can be mentioned. For example, the base material 11 can be formed by hot press sintering a molded body obtained by molding a raw powder containing high-purity (for example, purity 99.9% or higher) aluminum nitride powder, alumina powder, and silicon nitride powder. it can.

  The support member 12 is made of a ceramic sintered body. The support member 12 is a ceramic shaft having a cylindrical shape having an upper end surface 12A connected to the lower surface 11B of the substrate 11. In the present embodiment, the upper end surface 12 </ b> A of the support member 12 is joined to the lower surface 11 </ b> B of the base material 11. The upper end surface 12A functions as a support surface that supports the substrate 11. As shown in FIG. 1, the support member 12 is a cylindrical member, and has an inner surface (inner wall surface) 12B and an outer surface (outer wall surface) 12C. The outer shape of the support member 12 is not limited to a cylindrical shape.

Examples of the ceramic sintered body used as the material of the support member 12 include ceramic sintered bodies such as alumina (Al ₂ O ₃ ), aluminum nitride (AlN), and silicon nitride (Si ₃ N ₄ ).

  As shown in FIG. 2, in this embodiment, the upper end surface 12 </ b> A of the support member 12 is connected (joined) to the center portion of the lower surface 11 </ b> B of the base material 11. The base material 11 and the support member 12 are arranged and joined so that the center axis of a circle which is a planar shape of the base material 11 and the center axis of a cylinder formed by the support member 12 are coaxial. Moreover, the base material 11 and the supporting member 12 are joined by solid phase joining.

  FIG. 3 is a schematic cross-sectional view of the holding device 10. 3 is a cross-sectional view taken along line VV in FIG. In FIG. 3, the object SB that is a holding target of the holding device 10 is indicated by a broken line. For example, the holding device 10 holds a substrate such as a semiconductor wafer as the object SB.

  In the present embodiment, the holding device 10 is a ceramic heater that holds and heats the object SB. Specifically, the holding device 10 includes a heating resistor 13 embedded in the base material 11. The heating resistor 13 functions as a heater that heats the base material 11 to heat the object SB on the upper surface 11A.

  In the present embodiment, the heating resistor 13 is composed of a plurality of metal wirings that generate heat when supplied with power. The metal wiring as the heating resistor 13 is made of, for example, a metal material such as tungsten, molybdenum or an alloy thereof, or platinum, and may have a shape such as a thin plate, a thin film, a mesh shape, or a linear shape.

  The holding device 10 includes a power supply unit (not shown) that supplies power to the heating resistor 13. In addition, the holding device 10 may be a multi-zone heater having a configuration in which the power supply unit applies a voltage independently to each of the plurality of metal wirings. Further, the holding device 10 generates a coulomb force by applying a voltage to a metal member embedded in the base material 11 separately from the heating resistor 13, and statically sucks the substrate on the upper surface 11 </ b> A of the base material 11. It may have an electric chuck function. In addition, a metal member having a function as an RF electrode may be embedded in the substrate 11 separately from the heating resistor 13.

  Further, as shown in FIG. 3, the support member 12 has a cylindrical shape, and an inner space S1 is formed by an inner side surface 12B therein. A space other than the inner space S1 of the support member 12 in the holding device 10 is defined as an outer space S2. In the present embodiment, the outer surface 12C of the support member 12 faces the outer space S2. Further, the surface of the base material 11 other than the joint surface with the support member 12 faces the outer space S2.

  For example, when the holding device 10 is provided in the process chamber of the semiconductor manufacturing apparatus, the outer surface 12C of the support member 12 is exposed to the processing atmosphere in the process chamber together with the upper surface 11A of the base material 11. In FIG. 3, a space in the process chamber is indicated by a two-dot chain line as the outer space S2.

  On the other hand, the inner space S1 of the support member 12 communicates with the outside of the process chamber, and is in the same atmosphere as the outside atmosphere, for example, air or an inert gas atmosphere.

  As shown in FIG. 3, the holding device 10 includes a space 14 (first space) in which at least a part is provided along the circumferential direction of the support member 12 between the base material 11 and the support member 12. Have. In the present embodiment, the space 14 communicates with the inner space S <b> 1 of the support member 12 through the inner opening A <b> 1 formed on the inner surface 12 </ b> B of the support member 12.

  More specifically, in the present embodiment, a groove G <b> 1 is provided on the upper end surface 12 </ b> A of the support member 12. The space 14 is formed between the base material 11 and the support member 12 by joining the upper end surface 12A of the support member 12 having the groove G1 to the lower surface 11B of the base material 11. That is, in the present embodiment, the space 14 is a region surrounded by the inner surface of the groove G1 formed on the upper end surface 12A of the support member 12 and the lower surface 11B of the substrate 11. In the present embodiment, the inner surface of the groove G <b> 1 forms an inner opening A <b> 1 together with the lower surface 11 </ b> B of the base material 11.

  FIG. 4 is a top view showing the upper end surface 12 </ b> A of the support member 12. For clarity of illustration, in FIG. 4, the joining region of the upper end surface 12 </ b> A with the base material 11 is hatched. 4 shows a cutting line (VV line) in FIG. The groove G1, the space 14 formed by the groove G1, and the inner opening A1 will be described with reference to FIGS.

  As shown in FIG. 4, the groove G1 includes an annular groove GA including an inner annular groove GA1 and an outer annular groove GA2 formed concentrically with each other, and a communication groove that communicates the inner annular groove GA1 and the outer annular groove GA2. GB is included. Further, the groove G1 includes an inner opening groove GC that reaches the inner side surface 12B of the support member 12 from the inner annular groove GA1. In the present embodiment, as shown in FIG. 4, the communication groove GB and the inner opening groove GC are disposed at positions facing each other across the inner space S <b> 1 of the support member 12.

  The space 14 and the inner opening A1 are spaces surrounded by the groove G1 and the lower surface 11B of the substrate 11. More specifically, as shown in FIGS. 3 and 4, the space 14 includes an annular space 14A including an inner annular space 14A1 formed by the inner annular groove GA1 and an outer annular space 14A2 formed by the outer annular groove GA2. Have. The annular space 14 </ b> A is provided over the entire circumference of the support member 12 in the circumferential direction.

  In addition, the space 14 should just be provided along the circumferential direction of the support member 12, and it is not limited to the case where it has the annular space 14A (it is provided in a perimeter).

  The space 14 includes a communication space (communication portion) 14B that is formed by the communication groove GB and communicates the inner annular space 14A1 and the outer annular space 14A2. The space 14 communicates with the inner space S1 of the support member 12 through an inner opening A1 formed by the inner opening groove GC. The space 14 is isolated from the outer space S2 of the support member 12 (the space where the outer surface 12C faces).

  The space 14 forms a heat insulating part between the base material 11 and the support member 12. The space 14 communicates with the inner space S1 of the support member 12 through the inner opening A1. Accordingly, the space 14 has the same atmosphere as the atmosphere of the inner space S1 of the support member 12.

  For example, as shown in FIG. 3, when the holding device 10 is provided in a semiconductor manufacturing apparatus, the outer surface 12 </ b> C of the support member 12, the upper surface 11 </ b> A of the base material 11, etc. It will be exposed in the processing atmosphere in the chamber. On the other hand, the inner space S1 of the support member 12 is exposed to the atmosphere or an inert gas atmosphere.

  By forming a space 14 having the same atmosphere as the air or inert gas atmosphere between the base material 11 and the support member 12 (within the bonding surface), the space 14 becomes a heat insulating space having good heat insulating performance. Further, for example, there is no need to provide piping equipment for ensuring the heat insulation performance in the space 14.

  The space 14 includes an annular space 14 </ b> A provided over the entire circumference of the support member 12 in the circumferential direction. Therefore, the heat transfer path between the base member 11 and the support member 12 in the radial direction of the support member 12 is limited. Therefore, good heat insulation performance can be obtained at the joint surface between the base material 11 and the support member 12.

  Further, since the space 14 includes the plurality of annular spaces 14A1 and 14A2 and the communication space 14B that communicates the plurality of annular spaces 14A1 and 14A2, stable heat insulation performance can be obtained over the entire upper end surface 12A of the support member 12.

  FIG. 5 is a diagram illustrating a result of measuring the temperature distribution of the upper surface 11A of the base material 11 of the holding device 10 when the holding device 10 is heated. In addition, in order to evaluate the heating uniformity of the holding device 10, as a comparative example, a holding device 100 having the same configuration as the holding device 10 except that the space 14 is not provided is prepared. Compared. That is, the holding device 100 according to the comparative example has a structure in which the support member has a flat upper end surface that does not have a groove, and the entire upper end surface is bonded to the lower surface of the base material.

  The horizontal axis in FIG. 5 indicates the position in the upper surface 11A of the substrate 11, and the vertical axis indicates the temperature. As shown in FIG. 5, it can be seen that the temperature change in the vicinity of the joint surface between the base material 11 and the support member 12 is greatly suppressed. In particular, it can be seen that the temperature difference in the vicinity of the joint portion of the base material 11 with the support member 12 is suppressed to about half that of the holding device 100. Thus, by using the holding device 10, the temperature in the base material 11 is made uniform, and the object SB can be heated evenly.

  The space 14 is isolated from the outer space S2 of the support member 12. Therefore, for example, the process gas in the processing chamber is prevented from entering the space 14. Therefore, for example, it is possible to prevent the inner surface of the groove G1 from being corroded by the process gas, and it is possible to obtain a good heat insulating performance for a long time.

  FIG. 6 is a schematic cross-sectional view of a holding device 10A according to a modification of the first embodiment. FIG. 6 is a cross-sectional view similar to FIG. 3 in the holding device 10A. In the present modification, the holding device 10A has a structure in which a space 17 similar to the space 14 is formed on the base material 15 side.

  First, the holding device 10A is made of a ceramic sintered body, and has a plate-like base material 15 having an upper surface 15A and a lower surface 15B, and a cylindrical shape having an upper end surface 16A made of a ceramic sintered body and connected to the lower surface 15B. A support member 16 and a heating resistor 13 are provided. Here, the support member 16 forms the inner space S1 by the inner surface 16B, and the outer surface 16C faces the outer space S2. The holding device 10 </ b> A holds the object SB on the upper surface 15 </ b> A of the base material 15.

  Next, the holding device 10 </ b> A has a space 17 provided at least partially along the circumferential direction of the support member 16 between the base material 15 and the support member 16. In the present modification, the space 17 communicates with the inner space S1 of the support member 16 via an inner opening A1 formed in the lower surface 15B of the base material 15. In the present modification, the space 17 and the inner opening A <b> 1 are formed by the groove G <b> 11 provided in the base material 15.

  The space 17 has an annular space 17A and a communication space 17B having the same configuration as the annular space 14A and the communication space 14B of the space 14 except that the space 17 is provided on the lower surface 15B of the base material 15. The annular space 17A of the space 17 communicates with the inner space S1 of the support member 16 via the inner opening A1.

  As in this modification, the space 17 communicating with the inner space S1 (for example, the atmosphere or an inert gas atmosphere) may be formed by the groove G11 provided in the lower surface 15B of the base material 15. The space may be formed by grooves provided on both the lower surface 15B of the base material 15 and the upper end surface 16A of the support member 16. Further, the inner opening A1 may be provided on either the support member 12 side or the base material 15 side, as shown in the present embodiment and its modifications.

  In other words, it is only necessary to provide a space communicating with the inner space S1 of the support member via the inner opening A1 formed on at least one of the lower surface of the base material and the inner surface of the support member. As a result, it is possible to provide a holding device capable of suppressing heat unevenness of an object by performing reliable heat insulation between the base material and the support member and suppressing a temperature gradient in the base material. Become.

(Second Embodiment)
FIG. 7 is a schematic cross-sectional view of the holding device 20 according to the second embodiment. FIG. 8 is a schematic top view of the support member 21 of the holding device 20. 7 and 8 are a cross-sectional view and a top view of the holding device 20 similar to FIGS. 3 and 4, respectively. The holding device 20 has the same configuration as the holding device 10 except for the configuration of the support member 21 and the space 22.

  First, the support member 21 is a cylindrical member having an upper end surface 21 </ b> A that is a joint surface with the lower surface 11 </ b> B of the base material 11. Further, the support member 21 forms an inner space S1 with the inner side surface 21B, and the outer side surface 21C faces the outer space S2.

  Next, the holding device 20 has a space 22 (second space) provided at least partially along the circumferential direction of the upper end surface 21 </ b> A of the support member 21. The space 22 communicates with the outer space S2 of the support member 21 through an outer opening A2 provided in the outer surface 21C of the support member 21.

  In the present embodiment, the space 22 and the outer opening A <b> 2 are formed by a groove G <b> 2 provided in the upper end surface 21 </ b> A of the support member 21. Specifically, as shown in FIG. 8, the groove G2 communicates with the annular groove GA including the inner annular groove GA1 and the outer annular groove GA2 similar to the groove G1, and the inner annular groove GA1 and the outer annular groove GA2. And a communication groove GB.

  On the other hand, in the present embodiment, the groove G2 includes an outer opening groove GD that reaches the outer surface 12C of the support member 12 from the outer annular groove GA2. In the present embodiment, as shown in FIG. 8, the communication groove GB and the outer opening groove GD are arranged at positions facing each other across the inner space S <b> 1 of the support member 21.

  The space 22 and the outer opening A2 are spaces surrounded by the groove G2 and the lower surface 11B of the substrate 11. More specifically, as shown in FIGS. 7 and 8, the space 22 includes an annular space 22A including an inner annular space 22A1 formed by the inner annular groove GA1 and an outer annular space 22A2 formed by the outer annular groove GA2. Have. The annular space 22 </ b> A is provided over the entire circumference of the support member 21 in the circumferential direction.

  The space 22 includes a communication space (communication portion) 22B that is formed by the communication groove GB and communicates the inner annular space 22A1 and the outer annular space 22A2. The space 22 communicates with the outer space S2 of the support member 21 through an outer opening A2 formed by the outer opening groove GD. The space 22 is isolated from the inner space S1 of the support member 21.

  In the present embodiment, the holding device 20 has a space 22 that communicates with the outer space S2 of the support member 21 via the outer opening A2 between the base material 11 and the support member 21. Accordingly, the space 22 forms a heat insulating portion having the same atmosphere as the outer space S <b> 2 of the support member 21.

  In the present embodiment, for example, the space 22 has the same atmosphere as the processing atmosphere in the process chamber in the semiconductor manufacturing apparatus. For example, the space 22 is under reduced pressure during the semiconductor manufacturing process and is at normal pressure after the process. Therefore, the atmosphere in the space 22 is an atmosphere managed before and after the process. Therefore, the space 22 can form a heat insulating space having good heat insulating performance. Moreover, it is not necessary to provide new parts for heat insulation.

  In the space 22, the internal environment changes from under reduced pressure to normal pressure during and after the process. Therefore, the entire bottom surface 11B of the base material 11 is exposed in the same atmosphere as the top surface 11A except for the joint surface with the support member 21. Therefore, the entire base material 11 can be heated and cooled in a short time while performing stable heat insulation in the space 22. Therefore, not only the heating unevenness of the object SB but also the processing time can be shortened.

  In the present embodiment, the case where the space 22 communicates with the outer space S2 of the support member 21 through the outer opening A2 provided on the outer surface 21C of the support member 21 has been described. However, the configuration of the space 22 is not limited to this.

  For example, the space communicating with the outer space S <b> 2 of the support member 21 may be provided on the lower surface 11 </ b> B side of the base material 11. For example, a groove similar to the groove G2 may be provided on the lower surface 11B of the base material 11 in contact with the upper end surface 21A of the support member 21, thereby forming a space communicating with the outer space S2. Further, grooves may be provided on both the lower surface 11B of the base material 11 and the upper end surface 21A of the support member 21, and thereby a space communicating with the outer space S2 of the support member 21 may be formed.

  Further, the outer opening A2 that communicates the space with the outer space S2 of the support member 21 may be provided not only in the support member 21 but also on the base material 11 side, and provided in both of them. May be.

  In other words, it is only necessary to form a space communicating with the outer space S2 of the support member via the outer opening A2 formed in at least one of the lower surface of the substrate and the outer surface of the support member. Accordingly, it is possible to provide a holding device capable of suppressing heat unevenness of an object by performing reliable heat insulation between the substrate and the support member and suppressing a temperature gradient in the substrate.

(Third embodiment)
FIG. 9 is a schematic cross-sectional view of the holding device 30 according to the third embodiment. FIG. 10 is a schematic top view of the support member 31 of the holding device 30. 9 and 10 are a cross-sectional view and a top view, respectively, similar to FIGS. 3 and 4 in the holding device 30. The holding device 30 has the same configuration as the holding device 10 or 20 except for the configuration of the support member 31 and the space 32.

  First, the support member 31 is a cylindrical member having an upper end surface 31 </ b> A that is a joint surface with the lower surface 11 </ b> B of the base material 11. Further, the support member 31 forms an inner space S1 with the inner side surface 31B, and the outer side surface 31C faces the outer space S2.

  In the present embodiment, the holding device 30 has a space 32 provided at least partially along the circumferential direction of the support member 31 between the base material 11 and the support member 31. Further, the space 32 is formed in the first space 32 </ b> A communicating with the inner space S <b> 1 of the support member 31 through the inner opening A <b> 1 formed in the inner surface 31 </ b> B of the support member 31 and the outer surface 31 </ b> C of the support member 31. A second space 32B communicating with the outer space S2 of the support member 31 via the outer opening A2.

  In the present embodiment, the space 32, the inner opening A <b> 1, and the outer opening A <b> 2 are formed by a groove G <b> 3 provided on the upper end surface 31 </ b> A of the support member 31. Specifically, as shown in FIG. 10, the groove G3 includes an annular groove GA including an inner annular groove GA1 and an outer annular groove GA2 similar to the groove G1.

  On the other hand, in the present embodiment, the groove G3 includes an inner opening groove GC that reaches the inner surface 31B of the support member 31 from the inner annular groove GA1, and an outer opening groove GD that reaches the outer surface 31C of the support member 31 from the outer annular groove GA2. Including. In the present embodiment, as shown in FIG. 10, the inner opening groove GC and the outer opening groove GD are arranged at positions facing each other across the inner space S <b> 1 of the support member 31.

  The space 32, the inner opening A1, and the outer opening A2 are spaces surrounded by the groove G3 and the lower surface 11B of the base material 11. More specifically, as shown in FIGS. 9 and 10, the space 32 includes a first space (inner annular space) 32 </ b> A formed by the inner annular groove GA <b> 1 and a second space (by the outer annular groove GA <b> 2). Outer annular space) 32B. In the present embodiment, the first space 32 </ b> A and the second space 32 </ b> B are provided over the entire circumference of the support member 31 in the circumferential direction.

  Further, the first space 32A communicates with the inner space S1 of the support member 31 through the inner opening A1 formed by the inner opening groove GC. On the other hand, the second space 32B communicates with the outer space S2 of the support member 31 through the outer opening A2 formed by the outer opening groove GD.

  That is, in the present embodiment, the holding device 30 communicates as the space 32 with the first space 32A that communicates with the inner space S1 of the support member 31 via the inner opening A1 and the outer space S2 via the outer opening A2. And the second space 32B. The first space 32A and the second space 32B are independent from each other (isolated from each other).

  The present embodiment is a mode in which the first embodiment (the space 14 as the first space) and the second embodiment (the space 22 as the second space) are combined. That is, in the present embodiment, a region exposed in the atmosphere of the inner space S1 of the support member 31 and the outer space S2 of the support member 31 between the lower surface 11B of the base material 11 and the upper end surface 31A of the support member 31. And an exposed region in the atmosphere.

  For example, the present embodiment has a configuration suitable when considering the adjustment of the heat insulation performance between the base material 11 and the support member 31. For example, the surface temperature of the base material 11 (its upper surface 11A) can be adjusted with a high degree of freedom by combining the first and second spaces 32A and 32B to form the space 32 as a heat insulating portion. For example, it is possible to provide a difference in heat insulation performance between the first space 32A and the second space 32B by utilizing the difference in the properties and temperature of the gas in the atmosphere between the inner space S1 and the outer space S2. is there.

  By combining the first and second embodiments as in the present embodiment, reliable heat insulation between the base material 11 and the support member 31 is performed, and furthermore, the heat insulation performance is variable depending on the region, It is possible to effectively suppress the temperature gradient in the material 11 and suppress the uneven heating of the object SB.

  In the present embodiment, the space 32 communicates with the inner space S1 and the outer space S2 of the support member 31 via the inner opening A1 and the outer opening A2 provided on the inner surface 31B and the outer surface 31C of the support member 31. Explained the case. However, the configuration of the space 32 is not limited to this.

  For example, a groove similar to the groove G3 may be provided on the lower surface 11B of the base material 11 in contact with the upper end surface 31A of the support member 31, thereby forming a space communicating with the inner space S1 and the outer space S2. Further, grooves may be provided on both the lower surface 11B of the base material 11 and the upper end surface 31A of the support member 31, thereby forming a space communicating with the inner space S <b> 1 and the outer space S <b> 2 of the support member 31. Further, the inner opening A1 and the outer opening A2 may be provided on the base material 11 side.

  In other words, the first space communicating with the inner space S1 of the support member via the inner opening A1 formed in at least one of the lower surface of the base material and the inner surface of the support member, and the lower surface of the base material It suffices to include a second space communicating with the outer space S2 of the support member via the outer opening A2 formed in at least one of the outer surface of the support member.

  As described with the holding devices 10, 10A, 20 and 30 as an example, the holding device according to the present invention is made of a ceramic sintered body, and has a plate-like base material having an upper surface and a lower surface located on the opposite side of the upper surface. A cylindrical support member made of a ceramic sintered body and having an upper end surface connected to the lower surface of the base material, and a heating resistor embedded in the base material, on the upper surface of the base material Hold the object SB.

  The holding device according to the present invention has a space provided at least partially along the circumferential direction of the support member between the base material and the support member, and the space includes the lower surface of the base material and the support member. Formed in at least one of the first space communicating with the inner space of the support member via the inner opening formed in at least one of the inner surface of the substrate, the lower surface of the base material, and the outer surface of the support member. And at least one of a second space communicating with the outer space of the support member through the outer opening.

  Therefore, it is possible to provide a holding device capable of suppressing uneven heating of the target object by performing reliable heat insulation between the base material and the support member and suppressing a temperature gradient in the base material.

  Moreover, the said space contains the cyclic | annular space provided over the perimeter of the circumferential direction of a supporting member. Therefore, the heat transfer path between the base member and the support member along the radial direction of the support member is limited. Therefore, good heat insulation performance can be obtained at the joint surface between the base material and the support member.

  In addition, the space includes a plurality of annular spaces and a communication space that communicates the plurality of annular spaces with each other. Therefore, good heat insulation performance can be obtained over the entire upper end surface of the support member.

  The space includes the first space and the second space, and the first space and the second space are independent of each other. Therefore, it is possible to provide a holding device that can suppress the uneven heating of the object by adjusting the temperature distribution of the upper end surface of the support member to suppress the temperature gradient in the base material.

  10, 10A, 20, 30 ... holding device 11, 15 ... base material, 11B, 15B ... lower surface, 12, 16, 21, 31 ... support member, 13 ... heating resistor, 14, 17, 32A ... space (first) 1 space), 22, 32B ... space (second space), A1 ... inside opening, A2 ... outside opening, 14A, 17A, 22A, 32A, 32B ... annular space, 14B, 17B, 22B ... communication space.

Claims (4)

A plate-like substrate made of a ceramic sintered body and having an upper surface and a lower surface located on the opposite side of the upper surface;
A cylindrical support member comprising a ceramic sintered body and having an upper end surface connected to the lower surface of the substrate;
A heating resistor embedded in the base material, and a holding device for holding an object on the upper surface of the base material,
Between the base material and the support member, at least a part has a space provided along the circumferential direction of the support member,
A first space in which the space communicates with an inner space of the support member via an inner opening formed in at least one of a lower surface of the base material and an inner surface of the support member; A holding device comprising: at least one of a second space communicating with an outer space of the support member through an outer opening formed in at least one of the lower surface and the outer surface of the support member.   2. The holding device according to claim 1, wherein at least one of the first space and the second space includes an annular space provided over the entire circumference in the circumferential direction of the support member.   The holding device according to claim 2, wherein at least one of the first space and the second space includes a plurality of the annular spaces and a communication space that allows the plurality of annular spaces to communicate with each other.   The holding according to any one of claims 1 to 3, wherein the space includes the first space and the second space, and the first space and the second space are independent of each other. apparatus.