JP2018082021A - Electronic apparatus - Google Patents

Electronic apparatus Download PDF

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Publication number
JP2018082021A
JP2018082021A JP2016222857A JP2016222857A JP2018082021A JP 2018082021 A JP2018082021 A JP 2018082021A JP 2016222857 A JP2016222857 A JP 2016222857A JP 2016222857 A JP2016222857 A JP 2016222857A JP 2018082021 A JP2018082021 A JP 2018082021A
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Prior art keywords
heat
substrate
electronic device
mounting surface
grease
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JP2016222857A
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Japanese (ja)
Inventor
哲 水城
Tetsu Mizusiro
哲 水城
吉川 正人
Masato Yoshikawa
正人 吉川
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Toyoda Gosei Co Ltd
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Toyoda Gosei Co Ltd
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Priority to JP2016222857A priority Critical patent/JP2018082021A/en
Publication of JP2018082021A publication Critical patent/JP2018082021A/en
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Abstract

PROBLEM TO BE SOLVED: To provide an electronic apparatus having a heat release part ensuring sufficient heat dissipation effect even with a small number of components, and capable of suppressing leakage of heat transmission grease.SOLUTION: An electronic apparatus having a heating element includes a board mounting an element, a housing section for housing the board while exposing the element non-mounting surface of the board, and heat release section. The heat release section has a fixed part to be fixed to the side of the housing section, and a heat receiving section having a face opposing the element non-mounting surface so as to cover the element non-mounting surface, and the heat receiving section has a grease pool. Heat conduction from the board to the heat release section becomes more effective because of the existence of grease in the grease pool, thus improving heat reception and heat release effect by the heat release section. The grease pool may have a protrusion of closed loop. The fixed part may be fixed to press the heat receiving section against the element non-mounting surface.SELECTED DRAWING: Figure 6

Description

本発明は電子機器に関するものであり、より詳しくは、熱を発する素子を有する電子機器に関するものである。   The present invention relates to an electronic device, and more particularly to an electronic device having an element that generates heat.

熱を発する素子を有する電子機器からの放熱のために放熱フィンが用いられることがある。そのような電子機器の従来の一例としての電子機器100を図7に示す。図7(A)は電子機器100の斜視図、図7(B)は電子機器100の平面図、図7(C)は図7(B)の電子機器100のVIIC−VIIC断面図、図7(D)は図7(B)の電子機器100のVIID−VIID断面図である。図7に示す電子機器100は、基板101の面のうち、熱を発する素子101aを搭載した面とは反対側の面と、複数の放熱フィンを有するヒートシンク102の、放熱フィンとは反対側の面の間に伝熱ゲルシート103を挟み込み、ヒートシンク102の放熱フィン側の面からカバー104を被せ、カバー104の側面の穴104aにハウジング105の爪105aを掛けて止めている。カバー104は複数の板ばね104bを有しており、複数の板ばね104bがヒートシンク102を基板101に対して押圧する力を発揮する。これにより、基板101の素子非搭載面と、伝熱ゲルシート103と、ヒートシンク102の放熱フィンと反対側の面は密着し、それらの間での伝熱効果を高めることができる。   A heat radiation fin may be used for heat radiation from an electronic device having an element that generates heat. FIG. 7 shows an electronic device 100 as a conventional example of such an electronic device. 7A is a perspective view of the electronic device 100, FIG. 7B is a plan view of the electronic device 100, FIG. 7C is a VIIC-VIIC cross-sectional view of the electronic device 100 of FIG. FIG. 7D is a VID-VID cross-sectional view of the electronic device 100 of FIG. The electronic device 100 illustrated in FIG. 7 includes a surface of the substrate 101 opposite to the surface on which the element 101a that generates heat is mounted, and a heat sink 102 having a plurality of heat dissipation fins on the side opposite to the heat dissipation fins. The heat transfer gel sheet 103 is sandwiched between the surfaces, the cover 104 is covered from the surface of the heat sink 102 on the side of the heat radiating fins, and the holes 104a on the side surface of the cover 104 are hung by the claws 105a of the housing 105. The cover 104 has a plurality of leaf springs 104 b, and the plurality of leaf springs 104 b exerts a force that presses the heat sink 102 against the substrate 101. Thereby, the element non-mounting surface of the substrate 101, the heat transfer gel sheet 103, and the surface of the heat sink 102 on the side opposite to the heat dissipating fins are in close contact with each other, and the heat transfer effect between them can be enhanced.

しかしながら、放熱フィンを用いているため、電子機器全体の大きさが大きくなってしまう。また、板ばね104bの形成されたカバー104を用いているため、部品点数が多くなってしまう。さらに、伝熱ゲルシート103を用いるため、その分コスト高となってしまう。伝熱ゲルシート103に代えて伝熱グリースを用いた場合には、板ばね104bの働きにより基板101およびヒートシンク102が互いに押圧されることでそれらの間の隙間が狭くなり、そこから伝熱グリースが外部に押し出され、放熱機能が悪化するとともに、はみ出した伝熱グリースにより外観不良となる。   However, since the heat radiating fins are used, the size of the entire electronic device is increased. Further, since the cover 104 having the leaf spring 104b is used, the number of parts is increased. Furthermore, since the heat transfer gel sheet 103 is used, the cost increases accordingly. When heat transfer grease is used instead of the heat transfer gel sheet 103, the gap between the substrate 101 and the heat sink 102 is pressed by the action of the leaf spring 104b, so that the heat transfer grease is reduced from there. Extruded to the outside, the heat dissipation function deteriorates, and the protruding heat transfer grease causes poor appearance.

本発明は前記問題を解決するためになされたものであって、その目的は、少ない部品点数でも十分な放熱効果を得られる放熱部を有するとともに、伝熱グリースの漏出を抑制できる電子機器を提供することにある。   The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to provide an electronic device that has a heat radiating portion that can obtain a sufficient heat radiating effect even with a small number of parts and can suppress leakage of heat transfer grease. There is to do.

本発明の発明者らは前記課題を解決するために鋭意検討を重ねた結果、下記のように本発明の各局面に想到した。
すなわち、本発明の第1の局面による電子機器は、発熱する素子を有する電子機器であって、素子が搭載された基板と、基板の素子非搭載面を露出させて基板を収納する収納部と、放熱部と、を備え、放熱部は、収納部の側面に固定される被固定部と、素子非搭載面を覆うように素子非搭載面に対向する面を有する受熱部と、を有し、受熱部はグリースだまりを有する、電子機器である。
上記の構成によれば、グリースだまり内部のグリースの存在により基板から放熱部への熱伝導がより効果的に行われ、放熱部による受熱および放熱の効果が高められる。
The inventors of the present invention have intensively studied to solve the above problems, and as a result, have arrived at the various aspects of the present invention as follows.
That is, the electronic device according to the first aspect of the present invention is an electronic device having a heat generating element, and a substrate on which the element is mounted, and a storage unit that stores the substrate by exposing the element non-mounting surface of the substrate. A heat dissipating part, and the heat dissipating part has a fixed part fixed to the side surface of the storage part, and a heat receiving part having a surface facing the element non-mounting surface so as to cover the element non-mounting surface. The heat receiving part is an electronic device having a grease reservoir.
According to said structure, the heat conduction from a board | substrate to a thermal radiation part is performed more effectively by presence of the grease inside a grease reservoir, and the effect of the heat reception and thermal radiation by a thermal radiation part is improved.

また、本発明の第2の局面によれば、上記電子機器において、グリースだまりは、閉ループ状の突条部を有する。これにより、所定の容積を有する閉空間としてのグリースだまりを形成することができる。また、閉ループ状の突条部により、グリースがグリースだまりから外部へ漏出することを抑制できる。
また、本発明の第3の局面によれば、上記電子機器において、被固定部は、受熱部を素子非搭載面に対して押圧するように固定される。これにより、受熱部の突条部を素子非搭載面に対して押し付けることができるため、グリースだまりの密閉性を高めることができ、グリースの漏出を抑制する効果が高められる。
According to the second aspect of the present invention, in the electronic device, the grease pool has a closed loop-shaped protrusion. Thereby, a grease pool as a closed space having a predetermined volume can be formed. Moreover, it is possible to suppress the leakage of grease from the grease reservoir to the outside by the closed loop-shaped protrusion.
According to the third aspect of the present invention, in the electronic device, the fixed part is fixed so as to press the heat receiving part against the element non-mounting surface. Thereby, since the protrusion part of a heat receiving part can be pressed with respect to an element non-mounting surface, the sealing property of a grease pool can be improved and the effect which suppresses the leakage of grease is heightened.

また、本発明の第4の局面によれば、上記電子機器において、収納部の側面は突起を有し、被固定部は突起と係合する孔を有する。
また、本発明の第5の局面によれば、上記電子機器において、受熱部と収納部がケースを形成する。これにより、放熱部の受熱部がケースの一部を形成するため、全体としての部品点数を低減することに貢献できる。
According to the fourth aspect of the present invention, in the electronic device, the side surface of the storage portion has a protrusion, and the fixed portion has a hole that engages with the protrusion.
According to the fifth aspect of the present invention, in the electronic device, the heat receiving portion and the storage portion form a case. Thereby, since the heat receiving part of a thermal radiation part forms a part of case, it can contribute to reducing the number of parts as a whole.

また、本発明の第6の局面によれば、上記電子機器において、放熱部は一枚の板状部材である。このような構成とすれば、放熱部をフィン形状のものとする構成と比べて電子機器がコンパクトになり、しかも、電子機器の製造コストも低減できる。
また、本発明の第7の局面によれば、上記電子機器において、被固定部は収納部の側面に沿う形状を有する。これにより、電子機器がコンパクトになる。
According to the sixth aspect of the present invention, in the electronic device, the heat dissipation part is a single plate-like member. With such a configuration, the electronic device is more compact than a configuration in which the heat dissipating part has a fin shape, and the manufacturing cost of the electronic device can be reduced.
According to the seventh aspect of the present invention, in the electronic device, the fixed portion has a shape along the side surface of the storage portion. Thereby, an electronic device becomes compact.

また、本発明の第8の局面によれば、上記電子機器において、収納部は直方体状の形状を有し、放熱部は収納部の直方体状の形状の一つの面および該一つの面と隣り合う別の二つまたは三つの面を覆う。これにより、放熱部はコンパクトな形状でありながら、受熱と放熱のための広い面積を有することができる。   According to the eighth aspect of the present invention, in the electronic device, the storage portion has a rectangular parallelepiped shape, and the heat dissipation portion is adjacent to the one surface of the rectangular parallelepiped shape of the storage portion and the one surface. Cover another two or three faces that fit. Thereby, although a heat radiating part is a compact shape, it can have a wide area for heat receiving and heat radiation.

図1は本発明の一実施形態に係る車両用照明装置の分解斜視図である。FIG. 1 is an exploded perspective view of a vehicle lighting device according to an embodiment of the present invention. 図2は一実施形態に係る車両用照明装置の斜視図である。FIG. 2 is a perspective view of the vehicle lighting device according to the embodiment. 図3は図2の車両用照明装置を裏側から視た斜視図である。FIG. 3 is a perspective view of the vehicular illumination device of FIG. 2 viewed from the back side. 図4(A)は一実施形態に係る車両用照明装置のハウジングを反射部側から見た図であり、図4(B)はハウジングを基板収納部側から見た図である。FIG. 4A is a view of the housing of the vehicle lighting device according to the embodiment as seen from the reflecting portion side, and FIG. 4B is a view of the housing as seen from the substrate storage portion side. 図5(A)は一実施形態に係る車両用照明装置の裏側の平面図であり、図5(B)は図5(A)の車両用照明装置のVB−VB断面図であり、図5(C)は図5(A)の車両用照明装置のVC−VC断面図であり、図5(D)は図5(A)の車両用照明装置のVD−VD断面図である。5A is a plan view of the back side of the vehicle lighting device according to the embodiment, and FIG. 5B is a VB-VB sectional view of the vehicle lighting device of FIG. 5A. (C) is a VC-VC cross-sectional view of the vehicular illumination device of FIG. 5 (A), and FIG. 5 (D) is a VD-VD cross-sectional view of the vehicular illumination device of FIG. 5 (A). 図6(A)は図5(C)に示す車両用照明装置の要部を拡大して示す拡大部分断面図であり、図6(B)は図6(A)の断面図において一点鎖線VIBで囲んだ範囲の近傍を更に拡大して示す拡大部分断面図であり、図6(C)は図6(A)の断面図において一点鎖線VICで囲んだ範囲の近傍を更に拡大して示す拡大部分断面図であり、図6(D)は図6(C)に示す構成の変形例を示す拡大部分断面図である。6A is an enlarged partial cross-sectional view showing an essential part of the vehicular lighting device shown in FIG. 5C, and FIG. 6B is an alternate long and short dash line VIB in the cross-sectional view of FIG. FIG. 6C is an enlarged partial cross-sectional view showing the vicinity of the range surrounded by a circle, and FIG. 6C is an enlarged view showing the vicinity of the range surrounded by the alternate long and short dash line VIC in the cross-sectional view of FIG. FIG. 6D is an enlarged partial cross-sectional view showing a modification of the configuration shown in FIG. 6C. 図7は従来例の電子機器を示す図であり、図7(A)は斜視図、図7(B)は平面図、図7(C)は図7(B)の電子機器のVIIC−VIIC断面図、図7(D)は図7(B)の電子機器のVIID−VIID断面図である。7A and 7B are diagrams showing a conventional electronic device. FIG. 7A is a perspective view, FIG. 7B is a plan view, and FIG. 7C is a VIIC-VIIC of the electronic device in FIG. FIG. 7D is a cross-sectional view of the electronic device of FIG.

以下、本発明を具体化した一実施形態に係る車両用照明装置1について、図面を参照しながら説明する。図1は本発明の一実施形態に係る車両用照明装置1の分解斜視図であり、図2は一実施形態に係る車両用照明装置1の斜視図であり、図3は図2の車両用照明装置1を裏側から見た斜視図である。これらの図に例示する車両用照明装置1は、車室の天井部分に設置されるランプである。例えば、使用位置と収納位置との間で回動可能なサンバイザーがその収納位置にあるときにサンバイザーによって隠れる天井の部分に車両用照明装置1が設置されるものとしてもよい。車両用照明装置1の点灯および消灯の動作は、サンバイザーの収納位置と使用位置の間の回動と連動して行われるものであってもよく、サンバイザーに設けられるバニティミラーの蓋の開閉と連動して行われるものであってもよく、あるいは、別途のスイッチにより行われるものであってもよく、更には、これらに限られない。   Hereinafter, a vehicular lighting device 1 according to an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is an exploded perspective view of a vehicular illumination device 1 according to an embodiment of the present invention, FIG. 2 is a perspective view of the vehicular illumination device 1 according to an embodiment, and FIG. 3 is the vehicular illumination device of FIG. It is the perspective view which looked at the illuminating device 1 from the back side. The vehicle lighting device 1 illustrated in these drawings is a lamp installed on a ceiling portion of a passenger compartment. For example, the vehicular lighting device 1 may be installed on a ceiling portion hidden by a sun visor when a sun visor that can be rotated between the use position and the storage position is in the storage position. The lighting and extinguishing operations of the vehicular illumination device 1 may be performed in conjunction with the rotation between the storage position of the sun visor and the use position, and the lid of the vanity mirror provided in the sun visor is opened and closed. It may be performed in conjunction with the device, or may be performed by a separate switch, and is not limited to these.

図示するように、車両用照明装置1はレンズ部10と、ハウジング20と、基板30と、カバー40を有する。
(レンズ部)
レンズ部10は主としてポリカーボネート樹脂(PC樹脂)、アクリル樹脂(PMMA樹脂)等の光透過性の樹脂からなる板状の部材である。レンズ部10には光拡散材が分散されていてもよい。レンズ部10の中央を含む部分は、その表面に対してシボ加工やレンズカット加工等の凹凸処理が行われることで内部構造が透視できない様になっている。
As illustrated, the vehicular lighting device 1 includes a lens unit 10, a housing 20, a substrate 30, and a cover 40.
(Lens part)
The lens unit 10 is a plate-like member mainly made of a light-transmitting resin such as polycarbonate resin (PC resin) or acrylic resin (PMMA resin). A light diffusing material may be dispersed in the lens unit 10. A portion including the center of the lens portion 10 is configured such that the inner structure cannot be seen through by performing uneven processing such as embossing or lens cutting on the surface.

(基板)
基板30はいわゆるプリント配線板によって実現され、特にアルミ基板や銅基板といった放熱性に優れる金属ベース基板により実現される。基板30の表面上に光源としてのLED31およびその他の素子が実装される。さらに、基板30にはコネクタ嵌合部32が設けられ、コネクタ嵌合部32の内部には、LED31への電力供給のための電源端子が収容される。コネクタ嵌合部32は電力供給用のコネクタを受け入れるためのコネクタ受け入れ開口32aを有する。LED31は発光部を含んでパッケージ化されており、電源端子と基板30の回路配線(図示省略)を介して電力が供給されるとその発光部が光を発する。パッケージ化されたLED31の外形形状は矩形状、円形状、弾丸状など任意である。
(substrate)
The substrate 30 is realized by a so-called printed wiring board, and particularly realized by a metal base substrate having excellent heat dissipation such as an aluminum substrate or a copper substrate. An LED 31 as a light source and other elements are mounted on the surface of the substrate 30. Further, the board 30 is provided with a connector fitting portion 32, and a power supply terminal for supplying power to the LED 31 is accommodated in the connector fitting portion 32. The connector fitting portion 32 has a connector receiving opening 32a for receiving a power supply connector. The LED 31 is packaged including a light emitting unit. When power is supplied via a power supply terminal and circuit wiring (not shown) of the substrate 30, the light emitting unit emits light. The outer shape of the packaged LED 31 is arbitrary, such as a rectangular shape, a circular shape, or a bullet shape.

(ハウジング)
ハウジング20はポリプロピレン樹脂(PP樹脂)、ポリブチレンテレフタレート樹脂(PBT樹脂)、ポリカーボネート樹脂(PC樹脂)、ABS樹脂、PC樹脂+ABS樹脂等の樹脂からなり、LED31からの光をレンズ部10側へ反射するための反射面21aを有する反射部21と、基板30を受け入れ、収納するための基板収納部22とを有する。図4(A)はハウジング20を反射部21側から見た図であり、図4(B)はハウジング20を基板収納部22側から見た図である。反射部21は内側に複数の反射面21aを有し、これらの反射面21aが略四角錐台状の形状を形成し、それらの内奥側の面21b(この面21bも反射面として機能し得る)に開口21c(以下、「LED挿通開口21c」と称する)を有する。LED挿通開口21cはLED31に対応する位置に設けられる。すなわち、基板30を基板収納部22に収納するとLED31はLED挿通開口21cに挿通する位置となる。
(housing)
The housing 20 is made of a resin such as polypropylene resin (PP resin), polybutylene terephthalate resin (PBT resin), polycarbonate resin (PC resin), ABS resin, PC resin + ABS resin, and reflects light from the LED 31 toward the lens unit 10 side. A reflecting portion 21 having a reflecting surface 21a for receiving the substrate 30 and a substrate receiving portion 22 for receiving and storing the substrate 30. 4A is a view of the housing 20 viewed from the reflecting portion 21 side, and FIG. 4B is a view of the housing 20 viewed from the substrate housing portion 22 side. The reflecting portion 21 has a plurality of reflecting surfaces 21a on the inside, and these reflecting surfaces 21a form a substantially quadrangular pyramid shape, and the inner side surface 21b (this surface 21b also functions as a reflecting surface). And an opening 21c (hereinafter referred to as “LED insertion opening 21c”). The LED insertion opening 21 c is provided at a position corresponding to the LED 31. That is, when the board | substrate 30 is accommodated in the board | substrate accommodating part 22, LED31 will be a position which penetrates LED insertion opening 21c.

反射部21において、内奥側の面21bに対向する側は全面が略矩形状の開口(以下、「光出射開口21d」と称する)となっており、その光出射開口21dの縁を画定するハウジング20の縁部分はレンズ部10の縁部分の裏側と係合可能である。なお、反射面21aは、反射率の高い材質、色等に設定することが好ましい。例えば、ハウジング20全体を白色にすることによって反射面21aを白色にしてもよいし、反射面21aのみを選択的に白色にしてもよい。   In the reflecting portion 21, the entire surface on the side facing the inner back surface 21b is a substantially rectangular opening (hereinafter referred to as “light emitting opening 21d”), and demarcates the edge of the light emitting opening 21d. The edge portion of the housing 20 can be engaged with the back side of the edge portion of the lens unit 10. In addition, it is preferable to set the reflective surface 21a to a highly reflective material, color, or the like. For example, the reflective surface 21a may be white by making the entire housing 20 white, or only the reflective surface 21a may be selectively white.

基板収納部22は反射部21の反射面21aおよび内奥側の面21bとは反対の側(すなわち、反射部21の外側の面)に一体的に形成され、少なくとも内奥側の面21bの反対側の面とその近傍部分を内包する。ハウジング20の一部は反射部21と基板収納部22の両方に属する。基板収納部22の外形は全体として直方体形状に沿う形状を有する。基板収納部22は、反射部21とは反対となる側に、基板30を受け入れるための基板受け入れ開口22aを有する。基板収納部22内には複数の基板支持部22bが設けられ、基板30のLED31を実装した面(以下、「素子搭載面」と称する)を基板支持部22bに当接させ、基板30の素子搭載面とは反対側の面(以下、「素子非搭載面」と称する)を基板受け入れ開口22aの外側へ向けて露出させる態様で、基板30を基板収納部22内に収納することができる。反射部21の内奥側の面21bの反対側の面も基板支持部22bに含まれる。また、基板収納部22は、基板30を収納した際に、コネクタ嵌合部32のコネクタ受け入れ開口32aに対応する位置にコネクタを挿通するためのコネクタ挿通開口22cを有する。基板受け入れ開口22aとコネクタ挿通開口22cは、基板収納部2の隣り合う2つの面にそれぞれ設けられる。   The substrate housing portion 22 is integrally formed on the side opposite to the reflecting surface 21a and the inner back surface 21b of the reflecting portion 21 (that is, the outer surface of the reflecting portion 21), and at least of the inner back surface 21b. Enclose the opposite surface and its vicinity. A part of the housing 20 belongs to both the reflection portion 21 and the substrate storage portion 22. The external shape of the board | substrate storage part 22 has a shape which follows a rectangular parallelepiped shape as a whole. The substrate storage portion 22 has a substrate receiving opening 22 a for receiving the substrate 30 on the side opposite to the reflecting portion 21. A plurality of substrate support portions 22 b are provided in the substrate storage portion 22, and a surface of the substrate 30 on which the LED 31 is mounted (hereinafter referred to as “element mounting surface”) is brought into contact with the substrate support portion 22 b to The substrate 30 can be stored in the substrate storage portion 22 in such a manner that a surface opposite to the mounting surface (hereinafter referred to as “element non-mounting surface”) is exposed to the outside of the substrate receiving opening 22a. The surface opposite to the inner surface 21b of the reflection portion 21 is also included in the substrate support portion 22b. Further, the board housing part 22 has a connector insertion opening 22c for inserting a connector at a position corresponding to the connector receiving opening 32a of the connector fitting part 32 when the board 30 is housed. The board receiving opening 22a and the connector insertion opening 22c are respectively provided on two adjacent surfaces of the board housing portion 2.

ハウジング20の外側の面には更に、車両の天井の内装材の係合開口の縁と係合することで車両用照明装置1を天井に取り付けるためのスナップフィット23が形成されている。スナップフィット23は、天井への装着時に天井の内装材の裏側の方向へ突出する山型の形状となるように形成されている。スナップフィット23には、レンズ部10の縁の外方向に突出する裾部が形成され、裾部が内装材の係合開口の縁に係止されるようになっている。   A snap fit 23 for attaching the vehicle lighting device 1 to the ceiling is formed on the outer surface of the housing 20 by engaging with the edge of the engagement opening of the interior material of the vehicle ceiling. The snap fit 23 is formed to have a mountain shape protruding in the direction of the back side of the ceiling interior material when mounted on the ceiling. The snap fit 23 is formed with a skirt that protrudes outward from the edge of the lens unit 10, and the skirt is locked to the edge of the engagement opening of the interior material.

(カバー40)
図5(A)は車両用照明装置1の裏側の平面図であり、図5(B)は図5(A)の車両用照明装置1のVB−VB断面図であり、図5(C)は図5(A)の車両用照明装置1のVC−VC断面図であり、図5(D)は図5(A)の車両用照明装置1のVD−VD断面図である。図6(A)は図5(C)に示す車両用照明装置1の要部(カバー40近傍部)を拡大して示す拡大部分断面図であり、図6(B)は図6(A)の断面図において一点鎖線VIBで囲んだ範囲付近を更に拡大して示す拡大部分断面図であり、図6(C)は図6(A)の断面図において一点鎖線VICで囲んだ範囲付近を更に拡大して示す拡大部分断面図である。
(Cover 40)
5A is a plan view of the back side of the vehicular lighting device 1, and FIG. 5B is a VB-VB cross-sectional view of the vehicular lighting device 1 of FIG. 5A, and FIG. FIG. 5A is a sectional view taken along the line VC-VC of the vehicle lighting device 1 in FIG. 5A, and FIG. 5D is a sectional view taken along the line VD-VD of the vehicle lighting device 1 in FIG. 6A is an enlarged partial cross-sectional view showing an enlarged main part (the vicinity of the cover 40) of the vehicular lighting device 1 shown in FIG. 5C, and FIG. 6B is FIG. 6A. FIG. 6C is an enlarged partial cross-sectional view showing the vicinity of the range surrounded by the alternate long and short dash line VIB in FIG. 6C, and FIG. 6C is a cross-sectional view of FIG. It is an enlarged partial sectional view expanding and showing.

カバー40はアルミニウム、鉄、銅等の金属、窒化アルミニウム等の無機材料、金属またはカーボンを含有させた樹脂等からなり、一枚の板を折り曲げた形状を有する。より詳細には、図1に示すように、カバー40は基板収納部22の基板受け入れ開口22aに対向して、それを覆うための略矩形状の受熱部41を有する。カバー40は受熱部41の両側の二辺と境界を接し、受熱部41から同じ側へそれぞれ約90度折り曲げられた状態の平板状の2つの側方延在部42、43を有し、受熱部41の残る二辺と境界を接する部分には側方延在部が存在しない。これにより、カバー40を基板収納部22に装着した時に、基板収納部22の基板受け入れ開口22aを有する面およびコネクタ挿通開口22cを有する面と境界を接する2つの側面がカバー40の2つの側方延在部42、43により覆われる一方で、コネクタ挿通開口22cはカバー40によって覆われない。カバー40は更にもう一つの側方延在部を、基板収納部22のコネクタ挿通開口22cと反対側の面を覆う位置に有していてもよい。   The cover 40 is made of a metal such as aluminum, iron or copper, an inorganic material such as aluminum nitride, a resin containing metal or carbon, and has a shape obtained by bending a single plate. More specifically, as shown in FIG. 1, the cover 40 has a substantially rectangular heat receiving portion 41 that faces the substrate receiving opening 22 a of the substrate storing portion 22 and covers it. The cover 40 has two flat side-extending portions 42 and 43 that are in contact with the two sides of the heat receiving portion 41 and are bent about 90 degrees from the heat receiving portion 41 to the same side. There is no laterally extending portion at the portion of the portion 41 that contacts the remaining two sides. Thus, when the cover 40 is attached to the substrate storage part 22, the two side surfaces that are in contact with the surface having the board receiving opening 22a and the surface having the connector insertion opening 22c of the substrate storage part 22 are located on the two sides of the cover 40. The connector insertion opening 22 c is not covered by the cover 40 while being covered by the extending portions 42 and 43. The cover 40 may have another side extending portion at a position covering the surface of the board housing portion 22 opposite to the connector insertion opening 22c.

受熱部41はカバー40の内側に突出する閉ループ状の突条部41aを有する。2つの側方延在部42、43は基板収納部22に対して固定される被固定部としての機能を有する。すなわち、被固定部としての側方延在部42、43にはそれぞれ複数の係合孔42a、43aが形成され、カバー40を基板収納部22に対して装着する際、基板収納部22の基板受け入れ開口22aとコネクタ挿通開口22cが形成された2つの面と境界を接する、向かい合う2つの側面の外側に形成された複数の係合突起22dとそれぞれ係合する。そのとき、カバー40の受熱部41の突条部41aはその全周において、基板30の素子非搭載面に当接し、基板30の素子搭載面はハウジング20の基板支持部22bに当接する。これによって、基板30は受熱部41の突条部41aとハウジング20の基板支持部22bの間に挟持され保持される。カバー40の受熱部41がハウジング20に直接接触しないように各部の寸法が決定されている。   The heat receiving portion 41 has a closed loop-shaped protruding portion 41 a that protrudes inside the cover 40. The two laterally extending portions 42 and 43 have a function as a fixed portion that is fixed to the substrate storage portion 22. That is, a plurality of engagement holes 42 a and 43 a are formed in the laterally extending portions 42 and 43 as fixed portions, respectively, and when the cover 40 is attached to the substrate storage portion 22, the substrate of the substrate storage portion 22 is formed. The receiving openings 22a and the connector insertion openings 22c are respectively engaged with a plurality of engaging protrusions 22d formed on the outer sides of the two opposing side faces that are in contact with the two faces. At that time, the protrusion 41 a of the heat receiving portion 41 of the cover 40 abuts on the element non-mounting surface of the substrate 30 on the entire circumference, and the element mounting surface of the substrate 30 abuts on the substrate support portion 22 b of the housing 20. As a result, the substrate 30 is sandwiched and held between the protrusion 41 a of the heat receiving portion 41 and the substrate support portion 22 b of the housing 20. The dimensions of each part are determined so that the heat receiving part 41 of the cover 40 does not directly contact the housing 20.

カバー40は基板収納部22内に収納した基板30を保護する機能を有するとともに、基板30に接することで基板30から熱を受け取るヒートシンクとしての機能と、受け取った熱を外部へ放散させる放熱器としての機能を有する。特に、基板30の素子非搭載面と直接接することで熱を受け取りその熱を外部へ放出する受熱部41に加えて、受熱部41から更に拡がる2つの側方延在部42、43を有することで、受熱および放熱のための広い面積を確保している。これにより、カバー40は十分な受熱および放熱の効果を提供できる。   The cover 40 has a function of protecting the substrate 30 stored in the substrate storage unit 22, a function as a heat sink that receives heat from the substrate 30 by contacting the substrate 30, and a radiator that dissipates the received heat to the outside. It has the function of. In particular, in addition to the heat receiving portion 41 that receives heat by directly contacting the element non-mounting surface of the substrate 30 and releases the heat to the outside, it has two laterally extending portions 42 and 43 that further spread from the heat receiving portion 41. Therefore, a large area for receiving and radiating heat is secured. Thereby, the cover 40 can provide sufficient heat receiving and heat dissipation effects.

また、上述の構成により、カバー40の受熱部41と基板30の素子非搭載面との間には、突条部41aにより閉空間が形成される。そしてその閉空間には、図6(B)に示すように伝熱グリース50が充填される。このように、突条部41aはグリースだまりを構成する。伝熱グリース50は基板30からカバー40への伝熱を高めることで、LED31が発する熱をカバー40が受熱し放熱する効果を高めるために用いられる。伝熱グリース50として例えばシリコーンベースの伝熱グリースが用いられる。伝熱グリース50としては好ましくは二液硬化性樹脂が用いられる。これにより、伝熱グリース50は所定の時間の経過により硬化し、突条部41aと素子非搭載面の間の隙間から伝熱グリース50が漏出する可能性を低減することができる。   Further, with the above-described configuration, a closed space is formed by the protrusion 41a between the heat receiving portion 41 of the cover 40 and the element non-mounting surface of the substrate 30. The closed space is filled with heat transfer grease 50 as shown in FIG. Thus, the protruding portion 41a constitutes a grease pool. The heat transfer grease 50 is used to increase the heat transfer from the substrate 30 to the cover 40, thereby increasing the effect of the cover 40 receiving and radiating the heat generated by the LEDs 31. For example, a silicone-based heat transfer grease is used as the heat transfer grease 50. As the heat transfer grease 50, a two-component curable resin is preferably used. Thereby, the heat transfer grease 50 is hardened with the passage of a predetermined time, and the possibility that the heat transfer grease 50 leaks from the gap between the protrusion 41a and the non-element mounting surface can be reduced.

図6(C)に示すように、ハウジング20の基板収納部22の側面に設けた係合突起22dは、基板受け入れ開口22aとは反対の側に傾斜部221dを有し、この傾斜部221dは外側(すなわち、基板収納部22の側面から遠ざかる方向の側。図6(C)では左側)に行くほど基板受け入れ開口22aに近づく傾斜を有している。一方、カバー40の係合孔42a、43aの形成位置は、係合孔42a、43aの縁が常に傾斜部221dと接し、係合孔42a、43aの縁と傾斜部221dが押圧力を及ぼし合う位置となるように設定されている。傾斜部221dが上述のような傾斜を有しているため、傾斜部221dが係合孔42a、43aの縁に及ぼす力は、カバー40の側方延在部42、43を外側に開くように押す成分と、側方延在部42、43を垂直方向(図6(C)における上下方向)に引っ張り、カバー40の受熱部41を基板30の素子非搭載面に押し付けるように作用する成分とに分解され得る。   As shown in FIG. 6C, the engaging protrusion 22d provided on the side surface of the substrate housing portion 22 of the housing 20 has an inclined portion 221d on the side opposite to the substrate receiving opening 22a. It has an inclination which approaches the board | substrate reception opening 22a, so that it goes to the outer side (namely, the side away from the side surface of the board | substrate storage part 22 and left side in FIG.6 (C)). On the other hand, the positions of the engagement holes 42a and 43a of the cover 40 are such that the edges of the engagement holes 42a and 43a are always in contact with the inclined portion 221d, and the edges of the engagement holes 42a and 43a and the inclined portion 221d exert a pressing force. It is set to be a position. Since the inclined portion 221d has the inclination as described above, the force exerted by the inclined portion 221d on the edges of the engaging holes 42a and 43a opens the side extending portions 42 and 43 of the cover 40 outward. A component to be pressed, and a component that acts to pull the heat receiving portion 41 of the cover 40 against the element non-mounting surface of the substrate 30 by pulling the side extending portions 42 and 43 in the vertical direction (vertical direction in FIG. 6C). Can be broken down into

上述のとおり、カバー40の受熱部41は基板30の素子非搭載面には接するが、ハウジング20には接しないように各部の寸法が決定されている。また上述の通り、傾斜部221dがカバー40の係合孔42a、43aの縁に及ぼす力は、カバー40の側方延在部42、43を垂直方向に引っ張り、カバー40の受熱部41を基板30の素子非搭載面に押し付けるように作用する成分を含んでいるため、傾斜部221dが係合孔42a、43aの縁を常に押圧することで、カバー40の受熱部41は常に基板30の素子非搭載面に押し付けられることとなる。これにより、突条部41aと素子非搭載面との間に常に押圧力が働き、両者が密に接する。そのため、突条部41aと素子非搭載面との間の隙間からグリース50が外部へ漏出する可能性がより低減される。特に、ハウジング20、基板30、カバー40の形状や位置のばらつきによりカバー40が垂直方向に浮くと異音やグリース漏出の原因となるが、上述のとおり、突条部41aと素子非搭載面との間に常に押圧力が働きそれらが密に接するため、カバー40の浮き上がりにより異音やグリース漏出が発生する可能性を効果的に低減することができる。   As described above, the heat receiving portion 41 of the cover 40 is in contact with the element non-mounting surface of the substrate 30, but the dimensions of each portion are determined so as not to contact the housing 20. Further, as described above, the force exerted by the inclined portion 221d on the edges of the engagement holes 42a and 43a of the cover 40 pulls the side extending portions 42 and 43 of the cover 40 in the vertical direction, and the heat receiving portion 41 of the cover 40 is placed on the substrate. 30 includes a component that acts to press against the element non-mounting surface, and the inclined portion 221d always presses the edges of the engagement holes 42a and 43a, so that the heat receiving portion 41 of the cover 40 is always the element of the substrate 30. It will be pressed against the non-mounting surface. As a result, a pressing force always acts between the protrusion 41a and the element non-mounting surface, and both come into close contact with each other. Therefore, the possibility that the grease 50 leaks to the outside from the gap between the protrusion 41a and the element non-mounting surface is further reduced. In particular, if the cover 40 floats in the vertical direction due to variations in the shape and position of the housing 20, the substrate 30, and the cover 40, abnormal noise and grease leakage may occur, but as described above, the protrusion 41 a and the element non-mounting surface Since the pressing force always works during the period of time and they are in close contact with each other, the possibility of abnormal noise and grease leakage due to the rising of the cover 40 can be effectively reduced.

係合突起22dにおいて、傾斜部221dの更に外側には平坦部222dが設けられている。平坦部222dは傾斜部221dのような傾斜を有しておらず、基板収納部23の側面と垂直な面を有する。そのため、何らかの理由により係合孔42a、43aの縁が傾斜部221dの上を移動してカバー40の被固定部としての側方延在部42、43がさらに外側に開くように弾性変形したとしても、係合孔42a、43aの縁が平坦部222dに引っ掛かり、カバー40の被固定部としての側方延在部42、43がそれ以上開くことを抑制することができる。なお、図6(C)に示す傾斜部221dは傾斜している面が平面状のものとしたが、図6(D)に示す傾斜部221d’のように、傾斜している面が曲面状のものでもよい。   In the engaging protrusion 22d, a flat portion 222d is provided on the outer side of the inclined portion 221d. The flat portion 222d does not have an inclination like the inclined portion 221d, and has a surface perpendicular to the side surface of the substrate storage portion 23. Therefore, for some reason, the edges of the engagement holes 42a, 43a move on the inclined portion 221d, and the side extending portions 42, 43 as the fixed portions of the cover 40 are elastically deformed so as to open further outward. In addition, the edges of the engagement holes 42a and 43a are caught by the flat portion 222d, and the side extending portions 42 and 43 as the fixed portions of the cover 40 can be prevented from further opening. Note that although the inclined portion 221d shown in FIG. 6C has a flat inclined surface, the inclined surface is a curved surface like the inclined portion 221d ′ shown in FIG. 6D. It may be.

以上の車両用照明装置1において、電力の供給を受けてLED31が光を発するとLED31からの直接光および反射面21a、内奥側の面21bで反射された光が光出射開口21dからレンズ部10を介して車両用照明装置1の外部、すなわち車室内へと照射される。図4から理解される様に、車両用照明装置1の平面形状の中心に対してLED31の設置位置が一方の側にやや寄っており、反射部21の反射面21aもLED31の設置位置に応じた形状となっている。これは、車両用照明装置1から発せられる光の照射範囲を、意図した照射範囲に合致させるためのものである。   In the vehicle lighting device 1 described above, when the LED 31 emits light upon receiving electric power, the direct light from the LED 31 and the light reflected by the reflection surface 21a and the inner surface 21b are transmitted from the light emission opening 21d to the lens unit. 10 is irradiated to the exterior of the vehicular lighting device 1, that is, the vehicle interior. As understood from FIG. 4, the installation position of the LED 31 is slightly shifted to one side with respect to the center of the planar shape of the vehicle lighting device 1, and the reflection surface 21 a of the reflection portion 21 also corresponds to the installation position of the LED 31. It has a different shape. This is for matching the irradiation range of the light emitted from the vehicular lighting device 1 with the intended irradiation range.

以上説明した構成において、受熱部41は基板30の素子非搭載面の全体を覆うことが好ましいが、一部のみを覆うものであってもよい。
また、以上説明した構成において、側方延在部42、43の各々は、基板収納部22の側面のうちの対応する面の全体を覆うことが好ましいが、その一部のみを覆うものであってもよい。あるいは、側方延在部42、43の各々は、基板収納部22の側面のうちの対応する面よりも広い範囲まで広がるものであってもよい。
上記の説明においては、側方延在部42、43はそれぞれ平板状の部分として説明したが、本発明はこれに限られず、帯状、棒状、格子状など、任意の形状とすることができる。そのため、被固定部としての側方延在部42、43についても例えば受熱部41から帯状に延びる部分として形成して、その中に係合孔42a、43aを形成して、突起22dに係合させてもよい。
また、被固定部としての側方延在部42、43を基板収納部22の側面に固定する方法は、上記したような係合によるものに限らず、ねじ止め、接着などの固定方法によるものとしてもよい。
In the configuration described above, the heat receiving portion 41 preferably covers the entire element non-mounting surface of the substrate 30, but may cover only a part.
Further, in the configuration described above, each of the side extending portions 42 and 43 preferably covers the entire corresponding surface of the side surfaces of the substrate storage portion 22, but covers only a part thereof. May be. Alternatively, each of the laterally extending portions 42 and 43 may extend to a wider range than the corresponding surface of the side surfaces of the substrate storage portion 22.
In the above description, the laterally extending portions 42 and 43 have been described as flat plate portions, but the present invention is not limited to this, and may have any shape such as a strip shape, a rod shape, or a lattice shape. For this reason, the laterally extending portions 42 and 43 as the fixed portions are also formed, for example, as portions extending in a belt shape from the heat receiving portion 41, and the engagement holes 42a and 43a are formed therein to engage with the protrusions 22d. You may let them.
Further, the method of fixing the laterally extending portions 42 and 43 as the fixed portions to the side surface of the substrate housing portion 22 is not limited to the above-described engagement, but is also based on a fixing method such as screwing or adhesion. It is good.

1…車両用照明装置(電子機器)
10…レンズ部
20…ハウジング
21…反射部
22…基板収納部(収納部)
23…スナップフィット
30…基板
31…LED(素子)
32…コネクタ嵌合部
40…カバー(放熱部)
41…受熱部
42、43…側方延在部(被固定部)
1 ... Vehicle lighting device (electronic equipment)
DESCRIPTION OF SYMBOLS 10 ... Lens part 20 ... Housing 21 ... Reflection part 22 ... Board | substrate storage part (storage part)
23 ... Snap fit 30 ... Substrate 31 ... LED (element)
32 ... Connector fitting part 40 ... Cover (heat radiation part)
41 ... heat receiving part 42, 43 ... side extension part (fixed part)

Claims (8)

発熱する素子を有する電子機器であって、
前記素子が搭載された基板と、
前記基板の素子非搭載面を露出させて前記基板を収納する収納部と、
放熱部と、を備え、
前記放熱部は、前記収納部の側面に固定される被固定部と、前記素子非搭載面を覆うように前記素子非搭載面に対向する面を有する受熱部と、を有し、
前記受熱部はグリースだまりを有する、電子機器。
An electronic device having an element that generates heat,
A substrate on which the element is mounted;
A storage portion for storing the substrate by exposing an element non-mounting surface of the substrate;
A heat dissipating part,
The heat radiating portion has a fixed portion fixed to a side surface of the storage portion, and a heat receiving portion having a surface facing the element non-mounting surface so as to cover the element non-mounting surface,
The heat receiving unit has an accumulation of grease.
前記グリースだまりは、閉ループ状の突条部を有する、請求項1に記載の電子機器。   The electronic device according to claim 1, wherein the grease pool has a closed loop-shaped protrusion. 前記被固定部は、前記受熱部を前記素子非搭載面に対して押圧するように固定される、請求項1または請求項2に記載の電子機器。   The electronic device according to claim 1, wherein the fixed portion is fixed so as to press the heat receiving portion against the element non-mounting surface. 前記収納部の前記側面は突起を有し、
前記被固定部は前記突起と係合する孔を有する、請求項1〜3のいずれか一項に記載の電子機器。
The side surface of the storage portion has a protrusion,
The electronic device according to claim 1, wherein the fixed portion includes a hole that engages with the protrusion.
前記受熱部と前記収納部がケースを形成する、請求項1〜4のいずれか一項に記載の電子機器。   The electronic device according to claim 1, wherein the heat receiving unit and the storage unit form a case. 前記放熱部は一枚の板状部材である、請求項1〜5のいずれか一項に記載の電子機器。   The electronic device according to any one of claims 1 to 5, wherein the heat dissipating part is a single plate-like member. 前記被固定部は前記収納部の前記側面に沿う形状を有する、請求項1〜6のいずれか一項に記載の電子機器。   The electronic device according to claim 1, wherein the fixed portion has a shape along the side surface of the storage portion. 前記収納部は直方体状の形状を有し、
前記放熱部は前記収納部の直方体状の形状の一つの面および該一つの面と隣り合う別の二つまたは三つの面を覆う、請求項1〜7のいずれか一項に記載の電子機器。
The storage portion has a rectangular parallelepiped shape,
The electronic device according to claim 1, wherein the heat radiating unit covers one surface of the rectangular parallelepiped shape of the storage unit and two or three surfaces adjacent to the one surface. .
JP2016222857A 2016-11-16 2016-11-16 Electronic apparatus Pending JP2018082021A (en)

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WO2020153164A1 (en) * 2019-01-24 2020-07-30 株式会社オートネットワーク技術研究所 Circuit structure, electric connection box, and method for manufacturing circuit structure

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JP2007184428A (en) * 2006-01-06 2007-07-19 Denso Corp Electronic device
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JP2003289191A (en) * 2002-03-28 2003-10-10 Denso Corp Electronic control device
JP2004274018A (en) * 2003-02-19 2004-09-30 Toshiba Lighting & Technology Corp Wiring-board housing device and discharge-lamp lighting device
JP2007184428A (en) * 2006-01-06 2007-07-19 Denso Corp Electronic device
JP2011159546A (en) * 2010-02-02 2011-08-18 Toshiba Lighting & Technology Corp Electronic device, and luminaire
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Publication number Priority date Publication date Assignee Title
WO2020153164A1 (en) * 2019-01-24 2020-07-30 株式会社オートネットワーク技術研究所 Circuit structure, electric connection box, and method for manufacturing circuit structure
JP2020120003A (en) * 2019-01-24 2020-08-06 株式会社オートネットワーク技術研究所 Circuit structure, electrical junction box, and manufacturing method of circuit structure

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