JP2018073864A - Cooling device, mounting method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To solve a problem that it is difficult for an operator to specify a heat sink mounting position in a simple method with a cooling device achieving sufficient cooling performance.SOLUTION: A cooling device includes: a heat radiation part which cools a heating component located on a substrate; and a frame mounted on the substrate. Protruding parts which cool the substrate and assist to position the heat radiation part are formed at the outer side of a mounting position of the heat radiation part on the frame.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a semiconductor package and a semiconductor package mounting method, and more particularly to a semiconductor package and a semiconductor package mounting method capable of improving the cooling performance for a heat generating member such as a silicon chip.

  A semiconductor package in which a silicon chip or the like is mounted on a package substrate is known.

  For example, in Patent Document 1, a CPU chip (silicon chip), a package substrate on which the CPU chip is mounted, a lid disposed on the top surface of the CPU chip, and the CPU chip and the lid are inserted. A semiconductor package having a thermal interface material (TIM) is described. In addition, in the case of Patent Document 1, in addition to the above configuration, a heat dispersion cover that is adjacent to the TIM and is inserted between the CPU chip and the lid to dissipate heat is provided. According to Patent Document 1, such a configuration can enhance the heat release capability.

  In addition, a heat sink may be disposed on the top of the lid via a TIM or the like. As one of techniques when using such a heat sink, there is, for example, Patent Document 2. Patent Document 2 describes a heat sink that includes a fixing portion that is fixed to a heating element and a heat dissipation portion that has a heat dissipation convex portion and slides relative to the fixing portion. According to Patent Document 2, it is possible to suppress the restriction on the arrangement of the heating elements by providing the heat radiating part that slides with respect to the fixed part.

Patent No. 4434564 Japanese Patent Laying-Open No. 2015-50255

  When a lid is used as described in Patent Document 1, the thermal resistance increases according to the thickness of the lid, and the cooling performance decreases. Therefore, from the viewpoint of improving the cooling performance, it is desirable to directly connect the silicon chip, which is a heating element, and the heat sink without using a lid (or connect via a TIM).

  On the other hand, the lid has a function of reducing warpage of the interposer substrate caused by a difference in thermal expansion coefficient between the silicon chip and the package substrate when the package substrate is solder-connected to the mother substrate. Therefore, if the lid is simply removed, there is a risk that poor solder connection is likely to occur during bonding to the mother board.

  Thus, while it is desirable not to use a lid from the viewpoint of cooling efficiency, it was desirable to use a lid from the viewpoint of preventing poor solder connection. That is, in the semiconductor package, there has been a problem that it is difficult to improve the cooling performance while preventing poor solder connection.

  Note that when the heat sink is made slidable as in Patent Document 2, the lid body still remains. For this reason, it has been difficult to solve the above-described problems with the device for the heat sink as in Patent Document 2.

  Accordingly, an object of the present invention is to provide a semiconductor package that solves the problem that it is difficult to improve cooling performance while preventing poor solder connection.

In order to achieve such an object, a semiconductor package which is an embodiment of the present invention includes:
A heating member;
A first substrate mounted with the heat generating member and mounted on a second substrate;
A reinforcing member for preventing deformation of the first substrate;
With
The reinforcing member is configured to be detachable from the first substrate.

In addition, a semiconductor package mounting method according to another embodiment of the present invention includes:
On the first substrate,
A configuration is adopted in which a heat generating member is mounted, and a reinforcing member configured to prevent deformation of the first substrate and be detachable from the first substrate is provided.

  By being configured as described above, the present invention can provide a semiconductor package that solves the problem that it is difficult to improve cooling performance while preventing poor solder connection.

It is a figure which shows an example of a structure of the semiconductor package which concerns on the 1st Embodiment of this invention. It is a figure which shows an example of a structure at the time of removing the upper-plate part among the semiconductor packages shown in FIG. It is AA sectional drawing which shows an example of a structure of the semiconductor package at the time of cut | disconnecting by the AA line of FIG. It is a flowchart which shows an example of the operation | movement at the time of manufacturing and attaching the semiconductor package which concerns on the 1st Embodiment of this invention. It is AA sectional drawing which shows an example of the mode of step S002 shown in FIG. It is AA sectional drawing which shows an example of the mode of step S003 shown in FIG. It is AA sectional drawing which shows an example of the mode of step S004 shown in FIG. It is a figure which shows an example of the other structure of a leg part. It is AA sectional drawing which shows another example of a lid and an interposer board | substrate. It is a figure which shows an example of a structure of the semiconductor package which concerns on the 2nd Embodiment of this invention. It is BB sectional drawing which shows an example of a structure of the semiconductor package at the time of cut | disconnecting by the BB line shown in FIG. It is BB sectional drawing which shows an example of a structure of the semiconductor package at the time of attaching an upper board part to a leg part. It is the schematic which shows an example of a structure of the semiconductor package in the 3rd Embodiment of this invention.

[First Embodiment]
A first embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a diagram illustrating an example of the configuration of the semiconductor package 1. FIG. 2 is a diagram illustrating an example of a configuration when the upper plate portion 111 is removed from the lid 11. FIG. 3 is a cross-sectional view of the semiconductor package 1 taken along the line AA. FIG. 4 is a flowchart showing an example of an operation when the semiconductor package 1 is manufactured and attached. FIG. 5 is a cross-sectional view taken along the line AA showing the state where the semiconductor package 1 is bonded to the mother substrate 3. FIG. 6 is a cross-sectional view taken along line AA showing the state where the upper plate portion 111 is removed after the semiconductor package 1 is bonded to the mother substrate 3. FIG. 7 is a cross-sectional view taken along line AA showing the state where the heat sink 4 is installed after the upper plate portion 111 is removed. FIG. 8 is a diagram illustrating an example of another configuration of the leg portion 112. FIG. 9 is an AA cross-sectional view showing another example of the lid 11 and the interposer substrate 12.

  In the first embodiment of the present invention, a semiconductor package 1 mounted on a mother substrate 3 (second substrate) or the like by solder connection will be described. As will be described later, the lid 11 of the semiconductor package 1 in the present embodiment is configured such that at least a part of the lid 11 is detachable. With such a configuration, when the semiconductor package 1 and the mother substrate 3 are joined, the lid 11 (at least a part of the lid 11) is removed after joining to expose the heat generating chip 11 while preventing the warp by the lid 11. Is possible.

  Referring to FIG. 1, the semiconductor package 1 in the present embodiment includes a lid 11 (reinforcing member) and an interposer substrate 12 (first substrate). Further, as shown in FIG. 2, a heat generating chip 13 (heat generating member) is mounted on the interposer substrate 12. That is, the semiconductor package 1 includes the lid 11, the interposer substrate 12, and the heat generating chip 13.

  The lid 11 is made of a member having high heat dissipation efficiency and rigidity such as copper or aluminum. As shown in FIG. 1, the lid 11 includes an upper plate portion 111 and a leg portion 112, and the interposer substrate 12 is reinforced by the upper plate portion 111 and the leg portion 112. In other words, the lid 11 is provided on the interposer substrate 12, so that when the interposer substrate 12 is soldered to the mother substrate 3, warpage caused by a difference in thermal expansion coefficient between the interposer substrate 12 and the heat generating chip 13 (that is, the interposer substrate 12). Deformation of the substrate 12 is prevented. As shown in FIGS. 1 and 2, the upper plate part 111 and the leg part 112 are configured to be detachable by screws 2.

  The upper plate portion 111 is a rectangular parallelepiped plate member formed in a substantially rectangular shape in plan view. As shown in FIG. 2, through holes 1111 for inserting screws 2 are formed at the four corners of the upper plate portion 111 so as to penetrate in the thickness direction of the upper plate portion 111.

  The leg 112 is formed in a rectangular frame shape surrounding the heat generating chip 13 mounted on the interposer substrate 12 in plan view. In other words, the shape of the leg portion 112 is a rectangle having a quadrangular opening through which the heat generating chip 13 is inserted in a plan view. In addition, screw holes 1121 for inserting screws 2 are formed in positions corresponding to the through holes 1111 formed in the upper plate portion 111 among the four corners of the leg portion 112. The leg portion 112 is fixed to a predetermined position on the interposer substrate 12 by, for example, an adhesive.

  With the configuration as described above, the upper plate portion 111 can be fixed to the leg portion 112 by installing the top plate portion 111 on the leg portion 112 and then tightening the screw 2 that passes through the through hole 1111 and the screw hole 1121. When the upper plate portion 111 is fixed to the leg portion 112, as shown in FIG. 1, the periphery of the heat generating chip 1 is covered (the upper plate portion 111 and the leg portion 112 form a lid). On the other hand, the upper plate portion 111 can be removed by removing the screw 2 from the state in which the upper plate portion 111 is fixed to the leg portion 112 to release the fixed state with the leg portion 112. As described above, the upper plate portion 111 is configured to be detachable from the leg portion 112 by tightening or removing the screw 2.

  The interposer substrate 12 is a substrate on which the heat generating chip 13 is mounted and mounted on the mother substrate 3 described later. As shown in FIG. 2, for example, a plurality of solder balls 121 are formed in a lattice shape on the surface of the interposer substrate 12 that is mounted on the mother substrate 3. On the other hand, the heat generating chip 13 is mounted on the surface opposite to the surface on which the plurality of solder balls 112 are formed, and the leg portion 112 of the lid 11 is fixed.

  The heat generating chip 13 is a heat generating member such as a silicon chip. The heat generating chip 13 is connected to the interposer substrate 12 by wire bonding or flip chip bonding.

  When the semiconductor package 1 as described above is cut along the line AA in FIG. 1, a cross-sectional view thereof is as shown in FIG. 3, for example.

  Referring to FIG. 3, the heat generating chip 13 is connected to one surface of the interposer substrate 12, and the leg portion 112 is fixed. Further, an upper plate portion 111 is installed on the leg portion 112. As described above, the upper plate portion 111 can be attached to and detached from the leg portion 112 with the screw 2. On the other hand, a plurality of solder balls 121 used for mounting the interposer substrate 12 on the mother substrate 3 are formed in a lattice shape on the surface of the interposer substrate 12 opposite to the side to which the heat generating chip 13 is connected. Has been.

  In the present embodiment, as will be described later, after the upper plate portion 111 is removed, the heat sink 4 (heat radiating portion) and the heat generating chip 13 are brought into contact with each other. Therefore, in the state where the upper plate portion 111 is fixed to the leg portion 112 as shown in FIG. 3, it is not necessary to provide a TIM (Thermal Interface Material) such as grease between the upper plate portion 111 and the heat generating chip 13. become.

  The semiconductor package 1 has the above configuration, for example. Next, an example of an operation when the semiconductor package 1 having the above configuration is manufactured and mounted on the mother substrate 3 will be described with reference to FIG.

  Referring to FIG. 4, the heat generating chip 13 is connected to the interposer substrate 12 and the lid 11 is provided (step S001). For example, the heat generating chip 13 is connected to the interposer substrate 12 by wire bonding or the like. Further, the leg 112 is fixed on the interposer substrate 12 by using, for example, an adhesive. And the upper board part 111 is installed in the upper part of the leg part 112, and the screw 2 is tightened. As a result, the upper plate portion 111 is fixed to the leg portion 112.

  As a result of step S001, the semiconductor package 1 is in a state as shown in FIG. 3, for example. That is, referring to FIG. 3, the heat generating chip 13 is connected to the interposer substrate 12 and the legs 112 are fixed. Further, the upper plate portion 111 is fixed to the leg portion 112.

  Subsequently, the interposer substrate 12 is mounted on the mother substrate 3 by solder connection (step S002). As a result of step S002, the state of the semiconductor package 1 becomes, for example, as shown in FIG. Referring to FIG. 5, the interposer substrate 12 is mounted on the mother substrate 3.

  After the interposer substrate 12 is mounted on the mother substrate 3, the screws 2 are removed and the upper plate portion 111 is removed (step S003). As a result of step S003, the state of the semiconductor package 1 becomes, for example, as shown in FIG. Referring to FIG. 6, the upper plate portion 111 is removed, and the heat generating chip 113 is exposed to the outside.

  Thereafter, the heat sink 4 is provided on the heat generating chip 13 (step S004). Since the upper plate portion 111 is removed by the process of step S003, the heat sink 4 can be in contact with the heat generating chip 13 without passing through the upper plate portion 111.

  The heat sink 4 and the heat generating chip 13 may be configured to be in direct contact with each other, or may be configured to be in contact with each other via a TIM 41 such as grease as illustrated in FIG. The leg 112 is provided with a screw hole 1121. The screw hole 1121 of the leg 112 may be used when the heat sink 4 is provided. That is, you may comprise so that the heat sink 4 may be screwed using the screw hole 1121. FIG.

  The above is an example of the operation when the semiconductor package 1 is manufactured and mounted on the mother substrate 3.

  As described above, the semiconductor package 1 according to the present embodiment includes the lid 11 including the upper plate portion 111 and the leg portion 112. Further, the upper plate portion 111 is configured to be detachable from the leg portion 112 by the screw 2. With such a configuration, the interposer substrate 12 can be soldered to the mother substrate 3 with the upper plate portion 111 fixed to the leg portion 112. As a result, the interposer substrate 12 can be solder-connected to the mother substrate 3 in a state where the warp of the interposer substrate 12 caused by the difference in thermal expansion coefficient between the heat generating chip 13 and the interposer substrate 12 is reduced. On the other hand, after the interposer substrate 12 is solder-connected to the mother substrate 3, the upper plate portion 111 can be removed from the leg portion 112 by an easy method. As a result, the heat sink 4 and the heat generating chip 13 can be in contact with each other without the upper plate portion 111 interposed therebetween. As a result, it is possible to improve the cooling performance. Thus, according to the above configuration, it is possible to improve the cooling performance while preventing poor solder connection.

  In the present embodiment, the leg portion 112 is formed in a rectangular frame shape surrounding the heat generating chip 13 mounted on the interposer substrate 12 in plan view. However, the shape of the leg part 112 is not limited to the case illustrated above. For example, as shown in FIG. 8, the leg portion 112 may be a leg portion 112 </ b> A having a quadrangular columnar shape provided at locations corresponding to the four corners. In this case, four leg portions 112A are formed. Further, as shown in FIG. 8, the shape may be a shape like a leg portion 112B formed in an L shape in plan view. Thus, the shape of the leg part 112 is not limited to the case illustrated in the present embodiment, and various shapes can be adopted.

  Moreover, in this embodiment, although the case where the interposer board | substrate 12 was larger than the lid 11 by planar view and side view was illustrated, it does not necessarily need to be so. For example, as shown in FIG. 9, legs 112 may be formed at the end of the interposer substrate 12.

  Further, according to the semiconductor package 1 in the present embodiment, the heat sink 1 and the heat generating chip 13 can be brought into contact without the upper plate portion 111 being interposed. Therefore, the lid 11 including the upper plate portion 111 does not necessarily need to be configured with a member having high heat dissipation performance. For example, the lid 11 may employ a member having a low coefficient of thermal expansion regardless of the heat dissipation performance.

[Second Embodiment]
Next, a second embodiment of the present invention will be described with reference to FIGS. FIG. 10 is a diagram illustrating an example of the configuration of the semiconductor package 5. 11 and 12 are cross-sectional views of the semiconductor package 5 taken along the line BB.

  In the second embodiment of the present invention, a semiconductor package 5 having a lid 51 instead of the lid 11 described in the first embodiment will be described. As will be described later, the lid 51 in this embodiment is configured so that the upper plate portion 511 can be attached to and detached from the leg portion 512 by sliding movement instead of screwing.

  Referring to FIG. 10, the semiconductor package 5 in this embodiment includes a lid 51, an interposer substrate 12, and a heat generating chip 13. Since the configuration of the interposer substrate 12 and the heat generating chip 13 is the same as that of the first embodiment, the description thereof is omitted.

  The lid 51 is made of a member having high heat dissipation efficiency and rigidity such as copper or aluminum. The lid 51 includes an upper plate portion 511 and leg portions 512. As shown in FIG. 10, groove portions 5121 are respectively provided at opposite ends of the leg portions 512. The upper plate portion 511 is inserted between the groove portions 5121.

  The upper plate portion 511 is a rectangular parallelepiped plate material formed in a substantially rectangular shape in plan view. The thickness of the upper plate portion 511 is formed so as to be thinner than the thickness of a groove portion 5121 formed in a leg portion 512 described later.

  The leg portion 512 is formed in a rectangular frame shape surrounding the heat generating chip 13 mounted on the interposer substrate 12 in plan view. In other words, the shape of the leg portion 512 is a rectangle having a rectangular opening through which the heat generating chip 13 is inserted in a plan view. In addition, a groove portion 5121 that forms a recess toward the inside of the leg portion 512 is formed at the opposite end portion of the leg portion 512. One of the opposite end portions of the upper plate portion 511 is inserted through one groove portion 5121, and the other of the opposite end portions of the upper plate portion 511 is inserted through the other groove portion 5121. Thus, the upper plate portion 511 is inserted between the groove portions 5121 formed in the leg portion 512, so that the upper plate portion 511 can be attached to and detached from the leg portion 512 by sliding movement.

  When the semiconductor package 5 as described above is cut along the line BB in FIG. 10, the cross-sectional view thereof is as shown in FIG. 11, for example.

  Referring to FIG. 11, the heat generating chip 13 is connected to one surface of the interposer substrate 12, and the leg portion 512 is fixed. Further, a groove portion 5121 is provided at the opposite end portion of the leg portion 512. The upper plate portion 511 is inserted between the groove portions 5121. On the other hand, a plurality of solder balls 121 used for mounting the interposer substrate 12 on the mother substrate 3 are formed in a lattice shape on the surface of the interposer substrate 12 opposite to the side to which the heat generating chip 13 is connected. Has been.

  An example of a state in which the upper plate portion 511 is inserted between the groove portions 5121 is shown in FIG. Referring to FIG. 12, the upper plate portion 511 is inserted between the groove portions 5121, and the upper plate portion 511 is disposed above the leg portion 512.

  The semiconductor package 5 has the above-described configuration, for example. Next, an example of an operation when the semiconductor package 5 having the above-described configuration is manufactured and mounted on the mother substrate 3 will be described. Since it is basically the same as that of the first embodiment, it will be described with reference to FIG.

  Referring to FIG. 4, the heat generating chip 13 is connected to the interposer substrate 12 and the lid 51 is provided (step S001). For example, the heat generating chip 13 is connected to the interposer substrate 12 by wire bonding or the like. Moreover, the leg part 512 is fixed on the interposer substrate 12, for example, using an adhesive. Then, the upper plate portion 511 is inserted between the groove portions 5121 formed in the leg portion 512. Accordingly, the upper plate portion 511 is disposed on the upper portion of the leg portion 512.

  As a result of step S001, the semiconductor package 5 is in a state as shown in FIG. 12, for example. That is, referring to FIG. 12, the heating chip 13 is connected to the interposer substrate 12 and the legs 512 are fixed. An upper plate portion 511 is disposed on the leg portion 512.

  Subsequently, the interposer substrate 12 is mounted on the mother substrate 3 by solder connection (step S002).

  Thereafter, the upper plate portion 511 is slid to remove the upper plate portion 511 from the leg portion 512 (step S003). Thereby, as shown in FIG. 11, the heat generating chip 113 is exposed to the outside. Then, the heat sink 4 is provided on the heat generating chip 13 (step S004). Since the upper plate portion 511 is removed by the process of step S003, the heat sink 4 can be in contact with the heat generating chip 13 without the upper plate portion 111 interposed therebetween.

  The above is an example of the operation when the semiconductor package 5 is manufactured and mounted on the mother substrate 3.

  As described above, the semiconductor package 5 according to the present embodiment includes the lid 51 including the upper plate portion 511 and the leg portion 512. Further, the upper plate portion 511 can be disposed on or removed from the leg portion 512 by inserting between the groove portions 5121 formed in the leg portion 512. Even in such a configuration that the upper plate portion 511 is slidable, the upper plate portion 511 is removed by an easy method after the interposer substrate 12 is solder-connected to the mother substrate 3 as in the first embodiment. I can do it. As a result, it is possible to improve the cooling performance while preventing poor solder connection.

  It should be noted that the semiconductor package 5 described in the second embodiment can also have various modifications as in the first embodiment.

[Third Embodiment]
Subsequently, a third embodiment of the present invention will be described with reference to FIG. FIG. 13 shows an outline of the configuration of the semiconductor package 6.

  Referring to FIG. 13, the semiconductor package 6 includes a heat generating member 61, a first substrate 62, and a reinforcing member 63.

  The first substrate 62 mounts the heat generating member 61 and is mounted on a second substrate (not shown). The reinforcing member 63 prevents the first substrate 62 from being deformed. The reinforcing member 63 is configured to be detachable from the first substrate.

  As described above, the semiconductor package 6 according to the present embodiment includes the reinforcing member 63 configured to be detachable from the first substrate 62. With such a configuration, the first substrate 62 can be mounted on the second substrate while the reinforcing member 63 is fixed to the first substrate 62. On the other hand, after the first substrate 62 is mounted on the second substrate, the reinforcing member 63 can be detached from the first substrate 62. As a result, a heat radiating part such as a heat sink can be brought into direct contact with the heat generating member 61 without using the reinforcing member 63. Thereby, it becomes possible to improve cooling performance while preventing poor solder connection.

  In addition, as a method of using the semiconductor package 6 described above, a reinforcing member configured to mount a heat generating member on the first substrate and prevent the first substrate from being deformed and detachable from the first substrate. The method of providing a member is taken.

  Even the invention of such a semiconductor package mounting method can achieve the above-described object of the present invention because it has the same operation as the semiconductor package 6 described above.

<Appendix>
Part or all of the above-described embodiment can be described as in the following supplementary notes. Hereinafter, an outline of a semiconductor package and the like in the present invention will be described. However, the present invention is not limited to the following configuration.
[Appendix 1]
A heating member;
A first substrate mounted with the heat generating member and mounted on a second substrate;
A reinforcing member for preventing deformation of the first substrate;
With
The reinforcing member is configured to be detachable from the first substrate.
[Appendix 2]
The semiconductor package according to appendix 1, wherein
The said reinforcement member has a leg part fixed to the said 1st board | substrate, and a board part which can be attached or detached with respect to the said leg part. Semiconductor package.
[Appendix 3]
The semiconductor package according to attachment 2, wherein
The plate part is screwed to the leg part.
[Appendix 4]
The semiconductor package according to attachment 2, wherein
The shape of the leg is a rectangle having an opening through which the heat generating member is inserted,
The shape of the plate portion is a rectangle,
A groove portion through which the opposite end portion of the plate portion is inserted is formed in the opposite end portion of the leg portion, respectively. Semiconductor package.
[Appendix 5]
A semiconductor package according to any one of appendices 2 to 4,
The semiconductor package which forms the lid which covers the heat generating member with the leg part and the board part.
[Appendix 6]
On the first substrate,
A semiconductor package mounting method comprising mounting a heat generating member and providing a reinforcing member configured to be detachable from the first substrate while preventing deformation of the first substrate.
[Appendix 7]
The semiconductor package mounting method according to appendix 6, wherein
A method for attaching a semiconductor package, wherein the reinforcing member is removed after the first substrate is bonded to a second substrate.
[Appendix 8]
A semiconductor package mounting method according to appendix 7,
The reinforcing member includes a leg portion fixed to the first substrate, and a plate portion detachable from the leg portion,
A method for attaching a semiconductor package, wherein the plate portion is removed after the first substrate is bonded to the second substrate.
[Appendix 9]
A semiconductor package mounting method according to any one of appendices 6 to 8,
After removing the reinforcing member, a heat dissipating part is installed on a surface different from the surface connected to the first substrate of the heat generating member.

  Although the present invention has been described with reference to the above embodiments, the present invention is not limited to the above-described embodiments. Various changes that can be understood by those skilled in the art can be made to the configuration and details of the present invention within the scope of the present invention.

DESCRIPTION OF SYMBOLS 1 Semiconductor package 11 Lid 111 Upper board part 1111 Through-hole 112 Leg part 1121 Screw hole 12 Interposer board 121 Solder ball 13 Heat generating chip 2 Screw 3 Mother board 4 Heat sink 5 Semiconductor package 51 Lid 511 Upper board part 512 Leg part 5121 Groove part 6 Semiconductor Package 61 Heat generating member 62 First substrate 63 Reinforcing member

Claims (9)

A heating member;
A first substrate mounted with the heat generating member and mounted on a second substrate;
A reinforcing member for preventing deformation of the first substrate;
With
The reinforcing member is configured to be detachable from the first substrate. The semiconductor package according to claim 1,
The said reinforcement member has a leg part fixed to the said 1st board | substrate, and a board part which can be attached or detached with respect to the said leg part. Semiconductor package. The semiconductor package according to claim 2,
The plate part is screwed to the leg part. The semiconductor package according to claim 2,
The shape of the leg is a rectangle having an opening through which the heat generating member is inserted,
The shape of the plate portion is a rectangle,
A groove portion through which the opposite end portion of the plate portion is inserted is formed in the opposite end portion of the leg portion, respectively. Semiconductor package. A semiconductor package according to any one of claims 2 to 4,
The semiconductor package which forms the lid which covers the heat generating member with the leg part and the board part. On the first substrate,
A semiconductor package mounting method comprising mounting a heat generating member and providing a reinforcing member configured to be detachable from the first substrate while preventing deformation of the first substrate. A semiconductor package mounting method according to claim 6, comprising:
A method for attaching a semiconductor package, wherein the reinforcing member is removed after the first substrate is bonded to a second substrate. A semiconductor package mounting method according to claim 7,
The reinforcing member includes a leg portion fixed to the first substrate, and a plate portion detachable from the leg portion,
A method for attaching a semiconductor package, wherein the plate portion is removed after the first substrate is bonded to the second substrate. A semiconductor package mounting method according to any one of claims 6 to 8,
After removing the reinforcing member, a heat dissipating part is installed on a surface different from the surface connected to the first substrate of the heat generating member.

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