JP2018056179A - Coil component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a coil component in which short circuit and exfoliation of top plate are less likely to occur.SOLUTION: A coil component includes a drum core 20, a wire W wound around the wrapping core 21 of the drum core 20, terminal electrodes E1-E4 provided, respectively, at the flanges 22, 23 of the drum core 20, and connected with the ends of the wire W, and a top plate 30 fixed to the flanges 22, 23. The top plate 30 includes a magnetic layer 31 formed by mixing magnetic powder with binder resin, and a resin layer 32 containing less magnetic powder than the magnetic layer 31, where the resin layer 32 is at least located between the flanges 22, 23 and the magnetic layer 31. With such an arrangement, short circuit can be prevented between the magnetic layer 31 and the terminal electrodes E1-E4 or the wire W. Exfoliation of the top plate 30 due to temperature change can also be prevented. Furthermore, mechanical strength of the top plate 30 can be improved by the resin layer 32.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a coil component, and more particularly to a coil component using a drum core.

  Unlike a coil component using a toroidal core, a coil component using a drum core is widely used in portable electronic devices such as smartphones because it can be surface-mounted on a printed circuit board. Moreover, since the coil component using a drum core is low-profile, it contributes to thinning of portable electronic devices.

  However, in recent years, further reduction in thickness is required for portable electronic devices, and in order to realize this, further reduction in height is required for coil parts using a drum core. One way to reduce the height of coil components is to remove the magnetic top plate that is usually bonded to the drum core. In this case, however, the leakage of magnetic flux increases, so other circuits such as antennas can be used. There was a risk of adverse effects. On the other hand, since the magnetic top plate made of ferrite is brittle, if the thickness is reduced, the strength is insufficient, and there is a risk of damage during mounting or actual use.

  In order to solve such a problem, a magnetic powder-containing resin having flexibility instead of ferrite may be used as a material for the magnetic top plate. Since the magnetic powder-containing resin maintains a certain level of strength even if it is thin, using magnetic powder-containing resin as the material of the magnetic top plate can reduce the magnetic flux leakage while realizing a low profile. It becomes. Examples of using magnetic powder-containing resin as the material for the magnetic top plate include coil components described in Patent Documents 1 and 2.

Japanese Patent Laid-Open No. 9-219318 JP 2004-363178 A

  However, since the magnetic powder contained in the magnetic powder-containing resin often has conductivity, there is a possibility that a short circuit failure may occur between the terminal electrode and the wire. Further, since the magnetic powder-containing resin has a larger coefficient of thermal expansion than that of the drum core, there is a possibility that the magnetic powder-containing resin may be peeled off from the drum core due to a temperature change.

  Accordingly, an object of the present invention is to provide a coil component that uses a top plate containing a magnetic powder-containing resin while realizing a low profile, and that is unlikely to cause a short circuit failure or peeling of the top plate. To do.

  The coil component according to the present invention includes a drum core having first and second flanges provided at both ends of the core and the core, a wire wound around the core, the first and second A terminal electrode provided on each of the second flanges and connected to an end of the wire; and a top plate fixed to the first and second flanges, wherein the top plate is a binder. A magnetic layer formed by mixing magnetic powder in a resin; and a resin layer having a content of the magnetic powder less than that of the magnetic layer, wherein the resin layer includes at least the first and second flange portions and the magnetic layer. It is characterized by being located between the layers.

  According to the present invention, since the resin layer is interposed between the first and second flanges and the magnetic layer, it is possible to prevent a short circuit failure between the magnetic layer and the terminal electrode or the wire. . Moreover, if a material having a thermal expansion coefficient between the thermal expansion coefficient of the magnetic layer and the thermal expansion coefficient of the drum core is used as the resin layer material, it is possible to prevent the top plate from peeling off due to a temperature change. Become. Further, the mechanical strength of the top plate can be increased by the resin layer.

  In this invention, it is preferable that the said resin layer does not contain the said magnetic powder substantially. According to this, it becomes possible to prevent a short circuit failure more reliably.

  In the present invention, the resin layer preferably contains a nonmagnetic filler. According to this, it becomes possible to adjust a thermal expansion coefficient to a desired value.

  In the present invention, the resin layer may cover the entire surface of the magnetic layer, or may be selectively provided between the first and second flanges and the magnetic layer. According to the former, it is possible to reduce the manufacturing cost of the top plate and more reliably prevent short circuit defects. On the other hand, according to the latter, the peeling of the top plate due to the temperature change can be more reliably prevented.

  Preferably, the coil component according to the present invention further includes an adhesive that adheres the first and second flanges and the resin layer of the top plate. According to this, an insulating effect by the adhesive can also be expected.

  In the present invention, the magnetic layer of the top plate has a lower surface facing the resin layer side and an upper surface located on the opposite side of the lower surface, and the surface layer on the upper surface side than the surface layer portion on the lower surface side. The part preferably has a higher density of the binder resin. According to this, the insulation of the upper surface of a top plate is improved. As a result, a short circuit failure caused by the top surface of the top plate coming into contact with another electronic component can be prevented, and a highly reliable coil component can be obtained. Moreover, since the density of the magnetic powder is high in the surface layer portion on the lower surface side of the magnetic layer, the magnetic path passing through the top plate is shortened, and higher magnetic characteristics can be obtained.

  In the present invention, the magnetic powder is preferably a metal soft magnetic powder. According to this, high magnetic characteristics can be obtained. In particular, the metal soft magnetic powder preferably has a flat shape. According to this, higher magnetic characteristics can be obtained.

  According to the present invention, it is possible to provide a coil component that is less likely to cause a short circuit failure and peeling of the top plate while realizing a reduction in height.

FIG. 1 is a perspective view of a coil component 11 according to a first embodiment of the present invention viewed from an oblique direction. FIG. 2 is a plan view of the coil component 11 as viewed from the mounting surface. FIG. 3 is a cross-sectional view of the coil component 11. FIG. 4 is a schematic cross-sectional view for explaining the structure of the top plate 30. FIG. 5 is a schematic diagram for explaining the shape of the magnetic powder 35 included in the top plate 30. FIG. 6 is a schematic cross-sectional view for explaining the structure of the magnetic layer 31. FIG. 7 is an electron micrograph of the magnetic layer 31, wherein (a) is a photograph of the surface 31a, and (b) is a photograph of the surface 31b. FIG. 8 is a schematic diagram for explaining a method of producing the sheet S1 in which the magnetic layer 31 is applied on the surface of the base film F. FIG. 9 is a schematic diagram for explaining a method of producing the sheet S2 in which the resin layer 32 is applied on the surface of the magnetic layer 31. FIG. FIG. 10 is a process diagram for explaining the manufacturing method of the coil component 11. FIG. 11 is a perspective view of the coil component 12 according to the second embodiment of the present invention viewed from an oblique direction. FIG. 12 is a cross-sectional view of the coil component 12.

  Hereinafter, some embodiments of the present invention will be described in detail with reference to the accompanying drawings.

<First Embodiment>
1 to 3 are diagrams showing the configuration of the coil component 11 according to the first embodiment of the present invention, in which FIG. 1 is a perspective view seen from obliquely above, and FIG. 2 is a plan view seen from the mounting surface. 3 is a cross-sectional view.

  As shown in FIGS. 1 to 3, the coil component 11 according to the first embodiment of the present invention includes a drum core 20 and a top plate 30. The drum core 20 includes a core portion 21 whose axial direction is the x direction, and first and second flange portions 22 and 23 provided at both ends of the core portion 21 in the x direction. The drum core 20 is made of a ceramic material having high magnetic permeability such as ferrite, and has a configuration in which the core 21 and the flanges 22 and 23 are integrated.

  Two wires W are wound around the core portion 21, and both ends of these wires W are connected to terminal electrodes E1 to E4 provided on the flange portions 22 and 23. In the present embodiment, the terminal electrodes E1 and E2 are formed on one flange portion 22, and the terminal electrodes E3 and E4 are formed on the other flange portion 23. The terminal electrodes E1 to E4 constitute an xy surface of the flange portions 22 and 23 constituting the mounting surface, an xy surface of the flange portions 22 and 23 which are located on the opposite side of the mounting surface and constitute the upper surface, and an outer surface. It is formed continuously on the yz plane of the flange portions 22 and 23. In the present embodiment, the wires W are connected to the terminal electrodes E1 to E4 provided on the upper surfaces of the flange portions 22 and 23, but the terminal electrodes E1 to E4 provided on the mounting surface of the flange portions 22 and 23 are provided. The wire W may be connected to the wire. In this case, it is not necessary to provide the terminal electrodes E1 to E4 on the upper surfaces of the flange portions 22 and 23.

  The application of the coil component 11 according to the present embodiment is not particularly limited, and may be a general-purpose coil component for inductance, or a specific application, for example, a coil for a common mode filter, a pulse transformer, a balun transformer, etc. It may be a part. Therefore, the number of wires W wound around the core 21, the number of windings, the winding direction, the winding method, and the like are not particularly limited. The size of the coil component 11 is not particularly limited, but the length in the x direction is about 1.6 mm, the width in the y direction is about 1.0 mm, and the height in the z direction is about 0.55 mm to 0.65 mm.

  As shown in FIGS. 1 and 3, the top plate 30 is fixed to the xy surfaces constituting the upper surfaces of the flange portions 22 and 23 via an adhesive 40. As shown in FIG. 4, the top plate 30 has a laminated structure of a magnetic layer 31 and a resin layer 32, and is laminated so that the magnetic layer 31 is on the upper side and the resin layer 32 is on the lower side. That is, the resin layer 32 is located between the flange portions 22 and 23 and the magnetic layer 31.

  The magnetic layer 31 is made of a magnetic powder-containing resin in which a magnetic powder 35 is mixed with a binder resin 34, and has a magnetic permeability higher than that of a normal resin. Since the top plate 30 having the magnetic layer 31 is fixed to the upper surfaces of the flange portions 22 and 23 so as to straddle the core portion 21, the drum core 20 and the magnetic layer 31 constitute a closed magnetic circuit. For this reason, the leakage of magnetic flux is reduced as compared with the case of using a top plate made of only resin, and it is possible to reduce the magnetic influence on other circuits such as an antenna circuit. The top plate 30 is also used as a suction surface for handling when mounted on a printed circuit board.

  As described above, the magnetic powder-containing resin constituting the magnetic layer 31 is obtained by mixing the magnetic powder 35 with the binder resin 34. Among these, it is preferable that the binder resin 34 has an acrylic ester copolymer as a main chain and includes a crosslinked structure by a urethane bond. On the other hand, as the magnetic powder 35, it is preferable to use a metal soft magnetic powder having a shape flat in the xy direction, as shown in FIG. When using the metal soft magnetic powder which has a flat shape, it is preferable to mix with the binder resin 34 so that the main plane of the metal soft magnetic powder may be an xy plane. According to this, the magnetic permeability in the x direction that is the direction of the magnetic flux passing through the magnetic layer 31 is increased, and the soft metal powder having a flat shape also functions as an electromagnetic shield.

  The resin layer 32 plays a role of preventing direct contact between the flange portions 22 and 23 and the magnetic layer 31 by being interposed therebetween. The resin layer 32 is interposed because the magnetic powder 35 contained in the magnetic layer 31 has conductivity, and this may be exposed from the binder resin 34. As a material of the resin layer 32, an insulating resin material similar to the binder resin 34 can be used. By using the resin layer 32 made of such an insulating resin material, the withstand voltage between the magnetic layer 31 and the terminal electrodes E1 to E4 and the wire W is greatly improved, so that a short circuit failure between them is prevented. can do. Furthermore, since the resin layer 32 functions also as a buffer material, impact resistance is also improved.

  A magnetic or nonmagnetic filler may be added to the resin layer 32. However, if the content of the magnetic powder is too high, the insulating property is lowered. Therefore, when the magnetic powder is added to the resin layer 32, the content of the magnetic powder needs to be smaller than that of the magnetic layer 31. On the other hand, a nonmagnetic filler can be added to adjust physical properties such as a thermal expansion coefficient. If the thermal expansion coefficient of the resin layer 32 is adjusted between the thermal expansion coefficient of the magnetic layer 31 and the thermal expansion coefficient of the drum core 20 by adding a nonmagnetic filler, peeling of the top plate 30 due to temperature change can be prevented. Is also possible. Examples of the nonmagnetic filler include talc and mica.

  As described above, in the coil component 11 according to the present embodiment, the top plate 30 fixed to the drum core 20 has a laminated structure of the magnetic layer 31 and the resin layer 32, and the resin layer 32 includes the drum core 20, the magnetic layer 31, and the like. Therefore, it is possible to improve the withstand voltage, impact resistance, peel strength, etc. while realizing a low profile.

  FIG. 6 is a schematic cross-sectional view for explaining the structure of the magnetic layer 31.

  As shown in FIG. 6, in the magnetic layer 31, the distribution of the binder resin 34 and the magnetic powder 35 in the thickness direction (z direction) is not completely uniform, and the surface layer portion 31A and the surface layer portion 31B have different characteristics. Sometimes.

  Specifically, in the inner layer portion 31C of the magnetic layer 31, the magnetic powder 35 is distributed almost uniformly in the binder resin 34, while in the surface layer portion 31B, the density of the magnetic powder 35 is lower than that of the inner layer portion 31C. The density of the binder resin 34 is higher than that of the inner layer portion 31C. As a result, the magnetic powder 35 exposed on the surface 31b is reduced, and typically the magnetic powder 35 is hardly exposed. In this case, almost the entire surface 31 b is covered with the binder resin 34. On the other hand, the surface layer portion 31A is substantially the same as the inner layer portion 31C. That is, in the surface layer portion 31A, the density of the magnetic powder 35 in the binder resin 34 is substantially the same as that of the inner layer portion 31C. For this reason, the magnetic powder 35 may be exposed to some extent from the surface 31a.

  7A and 7B are electron micrographs of the magnetic layer 31 actually produced. FIG. 7A is a photograph of the surface 31a, and FIG. 7B is a photograph of the surface 31b. In these photographs, the black portion is the binder resin 34, and the white portion is the magnetic powder 35.

  As shown in FIG. 7A, the surface layer portion 31A on the surface 31a side has a high density of the magnetic powder 35 and a low density of the binder resin 34, so that many magnetic powders 35 appear white when photographed with an electron microscope. I understand. It can also be seen that a lot of magnetic powder 35 is exposed on the surface 31a. On the other hand, as shown in FIG. 7B, the surface layer portion 31B on the surface 31b side has a low density of the magnetic powder 35 and a high density of the binder resin 34. I understand that. In particular, there is almost no magnetic powder 35 exposed on the surface 31b.

  Thus, the magnetic layer 31 is characterized in that the density of the binder resin 34 is higher in the surface layer portion 31B than in the surface layer portion 31A. The difference between the surface layers 31A and 31B is caused by the manufacturing process of the top plate 30 described later.

  By utilizing such a difference in surface properties, more preferable characteristics can be given to the coil component 11 according to the purpose. For example, if the surface 31a is on the lower layer side (resin layer 32 side) and the surface 31b is on the upper layer side, the insulation on the upper surface side of the top plate 30 is enhanced, so the upper surface of the top plate 30 is in contact with other electronic components. By doing so, it is possible to prevent short-circuit defects. Moreover, in the surface layer portion 31A on the lower surface side of the magnetic layer 31, the density of the binder resin 34 is low and more magnetic powder 35 is present, so that the magnetic path passing through the top plate 30 is shortened and high magnetic properties are obtained. It is also possible to obtain characteristics.

  Conversely, if the surface 31b is on the lower layer side (resin layer 32 side) and the surface 31a is on the upper layer side, the dielectric strength between the magnetic layer 31 and the terminal electrodes E1 to E4 and the wires W can be further increased. In addition, impact resistance and peel strength are further improved.

  Although not particularly limited, the thickness of the top plate 30 in the z direction is preferably 100 μm or less, more preferably 75 μm or less, and particularly preferably about 60 μm. If the thickness of the top plate 30 is 100 μm or less, the height of the entire coil component 11 in the z direction can be reduced. When the thickness of the top plate is reduced to 100 μm or less, if ferrite is used, damage may occur due to insufficient strength, but the laminate is composed of a magnetic layer 31 in which a magnetic powder 35 is mixed with a binder resin 34 and a resin layer 32. If the top plate 30 is used, even if the thickness is reduced to 100 μm or less, breakage or the like does not occur. The lower limit of the thickness of the top plate 30 is not particularly limited, but is preferably 30 μm or more. This is because if the thickness of the top plate 30 is reduced to less than 30 μm, the strength is insufficient and it is difficult to ensure sufficient magnetic properties. In order to sufficiently suppress leakage of magnetic flux, the magnetic permeability of the magnetic layer 31 constituting the top plate 30 is preferably 30 or more.

  The binder resin used for the magnetic layer 31 is required to have predetermined flexibility, heat resistance, and strength. The reason why flexibility and strength are required is to prevent damage even when the thickness of the top plate 30 is reduced to, for example, 100 μm or less. The reason why heat resistance is necessary is that deformation occurs during reflow. This is because it does not cause the above. Therefore, a material having high strength and low flexibility or a material having high flexibility and low heat resistance is not appropriate. Since the reflow temperature is about 260 ° C., it is necessary to use at least a binder resin that does not deform at that temperature.

  Considering these points, in this embodiment, a binder resin having an acrylic ester copolymer as a main chain and including a crosslinked structure by a urethane bond is used. The composition is not particularly limited, but the acrylate copolymer preferably includes at least an ethyl acrylate copolymer structure and a butyl acrylate copolymer structure. This is because flexibility is added by the copolymer structure of butyl acrylate while ensuring high strength by the copolymer structure of ethyl acrylate. The acrylic ester copolymer preferably further includes a copolymerized structure of acrylonitrile. This is because heat resistance and strength are enhanced by including a copolymerized structure of acrylonitrile.

  The top plate 30 can be manufactured by the following method. First, a binder solution prepared by dissolving a solute having a hydroxyl group or a carboxyl group as a functional group as a main monomer in ethyl acrylate, butyl acrylate, and acrylonitrile in an organic solvent such as methyl ethyl ketone is prepared. Magnetic powder and a curing agent are added to the binder solution. To prepare a mixed solution. It is preferable to use isocyanate as the curing agent. As the isocyanate, for example, an aromatic isocyanate or an isocyanate containing a triazine ring in the structure is preferably used, and it is more preferable to have a plurality of isocyanate groups in one molecule. Thereby, the hydroxyl group or carboxyl group that the acrylic ester copolymer has as a functional group reacts with isocyanate to form a crosslinked structure. In addition, fillers other than magnetic powder, such as talc and mica, may be further mixed.

  Next, as shown in FIG. 8, the above mixed solution is applied to the base film F, heated and wound with a roll while drying the solvent in the mixed solution and curing the binder resin. The magnetic powder may be oriented in a predetermined direction by applying a magnetic field when applying the mixed solution to the base film F. Thereby, the sheet S1 in which the magnetic layer 31 made of the magnetic powder-containing resin is applied to the surface of the base film F is obtained. As the base film F, a PET film can be used. Here, the content ratio of the magnetic powder in the cured magnetic powder-containing resin is preferably 50 to 90% by weight. This is because if the content ratio of the magnetic powder is less than 50% by weight, sufficient magnetic permeability cannot be obtained, and if it exceeds 90% by weight, the possibility of the magnetic powder falling off from the cut surface of the top plate 30 increases.

  When the magnetic layer 31 made of a magnetic powder-containing resin is applied to the surface of the base film F, the characteristics of the magnetic powder-containing resin are slightly different between the surface layer portion on the base film F side and the surface layer portion on the opposite side that is the opposite side. . This is considered to be due to the surface tension of the uncured binder resin, and the density of the magnetic powder 35 is reduced in the surface layer portion 31B on the base film F side, while the magnetic powder is reduced in the surface layer portion 31A on the exposed side. The density of 35 increases.

  Next, after peeling the magnetic layer 31 from the base film F, as shown in FIG. 9, a resin material constituting the resin layer 32 is applied to the surface 31a located on the opposite side of the base film F, and heated. Take up with a roll while curing by. Thereby, the sheet S2 in which the resin layer 32 is applied to the surface of the magnetic layer 31 is obtained.

  Next, as shown in FIG. 10A, the sheet S <b> 2 is die-cut into a planar shape of the top plate 30 using a mold. Next, after applying an epoxy adhesive 40 to the die-cut portion as shown in FIG. 10 (b), the drum core 20 around which the wire W is wound is adhered as shown in FIG. 10 (c). . And if the drum core 20 with which the top plate 30 was adhere | attached is isolate | separated from a sheet | seat main body, the coil component 11 by this embodiment will be completed.

  If the coil component 11 is manufactured by such a method, the surface of the magnetic powder-containing resin facing the base film F side at the time of application, that is, the surface 31b on the side of the magnetic layer 31 on which the binder resin 34 is high is formed. As an upper surface, it can be bonded to the drum core 20. The resin layer 32 may be formed without peeling off the magnetic layer 31 from the base film F. In this case, the base film F may be peeled off after performing the process shown in FIG.

  On the other hand, the base film F itself can be used as the resin layer 32 when the magnetic layer 31 is bonded to the drum core 20 with the surface 31a of the binder resin 34 having the low density as the upper surface. According to this, it is possible to reduce the manufacturing cost because the coating process is performed only once. However, in this case, as the material of the base film F, it is necessary to use a resin material having higher heat resistance instead of a PET resin.

<Second Embodiment>
11 and 12 are views showing the configuration of the coil component 12 according to the second embodiment of the present invention, in which FIG. 11 is a perspective view seen from obliquely above, and FIG. 12 is a cross-sectional view.

  As shown in FIGS. 11 and 12, the coil component 12 according to the second embodiment of the present invention is such that the resin layer 32 is selectively provided between the flange portions 22 and 23 and the magnetic layer 31. This is different from the coil component 11 according to the first embodiment described above. That is, the resin layer 32 is divided into two in plan view. Since other configurations are the same as those of the coil component 11 according to the first embodiment, the same elements are denoted by the same reference numerals, and redundant description is omitted.

  According to the present embodiment, since the resin layer 32 is divided into two, even if there is a relatively large difference between the thermal expansion coefficient of the resin layer 32 and the thermal expansion coefficient of the drum core 20, the top plate 30 is peeled off. Has the advantage that it is difficult to occur. In the example shown in FIGS. 11 and 12, the planar sizes of the resin layer 32 and the flange portions 22 and 23 are substantially the same, but at least between a portion of the flange portions 22 and 23 and the magnetic layer 31. It is sufficient if the resin layer 32 is interposed. However, in order to further ensure the withstand voltage and impact resistance, it is preferable to cover the entire surface of the flange portions 22 and 23 with the resin layer 32 in a plan view (as viewed from the z direction).

  The coil component 12 according to the present embodiment is preferably manufactured by adhering a resin layer 32 that has been cut to a predetermined size in advance to the upper surfaces of the flange portions 22 and 23 and then bonding the magnetic layer 31. According to this method, the positioning operation of the resin layer 32 can be easily performed as compared with the method of attaching the resin layer 32 to the magnetic layer 31.

  The preferred embodiments of the present invention have been described above, but the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit of the present invention. Needless to say, it is included in the range.

DESCRIPTION OF SYMBOLS 11, 12 Coil components 20 Drum core 21 Core part 22, 23 Edge part 30 Top plate 31 Magnetic layer 31A, 31B Surface layer part 31C Inner layer part 31a, 31b Surface 32 Resin layer 34 Binder resin 35 Magnetic powder 40 Adhesive E1-E4 Terminal Electrode F Base film S1, S2 Sheet W Wire

Claims (9)

A drum core having a core part and first and second flanges provided at both ends of the core part;
A wire wound around the core,
A terminal electrode provided on each of the first and second flanges, to which an end of the wire is connected;
A top plate fixed to the first and second collars,
The top plate includes a magnetic layer obtained by mixing magnetic powder in a binder resin, and a resin layer in which the content of the magnetic powder is less than that of the magnetic layer,
The coil component, wherein the resin layer is located at least between the first and second flanges and the magnetic layer.   The coil component according to claim 1, wherein the resin layer does not substantially contain the magnetic powder.   The coil component according to claim 1, wherein the resin layer includes a nonmagnetic filler.   The coil component according to claim 1, wherein the resin layer covers the entire surface of the magnetic layer.   4. The coil component according to claim 1, wherein the resin layer is selectively provided between the first and second flanges and the magnetic layer. 5.   The coil component according to any one of claims 1 to 5, further comprising an adhesive that bonds the first and second flanges and the resin layer of the top plate.   The magnetic layer of the top plate has a lower surface facing the resin layer side and an upper surface located on the opposite side of the lower surface, and the surface layer portion on the upper surface side is more than the surface layer portion on the lower surface side. The coil component according to any one of claims 1 to 6, wherein the binder resin has a high density.   The coil component according to any one of claims 1 to 7, wherein the magnetic powder is a metal soft magnetic powder.   The coil component according to claim 8, wherein the metal soft magnetic powder has a flat shape.