JP2018049963A - Component mounting machine - Google Patents

Abstract

PROBLEM TO BE SOLVED: To determine the quality of an electronic component absorption state.SOLUTION: In a component mounting machine, there are acquired the top face imaging data of an electronic component in a state of being not sucked by a suction nozzle (S12), the side face imaging data of the electronic component in a state of being sucked by the suction nozzle (S20), and the bottom face imaging data of the electronic component in the state sucked by the suction nozzle (S28). Then, the quality of the sucked state of the electronic component is determined on the basis of at least one of the inclination of the electronic component of the side face imaging data and a difference between the area of the top face imaging data and the area of the bottom face imaging data of the electronic component (S24, S32). When the sucked state is determined to be normal, the operation of a transfer head is controlled based on the bottom face position of the electronic component which is identified from the side face imaging data, so that the electronic component is loaded on the circuit board (S36, S38).SELECTED DRAWING: Figure 3

Description

The technology disclosed in this specification relates to a component mounter that mounts electronic components on a circuit board.

Patent Document 1 discloses a component mounting apparatus for mounting electronic components on a circuit board. The component mounting apparatus includes a suction nozzle and a laser unit. The laser unit detects the position of the lower end of the suction nozzle in a state in which the electronic component is not sucked and the position of the lower end of the electronic component in the state of being sucked in the suction nozzle. The height of the electronic component is calculated based on the position of the lower end of the suction nozzle in a state in which the electronic component is not sucked and the position of the lower end of the component in the state of being sucked in the suction nozzle. Then, the position of the suction nozzle is controlled according to the calculated height of the electronic component. Thereby, the variation in the height of the electronic component to be supplied is absorbed, and the electronic component is mounted on an appropriate circuit board.

JP 2007-48821 A

In the component mounting apparatus of Patent Document 1, the height of the electronic component is calculated under the condition that the electronic component is normally sucked by the suction nozzle. However, when the electronic component is sucked by the suction nozzle, the suction state of the electronic component may be abnormal. For example, there is a case where the electronic component is sucked diagonally with respect to the suction nozzle. When the electronic component is sucked diagonally with respect to the suction nozzle, the component mounting apparatus of Patent Document 1 detects the inclination of the electronic component with respect to the suction nozzle as the height of the electronic component. For this reason, even when the suction state of the electronic component with respect to the suction nozzle is abnormal, there arises a problem that the electronic component is mounted on the circuit board.

A component mounter disclosed in this specification mounts an electronic component on a circuit board. The component mounting machine supports a suction nozzle that sucks the upper surface of the electronic component, and moves the suction nozzle relative to the circuit board, thereby mounting the electronic component sucked by the suction nozzle on the circuit board; A side surface imaging camera that acquires side surface imaging data of the side surface of the electronic component that is attracted to the suction nozzle, and a control device that controls the operation of the transfer head are provided. The control device determines whether the electronic component suction state is good or not based on the inclination of the electronic component in the side surface image data, and controls the operation of the transfer head when the electronic component suction state is determined to be normal. The electronic component is configured to be mounted on the circuit board.

Alternatively, the component mounter disclosed in this specification mounts an electronic component on a circuit board. The component mounting machine supports a suction nozzle that sucks the upper surface of the electronic component, and moves the suction nozzle relative to the circuit board, thereby mounting the electronic component sucked by the suction nozzle on the circuit board; A top imaging camera that acquires top surface imaging data of the top surface of the electronic component that is not attracted to the suction nozzle; a bottom surface imaging camera that acquires bottom surface imaging data of the bottom surface of the electronic component that is suctioned to the suction nozzle; And a control device for controlling the operation of the transfer head. Based on the difference between the area of the top surface imaging data of the electronic component and the area of the bottom surface imaging data, the control device determines whether or not the suction state of the electronic component is normal, and if the suction state of the electronic component is determined to be normal, The electronic component is mounted on the circuit board by controlling the operation of the transfer head based on the position of the lower surface of the electronic component specified from the side image data.

In the above component mounter, whether or not the electronic component is attracted is determined based on one of the inclination of the electronic component of the side surface image data or the difference between the area of the upper surface image data and the area of the lower surface image data of the electronic component. Judgment. For this reason, when the suction state of the electronic component is abnormal, the mounting of the electronic component on the circuit board can be stopped. As a result, it is possible to reduce the possibility of mounting an electronic component with an abnormal suction state on the circuit board, and to reduce the defect rate of the circuit board. When it is determined that the electronic component suction state is normal, the transfer head is controlled and the electronic component is mounted on the circuit board. Thereby, the mounting accuracy of the electronic component on the circuit board can be improved.

It is a side view which represents the structure of a component mounting machine typically. It is a block diagram showing the structure of the control system of a component mounting machine. It is a figure which shows the flowchart of a 1st mounting process. It is an example of the side surface imaging data of the state in which the electronic component is normally adsorbed. It is an example of the side surface imaging data of the state in which the electronic component is adsorbed diagonally. It is an example of the side surface imaging data of the state in which the electronic component is adsorbed sideways. It is a figure which shows the flowchart of a 2nd mounting process. It is a figure which shows the correlation of the distance of a distance measurement sensor and an electronic component. It is a figure which shows the correlation of the distance of a circuit board and an electronic component. It is an example of upper surface imaging data. It is an example of the upper surface imaging data in case an electronic component is adsorbed sideways. It is a figure which shows the difference of the area of the electronic component on the lower surface imaging data in the case where the electronic component is adsorbed horizontally, and the area of the electronic component on the upper surface imaging data.

The technical elements described below are independent technical elements and exhibit technical usefulness alone or in various combinations, and are not limited to the combinations described in the claims at the time of filing.

(Example) Hereinafter, the component mounting machine 10 which concerns on a present Example is demonstrated using FIG.1 and FIG.2. The component mounter 10 is a device for mounting the electronic component 4 on the circuit board 2. The component mounter 10 is also referred to as a surface mounter or a chip mounter. Usually, the component mounting machine 10 is provided side by side with a solder printing machine, other component mounting machines, and a board inspection machine, and constitutes a series of mounting lines.

As shown in FIG. 1, the component mounter 10 includes a plurality of component feeders 12, a feeder holding unit 14, a top imaging camera 16, a bottom imaging camera 18, a distance measurement sensor 20, a transfer head 22, A side imaging unit 26, a moving device 24 that moves the transfer head 22, the top imaging camera 16, and the side imaging unit 26, a substrate conveyor 32, an operation panel 34, and a control device 40 are provided. The top imaging camera 16 also has a function as a mark camera that images a reference mark provided on the circuit board 2.

Each component feeder 12 accommodates a plurality of electronic components 4. The component feeder 12 is detachably attached to the feeder holding unit 14 and supplies the electronic component 4 to the transfer head 22. The specific configuration of the component feeder 12 is not particularly limited. Each component feeder 12 is, for example, a tape feeder that accommodates a plurality of electronic components 4 on a winding tape, a tray feeder that accommodates a plurality of electronic components 4 on a tray, or a plurality of electronic components 4 in a container. Any of the bulk type feeders that accommodates the ink at random.

The moving device 24 moves the transfer head 22, the top surface imaging camera 16, and the side surface imaging unit 26 between above the component feeder 12 and above the circuit board 2. The moving device 24 of the present embodiment is an XY robot that moves the moving base 24a in the X direction and the Y direction. The moving device 24 includes a guide rail that guides the moving base 24a, a moving mechanism that moves the moving base 24a along the guide rail, a motor that drives the moving mechanism, and the like. The moving device 24 is disposed above the component feeder 12 and the circuit board 2. The transfer head 22, the upper surface imaging camera 16, and the side surface imaging unit 26 are attached to the moving base 24a. The transfer head 22, the top imaging camera 16, and the side imaging unit 26 are moved from above the component feeder 12 to above the circuit board 2 by the moving device 24.

The transfer head 22 includes a suction nozzle 6 that sucks the electronic component 4. The suction nozzle 6 can be attached to and detached from the transfer head 22. The suction nozzle 6 is attached to the transfer head 22 so as to be movable in the Z direction (vertical direction in the drawing). The suction nozzle 6 is configured to be moved up and down by an actuator (not shown) housed in the transfer head 22 and to suck the electronic component 4. In order to mount the electronic component 4 on the circuit board 2 by the transfer head 22, first, the suction nozzle 6 is moved until the suction surface (lower surface) 6 a of the suction nozzle 6 contacts the electronic component 4 accommodated in the component feeder 12. Move down. Next, the electronic component 4 is sucked by the suction nozzle 6 and the suction nozzle 6 is moved upward. Next, the transfer head 22 is positioned with respect to the circuit board 2 by the moving device 24. Next, the electronic component 4 is mounted on the circuit board 2 by lowering the suction nozzle 6 toward the circuit board 2. The above operation by the transfer head 22 is referred to as a mounting process.

The top imaging camera 16 is attached to the movement base 24a. The upper surface imaging camera 16 images the upper surface 4 a of the electronic component 4 that is housed in the component feeder 12. The lower surface imaging camera 18 is disposed between the feeder holding unit 14 and the substrate conveyor 32. The lower surface imaging camera 18 images the lower surface 4 b of the electronic component 4 in a state of being sucked by the suction nozzle 6. The distance measuring sensor 20 may be disposed between the lower surface imaging camera 18 and the board conveyor 32, or may be installed in an empty slot on the feeder, and on the lead wire on which the moving base 24a can operate efficiently. Installed. The distance measurement sensor 20 is a sensor that measures a distance from an object using laser light. As will be described later, the distance measurement sensor 20 includes a distance from the distance measurement sensor 20 to the suction surface 6a of the suction nozzle 6 (hereinafter referred to as a first distance L1) (shown in FIG. 8) and the distance measurement sensor 20 to the suction nozzle 6. The distance to the lower surface 4b of the electronic component 4 adsorbed on (hereinafter referred to as the second distance L2) (shown in FIG. 8) is measured.

The side imaging unit 26 is attached to the moving base 24a. For this reason, when the transfer head 22 moves, the side surface imaging unit 26 also moves together. The side imaging unit 26 includes a camera support unit 28 and a side imaging camera 30. The camera support unit 28 is attached to the moving base 24a. A side imaging camera 30 is attached to the camera support unit 28. The side imaging camera 30 is disposed on the side of the suction nozzle 6 (the Y direction in the drawing).

The board conveyor 32 is a device that carries the circuit board 2 into the component mounter 10, positions it on the component mounter 10, and carries it out of the component mounter 10. The substrate conveyor 32 of the present embodiment is constituted by, for example, a pair of belt conveyors, a support device (not shown) that is attached to the belt conveyor and supports the circuit board 2 from below, and a driving device that drives the belt conveyor. Can do. The operation panel 34 is an input device that receives an instruction from the worker and a display device that displays various types of information to the worker.

The control device 40 is configured using a computer including a CPU, a ROM, and a RAM. As shown in FIG. 2, the control device 40 includes a component feeder 12, a transfer head 22, a moving device 24, a side imaging camera 30, a top imaging camera 16, a bottom imaging camera 18, and a distance measurement sensor. 20 and the operation panel 34 are communicably connected. The control device 40 controls the electronic component 4 by controlling the component feeder 12, the upper surface imaging camera 16, the lower surface imaging camera 18, the distance measuring sensor 20, the transfer head 22, the moving device 24, the side surface imaging camera 30, and the operation panel 34. Is mounted on the circuit board 2.

The control device 40 is communicably connected to the storage device 50. The storage device 50 stores in advance a program for controlling the operation of the component mounter 10 and component information of the plurality of electronic components 4. The component information stored in the storage device 50 includes an allowable range R of the size of the electronic component 4 and the height (thickness) of the electronic component 4. The programs stored in the storage device 50 include a first program that is executed when the size of the electronic component 4 is equal to or smaller than a predetermined size, and a second program that is executed when the size of the electronic component 4 exceeds the predetermined size. It is included. When the size of the electronic component 4 is equal to or smaller than the predetermined size, for example, the effective imaging area of each camera, the top imaging camera 16, the bottom imaging camera 18, and the side imaging camera 30 is larger than the size of all the surfaces of the electronic component 4. It is a big case. The control device 40 executes the first mounting process by executing the first program, and executes the second mounting process by executing the second program. The first mounting process and the second mounting process are collectively referred to as a mounting process.

Next, a mounting process in which the control device 40 mounts the electronic component 4 on the circuit board 2 will be described. Note that the control device 40 is configured to receive the size of the electronic component 4 from an external device before executing the mounting process. The size of the electronic component 4 may be transmitted from the operation panel 34 or may be transmitted from an external management device (not shown) connected to be able to communicate with the control device 40.

The first mounting process that is executed when the size of the electronic component 4 is equal to or smaller than the predetermined size will be described with reference to FIG.

First, in step S <b> 12, the control device 40 drives the moving device 24 to move the top imaging camera 16 above the electronic component 4 accommodated in the component feeder 12, and images the top surface 4 a of the electronic component 4. Then, the upper surface imaging data 102 of the electronic component 4 is acquired. Next, in step S <b> 14, the control device 40 transmits the acquired upper surface imaging data 102 to the storage device 50. The storage device 50 stores the received upper surface imaging data 102.

Next, in step S <b> 16, the control device 40 sucks the electronic component 4 on the component feeder 12 by the suction nozzle 6.

Next, in step S <b> 18, the control device 40 drives the moving device 24 to move the transfer head 22, so that the suction nozzle 6 in the state of sucking the electronic component 4 faces the lower surface imaging camera 18. To move.

Next, in step S <b> 20, the control device 40 operates the side surface imaging camera 30 to image the side surface 4 c of the electronic component 4 in the state of being sucked by the suction nozzle 6, and the side surface imaging data 104 of the electronic component 4 is obtained. get. Next, in step S22, the control device 40, based on the side image data 104, the position z1 (for example, shown in FIG. 4) of the lower surface 4b of the electronic component 4 and the inclination θ (for example, FIG. 4) of the electronic component 4. 5). The inclination θ of the electronic component 4 is an inclination angle of the lower surface 4b of the electronic component 4 with respect to the horizontal plane. Hereinafter, the state in which the electronic component 4 is attracted by being inclined with respect to the horizontal plane is referred to as oblique adsorption.

Next, in step S24, the control device 40 determines whether or not the inclination θ 1 of the electronic component 4 is equal to or smaller than the allowable angle α. When the inclination θ of the electronic component 4 is equal to or smaller than the allowable angle α (YES in S24), the control device 40 proceeds to step S26. If the inclination θ of the electronic component 4 exceeds the allowable angle α (NO in S24), the control device 40 determines that the suction state of the electronic component 4 is abnormal, and proceeds to step S40. In addition, since the side imaging camera 30 can move integrally with the transfer head 22, steps S20 to S24 are performed so that the transfer head 22 moves from above the component feeder 12 to above the bottom imaging camera 18. It is preferably performed while moving. According to such a configuration, the time required for the first mounting process of the control device 40 can be reduced as compared with the case where steps S20 to S24 are performed after the transfer head 22 moves upward of the lower surface imaging camera 18. Can do.

Next, in step S <b> 26, the control device 40 calculates the height H of the electronic component 4. The storage device 50 stores the value of the height H of the electronic component 4.

Next, in step S <b> 28, the control device 40 operates the lower surface imaging camera 18 to image the lower surface 4 b of the electronic component 4 being sucked by the suction nozzle 6, and the lower surface imaging data 106 of the electronic component 4 is obtained. get.

Next, in step S <b> 30, the control device 40 determines an area difference A <b> 3 between the area A <b> 1 of the electronic component 4 on the upper surface imaging data 102 and the area A <b> 2 of the electronic component 4 on the lower surface imaging data 106 stored in the storage device 50. A1-A2) is calculated. Next, in step S32, the control device 40 determines whether or not the area difference A3 is equal to or smaller than the allowable difference D. The allowable difference D can be set in consideration of an imaging error caused by imaging with the top imaging camera 16 and the bottom imaging camera 18 and an error in manufacturing the electronic component 4. When the area difference A3 is equal to or smaller than the allowable difference D (YES in S32), the control device 40 determines that the electronic component 4 is in the normal suction state, and proceeds to step S34. When the area difference A3 exceeds the allowable difference D (NO in S32), the control device 40 determines that the suction state of the electronic component 4 is abnormal, and proceeds to step S40. The case where the area difference A3 exceeds the allowable difference D is, for example, a case where the suction nozzle 6 is sucking the side surface 4c of the electronic component 4 (hereinafter referred to as lateral suction) (for example, FIG. 6).

Next, in step S <b> 34, the control device 40 calculates a correction amount c for the position of the suction nozzle 6 (hereinafter, a mounting position) when the electronic component 4 is mounted on the circuit board 2. When the suction nozzle 6 sucks the electronic component 4, the mounting position is the position in the X direction and Y direction of the center of the suction surface 6 a of the suction nozzle 6 and the position of the center of the upper surface 4 a of the electronic component 4 in the X direction and Y direction. The position, suction angle, and mounting angle are set as a reference. However, when the electronic component 4 is actually sucked by the suction nozzle 6, the suction position and the suction angle may be slightly shifted. In such a case, the control device 40 calculates the correction amount c.

Next, in step S <b> 36, the control device 40 moves the transfer head 22 by driving the moving device 24, and moves the suction nozzle 6 that sucks the electronic component 4 toward the upper side of the circuit board 2. . At this time, the control device 40 adjusts the position of the suction nozzle 6 in the X direction, the Y direction, and the rotation direction based on the correction amount c.

Next, in step S38, the control device 40 drives the transfer head 22 and lowers the suction nozzle 6. At this time, the control device 40 lowers the suction nozzle 6 based on the height H of the electronic component 4 calculated in step S <b> 26 and mounts the electronic component 4 on the circuit board 2. The control device 40 adjusts the lowering speed of the suction nozzle 6 based on the position z1 of the lower surface 4b of the electronic component 4 in the Z direction. That is, the electronic component 4 descends at a high speed until it descends to the vicinity of the circuit board 2, and descends at a small speed when the electronic component 4 descends to the vicinity of the circuit board 2. As described above, it is possible to prevent the occurrence of cracks or the like that occur when the electronic component 4 is mounted on the circuit board 2.

On the other hand, in step S <b> 40, the control device 40 notifies that an abnormality in the suction state of the electronic component 4 by the suction nozzle 6 has been detected. Specifically, the control device 40 transmits a signal indicating that the suction state of the electronic component 4 by the suction nozzle 6 is abnormal to the operation panel 34. Thereby, the abnormal suction of the electronic component 4 is displayed on the operation panel 34, and the operator of the component mounting machine 10 can recognize the abnormal suction state of the electronic component 4.

Next, a second mounting process that is executed when the size of the electronic component 4 exceeds a predetermined size will be described with reference to FIG. In addition, when the size of the electronic component 4 exceeds the predetermined size, the possibility that the electronic component 4 is diagonally or laterally attracted to the suction nozzle 6 is low. In addition, this operation may be acquired before acquiring the lower surface imaging data 106 as long as the position of the distance measurement sensor 20 is installed in the vicinity of the component feeder 12.

First, in step S <b> 112, the control device 40 drives the moving device 24 to move the transfer head 22, so that the suction nozzle 6 in a state where the electronic component 4 is not sucked is directed above the distance measurement sensor 20. The suction nozzle 6 and the transfer head 22 are positioned at preset positions. Next, in step S <b> 114, the control device 40 operates the distance measurement sensor 20 to measure the first distance L <b> 1 from the distance measurement sensor 20 to the suction surface 6 a of the suction nozzle 6. Next, in step S <b> 116, the control device 40 transmits the measured first distance L <b> 1 to the storage device 50. The storage device 50 stores the received first distance L1. Steps S112 to S116 may be configured to be executed only at a predetermined timing such as immediately after the suction nozzle 6 is replaced.

Next, in step S <b> 118, the control device 40 moves the transfer head 22 by driving the moving device 24, and moves the suction nozzle 6 to above the component feeder 12. Next, in step S <b> 120, the control device 40 sucks the electronic component 4 on the component feeder 12 by the suction nozzle 6.

Next, in step S122, the control device 40 drives the moving device 24 to move the transfer head 22 so that the suction nozzle 6 in a state of sucking the electronic component 4 faces the distance measuring sensor 20 above. The suction nozzle 6 and the transfer head 22 are positioned at the same position as the position positioned in step S112. Next, in step S <b> 124, the control device 40 operates the distance measurement sensor 20 to measure the second distance L <b> 2 from the distance measurement sensor 20 to the lower surface 4 b of the electronic component 4 that is being sucked by the suction nozzle 6.

Next, in step S126, the control device 40 calculates the height H of the electronic component 4. Specifically, the control device 40 sucks the suction nozzle 6 from the distance measurement sensor 20 measured in step S124 from the first distance L1 from the distance measurement sensor 20 measured in step S114 to the suction surface 6a of the suction nozzle 6. The height H of the electronic component 4 is calculated by subtracting the second distance L2 to the lower surface 4b of the electronic component 4 in a state where the electronic component 4 is in a state (for example, FIG. 8).

Next, in step S128, the control device 40 determines whether or not the height H of the electronic component 4 is within the allowable range R of the height of the electronic component 4. The allowable range R of the height of the electronic component 4 is set in advance in consideration of the design error of the electronic component 4 and the measurement error of the distance measurement sensor 20. When the height H of the electronic component 4 is within the allowable range R (YES in S128), the control device 40 determines that the electronic component 4 is normal and proceeds to step S130. If the height H of the electronic component 4 is outside the allowable range R (NO in S128), the control device 40 determines that the electronic component 4 is abnormal and proceeds to step S136.

Next, in step S130, the control device 40 calculates a distance from the circuit board 2 to the lower surface 4b of the electronic component 4 (hereinafter referred to as a third distance L3). That is, the distance from the circuit board 2 to the suction surface 6a of the suction nozzle 6 (hereinafter referred to as the fourth distance L4) when the suction nozzle 6 and the transfer head 22 are positioned in step S112 or S122 is known. Therefore, the fourth distance L4 from the circuit board 2 to the suction surface 6a of the suction nozzle 6 is stored in the storage device 50 in advance. The control device 40 calculates the third distance L3 by subtracting the height H of the electronic component 4 calculated in step S126 from the fourth distance L4 (for example, FIG. 9).

Next, in step S <b> 132, the control device 40 moves the transfer head 22 by driving the moving device 24, and moves the suction nozzle 6 that sucks the electronic component 4 toward the upper side of the circuit board 2. . Next, in step S <b> 134, the control device 40 mounts the electronic component 4 on the circuit board 2 by lowering the suction nozzle 6 downward. At this time, the control device 40 adjusts the lowering speed of the suction nozzle 6 based on the third distance L3 between the circuit board 2 and the lower surface 4b of the electronic component 4. That is, when the distance between the lower surface 4b of the electronic component 4 and the circuit board 2 becomes shorter than the set value, the lowering speed of the suction nozzle 6 (electronic component 4) is decreased. Thereby, the rate of occurrence of cracks that occur when the electronic component 4 is mounted on the circuit board 2 can be reduced.

On the other hand, in step S136, the control device 40 notifies that an abnormality in the height H of the electronic component 4 has been detected. Specifically, the control device 40 transmits a signal indicating that the height H of the electronic component 4 is abnormal to the operation panel 34. Thereby, the operator of the component mounting machine 10 can recognize the abnormality of the height H of the electronic component 4.

(Case A) A specific case A in which an abnormality can be determined by the first mounting process of this embodiment will be described. The size of the electronic component 4 of the case A is not more than a predetermined size. FIG. 5 is a view in which the electronic component 4 is sucked diagonally by the suction nozzle 6.

In the case of FIG. 5, the inclination θ of the electronic component 4 detected from the electronic component 4 on the side imaging data 104 exceeds the allowable angle α of the electronic component 4. In this case, when the control device 40 performs the first mounting process, the control device 40 determines that the suction state of the electronic component 4 is abnormal in step S24, and proceeds to step S40. In step S <b> 40, the control device 40 outputs a signal indicating that the suction state of the electronic component 4 is abnormal to the operation panel 34. Thereby, the operator can recognize that the abnormality of the adsorption | suction state of the electronic component 4 was detected.

(Case B) A specific case B in which an abnormality can be determined by the first mounting process of this embodiment will be described. The size of the electronic component 4 of the case B is not more than a predetermined size. FIG. 6 is a diagram in which the electronic component 4 is laterally attracted. FIG. 10 shows the upper surface image data 102 of the electronic component 4.

In the case of FIG. 6, the inclination θ of the electronic component 4 detected from the electronic component 4 on the side imaging data 104 is approximately 0 °. That is, the inclination θ of the electronic component 4 is less than the allowable angle α. In this case, when the control device 40 performs the first mounting process, the control device 40 determines that the suction state of the electronic component 4 is normal in step S24, and proceeds to step S26 and subsequent steps. In step S <b> 26, the control device 40 calculates the height H of the electronic component 4. Next, in step S28, the control device 40 acquires the lower surface imaging data 106 of the electronic component 4 (for example, FIG. 11). Next, in step S <b> 30, the control device 40 calculates an area difference A <b> 3 based on the upper surface imaging data 102 and the lower surface imaging data 106. The area difference A3 is a hatched portion in FIG. That is, the difference between the area of the upper surface 4 a of the electronic component 4 and the area of the side surface 4 c of the electronic component 4. In this case, the area difference A3 exceeds the allowable difference D. For this reason, in step S32, the control device 40 determines that the suction state of the electronic component 4 is abnormal, and proceeds to step S40. In step S <b> 40, the control device 40 outputs a signal indicating that the suction state of the electronic component 4 is abnormal to the operation panel 34. Thereby, the operator can recognize that the abnormality of the adsorption | suction state of the electronic component 4 was detected.

As is clear from the above description, in the component mounter 10 of the present embodiment, when the size of the electronic component 4 is equal to or smaller than the predetermined size, the electronic component 4 of the electronic component 4 is based on each image data (102, 104, 106). The quality of the suction state is determined. Thereby, it is possible to prevent the electronic component 4 from being mounted on the circuit board 2 in a state where the electronic component 4 is abnormally adsorbed. Further, by using the side surface image data 104, it is possible to detect the height of the electronic component 4 being sucked by the suction nozzle 6. Thereby, even when the height H of the supplied electronic component 4 varies, the mounting accuracy of the electronic component 4 on the circuit board 2 can be improved.

When the size of the electronic component 4 exceeds a predetermined size, the component mounter 10 calculates the height H of the electronic component 4 based on the distances L1 and L2 measured by the distance measurement sensor 20. Thereby, when the height H of the supplied electronic component 4 varies, it is possible to prevent the electronic component 4 whose height H is outside the allowable range R from being mounted on the circuit board 2. Further, the third distance L3 from the circuit board 2 to the lower surface 4b of the electronic component 4 can be calculated by using the height H of the electronic component 4. As a result, even when the height H of the supplied electronic component 4 varies within the allowable range R, the mounting accuracy of the electronic component 4 on the circuit board 2 can be improved.

As mentioned above, although the Example which concerns on the technique disclosed by this specification was described in detail, these are only illustrations and do not limit a claim. The technology described in the claims includes various modifications and changes of the specific examples illustrated above.

In the component mounter 10 of the above embodiment, the height of the electronic component 4 is calculated using the distance measurement sensor 20. However, the component mounter 10 may determine the quality of the suction surface 6a of the suction nozzle 6 using the distance measurement sensor 20. For example, the distance from the distance measuring sensor 20 to the suction surface 6a may be measured for a plurality of locations on the suction surface 6a, and the quality of the suction surface 6a may be determined based on the difference between the measured distances.

2: Circuit board 4: Electronic component 4a: Upper surface 4b: Lower surface 4c: Side surface 6: Adsorption nozzle 6a: Adsorption surface 10: Component mounting machine 12: Component feeder 14: Feeder holding unit 16: Upper surface imaging camera 18: Lower surface imaging camera 20 : Distance measuring sensor 22: Transfer head 24: Moving device 24 a: Moving base 26: Side imaging unit 28: Camera support unit 30: Side imaging camera 32: Substrate conveyor 34: Operation panel 40: Control device 50: Storage device 102: Upper surface image data 104: Side surface image data 106: Lower surface image data D: Allowable difference H: Height L1: First distance L2: Second distance L3: Third distance L4: Fourth distance R: Allowable range α: Allowable angle θ : Inclination

Claims (5)

A component mounting machine for mounting an electronic component on a circuit board, supporting a suction nozzle that sucks an upper surface of the electronic component, and supporting the suction nozzle, and moving the suction nozzle relative to the circuit board, A transfer head for mounting the electronic component sucked by the suction nozzle on the circuit board, a side imaging camera for acquiring side image data of a side surface of the electronic component being sucked by the suction nozzle, and the transfer A control device that controls the operation of the mounting head, wherein the control device determines whether the electronic component is in the suction state based on the inclination of the electronic component in the side surface imaging data, and the electronic component. A component mounter configured to control the operation of the transfer head and mount the electronic component on the circuit board when it is determined that the suction state is normal. The control device controls the operation of the transfer head based on the position of the lower surface of the electronic component specified from the side surface image data when it is determined that the suction state of the electronic component is normal. A component mounter configured to mount the electronic component on the circuit board. The component mounter further includes a distance measurement sensor arranged in a direction facing the suction surface of the suction nozzle, and the control device measures the distance when the electronic component is a predetermined size or more. The sensor measures the nozzle distance from the distance measurement sensor to the suction surface of the suction nozzle, and the component distance from the distance measurement sensor to the lower surface of the electronic component in the state of being sucked by the suction nozzle, The electronic component is mounted on the circuit board by controlling the operation of the transfer head based on the component height of the electronic component calculated from the difference between the nozzle distance and the component distance. The component mounting machine according to claim 1. The component mounting machine according to claim 1 or 2, wherein the side imaging camera moves integrally with the transfer head. A component mounting machine for mounting an electronic component on a circuit board, supporting a suction nozzle that sucks an upper surface of the electronic component, and supporting the suction nozzle, and moving the suction nozzle relative to the circuit board, A transfer head that mounts the electronic component sucked by the suction nozzle on the circuit board, a top imaging camera that acquires top surface imaging data of the top surface of the electronic component that is not sucked by the suction nozzle, and the suction A lower surface imaging camera that acquires lower surface imaging data of the lower surface of the electronic component in a state of being sucked by a nozzle, and a control device that controls the operation of the transfer head. Based on the difference between the area of the upper surface imaging data of the component and the area of the lower surface imaging data, the quality of the electronic component adsorption state is determined, and the electronic component adsorption state is normal. If it is a constant, the controlling the operation of the transfer head, said that the electronic component is configured to implement the circuit board, the component mounting machine.

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